CN115250584B

CN115250584B - Circuit board with heat dissipation function and manufacturing method thereof

Info

Publication number: CN115250584B
Application number: CN202110468463.0A
Authority: CN
Inventors: 唐攀; 张馥麟
Original assignee: Hong Heng Sheng Electronical Technology HuaiAn Co Ltd; Avary Holding Shenzhen Co Ltd
Current assignee: Hong Heng Sheng Electronical Technology HuaiAn Co Ltd; Avary Holding Shenzhen Co Ltd
Priority date: 2021-04-28
Filing date: 2021-04-28
Publication date: 2025-04-22
Anticipated expiration: 2041-04-28
Also published as: TWI823176B; CN115250584A; TW202243580A

Abstract

The application provides a manufacturing method of a circuit board with a heat dissipation function, which comprises the steps of providing a substrate, forming a first conductive circuit layer on the substrate, forming a first insulating layer on the first conductive circuit layer, forming a first through hole in the first insulating layer, filling metal in the first through hole to form a first heat conduction part, forming a second conductive circuit layer, a second insulating layer and a copper foil layer on the first insulating layer to obtain an intermediate, forming a groove in the intermediate, forming a second heat conduction part in the groove, forming a copper plating layer on the copper foil layer and the second heat conduction part, and etching the copper plating layer and the copper foil layer to form a third conductive circuit layer, thereby obtaining the circuit board. The circuit board manufactured by the manufacturing method has a good heat dissipation effect. The application also provides a circuit board manufactured by the manufacturing method.

Description

Circuit board with heat dissipation function and manufacturing method thereof

Technical Field

The application relates to the technical field of circuit boards, in particular to a circuit board with a heat dissipation function and a manufacturing method thereof.

Background

With the development of 5G technology, electronic products are developed to be highly integrated and miniaturized, so that the packaging density of electronic components is higher and higher, and the power consumption is higher and higher. Therefore, the heat dissipation requirement of the circuit board in the electronic product is also higher and higher. The heat dissipation performance of the current circuit board cannot meet the requirements.

Disclosure of Invention

In view of this, the present application provides a method for manufacturing a circuit board with good heat dissipation effect.

In addition, it is necessary to provide a circuit board manufactured by the manufacturing method.

The application provides a manufacturing method of a circuit board, which comprises the following steps:

providing a substrate, wherein the substrate comprises a metal layer and an adhesive layer, the metal layer comprises a body and a first column body convexly arranged on the body, a slot is formed between the body and the first column body, and the adhesive layer is arranged in the slot;

Forming a first conductive line layer on the surface of the substrate, so that the first conductive line layer is in thermal conduction with the first column;

Forming a first insulating layer on the first conductive circuit layer, wherein a first through hole is formed in the first insulating layer, and the first through hole corresponds to the first conductive circuit layer;

Filling metal in the first through hole to form a first heat conduction part;

Forming a second conductive line layer on the first insulating layer, wherein the second conductive line layer is in thermal conduction with the first conductive line layer through the first heat conduction part;

sequentially forming a second insulating layer and a copper foil layer on the second conductive circuit layer to obtain an intermediate;

A groove is formed in the intermediate body, the groove sequentially penetrates through the copper foil layer and the second insulating layer, the bottom of the groove corresponds to the second conductive circuit layer, and the groove corresponds to the first heat conducting part;

filling the metal in the groove to form a second heat conduction part;

forming a copper plating layer on the copper foil layer and the second heat conduction part, and

And etching the copper plating layer and the copper foil layer to form a third conductive circuit layer, thereby obtaining the circuit board.

The application also provides a circuit board, comprising:

the substrate comprises a metal layer and an adhesive layer, wherein the metal layer comprises a body and a first column body which is convexly arranged on the body, a slot is formed between the body and the first column body, and the adhesive layer is arranged in the slot;

A first conductive trace layer on a surface of the substrate, the first conductive trace layer in thermal communication with the first pillar;

The first insulating layer is positioned on the first conductive circuit layer, a first through hole is formed in the first insulating layer, the first through hole corresponds to the first conductive circuit layer, and metal is filled in the first through hole to form a first heat conducting part;

the second conductive circuit layer is positioned on the first insulating layer and is in thermal conduction with the first conductive circuit layer through the first heat conduction part;

a second insulating layer on the second conductive line layer, and

A third conductive trace layer on the second insulating layer;

The circuit board is provided with a groove, the groove penetrates through the second insulating layer, the bottom of the groove corresponds to the second conductive circuit layer, the groove corresponds to the first heat conduction part, and the groove is filled with metal to form a second heat conduction part.

According to the application, the first conductive circuit layer, the second conductive circuit layer and the third conductive circuit layer are arranged on the substrate, the first heat conduction part is arranged below the second conductive circuit layer, and the second heat conduction part is arranged below the third conductive circuit layer, so that heat generated by the first conductive circuit layer is transmitted to the metal layer, heat generated by the second conductive circuit layer is transmitted to the first heat conduction part, heat generated by the third conductive circuit layer is transmitted to the second heat conduction part, and heat conduction among the first conductive circuit layer, the second conductive circuit layer and the third conductive circuit layer can be realized, and the heat dissipation effect of the circuit board is further improved.

Drawings

Fig. 1 is a schematic structural diagram of a substrate according to some embodiments of the present application.

Fig. 2 is a schematic structural view of the substrate shown in fig. 1 after first conductive trace layers are formed on opposite surfaces thereof.

Fig. 3 is a schematic structural view of the first conductive trace layer shown in fig. 2 after forming a first insulating layer thereon.

Fig. 4 is a schematic structural diagram of the first insulating layer shown in fig. 3 after a first via hole is opened and filled with metal.

Fig. 5 is a schematic structural view of the first insulating layer shown in fig. 4 after forming a second conductive trace layer thereon.

Fig. 6 is a schematic structural view of the second conductive trace layer shown in fig. 5 after sequentially forming a second insulating layer and a copper foil layer thereon.

Fig. 7 is a schematic structural view of the intermediate body shown in fig. 6 after forming a groove and a second through hole.

Fig. 8 is a schematic view of the structure of the recess and the second through hole shown in fig. 7 after metal is electroplated and filled.

Fig. 9 is a schematic view of the structure of the copper foil layer, the second heat conductive portion and the third heat conductive portion shown in fig. 8 after metal plating.

Fig. 10 is a schematic view of the circuit board obtained by etching the copper-clad layer and the copper foil layer shown in fig. 9.

Description of the main reference signs

Circuit board 100

Substrate 10

Metal layer 11

Body 111

First column 112

Second column 113

Adhesive layer 12

Grooving 13

First conductive line layer 20

First insulating layer 30

First through hole 301

First heat conduction part 31

Second conductive trace layer 40

Second insulating layer 50

Copper foil layer 60

Intermediate 70

Groove 71

Opening 701

Second through hole 72

First metal layer 73

Second metal layer 74

Second heat conduction part 75

Third heat conduction part 76

Copper plating layer 80

Third conductive line layer 90

The application will be further described in the following detailed description in conjunction with the above-described figures.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

The application will be described in detail below with reference to the drawings and preferred embodiments thereof, in order to further explain the technical means and effects of the application to achieve the intended purpose.

Some embodiments of the present application provide a method for manufacturing a circuit board, including the following steps:

in step S11, referring to fig. 1, a substrate 10 is provided.

In some embodiments, the substrate 10 includes a metal layer 11 and two glue layers 12 disposed in the metal layer 11. The metal layer 11 includes a body 111, at least two first pillars 112, and a second pillar 113. The first column 112 and the second column 113 are both protruding from the surface of the body 111. The width of the second pillars 113 is greater than the width of the first pillars 112 along the extending direction of the metal layer 11. Wherein, the body 111 and the first column 112, and the body 111 and the second column 113 enclose a slot 13 therebetween. Wherein, two glue layers 12 are respectively located in the slots 13, and the surface of the first column 112 or the second column 113 is approximately flush with the surface of the glue layer 12.

In some embodiments, the metal layer 11 is a thermoelectrically separated metal. Thermoelectric separation means that heat and electricity are separated, and an electrically conductive portion and a thermally conductive portion thereof are located at different positions.

In some embodiments, the material of the metal layer 11 is aluminum nitride or potassium nitride. The metal layer 11 has good heat conduction and certain electric conduction. In some embodiments, the glue layer 12 may be an acrylic glue (AD glue).

In step S12, referring to fig. 2, first conductive trace layers 20 are respectively formed on two opposite surfaces of the substrate 10.

Specifically, copper foil layers (not shown) are respectively formed on opposite surfaces of the substrate 10, and the two copper foil layers are respectively etched to form the two first conductive trace layers 20. The second column 113 corresponds to a line gap of the first conductive line layer 20.

The two first conductive trace layers 20 are connected to the first column 112, so as to be in thermal conduction with the metal layer 11, so that heat generated by the two first conductive trace layers 20 is transferred to the metal layer 11, and the metal layer 11 is made of metal, so that the heat can be absorbed or dissipated to the outside, and the temperature of the two first conductive trace layers 20 is reduced.

In step S13, referring to fig. 3, a first insulating layer 30 is formed on the two first conductive trace layers 20 respectively.

The material of the first insulating layer 30 may be one selected from epoxy resin (PP), polypropylene (BT) resin, polyphenylene oxide (Polyphenylene Oxide, PPO), polyimide (PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), and polyethylene naphthalate (Polyethylene Naphthalate, PEN). In this embodiment, the material of the first insulating layer 30 is polypropylene.

In step S14, referring to fig. 4, at least one first through hole 301 is formed in each of the two first insulating layers 30.

Specifically, the first through hole 301 may be formed by laser cutting.

Wherein each first through hole 301 penetrates through the first insulating layer 30, and each first through hole 301 corresponds to the first conductive line layer 20. I.e. the bottom of each first through hole 301 is the first conductive trace layer 20.

In step S15, a metal is filled in each of the first through holes 301 to form a first heat conducting portion 31.

Wherein the first heat conducting portion 31 is in thermal conduction with the corresponding first conductive trace layer 20.

In some embodiments, the metal is a thermoelectric separation metal.

In some embodiments, the metal is aluminum nitride or potassium nitride.

In step S16, referring to fig. 5, a second conductive trace layer 40 is formed on the two first insulating layers 30 respectively.

Specifically, copper foil layers (not shown) are formed on the two first insulating layers 30, respectively, and the two copper foil layers are etched, respectively, to form the two second conductive trace layers 40.

The heat generated by the two second conductive circuit layers 40 can be transmitted to the first heat conducting portion 31, and the first heat conducting portion 31 is made of metal, so that the heat can be absorbed, and the temperature of the two second conductive circuit layers 40 is reduced. Meanwhile, since the first heat conducting portion 31 is in thermal conduction with the first conductive circuit layer 20, the heat generated by the second conductive circuit layer 40 can be transferred to the metal layer 11 through the first heat conducting portion 31 and the first conductive circuit layer 20 in sequence, and the metal layer 11 absorbs the heat or dissipates the heat to the outside.

In step S17, referring to fig. 6, a second insulating layer 50 and a copper foil layer 60 are sequentially formed on the two second conductive trace layers 40, respectively, to obtain an intermediate 70.

The material of the second insulating layer 50 may be the same as that of the first insulating layer 30, and the material of the first insulating layer 30 may be referred to herein, which is not described in detail.

In step S18, referring to fig. 7, at least two grooves 71 and at least one second through hole 72 are formed in the intermediate body 70.

Specifically, the groove 71 and the second through hole 72 may be formed by laser cutting.

Wherein two of the grooves 71 are respectively located on two opposite surfaces of the intermediate body 70. Each of the grooves 71 penetrates the copper foil layer 60 and the second insulating layer 50 in sequence. The bottom of each groove 71 corresponds to the second conductive circuit layer 40, and each groove 71 corresponds to the first heat conductive portion 31.

In some embodiments, each of the grooves 71 includes an opening 701 formed on the copper foil layer 60, and the inner diameter of the groove 71 decreases from the opening 701 of the groove 71 to the bottom.

Each of the second through holes 72 penetrates the intermediate body 70. Specifically, each of the second through holes 72 sequentially penetrates the copper foil layer 60, the second insulating layer 50, the second conductive trace layer 40, the first insulating layer 30, the first conductive trace layer 20, the substrate 10, the first conductive trace layer 20, the first insulating layer 30, the second conductive trace layer 40, the second insulating layer 50, and the copper foil layer 60.

In step S19, referring to fig. 8, at least the inner walls of each of the grooves 71 and each of the second through holes 72 are electroplated with metal to form a first metal layer 73 and a second metal layer 74, and then each of the grooves 71 with the first metal layer 73 and each of the second through holes 72 with the second metal layer 74 is filled with the metal to form a second heat conducting portion 75 and a third heat conducting portion 76, respectively.

In some embodiments, the first metal layer 73 is disposed on the inner wall of the groove 71 and the bottom of the groove 71. In other embodiments, the first metal layer 73 may be provided only on the inner wall of the groove 71. Wherein the second metal layer 74 is disposed on the inner wall of the second through hole 72.

In some embodiments, the material of the first metal layer 73 and the second metal layer 74 may be copper.

In step S20, referring to fig. 9, a metal is electroplated on each copper foil layer 60, each second heat conducting portion 75 and each third heat conducting portion 76 to form two copper plating layers 80.

In step S21, referring to fig. 10, each of the copper plating layers 80 and each of the copper foil layers 60 are etched to form two third conductive trace layers 90, respectively, so as to obtain the circuit board 100.

The heat generated by the two third conductive circuit layers 90 can be transmitted to the second heat conducting portion 75, and the second heat conducting portion 75 is made of metal, so that the heat can be absorbed, and the temperature of the two third conductive circuit layers 90 is reduced. Meanwhile, since the second heat conducting portion 75 is in thermal conduction with the first metal layer 73 and the second conductive circuit layer 40, the heat generated by the third conductive circuit layer 90 may also be transmitted to the metal layer 11 through the second heat conducting portion 75, the first metal layer 73, the second conductive circuit layer 40, the first heat conducting portion 31, and the first conductive circuit layer 20 in sequence, and the metal layer 11 absorbs the heat or emits the heat to the outside.

In addition, the heat generated by the first conductive trace layer 20, the second conductive trace layer 40 and the third conductive trace layer 90 may be transferred to the third heat conducting portion 76, and the third heat conducting portion 76 is made of metal, so that the heat may be absorbed, and the temperature of the first conductive trace layer 20, the second conductive trace layer 40 and the third conductive trace layer 90 may be reduced. Meanwhile, the heat generated by the second conductive trace layer 40 and the third conductive trace layer 90 may be directly transferred to the metal layer 11 through the third heat conducting portion 76, and the metal layer 11 absorbs the heat or dissipates the heat to the outside.

The second metal layer 74 may be used to electrically connect the first conductive trace layer 20, the second conductive trace layer 40, and the third conductive trace layer 90.

The present application also mounts electronic components (not shown) on each of the third conductive trace layers 90. The heat generated by the electronic component can be transferred to the first heat conduction part 31, the second heat conduction part 75, the third heat conduction part 76, and the metal layer 11.

Referring to fig. 10, some embodiments of the present application further provide a circuit board 100, where the circuit board 100 includes a substrate 10, a first conductive circuit layer 20, a first insulating layer 30, a second conductive circuit layer 40, a second insulating layer 50, and a third conductive circuit layer 90.

The two first conductive trace layers 20 are respectively located on two opposite surfaces of the substrate 10. The second column 113 corresponds to a line gap of the first conductive line layer 20.

The two first insulating layers 30 are respectively located on the two first conductive trace layers 20. The material of the first insulating layer 30 may be one selected from epoxy resin (PP), polypropylene (BT) resin, polyphenylene oxide (Polyphenylene Oxide, PPO), polyimide (PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), and polyethylene naphthalate (Polyethylene Naphthalate, PEN). In this embodiment, the material of the first insulating layer 30 is polypropylene.

At least one first through hole 301 is formed in each of the two first insulating layers 30. Wherein each first through hole 301 penetrates through the first insulating layer 30, and each first through hole 301 corresponds to the first conductive line layer 20. I.e. the bottom of each first through hole 301 is the first conductive trace layer 20. Each of the first through holes 301 is filled with a metal to form a first heat conductive portion 31. Wherein the first heat conducting portion 31 is in thermal conduction with the corresponding first conductive trace layer 20.

In some embodiments, the metal is a thermoelectric separation metal.

In some embodiments, the metal is aluminum nitride or potassium nitride.

Two second conductive trace layers 40 are respectively disposed on the two first insulating layers 30. The heat generated by the two second conductive circuit layers 40 can be transmitted to the first heat conducting portion 31, and the first heat conducting portion 31 is made of metal, so that the heat can be absorbed, and the temperature of the two second conductive circuit layers 40 is reduced. Meanwhile, since the first heat conducting portion 31 is in thermal conduction with the first conductive circuit layer 20, the heat generated by the second conductive circuit layer 40 can be transferred to the metal layer 11 through the first heat conducting portion 31 and the first conductive circuit layer 20 in sequence, and the metal layer 11 absorbs the heat or dissipates the heat to the outside.

The two second insulating layers 50 are respectively located on the two second conductive trace layers 40. The material of the second insulating layer 50 may be the same as that of the first insulating layer 30, and the material of the first insulating layer 30 may be referred to herein, which is not described in detail.

Two third conductive trace layers 90 are respectively disposed on the two second insulating layers 50. At least two grooves 71 and at least one second through hole 72 are formed in the circuit board 100. Each of the grooves 71 penetrates the second insulating layer 50. The bottom of each groove 71 corresponds to the second conductive circuit layer 40, and each groove 71 corresponds to the first heat conductive portion 31. In some embodiments, each of the grooves 71 includes an opening 701 formed on the third conductive trace layer 90, and the inner diameter of the groove 71 decreases from the opening 701 of the groove 71 to the bottom. Each of the second through holes 72 penetrates the circuit board 100.

At least the inner walls of each of the grooves 71 and each of the second through holes 72 are plated with metal to form a first metal layer 73 and a second metal layer 74, respectively, and then each of the grooves 71 having the first metal layer 73 and each of the second through holes 72 having the second metal layer 74 is filled with the metal to form a second heat conduction portion 75 and a third heat conduction portion 76, respectively.

The first conductive circuit layer 20, the second conductive circuit layer 40 and the third conductive circuit layer 90 are arranged on the substrate 10, the first heat conduction part 31 is arranged below the second conductive circuit layer 40, and the second heat conduction part 75 is arranged below the third conductive circuit layer 90, so that heat generated by the first conductive circuit layer 20 is transmitted to the metal layer 11, heat generated by the second conductive circuit layer 40 is transmitted to the first heat conduction part 31, heat generated by the third conductive circuit layer 90 is transmitted to the second heat conduction part 75, and heat conduction among the first conductive circuit layer 20, the second conductive circuit layer 40 and the third conductive circuit layer 90 is enabled, and therefore the heat dissipation effect of the circuit board 100 is improved.

The above description is only one preferred embodiment of the present application, but is not limited to this embodiment during actual application. Other modifications and variations to the present application will be apparent to those of ordinary skill in the art in light of the present teachings.

Claims

1. A method for manufacturing a circuit board, characterized in that it comprises the following steps:

Providing a substrate, comprising a metal layer and an adhesive layer, wherein the metal layer comprises a body and a first column protruding from the body, a groove is formed between the body and the first column, and the adhesive layer is arranged in the groove;

forming a first conductive circuit layer on the surface of the substrate so that the first conductive circuit layer is thermally connected to the first column;

Filling metal in the first through hole to form a first heat conducting portion;

forming a second conductive circuit layer on the first insulating layer, wherein the second conductive circuit layer is thermally connected to the first conductive circuit layer through the first heat conducting portion;

forming a second insulating layer and a copper foil layer in sequence on the second conductive circuit layer to obtain an intermediate;

A groove is provided in the intermediate body, the groove sequentially passes through the copper foil layer and the second insulating layer, the bottom of the groove corresponds to the second conductive circuit layer, and the groove corresponds to the first heat conducting portion;

Filling the metal in the groove to form a second heat conducting portion;

forming a copper plating layer on the copper foil layer and the second heat conducting portion; and

The copper plating layer and the copper foil layer are etched to form a third conductive circuit layer, thereby obtaining the circuit board.

2. The method for manufacturing a circuit board according to claim 1, characterized in that after the groove is formed in the intermediate body, the method further comprises:

A second through hole is formed in the intermediate body, and the through hole passes through the intermediate body;

filling the metal in the second through hole to form a third heat conducting portion; and

The copper plating layer is formed on the third heat conducting portion.

3. The method for manufacturing a circuit board according to claim 2, characterized in that after the groove is formed in the intermediate body, the method further comprises:

forming a first metal layer at least on an inner wall of the groove; and

A second metal layer is formed at least on the inner wall of the second through hole.

4. The method for manufacturing a circuit board according to claim 1, wherein the groove comprises an opening formed on the copper foil layer, and an inner diameter of the groove decreases from the opening to the bottom of the groove.

5. The method for manufacturing a circuit board as described in claim 1 is characterized in that the metal layer also includes a second column protruding from the body, the groove is formed between the body and the second column, and along the extension direction of the metal layer, the width of the second column is greater than the width of the first column.

6. The method for manufacturing a circuit board according to claim 1, characterized in that the metal layer and the metal are both thermoelectric separation metals, and the material of the thermoelectric separation metal is aluminum nitride or potassium nitride.

7. A circuit board, comprising:

A substrate, comprising a metal layer and an adhesive layer, wherein the metal layer comprises a body and a first column protruding from the body, a groove is formed between the body and the first column, and the adhesive layer is arranged in the groove;

A first conductive circuit layer is located on the surface of the substrate, and the first conductive circuit layer is thermally connected to the first column;

a first insulating layer, located on the first conductive circuit layer, in which a first through hole is opened, the first through hole corresponds to the first conductive circuit layer, and the first through hole is filled with metal to form a first heat conducting portion;

A second conductive circuit layer is located on the first insulating layer, and the second conductive circuit layer is thermally connected to the first conductive circuit layer through the first heat conducting portion;

A second insulating layer, located on the second conductive circuit layer; and

A third conductive circuit layer is located on the second insulating layer;

A groove is provided in the circuit board, the groove passes through the second insulating layer, the bottom of the groove corresponds to the second conductive circuit layer, and the groove corresponds to the first heat conducting part, and the metal is filled in the groove to form the second heat conducting part.

8 . The circuit board according to claim 7 , wherein a second through hole is further provided in the circuit board, and the second through hole is filled with the metal to form a third heat conducting portion.

9 . The circuit board according to claim 8 , wherein a first metal layer is formed at least on an inner wall of the groove, and a second metal layer is formed at least on an inner wall of the second through hole.

10. The circuit board according to claim 7, characterized in that the metal layer and the metal are both thermoelectric separation metals, and the thermoelectric separation metal is made of aluminum nitride or potassium nitride.