CN115274987A - light-emitting device - Google Patents

Abstract

The present invention provides a light-emitting device. The light-emitting device includes a light-emitting chip and a substrate, the bottom of the light-emitting chip is connected to the substrate, the top and the side of the light-emitting chip can emit light, the side surface of the substrate facing the light-emitting chip includes a reflective surface, and at least a part of the side of the light-emitting chip is located in the reflective surface. Above the top of the surface, the reflective surface is arranged on the periphery of the light-emitting chip; wherein a part of the light emitted from the side of the light-emitting chip can be irradiated to the reflective surface and reflected by the reflective surface. The light-emitting device provided by the present invention improves the overall light-extracting efficiency of the light-emitting device by improving its own side-part light-extracting efficiency.

Description

light emitting device

technical field

The invention relates to the technical field of LED packaging, in particular to a light emitting device.

Background technique

There are many light-emitting devices with LED light-emitting chips on the market. However, in some light-emitting devices, the light emitted by the LED light-emitting chip is relatively blocked, which leads to low overall light extraction efficiency of the light-emitting device.

Contents of the invention

The present invention aims to solve at least one of the technical problems existing in the prior art. For this reason, the present invention proposes a light emitting device with high light extraction efficiency.

A light-emitting device according to an embodiment of the present invention includes: a light-emitting chip capable of emitting light from both the top and the side; a substrate connected to the bottom of the light-emitting chip, and the surface of the substrate facing the light-emitting chip includes a reflective surface , at least a part of the side of the light-emitting chip is located above the top of the reflective surface, the reflective surface is arranged on the periphery of the light-emitting chip, and a part of the light emitted from the side of the light-emitting chip can be irradiated to the and be reflected by the reflective surface; wherein, the reflective surface is a plane; or, from the bottom end of the reflective surface to the top end of the reflective surface, the reflective surface gradually moves toward the center of the light-emitting chip Gather.

The light-emitting device according to the embodiment of the present invention has at least the following beneficial effects: Since the periphery of the light-emitting chip is not blocked by enclosing structures such as dam glue, the light emitted from the side of the light-emitting chip is less blocked, and the side of the light-emitting device The local light output is improved. Therefore, the side light extraction efficiency of the light emitting device of the present invention is higher, and the overall light extraction efficiency is also higher.

According to some embodiments of the present invention, the substrate includes an insulating part and a conductive part, the insulating part includes a mounting surface and the reflecting surface, the mounting surface is located below the light-emitting chip, and the inner surface of the reflecting surface The edge is connected to the outer edge of the installation surface; a part of the conductive part is exposed from the installation surface and is electrically connected to the bottom of the light emitting chip, and the light emitting chip receives power supply through the conductive part.

According to some embodiments of the present invention, the surface of the conductive part used to electrically connect with the light-emitting chip is a connection surface; the installation surface is lower than the connection surface, or the installation surface and the connection surface flush.

According to some embodiments of the present invention, the reflective surface is a plane, and the reflective surface, the installation surface and the connecting surface are flush with each other.

According to some embodiments of the present invention, from the bottom end of the reflective surface to the top end of the reflective surface, the reflective surface gradually gathers toward the center of the light-emitting chip; the reflective surface includes a plurality of unit surfaces, along which In the circumferential direction of the light-emitting chip, a plurality of the unit surfaces are connected end to end, and the unit surfaces are arranged as inclined surfaces.

According to some embodiments of the present invention, from the bottom end of the reflective surface to the top end of the reflective surface, the reflective surface gradually gathers toward the center of the light-emitting chip; the reflective surface includes a plurality of unit surfaces, along which In the circumferential direction of the light-emitting chip, a plurality of the unit surfaces are connected end to end, and the unit surfaces are set as curved surfaces.

According to some embodiments of the present invention, from the bottom end of the reflective surface to the top end of the reflective surface, the reflective surface gradually gathers toward the center of the light-emitting chip; the bottom edge of the reflective surface defines a first A circle, the top edge of the reflective surface defines a second circle, the first circle and the second circle are concentric circles, and the diameter of the second circle is larger than the diameter of the first circle.

According to some embodiments of the present invention, the reflective surface is configured to be convex.

According to some embodiments of the present invention, the light-emitting device includes a plurality of light-emitting chips, the substrate includes a plurality of reflective surfaces, and each reflective surface is respectively arranged on the periphery of one of the light-emitting chips, adjacent to each other. The reflective surfaces are arranged at intervals.

According to some embodiments of the present invention, encapsulating glue is also included, the encapsulating glue can transmit light, the encapsulating glue is connected to the side of the substrate facing the light-emitting chip and wraps the light-emitting chip, and the encapsulating glue covers the reflective surface.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

The present invention will be further described below in conjunction with accompanying drawing and embodiment, wherein:

FIG. 1 is a schematic diagram of a light-emitting device with a reflective surface set as a plane in an embodiment of the present invention;

Fig. 2 is a top view of the substrate of the light emitting device of Fig. 1;

Fig. 3 is a schematic diagram of a light emitting device with reflective surfaces gradually gathered in an embodiment of the present invention;

FIG. 4 is a top view of a substrate of the light emitting device of FIG. 3;

Fig. 5 is a cross-sectional view of the substrate of Fig. 4 along section A-A;

FIG. 6 is a schematic diagram of the light-emitting route on the side of the light-emitting chip of the light-emitting device in FIG. 3;

Figure 7 is an enlarged schematic view of the P area in Figure 6;

Fig. 8 is a schematic diagram of the comparison of the path of the target light in Fig. 7 after being reflected by the reflective surface and reflected by the plane (the reflective surface is convexly set);

9 is a partial schematic diagram of a light-emitting device in which the unit surface of the reflective surface is set as a slope or the reflective surface is set as a side of a circular truncated table in an embodiment of the present invention;

Fig. 10 is a partial schematic diagram of a light-emitting device with a concave reflective surface in an embodiment of the present invention;

Fig. 11 is a top view of a light-emitting device in which the reflective surface is set as the side of a circular frustum in an embodiment of the present invention;

Fig. 12 is a schematic diagram of a light-emitting device provided with an encapsulant in an embodiment of the present invention;

FIG. 13 is a schematic diagram of a light emitting device with multiple light emitting chips in an embodiment of the present invention.

Reference signs: 100-light-emitting device, 101-light-emitting chip, 102-insulation part, 104-conductive part, 105-connection part, 106-reflection surface, 200-substrate, 201-unit surface, 202-connection surface, 203- Mounting surface, 301-target light, 302-first circle, 303-second circle, 401-encapsulation glue.

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc. indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

In the description of the present invention, several means more than one, and multiple means more than two. Greater than, less than, exceeding, etc. are understood as not including the original number, and above, below, within, etc. are understood as including the original number. If the description of the first and second is only for the purpose of distinguishing the technical features, it cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features relation.

In the description of the present invention, unless otherwise clearly defined, words such as setting, installation, and connection should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

In the description of the present invention, reference to the terms "one embodiment," "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples" is intended to mean that the embodiments are A specific feature, structure, material, or characteristic described by or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The present invention provides a light emitting device 100. The light emitting device 100 includes a light emitting chip 101 and a substrate 200. The substrate 200 has a reflective surface 106 for reflecting light emitted from the side of the light emitting chip 101.

The light-emitting chip 101 may specifically be set as an LED chip, and the light-emitting principle and structure of the LED chip belong to the well-known technology in the art, and will not be described in detail here. Referring to FIG. 1 or FIG. 3 , the bottom of the light-emitting chip 101 is connected to the substrate 200 , and the top and sides of the light-emitting chip 101 can emit light. The light emitted from the top and side of the light emitting chip 101 will be emitted in a direction away from the light emitting chip 101 .

Referring to FIG. 1 or FIG. 3 , the surface of the substrate 200 facing the light-emitting chip 101 includes a reflective surface 106 , the side of the light-emitting chip 101 is located above the top of the reflective surface 106 , and the reflective surface 106 is disposed on the periphery of the light-emitting chip 101 . Referring to FIG. 1 , in some embodiments, the reflective surface 106 is set as a plane; referring to FIG. 1 , the reflective surface 106 is set as a plane, which specifically means that the reflective surface 106 is perpendicular to the center line L1 of the light-emitting chip 101 .

Referring to FIG. 3 , in other embodiments, from the bottom end of the reflective surface 106 to the top end of the reflective surface 106 , the reflective surface 106 gradually converges toward the center of the light-emitting chip 101 . As shown in Figure 3, L1 is the center line of the light-emitting chip 101, and the distance between one point on the reflective surface 106 and the center line is D, "From the bottom end of the reflective surface 106 to the top end of the reflective surface 106, the reflective surface 106 Gradually gathering towards the center of the light-emitting chip 101" may specifically mean that the value of D gradually decreases from the bottom end of the reflective surface 106 to the top end of the reflective surface 106 .

Part of the light emitted from the side of the light-emitting chip 101 may be irradiated onto the reflective surface 106 and be reflected by the reflective surface 106 . For example, FIG. 6 and FIG. 7 show the path of one beam of light (denoted as target light 301) emitted from the side of the light-emitting chip 101 shown in FIG. Reflective surface 106 reflects. The light emitted from the top of the light emitting chip 101 and other light emitted from the side are not fully shown in the figure.

It should be noted that the reflective surface 106 is disposed on the periphery of the light-emitting chip 101 , which may mean that the reflective surface 106 does not overlap with the light-emitting chip 101 at all along the up-down direction (for example, based on the direction shown in FIG. 3 ). Alternatively, the reflective surface 106 is disposed on the periphery of the light-emitting chip 101, which may also refer to: along the up-down direction (for example, based on the direction of FIG. 3 ), the upper or inner part of the reflective surface 106 overlaps with the light-emitting chip 101, but The lower or outer part of the reflective surface 106 does not overlap with the light-emitting chip 101 , and part of the light emitted from the side of the light-emitting chip 101 can irradiate the part of the reflective surface 106 that does not overlap with the light-emitting chip 101 .

Since the periphery of the light-emitting chip 101 is not blocked by enclosing structures such as dam glue, the light emitted from the side of the light-emitting chip 101 is less blocked, and the amount of light output from the side of the light-emitting device 100 is improved. Therefore, the side light extraction efficiency of the light emitting device 100 of the present invention is higher, and the overall light extraction efficiency is also higher. In addition, since the light emitting device 100 of the present invention mainly improves the light output efficiency at the side, the light emitting device 100 of the present invention is especially suitable for thinner light emitting devices.

Referring to FIG. 1 or FIG. 5 , the substrate 200 includes an insulating part 102 and a conductive part 104 , the insulating part 102 is made of an insulating material, and the conductive part 104 is made of metal or other conductive materials. Referring to FIG. 1 and FIG. 2 , the surface of the insulating portion 102 facing the light-emitting chip 101 includes a mounting surface 203 and a reflective surface 106 , and the inner edge of the reflective surface 106 is connected to the outer edge of the mounting surface 203 . The conductive part 104 is connected to the insulating part 102, the mounting surface 203 is located below the light-emitting chip 101, a part of the conductive part 104 is exposed on the mounting surface 203, and the part of the conductive part 104 exposed on the mounting surface 203 is electrically connected to the bottom of the light-emitting chip 101 . For example, with reference to FIG. 1 and FIG. 2, the light-emitting chip 101 includes a connection portion 105, the connection portion 105 is located at the bottom of the light-emitting chip 101, the connection portion 105 can be a pin or a contact of the light-emitting chip 101, and the connection portion 105 is directly connected to the conductive portion 104. Contact, or, the connection part 105 and the conductive part 104 are bonded by conductive glue, so as to realize the electrical connection between the connection part 105 and the conductive part 104 .

The extension part of the conductive part 104 can be connected to a power source (power source not shown), and when the substrate 200 is connected to a power source, the electric energy provided by the power source can be delivered to the light-emitting chip 101 through the conductive part 104 . More specifically, as shown in FIG. 3 , the light emitting chip 101 may include two connecting parts 105, one light emitting chip 101 is correspondingly provided with two conductive parts 104, and each connecting part 105 is electrically connected to one conductive part 104 respectively, wherein One connection part 105 serves as a positive terminal of the light emitting chip 101 , and the other connection part 105 serves as a negative terminal of the light emitting chip 101 . It should be noted that the conductive part 104 can be entirely printed on the surface of the insulating part 102 , or the part of the conductive part 104 outside the mounting surface 203 can be buried inside the insulating part 102 .

The surface of the conductive part 104 used to electrically connect with the light-emitting chip 101 is the connection surface 202. Since the conductive part 104 is used to support the light-emitting chip 101, the mounting surface 203 can be set not higher than the connection surface 202, so that the light-emitting chip 101 can be installed as a whole. At a higher position, the height difference between the side of the light-emitting chip 101 and the insulating portion 102 is increased, thereby increasing the irradiation area of the side light of the light-emitting device 100 . As shown in FIG. 5 , in some embodiments, the mounting surface 203 may be flush with the connecting surface 202 . Or, in some other embodiments, the installation surface 203 may be higher than the connection surface 202 . In addition, when the reflective surface 106 is set as a plane, the reflective surface 106 , the installation surface 203 and the connection surface 202 may be flush, so as to reduce the manufacturing difficulty of the substrate 200 .

The configuration of the reflective surface 106 gradually converging toward the center of the light-emitting chip 101 from the bottom end to the top will be described in detail below. Wherein, compared with the reflective surface 106 arranged as a plane, after the reflective surface 106 gradually converges to reflect the light, the light emitted from the side of the light emitting device 100 can illuminate a larger range. As shown in Figure 8, when target ray 301 is reflected by reflective surface 106, its path is B-D-E; The route of 301 is B-C-F. It can be seen from FIG. 8 that when the target light 301 is reflected by the reflective surface 106, the position where the target light 301 is finally irradiated is lower, and the target light 301 can irradiate a lower space or area, thereby increasing the size of the side of the light emitting device 100. The range of the emitted light. If a plane is used for reflection, the target light 301 is reflected and finally irradiated at a relatively upper position, and cannot irradiate the space or area near the substrate 200 .

Referring to FIG. 4 and FIG. 9 , in some embodiments, the reflective surface 106 includes a plurality of unit surfaces 201 , the unit surfaces 201 are arranged as inclined surfaces, and the plurality of unit surfaces 201 are connected end to end along the circumferential direction of the light emitting chip 101 . For example, as shown in FIG. 4 , the reflective surface 106 includes four unit surfaces 201 , and the four unit surfaces 201 are respectively located on the front, rear, left and right sides of the light emitting chip 101 . If the unit surface 201 is set as an inclined plane, two points are arbitrarily selected on the same unit surface 201, and the normals of the unit surface 201 are drawn at the positions of the two points, and the two normal lines will be parallel to each other. In addition, it should be noted that, viewed from a top view, the light-emitting chip 101 can be arranged as a square, a rectangle, a circle, or other polygons; The direction is the reference), the direction around the light-emitting chip 101, and the "circumferential direction" does not strictly limit the light-emitting chip 101 to be circular.

Similarly, in some embodiments, the reflective surface 106 includes a plurality of unit surfaces 201 , the unit surfaces 201 are arranged as curved surfaces, and the plurality of unit surfaces 201 are connected end to end along the circumferential direction of the light emitting chip 101 . For example, as shown in FIG. 4, the reflective surface 106 includes four units, and the four unit surfaces 201 are respectively located on the front, back, left and right sides of the light-emitting chip 101, and the shape of the unit surfaces 201 can be set as shown in FIG. The convex shape or the concave shape shown in Figure 10.

Alternatively, referring to FIG. 11 , in some embodiments, the shape of the reflective surface 106 is the side of a truncated cone. As shown in Figure 11, the lower edge of the reflective surface 106 defines a first circle 302, the upper edge of the reflective surface 106 defines a second circle 303, the first circle 302 and the second circle 303 are concentric circles, and the first circle 302 The diameter of is greater than the diameter of the second circle 303 .

The reflective surface 106 can be convex. Compared with a concave reflective surface or a reflective surface whose unit surface is sloped, the convex reflective surface 106 can further increase the irradiation range of the light emitted from the side of the light emitting device 100 . For example, comparing FIG. 7 and FIG. 10, or comparing FIG. 7 and FIG. 9, the reflective surface 106 (reflective surface 106 shown in FIG. 7) that is convexly arranged can make the final irradiation position of the target light 301 lower, so that the light can The light is irradiated to the vicinity of the surface of the substrate 200 facing the light-emitting chip 101 .

Here, the "inner concave" and "outer convexity" of the reflective surface 106 are described. On the reflective surface 106, multiple points are taken from the inside to the outside or from top to bottom, and the reflective surface 106 is made at the position of each point. along the direction gradually away from the light-emitting chip 101, the angle between the normal and the side of the light-emitting chip 101 gradually becomes smaller, and the reflective surface 106 is concave. Conversely, along the direction away from the light-emitting chip 101 , the angle between the normal line and the side of the light-emitting chip 101 gradually increases, and the reflective surface 106 is concave.

For example, with reference to Fig. 10, get K, M, N three points from inside to outside on reflective surface 106, and make the normal line L3, L4, L5 of reflective surface 106 at these three points respectively; In the setting mode, the angle between L3 and the right side of the light-emitting chip 101 is larger than the angle between L4 and the right side of the light-emitting chip 101, and the angle between L4 and the right side of the light-emitting chip 101 is larger than L5 The angle between it and the right side of the light-emitting chip 101. Conversely, if the reflective surface 106 is convex, the angle between L3 and the right side of the light-emitting chip 101 is smaller than the angle between L4 and the right side of the light-emitting chip 101, and the angle between L4 and the light-emitting chip 101 The angle between the right sides of L5 and the right side of the light-emitting chip 101 is smaller than the angle between L5 and the right side of the light-emitting chip 101 .

13, in order to improve the brightness of the light emitting device 100, the light emitting device 100 may include a plurality of light emitting chips 101, correspondingly, the substrate 200 may include a plurality of reflective surfaces 106, and each reflective surface 106 is respectively arranged on the periphery of a light emitting chip 101 In the case that the bottom end to the top end of the reflective surfaces 106 gradually converge toward the center of the light-emitting chip 101 , adjacent reflective surfaces 106 are arranged at intervals.

Referring to FIG. 12 , in some embodiments, the light-emitting device 100 further includes an encapsulant 401 that can transmit light, and the encapsulant 401 is connected to the side of the substrate 200 facing the light-emitting chip 101 and wraps the light-emitting chip 101 . The encapsulation glue 401 has a certain protective effect on the light-emitting chip 101 and prevents water and dust from damaging the light-emitting chip 101 . In addition, as shown in FIG. 12 , in order to reduce the difficulty of dispensing the packaging glue 401 , the packaging glue 401 may also cover the reflective surface 106 .

The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned embodiments. Within the scope of knowledge of those skilled in the art, various modifications can be made without departing from the spirit of the present invention. Variety. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other if there is no conflict.

Claims (10)

1. A light emitting device, characterized in that it comprises: Light-emitting chips, both top and side can emit light; The substrate is connected to the bottom of the light-emitting chip, the surface of the substrate facing the light-emitting chip includes a reflective surface, the side of the light-emitting chip is located above the top of the reflective surface, and the reflective surface is arranged on the The periphery of the light-emitting chip, part of the light emitted from the side of the light-emitting chip can be irradiated to the reflective surface and reflected by the reflective surface; Wherein, the reflective surface is a plane; or, from the bottom end of the reflective surface to the top end of the reflective surface, the reflective surface gradually gathers toward the center of the light-emitting chip. 2. The light-emitting device according to claim 1, wherein the substrate includes an insulating part and a conductive part, the insulating part includes a mounting surface and the reflecting surface, and the mounting surface is located below the light-emitting chip , and the inner edge of the reflective surface is connected to the outer edge of the installation surface; A part of the conductive part is exposed from the mounting surface and electrically connected to the bottom of the light-emitting chip, and the light-emitting chip receives power from a power source through the conductive part. 3. The light-emitting device according to claim 2, characterized in that, the surface of the conductive part used to electrically connect with the light-emitting chip is a connection surface; The installation surface is lower than the connection surface, or the installation surface is flush with the connection surface. 4 . The light emitting device according to claim 3 , wherein the reflective surface is a plane, and the reflective surface, the installation surface and the connecting surface are flush with each other. 5. The light-emitting device according to claim 1, characterized in that, from the bottom end of the reflective surface to the top end of the reflective surface, the reflective surface gradually gathers toward the center of the light-emitting chip; The reflective surface includes a plurality of unit surfaces, and the plurality of unit surfaces are connected end to end along the circumferential direction of the light-emitting chip, and the unit surfaces are arranged as inclined surfaces. 6. The light-emitting device according to claim 1, characterized in that, from the bottom end of the reflective surface to the top end of the reflective surface, the reflective surface gradually gathers toward the center of the light-emitting chip; The reflective surface includes a plurality of unit surfaces, and the plurality of unit surfaces are connected end to end along the circumferential direction of the light-emitting chip, and the unit surfaces are configured as curved surfaces. 7. The light-emitting device according to claim 1, characterized in that, from the bottom end of the reflective surface to the top end of the reflective surface, the reflective surface gradually gathers toward the center of the light-emitting chip; The bottom edge of the reflective surface defines a first circle, the top edge of the reflective surface defines a second circle, the first circle and the second circle are concentric circles, and the diameter of the second circle is greater than the diameter of the first circle. 8. The light emitting device according to claim 6 or 7, characterized in that, the reflective surface is convexly arranged. 9. The light-emitting device according to claim 1, wherein the light-emitting device comprises a plurality of light-emitting chips, the substrate comprises a plurality of reflective surfaces, and each reflective surface is respectively arranged on one of the said reflective surfaces. On the periphery of the light-emitting chip, the adjacent reflective surfaces are arranged at intervals. 10. The light-emitting device according to claim 1, further comprising encapsulation adhesive, which can transmit light, and the encapsulation adhesive is connected to the side of the substrate facing the light-emitting chip and wraps the For a light-emitting chip, the encapsulation glue covers the reflective surface.

Images