CN115164712B - Back drill alignment degree detection plate and detection method thereof - Google Patents
Back drill alignment degree detection plate and detection method thereofInfo
- Publication number
- CN115164712B CN115164712B CN202210743538.6A CN202210743538A CN115164712B CN 115164712 B CN115164712 B CN 115164712B CN 202210743538 A CN202210743538 A CN 202210743538A CN 115164712 B CN115164712 B CN 115164712B
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- hole
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- drilling
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/30—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring angles or tapers; for testing the alignment of axes
- G01B7/31—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
- G01B7/312—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes for measuring eccentricity, i.e. lateral shift between two parallel axes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
本发明涉及PCB技术领域，公开了一种背钻对准度检测板及其检测方法。背钻对准度检测板包括电路板本体，电路板本体划分为拟背钻非钻穿层和拟背钻钻穿层；在拟背钻非钻穿层，于拟制作一钻孔外周制作有第一测试环，且第一测试环沿孔周向划分为相互断开的至少两段第一弧形分段；在拟背钻钻穿层，于拟制作背钻孔外周制作第二测试环，且第二测试环沿孔周向划分为相互断开的至少两段第二弧形分段。本发明实施例摒弃了目测和切片操作，能够完全杜绝目测检测方式和切片检测方式存在的工作量大、主观性强及检查结果较为片面的缺陷，而且不仅能够检测出一钻孔与背钻孔的绝对偏移情况，还能够分析得到一钻孔与背钻孔的相对偏移情况，检测结果有效且精准。
The present invention relates to the field of PCB technology, and discloses a back-drill alignment detection board and a detection method thereof. The back-drill alignment detection board includes a circuit board body, and the circuit board body is divided into a proposed back-drilled non-drilling layer and a proposed back-drilling drilling layer; in the proposed back-drilling non-drilling layer, a first test ring is made at the periphery of a drill hole to be made, and the first test ring is divided into at least two first arc segments disconnected from each other along the circumference of the hole; in the proposed back-drilling drilling layer, a second test ring is made at the periphery of the proposed back-drilled hole, and the second test ring is divided into at least two second arc segments disconnected from each other along the circumference of the hole. The embodiment of the present invention abandons visual inspection and slicing operations, and can completely eliminate the defects of large workload, strong subjectivity and relatively one-sided inspection results of visual inspection methods and slicing inspection methods, and can not only detect the absolute offset between a drill hole and a back-drilled hole, but also analyze and obtain the relative offset between a drill hole and a back-drilled hole, and the detection result is effective and accurate.
Description
Technical Field
The invention relates to the technical field of PCBs (Printed Circuit Boards ), in particular to a back drill alignment detection plate and a detection method thereof.
Background
As the speed of signal transmission increases, the frequency increases, and thus signal integrity becomes an increasingly important core of PCBs. However, part of hole copper, called stub, is always present in the via hole PTH of conventional design, which does not play any role in connection, and this hole copper causes problems such as reflection, scattering, delay, etc. of high-frequency and high-speed signals.
The process of drilling the stub is called back drilling, and the back drilling is a drilling technology for specially controlling the drilling depth, namely, on the basis of one drill, a drill bit with a larger diameter than the one drill is used for drilling the useless copper in the one drill. In the machining process, the overlapping ratio of the back drill and the one drill is deviated, so that the phenomenon of copper hanging exists on the hole wall of the one drill, and the phenomenon is particularly shown in fig. 1. For this reason, currently, the alignment degree of the back drill is mainly judged by a visual inspection method and a slicing method.
(1) The visual inspection method comprises the steps of observing from the back drilling surface to the inside through a ten-fold mirror to observe whether a drill is tangential to the back drilling or the center of circle is deviated, wherein the method has large workload, and a lens cannot focus on a drill position along with the increase of the drill depth of the back drilling;
(2) The slicing method is performed by slicing, but since slicing only observes the backdrilling offset of one of the vertical/horizontal sections, the result is opposite to the slice.
Disclosure of Invention
The invention aims to provide a back drill alignment degree detection plate and a detection method thereof, which are used for solving the problems of large detection workload, opposite detection results, one-sided detection and the like in the prior art.
To achieve the purpose, the invention adopts the following technical scheme:
the back drill alignment degree detection plate comprises a circuit board body, wherein the circuit board body is divided into at least one back drill non-drilling layer which is not to be penetrated by back drill and at least one back drill penetrating layer which is to be penetrated by back drill along the back drill drilling direction;
A first test ring is manufactured on the periphery of a first theoretical manufacturing position of a to-be-manufactured drilling hole of the circuit board body, and the first test ring is divided into at least two sections of first arc-shaped sections which are disconnected with each other along the circumferential direction of the to-be-manufactured drilling hole;
manufacturing a second test ring at the periphery of a second theoretical manufacturing position of the back drilling hole to be manufactured on the back drilling penetrating layer of the circuit board body, wherein the second test ring is divided into at least two sections of second arc-shaped sections which are disconnected with each other along the circumferential direction of the back drilling hole to be manufactured;
The first theoretical manufacturing position and the second theoretical manufacturing position are coaxially arranged.
Optionally, the first test ring and the second test ring are divided in the same manner, so that the upper and lower positions of each first arc-shaped section and each second arc-shaped section are aligned one by one.
Optionally, the circuit board body is further provided with at least two groups of test units, and each group of test units corresponds to a group of first arc-shaped section and a group of second arc-shaped section which are aligned vertically.
Optionally, the test unit includes a first metallized test well, a second metallized test well, and a third metallized test well;
The first metallization test hole is electrically connected with one end of the corresponding first arc-shaped section in the arc length direction, the second metallization test hole is electrically connected with the other end of the corresponding first arc-shaped section in the arc length direction and one end of the corresponding second arc-shaped section in the arc length direction simultaneously, and the third metallization test hole is electrically connected with the other end of the corresponding second arc-shaped section in the arc length direction.
Optionally, the second metallization test hole penetrates through the other end of the corresponding first arc-shaped segment in the arc length direction.
Optionally, the inner diameter of the first test ring is equal to the theoretical hole diameter of the first drill hole, and the width is equal to the maximum allowable offset under the current alignment degree detection level of the first drill hole;
the inner diameter of the second test ring is equal to the theoretical drilling aperture of the back drilling hole, and the width is equal to the maximum allowable offset under the current back drilling alignment degree detection grade.
A backdrilling alignment detection method, comprising:
on the circuit board body of the back drill alignment degree detection board according to any one of the above, firstly, manufacturing a drill hole according to the first theoretical manufacturing position, and then manufacturing a back drill hole according to the second theoretical manufacturing position;
detecting whether each first arc-shaped section of the first test ring is drilled, and judging absolute offset information of the drilled hole according to the detection result;
Detecting whether each second arc-shaped section of the second test ring is drilled or not, and judging absolute offset information of the back drilling hole according to the detection result, wherein the absolute offset information comprises an offset range and an offset direction;
And analyzing and obtaining the relative offset information of the drill hole and the back drill hole according to the absolute offset information of the drill hole and the absolute offset information of the back drill hole.
Optionally, the first test ring and the second test ring are divided in the same way, so that the first arc-shaped sections are aligned with the second arc-shaped sections one by one, and at least two groups of test units are also manufactured on the circuit board, wherein each group of test units corresponds to the first arc-shaped section and the second arc-shaped section which are aligned with each other in the upper and lower positions;
the test unit comprises a first metallization test hole, a second metallization test hole and a third metallization test hole, wherein the first metallization test hole is electrically connected with one end of a corresponding first arc-shaped section in the arc length direction, the second metallization test hole is electrically connected with the other end of the corresponding first arc-shaped section in the arc length direction and one end of a corresponding second arc-shaped section in the arc length direction at the same time, and the third metallization test hole is electrically connected with the other end of the corresponding second arc-shaped section in the arc length direction.
Judging whether each first arc-shaped section of the first test ring is drilled or not according to the electric conduction state between the first metallization test hole and the second metallization test hole in each test unit;
And judging whether each second arc-shaped section of the second test ring is drilled or not according to the electric conduction state between the second metallization test hole and the third metallization test hole in each test unit.
Compared with the prior art, the invention has the beneficial effects that:
the embodiment of the invention respectively manufactures a test ring on the non-drilling-through layer of the back-drilling-through layer of the circuit board body and the back-drilling-through layer of the circuit board body, and carries out sectional treatment on the test ring, and then a drilling hole and a back drilling hole can be manufactured in the test ring, and the actual deviation condition of the drilling hole and the back drilling hole is judged by detecting whether each section of each part of the test ring is broken by drilling. The method abandons visual inspection and slicing operation, can completely eliminate the defects of large workload, strong subjectivity and relatively single surface of inspection results in visual inspection and slicing inspection modes, can detect the absolute deviation condition of a drilling hole and a back drilling hole, and can analyze and obtain the relative deviation condition of the drilling hole and the back drilling hole, and the detection result is effective and accurate.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 (1) and (2) are schematic illustrations of a conventional one-bit and back-bit comparison in aligned and misaligned conditions.
Fig. 2 is a transverse cross-sectional view of a backdrill alignment detection plate according to an embodiment of the present invention.
Fig. 3 is a perspective view of a back drill alignment degree detection plate according to an embodiment of the present invention.
Fig. 4 is a flowchart of a back drill alignment detecting method according to an embodiment of the present invention.
Reference numerals illustrate a first test ring 1, a second test ring 2, a borehole 3, a back borehole 4, a first metallized test hole 5, a second metallized test hole 6, and a third metallized test hole 7.
Detailed Description
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions in the embodiments of the present invention are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The back drilling is a drilling technology for specially controlling the depth of a drilled hole, namely, on the basis of a drilled hole, a drill bit with the diameter larger than or equal to that of the drilled hole is adopted to drill away the useless copper in the drilled hole to form the back drilled hole. Therefore, one drilling hole is a through hole structure penetrating through the upper plate surface and the lower plate surface of the circuit board body, and the back drilling hole is obtained by reaming the upper section hole section of one drilling hole by taking one side plate surface of the circuit board body as an entrance drilling surface, namely, the depth of the back drilling hole is smaller than that of the one drilling hole, so that part of the core plate of the circuit board body is penetrated by the back drilling hole, and part of the core plate is not penetrated by the back drilling hole. Therefore, for convenience of description, the circuit board body is divided into a non-penetration layer of the back drill to be not penetrated by the back drill and a penetration layer of the back drill to be penetrated by the back drill according to the back drill drilling direction.
In order to realize simple and effective alignment detection of a drill and a back drill, the embodiment of the invention provides a back drill alignment detection plate, which is characterized in that a test ring is respectively manufactured on a non-drilling-through layer of a back drill and a drilling-through layer of the back drill of a circuit board body, the test ring is subjected to sectional treatment, a drill hole 3 and a back drill hole 4 can be manufactured in the test ring later, and the actual offset condition of the drill hole 3 and the back drill hole 4 is judged by detecting whether each partial section of the test ring is broken by drilling. The method abandons visual inspection and slicing operations, can completely eliminate the defects of large workload, strong subjectivity and relatively single surface of inspection results in the visual inspection and slicing inspection modes, can detect the absolute deviation condition of a drilling hole 3 and a back drilling hole 4, can analyze and obtain the relative deviation condition of the drilling hole 3 and the back drilling hole 4, and has effective and accurate inspection results.
Referring to fig. 2 and 3, the back drill alignment detecting board provided by the embodiment of the invention includes a circuit board body.
The method comprises the steps that a first test ring 1 is manufactured on the periphery of a first theoretical manufacturing position of a to-be-manufactured drilling hole 3 of a circuit board body in a non-drilling through layer of a to-be-drilled back drill, and the first test ring 1 is divided into at least two sections of first arc-shaped sections which are disconnected with each other along the circumferential direction of the to-be-manufactured drilling hole 3. The first theoretical drilling position refers to a theoretical drilling position of a drilling hole 3 on the circuit board body.
And manufacturing a second test ring 2 at the periphery of a second theoretical manufacturing position of the back drilling hole 4 to be manufactured on the simulated back drilling penetrating layer of the circuit board body, wherein the second test ring 2 is divided into at least two sections of second arc-shaped sections which are disconnected with each other along the circumferential direction of the back drilling hole 4 to be manufactured. The second theoretical manufacturing position refers to a theoretical drilling position of the back drilling hole 4 on the circuit board body, and is coaxially arranged with the first theoretical manufacturing position.
It should be noted that, in the actual machining process, if the actual manufacturing position of the drill hole 3 deviates from the theoretical manufacturing position, the manufactured drill hole 3 will tend to intersect the first test ring 1 around the drill hole 3, and when the deviation reaches a certain level, the first test ring 1 will be completely drilled by the drill hole 3, so that it can be determined whether the absolute deviation and the actual deviation level of the drill hole 3 actually occur according to the state of the first test ring 1.
Similarly, if the actual manufacturing position and the theoretical manufacturing position of the back drill deviate, the manufactured back drill 4 will tend to intersect with the second test ring 2 at the outer periphery thereof, and when the deviation reaches a certain degree, the back drill 4 will completely drill the second test ring 2, so that it can be determined whether the back drill 4 actually deviates absolutely and the actual deviation degree according to the state of the second test ring 2.
Further, in the embodiment of the present invention, the first test ring 1 and the second test ring 2 are processed in segments along the hole circumferential direction, and each arc segment is detected separately, so that the approximate position of each test ring being drilled can be identified, and the absolute offset direction of a drill hole 3 and the absolute offset direction of the back drill hole 4 can be determined.
Therefore, based on the sectional detection results of the first test ring 1 and the second test ring 2, the absolute offset conditions (including the offset direction and the offset degree) of the drill hole 3 and the back drill hole 4 can be respectively determined, and based on the absolute offset conditions of the drill hole 3 and the back drill hole 4, the relative offset conditions of the drill hole 3 and the back drill hole 4 can be further analyzed and obtained.
In practical application, the first test ring 1 and the second test ring 2 may be divided into different modes (such as number of segments and position of segments), and in order to improve manufacturing and detecting efficiency, the same dividing modes (including number of segments and position of segments) may be adopted, so that each first arc segment corresponds to each second arc segment in a one-to-one manner.
Further, as shown in fig. 3, in order to realize the function of detecting each arc segment, at least two groups of test units are also manufactured on the circuit board body, and each group of test units corresponds to a group of first arc segment and second arc segment which correspond to the upper position and the lower position.
The test unit comprises a first metallization test hole 5, a second metallization test hole 6 and a third metallization test hole 7, wherein the first metallization test hole 5 is electrically connected with one end of the corresponding first arc-shaped section in the arc length direction, the second metallization test hole 6 is simultaneously electrically connected with the other end of the corresponding first arc-shaped section in the arc length direction and one end of the corresponding second arc-shaped section in the arc length direction, and the third metallization test hole 7 is electrically connected with the other end of the corresponding second arc-shaped section in the arc length direction.
Illustratively, the second metallization test hole 6 penetrates through the other end of the corresponding first arc-shaped segment in the arc length direction, and is electrically connected with one end of the corresponding second arc-shaped segment in the arc length direction through the inner layer pattern.
At this time, compared with a mode of respectively detecting two arc segments by using four through holes, the three metallized test through holes are used for simultaneously detecting the states of the upper arc segment and the lower arc segment, multiplexing of one metallized test hole is realized, space can be effectively saved, and wiring density is improved.
In the embodiment of the invention, the inner diameter of the first test ring 1 is equal to the theoretical drilling aperture of a drilling hole 3, the width is equal to the maximum allowable offset under the current drilling alignment detection level, and the inner diameter of the second test ring 2 is equal to the theoretical drilling aperture of the back drilling hole 4, and the width is equal to the maximum allowable offset under the current back drilling alignment detection level. Based on this, when a certain first arc segment of the first test ring 1 is completely drilled, it is indicated that the actual offset of a borehole 3 reaches the maximum allowable offset at the current drill alignment detection level, and similarly, when a certain second arc segment of the second test ring 2 is completely drilled, it is indicated that the offset of the back borehole 4 reaches the maximum allowable offset at the current back drill alignment detection level. Thus, the width of the test ring can be designed according to the actual alignment requirements.
In practical applications, to determine the maximum alignment capability of a borehole 3 (or back borehole 4), multiple sets of first test rings 1 (or second test rings 2) may be fabricated simultaneously, and the widths of the respective first test rings 1 (or second test rings 2) may be set according to a predetermined gradient. After a borehole 3 (or back borehole 4) is formed in each first test ring 1, the first test ring 1 (or second test ring 2) with the smallest width can represent the maximum alignment capability of a borehole 3 (or back borehole 4) in a group of first test rings 1 (or second test rings 2) which are completely drilled.
Referring to fig. 4, an embodiment of the present invention provides a back drill alignment detecting method, including:
Step 101, manufacturing a drill hole 3 according to a first theoretical manufacturing position on the circuit board body of the back drill alignment degree detection board, and then manufacturing a back drill hole 4 according to a second theoretical manufacturing position.
Step 102, detecting whether each first arc segment of the first test ring 1 is drilled, and judging absolute offset information of a drilling hole 3 according to the first arc segment, and detecting whether each second arc segment of the second test ring 2 is drilled, and judging absolute offset information of a back drilling hole 4 according to the second arc segment.
Step 103, analyzing to obtain the relative offset information of the borehole 3 and the back borehole 4 according to the absolute offset information of the borehole 3 and the absolute offset information of the back borehole 4.
Taking fig. 3 as an example, if it is detected that the first arc segment at the upper left of the first test ring 1 is drilled out and the first arc segments in other directions are not drilled out, it is determined that a borehole 3 is offset to the upper left, and the offset reaches the width value of the first test ring 1.
If it is detected that the second arc-shaped segment at the lower right of the second test ring 2 is drilled out and that the second arc-shaped segments in other directions are not drilled out, it is determined that the back drilling hole 4 is shifted to the lower right and the shift amount reaches the width value of the second test ring 2.
Further, on the basis that the offset of one drilling hole 3 is offset to the upper left and reaches the width value of the first test ring 1, the offset of the back drilling hole 4 is offset to the lower right and reaches the width value of the second test ring 2, the relative offset direction of the back drilling hole 4 relative to the one drilling hole 3 can be analyzed to be the lower right and reach the sum of the width value of the first test ring 1 and the width value of the second test ring 2.
Therefore, according to the method of the embodiment of the invention, the absolute offset information of the drill hole 3, the absolute offset information of the back drill hole 4 and the relative offset information of the drill hole 3 and the back drill hole 4 can be rapidly and accurately detected.
While the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that the foregoing embodiments may be modified or equivalents may be substituted for some of the features thereof, and that the modifications or substitutions do not depart from the spirit and scope of the embodiments of the invention.
Claims (7)
1. The backdrill alignment detection plate is characterized by comprising a circuit board body, wherein the circuit board body is divided into at least one backdrill non-penetrating layer which is not penetrated by backdrill and at least one backdrill penetrating layer which is penetrated by backdrill along the backdrill drilling direction;
A first test ring is manufactured on the periphery of a first theoretical manufacturing position of a to-be-manufactured drilling hole of the circuit board body, and the first test ring is divided into at least two sections of first arc-shaped sections which are disconnected with each other along the circumferential direction of the to-be-manufactured drilling hole;
manufacturing a second test ring at the periphery of a second theoretical manufacturing position of the back drilling hole to be manufactured on the back drilling penetrating layer of the circuit board body, wherein the second test ring is divided into at least two sections of second arc-shaped sections which are disconnected with each other along the circumferential direction of the back drilling hole to be manufactured;
Wherein the first theoretical manufacturing position and the second theoretical manufacturing position are coaxially arranged;
The first test ring and the second test ring are divided in the same way, so that the first arc-shaped sections and the second arc-shaped sections are in one-to-one correspondence according to the upper and lower positions.
2. The backdrill alignment detection board of claim 1, wherein the circuit board body is further provided with at least two sets of test units, each set of test units corresponding to a set of first arcuate segment and a set of second arcuate segment corresponding to a vertical position.
3. The backdrill alignment test plate of claim 2, wherein the test unit comprises a first metallized test well, a second metallized test well, and a third metallized test well;
The first metallization test hole is electrically connected with one end of the corresponding first arc-shaped section in the arc length direction, the second metallization test hole is electrically connected with the other end of the corresponding first arc-shaped section in the arc length direction and one end of the corresponding second arc-shaped section in the arc length direction simultaneously, and the third metallization test hole is electrically connected with the other end of the corresponding second arc-shaped section in the arc length direction.
4. The backdrill alignment detector plate of claim 3, wherein the second metallization test hole extends through the other end of the corresponding first arcuate segment in the arcuate direction.
5. The backdrill alignment detection plate of claim 1, wherein the first test ring has an inner diameter equal to a theoretical borehole diameter of the borehole and a width equal to a maximum allowable offset at a current borehole alignment detection level;
the inner diameter of the second test ring is equal to the theoretical drilling aperture of the back drilling hole, and the width is equal to the maximum allowable offset under the current back drilling alignment degree detection grade.
6. The back drill alignment degree detection method is characterized by comprising the following steps of:
On the circuit board body of the backdrill alignment degree detection board according to any one of claims 1 to 5, firstly making a drill hole according to the first theoretical making position, and then making a backdrill hole according to the second theoretical making position;
detecting whether each first arc-shaped section of the first test ring is drilled, and judging absolute offset information of the drilled hole according to the detection result;
Detecting whether each second arc-shaped section of the second test ring is drilled or not, and judging absolute offset information of the back drilling hole according to the detection result, wherein the absolute offset information comprises an offset range and an offset direction;
And analyzing and obtaining the relative offset information of the drill hole and the back drill hole according to the absolute offset information of the drill hole and the absolute offset information of the back drill hole.
7. The back drill alignment detection method according to claim 6, wherein the first test ring and the second test ring are divided in the same way, so that each first arc-shaped section corresponds to each second arc-shaped section in a one-to-one correspondence manner;
The test unit comprises a first metallization test hole, a second metallization test hole and a third metallization test hole, wherein the first metallization test hole is electrically connected with one end of a corresponding first arc-shaped section in the arc length direction, the second metallization test hole is simultaneously electrically connected with the other end of the corresponding first arc-shaped section in the arc length direction and one end of a corresponding second arc-shaped section in the arc length direction, and the third metallization test hole is electrically connected with the other end of the corresponding second arc-shaped section in the arc length direction;
Judging whether each first arc-shaped section of the first test ring is drilled or not according to the electric conduction state between the first metallization test hole and the second metallization test hole in each test unit;
And judging whether each second arc-shaped section of the second test ring is drilled or not according to the electric conduction state between the second metallization test hole and the third metallization test hole in each test unit.
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| CN202210743538.6A CN115164712B (en) | 2022-06-28 | 2022-06-28 | Back drill alignment degree detection plate and detection method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210743538.6A CN115164712B (en) | 2022-06-28 | 2022-06-28 | Back drill alignment degree detection plate and detection method thereof |
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| CN115164712B true CN115164712B (en) | 2025-07-25 |
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| CN117135830A (en) * | 2023-08-31 | 2023-11-28 | 沪士电子股份有限公司 | PCB for back drilling alignment detection and manufacturing method thereof |
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| CN110646726A (en) * | 2019-09-20 | 2020-01-03 | 胜宏科技（惠州）股份有限公司 | PCB back drilling nondestructive testing method |
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