CN115096208A - Broad spectrum ellipsometry measuring equipment - Google Patents
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- 238000000572 ellipsometry Methods 0.000 title claims abstract description 32
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
技术领域technical field
本发明涉及光学设备技术领域,尤其涉及一种宽光谱椭偏测量设备。The invention relates to the technical field of optical equipment, in particular to a wide-spectrum ellipsometry measurement equipment.
背景技术Background technique
椭偏仪是一种用于探测薄膜厚度、光学常数以及材料微结构的光学测量设备。为满足待测样品1基于自身的材料体系和结构的测量限制,需要向待测样品1入射含有波长覆盖紫外线波段至红外线波段的宽光谱光线。宽光谱光线能够覆盖更多的材料体系和结构,因此能够对不同材料及结构的待测样品1予以灵敏地检测。同时,由于椭偏仪进行光学检测时与待测样品1非接触,且对待测样品1没有破坏且不需要真空,因此使用宽光谱作为光源的宽光谱椭偏仪已成为一种主流的椭偏测量设备。An ellipsometer is an optical measurement device used to detect film thickness, optical constants, and material microstructure. In order to meet the measurement limitations of the sample to be tested 1 based on its own material system and structure, it is necessary to inject a broad spectrum light with wavelengths covering the ultraviolet band to the infrared band into the sample 1 to be tested. The broad-spectrum light can cover more material systems and structures, so it can sensitively detect samples 1 of different materials and structures. At the same time, since the ellipsometer is not in contact with the sample to be tested 1 during optical detection, and the sample 1 to be tested is not damaged and does not require vacuum, the broad-spectrum ellipsometer using a broad spectrum as a light source has become a mainstream ellipsometer measuring equipment.
参图1所示出的现有技术中的一种宽光谱椭偏仪。宽光谱光源10发出的宽光谱出射光通过光纤射入起偏系统11后,经过透镜17汇聚后会在待测样品1(例如晶圆等半导体器件)的表面后发生反射。反射光束透过透镜16后穿过检偏系统30后被探测器40所捕获,同时通过对准系统20基于图像匹配以确保穿过透镜16后的出射光线对准指定的量测Pad区域。最终,由探测器40对自Pad区域所反射形成的反射光束并在穿过透镜16后进行光谱分析,以实现对待测样品1所具有的膜厚及关键尺寸(CD)予以测量。Referring to Fig. 1, a broad spectrum ellipsometer in the prior art is shown. After the broad-spectrum outgoing light emitted by the broad-
晶圆在前道制程完成后会在圆形硅片表面形成多个规则排布且尺寸非常小的Pad区以矩阵形式执行逐点检测。而形状为矩形的Pad区的尺寸非常小,通常Pad区域的最大边长只有100微米左右。因此,在使用宽光谱椭偏仪在测量过程中就必须保证倾斜射向晶圆的光斑必须集中在量测Pad区域范围内。然而,由于入射光束覆盖宽光谱,从而导致不同波长的光线透过透镜17后所形成的焦点不可能在同一聚焦平面,并基于色散效应而导致光斑形状较大而超出量测Pad区域的不良情况。例如,参图2所示,入射光束在像面上形成的椭圆形光斑的长轴长度约为206微米,该椭圆形光斑已经明显超过了量测Pad区域。为此,为解决前述问题,现有技术中的宽光谱椭偏仪通常在起偏系统11的光路中增加狭缝的方式对光斑尺寸予以截取。然而,在实际使用中发现经过狭缝截取所形成的光斑尺寸依然较大。从而,导致现有技术中的宽光谱椭偏仪对Pad区域的量测数据的准确性和重复性不佳。After the front-end process of the wafer is completed, multiple regularly arranged and very small pad areas are formed on the surface of the circular silicon wafer to perform point-by-point inspection in a matrix form. The size of the Pad area with a rectangular shape is very small, and usually the maximum side length of the Pad area is only about 100 microns. Therefore, in the measurement process using a wide-spectrum ellipsometer, it must be ensured that the light spot obliquely directed to the wafer must be concentrated within the measurement pad area. However, since the incident beam covers a wide spectrum, it is impossible for the focal points formed by the different wavelengths of light to pass through the
有鉴于此,有必要对现有技术中的宽光谱椭偏仪予以改进,以解决上述问题。In view of this, it is necessary to improve the wide-spectrum ellipsometer in the prior art to solve the above problems.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于揭示一种宽光谱椭偏测量设备,用以解决现有技术中宽光谱椭偏测量设备所存在的前述缺陷,并尤其为降低在待测样品表面所形成的光斑的尺寸,以提高对待测样品执行膜厚、关键尺寸等形貌参数测量的准确性及重复性。The purpose of the present invention is to disclose a wide-spectrum ellipsometry device, which is used to solve the aforementioned defects of the wide-spectrum ellipsometry device in the prior art, and especially to reduce the size of the light spot formed on the surface of the sample to be measured, In order to improve the accuracy and repeatability of the measurement of topographic parameters such as film thickness and critical dimensions of the sample to be tested.
为实现上述目的,本发明提供了一种宽光谱椭偏测量设备,包括工件台、宽光谱光源、入射光调整组件、光束汇聚模块、对准系统、控制系统和探测器;In order to achieve the above purpose, the present invention provides a wide-spectrum ellipsometry measurement device, including a workpiece stage, a wide-spectrum light source, an incident light adjustment component, a beam convergence module, an alignment system, a control system and a detector;
所述工件台用于承载并带动待测样品;The workpiece table is used to carry and drive the sample to be tested;
所述宽光谱光源用于发射宽波段光束;The broad-spectrum light source is used for emitting a broad-band light beam;
所述入射光调节组件将所述宽波段光束分解为至少两束不同波长光束,并调整所述不同波长光束的传输方向;The incident light adjustment component decomposes the broadband light beam into at least two beams of different wavelengths, and adjusts the transmission direction of the beams of different wavelengths;
所述光束汇聚模块用于汇聚所述不同波长的光束以在所述样品表面形成不同量测光斑;the beam converging module is used for converging the beams of different wavelengths to form different measurement spots on the surface of the sample;
所述对准系统用以获取所述量测光斑在所述样品表面的分布信息,所述分布信息包括光斑位置、光斑尺寸;The alignment system is used to obtain distribution information of the measurement spot on the sample surface, where the distribution information includes spot position and spot size;
所述控制系统,基于所述分布信息调整所述工件台、所述光束汇聚模块、所述入射光调节组件中的至少一种,以使所述不同量测光斑至少具有部分重叠区域;The control system, based on the distribution information, adjusts at least one of the workpiece stage, the beam converging module, and the incident light adjusting component, so that the different measurement light spots have at least a partial overlap area;
所述探测器收集所述不同波长的光束经所述待测样品后的反射和/或散射光束,以获取测量信息。The detector collects the reflected and/or scattered light beams of the light beams of different wavelengths after passing through the sample to be measured, so as to obtain measurement information.
作为本发明的进一步改进,所述入射光调节组件包括:As a further improvement of the present invention, the incident light adjustment component includes:
第一分光镜和第一反射镜;所述光束汇聚模块包括第一透镜与第二透镜;所述第一分光镜将所述宽波段光束分解为第一子光束与第二子光束,所述第一子光束与所述第二子光束波长不同;所述第一子光束经所述第一透镜汇聚至所述样品表面形成第一量测光斑;所述第二子光束经所述第一反射镜反射后被所述第二透镜汇聚以在所述样品表面形成第二量测光斑。a first beam splitter and a first reflection mirror; the beam converging module includes a first lens and a second lens; the first beam splitter decomposes the broadband light beam into a first sub-beam and a second sub-beam, the The wavelengths of the first sub-beam and the second sub-beam are different; the first sub-beam is converged to the sample surface through the first lens to form a first measurement spot; the second sub-beam is passed through the first sub-beam After being reflected by the mirror, it is converged by the second lens to form a second measurement spot on the surface of the sample.
作为本发明的进一步改进,所述第一子光束与所述宽波段光束同轴,所述第二子光束光轴与所述宽波段光束光轴具有一夹角。As a further improvement of the present invention, the first sub-beam is coaxial with the broadband beam, and the optical axis of the second sub-beam and the broadband beam have an included angle.
作为本发明的进一步改进,所述控制系统基于所述分布信息调整所述第一透镜和/或所述第二透镜的焦距以使所述第一量测光斑与所述第一量测光斑重合。As a further improvement of the present invention, the control system adjusts the focal length of the first lens and/or the second lens based on the distribution information to make the first measurement spot coincide with the first measurement spot .
作为本发明的进一步改进,所述入射光调节组件还包括:第二反射镜与第二分光镜;As a further improvement of the present invention, the incident light adjustment component further includes: a second reflector and a second beam splitter;
所述第一子光束经所述第一透镜汇聚并穿透所述第二分光镜后入射至所述样品表面形成所述第一量测光斑;The first sub-beam is condensed by the first lens and penetrates the second beam splitter, and then enters the sample surface to form the first measurement spot;
所述第二子光束被所述第二透镜汇聚后经所述第二反射镜反射至所述第二分光镜,所述第二分光镜将所述第二子光束的部分光束进行反射以形成所述第二量测光斑。The second sub-beam is converged by the second lens and then reflected by the second mirror to the second beam splitter, and the second beam splitter reflects part of the second sub-beam to form the second measurement spot.
作为本发明的进一步改进,所述第一子光束与经所述第二分光镜反射后的部分第二子光束以相同入射角入射至所述待测样品表面。As a further improvement of the present invention, the first sub-beam and part of the second sub-beam reflected by the second beam splitter are incident on the surface of the sample to be tested at the same incident angle.
作为本发明的进一步改进,所述第二反射镜为可偏摆反射镜。As a further improvement of the present invention, the second reflector is a swingable reflector.
作为本发明的进一步改进,所述入射光调节组件还包括第一快门和第二快门,所述第一快门设置于所述第一透镜的入射面一侧,用于控制所述第一子光束的开关,所述第二快门设置于所述第二透镜的入射面一侧,用于控制所述第二子光束的开关。As a further improvement of the present invention, the incident light adjustment component further includes a first shutter and a second shutter, the first shutter is disposed on the incident surface side of the first lens, and is used to control the first sub-beam The second shutter is arranged on the side of the incident surface of the second lens, and is used to control the switch of the second sub-beam.
作为本发明的进一步改进,所述控制系统基于所述光斑信息调控所述工件台的垂直位置、所述光束汇聚模块的焦距、所述入射光调节组件的倾斜角度,以使所述第一量测光斑与所述第一量测光斑重合。As a further improvement of the present invention, the control system adjusts the vertical position of the workpiece table, the focal length of the beam converging module, and the inclination angle of the incident light adjustment component based on the light spot information, so that the first quantity The measuring light spot is coincident with the first measuring light spot.
作为本发明的进一步改进,所述宽波段光束的波长范围为200~1700nm。As a further improvement of the present invention, the wavelength range of the broadband light beam is 200-1700 nm.
作为本发明的进一步改进,所述第一子光束的波长为1100~1700nm,所述第二子光束的波长为200~1100nm;或所述第一子光束的波长为200~1100nm,所述第二子光束的波长为1100~1700nm。As a further improvement of the present invention, the wavelength of the first sub-beam is 1100-1700 nm, the wavelength of the second sub-beam is 200-1100 nm; or the wavelength of the first sub-beam is 200-1100 nm, the The wavelengths of the two sub-beams are 1100-1700 nm.
与现有技术相比,本发明的有益效果是:Compared with the prior art, the beneficial effects of the present invention are:
在本申请中,将所述宽波段光束分解为至少两束不同波长光束,通过光束汇聚模块及入射光调整组件使得所述不同波长的光束在样品表面形成不同量测光斑,并且所述不同量测光斑在样品表面形成至少具有部分重叠区域,从而使得不同量测光斑均落在样品表面量测Pad区域内,从而降低了入射光束在待测样品表面所形成的量测光斑的尺寸,并提高了对待测样品执行膜厚、关键尺寸等形貌参数的量测数据的准确性及重复性。In the present application, the broadband beam is decomposed into at least two beams of different wavelengths, and the beams of different wavelengths form different measurement spots on the sample surface through the beam converging module and the incident light adjustment component, and the different wavelengths The measurement spot is formed on the sample surface with at least a partial overlapping area, so that different measurement spots all fall within the measurement pad area of the sample surface, thereby reducing the size of the measurement spot formed by the incident beam on the sample surface to be measured, and improving The accuracy and repeatability of the measurement data of the topographical parameters such as film thickness and critical dimensions of the sample to be tested were investigated.
附图说明Description of drawings
图1为现有技术中的宽光谱椭偏仪的示意图;Fig. 1 is the schematic diagram of the wide spectrum ellipsometer in the prior art;
图2为基于图1所示出的宽光谱椭偏仪在晶圆表面的Pad区所形成的量测光斑的示意图;2 is a schematic diagram of a measurement spot formed in the Pad region of the wafer surface based on the wide-spectrum ellipsometer shown in FIG. 1;
图3为本发明所揭示的宽光谱椭偏测量设备的示意图;Fig. 3 is the schematic diagram of the wide-spectrum ellipsometry measurement device disclosed by the present invention;
图4为基于图3所示出的宽光谱椭偏测量设备透过第一透镜的出射光线在晶圆表面的Pad区所形成的第一量测光斑的示意图,其中,透过第一透镜的出射光线的波长为1100~1700nm;4 is a schematic diagram of a first measurement spot formed in the Pad area of the wafer surface based on the outgoing light of the wide-spectrum ellipsometry device shown in FIG. 3 through the first lens, wherein the light passing through the first lens The wavelength of the outgoing light is 1100-1700nm;
图5为基于图3所示出的宽光谱椭偏测量设备透过第二透镜的出射光线在晶圆表面的Pad区所形成的第二量测光斑的示意图,其中,透过第二透镜的出射光线的波长为200~1100nm;5 is a schematic diagram of a second measurement spot formed in the Pad area of the wafer surface based on the outgoing light of the wide-spectrum ellipsometry device shown in FIG. 3 through the second lens, wherein the light passing through the second lens The wavelength of the emitted light is 200-1100nm;
图6为本发明所揭示的宽光谱椭偏测量设备在另一种实施例中的示意图;6 is a schematic diagram of the wide-spectrum ellipsometry device disclosed in another embodiment of the present invention;
图7为本发明所揭示的宽光谱椭偏测量设备在又一种实施例中的示意图;7 is a schematic diagram of a wide-spectrum ellipsometry device disclosed in another embodiment of the present invention;
图8为工件台承载待测样品的示意图;Fig. 8 is the schematic diagram that the workpiece table carries the sample to be tested;
图9为本发明所揭示的宽光谱椭偏测量设备的结构框图。FIG. 9 is a structural block diagram of the wide-spectrum ellipsometry device disclosed in the present invention.
具体实施方式Detailed ways
下面结合附图所示的各实施方式对本发明进行详细说明,但应当说明的是,这些实施方式并非对本发明的限制,本领域普通技术人员根据这些实施方式所作的功能、方法、或者结构上的等效变换或替代,均属于本发明的保护范围之内。The present invention will be described in detail below with reference to the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments do not limit the present invention. Equivalent transformations or substitutions all fall within the protection scope of the present invention.
本实施例所揭示的一种宽光谱椭偏测量设备可用于执行显影后检查(ADI)、刻蚀后检查(AEI)等多种工艺段的二维或三维样品的线宽、侧壁角度(SWA)、高度/深度等关键尺寸(CD)特征、膜厚或整体形貌测量,具有高速、准确和非破坏性等特点,是半导体前道检测的关键设备之一。The wide-spectrum ellipsometry device disclosed in this embodiment can be used to perform post-development inspection (ADI), post-etch inspection (AEI) and other process sections of the line width, sidewall angle ( SWA), height/depth and other critical dimension (CD) features, film thickness or overall topography measurement, with high speed, accuracy and non-destructive characteristics, is one of the key equipment for semiconductor front-line inspection.
参图3至图5、图8及图9所示,本实施例揭示了一种宽光谱椭偏测量设备。在本实施例中,一种宽光谱椭偏测量设备,对待测样品1(即,样品,例如晶圆、IC器件等)的表面形貌进行量测,包括:工件台100,出射宽波段光束110的宽光谱光源10,垂直于待测样品1的对准系统20,位于入射光路中的入射光调整组件80,光束汇聚模块70,控制系统50及探测器40。工件台100用于承载并带动待测样品1,带动待测样品沿X/Y/Z轴任一方向运动,并配合后续的对准、调焦或者两个量测光斑的位置重叠处理操作。宽光谱光源10用于发射宽波段光束110,宽波段光束110所包含的光线波长范围为200~1700nm。光束汇聚模块70包括第一透镜14、第二透镜15及透镜16,且前述透镜即可视为一个透镜,也可视为多个透镜沿同一光轴所依次配置的透镜组。入射光调整组件80将宽波段光束分解为至少两束不同波长光束(例如,下文所述的第一子光束121与第二子光束122),并调整不同波长光束的传输方向。光束汇聚模块70由多个独立控制的透镜组成,用于汇聚不同波长的光束以在样品表面形成不同量测光斑(即,下文所述的第一量测光斑与第二量测光斑)。对准系统20垂直设置于待测样品1的上方,并用以获取所述量测光斑在所述样品表面的分布信息,分布信息包括光斑位置、光斑尺寸。控制系统50基于分布信息调整工件台100、光束汇聚模块70、入射光调节组件80中的至少一种,以使所述不同量测光斑至少具有部分重叠区域,从而实现不同波长光束入射至同一测量点。探测器40用于收集不同波长的光束经过待测样品后的反射和/或散射光束,以获取测量信息。Referring to FIG. 3 to FIG. 5 , FIG. 8 and FIG. 9 , the present embodiment discloses a broad spectrum ellipsometry measurement device. In this embodiment, a wide-spectrum ellipsometry measurement device is used to measure the surface topography of a sample to be measured 1 (ie, a sample, such as a wafer, an IC device, etc.), including: a
入射光调整组件80所产生的两路或者三路或者更多的倾斜入射至待测样品1同一测量点的入射光束后,在待测样品1的表面(即样品表面)后发生反射和/或散射以形成反射光束和/或散射光束并被探测器40捕获,从而基于所捕获的光信号分析出待测样品1的待测参数。探测器40在本实施例中可为光谱仪。反射光束和/或散射光束透过透镜16后被探测器40所捕获,同时通过对准系统20基于图像匹配以确保穿过透镜16后的出射光线对准待测样品1表面指定的量测Pad区域。最终,由探测器40对自待测样品1的表面的量测Pad区域所反射和/或散射形成的光束并在穿过透镜16后进行光谱分析,以实现对待测样品1所具有的膜厚及关键尺寸(CD)予以测量。出射宽波段光束110光谱覆盖范围为190~2500nm,并进一步可选为200~1700nm。After two or three or more oblique incident beams generated by the incident
入射光调节组件80将入射光路中的波长为200~1700nm的宽波段光束110分解为至少两束波长不同入射光束,其中,所述入射光束覆盖的波长范围不同。申请人指出在本申请各个实施例中,示例性地示出将前述波长为200~1700nm的宽波段光束110分解为两个不同波长范围的入射光束。申请人指出还可借助多组分光镜与反射镜将宽波段光束110分解为三个或者数量更多的入射光束,只要保证多个入射光束倾斜射向待测样品1同一测量点即可,从而有效地降低椭圆形的量测光斑的尺寸(尤其是椭圆形的量测光斑的长轴尺寸),并减弱聚焦过程中色散效应对量测光斑尺寸的影响。The incident
示例性地,参图3所示,入射光调节组件80包括:第一分光镜12第一反射镜13与第一分光镜12。光束汇聚模块70包括第一透镜14与第二透镜15。第一分光镜12将宽波段光束110分解为光束波长不同的第一子光束121与第二子光束122,第一子光束121穿过第一透镜14以形成第一聚焦光束141,第一聚焦光束141汇聚至样品表面形成如图4所示出的第一量测光斑;第二子光束122通过第一反射镜13反射后穿过第二透镜15以形成与第一聚焦光束141具相同焦平面的第二聚焦光束152,第二汇聚光束152在样品表面形成如图5所示出的第二量测光斑。第一子光束121与宽波段光束110同轴,第二子光束光轴与宽波段光束110具一定夹角,且夹角大小可通过第一分光镜的位置调整,以使得形成第二量测光斑的第二子光束122的光轴与宽波段光束110的光轴所形成的夹角可调,以对第一量测光斑与第二量测光斑的光斑位置予以调节,以实现两个量测光斑的部分重合或者重合。Exemplarily, as shown in FIG. 3 , the incident
在实施例中,该第一子光束121的波长为1100~1700nm,第二子光束122的波长为200~1100nm。宽波段光束110可以满足从经紫外线、可见光至近红外线波段内的宽光谱检测需求。同时,透镜16、第一透镜14及第二透镜15均为汇聚透镜,并可沿彼此的光轴予以轴向调整。作为一种可选方案,还可将通过第一分光镜12将宽波段光束110分解为波长为200~1100nm的第一子光束121与波长为1100~1700nm的第二子光束122。In the embodiment, the wavelength of the
优选的,本实施例中的宽光谱椭偏测量设备还包括起偏系统11和检偏系统30。宽光谱光源10通过光纤连接起偏系统11以生成所需偏振方向的宽波段光束110作为入射光,入射光通过第一分光镜12将宽波段光束110分解为第一子光束121与第二子光束122。第一子光束121透过第一分光镜12后射向第一透镜14,并由第一透镜14对第一子光束121进行聚焦汇聚至待测样品1表面由对准系统20所确定测量点。第二子光束122通过第一分光镜12反射后入射至第一反射镜13表面并进一步反射至第二透镜15。第二透镜15对第二子光束122进行聚焦汇聚至待测样品1表面由对准系统20所确定的同一个测量点。在实现第一聚焦光束141与第二聚焦光束152汇聚至同一个测量点过程中,第一透镜14与第二透镜15可独立地调整焦距,以使第一聚焦光束141与第二聚焦光束152具有相同焦平面,从而在对准系统20所形成的像面视场中将透射过第一透镜14的第一子光束121汇聚至待测样品1表面的第一量测光斑与透射过第二透镜15的第二子光束122并聚焦汇聚至待测样品1表面的第二量测光斑予以对准以使两个量测光斑至少部分重合。经过待测样品1表面的反射光束和/或散射光束经透镜16汇聚至检偏系统30,以筛选出所需偏振方向的光束被光谱仪40收集,进而分析得出待测量参数。Preferably, the wide-spectrum ellipsometry device in this embodiment further includes a
结合图9所示,控制系统50选自包含逻辑运算存储功能并内置可运行计算机程序指令的单片机或者集成电路芯片或者计算机装置。控制系统50通过线缆及对应的接口(未示出)连接工件台100、光束汇聚模块70、入射光调节组件80及探测器40。控制系统50基于光斑信息调控工件台100的垂直位置、光束汇聚模块70的焦距或者入射光调节组件80的倾斜角度中的一个或者多个,以使得第一量测光斑与第二量测光斑部分重合或者完全重合。具体地,控制系统50控制工件台100沿垂直方向作往复运动,以通过对准系统20确定由第一子光束121在待测样品1表面形成最小尺寸的第一量测光斑时工件台的位置;将工件台100固定于此位置,控制系统50再基于第一量测光斑与第二量测光斑的光斑位置及光斑尺寸(即,分布信息),调整第一透镜14和/或第二透镜15的焦距,在对准系统20予以实施检测并向控制系统50反馈各个透镜的焦距校正结果,以确保视场中的第一量测光斑与第二量测光斑重合或者部分重合,并能够确保第一量测光斑与第二量测光斑的清晰度及位置的准确性。As shown in FIG. 9 , the
参图4所示出的第一透镜14的出射光线(即,波长为1100~1700nm的第一子光束121在第一聚焦光路141进行汇聚后)在晶圆表面的量测Pad区所形成的第一量测光斑的示意图。该第一量测光斑为椭圆形,其长轴长度约为5微米,短轴长度约为2微米,且明显小于图2中现有技术中的宽光谱椭偏仪在晶圆表面的量测Pad区所形成的量测光斑的尺寸。参图5所示出的第二透镜15的出射光线(即,波长为200~1100nm的第二子光束122在第二聚焦光路152进行汇聚后)在晶圆表面的量测Pad区所形成的第二量测光斑的示意图。该第二量测光斑为椭圆形,其长轴长度约为55微米,短轴长度约为22微米,且也明显小于图2中现有技术中的宽光谱椭偏仪在晶圆表面的Pad区所形成的量测光斑的尺寸。Referring to FIG. 4, the light emitted from the first lens 14 (that is, after the
前述实施例所揭示的宽光谱椭偏测量设备将宽波段光束110分解为两路形成具相同聚焦平面的第一聚焦光束与第二调焦光束,显著地缩小了量测光斑尺寸,从而提高了对待测样品执行膜厚、关键尺寸(CD)等形貌数据量测的准确性及重复性。The wide-spectrum ellipsometry device disclosed in the foregoing embodiment decomposes the wide-
示例性地,基于前述实施例所揭示的技术方案,参图6所示,本实施例示出了本发明一种宽光谱椭偏测量设备的另一种变形实例,该宽光谱椭偏测量设备包括入射光调节组件80。Exemplarily, based on the technical solutions disclosed in the foregoing embodiments, as shown in FIG. 6 , this embodiment shows another modification example of a wide-spectrum ellipsometry device of the present invention. The wide-spectrum ellipsometry device includes: Incident
具体的,该入射光调节组件80包括:第一分光镜12,第一反射镜13,第二反射镜18与第二分光镜19。具体地,第一分光镜12将宽波段光束110分解为第一子光束121与第二子光束122,第一子光束121经第一透镜14汇聚并穿透第二分光镜19以形成第一聚焦光束142,第一聚焦光束142入射至待测样品1表面形成一量测光斑;第二子光束122通过第一反射镜13反射后经第二透镜15汇聚,并通过第二反射镜18反射至第二分光镜19,第二分光镜19将第二子光束122的部分光束进行反射生成第二聚焦光束155,第二聚焦光束155入射至待测样品1表面形成第二量测光斑,且第一聚焦光束142与第二聚焦光束155具有相同入射角度。优选地,该第二反射镜18为可偏摆反射镜,因此可通过第二反射镜18执行摆动调节,以调节第二子光束122入射至第二反射镜18的入射角及反射角,同时也调控了第二子光束122入射至第二分光镜19的入射角及反射角,从而最终对由第二分光镜19所形成的第二聚焦光束155入射至测量样本1表面的入射角度,并实现第二聚焦光束155与第一聚焦光束142分别所形成的入射角的调节,从而对由第二聚焦光束155与第一聚焦光束分别形成的量测光斑的光斑位置和/或光斑尺寸予以调节,以确保待测样品表面两个量测光斑部分重叠或者完全重叠,并确保量测光斑始终落入量测Pad区域以内。Specifically, the incident
示例性地,基于前述实施例所揭示的技术方案,参图7所示,本实施例示出了本发明一种宽光谱椭偏测量设备的另一种变形实例,该宽光谱椭偏测量设备包括入射光调节组件80。Exemplarily, based on the technical solutions disclosed in the foregoing embodiments, as shown in FIG. 7 , this embodiment shows another modification example of a wide-spectrum ellipsometry device according to the present invention. The wide-spectrum ellipsometry device includes: Incident
入射光调节组件80还包括:第一快门51与第二快门52。第一快门51设置第一透镜14的入射面一侧,用以控制第一子光束121的开关(即,控制第一子光束121是否能够通过该第一快门51入射至第一透镜14),第二快门52设置第二透镜15的入射面一侧,用于控制第二子光束122的开关(即,控制第二子光束122是否能够通过该第二快门52入射至第二透镜15)。The incident
位于第二子光束122由第一分光镜12反射至第一反射镜13的光路中的第二块门52,以及位于第一子光束121由透射过第一分光镜12并射入第一透镜14的光路中的第一快门51,择一地开闭第一块门51与第二快门52,以调节第一子光束121与第二子光束122在待测样品1的表面所分别形成的量测光斑予以重合。第一子光束121的波长为1100~1700nm,第二子光束122的波长为200~1100nm。在本实施例中,可将第一块门51与第二快门52分别执行开启与闭合操作。具体地,结合图8、图9所示,首先控制系统50将将第一快门51打开并将第二快门52关闭,并控制承载测量样本1的工件台100沿垂直方向作往复运动,以通过对准系统20确定由第一子光束121在测量样本1表面形成最小尺寸的第一量测光斑的位置。然后,将第一快门51关闭并将第二快门52打开,此时保持工件台100沿垂直方向的位置,调整第二透镜15的焦距和/或第二反射镜18的位置和/或第二分光镜19的位置,并通过对准系统20观察第二子光束122在测量样本1表面所形成的第二量测光斑的位置,以确保第二量测光斑和第一量测光斑重合。The
上文所列出的一系列的详细说明仅仅是针对本发明的可行性实施方式的具体说明,它们并非用以限制本发明的保护范围,凡未脱离本发明技艺精神所作的等效实施方式或变更均应包含在本发明的保护范围之内。The series of detailed descriptions listed above are only specific descriptions for the feasible embodiments of the present invention, and they are not used to limit the protection scope of the present invention. Changes should all be included within the protection scope of the present invention.
对于本领域技术人员而言,显然本发明不限于上述示范性实施例的细节,而且在不背离本发明的精神或基本特征的情况下,能够以其他的具体形式实现本发明。因此,无论从哪一点来看,均应将实施例看作是示范性的,而且是非限制性的,本发明的范围由所附权利要求而不是上述说明限定,因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。It will be apparent to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, but that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments are to be regarded in all respects as illustrative and not restrictive, and the scope of the invention is to be defined by the appended claims rather than the foregoing description, which are therefore intended to fall within the scope of the claims. All changes within the meaning and scope of the equivalents of , are included in the present invention. Any reference signs in the claims shall not be construed as limiting the involved claim.
此外,应当理解,虽然本说明书按照实施方式加以描述,但并非每个实施方式仅包含一个独立的技术方案,说明书的这种叙述方式仅仅是为清楚起见,本领域技术人员应当将说明书作为一个整体,各实施例中的技术方案也可以经适当组合,形成本领域技术人员可以理解的其他实施方式。In addition, it should be understood that although this specification is described in terms of embodiments, not each embodiment only includes an independent technical solution, and this description in the specification is only for the sake of clarity, and those skilled in the art should take the specification as a whole , the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.
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| CN112539697A (en) * | 2020-07-14 | 2021-03-23 | 深圳中科飞测科技股份有限公司 | Light-emitting device and light spot adjusting method and detection equipment thereof |
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| CN107250766A (en) * | 2015-02-22 | 2017-10-13 | 科磊股份有限公司 | Optical metrology with reduced focusing error sensitivity |
| CN111665259A (en) * | 2019-03-08 | 2020-09-15 | 深圳中科飞测科技有限公司 | Testing equipment and testing methods |
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| CN116007508A (en) * | 2023-01-20 | 2023-04-25 | 睿励科学仪器(上海)有限公司 | Light spot detection method and device for ellipsometry |
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