CN115250602B

CN115250602B - Multi-loop circulation heat radiation module

Info

Publication number: CN115250602B
Application number: CN202110458867.1A
Authority: CN
Inventors: 林育民; 廖文能; 谢铮玟; 王俊杰; 陈宗廷; 何吉泰; 陈冠霖; 柯召汉
Original assignee: Acer Inc
Current assignee: Acer Inc
Priority date: 2021-04-27
Filing date: 2021-04-27
Publication date: 2025-07-29
Anticipated expiration: 2041-04-27
Also published as: CN115250602A

Abstract

The invention provides a multi-loop circulating heat dissipation module which comprises a first tank body, a first pipeline, a second tank body and a second pipeline. The first pipeline is connected with the first groove body to form a first loop, the first working fluid is filled in the first loop and conducts heat transfer through phase change, and a first high-temperature section and a first low-temperature section are formed in the first pipeline. The second pipeline is connected with the second groove body to form a second loop, the second working fluid is filled in the second loop and carries out heat transfer through phase change, and a second high-temperature section and a second low-temperature section are formed in the second pipeline. The first high temperature section is in thermal contact with the second low temperature section, and the first low temperature section is in thermal contact with the second high temperature section.

Description

Multi-loop circulation heat radiation module

Technical Field

The present disclosure relates to heat dissipation modules, and particularly to a multi-loop circulation heat dissipation module.

Background

With the progress of technology, portable electronic devices are developing toward lighter and thinner devices. For example, a lightweight and slim notebook computer, tablet PC (Tablet PC), smart Phone (Smart Phone), etc., the lightweight and slim profile is suitable for the user to carry and operate. In addition, in order to increase the processing efficiency of the tablet computer, the performance of the cpu of the motherboard is also increased, but a large amount of heat is also easily generated, which often causes the circuit or the electronic component of the electronic device to be on-line due to overheating, which is inconvenient.

Generally, a heat dissipation module disposed in an electronic device includes an air-cooled heat dissipation module and a water-cooled heat dissipation module, such as a light-weight and thin-type notebook computer, a Tablet PC (Tablet PC) or a smart mobile phone type heat dissipation module, wherein the efficiency of the water-cooled heat dissipation module is better. However, under the trend of the portable electronic device to be light, thin, short and small, how to configure the corresponding heat dissipation module in the body with limited space while maintaining the heat dissipation efficiency is a problem that needs to be considered and solved by related personnel.

Disclosure of Invention

The invention is directed to a multi-loop circulating heat dissipation module which can improve the overall heat dissipation capacity of the module.

According to an embodiment of the invention, the multi-loop circulating heat dissipation module comprises a first groove body, a first pipeline, a second groove body and a second pipeline. The first pipeline is connected with the first groove body to form a first loop, the first working fluid is filled in the first loop and conducts heat transfer through phase change, and a first high-temperature section and a first low-temperature section are formed in the first pipeline. The second pipeline is connected with the second groove body to form a second loop, the second working fluid is filled in the second loop and carries out heat transfer through phase change, and a second high-temperature section and a second low-temperature section are formed in the second pipeline. The first high temperature section is in thermal contact with the second low temperature section, and the first low temperature section is in thermal contact with the second high temperature section.

Based on the above, the heat dissipation module is formed by circulating a plurality of loops and filling the loops with corresponding working fluid so that the loops are independent single loops, and more importantly, the heat dissipation module of the present invention further combines the high temperature section and the low temperature section of each pipeline by thermal contact means. Therefore, the high-temperature section of one loop can further transfer heat to the low-temperature section of the other loop, and the temperature equalizing effect can be provided for the whole heat dissipation module, so that the whole heat dissipation capacity of the heat dissipation module is effectively improved. In other words, by slowing down the temperature drop of the single loop and providing an additional heat dissipation path, the overall heat dissipation performance of the heat dissipation module can be improved, so as to more rapidly transfer the heat generated by the heat source of the electronic device to the external environment, thereby avoiding heat accumulation in a local part of the electronic device.

Drawings

FIG. 1 is a schematic diagram of a multi-loop circulation heat dissipation module according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of an internal structure of a tank of the heat dissipating module of FIG. 1;

FIG. 3 is a schematic diagram of a multi-loop circulation heat dissipation module according to another embodiment of the present invention;

fig. 4 is a schematic diagram of a multi-loop circulation heat dissipation module according to another embodiment of the invention.

Detailed Description

Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.

Fig. 1 is a schematic diagram of a multi-loop circulation heat dissipation module according to an embodiment of the invention. Referring to fig. 1, an arrow beside a circuit is shown as a simple illustration of the working fluid filled therein, and in this embodiment, the multi-circuit circulation heat dissipation module 100 includes a first tank 110, a first pipeline 120, a second tank 130 and a second pipeline 140. The first pipe 120 is connected to the first tank 110 to form a first loop P1, the first working fluid F1 fills the first loop P1 and performs heat transfer through phase change, and a first high temperature section H1 and a first low temperature section L1 are formed in the first pipe 120. The second pipe 140 is connected to the second tank 130 to form a second loop P2, the second working fluid F2 is filled in the second loop P2 and performs heat transfer through phase change, and a second high temperature section H2 and a second low temperature section L2 are formed in the second pipe 140, wherein the first high temperature section H1 is in thermal contact with the second low temperature section L2, and the first low temperature section L1 is in thermal contact with the second high temperature section H2.

Further, the multi-loop heat dissipation module 100 is adapted to an electronic device (such as a notebook computer or a tablet computer) to dissipate heat from a heat source 400 (such as a cpu or a display chip), wherein the first tank 110 and the second tank 130 of the present embodiment are in thermal contact with the heat source 400 to absorb heat generated by the heat source 400, and the first working fluid F1 and the second working fluid F2 respectively located in the first tank 110 and the second tank 130 are subjected to phase change (from a liquid phase to a vapor phase), so that the first working fluid F1 and the second working fluid F2 respectively flow out of the first tank 110 and the second tank 130 in vapor phase, and then gradually dissipate heat in the traveling process of the first pipeline 120 and the second pipeline 140 to be converted into a liquid phase, and accordingly flow back to the first tank 110 and the second tank 130 to form a phase change cycle, so that the heat dissipation effect can be provided to the heat source 400 regardless of the first loop P1 or the second loop P2. For the first circuit P1, the first working fluid F1 located in the first high temperature section H1 is in a vapor phase, and the first working fluid F1 located in the first low temperature section L1 is in a liquid phase, and the liquid and vapor coexist therebetween. For the second circuit P2, the second working fluid F2 in the second high temperature section H2 is in a vapor phase, and the second working fluid F2 in the second low temperature section L2 is in a liquid phase, and the liquid and vapor coexist therebetween.

It should be noted that, for the first circuit P1 and the second circuit P2, if they are considered separately, the temperature of the first low temperature section L1 and the temperature of the second low temperature section L2 are substantially close to the ambient temperature, and the heat dissipation effect of the first circuit P1 and the second circuit P2 is significantly reduced. In other words, if only the first loop P1 or only the second loop P2 is present, the overall heat dissipation efficiency can only rely on the phase change of the first working fluid F1 in the first pipeline 120 or the phase change of the second working fluid F2 in the second pipeline 140 to achieve the heat dissipation, thereby creating the performance bottleneck of the current loop type circulation heat dissipation module.

As described above, the first circuit P1 and the second circuit P2, which are different from each other, are further combined in this embodiment to form a thermal contact area between the first high temperature section H1 and the second low temperature section L2, and form another thermal contact area between the second high temperature section H2 and the first low temperature section L1, so that the first high temperature section H1 and the second low temperature section L2 can further exchange heat, and the second high temperature section H2 and the first low temperature section L1 can also further exchange heat. By combining the above means with a plurality of separate circuits, a temperature equalizing effect is provided for the whole multi-circuit circulation heat dissipation module 100, and thus the temperature drop of the individual circuits is slowed down, and an additional heat dissipation path is provided for the first high temperature section H1 and the second high temperature section H2, which further causes the temperature difference between the multi-circuit circulation heat dissipation module 100 and the external environment (which is equivalent to increasing the temperature difference region between the multi-circuit circulation heat dissipation module 100 and the external environment), so that the multi-circuit circulation heat dissipation module 100 dissipates the heat generated by the heat source 400 to the external environment more easily.

In the present embodiment, the flow direction of the first working fluid F1 in the first circuit P1 and the flow direction of the second working fluid F2 in the second circuit P2 are opposite to each other, and the first circuit P1 and the second circuit P2 are independent from each other and have inner and outer closed profiles, so that the high and low temperatures Duan Neng of the different circuits correspond to each other. Furthermore, the multi-loop heat dissipation module 100 further includes a first conductive member 150 and a second conductive member 160, wherein the first conductive member 150 is connected between the first high temperature section H1 and the second low temperature section L2 to transfer the heat of the first high temperature section H1 to the second low temperature section L2. The second conductive member 160 is connected between the second high temperature section H2 and the first low temperature section L1 to transfer the heat of the second high temperature section H2 to the first low temperature section L1.

Here, the first conductive member 150 and the second conductive member 160 are, for example, heat pipes or members having heat conductive capability. For example, when the multi-circuit heat dissipation module 100 is adapted to a notebook computer, the first conductive member 150 and the second conductive member 160 may be metal structures of the machine body or metal back plates or metal brackets disposed on the machine body. To facilitate the formation of thermal contact areas for the high and low temperature sections. Of course, in other embodiments not shown, the direct heat transfer can be achieved by directly contacting the first high temperature section H1 with the second low temperature section L2 and directly contacting the second high temperature section H2 with the first low temperature section L1. The form of bringing the high and low temperature sections into thermal contact with each other is not limited herein.

In addition, the first tank 110 and the second tank 130 of the present embodiment are of an integral structure, that is, they belong to different chambers in the same structural member, and the different chambers are independent and not communicated with each other.

Fig. 2 is a schematic diagram of an internal structure of a tank of the heat dissipating module of fig. 1. The first tank 110 is taken as an example, and the second tank 130 has the same internal structure and is omitted. In the present embodiment, the first tank 110 has a chamber 111 and a plurality of flow guiding elements 112 disposed in the chamber 111, the chamber 111 has an inlet E1 and an outlet E2, the flow guiding elements 112 have a tapered profile from the inlet E1 toward the outlet E2, or the flow guiding elements 112 form a plurality of flow passages 113 in the chamber 111 that taper from the inlet E1 toward the outlet E2, so as to control the flow of the first working fluid F1 and the second working fluid F2 from the inlet E1 to the outlet E2, respectively. In other words, the arrangement of the flow guide member 112 in the chamber 111 affects the flow direction of the working fluid (for example, the first working fluid F1) in the circuit, so that the first circuit P1 and the second circuit P2 are configured as shown in fig. 1 by adjusting the first tank 110 and the second tank 130, so as to achieve the corresponding effects required by the high-temperature and low-temperature sections.

Fig. 3 is a schematic diagram of a multi-loop circulation heat dissipation module according to another embodiment of the invention. Referring to fig. 3, in the present embodiment, the multi-circuit heat dissipation module 200 includes a first tank 210, a first pipeline 220, a second tank 230, a second pipeline 240, a third tank 250 and a third pipeline 260, wherein the first tank 210 is connected to the first pipeline 220 to form a first circuit P11, the second tank 230 is connected to the second pipeline 240 to form a second circuit P21, and the third tank 250 is connected to the third pipeline 260 to form a third circuit P31. The first working fluid F11 fills the first circuit P11, the second working fluid F21 fills the second circuit P21, and the third working fluid F31 fills the third circuit P31.

The same logic as in the previous embodiment also combines the different individual circuits and provides thermal contact between the high and low temperature sections to facilitate heat transfer. Accordingly, the first high temperature section H11 of the first pipeline 220 is in thermal contact with the third low temperature section L31 of the third pipeline 260, the first low temperature section L11 of the first pipeline 220 is in thermal contact with the second high temperature section H21 of the second pipeline 240, and the third high temperature section H31 of the third pipeline 260 is in thermal contact with the second low temperature section L21 of the second pipeline 240. In other words, as shown in fig. 3, the first circuit P11, the second circuit P21 and the third circuit P31 form three thermal contact areas 271-273, and the thermal contact areas 271-273 are the same as the above embodiment, and can be directly contacted or connected by thermal conductors to achieve the effect of transferring the heat of the high temperature section to the low temperature section.

Here, the first tank 210, the second tank 230 and the third tank 250 are integrally formed, the flow direction of the first working fluid F11 in the first circuit P11 and the flow direction of the second working fluid F21 in the second circuit P21 are opposite to each other, the flow direction of the first working fluid F11 in the first circuit P11 and the flow direction of the third working fluid F31 in the third circuit P31 are opposite to each other, and the second circuit P21 and the third circuit P31 are independent from each other and are separated from each other, and are surrounded by the first circuit P11.

Fig. 4 is a schematic diagram of a multi-loop circulation heat dissipation module according to another embodiment of the invention. Unlike the foregoing embodiment, in the multi-circuit circulation heat dissipation module 300 of the present embodiment. The first tank 310 and the second tank 330 are separate structures, the first pipe 320 and the second pipe 340 are also separate and juxtaposed at the same time, and the flow directions of the working fluids in the different circuits are identical to each other. In other words, the first tank 310, the first pipeline 320 and the working fluid filled therein are configured to dissipate heat from the heat source 410, and the second tank 330, the second pipeline 340 and the working fluid filled therein are configured to dissipate heat from the heat source 420. Meanwhile, the first tank 310 and the second tank 330 are further connected through the third conductive member 350 to achieve the heat transfer effect therebetween, and more importantly, the first pipeline 320 and the second pipeline 340 also have thermal contact areas 360 and 370 for the high temperature section and the low temperature section. In short, the independent circuits of the multi-circuit circulation heat dissipation module 300 of the present embodiment can achieve heat exchange between the third conductive member 350 and the thermal contact areas 360 and 370 smoothly, so as to achieve the above-mentioned temperature equalizing effect and overall heat dissipation capability.

It should be further noted that, in either of the embodiments shown in fig. 1, 3 or 4, the channel body may utilize the flow guide member 112 shown in fig. 2 to make the flow direction of the working fluid in the circuit meet the requirement.

In summary, the heat dissipation module of the present invention is formed by a multi-circuit circulation arrangement, and is filled with the corresponding working fluid so that the circuits are independent single circuits. More importantly, for these circuits independent of each other, the heat dissipation module of the present invention further combines the high temperature section and the low temperature section of the respective piping by thermal contact means. Therefore, the high-temperature section of one loop can further transfer heat to the low-temperature section of the other loop, and besides the heat dissipation path, the heat dissipation module can also provide a temperature equalization effect on the whole, so that the whole heat dissipation capacity of the heat dissipation module is effectively improved. In other words, by slowing down the temperature drop of the single loop and providing an additional heat dissipation path, the overall heat dissipation efficiency of the heat dissipation module can be improved, so as to more rapidly transfer the heat generated by the heat source of the electronic device to the external environment, thereby avoiding heat accumulation in a local part of the electronic device.

It should be noted that the above embodiments are merely for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that the technical solution described in the above embodiments may be modified or some or all of the technical features may be equivalently replaced, and these modifications or substitutions do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the present invention.

Claims

1. A multi-circuit cyclic heat dissipation module, comprising:

A first tank body;

The first pipeline is connected with the first groove body to form a first loop, the first loop is filled with a first working fluid, heat transfer is carried out through phase change, and a first high-temperature section and a first low-temperature section are formed in the first pipeline;

A second groove body, and

The second pipeline is connected with the second groove body to form a second loop, the second working fluid is filled in the second loop and is subjected to heat transfer through phase change, a second high-temperature section and a second low-temperature section are formed on the second pipeline, the first high-temperature section is in thermal contact with the second low-temperature section, the first low-temperature section is in thermal contact with the second high-temperature section, the multi-loop circulating heat dissipation module further comprises a third groove body and a third pipeline, the third pipeline is connected with the third groove body to form a third loop, the third working fluid is filled in the third loop and is subjected to heat transfer through phase change, and a third high-temperature section and a third low-temperature section are formed on the third pipeline, wherein the first high-temperature section is in thermal contact with the third low-temperature section, the first low-temperature section is in thermal contact with the second high-temperature section, and the third high-temperature section is in thermal contact with the second low-temperature section.

2. The multi-circuit circulating heat dissipation module of claim 1, wherein the flow direction of the first working fluid in the first circuit and the flow direction of the second working fluid in the second circuit are opposite to each other.

3. The multi-circuit circulating heat sink module of claim 1, wherein the first circuit and the second circuit are independent of each other and have an inner and an outer closed profile.

4. The multi-circuit circulation heat dissipation module of claim 1, wherein the first tank and the second tank are of unitary construction.

5. The multi-circuit circulation heat dissipation module according to claim 1, wherein the first, second and third tanks are of unitary construction.

6. The multi-circuit circulating heat dissipation module of claim 1, wherein the flow direction of the first working fluid in the first circuit and the flow direction of the second working fluid in the second circuit are opposite to each other, and the flow direction of the first working fluid in the first circuit and the flow direction of the third working fluid in the third circuit are opposite to each other.

7. The multi-circuit circulating heat sink module of claim 1, wherein the second circuit and the third circuit are separate from each other and are surrounded by the first circuit.

8. The multi-circuit circulation heat dissipation module according to claim 1, wherein the first, second and third tanks each have a chamber with an inlet and an outlet, and a plurality of flow guides disposed in the chamber, the plurality of flow guides tapering in profile from the inlet toward the outlet, or the plurality of flow guides forming a plurality of flow passages tapering from the inlet toward the outlet within the chamber to control the flow of the first, second and third working fluids from the inlet to the outlet, respectively.

9. The multi-circuit circulation heat removal module of claim 1, wherein the first and second tanks each have a chamber with an inlet and an outlet and a plurality of flow guides disposed within the chamber, the plurality of flow guides tapering in profile from the inlet toward the outlet or the plurality of flow guides forming a plurality of flow passages within the chamber tapering from the inlet toward the outlet to control flow of the first and second working fluids from the inlet to the outlet, respectively.