CN115102322B - High-precision base assembly for semiconductor and preparation method thereof - Google Patents
High-precision base assembly for semiconductor and preparation method thereofInfo
- Publication number
- CN115102322B CN115102322B CN202210845866.7A CN202210845866A CN115102322B CN 115102322 B CN115102322 B CN 115102322B CN 202210845866 A CN202210845866 A CN 202210845866A CN 115102322 B CN115102322 B CN 115102322B
- Authority
- CN
- China
- Prior art keywords
- plastic base
- base
- lead frame
- injection molding
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K5/00—Casings; Enclosures; Supports
- H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
- H02K5/22—Auxiliary parts of casings not covered by groups H02K5/06-H02K5/20, e.g. shaped to form connection boxes or terminal boxes
- H02K5/225—Terminal boxes or connection arrangements
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
- H02K15/14—Casings; Enclosures; Supports
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K5/00—Casings; Enclosures; Supports
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
本发明公开了高精密半导体用底座组件及其制备方法，包括塑胶基座，所述塑胶基座内嵌有引线框架，所述引线框架上垂直设置有若干PIN脚，所述塑胶基座上设置有若干焊接部；其制备方法包括：将基材冲压成需要的线路;制作成为引线框架;注塑成型形成塑胶基座；将注塑完成的工件分割为单颗；IC芯片的植入，形成半导体注塑件；发明通过一次注塑成型的方式成型塑胶基座，预留出IC芯片的贴合位点，之后再进行芯片的植入，当产品基座加工不合格时，不会使芯片、发生损坏，相较现有工艺来说，保证了产品的合格率，成品率可达到98%，大幅增加了良率。
The present invention discloses a base assembly for high-precision semiconductors and a preparation method thereof, comprising a plastic base, wherein the plastic base is embedded with a lead frame, a plurality of PIN pins are vertically arranged on the lead frame, and a plurality of welding parts are provided on the plastic base; the preparation method comprises: punching a substrate into required circuits; making a lead frame; injection molding to form the plastic base; dividing the injection-molded workpiece into single pieces; implanting an IC chip to form a semiconductor injection-molded part; the invention forms the plastic base by a one-time injection molding method, reserves a fitting site for the IC chip, and then implants the chip. When the product base is unqualified, the chip will not be damaged. Compared with the existing process, the qualified rate of the product is guaranteed, and the finished product rate can reach 98%, which greatly increases the yield rate.
Description
Technical Field
The invention relates to the field of semiconductor packaging, in particular to a base component for a high-precision semiconductor and a preparation method thereof.
Background
The existing voice coil motor generally comprises a base, a metal circuit embedded in the base, a lower reed electrically connected with the metal circuit, a coil, a magnetic structure mutually acting with the coil and other parts, along with the development of miniaturization requirements of electronic equipment, the structure of a miniature digital camera is miniaturized more and more, the requirements on the use stability and reliability of the voice coil motor are higher and more, a substrate is often used as the base in the prior art, a chip, a coil and the like are driven into the base and then packaged by secondary injection molding, the efficiency is low, and especially, the assembly of sheet-type reeds is particularly difficult, as disclosed in the invention patent with the publication number of CN105676407B, the lens driving device comprises the lower reed, the reed baffle is arranged on the peripheral edge of the base, and the lower reed is clamped in the base through the reed baffle, and is also easy to be invalid due to the fact that the reed is fixed by adopting a clamping mode;
Because the reed is extremely fragile and is easy to damage, the cost of a part manufacturer or a camera manufacturer is increased, and because of the specificity of a sheet structure, the fixing structure is difficult to design, and the reed is easy to fall off in the use process due to simple fixing, so that the use failure of a voice coil motor is caused, and the quality and the service life of a camera assembly are further influenced;
In another embodiment, the invention disclosed in CN112799260a discloses a lens driving mechanism, which includes an upper reed, wherein an outer ring of the upper reed is provided with a plurality of frame mounting holes, and the frame mounting holes are fixedly connected with the upper reed positioning posts. The reed is usually fixed by adopting the fixing mode, and the subsequent fixing treatment is also required to be carried out by adopting a mode of fusing fixing columns and dispensing fixing. But firstly, because the positioning difficulty of the positioning of the column holes at the four corners is high and the auxiliary working procedure is needed for reinforcement after the positioning, the operation working procedure and the cost are increased. Even if a plurality of processes are added, the reed can not be prevented from falling off relative to the plastic body due to the too fragile fixed structure. Finally, the fixed reed is welded with the metal circuit injection molded in the plastic body by adopting a fixing mode of matching the column holes, so that electric conduction is realized by adopting a laser mode, the laser welding area is smaller, the secondary reinforcement is realized by adopting a glue dispensing mode after welding, the problem of smaller strength still exists in a welding structure of the laser welding mode, and the operation in the plastic body is limited no matter the welding or the glue dispensing is carried out;
The voice coil motor shown in the publication number CN111555536a comprises an upper reed and a lower reed, a positioning column is arranged on the base of the upper reed, and when the lower reed is installed, a fixing column of the lower reed needs to be arranged on one side of the positioning column and the lower reed needs to be welded at the position. By adopting the fixing mode, the fixing and welding reed positions are reserved outside the fixing column when the base is molded, and the fixing and welding mode is not beneficial to the miniaturization design of the voice coil motor;
In addition, the existing high-precision semiconductor injection molding device preparation method uses a material strap pulling mode for injection molding, for example, the patent publication number is: the base with the metal circuit, the production process thereof and the voice coil motor, and the base with the electronic component welded with the electronic component and the production process thereof and the voice coil motor disclosed by CN 112737272A have lower injection molding efficiency for many times in complex operation, when the material belt is implanted into an IC through the hot melting furnace, partial heating of the material belt is uneven, the material belt is deformed, the flatness of a manufactured final product is more than 5 wires after the deformation of the base, the subsequent processing error rate is higher, the prior art often uses two injection molding, namely, after one injection molding, the chip is attached again, the injection molding is carried out again after the chip is attached again until the required injection molding thickness is reached, the thickness of an injection molding part entering the hot melting furnace is reduced, the deformation amount is reduced to solve the problems, but the error rate of an injection molding part is higher, the error rate of about 5 percent is about 2% -5 percent after the two injection molding and the chip attachment, the error rate of the whole product line error rate is about 15 percent, the finished product rate is lower, and the chip attachment cost is still largely increased before the chip attachment is carried out continuously, and the problem that the chip attachment is still wasted is caused when the chip attachment is carried out once.
Disclosure of Invention
The invention provides a base component for a high-precision semiconductor, which comprises a plastic base, wherein a lead frame is embedded in the plastic base, the lead frame comprises a supporting table, an outer frame is arranged around the supporting table, the outer frame and the supporting table are integrally formed through connecting parts, a plurality of welding parts are arranged on the plastic base and used for subsequent assembly and connection, a plurality of storage grooves are formed in the plastic base, PAD points are arranged in the storage grooves, grooves are formed in the plastic base between the PAD points, and a plurality of floating material pinholes are formed in the plastic base.
Preferably, the welding part comprises a plurality of connecting grooves arranged on the plastic base, a welding table is arranged on one side of each connecting groove, and welding chips are embedded on part of the welding table.
Preferably, a plurality of PIN feet are vertically arranged on the outer frame of the lead frame, the PAD points and the outer frame of the lead frame are integrally formed, and the PIN feet protrude out of the plastic base.
Preferably, the plastic base is provided with a plurality of Mark points.
The invention provides a preparation method of a high-precision semiconductor injection molding device, which comprises the following steps of
S1, providing a base material belt, and stamping the base material into a required lead frame, wherein the lead frame comprises PAD points;
S2, bending corners of the lead frame, bending the lead frame to form a PIN, and electroplating at the position of the PIN by using a spot plating wheel;
s3, manufacturing the lead frame into a coil of material;
S4, pulling a material belt to send the lead frame into the injection mold, and then performing injection molding to form a plastic base, wherein after injection molding is completed, a PIN foot is exposed out of the plastic base, the plastic base coats an outer frame of the lead frame and reserves an IC patch point and a lead point, and a supporting table and a connecting part of the lead frame support the plastic base;
s5, cutting the PIN PIN and the plastic base, dividing the injection-molded workpiece into single cutting pieces to form base components, and turning the single base components;
S6, chip implantation, namely placing the turnover carrying disc into a hot melting furnace, implanting the IC chip in a mode of welding and melting a spot tin patch, encapsulating glue on the attached IC chip, attaching a coil on the glue encapsulation, and curing and drying to form a semiconductor injection molding piece;
and S7, detecting the semiconductor injection molding.
Preferably, during the injection molding of the plastic base S4, the insert is pressed against the IC chip and the lead points, so that the IC chip and the lead points are reserved during the molding.
Preferably, in the step S5, the base assembly is placed in the Tray, and after the appearance is checked and confirmed to be correct, the qualified base assembly is placed in the transfer Tray.
Preferably, the turnover carrying disc is made of aluminum alloy, a plurality of groups of profiling grooves are formed in the turnover carrying disc, and the profiling grooves are identical to the bottom surface of the base assembly in shape.
Preferably, when the step S5 is performed, a part of the PIN is cut off, so that the PIN is exposed out of the plastic base, and the connection part is cut off.
Compared with the prior art, the invention has the following beneficial effects:
1. According to the invention, the plastic base is molded in a one-step injection molding mode, the attaching site of the IC chip is reserved, then the chip is implanted, when the processing of the product base is unqualified, the chip, the coil and other parts are not damaged, compared with the operation process of the existing secondary injection molding stringing machine, the injection molding yield is not influenced on the whole yield after injection molding in the chip implantation process, the stringing machine operation is not needed, the utilization efficiency of the machine is improved, the process flow is shortened, the process is simple, the qualification rate of the product is ensured, the yield can reach 98%, and the yield is greatly increased.
2. In order to avoid deformation of the lead frame during injection molding, the supporting table is arranged at the center part of the lead frame, so that the lead frame is more protected, the lead frame is not easy to deform, meanwhile, the use of plastic is saved, and the supporting table is cut off after the injection molding is finished.
3. According to the invention, the grooves are arranged among the PAD points, so that the problem that solder paste at the bottom overflows when the IC chip is welded is solved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the description of the embodiments will be briefly described below.
FIG. 1 is a schematic flow chart of the present invention;
FIG. 2 is a schematic view of a plastic base structure according to the present invention;
FIG. 3 is an enlarged view of FIG. 2 at A;
FIG. 4 is a schematic view of a leadframe structure according to the present invention;
Wherein, 1, a plastic base, 101, a PIN foot, 102, a storage groove, 103, a PAD point, 104, a groove, 2, a lead frame, 201, a supporting table, 202, an outer frame, 203, a connecting part, 3, a welding part, 301, a connecting groove, 302 and a welding table.
Detailed Description
In order to overcome the defects of the prior art, the invention provides a high-precision base component for a semiconductor, which is shown in fig. 2, and comprises a plastic base 1, wherein a lead frame 2 is embedded in the plastic base 1, as shown in fig. 4, a plurality of PIN PINs 101 and PAD points 103 are vertically arranged on the lead frame 2, the PAD points 103 are used as welding platforms of an IC chip, the PIN PINs 101 protrude out of the plastic base 1, and the lead frame 2 is a required circuit frame which is arranged according to the requirement of a product, is not limited to a certain fixed shape, and is used for conducting a circuit with the IC chip;
As shown in fig. 3, the plastic base 1 is provided with a plurality of welding parts 3, the welding parts 3 include a plurality of connecting grooves 301 disposed on the plastic base 1, one side of each connecting groove 301 is provided with a welding table 302, and part of the welding tables 302 are embedded with welding tabs, in this embodiment, the plastic base 1 has a square structure, a through hole is disposed in the center of the plastic base 1, and a set of welding parts 3 are disposed at four corners of the plastic base 1.
The plastic base 1 is provided with a plurality of object placing grooves 102, the PAD points 103 are located in the object placing grooves 102, grooves 104 are formed in the plastic base 1 between the PAD points 103, solder paste at the PAD points 103 overflows and mixes when the solder is placed in the grooves 104, the plastic base 1 is provided with a plurality of floating material pinholes and MARK points, the floating material pinholes are used for pressing the lead frame 2 to prevent the lead frame 2 from displacement when the injection molding is performed, the MARK points are used for carrying out image recognition and positioning, further, the quality of a base assembly is detected through an industrial camera, in the embodiment, four object placing grooves 102 are formed in the plastic base 1, four groups of PAD points 103 are arranged in each object placing groove 102, the lead frame 2 comprises a supporting table 201, an outer frame 202 is arranged around the supporting table 201, the outer frame 202 is integrally formed with the supporting table 201 through a connecting part 203, and the lead frame 2 can change along with processing requirements, but all the lead frames 2 are provided with the supporting table 201, the connecting part 203, the outer frame 202 and the outer frame 202 are connected with the outer frame 103.
In order to overcome the defects in the prior art, the invention provides a preparation method of a high-precision semiconductor injection molding device, which comprises the following steps of
S1, providing a base material belt, stamping a base material into a required lead frame 2, wherein the lead frame 2 comprises a PAD point 103, and as an embodiment, providing a copper base material coiled material belt, stamping a copper base material into the lead frame 2 by using high-speed stamping and bending forming equipment, wherein the lead frame 2 comprises a required circuit, a supporting table 201, an outer frame 202 and the PAD point 103, the supporting table 201 is circular, a plurality of connecting parts 203 are arranged around the supporting table 201, the other end of the connecting part 203 is connected with the outer frame 202, the supporting table 201 is connected with the outer frame 202 through the connecting parts 203, the structures are on the same horizontal plane, uniformly distributed fixing holes are formed on the supporting table 201, and the supporting table 201 is used for fixing the outer frame 202 through the connecting parts 203 during injection molding.
S2, bending corners of the lead frame 2, bending the lead frame 2 to form a PIN 101, electroplating the PIN 101 by using a point plating wheel, wherein Ni/Au/Ag and the like are used as electroplating substances in the electroplating process as a best embodiment;
as an example, bending processing is performed on two sides of the outer frame respectively, and PIN 101 which is vertical to and protrudes from the outer frame is processed.
S3, manufacturing the lead frame 2 into a coil of material;
S4, pulling a material belt to send the lead frame 2 into the injection mold, and then performing injection molding to form a plastic base 1, liquefying engineering modified plastic in an injection molding machine, and then performing injection molding, wherein the plastic base 1 coats part of an outer frame, is positioned on the outer frame and is molded on the outer frame, a supporting table 201 is arranged in a through hole of the plastic base 1, the plane is lower than the top surface of the plastic base 1, the supporting table 201 is not wrapped by plastic, when the part of the outer frame is wrapped by plastic, the outer frame 202 is stressed, deformation of the outer frame 202 is often caused, and the supporting table 201 plays a role in supporting the outer frame 202 when the outer frame 202 is about to be deformed through a connecting part 203, so that the stress of the outer frame 202 is shared, and the deformation of the outer frame 202 is prevented;
As an embodiment, triangular grooves are formed in the injection mold in four corners, the triangular grooves are used for matching with a subsequent assembly process to complete embedded assembly, a welding table higher than the bottom surface plane is arranged on the clockwise side of each groove, the welding table is used for matching with the assembly process to complete connection among components, welding chips are embedded on part of welding tables, rectangular grooves are formed on the anticlockwise side of the welding table without welding chips, four PAD points 103 are uniformly arranged in the rectangular grooves, the PAD points 103 serve as welding platforms of IC chips, grooves 104 are formed among the PAD points 103, a plurality of floating PIN holes are formed on the plastic base 1 through fixing the lead frame 2 in the mold during injection molding, the welding table is used for preventing displacement of the lead frame 2 during injection molding, the welding table is used for matching with the assembly process, welding chips are embedded with welding chips, the welding chips are uniformly provided with four PAD points 103, the PAD points 103 are used for detecting the welding platform of the IC chips, and the welding platform of the IC chips is used for detecting the four PAD points, and the welding platform of the MAR points is used for detecting the welding chip quality of the four-chip, and the welding chip is used for detecting the welding point of the welding chip, and the welding platform of the welding chip is used for detecting the welding point of the four PAD points.
S5, cutting the PIN 101 and the supporting table 201, simultaneously cutting the injection molded continuous base assembly into single base assemblies, cutting the exposed part of the PIN 101 until the lengths are equal, cutting the supporting table 201, blanking the connecting part 203, cutting off the connecting part 203, further enabling the supporting table 201 to fall off, placing the cut single base assembly into a Tray, placing the base assembly into the Tray before the implantation of an IC chip, and placing the qualified base assembly into a turnover Tray after the appearance is qualified through manual observation or industrial camera inspection.
The turnover carrying disc is made of aluminum alloy, a plurality of groups of profiling grooves are arranged on the turnover carrying disc, the profiling grooves are identical to the base component in shape, the base component is completely attached to the profiling grooves when in the profiling grooves,
The application uses one-time injection molding, the base is placed into the turnover carrying disc after injection molding, and then the turnover carrying disc is placed into the hot melting furnace for IC chip implantation, the turnover carrying disc is made of aluminum alloy material and is fully attached to the bottom surface of an injection molding piece through the support of the profiling groove in the turnover carrying disc, the heat contact is extremely uniform, the hot melting furnace is provided with a constant temperature system, the further heat distribution is stable, the deformation amount of the base component after being heated is reduced due to the design of the profiling groove, the deformation amount can be reduced to below 3 wires, the problem of deformation in the hot melting furnace is solved, only single injection molding is needed and the position of a chip is reserved, the failure rate of one-time injection molding is far lower than the probability of two injection molding, the failure rate of each injection molding is often about 2% -3% when the IC chip is combined with implantation, the failure rate of the traditional drawing belt is often about 5%, the damaged base can not be removed continuously, the failure rate of the traditional drawing belt processing is about 85%, after improvement, the deformation amount of the base after single product is heated is reduced from the Tray, the problem of deformation is solved, the problem of deformation in the hot melting furnace is solved, the problem of deformation is solved, the cost of the IC chip can be greatly reduced, the cost is greatly reduced, and the cost of the IC chip can be greatly scrapped when the IC chip is lowered by the conventional machine when the IC chip is simultaneously, and the cost is greatly increased, and the cost when the cost is greatly increased when the cost when the IC chip is subjected to the operation to be simultaneously subjected to the operation.
And S6, placing an IC chip in the base assembly, implanting the IC chip in a mode of welding and melting a spot tin patch, encapsulating the glued IC chip, gluing a coil on the glued IC chip, and finally curing and drying to form the semiconductor device.
The method comprises the steps of placing the carrier disc into a machine by using an automatic wire body, carrying out tin plating on a PAD point 103 on the bottom surface of a plastic base 1, carrying out tin paste inspection on the same machine, then implanting an IC chip in a rectangular groove, attaching a coil which is a magnetic field induction wire, forming a stable magnetic field by the coil to meet the use requirement, completely covering the bottom surface of the plastic base 1 by the coil, carrying out visual inspection, carrying out reflow soldering after inspection, encapsulating the glue on the IC chip, and finally curing and drying;
and S7, detecting the semiconductor device.
Claims (8)
1. The base component comprises a plastic base (1), wherein a lead frame (2) is embedded in the plastic base (1), the lead frame (2) comprises a supporting table (201), an outer frame (202) is arranged around the supporting table (201), the outer frame (202) and the supporting table (201) are integrally formed through a connecting part (203), the supporting table (201) is not wrapped by plastic, the supporting table (201) plays a role in supporting the outer frame (202) when the outer frame (202) is about to deform through the connecting part (203), the stress of the outer frame (202) is shared, the deformation of the outer frame (202) is prevented, the connecting part (203) is cut off, and the supporting table (201) is enabled to fall down;
a plurality of welding parts (3) are arranged on the plastic base (1), and the welding parts (3) are used for subsequent assembly and connection;
A plurality of storage grooves (102) are arranged on the plastic base (1), PAD points (103) are arranged in the storage grooves (102), grooves (104) are arranged on the plastic base (1) between the PAD points (103), a plurality of floating material pinholes are arranged on the plastic base (1), and the plastic base is characterized in that,
The preparation method comprises the following steps:
S1, providing a base material belt, and stamping the base material into a required lead frame, wherein the lead frame comprises PAD points;
S2, bending corners of the lead frame, bending the lead frame to form a PIN, and electroplating at the position of the PIN by using a spot plating wheel;
s3, manufacturing the lead frame into a coil of material;
S4, pulling the material belt to send the lead frame into an injection mold, and then carrying out one-time injection molding to form a plastic base, wherein after injection molding is finished, a PIN foot is exposed out of the plastic base, the plastic base coats an outer frame of the lead frame and reserves an IC patch point and a lead point, and a supporting table and a connecting part of the lead frame support the plastic base;
S5, cutting the PIN PIN and the plastic base, dividing the injection molded workpiece into single cutting pieces to form base components, and transferring the single base components to a turnover carrier disc;
S6, chip implantation, namely placing the turnover carrying disc into a hot melting furnace, implanting the IC chip in a mode of welding and melting a spot tin patch, encapsulating glue on the attached IC chip, attaching a coil on the glue encapsulation, and curing and drying to form a semiconductor injection molding piece;
and S7, detecting the semiconductor injection molding.
2. The method for manufacturing the high-precision semiconductor injection molding device according to claim 1, wherein the welding part (3) comprises a plurality of connecting grooves (301) arranged on the plastic base (1), a welding table (302) is arranged on one side of the connecting grooves (301), and welding tabs are embedded on part of the welding table (302).
3. The method for manufacturing the high-precision semiconductor injection molding device according to claim 1, wherein a plurality of PIN (101) are vertically arranged on an outer frame (202) of the lead frame (2), the PAD points (103) and the outer frame (202) of the lead frame (2) are integrally formed, and the PIN (101) protrudes out of the plastic base (1).
4. The method for manufacturing the high-precision semiconductor injection molding device according to claim 1, wherein a plurality of Mark points are arranged on the plastic base (1).
5. The method according to claim 1, wherein the insert is pressed against the IC chip and the lead point during the injection molding of the plastic base S4, so as to reserve the IC chip and the lead point during the molding.
6. The method for manufacturing a high-precision semiconductor injection molding device according to claim 1, wherein the turnover mode in S5 is to place the base assembly into a Tray, and place the qualified base assembly into a turnover carrying Tray after checking and confirming that the appearance is correct.
7. The method for manufacturing a high-precision semiconductor injection molding device according to claim 1, wherein the turnover carrying disc is made of aluminum alloy, a plurality of groups of profiling grooves are formed in the turnover carrying disc, and the profiling grooves are identical to the bottom surface of the base assembly in shape.
8. The method of manufacturing a high-precision semiconductor injection molded device according to claim 1, wherein a portion of the PIN is cut off at the time of S5 cutting, so that the PIN is exposed from the plastic base, and the connection portion is cut off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210845866.7A CN115102322B (en) | 2022-07-19 | 2022-07-19 | High-precision base assembly for semiconductor and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210845866.7A CN115102322B (en) | 2022-07-19 | 2022-07-19 | High-precision base assembly for semiconductor and preparation method thereof |
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| Publication Number | Publication Date |
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| CN115102322A CN115102322A (en) | 2022-09-23 |
| CN115102322B true CN115102322B (en) | 2025-09-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210845866.7A Active CN115102322B (en) | 2022-07-19 | 2022-07-19 | High-precision base assembly for semiconductor and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115755313A (en) * | 2022-11-17 | 2023-03-07 | 河南皓泽电子股份有限公司 | Base, base machining method and lens driving mechanism |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4942452A (en) * | 1987-02-25 | 1990-07-17 | Hitachi, Ltd. | Lead frame and semiconductor device |
| JP2006210941A (en) * | 2006-03-27 | 2006-08-10 | Renesas Technology Corp | Semiconductor device |
| CN112331643A (en) * | 2020-10-20 | 2021-02-05 | 广东汇芯半导体有限公司 | Intelligent power module and manufacturing method thereof |
| CN114284218A (en) * | 2021-12-14 | 2022-04-05 | 江苏长电科技股份有限公司 | Cavity package structure and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6544820B2 (en) * | 1997-06-19 | 2003-04-08 | Micron Technology, Inc. | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
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2022
- 2022-07-19 CN CN202210845866.7A patent/CN115102322B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4942452A (en) * | 1987-02-25 | 1990-07-17 | Hitachi, Ltd. | Lead frame and semiconductor device |
| JP2006210941A (en) * | 2006-03-27 | 2006-08-10 | Renesas Technology Corp | Semiconductor device |
| CN112331643A (en) * | 2020-10-20 | 2021-02-05 | 广东汇芯半导体有限公司 | Intelligent power module and manufacturing method thereof |
| CN114284218A (en) * | 2021-12-14 | 2022-04-05 | 江苏长电科技股份有限公司 | Cavity package structure and manufacturing method thereof |
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| CN115102322A (en) | 2022-09-23 |
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