CN115223911A - Chip transfer substrate, transfer device and chip transfer method - Google Patents

Abstract

The embodiment of the invention discloses a chip transfer substrate, a transfer device and a chip transfer method, wherein the chip transfer substrate comprises a transfer substrate and a glue layer positioned on the transfer substrate, the glue layer comprises photosensitive glue units arranged in an array manner, and a space is reserved between every two adjacent photosensitive glue units; the photosensitive adhesive unit is used for adhering a corresponding chip to be transferred in the chip array to be transferred to the target substrate when the photosensitive adhesive unit is irradiated by the light source; wherein each photosensitive adhesive unit corresponds to at least one chip to be transferred. Because the distance exists between the adjacent photosensitive adhesive units, the phenomenon of adhesive material gasification or carbonization caused by the absorption of illumination energy can not occur at the distance position between the adjacent photosensitive adhesive units in the process of transferring the chip, thereby being beneficial to improving the transfer yield of the chip to be transferred. In addition, when the chip to be transferred is subjected to single-point repair, residual glue cannot be formed around the chip to be transferred due to the fact that photosensitive glue does not exist at the distance position between the adjacent photosensitive glue units, and the single-point repair yield is improved.

Description

Chip transfer substrate, transfer device, and chip transfer method

technical field

Embodiments of the present invention relate to the field of display technology, and in particular, to a chip transfer substrate, a transfer device and a chip transfer method.

Background technique

Micro Light Emitting Diode (Micro LED) has the advantages of high brightness, long life, fast response, and high contrast. Display devices using Micro LED have become a new generation of display technology.

At present, batch transfer technology is the key technology for the preparation of Micro LED display devices. In the prior art, colloids are usually used to transfer Micro LEDs. However, during the transfer process, the colloids are easily carbonized, and glue residues are prone to appear around the Micro LEDs. phenomenon, which seriously affects the yield of Micro LED transfer.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide a chip transfer substrate, a transfer device and a chip transfer method, so as to improve the yield of chips during the transfer process.

In a first aspect, an embodiment of the present invention provides a chip transfer substrate, including:

transfer substrate;

an adhesive layer, located on the transfer substrate, the adhesive layer includes a plurality of photosensitive adhesive units arranged in an array, and there is a distance between the adjacent photosensitive adhesive units; the photosensitive adhesive units are used for Adhering the corresponding chips to be transferred in the array of chips to be transferred to the target substrate;

Each of the photosensitive adhesive units corresponds to at least one chip to be transferred.

Optionally, each of the photosensitive adhesive units corresponds to one of the chips to be transferred.

Optionally, the photosensitive adhesive unit has the same shape and size as the chip to be transferred.

Optionally, each of the photosensitive adhesive units corresponds to a plurality of the chips to be transferred;

Preferably, the photosensitive adhesive unit has the same shape and size as the corresponding regions where the plurality of chips to be transferred are located; wherein, the regions where the plurality of chips to be transferred are located include the positions of the plurality of chips to be transferred and a plurality of A spacing position between adjacent chips to be transferred among the chips to be transferred.

Optionally, the size of the chip to be transferred is less than or equal to 100 microns.

Optionally, a non-photosensitive adhesive is also included, and the non-photosensitive adhesive is disposed at least between some adjacent photosensitive adhesive units.

Optionally, the non-photosensitive adhesive is disposed around the photosensitive adhesive unit, and the photosensitive adhesive unit and the non-photosensitive adhesive are integrally formed.

In a second aspect, an embodiment of the present invention further provides a chip transfer device, the chip transfer device comprising:

a light source, the light source is used to provide light with a preset wavelength;

a chip transfer substrate, the chip transfer substrate includes a transfer substrate and an adhesive layer on the transfer substrate, the adhesive layer includes a plurality of photosensitive adhesive units arranged in an array, and there is a gap between adjacent photosensitive adhesive units; The photosensitive adhesive unit is used for adhering the corresponding chips to be transferred in the array of chips to be transferred to the target substrate when irradiated by the light source.

In a third aspect, an embodiment of the present invention also provides a chip transfer method, including:

A chip transfer substrate is provided, the chip transfer substrate includes a transfer substrate and an adhesive layer on the transfer substrate, the adhesive layer includes a plurality of photosensitive adhesive units arranged in an array, and there is a spacing between adjacent photosensitive adhesive units ;

providing a carrier substrate on which a chip array to be transferred is arranged, and the photosensitive adhesive unit and the chip array to be transferred are aligned;

providing a light source for providing light with a preset wavelength;

A target substrate is provided, and the photosensitive adhesive unit is irradiated by the light source to adhere the corresponding chips to be transferred in the array of chips to be transferred to the target substrate.

Optionally, the providing a transfer substrate includes:

providing a transfer substrate, and forming an entire continuous adhesive layer on the transfer substrate;

The adhesive layer is patterned so that the adhesive layer forms a set pattern at a position for forming a photosensitive adhesive unit, and a photosensitive material is filled into the set pattern to form the photosensitive adhesive unit.

Embodiments of the present invention provide a chip transfer substrate, a transfer device and a chip transfer method, wherein the chip transfer substrate includes a transfer base and an adhesive layer on the transfer base. Wherein, the adhesive layer includes a plurality of photosensitive adhesive units arranged in an array, each photosensitive adhesive unit corresponds to at least one chip to be transferred, and there is a gap between adjacent photosensitive adhesive units. Since there is a distance between adjacent photosensitive adhesive units, there is no photosensitive adhesive at the spacing position, and the chip to be transferred is set corresponding to the photosensitive adhesive unit. Therefore, in the process of transferring the chip, the spacing between adjacent photosensitive adhesive units is The phenomenon of vaporization or carbonization of the glue material will occur, which is beneficial to improve the transfer yield of the chip to be transferred. In addition, because there is no photosensitive adhesive in the spacing between adjacent photosensitive adhesive units, during the single-point repair process of the chip to be transferred, when the substrate is transferred by laser irradiation of the chip, residual glue will not be formed around the chip to be transferred. It is beneficial to improve the yield of single point repair.

Description of drawings

FIG. 1 is a top-view structural view of a chip transfer substrate according to an embodiment of the present invention;

2 is a cross-sectional view of a chip transfer substrate provided by an embodiment of the present invention;

3 is a schematic diagram of a chip transfer process according to an embodiment of the present invention;

4 is a top-view structural view of another chip transfer substrate provided by an embodiment of the present invention;

5 is a schematic cross-sectional structural diagram of a chip transfer substrate corresponding to another chip transfer process provided by an embodiment of the present invention;

6 is a schematic top-view structural diagram of another chip transfer substrate provided by an embodiment of the present invention;

7 is a schematic structural diagram of a chip transfer device according to an embodiment of the present invention;

8 is a flowchart of a chip transfer method provided by an embodiment of the present invention;

FIG. 9 is a schematic structural diagram of another chip transfer substrate according to an embodiment of the present invention;

10 is a schematic diagram of a process of aligning a photosensitive adhesive unit and a chip to be transferred according to an embodiment of the present invention;

11 is a schematic diagram of a process of adhering a photosensitive adhesive unit to a corresponding chip to be transferred according to an embodiment of the present invention;

FIG. 12 is a schematic diagram of a process of transferring a to-be-transferred chip to a target substrate according to an embodiment of the present invention.

Detailed ways

The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, the drawings only show some but not all structures related to the present invention.

As described in the background art, in the process of batch transferring LED chips in the prior art, laser light is usually used to irradiate photosensitive adhesive to realize adhesion or release of LED chips. During the transfer process, due to the difference in the energy absorbed by the photosensitive adhesive at the positions with and without LED chips, when the power of the laser is too large, there is no position blocked by the LED chip, the energy absorbed by the photosensitive adhesive is too large, and the photosensitive adhesive is covered by a large area. Vaporization, or carbonization of the photosensitive adhesive between adjacent LED chips, seriously affects the transfer yield of LED chips. When single-point repair is performed, due to the difference in energy absorbed by the photosensitive adhesive at the positions with and without the LED chip, it is easy to cause glue residue around the LED chip, which affects the repair yield.

In view of the above problems, embodiments of the present invention provide a chip transfer substrate, which can improve the yield of LED chips during the transfer process. 1 is a top plan view of a chip transfer substrate provided by an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a chip transfer substrate provided by an embodiment of the present invention, wherein FIG. 2 may be a section taken along section line AA' in FIG. 1 Figure 3 is a schematic diagram of a chip transfer process provided by an embodiment of the present invention. Referring to FIGS. 1 to 3 , a chip transfer substrate provided by an embodiment of the present invention includes: a transfer substrate 10; There is a distance between the glue units 210; the photosensitive glue unit 210 is used for adhering the corresponding to-be-transferred chip 40 in the to-be-transferred chip array to the target substrate 50 when irradiated by a light source; wherein each photosensitive glue unit 210 corresponds to at least one to-be-transferred chip chip 40.

Specifically, the transfer substrate 10 may be a glass substrate for supporting the adhesive layer 20 disposed thereon. The adhesive layer 20 includes a plurality of photosensitive adhesive units 210 , and the photosensitive adhesive units 210 are arranged in an array on the transfer substrate 10 . The array of chips to be transferred is disposed on the carrier substrate 30, and the array of chips to be transferred includes chips to be transferred 40, wherein the carrier substrate 30 may be a sapphire substrate or a GaAs substrate, and the chips to be transferred 40 may be Micro LEDs. Each photosensitive adhesive unit 210 disposed on the transfer substrate 10 corresponds to at least one chip to be transferred 40 , that is, the vertical projection of each photosensitive adhesive unit 210 on the transfer substrate 10 covers at least one chip to be transferred 40 . The photosensitive adhesive unit 210 can be made of a photosensitive polymer material such as polyimide. When the photosensitive adhesive unit 210 is irradiated by the light of the first wavelength emitted by the light source, it can be quickly cured to produce a certain viscosity, so as to be able to adhere to the corresponding required transfer. The chip to be transferred 40; wherein the light of the first wavelength can be ultraviolet.

In this embodiment, there is a distance between adjacent photosensitive adhesive units 210, and the distance can be set according to the actual requirements of the product. In order to ensure the transfer reliability of the to-be-transferred chip 40 , the to-be-transferred chip 40 needs to be precisely aligned with the photosensitive adhesive unit 210 , so that the to-be-transferred chip 40 is attached to the photosensitive adhesive unit 210 . When the photosensitive adhesive unit 210 is irradiated by the ultraviolet light source, the photosensitive adhesive unit 210 is rapidly cured and adheres to the corresponding chip 40 to be transferred, and the second wavelength light emitted by the light source is used to illuminate the chip transfer substrate to which the chip to be transferred 40 is adhered, so that the The photosensitive adhesive unit 210 loses its viscosity, so as to transfer the chips 40 to be transferred onto the target substrate 50 , so as to realize the batch transfer of LED chips, wherein the light of the second wavelength can be infrared rays. The chips 40 to be transferred are arranged in the array of chips to be transferred in the form of an array. When the chips 40 to be transferred are aligned with the transfer substrate, the photosensitive adhesive unit 210 only exists at the position of the chips 40 to be transferred, and the positions without the chips 40 to be transferred are not different. There is a photosensitive adhesive unit 210, so when the transfer substrate is illuminated by a light source, the photosensitive adhesive unit 40 blocked by the to-be-transferred chip 40 is cured to produce stickiness. The position will not be vaporized or carbonized by absorbing the energy of the light source.

In addition, when the chip to be transferred 40 adhered to the chip transfer substrate is damaged and the laser single-point repair is performed, the corresponding photosensitive adhesive unit 210 is irradiated by the light of the second wavelength emitted by the light source, so that the photosensitive adhesive unit 210 loses its viscosity and the chip is transferred. The chip to be transferred 40 at the corresponding position on the substrate falls off, so that a new chip to be transferred 40 can be re-attached. When laser irradiation is performed on the chip to be transferred 40 that needs to be repaired, since there is no photosensitive adhesive in the position that is not blocked by the chip to be transferred 40 (ie, the distance between adjacent photosensitive adhesive units 40 ), the laser irradiation is used to transfer the chip. When the substrate is used, there will be no glue residue around the chip 40 to be transferred, and the yield rate of the laser single-point repair will not be affected.

In other embodiments, two light sources may also be included, one light source is used for emitting light with a first wavelength to cure the photosensitive adhesive unit 210; the other light source is used for emitting light with a second wavelength so that the photosensitive adhesive unit 210 can be cured 210 loses stickiness.

An embodiment of the present invention provides a chip transfer substrate, which includes a transfer substrate and an adhesive layer on the transfer substrate. Wherein, the adhesive layer includes a plurality of photosensitive adhesive units arranged in an array, each photosensitive adhesive unit corresponds to at least one chip to be transferred, and there is a gap between adjacent photosensitive adhesive units. Since there is a distance between adjacent photosensitive adhesive units, there is no photosensitive adhesive at the spacing position, and the chip to be transferred is set corresponding to the photosensitive adhesive unit. Therefore, in the process of transferring the chip, the spacing between adjacent photosensitive adhesive units is The phenomenon of vaporization or carbonization of the glue material will occur, which is beneficial to improve the transfer yield of the chip to be transferred. In addition, when the chip to be transferred is single-point repaired, since there is no photosensitive adhesive in the spacing between adjacent photosensitive adhesive units, no adhesive residue will be formed around the to-be-transferred chip, which is beneficial to improve the yield of single-point repair.

It should be noted that the single-point repair mentioned in the embodiment of the present invention may also be repairing the chip transferred to the target substrate 50 , and the target substrate 50 is also provided with the adhesive layer provided by the embodiment of the present invention.

Continuing to refer to FIG. 3 , the structure of the chip transfer substrate shown in FIG. 3 is that each photosensitive adhesive unit 210 corresponds to one chip 40 to be transferred. In this embodiment, the shape of the photosensitive adhesive unit 210 is the same as that of the chip 40 to be transferred, and the size is the same. After the precise alignment of the photosensitive adhesive unit 210 and the to-be-transferred chip 40 is achieved, the photosensitive adhesive unit 210 can just fit the to-be-transferred chip 40 , and there is no photosensitive adhesive around the to-be-transferred chip 40 and between the adjacent to-be-transferred chips 40 . Therefore, under the condition of ensuring firm adhesion, the phenomenon of vaporization or carbonization of glue material between adjacent chips 40 to be transferred can be improved. Preferably, the spacing between the adjacent photosensitive adhesive units 210 is equal to the spacing between the corresponding adjacent chips 40 to be transferred, and the size of the spacing is d, so as to facilitate accurate alignment between the photosensitive adhesive units 210 and the chips to be transferred 40 , The process difficulty of patterning the photosensitive adhesive unit 210 can be reduced. At the same time, the spacing between any adjacent photosensitive adhesive units 210 may also be equal, which can improve the alignment accuracy between the photosensitive adhesive units 210 and the corresponding to-be-transferred chips 40 .

As another optional implementation manner provided by the embodiment of the present invention, each photosensitive adhesive unit 210 may also correspond to a plurality of chips 40 to be transferred. FIG. 4 is a top-view structural view of another chip transfer substrate provided by an embodiment of the present invention, and FIG. 5 is a schematic cross-sectional structural diagram of a chip transfer substrate corresponding to another chip transfer process provided by an embodiment of the present invention. Referring to FIG. 4 and FIG. 5. Each photosensitive adhesive unit 210 corresponds to a plurality of chips 40 to be transferred; preferably, the shape of the photosensitive adhesive unit 210 is the same as the shape and size of the area where the corresponding plurality of chips to be transferred 40 are located; The area where the 40 is located includes the positions where the multiple chips 40 to be transferred are located and the spacing positions of adjacent chips 40 to be transferred among the multiple chips 40 to be transferred.

Specifically, in this embodiment, the chip 40 to be transferred is a micro LED chip, and its size is less than or equal to 100 microns. In order to simplify the process difficulty, the size of the photosensitive adhesive unit 210 can be made larger, so that each photosensitive adhesive unit 210 can adhere a plurality of chips 40 to be transferred, that is, the vertical projection of each photosensitive adhesive unit 210 on the transfer substrate 10 covers the plurality of chips 40 to be transferred. Exemplarily, the chips 40 to be transferred are arranged on the carrier substrate 30 in an array, and the size of one photosensitive adhesive unit 210 is the same as the shape and size of the area where the nine chips 90 to be transferred are located. The size and shape of the glue unit 210 are the same as the size and shape of the area formed by the nine chips 40 to be transferred, wherein the size of the area formed by the nine chips 40 to be transferred includes the size of the nine chips 40 to be transferred and the size and shape of the adjacent chips 40 to be transferred. The pitch dimension between chips 40 . There is also no photosensitive adhesive at the distance between adjacent photosensitive adhesive units 210. Therefore, when the light source illuminates the transfer substrate, the corresponding chip 40 to be transferred is only adhered at the position where the photosensitive adhesive unit 210 exists, and the adjacent photosensitive adhesive units are attached. The spacing between 210 will not cause the phenomenon of photosensitive adhesive vaporization or carbonization.

In this embodiment, by assigning each photosensitive adhesive unit 210 to a plurality of chips 40 to be transferred, the size of the photosensitive adhesive unit 210 can be correspondingly increased, and the process difficulty of forming the photosensitive adhesive unit 210 can be reduced when the transfer substrate is fabricated. , which is beneficial to improve the alignment accuracy between the photosensitive adhesive unit 210 and the to-be-transferred chip 40 .

FIG. 6 is a schematic top-view structure diagram of another chip transfer substrate provided by an embodiment of the present invention. Referring to FIG. 6 , on the basis of the above technical solutions, the chip transfer substrate provided by an embodiment of the present invention further includes a non-photosensitive adhesive 220, a non-photosensitive adhesive The photosensitive adhesive 220 is disposed at least between some adjacent photosensitive adhesive units 210 .

Specifically, the non-photosensitive adhesive 220 may be disposed around the photosensitive adhesive unit 210 , and the photosensitive adhesive unit 210 and the non-photosensitive adhesive 220 are integrally formed, that is, the non-photosensitive adhesive 220 is provided at the spacing between adjacent photosensitive adhesive units 210 . Controlling the photosensitive adhesive unit 210 and the chip to be transferred 40 in alignment and bonding, when the photosensitive adhesive unit 210 is irradiated by the light of the first wavelength emitted by the light source, the energy absorbed by the photosensitive adhesive unit 210 blocked by the chip to be transferred 40 is small, and The non-photosensitive adhesive 220 that is not blocked by the chip to be transferred 40 absorbs a large amount of energy, but since the non-photosensitive adhesive 220 does not contain photosensitive materials, the non-photosensitive adhesive 220 can be used as a buffer structure of the photosensitive adhesive unit 210. When the energy is too high, the non-photosensitive adhesive 220 absorbs energy without vaporizing or carbonizing itself, and at the same time, the non-photosensitive adhesive 220 can also absorb part of the energy irradiated to the photosensitive adhesive unit 210, so as to reduce the photosensitive adhesive caused by the high energy of the light source. The phenomenon of gasification or carbonization. The irradiated photosensitive adhesive unit 210 is rapidly cured and adheres to the corresponding chip 40 to be transferred. The light of the second wavelength emitted by the light source is used to illuminate the chip transfer substrate to which the chips to be transferred 40 are adhered, so that the photosensitive adhesive unit 210 loses its viscosity, so as to transfer the chips to be transferred 40 to the target substrate 50 , thereby realizing batch transfer of LED chips.

An embodiment of the present invention further provides a chip transfer device. FIG. 7 is a schematic structural diagram of a chip transfer device provided by an embodiment of the present invention. Referring to FIGS. 1 , 2 and 7 , the chip transfer device includes a light source 100 . 100 is used to provide light with a preset wavelength; the transfer substrate includes a transfer substrate 10 and an adhesive layer 20 located on the transfer substrate 10, the adhesive layer 20 includes a plurality of photosensitive adhesive units 210 arranged in an array, and adjacent photosensitive adhesive units There is a distance between 210; the photosensitive adhesive unit 210 is used for adhering the corresponding chip to be transferred 40 in the array of chips to be transferred to the target substrate 50 when irradiated by a light source. The light source 100 can emit light of the first wavelength and light of the second wavelength, and the photosensitive adhesive unit 210 can be rapidly cured to generate viscosity when irradiated by the light of the first wavelength to adhere the corresponding chip 40 to be transferred. When the photosensitive adhesive unit 210 is irradiated by the light of the second wavelength, it can return to a fluid state and lose its viscosity, so that the adhered chip to be transferred 40 is peeled off.

The chip transfer device provided by the embodiment of the present invention includes the chip transfer substrate provided by any embodiment of the present invention. Therefore, the chip transfer device also has the beneficial effects described in any embodiment of the present invention, which will not be repeated here.

An embodiment of the present invention further provides a chip transfer method, and the chip transfer method can be applied to the chip transfer apparatus of any of the above-mentioned embodiments of the present invention. FIG. 8 is a flowchart of a chip transfer method provided by an embodiment of the present invention. FIG. 9-FIG. 12 are schematic process diagrams corresponding to the steps of the chip transfer method in FIG. 8. Referring to FIG. 8-FIG. 12, the chip transfer method provided by the embodiment of the present invention includes:

S110, providing a chip transfer substrate, the chip transfer substrate includes a transfer substrate and an adhesive layer on the transfer substrate, the adhesive layer includes a plurality of photosensitive adhesive units arranged in an array, and there is a gap between adjacent photosensitive adhesive units.

Specifically, FIG. 9 is a schematic structural diagram of another chip transfer substrate provided by an embodiment of the present invention. Referring to FIG. 9 , the chip transfer substrate includes a transfer substrate 10 and an adhesive layer 20 on the transfer substrate 10 . The adhesive layer 20 includes a photosensitive adhesive unit 210 and a non-photosensitive adhesive 220 disposed around the photosensitive adhesive unit 210, wherein the photosensitive adhesive unit 210 and the non-photosensitive adhesive 220 are integrated into a structure, and the adhesive layer 20 can be formed on the transfer substrate 10 by coating. superior. For example, a whole continuous layer of adhesive layer 20 is coated on the transfer substrate 10, and the adhesive layer 20 is patterned, so that the adhesive layer 20 forms a set pattern at the position for forming the photosensitive adhesive unit 210, and the set pattern is A photosensitive material is filled in the middle to form a photosensitive adhesive unit 210 . The setting pattern can be designed according to the shape of the chip to be transferred 40 to achieve precise alignment between the photosensitive adhesive unit 210 and the chip to be transferred 40 . A set pattern can be formed on the adhesive layer 20 by using a nano-imprint technology (including hot embossing and extreme ultraviolet imprinting) or a photolithography technology, and a photosensitive material is filled into the set pattern to form a photosensitive adhesive unit 210. The photosensitive material can be: Photosensitive polymer materials such as polyimide. The transfer substrate 10 may be a glass substrate for supporting the adhesive layer 20 disposed thereon.

S120 , providing a carrier substrate on which a chip array to be transferred is disposed, and aligning the photosensitive adhesive unit with the chip array to be transferred.

Specifically, FIG. 10 is a schematic diagram of a process of aligning a photosensitive adhesive unit and a chip to be transferred according to an embodiment of the present invention. Referring to FIG. 10 , an array of chips to be transferred is formed on the carrier substrate 30 , and the array of chips to be transferred includes the array of chips to be transferred. The chip 40, the to-be-transferred chip 40 can be a Micro LED. Each photosensitive adhesive unit 210 disposed on the transfer substrate 10 corresponds to at least one chip to be transferred 40 , and the chip 40 to be transferred and the photosensitive adhesive unit 210 are precisely aligned so that the to-be-transferred chip 40 and the photosensitive adhesive unit 210 are bonded together .

S130 , providing a light source, where the light source is used to provide light with a preset wavelength.

Specifically, FIG. 11 is a schematic diagram of a process of adhering a photosensitive adhesive unit to a corresponding chip to be transferred according to an embodiment of the present invention. Referring to FIG. 11 , the light source is a light source capable of providing light with a preset wavelength, and the preset wavelength light can be ultraviolet rays And infrared, etc., the energy emitted by the light source is less than 10 millijoules. When the photosensitive adhesive unit 210 is irradiated by the light of the first wavelength (ultraviolet light), the photosensitive adhesive unit 210 is rapidly cured and adheres to the corresponding chip to be transferred 40 . Since the non-photosensitive adhesive 220 is disposed around the photosensitive adhesive unit 210 , that is, the non-photosensitive adhesive 220 is disposed at the distance between adjacent photosensitive adhesive units 210 . The shape and size of the photosensitive adhesive unit 210 are the same as the shape and size of the chip to be transferred 40 . The energy absorbed by the photosensitive adhesive unit 210 blocked by 40 is small, while the energy absorbed by the non-photosensitive adhesive 220 not blocked by the chip 40 to be transferred is relatively large. However, since the non-photosensitive adhesive 220 does not contain photosensitive materials, the non-photosensitive adhesive 220 can As the buffer structure of the photosensitive adhesive unit 210 , when the light energy emitted by the light source is too high, the non-photosensitive adhesive 220 will not vaporize or carbonize itself by absorbing the energy, and at the same time, the non-photosensitive adhesive 220 can also absorb part of the radiation to the photosensitive adhesive unit 210 . to reduce the vaporization or carbonization of the photosensitive adhesive caused by the high energy of the light source. The irradiated photosensitive adhesive unit 210 is rapidly cured and adheres to the corresponding chip 40 to be transferred.

S140 , providing a target substrate, and irradiating the photosensitive adhesive unit with a light source to adhere the corresponding chips to be transferred in the array of chips to be transferred to the target substrate.

Specifically, FIG. 12 is a schematic diagram of a process of transferring a chip to be transferred to a target substrate according to an embodiment of the present invention. Referring to FIG. 12 , a second wavelength of light (infrared) is used to illuminate the chip transfer substrate to which the chip 40 to be transferred is adhered , the cured photosensitive adhesive unit 210 melts and loses its viscosity, so as to transfer the chips 40 to be transferred onto the target substrate 50 , thereby realizing batch transfer of the chips 40 to be transferred.

When the photosensitive adhesive unit 210 is irradiated with ultraviolet rays and adheres the to-be-transferred chip 40 , if the to-be-transferred chip 40 adhered to the chip transfer substrate is damaged, the damaged to-be-transferred chip 40 can be repaired by laser single-point repair. Exemplarily, the corresponding photosensitive adhesive unit 210 can be irradiated with infrared rays emitted by the light source, so that the photosensitive adhesive unit 210 loses its viscosity, and the chip to be transferred 40 at the corresponding position on the chip transfer substrate falls off, so that a new chip to be transferred 40 can be re-attached. . When laser irradiation is performed on the chip to be transferred 40 that needs to be repaired, since there is non-photosensitive adhesive in the position not blocked by the chip to be transferred 40 (that is, the spacing position between adjacent photosensitive adhesive units 40 ), there is no photosensitive adhesive. When the laser is irradiated, the non-photosensitive adhesive will not be carbonized, so there will be no adhesive residue around the chip 40 to be transferred that has fallen off, and the yield rate of laser single-point repair will not be affected.

The embodiment of the present invention provides a chip transfer method, by patterning the adhesive layer to form a plurality of photosensitive adhesive units arranged in an array, each photosensitive adhesive unit corresponds to at least one to-be-transferred chip, and adjacent photosensitive adhesive units There are gaps between cells. Since there is a gap between adjacent photosensitive adhesive units, there is no photosensitive adhesive at the spacing position. Therefore, during the process of transferring the chip, the chip to be transferred and the photosensitive adhesive unit are set correspondingly, and the spacing position between adjacent photosensitive adhesive units is different. The phenomenon that the glue material is vaporized or carbonized due to the absorption of light energy is beneficial to improve the transfer yield of the chip to be transferred. In addition, because there is no photosensitive adhesive in the spacing between adjacent photosensitive adhesive units, during the single-point repair process of the to-be-transferred chip, no adhesive residue will be formed around the to-be-transferred chip, which is beneficial to improve the yield of single-point repair. .

Note that the above are only preferred embodiments of the present invention and applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the present invention. The scope is determined by the scope of the appended claims.

Claims (10)

1. A chip transfer substrate, characterized in that, comprising: transfer substrate; an adhesive layer, located on the transfer substrate, the adhesive layer includes a plurality of photosensitive adhesive units arranged in an array, and there is a distance between the adjacent photosensitive adhesive units; the photosensitive adhesive units are used for Adhering the corresponding chips to be transferred in the array of chips to be transferred to the target substrate; Each of the photosensitive adhesive units corresponds to at least one chip to be transferred. 2 . The chip transfer substrate according to claim 1 , wherein each of the photosensitive adhesive units corresponds to one of the chips to be transferred. 3 . 3 . The chip transfer substrate according to claim 2 , wherein the photosensitive adhesive unit has the same shape and the same size as the chip to be transferred. 4 . 4. The chip transfer substrate according to claim 1, wherein each of the photosensitive adhesive units corresponds to a plurality of the chips to be transferred; Preferably, the photosensitive adhesive unit has the same shape and size as the corresponding regions where the plurality of chips to be transferred are located; wherein, the regions where the plurality of chips to be transferred are located include the positions of the plurality of chips to be transferred and a plurality of A spacing position between adjacent chips to be transferred among the chips to be transferred. 5. The chip transfer substrate according to claim 1, wherein the size of the chip to be transferred is less than or equal to 100 microns. 6 . The chip transfer substrate according to claim 1 , further comprising a non-photosensitive adhesive, wherein the non-photosensitive adhesive is disposed at least between some adjacent photosensitive adhesive units. 7 . 7 . The chip transfer substrate according to claim 6 , wherein the non-photosensitive adhesive is disposed around the photosensitive adhesive unit, and the photosensitive adhesive unit and the non-photosensitive adhesive are integrally formed. 8 . 8. A chip transfer device, characterized in that, comprising: a light source, the light source is used to provide light with a preset wavelength; a chip transfer substrate, the chip transfer substrate includes a transfer substrate and an adhesive layer on the transfer substrate, the adhesive layer includes a plurality of photosensitive adhesive units arranged in an array, and there is a gap between adjacent photosensitive adhesive units; The photosensitive adhesive unit is used for adhering the corresponding chips to be transferred in the array of chips to be transferred to the target substrate when irradiated by the light source. 9. A chip transfer method, characterized in that, comprising: A chip transfer substrate is provided, the chip transfer substrate includes a transfer substrate and an adhesive layer on the transfer substrate, the adhesive layer includes a plurality of photosensitive adhesive units arranged in an array, and there is a spacing between adjacent photosensitive adhesive units ; providing a carrier substrate on which a chip array to be transferred is arranged, and the photosensitive adhesive unit and the chip array to be transferred are aligned; providing a light source for providing light with a preset wavelength; A target substrate is provided, and the photosensitive adhesive unit is irradiated by the light source to adhere the corresponding chips to be transferred in the array of chips to be transferred to the target substrate. 10. The chip transfer method according to claim 9, wherein the providing a transfer substrate comprises: providing a transfer substrate, and forming an entire continuous adhesive layer on the transfer substrate; The adhesive layer is patterned so that the adhesive layer forms a set pattern at a position for forming a photosensitive adhesive unit, and a photosensitive material is filled into the set pattern to form the photosensitive adhesive unit.

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