CN115172352B - Surface-mounted wireless multi-axis sensor structure and preparation method thereof - Google Patents
Surface-mounted wireless multi-axis sensor structure and preparation method thereofInfo
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- CN115172352B CN115172352B CN202210767585.4A CN202210767585A CN115172352B CN 115172352 B CN115172352 B CN 115172352B CN 202210767585 A CN202210767585 A CN 202210767585A CN 115172352 B CN115172352 B CN 115172352B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
- G01C21/12—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning
- G01C21/16—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
本发明公开一种表贴式无线多轴传感器结构及制备方法，结构包括第一基板及第一封装结构，第一基板的第一面设有电路单元，电路单元至少包括传感器单元，传感器单元至少包括多轴传感器，多轴传感器上覆盖保护膜，将电路单元与保护膜进行封装以形成第一封装结构，第一基板的第二面分别贴装电池单元及架高连接板的一端，第一基板还设有天线单元；第二基板设有隔磁片组件，第二基板设有充电线圈，第二基板的第一面与架高连接板的另一端连接；架高连接板、电池单元及第二基板模块进行二次封装以形成第二封装结构。本发明集成各种芯片，实现系统控制、无线传输、多轴姿态和运动信息收集；通过FC及超高密度SMT贴装，节约体积，具有防水功能，结构小巧。
The present invention discloses a surface-mounted wireless multi-axis sensor structure and preparation method. The structure includes a first substrate and a first packaging structure. The first surface of the first substrate is provided with a circuit unit. The circuit unit includes at least a sensor unit. The sensor unit includes at least a multi-axis sensor. The multi-axis sensor is covered with a protective film. The circuit unit and the protective film are packaged to form a first packaging structure. The second surface of the first substrate is respectively mounted with a battery unit and one end of an elevated connecting plate. The first substrate is also provided with an antenna unit. The second substrate is provided with a magnetic isolation plate assembly and a charging coil. The first surface of the second substrate is connected to the other end of the elevated connecting plate. The elevated connecting plate, battery unit, and second substrate module are secondary packaged to form a second packaging structure. The present invention integrates various chips to achieve system control, wireless transmission, and multi-axis posture and motion information collection. Through FC and ultra-high-density SMT mounting, it saves volume, has a waterproof function, and has a compact structure.
Description
Technical Field
The invention relates to the technical field of sensor technology and packaging technology, in particular to a surface-mounted wireless multi-axis sensor structure and a preparation method thereof.
Background
In the prior art, the multi-axis sensor is more and more widely applied, can provide high-precision gesture data and acceleration information, has positive significance and application to measurement of human body actions and scientific exercise training, but the current multi-axis sensor can work only by needing a main control unit and a power management unit in the working process, and is integrated in terminal equipment such as an intelligent bracelet, a mobile phone, an intelligent garment and the like, and has large overall size and limited application scenes and use quantity.
The invention solves the technical problem how to design a wearable multi-purpose multi-axis sensor system-level product supporting surface mounting, which is small enough and can be used by the field.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a surface-mounted wireless multi-axis sensor structure and a preparation method thereof.
In order to solve the technical problems, the invention is solved by the following technical scheme:
A surface-mounted wireless multi-axis sensor structure comprises a first substrate module, a second substrate module and a second packaging structure;
The first substrate module comprises a first substrate and a first packaging structure, wherein a first surface of the first substrate is provided with a circuit unit, the circuit unit at least comprises a sensor unit, the sensor unit at least comprises a multi-axis sensor, a protective film is covered on the multi-axis sensor, the circuit unit and the protective film are packaged to form the first packaging structure, a second surface of the first substrate is respectively attached with a battery unit and one end of an elevated connecting plate, and the first substrate is also provided with an antenna unit;
the second substrate module comprises a second substrate, wherein a first surface of the second substrate is provided with a magnetism isolating sheet assembly, a second surface of the second substrate is provided with a charging coil, and the first surface of the second substrate is connected with the other end of the elevated connecting plate;
the elevated connecting plate, the battery unit and the second substrate module are subjected to secondary packaging to form a second packaging structure, and the second surface of the second substrate is exposed to the outside.
As an implementation manner, the circuit unit further comprises a chip unit, and the chip unit at least comprises a main control chip, a radio frequency chip and a Flash chip.
As an embodiment, the sensor unit comprises at least a multi-axis sensor, a touch sensor or a vibration sensor.
As an implementation manner, the antenna unit is disposed on the first substrate by an internal metal layer routing manner, a mounting manner, an AIP or an heterogeneous integration manner.
As an implementation manner, when the antenna unit adopts an internal metal layer wiring mode or a mounting or heterogeneous integration mode, the second surface of the first substrate is provided with a first preset welding spot, and one end of the overhead connecting plate is connected through the first preset welding spot.
As an implementation manner, the antenna unit is disposed on the first substrate in an AIP integration manner, and the first packaging structure is provided with a conductive copper pillar and extends to the outside of the first packaging structure, where the conductive copper pillar is connected with the battery unit and one end of the elevated connecting plate.
As an implementation manner, the first surface of the second substrate is provided with a second preset welding spot, and the second preset welding spot is connected with the other end of the elevated connecting plate.
As an embodiment, the height of the first package structure is not higher than 700um, and the height of the second package structure is not higher than 3.6mm.
As an implementation manner, the second surface of the second substrate and the surface of the second encapsulation structure matched with the second surface are provided with an adhesive film, and the thickness of the adhesive film is not more than 1.0mm.
As an embodiment, the two ends of the elevated connecting plate have the same structure.
As an implementation manner, a sputtering layer is arranged on the outer side of the first packaging structure.
A preparation method of a surface-mounted wireless multi-axis sensor comprises the following steps:
Providing a first substrate, wherein the first substrate is provided with an antenna unit, a first surface of the first substrate is provided with a circuit unit, the circuit unit at least comprises a sensor unit, the sensor unit at least comprises a multi-axis sensor, a protective film is covered on the multi-axis sensor, the circuit unit and the protective film are packaged to form a first packaging structure, and a battery unit and one end of an elevated connecting plate are respectively attached to a second surface of the first substrate;
providing a second substrate, wherein a magnetic isolation sheet assembly is arranged on the first surface of the second substrate, a charging coil is arranged on the second surface of the second substrate, and the first surface of the second substrate is connected with the other end of the elevated connecting plate;
And secondarily packaging the elevated connecting plate, the battery unit and the second substrate module to form a second packaging structure, wherein the second surface of the second substrate is exposed to the outside.
As an embodiment, the method further comprises the steps of:
And attaching an adhesive film on the second surface of the second substrate and the surface of the second packaging structure, wherein the thickness of the adhesive film is not more than 1.0mm.
As an implementation manner, after the second packaging structure is formed, a sputtering layer is formed on the outer side of the first packaging structure by adopting a metal sputtering process, and the sputtering layer is locally grounded to realize EMI shielding protection.
As an implementation manner, the antenna unit is disposed on the first substrate by an internal metal layer routing manner, a mounting manner or a heterogeneous integration manner.
As an implementation manner, when the antenna unit is arranged on the first substrate in a wiring manner or a mounting manner through the internal metal layer, a first preset welding point is arranged on the first surface of the second substrate, a second preset welding point is arranged on the first surface of the second substrate, and two ends of the elevated connecting plate are respectively connected through the first preset welding point and the second preset welding point.
As an implementation manner, when the antenna unit is disposed on the first substrate in an AIP array antenna integration manner, the first package structure is provided with a conductive copper pillar and extends to the surface of the first package structure, and the conductive copper pillar is connected with the battery unit and one end of the elevated connection board.
The invention has the remarkable technical effects due to the adoption of the technical scheme:
The structure of the invention integrates various chips, a multi-axis sensor, a touch sensor and a PMIC unit or other units, is provided with an antenna unit and a charging coil, and realizes the functions of system control, wireless transmission, multi-axis gesture and motion information collection, external finger touch interaction and power supply control;
The product adopts a bare chip scheme or WLCSP packaging, saves the volume through FC and ultra-high density SMT mounting, realizes the waterproof function of the whole product through plastic packaging protection, has small structure, and can be directly put into swimming caps, wrist bands, leg guards, shoe caps, golf clubs and rackets;
The adhesive film can well adhere to the skin surface, is reliable in mounting, and uploads or stores information such as multiaxial gestures, accelerations and the like in real time for biological limb gestures, sports and training;
The invention not only saves the volume, but also has the waterproof function because of secondary packaging, has small structure, can be externally attached with an adhesive film, and is convenient for being directly attached to the surface of a human body.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a side view of an embodiment of the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a side view of another embodiment of the present invention;
FIG. 4 is a top view of FIG. 3;
FIG. 5 is a side view of yet another embodiment of the present invention;
FIG. 6 is a top view of FIG. 5;
fig. 7-13 are schematic views of a process flow for preparing a first substrate module;
Fig. 14-16 are schematic views of a process flow for preparing a second substrate module;
FIG. 17 is a schematic illustration of the interconnection of a first substrate and a second substrate;
FIG. 18 is a schematic diagram of a secondary package formed with a second package structure;
FIG. 19 is a schematic illustration of a succession of the structure of FIG. 18 cut and sputtered;
Fig. 20 is a schematic view of an adhesive film provided on a second side of a second substrate;
FIGS. 21-27 are schematic views of a process flow for fabricating a first substrate module in the structure of FIG. 5;
FIG. 28 is a schematic view of the interconnection of a first substrate and a second substrate;
FIG. 29 is a schematic view of a secondary package formed with a second package structure;
Fig. 30 is a schematic view of providing an adhesive film on the second surface of the second substrate.
Reference numerals in the drawings illustrate:
1. A first substrate; 2, a second substrate, 3, a first packaging structure, 4, a second packaging structure, 5, a battery unit, 6, a raised connecting plate, 7, an adhesive film, 8, a magnetism isolating sheet component, 9, a sputtering layer, 11, a chip unit, 12, a touch sensor, 13, a power management chip, 14, a multi-axis sensor, 15, an antenna unit, 16, a protective film, 17, a first preset welding point, 18, a second preset welding point, 19, a conductive copper column, 21 and a charging coil.
Detailed Description
The present invention will be described in further detail with reference to the following examples, which are illustrative of the present invention and are not intended to limit the present invention thereto.
In this embodiment, the surface-mounted wireless multi-axis sensor structure is disposed inside the first substrate by an internal metal layer routing manner, and the antenna unit needs clearance from the upper side, the lower side and the side far from the circuit unit inside the first substrate as shown in fig. 1-2;
In this way, the surface-mounted wireless multi-axis sensor structure comprises a first substrate module, a second substrate module and a second packaging structure 4;
The first substrate module includes a first substrate 1 and a first package structure 3, an antenna unit 15 is disposed in the first substrate 1 by way of internal metal wiring, a circuit unit is disposed on a first surface of the first substrate 1, the circuit unit is not disposed above the antenna unit 15, the circuit unit includes at least a sensor unit and a chip unit 11, the power management chip 13, the sensor unit includes at least a multi-axis sensor 14, a touch sensor 12, or further includes a pressure sensor or a thermal sensor, and the chip unit 11 includes at least a main control chip, a radio frequency chip and a Flash chip, and the circuit unit in this embodiment should not be limited to the above sensor unit and chip unit, but also includes a conventional chip and circuit design for realizing corresponding functions. Since the multi-axis sensor 14 is generally a cavity structure, the plastic packaging pressure in the packaging process is generally greater than 3MPa, which will damage or affect the multi-axis sensor 14, the surface of the multi-axis sensor 14 is covered with the protective film 16 to improve the protection of the multi-axis sensor, the circuit unit and the protective film 16 are packaged to form the first packaging structure 3, and the second surface of the first substrate 1 is respectively attached with the battery unit 5 and one end of the elevated connecting plate 6;
The second base plate module includes second base plate 2, and the first face of second base plate 2 is equipped with magnetism isolating sheet subassembly 8, and the second face of second base plate 2 is equipped with charging coil 21, and the first face of second base plate 2 is connected with the other end of overhead connecting plate 6, and overhead connecting plate 6, battery unit 5 and second base plate module carry out the secondary encapsulation in order to form second packaging structure 4 in order to realize the equipment of first base plate module and second base plate module to the lower surface of second packaging structure 4 flushes or exceeds the distance of the second face of second base plate 2 with the second face of second base plate 2 and is not more than 100um.
In this embodiment, different data are acquired through different sensors and fed back to the main control chip, the main control chip processes the data based on a preset data processing mode, so that different control signals can be generated, the control signals can be fed back to corresponding modules in the circuit unit, more functions can be realized, and the data can be uploaded to the host server for further analysis and processing through wireless transmission.
The height of the second package structure 4 is mainly determined by the thickness of the battery 5, and the battery with the corresponding specification thickness can be selected according to the requirements of different applications of the product on the capacity of the battery. In order to make the size of the finished product smaller and easier to use, the smaller the height of the second encapsulation structure 4 is, the better the battery thickness is, which in this embodiment is controlled to be within 3.6 mm. The touch sensor generally requires a package thickness on the upper surface of about 70um, which is too high to affect its sensitivity and too low to affect package reliability. The package thickness of the upper surface of the multiaxial sensor is not required. When the adhesive film adopts the thickness of 200um, the total thickness of the product can be controlled to be 4.7mm, and the surface-mounted adhesive film is convenient to use. Of course, under the conditions of further materials and feasible process, the thinner the product can be, the better, the smaller the product is.
The surface-mounted wireless multi-axis sensor structure has a plurality of purposes, can be directly attached to limb joint skin, and can be directly placed into swimming caps, wristbands, leg guards, shoe caps, golf clubs and intelligent rackets. If the adhesive film is directly attached to a human body, a medical adhesive film 7 needs to be arranged on the surface-mounted wireless multi-axis sensor structure, the adhesive film 7 is arranged on the second packaging structure 4 and the second surface of the second substrate, and the product can be attached to the skin of the human body through the adhesive film 7. In view of the stability of wireless charging, the thickness of the adhesive film 7 is not more than 1.0mm, and the thinner the adhesive film is, the better the adhesive film can meet the requirements of adhesion and application.
In this embodiment, the two ends of the elevated connection plate 6 are identical in structure for more space saving and better communication. The shape of the elevated connection plate 6 is not limited herein, and may be replaced by a device with an electrical communication function such as a copper column, a copper bar, a packaging adapter plate, or the like. In this embodiment, in order to make the connection between the first substrate 1, the second substrate 2 and the elevated connecting plate 6 stronger, a first preset welding point 17 is provided on the second surface of the first substrate 1, a second preset welding point 18 is provided on the first surface of the second substrate 2, the first preset welding point 17 is welded to one end of the elevated connecting plate 6, and the second preset welding point 18 is welded to the other end of the elevated connecting plate 6.
Furthermore, after the secondary packaging process is completed, since the first substrate 1 is already connected with the second substrate 2, a sputtering layer 9 is formed on the surface of the first substrate 1, corresponding to the surface of the first plastic packaging structure 3, and the sputtering layer 9 is locally grounded to realize EMI shielding protection.
Thus, the various limiting dimensions of the present invention are based on data from existing design, process capabilities, and the smaller the dimensions are, the better the materials and process are.
Example 2:
In this embodiment, as shown in fig. 3-4, the antenna unit 15 is disposed inside the first substrate 1 by attaching a ceramic antenna or mounting a heterogeneous antenna, and the antenna unit needs to be clear from the upper side, the lower side and the side far from the circuit unit inside the first substrate 1;
In this way, the surface-mounted wireless multi-axis sensor structure comprises a first substrate module, a second substrate module and a second packaging structure 4;
The first substrate module includes a first substrate 1 and a first package structure 3, an antenna unit 15 is disposed in the first surface of the first substrate 1, the antenna unit 15 is disposed by attaching a ceramic antenna to a board or mounting a heterogeneous antenna, the first surface of the first substrate 1 is provided with a circuit unit, the circuit unit and the antenna unit 15 are arranged in a partition manner, the circuit unit includes at least a sensor unit and a chip unit 11, a power management chip 13, the sensor unit includes at least a multi-axis sensor 14, a touch sensor 12, and may further include a pressure sensor or a thermal sensor, and the chip unit 11 includes at least a main control chip, a radio frequency chip, and a Flash chip, where the circuit unit in this embodiment is not limited to the above sensor unit and chip unit, or further includes a chip and a circuit design for realizing corresponding functions. Since the multi-axis sensor 14 is generally a cavity structure, and the plastic packaging pressure in the packaging process is generally greater than 3MPa, which will damage or affect the multi-axis sensor 14, the protection of the multi-axis sensor is improved by covering the surface of the multi-axis sensor 14 with the protection film 16, and the circuit unit and the protection film 16 are packaged to form the first packaging structure 3, and the battery unit 5 and one end of the elevated connecting plate 6 are respectively attached to the second surface of the first substrate 1;
The second base plate module includes second base plate 2, and the first face of second base plate 2 is equipped with magnetism isolating sheet subassembly 8, and the second face of second base plate 2 is equipped with charging coil 21, and the first face of second base plate 2 is connected with the other end of overhead connecting plate 6, and overhead connecting plate 6, battery unit 5 and second base plate module carry out the secondary encapsulation in order to form second packaging structure 4 in order to realize the equipment of first base plate module and second base plate module to the lower surface of second packaging structure 4 flushes or exceeds the distance of the second face of second base plate 2 with the second face of second base plate 2 and is not more than 100um.
In this embodiment, different data are acquired through different sensors and fed back to the main control chip, the main control chip processes the data based on a preset data processing mode, so that different control signals can be generated, the control signals can be fed back to corresponding modules in the circuit unit, more functions can be realized, and the data can be uploaded to the host server for further analysis and processing through wireless transmission.
The height of the second package structure 4 is mainly determined by the thickness of the battery 5, and the battery with the corresponding specification thickness can be selected according to the requirements of different applications of the product on the capacity of the battery. In order to make the size of the finished product smaller and more easily applied to different fields, the smaller the height of the second encapsulation structure 4 is, the better the battery thickness is, which is controlled within 3.6mm in the present design. The touch sensor generally requires that the plastic package height of the upper surface is about 70um, and the sensitivity is affected too high and the package reliability is affected too low. The surface packaging of the multiaxial motion sensor has no thickness requirement. When the adhesive film adopts the thickness of 200um, the total thickness of the product can be controlled to be 4.7mm, and the surface-mounted adhesive film is convenient to use. Of course, under the conditions of further materials and feasible process, the thinner the product can be, the better, the smaller the product is.
The surface-mounted wireless multi-axis sensor structure of the invention has a plurality of purposes, can be directly attached to the skin of a limb joint, can be directly placed into a swimming cap, a wrist strap, a leg protector, a shoe cap, a golf club and an intelligent racket, and is supposed to be directly attached to a human body, the surface-mounted wireless multi-axis sensor structure is required to be provided with a medical adhesive film 7, the adhesive film 7 is arranged on the second surfaces of the second packaging structure 4 and the second substrate, and the product can be attached to the skin of a human body after the adhesive film 7 is attached. In view of the stability of wireless charging, the thickness of the adhesive film 7 is not more than 1.0mm, and the thinner the adhesive film is, the better the adhesive film can meet the requirements of adhesion and application.
In this embodiment, the two ends of the elevated connection plate 6 are identical in structure for more space saving and better communication. The shape of the elevated connecting plate is not limited, and the elevated connecting plate can be replaced by a device with electric communication function such as a copper column, a copper bar, a packaging adapter plate and the like. In this embodiment, in order to make the connection between the first substrate 1, the second substrate 2 and the elevated connecting plate 6 stronger, a first preset welding point 17 is provided on the second surface of the first substrate 1, a second preset welding point 18 is provided on the first surface of the second substrate 2, the first preset welding point 17 is welded to one end of the elevated connecting plate 6, and the second preset welding point 18 is welded to the other end of the elevated connecting plate 6.
Furthermore, after the secondary packaging process is completed, since the first substrate 1 is already connected to the second substrate 2, the sputtering layer 9 is formed on the surface of the first substrate 1, which corresponds to the surface of the first plastic package structure 3 and is on the outside of the circuit unit, and the sputtering layer 9 is locally grounded to realize EMI shielding protection.
Thus, the various limiting dimensions of the present invention are based on data from existing design specifications, process capabilities, and the smaller the dimensions the better the materials and process can meet.
Example 3:
In this embodiment, the antenna unit 15 is designed by using an AIP array antenna, and the antenna unit 15 is implemented by using circuit unit lines in the first substrate, and only the upper side clearance of the antenna unit 15 in the first substrate is needed in this embodiment.
In this way, the surface-mounted wireless multi-axis sensor structure comprises a first substrate module, a second substrate module and a second packaging structure 4;
The first substrate module includes a first substrate 1 and a first package structure 3, an antenna unit 15 is disposed in the first surface of the first substrate 1, the antenna unit 15 is disposed on the second surface of the first substrate by coupling, and one side of the antenna unit 15 is exposed on the second surface of the first substrate 1, the first surface of the first substrate 1 is provided with a circuit unit, which is not attached above the antenna unit 15, and the circuit unit includes at least a sensor unit and a chip unit 11, the power management chip 13, the sensor unit includes at least a multi-axis sensor 14, a touch sensor 12, or further includes a pressure sensor or a thermal sensor, and the chip unit 11 includes at least a main control chip, a radio frequency chip, and a Flash chip, where it should be emphasized that the circuit unit in this embodiment is not limited to the above sensor unit and chip unit, and should include a conventional chip and a circuit design for realizing corresponding functions. Since the multi-axis sensor 14 is generally of a cavity structure, the plastic packaging pressure in the packaging process is generally higher than 3MPa, which will damage or affect the multi-axis sensor, the protection film 16 is added, the surface of the multi-axis sensor 14 is covered with the protection film 16, the circuit unit and the protection film 16 are packaged to form a first packaging structure 3, and the battery unit 5 and one end of the elevated connecting plate 6 are respectively mounted on the second surface of the first substrate 1;
the second base plate module comprises a second base plate 2, the first surface of the second base plate 2 is provided with a magnetism isolating sheet component 8, the second surface of the second base plate 2 is provided with a charging coil 21, the first surface of the second base plate 2 is connected with the other end of the lifting connecting plate 6, the battery unit 5 and the second base plate module are subjected to secondary packaging to form a second packaging structure 4 so as to realize the assembly of the first base plate module and the second base plate module, and the second packaging structure 4 and the second surface of the second base plate 2 are consistent with each other or are higher than each other by within 100 um.
In this embodiment, the first package structure 3 is provided with a conductive copper pillar 19, one end of the conductive copper pillar 19 is electrically connected to the first substrate, the other end extends to the surface of the first package structure 3 to be connected to the battery unit 5 and one end of the elevated connecting plate 6, and the other end of the elevated connecting plate 6 is connected to the first surface of the second substrate 2 through a second preset solder joint 18 provided on the first surface of the second substrate 2.
Since the antenna unit 15 is designed by the on-board AIP array antenna in this embodiment, the antenna unit 15 and the circuit unit can be disposed in an up-down position, in this embodiment, the size of the first substrate 1 can be smaller than the sizes of the first substrates 1 in embodiments 1 and 2, and the length and width dimensions of the second package structure 4 can be correspondingly reduced, so that the size of the surface-mounted wireless multi-axis sensor structure in embodiment 3 can be smaller than those of other embodiments.
The height of the second package structure 4 is mainly determined by the thickness of the battery 5, and the battery with the corresponding specification thickness can be selected according to the requirements of different applications of the product on the capacity of the battery. In order to make the size of the finished product smaller and more easily applicable to different fields, the smaller the height of the second encapsulation structure 4 is, the better the battery thickness is, which is controlled to be 3.6mm in the present design. The touch sensor generally requires that the plastic package height of the upper surface is about 70um, and the sensitivity is affected too high and the package reliability is affected too low. The surface packaging of the multiaxial motion sensor has no thickness requirement. The charging coil is integrated on the second surface of the second substrate, and only an adhesive film is arranged between the charging coil and the charging seat, and the charging performance is generally not affected under the condition that the adhesive film is not more than 1.0 mm. When the adhesive film adopts the thickness of 200um, the total thickness of the product can be controlled to be 4.7mm, and the surface-mounted adhesive film is convenient to use. Of course, under the conditions of feasible materials and technology, the thinner and better the product can be made, the smaller and better the product is.
The surface-mounted wireless multi-axis sensor structure has a plurality of purposes, can be directly attached to the skin of a person, and can be directly placed into a swimming cap, a wrist strap, a leg guard, a shoe cap, a golf club and an intelligent racket. If the adhesive film 7 is directly attached to a human body, a medical adhesive film 7 is required to be arranged on the surface-mounted wireless multi-axis sensor structure, the adhesive film 7 is arranged on the second surface of the second packaging structure 4 and the second substrate, and the product can be attached to the skin of the human body after the adhesive film 7 is attached. The thickness of the adhesive film 7 is not more than 1.0mm in terms of the stability of wireless charging, and the thinner the more preferable the adhesion and application requirements are satisfied.
In this embodiment, the two ends of the elevated connection plate 6 are identical in structure for more space saving and better communication. The shape of the elevated connecting plate is not limited, and the elevated connecting plate can be replaced by a device with electric communication function such as a copper column, a copper bar, a packaging adapter plate and the like.
In this embodiment, different data are acquired through different sensors and fed back to the main control chip, the main control chip processes the data based on a preset data processing mode, so that different control signals can be generated, the control signals can be fed back to corresponding modules in the circuit unit, more functions can be realized, and collected data can be transmitted to the host server through wireless for further analysis and processing. Thus, the various limiting dimensions of the present invention are based on data from existing design, process capabilities, and the smaller the dimensions are, the better the materials and process are.
According to the embodiment, various chips including a main control chip, a wireless communication chip, a Flash, a multi-axis sensor, a touch sensor, a PMIC unit and other circuit functional units are integrated on the first substrate, and an antenna unit is arranged, so that the functions of system control, wireless transmission, multi-axis gesture and motion information collection, touch interaction and power supply control are realized, and the communication of the two substrates and the wireless charging function of a charging coil on a battery unit can be realized through an elevated connecting plate.
The chip used in the product adopts a bare chip scheme or WLCSP packaging, saves the volume through FC and ultra-high density SMT mounting, realizes the waterproof function of the whole product through plastic package protection, has small structure, can be directly put into swimming caps, wrist bands, leg guards, shoe caps, golf clubs and rackets, can be well adhered to the surface of skin, is reliable in mounting, and uploads or stores information such as multiaxial gestures and accelerations in real time for limb gestures, sports and training.
Example 4:
In this embodiment, as shown in fig. 7-20, a first substrate 1 is provided, where an antenna unit 15 is disposed inside a first surface of the first substrate 1 or the first surface is attached to the antenna unit 15, that is, the antenna unit 15 is disposed inside the first substrate 1 by means of internal metal routing, or the antenna unit 15 is disposed inside the first substrate by means of attaching a ceramic antenna to a board or mounting a heterogeneous antenna, and a circuit unit is attached to the first surface of the first substrate 1, where the circuit unit includes a multi-axis sensor 14, a touch sensor 12, a control chip, a radio frequency chip, a power management chip 13, and the like;
The circuit unit and the first surface of the first substrate 1 are packaged to form the first packaging structure 3, and since the multi-axis sensor 14 is very sensitive to high plastic packaging voltage, the multi-axis sensor 14 needs to be covered with the protective film 16 separately or covered with a vacuum film pressing process before packaging. In addition, considering the radio frequency performance of the radio frequency chip, a composite material with low DKDF parameters is selected for packaging;
In addition, the diameter and the number of the conductive copper columns 19 can be increased to improve the heat dissipation performance of the battery unit 5 under the condition that space allows by the elevated connecting plate 6, and the battery unit 5 works at normal temperature, but the plastic sealing piece needs to reach high temperature and preset pressure (the high temperature is 175 ℃ and the preset pressure is higher than 3 MPa) during plastic sealing, so that the main body of the battery unit 5 adopts a firm compression-resistant shell and is attached to the second surface of the first substrate 1 through a specific colloid, and the fixing reliability can be ensured;
providing a second substrate 2, wherein a charging coil 21 is arranged in the second substrate 2 near the second surface, a second preset welding spot 18 is arranged on the first surface, and a magnetic isolation sheet assembly 8 is arranged, wherein the magnetic isolation sheet assembly 8 can be made of ferric oxide or other ferric oxides;
welding a second preset welding point 18 arranged on the first surface of the second substrate 2 with the first preset welding point 17 and the elevated connecting plate 6 to finish the connection of the first substrate 1 and the second substrate 2;
And the second surface of the first substrate 1 is used as the bottom surface for secondary packaging, the second substrate 2, the elevated connecting plate 6, the battery unit 5 and the like are packaged together, the height of the secondary plastic packaging is controlled within 3.6mm, the total thickness is controlled within 4.7mm, and the thinner and better the thinner the material and the process are under the feasible condition, so that the surface mount is convenient to use.
In general, in the manufacturing process, imposition processing is adopted, a plurality of surface-mounted multi-axis sensor structures can be manufactured after one imposition is completed, cutting is performed after secondary packaging is performed, after secondary packaging and cutting, as the first substrate is connected with the second substrate, the outer side of the circuit unit is mounted on the first substrate, and a sputtering layer is formed on the surface corresponding to the first plastic packaging structure by adopting a metal sputtering process, and the sputtering layer is locally grounded to realize EMI shielding protection.
Because the finished product is applied to various fields and even is attached to the surface of a human body, if the finished product is directly attached to the human body, a medical adhesive film 7 is required to be arranged on the surface-mounted wireless multi-axis sensor structure, the adhesive film 7 is arranged on the second surface of the second packaging structure 4 and the second substrate, and the finished product can be attached to the skin of the human body after the adhesive film 7 is attached. The thickness of the adhesive film 7 is not more than 1.0mm in terms of the stability of wireless charging, and the adhesive film 7 is preferably made of medical material, and the thinner the adhesive film is, the better the adhesive film is, and the more favorable the adhesion to the skin surface is.
Example 5:
As shown in fig. 21-30, the preparation method is implemented for the structure of example 3, and the specific process is as follows:
Providing a first substrate 1, wherein the first substrate module comprises a first substrate 1 and a first packaging structure 3, an antenna unit 15 is arranged in the first surface of the first substrate 1 through AIP technology, the antenna unit 15 is arranged on the second surface of the first substrate in a coupling mode, one side of the antenna unit 15 is exposed on the second surface of the first substrate 1, the size of a finished product can be further compressed due to the reduction of the size of the first substrate, and the length and width dimensions can be compressed by about one fourth, at the moment, a circuit unit is mounted on the first surface of the first substrate 1, and comprises a multi-axis sensor 14, a touch sensor 12, a control chip, a radio frequency chip, a Flash chip, a power management chip 13 and the like, or further comprises other functional chips and the like;
The circuit unit and the first surface of the first substrate 1 are subjected to plastic packaging protection to form a first packaging structure 3, and a conductive copper column 19 is arranged in the first packaging structure 3, so that the multi-axis sensor 14 is very sensitive to high plastic packaging pressure, and a protective film 16 is required to be covered on the multi-axis sensor 14 singly or a vacuum film pressing process is adopted for film covering before plastic packaging protection;
after the first packaging structure 3 is generated, grinding and thinning the first packaging structure to expose the conductive copper pillar 19;
In addition, the diameter and the number of the conductive copper columns 19 can be increased to improve the heat dissipation performance of the battery unit 5 under the condition that space is allowed by the elevated connecting plate 6, and the battery unit 5 works at normal temperature, but the plastic sealing piece needs to reach high temperature and high pressure (about 175 ℃ and the pressure is more than 3 MPa) during plastic sealing, so that the main body of the battery unit 5 adopts a firm compression-resistant shell, is attached to the second surface of the first substrate 1 through a specific colloid, and ensures the fixing reliability.
Providing a second substrate 2, wherein a charging coil 21 is arranged in the second substrate 2 near the second surface, a second preset welding spot 18 is arranged on the first surface, and a magnetic isolation sheet assembly 8 is arranged, wherein the magnetic isolation sheet assembly 8 can be made of ferric oxide or other ferric oxides;
Welding a second preset welding point 18 on the first surface of the second substrate 2 with the first preset welding point 17 and the elevated connecting plate 6 to finish the connection of the first substrate 1 and the second substrate 2;
and (3) taking the second surface of the first substrate 1 as the bottom surface for secondary packaging, and carrying out plastic packaging on the second substrate 2, the elevated connecting plate 6, the battery units 5 and the like, wherein the height of the secondary plastic packaging is controlled within 3.6mm in consideration of the volume of the battery (the batteries with different specification thicknesses can be selected according to application requirements).
In general, in the preparation process, imposition processing is adopted, a plurality of surface-mounted multi-axis sensor structures can be produced after one imposition is completed, and cutting is performed after secondary packaging is performed.
Because the finished product is applied to various fields and even is attached to the surface of a human body, if the finished product is directly attached to the human body, a medical adhesive film 7 is required to be arranged on the surface-mounted wireless multi-axis sensor structure, the adhesive film 7 is arranged on the second surface of the second packaging structure 4 and the second substrate, and the finished product can be attached to the skin of the human body after the adhesive film 7 is attached. The thickness of the adhesive film 7 is not more than 1.0mm in terms of the stability of wireless charging, and the adhesive film 7 is preferably made of medical material, and the thinner the adhesive film is, the better the adhesive film is, and the more favorable the adhesion to the skin surface is.
In addition, the specific embodiments described in the present specification may differ in terms of parts, shapes of components, names, and the like. All equivalent or simple changes of the structure, characteristics and principle according to the inventive concept are included in the protection scope of the present invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions in a similar manner without departing from the scope of the invention as defined in the accompanying claims.
Claims (17)
1. The surface-mounted wireless multi-axis sensor structure is characterized by comprising a first substrate module, a second substrate module and a second packaging structure;
The first substrate module comprises a first substrate and a first packaging structure, wherein a first surface of the first substrate is provided with a circuit unit, the circuit unit at least comprises a sensor unit, the sensor unit at least comprises a multi-axis sensor, a protective film is covered on the multi-axis sensor, the circuit unit and the protective film are packaged to form the first packaging structure, a second surface of the first substrate is respectively attached with a battery unit and one end of an elevated connecting plate, and the first substrate is also provided with an antenna unit;
the second substrate module comprises a second substrate, wherein a first surface of the second substrate is provided with a magnetism isolating sheet assembly, a second surface of the second substrate is provided with a charging coil, and the first surface of the second substrate is connected with the other end of the elevated connecting plate;
the elevated connecting plate, the battery unit and the second substrate module are subjected to secondary packaging to form a second packaging structure, and the second surface of the second substrate is exposed to the outside.
2. The surface mount wireless multi-axis sensor structure of claim 1, wherein the circuit unit further comprises a chip unit comprising at least a main control chip, a radio frequency chip, and a Flash chip.
3. The surface mount wireless multi-axis sensor structure of claim 1, wherein the sensor unit comprises at least a multi-axis sensor, a touch sensor, or a vibration sensor.
4. A surface mount wireless multi-axis sensor structure as claimed in any one of claims 1-3 wherein said antenna element is disposed on the first substrate by internal metal layer routing or mounting or heterogeneous integration.
5. The surface-mounted wireless multi-axis sensor structure of claim 4, wherein when the antenna unit adopts an internal metal layer wiring mode or a mounting mode, a first preset welding spot is arranged on the second surface of the first substrate, and one end of the elevated connecting plate is connected through the first preset welding spot.
6. The surface-mounted wireless multi-axis sensor structure of claim 4, wherein the antenna unit is disposed on the first substrate in an AIP integrated manner, the first packaging structure is provided with a conductive copper pillar, one end of the conductive copper pillar is electrically connected with the first substrate, and the other end of the conductive copper pillar extends to the surface of the first packaging structure to be connected with the battery unit and one end of the elevated connecting plate.
7. The surface mount wireless multi-axis sensor structure of claim 5 or 6, wherein the first surface of the second substrate is provided with a second preset welding spot, and the second preset welding spot is connected with the other end of the elevated connecting plate.
8. The surface mount wireless multi-axis sensor structure of claim 1, wherein the height of the first package structure is no higher than 700um and the height of the second package structure is no higher than 3.6mm.
9. The surface-mounted wireless multi-axis sensor structure of claim 1, wherein the second surface of the second substrate and the surface of the second encapsulation structure that is matched with each other are provided with an adhesive film, and the thickness of the adhesive film is not greater than 1.0mm.
10. The surface mount wireless multi-axis sensor structure of claim 1, wherein the two ends of the elevated connection plate are identical in structure.
11. The surface mount wireless multi-axis sensor structure of claim 1, wherein a sputtered layer is disposed on an outer side of the first package structure.
12. The preparation method of the surface-mounted wireless multi-axis sensor is characterized by comprising the steps of providing a first substrate, wherein an antenna unit is arranged on the first substrate, a circuit unit is arranged on the first surface of the first substrate, the circuit unit at least comprises a sensor unit, the sensor unit at least comprises a multi-axis sensor, a protective film is covered on the multi-axis sensor, the circuit unit and the protective film are packaged to form a first packaging structure, and a battery unit and one end of an elevated connecting plate are respectively mounted on the second surface of the first substrate;
providing a second substrate, wherein a magnetic isolation sheet assembly is arranged on the first surface of the second substrate, a charging coil is arranged on the second surface of the second substrate, and the first surface of the second substrate is connected with the other end of the elevated connecting plate;
And secondarily packaging the elevated connecting plate, the battery unit and the second substrate module to form a second packaging structure, wherein the second surface of the second substrate is exposed to the outside.
13. The method for manufacturing a surface-mounted wireless multi-axis sensor of claim 12, further comprising the steps of:
And attaching an adhesive film on the second surface of the second substrate and the surface of the second packaging structure, wherein the thickness of the adhesive film is not more than 1.0mm.
14. The method for manufacturing a surface-mounted wireless multi-axis sensor according to claim 12, wherein after the second package structure is formed, a sputtering layer is formed on the outer side of the first package structure by a metal sputtering process, and the sputtering layer is locally grounded to realize EMI shielding protection.
15. The method for manufacturing a surface-mounted wireless multi-axis sensor according to claim 12, wherein the antenna unit is disposed on the first substrate by an internal metal layer routing method, a mounting method, or an heterogeneous integration method.
16. The method for manufacturing a surface-mounted wireless multi-axis sensor according to claim 15, wherein when the antenna unit is arranged on the first substrate by adopting an internal metal layer wiring mode, a mounting mode or an heterogeneous integration mode, a first preset welding point is arranged on the first surface of the second substrate, a second preset welding point is arranged on the first surface of the second substrate, and two ends of the elevated connecting plate are respectively connected through the first preset welding point and the second preset welding point.
17. The method for manufacturing a surface-mounted wireless multi-axis sensor according to claim 15, wherein when the antenna unit is disposed on the first substrate in an AIP array antenna integration manner, the first package structure is provided with a conductive copper pillar, one end of the conductive copper pillar is electrically connected to the first substrate, and the other end of the conductive copper pillar extends to the surface of the first package structure to be connected to the battery unit and one end of the elevated connection board.
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