CN115242313A - Vertically and horizontally arranged receiving head and manufacturing method thereof - Google Patents

Abstract

The invention provides a vertical and horizontal receiving head, which includes: a base, a metal bracket, a photosensitive receiving module, and an information processing module, and the metal bracket includes a main bracket, a first pin bracket, a second lead bracket foot bracket, the main bracket has a ground pin, the first pin bracket has a first pin, the second pin bracket has a second pin; the first pin and the second pin The pins are all protruded from the first connecting surface and are bent to the second connecting surface so as to be attached to the second connecting surface. By bending the pins connecting the receiving head and the outside to the adjacent connecting surfaces of the base, and setting a balance column with approximately the same thickness as the pins on the corresponding connecting surfaces, it not only realizes the vertical and The two types of horizontal connection use quick connection methods, and the balanced connection between the receiving head and the installation surface is realized through the balance column and the positioning foot, so as to ensure the accurate positioning of the installation position of the receiving head without tilting.

Description

A vertical and horizontal receiving head and its manufacturing method

technical field

The invention relates to the technical field of signal receiving heads, in particular to a vertical and horizontal receiving head and a manufacturing method thereof.

Background technique

The SMD infrared receiver uses epoxy resin packaging material as a carrier, and after adding toner, it can filter out stray light except infrared light. The infrared remote control signal can be read out for the microprocessor to decode. SMD infrared receivers are mainly used in televisions, air conditioners, toys, home DVDs, set-top boxes and so on. It is a replacement product of the plug-in infrared receiver.

However, after the existing signal receiving heads are generally processed, they can only be assembled and connected in a single vertical or horizontal manner, which cannot meet the user's quick connection requirements in different scenarios.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the deficiencies of the prior art, and to provide a vertical and horizontal receiving head and a manufacturing method thereof, so as to solve the problem that the existing signal receiving head can only adopt the vertical or horizontal single connection method. question.

To achieve the above object, the present invention adopts the following technical solutions:

In a first aspect, embodiments of the present invention provide a vertical and horizontal receiving head, comprising:

a base, the base has an adjacent first connection surface and a second connection surface;

A metal bracket, the metal bracket includes: a main bracket, a first pin bracket and a second pin bracket, and the main bracket, the first pin bracket and the second pin bracket are all embedded in the base superior;

a photosensitive receiving module, the photosensitive receiving module is embedded in the base, and the photosensitive receiving module has a negative port and a signal output port; and

an information processing module, the information processing module is embedded in the base, and the information processing module has a signal receiving port, a negative port, a power port and a signal output port;

Wherein, the negative port of the photosensitive receiving module is electrically connected to the main support using metal glue, and the signal output port of the photosensitive receiving module is electrically connected to the signal receiving port of the information processing module using metal wires. The negative terminal of the module is electrically connected to the main bracket using a metal wire, the power port of the information processing module is electrically connected to the second pin bracket using a metal wire, and the signal output port of the information processing module is electrically connected to the metal wire. connected to the first pin holder;

The main bracket has a ground pin, the first pin bracket has a first pin, and the second pin bracket has a second pin; the ground pin, the first pin and all the The second pins protrude from the first connecting surface and are bent to the second connecting surface so as to be attached to the second connecting surface.

Wherein, the first connecting surface also protrudes with first connecting surface balancing feet.

Wherein, the balance leg of the first connection surface includes: a first balance column, a second balance column, a third balance column and a fourth balance column which are protruded from the first connection surface and are arranged in sequence; The first balance column and the fourth balance column are respectively arranged at the near edge of one of the opposite sides of the first connection surface.

Wherein, the second connecting surface is also protruded with a second connecting surface balancing foot.

Wherein, the balance leg of the second connection surface includes: a fifth balance column and a sixth balance column, and the fifth balance column and the sixth balance column are provided with a negative port, a power port and a signal corresponding to the information processing module. Set on the opposite side of the output port.

Wherein, the heights of the fifth balance column and the sixth balance column are the same as the heights of the ground pins, the first pins and the second pins.

Wherein, the first pin holder is further provided with a third pin, and the second pin holder is further provided with a fourth pin; the third pin is vertically arranged with the first pin, The fourth pin is vertically arranged with the second pin; the third pin is protruded from the first connecting surface and then bent and attached to the adjacent surface on the base, and the fourth pin is The feet are protruded from the first connecting surface and then bent and attached to the adjacent surfaces on the base.

Wherein, the main support is further provided with a first positioning pin and a second positioning pin, the first positioning pin and the second positioning pin are both arranged in parallel with the ground pin, and the first positioning pin And the second positioning foot protrudes out of the cylindrical surface of the second balance column and the third balance column by 0.5mm.

Wherein, the base includes: an upper layer colloid and a lower layer colloid, the upper layer colloid is fixed to the lower layer colloid; the grounding pin, the first pin and the second pin are all connected from the upper layer The connecting surface of the colloid and the lower layer of colloid protrudes out, the upper layer of colloid is also provided with a receiving window, the photosensitive receiving module is arranged under the receiving window, and the information processing module is arranged on the same plane of the photosensitive receiving module the underside.

In a second aspect, an embodiment of the present invention also provides a manufacturing method for manufacturing the vertical and horizontal receiving heads described in any of the above, comprising the following steps:

Use metal glue to fix the photosensitive receiving module on the main bracket, so that the negative terminal of the photosensitive receiving module is electrically connected to the main bracket using metal glue;

Use insulating glue to fix the information processing module on the main bracket, and connect the signal receiving port of the information processing module to the signal output port of the photosensitive receiving module, so that the negative terminal is electrically connected to the main bracket with a metal wire, and the power port is connected to the first Two-pin bracket, connecting the signal output port to the first pin bracket;

The components connecting the main support, the photosensitive receiving module, the information processing module, the first pin support and the second pin support are covered with a shielding case and put into a forming mold, and epoxy resin is injected into the mold to form a primary product;

The primary product is sent to the stamping equipment, and the solderable electroplating is carried out after removing the residual glue;

The electroplated primary product is sent into the forming equipment, and the pins protruding from the base are bent to obtain the formed product.

The vertical and horizontal receiving head and its manufacturing method of the present invention are provided by bending the pins connecting the receiving head and the outside on the adjacent connecting surfaces of the base, and setting the corresponding connecting surface on the corresponding connecting surface. The balance column with approximately the same thickness of the pins not only realizes the two quick connection methods of vertical and horizontal connection of the receiving head, but also realizes the balanced connection between the receiving head and the mounting surface through the balance column, ensuring the accurate installation of the receiving head. Tilt does not occur.

The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly, it can be implemented in accordance with the content of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable, the following A preferred embodiment is given, and the detailed description is as follows.

Description of drawings

FIG. 1 and FIG. 2 are schematic structural diagrams of the front side of the vertical and horizontal receiving heads according to the embodiments of the present invention at different angles.

FIG. 3 and FIG. 4 are schematic structural diagrams of different angles of the back of the vertical and horizontal receiving heads according to the embodiments of the present invention.

FIG. 5 is a schematic diagram of the bottom surface structure of the vertical and horizontal receiving heads according to the embodiment of the present invention.

FIG. 6 is a schematic structural diagram of the vertical and horizontal receiving heads of the embodiment of the present invention with the upper layer colloid removed.

FIG. 7 is a schematic diagram of the horizontal installation of the vertical and horizontal receiving heads according to the embodiment of the present invention.

FIG. 8 is a schematic diagram of vertical installation of the vertical and horizontal receiving heads according to the embodiment of the present invention.

FIG. 9 is a flowchart of a method for manufacturing a vertical and horizontal receiving head according to an embodiment of the present invention.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or position relationship described in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore It should not be construed as a limitation of the present invention.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the present invention, unless otherwise expressly specified and limited, the terms "installation", "connection", "connection", "fixing" and other terms should be understood in a broad sense, for example, it may be a connection or a detachable connection, It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication between the two elements or the interaction relationship between the two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In the present invention, unless otherwise expressly specified and limited, a first feature "on" or "under" a second feature may include the first and second features in direct contact, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature is directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

In the description of this specification, description with reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples", etc., mean specific features described in connection with the embodiment or example , structure, material or feature is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Please refer to FIG. 1 to FIG. 8 , this embodiment provides a vertical and horizontal receiving head, which includes:

a base 1, the base 1 has a first connecting surface 10 and a second connecting surface 20 adjacent to each other;

Metal bracket, the metal bracket includes: a main bracket 2, a first pin bracket 3 and a second pin bracket 4, the main bracket 2, the first pin bracket 3 and the second pin bracket 4 are all embedded are arranged on the base 1 and are all made of metal;

a photosensitive receiving module 5, the photosensitive receiving module 5 is embedded in the base 1, and the photosensitive receiving module 5 has a negative terminal and a signal output port; and

An information processing module 6, the information processing module 6 is embedded in the base 1, and the information processing module 6 has a signal receiving port, a negative port, a power port and a signal output port.

Wherein, the negative terminal of the photosensitive receiving module 5 is electrically connected to the main support 2, the signal output port of the photosensitive receiving module 5 is electrically connected to the signal receiving port of the information processing module 6, and the information processing module 6 The negative terminal of the information processing module 6 is electrically connected to the main bracket 2, the power supply port of the information processing module 6 is electrically connected to the second pin bracket 4, and the signal output port of the information processing module 6 is electrically connected to the first pin bracket 4. Pin holder 3.

The main bracket 2 has a ground pin 22, the first pin bracket 3 has a first pin 33, and the second pin bracket 4 has a second pin 43; The first pin 33 and the second pin 43 both protrude from the first connecting surface 10 and bend to the second connecting surface 20 to fit on the second connecting surface 20 . The first connection surface 10 and the second connection surface 20 are used as connection surfaces for alignment assembly with products such as televisions.

Wherein, the first connecting surface 10 also protrudes with a first connecting surface balancing foot.

Specifically, the first connecting surface balancing leg includes: a first balancing column 112 , a second balancing column 113 , a third balancing column 114 and a fourth balancing column, which are protruded from the first connecting surface 10 and are arranged in sequence. Column 115 ; wherein, the first balance column 112 and the fourth balance column 115 are respectively disposed at the near edge of one of the opposite sides of the first connection surface 10 . It should be noted that the first balance column 112 , the second balance column 113 , the third balance column 114 and the fourth balance column 115 start to extend from the opposite sides of the ground pins 22 that are bent and abutted, so that the ground leads The feet 22 , the first pins 33 and the second pins 43 , and the first balance column 112 , the second balance column 113 , the third balance column 114 and the fourth balance column 115 conduct the first connection surface 10 from opposite sides. Support to prevent the defect that the signal reception quality is not high or unstable due to tilt after connection.

Similarly, the second connecting surface 20 also protrudes with a second connecting surface balancing leg.

Specifically, the balance feet of the second connection surface include: a fifth balance column 121 and a sixth balance column 122 , and the fifth balance column 121 and the sixth balance column 122 are provided with a negative pole opposite to the information processing module 6 Ports, power ports, and signal output ports are set on the opposite side. In this embodiment, the base 1 is roughly in the shape of a cube, the grounding pin 22 , the first pin 33 and the second pin 43 are bent and the abutting surfaces of the parts are connected with the fifth balance column 121 and the sixth balance column 122 are located on the same face and are set opposite. At this time, the ground pins 22 , the first pins 33 , the second pins 43 , the first balance column 121 and the second balance column 122 are distributed at the edges of different positions on the same surface, and together form a connection to the second connection surface 20 Balanced support prevents it from tilting when connected horizontally, resulting in poor or unstable signal reception.

Wherein, the height of the protrusions of the fifth balance column 121 and the sixth balance column 122 is the same as the thickness of the ground pins 22 , the first pins 33 and the second pins 43 . That is, the thicknesses of the ground pins 22 , the first pins 33 and the second pins 43 are the same as the protruding heights of the fifth balance column 121 and the sixth balance column 122 , so as to form a plane support.

Wherein, the first pin holder 3 is also provided with two third pins 31 and 32, and the second pin holder 4 is also provided with two fourth pins 41 and 42; The pins 31 and 32 are arranged vertically with the first pin 33, and the fourth pins 41 and 42 are arranged vertically with the second pin 43; the third pins 31 and 32 are formed by the first The connecting surface 10 is protruded and then bent and attached to the adjacent surface on the base 1, as shown in FIG. 2 on the left side of the cube-shaped base 1; the fourth pins 41 and 42 The connecting surface 10 is protruded and then bent and attached to the adjacent surface on the base 1 , that is, the right side of the cube-shaped base 1 as shown in FIG. 1 .

Please refer to FIG. 3 and FIG. 6 again, the main bracket 2 is further provided with a first positioning pin 21 and a second positioning pin 23 , and the first positioning pin 21 and the second positioning pin 23 are both connected to the ground The pins 22 are arranged in parallel. During vertical installation, the first positioning foot 21 and the second positioning foot 23 protrude out of the cylindrical surface of the second balance column 113 and the second balance column 114 by 0.5mm. When the horizontal connection is used, the welding surface is not used, and the effect of the horizontal connection is not affected. The first positioning pins 21 and the second positioning pins 23 are inserted into the positioning holes of the circuit board during vertical installation, and play the role of positioning and orientation.

In this embodiment, the base 1 includes: an upper layer colloid 11 and a lower layer colloid 12, the upper layer colloid 11 is fixed to the lower layer colloid 12; the grounding pin 22, the first pin 33 and the The second pins 43 protrude from the connecting surface of the upper layer colloid 11 and the lower layer colloid 12 , the upper layer colloid 11 is also provided with a receiving window 111 , and the photosensitive receiving module 5 is arranged in the receiving window 111 . Below window 111.

Please refer to FIG. 7 and FIG. 8 again. FIG. 7 is a horizontal connection. At this time, the second connection surface 20 is attached to the connection position. At this time, the first pins 33 and the second Both the pin 43 and the ground pin 22 are connected with corresponding solder joints or contact pads, wherein the first pin 33 serves as the IR signal output end of the signal receiving head, and the second pin 43 serves as the VCC power port. FIG. 8 is a vertical connection. At this time, the first connection surface 10 is attached and connected to the external connection position, corresponding to the first pin 33 , the second pin 43 and the ground pin attached to the first connection surface 10 . 22 can be connected with corresponding welding or contact pads, the first pin 33 is used as the IR signal output end of the signal receiving head, and the second pin 43 is used as the VCC power port. Therefore, the signal receiving head can realize fast vertical and horizontal connection, flexible selection according to the usage scenario, without customization.

The embodiment of the present invention also provides a manufacturing method for manufacturing the above-mentioned vertical and horizontal receiving heads, which includes the following steps:

Step S100, using metal glue to fix the photosensitive receiving module on the main support, so that the negative port of the photosensitive receiving module is electrically connected to the main support using metal glue;

Step S200, using insulating glue to fix the information processing module on the main support, and connect the signal receiving port of the information processing module to the signal output port of the photosensitive receiving module, so that the negative terminal is electrically connected to the main support using a metal wire, and the power port is connected to the main support. is connected to the second pin bracket, and the signal output port is electrically connected to the first pin bracket using metal wires;

Step S300, the components connecting the main support, the photosensitive receiving module, the information processing module, the first pin support and the second pin support are covered with a shielding cover and put into the forming mold, and the shielding cover is the upper layer colloid, injected into the mold Epoxy resin (ie, the underlying colloid) to form the primary product;

Step S400, sending the primary product into the stamping equipment, and performing solderability electroplating after removing the residual glue;

In step S500, the electroplated primary product is sent into the molding equipment, and the pins protruding from the base are bent to obtain a molded product.

In another embodiment, after step S500, it further includes product appearance screening, electrical testing, and arrangement of vertical or horizontal carrier tapes of the movement to obtain qualified products connected by the patch.

The vertical and horizontal receiving head and its manufacturing method of the present invention are provided by bending the pins connecting the receiving head and the outside on the adjacent connecting surfaces of the base, and setting the corresponding connecting surface on the corresponding connecting surface. The balance column with approximately the same thickness of the pins not only realizes the two quick connection methods of vertical and horizontal connection of the receiving head, but also realizes the balanced connection between the receiving head and the mounting surface through the balance column, ensuring the accurate installation of the receiving head. Tilt does not occur.

The above only uses examples to further illustrate the technical content of the present invention, so that readers can understand it more easily, but it does not mean that the embodiments of the present invention are limited to this. Any technical extension or re-creation made according to the present invention is subject to the protection of. The protection scope of the present invention is subject to the claims.

Claims (10)

1. A vertically and horizontally erectable receiving head, comprising:

a base having a first connection face and a second connection face which are adjacent;

a metal stent, the metal stent comprising: the main support, the first pin support and the second pin support are all embedded on the base;

the photosensitive receiving module is embedded in the base and is provided with a negative electrode port and a signal output port; and

the information processing module is embedded in the base and is provided with a signal receiving port, a negative electrode port, a power supply port and a signal output port;

the negative port of the photosensitive receiving module is electrically connected to the main bracket, the signal output port of the photosensitive receiving module is electrically connected to the signal receiving port of the information processing module, the negative port of the information processing module is electrically connected to the main bracket, the power port of the information processing module is electrically connected to the second pin bracket, and the signal output port of the information processing module is electrically connected to the first pin bracket;

the main bracket is provided with a grounding pin, the first pin bracket is provided with a first pin, and the second pin bracket is provided with a second pin; the first pin and the second pin protrude from the first connection surface and bend towards the second connection surface so as to be attached to the second connection surface.

2. The receiving head of claim 1, wherein the first connecting surface is further provided with a first connecting surface balance foot.

3. The erectable and recumbent receiving head of claim 2, wherein said first joint face balancing foot comprises: the first balance column, the second balance column, the third balance column and the fourth balance column are arranged in sequence and protrude from the first connecting surface; the first and fourth balance posts are respectively disposed at a proximal edge of one of the opposite side edges of the first connection surface.

4. The erectable or collapsible receiver head of claim 2, wherein said second connecting surface further comprises a second connecting surface balancing foot protruding therefrom.

5. The erectable and recumbent receiving head of claim 4 wherein said second connecting surface balancing foot comprises: and the fifth balancing column and the sixth balancing column are arranged opposite to the negative port, the power supply port and the signal output port of the information processing module.

6. The erectable and collapsible receive head of claim 5, wherein the fifth and sixth standoff have a height of projection that is the same as the thickness of the ground, first and second pins.

7. The vertically and horizontally movable receiving head according to any one of claims 1 to 6, wherein the first pin holder is further provided with a third pin, and the second pin holder is further provided with a fourth pin; the third pin is perpendicular to the first pin, and the fourth pin is perpendicular to the second pin; the third pin protrudes from the first connection surface and then bends and attaches to the adjacent surface on the base, and the fourth pin protrudes from the first connection surface and then bends and attaches to the adjacent surface on the base.

8. The vertical and horizontal receiving head according to any one of claims 1 to 6, wherein the main support is further provided with a first positioning pin and a second positioning pin, the first positioning pin and the second positioning pin are both arranged in parallel with the ground pin, and the first positioning pin and the second positioning pin protrude out of the cylindrical surfaces of the second balance column and the third balance column by 0.5mm.

9. The erectable and collapsible receiving head of any one of claims 1 to 6, wherein said base comprises: the upper layer colloid is fixedly connected with the lower layer colloid; the grounding pin, the first pin and the second pin of the metal support all protrude from the connection surface of the upper layer colloid and the lower layer colloid, a receiving window is further arranged on the upper layer colloid, the photosensitive receiving module is arranged below the receiving window, and the information processing module is arranged on the lower side of the same plane of the photosensitive receiving module.

10. A manufacturing method for manufacturing the vertically and horizontally erectable receiving head of any one of claims 1 to 9, comprising the steps of:

fixing the photosensitive receiving module on the main bracket by adopting metal glue, so that a negative port of the photosensitive receiving module is electrically connected with the main bracket;

fixing the information processing module on the main support by using insulating glue, and connecting a signal receiving port of the information processing module to a signal output port of the photosensitive receiving module, so that a negative electrode port is electrically connected to the main support, a power supply port is connected to the second pin support, and the signal output port is connected to the first pin support;

covering a shielding case on a component which is connected with the main bracket, the photosensitive receiving module, the information processing module, the first pin bracket and the second pin bracket, putting the component into a forming die, and injecting epoxy resin into the die to form a primary product;

sending the primary product into a stamping device, removing residual glue and then carrying out weldability electroplating;

and (3) feeding the electroplated primary product into a forming device, and bending the pins protruding out of the base to obtain a formed product.

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