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CN115366085B - Multi-mode shape memory alloy software driver with quick response - Google Patents

Multi-mode shape memory alloy software driver with quick response

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Publication number
CN115366085B
CN115366085B CN202210943487.1A CN202210943487A CN115366085B CN 115366085 B CN115366085 B CN 115366085B CN 202210943487 A CN202210943487 A CN 202210943487A CN 115366085 B CN115366085 B CN 115366085B
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China
Prior art keywords
shape memory
memory alloy
wrapping layer
alloy wire
driver
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Chinese (zh)
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CN115366085A (en
Inventor
易思成
陈豪
张泉
江展
徐良
李龙
岳涛
彭艳
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University of Shanghai for Science and Technology
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University of Shanghai for Science and Technology
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Priority to CN202210943487.1A priority Critical patent/CN115366085B/en
Publication of CN115366085A publication Critical patent/CN115366085A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/10Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/1085Programme-controlled manipulators characterised by positioning means for manipulator elements positioning by means of shape-memory materials

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Micromachines (AREA)

Abstract

本发明涉及一种快速响应的多模态形状记忆合金软体驱动器,包括凝胶包裹层、驱动模块、柔性包裹层,其中驱动模块封装在凝胶包裹层内部,柔性包裹层粘附于凝胶包裹层底端。驱动模块包括固定板、弹性基板、导热绝缘薄膜、形状记忆合金丝。固定板共四块,分别设置在弹性基板上下表面的两端,每块固定板上设有两个定位孔。形状记忆合金丝约束在两个定位孔之间,在同一水平面内整体呈X型排布,导热绝缘薄膜裹覆在形状记忆合金丝表面。本发明基于形状记忆效应,可以实现驱动器的弯曲、扭转以及弯扭组合模态运动,并通过水凝胶蒸发脱水的形式加速驱动器散热,具有驱动效率高、制造成本低、运动形式多样等特点,适用于软体机械手、柔性制造等领域。

The present invention relates to a fast-response multi-modal shape memory alloy soft driver, comprising a gel wrapping layer, a driving module, and a flexible wrapping layer, wherein the driving module is encapsulated inside the gel wrapping layer, and the flexible wrapping layer is adhered to the bottom end of the gel wrapping layer. The driving module comprises a fixed plate, an elastic substrate, a heat-conducting insulating film, and a shape memory alloy wire. There are four fixed plates, which are respectively arranged at the two ends of the upper and lower surfaces of the elastic substrate, and each fixed plate is provided with two positioning holes. The shape memory alloy wire is constrained between the two positioning holes and arranged in an X-shape as a whole in the same horizontal plane, and the heat-conducting insulating film is wrapped around the surface of the shape memory alloy wire. Based on the shape memory effect, the present invention can realize the bending, torsion and bending-torsion combined modal motion of the driver, and accelerate the heat dissipation of the driver through the evaporation and dehydration of hydrogel. It has the characteristics of high driving efficiency, low manufacturing cost, and various motion forms. It is suitable for soft manipulators, flexible manufacturing and other fields.

Description

Multi-mode shape memory alloy software driver with quick response
Technical Field
The invention relates to the fields of soft manipulator, flexible manufacturing, space exploration and the like, in particular to a multi-mode shape memory alloy soft driver with quick response.
Background
The traditional rigid robot has wide application in the fields of industrial production, medical service, military reconnaissance and the like, but is limited to factors such as poor environmental adaptability, large noise, poor biocompatibility and the like, and is difficult to apply to special conditions such as fragile object grabbing, narrow space operation and the like. In recent years, with the development of novel intelligent materials, soft robots are widely focused and researched, the soft robots are processed by adopting flexible materials with stable performance, can continuously deform, theoretically have infinite degrees of freedom, can maintain high integrity and stability under extreme and complex conditions, and meanwhile, the defects of rigid robots are overcome by the good biocompatibility and flexibility of the soft robots.
Shape memory alloys, which are one of the intelligent materials developed in recent years, have many excellent properties, including superelasticity, shape memory effect, high damping, and the like, and can simultaneously generate certain expansion and contraction deformation. Based on the above properties, the shape memory alloy is widely applied to the field of soft drivers, and the soft driver made of the shape memory alloy can integrate driving and structure and has the advantages of high energy density, large load-to-weight ratio and the like. In addition, while the soft driver is capable of producing a variety of motion types, including linear motion, bending motion, torsional motion, etc., the soft drivers studied at present are less capable of achieving a variety of motion states.
The patent technology of the patent CN11991184A discloses a variable-rigidity soft pneumatic rehabilitation hand, and the cavity is inflated and pressurized by using an air pump, so that the driving of the palm is realized. However, the air pressure source required for pressurization requires an external air pump, which adds to the complexity of the system to some extent, limiting the scope of application of the technology.
The patent technology of the patent CN111264948A discloses a soft rehabilitation glove based on shape memory alloy driving, which mainly generates driving force by electrifying and/or stopping electrifying shape memory alloy wires at different positions, thereby realizing bending and side swinging of different joints. However, the heat dissipation problem of the shape memory alloy wires is not considered, so that the response speed of the soft rehabilitation glove is poor.
The patent technology of the patent CN108622352A discloses an autonomous underwater vehicle submerged device based on a shape memory alloy driver, wherein a piston is driven to move mainly through a shape memory alloy spring, and the driver can only output one-dimensional linear movement, the movement form is single, and the application range of the driver is limited.
The patent technology of the patent CN113459077A discloses a shape memory alloy soft driver, which mainly realizes the cooling of a shape memory alloy wire through a flexible substrate and a heat dissipation coating, thereby improving the response speed of the driver. First, the flexible substrate is mostly made of high molecular polymers such as silicone rubber, which has poor heat dissipation performance, even if a heat conductive filler is added, the heat conductive performance is always limited. The water content of the poly (N-isopropyl acrylamide) hydrogel reaches more than 90% in a swelling mode, the water has great latent heat which is far higher than that of a common phase change material, when the hydrogel is heated, the water in the hydrogel is evaporated to take away a large amount of heat, and the hydrogel can absorb the scattered water from the air during cooling, so that the hydrogel has remarkable stability and high cooling performance, and is relatively high in a flexible substrate composed of high polymer, a gel wrapping layer composed of the poly (N-isopropyl acrylamide) hydrogel is more excellent in cooling performance, and the volume shrinkage is caused by water scattering in the evaporation and heat dissipation process, and the flexible wrapping layer with different thermal response performances can generate bending force through adhesion, so that driving force is provided for a driver. Secondly, the shape memory alloy soft driver provided by the patent can only output bending motion, has single motion form and limits the application range of the driver. Finally, the patent uses 5V voltage to activate the shape memory alloy wire, and compared with pulse activation, the driving time is longer, and the generated heat is more.
Disclosure of Invention
The invention provides a quick-response multi-mode shape memory alloy soft driver, which aims to solve the technical problems, improve the problems of low response speed, insufficient driving force, single movement form and the like of the shape memory alloy driver, realize multi-mode movement of the driver and provide a brand new idea for designing the shape memory alloy soft driver.
The aim of the invention is achieved by the following technical scheme:
A multi-mode shape memory alloy soft driver with quick response comprises a gel wrapping layer, a driving module and a flexible wrapping layer, wherein the driving module is packaged in the gel wrapping layer, and the flexible wrapping layer is adhered to the bottom end of the gel wrapping layer.
The driving module comprises a fixing plate, an elastic substrate, a heat-conducting insulating film and shape memory alloy wires, wherein the elastic substrate is arranged on the middle position surface of the driving module, the four fixing plates are respectively arranged at two ends of the upper surface and the lower surface of the elastic substrate and fixedly connected through bonding, two positioning holes are formed in each fixing plate, the positioning holes are located on the middle position surface of the fixing plate, the shape memory alloy wires are connected to the positioning holes of the other fixing plate along the length of the elastic substrate and penetrate through the distance between the two positioning holes, the shape memory alloy wires are integrally distributed in an X shape in the same horizontal plane, and the heat-conducting insulating film is wrapped on the surface of the shape memory alloy wires.
The number of the shape memory alloy wires is four, the eccentricity ratio of each shape memory alloy wire to the elastic substrate is the same, the first shape memory alloy wire is fixedly arranged between the first positioning hole and the third positioning hole, the second shape memory alloy wire is fixedly arranged between the second positioning hole and the fourth positioning hole, the third shape memory alloy wire is fixedly arranged between the fifth positioning hole and the seventh positioning hole, and the fourth shape memory alloy wire is fixedly arranged between the sixth positioning hole and the eighth positioning hole.
The surface of the gel wrapping layer is provided with grid grooves, so that the surface roughness is effectively increased.
Preferably, the material of the gel wrapping layer is poly (N-isopropyl acrylamide) hydrogel with high heat dissipation ratio, soft texture and good thermal response performance.
Preferably, the material of the flexible wrapping layer is silica gel with soft texture and good mechanical property.
Preferably, the material of the fixing plate is a printed circuit board.
Preferably, the material of the elastic substrate is polyvinyl chloride plate.
Preferably, the heat conducting and insulating film has good flexibility, high electrical insulation property and high heat conductivity, and the material of the heat conducting and insulating film is a fluorinated graphene film.
The multi-mode driving of the soft driver can be realized by carrying out on-off operation on the shape memory alloy wires at different positions to enable the shape memory alloy wires to generate phase change and driving force, when the first shape memory alloy wire and the second shape memory alloy wire are electrified, the temperature of the first shape memory alloy wire and the second shape memory alloy wire are increased, the length of the first shape memory alloy wire is contracted and deformation force is generated, the torque of the deformation force counteracts each other, the generated bending moment enables the driver to bend towards the top surface, when the third shape memory alloy wire and the fourth shape memory alloy wire are electrified, the torque of the deformation force counteracts each other, when the first shape memory alloy wire, the fourth shape memory alloy wire or the second shape memory alloy wire and the third shape memory alloy wire are electrified, the driver carries out torsion movement under the torque of the deformation force, when the single shape memory alloy wire is electrified, the driver carries out bending and twisting combined movement under the combined action of the bending force of the bending moment of the bending force, when the third shape memory alloy wire and the fourth shape memory alloy wire are electrified, the temperature of the shape memory alloy wire is reduced, the deformation force disappears, and the driver gradually returns to an initial state. In addition, since the elastic substrate has certain elasticity, a certain restoring force can be provided in the cooling process, and the transition of the driver from other states to the initial state is accelerated.
The soft driver is powered on and heated by millisecond-level electric pulse, one part of energy is converted into internal energy and phase change latent heat of the shape memory alloy wire in the heating process, the other part of energy is dissipated through heat exchange with the environment, and the driver is powered on and heated by rapid pulse heating, namely, the electric pulse is generated within the millisecond range by using a given power supply voltage, so that the shape memory alloy wire can rapidly reach the phase change temperature and start driving, the energy dissipated by heat exchange with the environment is reduced, and the response speed of the driver is improved while the energy is saved.
When the shape memory alloy wire is electrified and heated, one part of energy is converted into the internal energy and the phase change latent heat of the shape memory alloy wire, the other part of energy is dissipated through heat exchange with the gel wrapping layer, the temperature of the gel wrapping layer is rapidly increased through the heat exchange, when the temperature exceeds the critical dissolution temperature, the gel wrapping layer releases free water outwards in an evaporation mode and takes away a large amount of heat, the cooling speed of the shape memory alloy wire can be effectively improved, and the response speed of a driver is further improved. In the evaporation dehydration process, the volume of the gel coating layer suddenly changes due to water loss, the volume of the flexible coating layer is relatively unchanged, the driver is bent and deformed to one side due to the difference of the volume changes of the upper coating layer and the lower coating layer, and the response speed is further improved and the deformation degree of the driver is increased on the basis of driving the shape memory alloy wire. When the driver stops working, the gel wrapping layer can supplement the evaporated and lost moisture from the surrounding air, so that the driver is restored to the initial state.
Compared with the prior art, the invention has the following beneficial effects:
1. The invention is a soft driver, integrates driving and structure, has compact structure, no noise in driving, strong environmental adaptability and good biocompatibility.
2. The invention adopts the shape memory alloy as the driving element, and has high energy density, large output force and large load-weight ratio.
3. The invention can realize multi-mode driving, including bending, torsion and bending-torsion combination, and expands the application range of the driver.
4. The invention adopts hydrogel as the gel coating layer, has soft texture and stable performance, can realize efficient evaporation and heat dissipation, can absorb the dissipated moisture from the surrounding air, greatly improves the cooling speed of the shape memory alloy, and further improves the response speed of the driver. When evaporating and radiating, the water loss leads to the gel wrapping layer volume to reduce, because the flexible wrapping layer volume of bottom adhesion is unchangeable relatively, and the volume variation difference of two wrapping layers leads to the driver to produce crooked to one side, consequently, the gel wrapping layer can also provide certain driving force for the driver.
5. According to the invention, the fluorinated graphene film is used as the heat conduction insulating film, has high electrical insulation property and high heat conductivity, and is wrapped on the surface of the shape memory alloy wire, so that the heat dissipation of the shape memory alloy wire can be accelerated on the premise of ensuring the use safety, and the response speed of the driver is further improved.
6. The invention has low manufacturing cost, simple manufacturing process and convenient production and application.
Drawings
Other features, objects and advantages of the present invention will become more apparent upon reading of the detailed description of non-limiting embodiments, given with reference to the accompanying drawings in which:
FIG. 1 is an initial state diagram of a multi-modal shape memory alloy software driver in accordance with the present invention.
FIG. 2 is a diagram of the wrapping layer of the multi-modal shape memory alloy software driver of the present invention.
FIG. 3 is a diagram of a driving module of the multi-modal shape memory alloy software driver according to the present invention.
FIG. 4 is a side view of a drive module of the multi-modal shape memory alloy software driver of the present invention.
FIG. 5 is a flow chart of the fabrication of the multi-modal shape memory alloy software driver of the present invention.
FIG. 6 is a diagram of a mold frame for a multi-modal shape memory alloy software driver in accordance with the present invention.
FIG. 7 is a top bending state diagram of a multi-modal shape memory alloy software driver of the present invention.
FIG. 8 is a bottom bending state diagram of a multi-modal shape memory alloy software driver of the present invention.
FIG. 9 is a torsional state diagram of a multi-modal shape memory alloy software driver of the present invention.
FIG. 10 is a diagram showing the bending and twisting combination of the multi-modal shape memory alloy software driver according to the present invention.
The figure shows a 1-gel wrap, a 2-drive module, a 3-flexible wrap, a 21-mounting plate, 211-locating holes, 2111-locating holes one, 2112-locating holes two, 2113-locating holes three, 2114-locating holes four, 2115-locating holes five, 2116-locating holes six, 2117-locating Kong Qi, 2118-locating holes eight, 22-elastic substrate, 23-thermally conductive insulating film, 24-shape memory alloy wire, 241-shape memory alloy wire one, 242-shape memory alloy wire two, 243-shape memory alloy wire three, 244-shape memory alloy wire four.
Detailed Description
The present application will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the present application, but are not intended to limit the application in any way. It should be noted that variations and modifications could be made by those skilled in the art without departing from the inventive concept. These are all within the scope of the present application. In the description of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
The shape memory alloy software driver and the method of manufacturing the same of the present invention are described below with reference to the accompanying drawings.
Example 1
Referring to fig. 1, the multi-mode shape memory alloy soft driver with quick response comprises a gel wrapping layer 1, a driving module 2 and a flexible wrapping layer 3, wherein the driving module 2 is packaged inside the gel wrapping layer 1, and the flexible wrapping layer 3 is adhered to the bottom end of the gel wrapping layer 1.
The driving module 2 comprises a fixing plate 21, an elastic substrate 22, a heat conducting insulating film 23 and shape memory alloy wires 24, wherein the elastic substrate 22 is arranged on the middle position surface of the driving module 2, the four fixing plates 21 are respectively arranged at two ends of the upper surface and the lower surface of the elastic substrate 22 and fixedly connected through bonding, two positioning holes 211 are formed in each fixing plate 21, the positioning holes 211 are located on the middle position surface of the fixing plate 21, the shape memory alloy wires 24 are connected to the positioning holes 211 of the other fixing plate 21 along the length of the elastic substrate 22 and penetrating through the distance between the two positioning holes 211, and are integrally arranged in an X shape in the same horizontal plane, and the heat conducting insulating film 23 is wrapped on the surface of the shape memory alloy wires 24.
The shape memory alloy soft driver is suitable for the fields of soft manipulators, flexible manufacturing and the like, can realize bending, torsion and bending-torsion combined modal movement of the driver, accelerates heat dissipation of the driver in a hydrogel evaporation and dehydration mode, and has the characteristics of high driving efficiency, low manufacturing cost, various movement modes and the like.
Example two
Referring to fig. 1 and 2, in the above embodiment, the material of the gel wrapping layer 1 is a poly (N-isopropyl acrylamide) hydrogel with high heat dissipation ratio, soft texture and good thermal response performance.
The flexible wrapping layer 3 is made of silica gel with soft texture and good mechanical property.
The material of the fixing plate 21 is a printed circuit board.
The elastic substrate 22 is made of polyvinyl chloride plate.
The heat conducting insulating film 23 has good flexibility and high electrical insulation and high heat conductivity, and the material of the heat conducting insulating film 23 is a fluorinated graphene film.
The soft driver is powered on and heated by adopting millisecond-level electric pulse, one part of energy is converted into internal energy and phase change latent heat of the shape memory alloy wire 24 in the heating process of the shape memory alloy wire 24, the other part of energy is dissipated through heat exchange with the environment, and the driver is powered on and heated by virtue of rapid pulse heating, namely, the electric pulse is generated within the millisecond range by using a given power supply voltage, so that the shape memory alloy wire 24 can rapidly reach the phase change temperature and start driving, the energy dissipated by heat exchange with the environment is reduced, and the response speed of the driver is improved while energy is saved.
When the shape memory alloy soft driver is used, millisecond-level electric pulses are adopted to electrify and heat the soft driver, so that the response speed of the driver is increased, the energy utilization rate is improved, and the generation of redundant heat is reduced. In the process of electrifying and heating, accumulated heat is dissipated outwards through the gel wrapping layer, the poly (N-isopropyl acrylamide) hydrogel is adopted as the gel wrapping layer, free water is released outwards in an evaporation mode, a large amount of heat is taken away, the cooling speed of the shape memory alloy wire can be effectively improved, and the response speed of the driver is further improved.
Example III
A multi-mode shape memory alloy soft driver with quick response is shown in fig. 1, and comprises a gel wrapping layer 1, a driving module 2 and a flexible wrapping layer 3, wherein the driving module 2 is packaged inside the gel wrapping layer 1, and the flexible wrapping layer 3 is adhered to the bottom end of the gel wrapping layer 1.
The driving module 2 comprises a fixing plate 21, an elastic substrate 22, a heat conducting insulating film 23 and shape memory alloy wires 24, wherein the elastic substrate 22 is arranged on the middle position surface of the driving module 2, the four fixing plates 21 are respectively arranged at two ends of the upper surface and the lower surface of the elastic substrate 22 and fixedly connected through bonding, two positioning holes 211 are formed in each fixing plate 21, the positioning holes 211 are located on the middle position surface of the fixing plate 21, the shape memory alloy wires 24 are connected to the positioning holes 211 of the other fixing plate 21 along the length of the elastic substrate 22 and penetrating through the distance between the two positioning holes 211, and are integrally arranged in an X shape in the same horizontal plane, and the heat conducting insulating film 23 is wrapped on the surface of the shape memory alloy wires 24.
Referring to fig. 2, the material of the gel coating layer 1 may be poly (N-isopropyl acrylamide) hydrogel with high heat dissipation ratio, soft texture and good thermal response performance, or may be other gel materials with good mechanical properties, good stability, soft texture, excellent thermal response performance and high heat dissipation ratio, and the surface of the gel coating layer 1 is provided with grid grooves, so that the surface roughness of the driver can be effectively increased, and favorable conditions are provided for the application of the driver in the aspects of soft mobile robots, flexible grasping and the like.
The flexible wrapping layer 3 is soft in texture, good in mechanical property and good in stability, and the material of the flexible wrapping layer 3 can be silica gel or other suitable materials.
The fixing plate 21 is used for restraining the shape memory alloy wire 24, and the material of the fixing plate 21 is a printed circuit board, or may be a material meeting the conditions, such as an acrylic plate.
The elastic substrate 22 has a certain elasticity, and can provide a restoring force when the shape memory alloy wire 24 is cooled, and the material of the elastic substrate 22 can be a polyvinyl chloride plate, or any other suitable material.
The heat conducting insulating film 23 has good flexibility and high electrical insulation and high heat conductivity, and the material of the heat conducting insulating film 23 can be a fluorinated graphene film or other flexible film materials with good heat conducting performance and insulation.
Referring to fig. 3 and 4, the number of the shape memory alloy wires 24 is four, the eccentricity of each shape memory alloy wire 24 to the elastic substrate 22 is the same, the first shape memory alloy wire 241 is fixedly arranged between the first positioning hole 2111 and the third positioning hole 2113, the second shape memory alloy wire 242 is fixedly arranged between the second positioning hole 2112 and the fourth positioning hole 2114, the third shape memory alloy wire 243 is fixedly arranged between the fifth positioning hole 2115 and the seventh positioning hole 2117, and the fourth shape memory alloy wire 244 is fixedly arranged between the sixth positioning hole 2116 and the eighth positioning hole 2118.
Referring to fig. 5, the manufacturing process of a fast-responding multi-modal shape memory alloy software driver can be divided into five parts.
First, four fixing plates 21 of the same size are bonded to both ends of the upper and lower surfaces of the elastic substrate 22.
Secondly, the shape memory alloy wires 24 are arranged, the shape memory alloy wires 24 are connected to the positioning holes 211 of the other fixing plate 21 along the length of the elastic base plate 22 and passing through the distance between the two positioning holes 211 from one positioning hole 211 of the fixing plate 21, the shape memory alloy wires 24 are integrally arranged in an X shape in the same horizontal plane, and the single shape memory alloy wire 24 is fixedly restrained at two ends of the positioning hole 211.
Again, the finished drive module 2 was placed in a mold as shown in fig. 6, and the mixed solution of N-isopropylacrylamide was added to the mold until the drive module 2 was completely immersed, and left standing at room temperature for a while waiting for the formation of the gel coat layer 1.
From time to time, the silica gel liquid which is fully stirred and subjected to air suction bubble treatment in a vacuum box is poured into a mould, and the silica gel is waited for solidification at room temperature to form the flexible wrapping layer 3.
Finally, demoulding is carried out, and the required multi-mode shape memory alloy soft driver can be obtained after demoulding treatment.
The different driving states of the software driver are described below with reference to fig. 7-10.
When the multi-mode shape memory alloy soft driver is used, current is introduced into shape memory alloy wires 24 at different positions, the temperature of the shape memory alloy wires 24 is changed, the shape memory alloy wires 24 are subjected to phase change to generate corresponding driving force, and the generated driving force drives an elastic substrate 22 adhered to the middle surface of the fixed plate 21 to generate deformation motion under the limitation of the fixed plate 21 due to the fact that the shape memory alloy wires 24 are restrained between the fixed plate 21 through positioning holes 211, so that the multi-mode driving of the soft driver is realized; when the first shape memory alloy wire 241 and the second shape memory alloy wire 242 are electrified, a great amount of joule heat is generated by the first shape memory alloy wire 241 and the second shape memory alloy wire 242, the inner parts are gradually transformed from martensite phase to austenite phase, the length is contracted and deformation force is generated, the torque of the deformation force is mutually counteracted, the generated bending moment enables the driver to bend towards the top surface to be in a state shown in fig. 7, when the third shape memory alloy wire 243 and the fourth shape memory alloy wire 244 are electrified, the inner parts are gradually transformed from martensite phase to austenite phase, the length is contracted and deformation force is generated, the torque of the deformation force is mutually counteracted, the generated bending moment enables the driver to bend towards the bottom surface to be in a state shown in fig. 8, and when the first shape memory alloy wire 241 and the fourth shape memory alloy wire 244 or the second shape memory alloy wire 242 and the third shape memory alloy wire 243 are electrified, the generated bending moment of the deformation force is mutually counteracted, and the driver is in a torsion motion under the action of the deformation force torque to be in a state shown in fig. 9. When the single shape memory alloy wire 24 is electrified, the driver makes bending and twisting combined motion under the combined action of the bending moment and the torque of the deformation force to present the state shown in fig. 10, the heating of the shape memory alloy wire 24 is stopped, the inside of the shape memory alloy wire 24 gradually returns from an austenite phase to a martensite phase in the cooling process, the length of the shape memory alloy wire 24 returns to the initial state, the deformation force generated by heating disappears, the driver gradually returns to the initial state, and in addition, due to the certain elasticity of the elastic substrate 22, certain restoring force can be provided in the cooling process, the transition of the driver from other states to the initial state is accelerated, and finally the state shown in fig. 1 is presented.
The multi-mode shape memory alloy soft driver adopts millisecond electric pulse to carry out electrifying heating, one part of energy is converted into internal energy and phase change latent heat of the shape memory alloy wire 24 in the heating process, the other part of energy is dissipated through heat exchange with the environment, and the rapid pulse heating, namely the electric pulse generated by utilizing a given power supply voltage in a millisecond range is used for electrifying and heating the driver, so that the shape memory alloy wire 24 can rapidly reach the phase change temperature and start driving, the energy dissipated by heat exchange with the environment is reduced, and the driving speed of the driver is improved while saving energy. Specifically, the voltage and duty cycle of the electrical pulse signal are determined according to the phase transition temperature of the shape memory alloy wire 24 and the output force of the driver.
In addition, when the shape memory alloy wire 24 is electrified and heated, a part of energy is converted into the internal energy and the phase change latent heat of the shape memory alloy wire 24, and the other part of energy is dissipated through heat exchange with the gel wrapping layer 1, so that the temperature of the gel wrapping layer 1 rises sharply, and when the temperature exceeds the critical dissolution temperature, the gel wrapping layer 1 releases free water outwards in an evaporation mode and takes away a large amount of heat, so that the cooling speed of the shape memory alloy wire 24 can be effectively improved, and the response speed of a driver is further improved. In the evaporation and dehydration process, the gel wrapping layer 1 suddenly changes due to the water loss volume, the volume of the flexible wrapping layer 3 is relatively unchanged, the driver is bent and deformed to one side due to the difference of the volume changes of the upper wrapping layer and the lower wrapping layer, and the response speed is further improved and the deformation degree of the driver is increased on the basis of driving the shape memory alloy wire 24. When the actuator stops working, the gel wrapping layer 1 can supplement the evaporated moisture from the surrounding air, so that the actuator is restored to the initial state.
As can be seen from the above description with reference to fig. 1 to 10, the shape memory alloy soft driver of this embodiment limits the deformation movement of the shape memory alloy wire by the fixing plate based on the shape memory effect of the shape memory alloy wire, and makes the driving module deform in a manner of electrically heating and/or electrically cooling the shape memory alloy wire at different positions, so as to drive the gel wrapping layer to move, thereby realizing the bending, torsion and bending-twisting combined mode movement of the soft driver. The shape memory alloy soft driver of the embodiment adopts millisecond-level electric pulse to electrify and heat the driver, and by virtue of rapid pulse heating, the shape memory alloy wire can rapidly reach the phase transition temperature and start driving, thereby reducing the generation of redundant heat, saving energy and improving the response speed of the driver. Meanwhile, the poly (N-isopropyl acrylamide) hydrogel is used as a gel wrapping layer, free water is released outwards in an evaporation mode, a large amount of heat is taken away, and therefore cooling of the shape memory alloy wire is accelerated, the volume of the gel wrapping layer suddenly changes in the evaporation and dehydration process, the volume of the flexible wrapping layer is relatively unchanged due to poor thermal responsiveness, the driver is bent and deformed to one side due to the fact that the volume change of the upper wrapping layer and the lower wrapping layer is poor, and on the basis of driving of the shape memory alloy wire, the response speed is further improved, and the deformation degree of the driver is increased. When the driver is cooled, the gel wrapping layer can supplement the evaporated moisture from the surrounding air, so that the driver is restored to the initial state. The shape memory alloy soft driver has the characteristics of high driving efficiency, low manufacturing cost, various movement forms and the like, and is suitable for the fields of soft manipulators, flexible manufacturing and the like.
The foregoing describes specific embodiments of the present application. It is to be understood that the application is not limited to the particular embodiments described above, and that various changes or modifications may be made by those skilled in the art within the scope of the appended claims without affecting the spirit of the application. The embodiments of the application and the features of the embodiments may be combined with each other arbitrarily without conflict.

Claims (8)

1.一种快速响应的多模态形状记忆合金软体驱动器,包括凝胶包裹层(1)、驱动模块(2)、柔性包裹层(3),其特征在于,所述驱动模块(2)封装在凝胶包裹层(1)内部;所述柔性包裹层(3)粘附于凝胶包裹层(1)底端;1. A fast-response multi-modal shape memory alloy soft actuator, comprising a gel wrapping layer (1), a driving module (2), and a flexible wrapping layer (3), wherein the driving module (2) is encapsulated inside the gel wrapping layer (1); and the flexible wrapping layer (3) is adhered to the bottom end of the gel wrapping layer (1); 所述驱动模块(2)包括固定板(21)、弹性基板(22)、导热绝缘薄膜(23)、形状记忆合金丝(24);所述弹性基板(22)设置在驱动模块(2)的中位面上;所述固定板(21)共四块,分别设置在弹性基板(22)上下表面的两端,通过粘结固定连接,每块固定板(21)上设有两个定位孔(211);所述定位孔(211)位于固定板(21)中位面上;所述形状记忆合金丝(24)从固定板(21)的一个定位孔(211)开始,沿着弹性基板(22)的长度穿过两个定位孔(211)的距离连接到另一块固定板(21)的定位孔(211)上,在同一水平面内整体呈X型排布;所述导热绝缘薄膜(23)裹覆在形状记忆合金丝(24)表面。The driving module (2) comprises a fixing plate (21), an elastic substrate (22), a heat-conducting insulating film (23), and a shape memory alloy wire (24); the elastic substrate (22) is arranged on the middle surface of the driving module (2); there are four fixing plates (21), which are respectively arranged at the two ends of the upper and lower surfaces of the elastic substrate (22) and fixedly connected by bonding, and each fixing plate (21) is provided with two positioning holes (211); the positioning holes (211) are located on the middle surface of the fixing plate (21); the shape memory alloy wire (24) starts from one positioning hole (211) of the fixing plate (21), passes through the distance between the two positioning holes (211) along the length of the elastic substrate (22), and is connected to the positioning hole (211) of another fixing plate (21), and is arranged in an X-shape as a whole in the same horizontal plane; the heat-conducting insulating film (23) is wrapped around the surface of the shape memory alloy wire (24). 2.根据权利要求1所述的快速响应的多模态形状记忆合金软体驱动器,其特征在于,所述形状记忆合金丝(24)的数量为四根,且每根形状记忆合金丝(24)对弹性基板(22)的偏心率相同;形状记忆合金丝一(241)固设于定位孔一(2111)和定位孔三(2113)之间;形状记忆合金丝二(242)固设于定位孔二(2112)和定位孔四(2114)之间;形状记忆合金丝三(243)固设于定位孔五(2115)和定位孔七(2117)之间;形状记忆合金丝四(244)固设于定位孔六(2116)和定位孔八(2118)之间。2. The fast-response multi-modal shape memory alloy soft driver according to claim 1 is characterized in that the number of the shape memory alloy wires (24) is four, and the eccentricity of each shape memory alloy wire (24) relative to the elastic substrate (22) is the same; shape memory alloy wire one (241) is fixed between positioning hole one (2111) and positioning hole three (2113); shape memory alloy wire two (242) is fixed between positioning hole two (2112) and positioning hole four (2114); shape memory alloy wire three (243) is fixed between positioning hole five (2115) and positioning hole seven (2117); shape memory alloy wire four (244) is fixed between positioning hole six (2116) and positioning hole eight (2118). 3.根据权利要求1所述的快速响应的多模态形状记忆合金软体驱动器,其特征在于,所述凝胶包裹层(1)表面设有网格槽,有效增加表面粗糙度。3. The fast-response multi-modal shape memory alloy soft actuator according to claim 1 is characterized in that the surface of the gel wrapping layer (1) is provided with grid grooves to effectively increase the surface roughness. 4.根据权利要求1-3中任一项所述的快速响应的多模态形状记忆合金软体驱动器,其特征在于,所述凝胶包裹层(1)的材料为聚(N-异丙基丙烯酰胺)水凝胶。4. The fast-response multi-modal shape memory alloy soft actuator according to any one of claims 1 to 3, characterized in that the material of the gel wrapping layer (1) is poly (N-isopropylacrylamide) hydrogel. 5.根据权利要求1-3中任一项所述的快速响应的多模态形状记忆合金软体驱动器,其特征在于,所述柔性包裹层(3)的材料为硅胶。5. The fast-response multi-modal shape memory alloy soft actuator according to any one of claims 1 to 3, characterized in that the material of the flexible wrapping layer (3) is silicone. 6.根据权利要求1-3中任一项所述的快速响应的多模态形状记忆合金软体驱动器,其特征在于,所述固定板(21)的材料为印刷电路板。6. The fast-response multi-modal shape memory alloy soft actuator according to any one of claims 1 to 3, characterized in that the material of the fixing plate (21) is a printed circuit board. 7.根据权利要求1-3中任一项所述的快速响应的多模态形状记忆合金软体驱动器,其特征在于,所述弹性基板(22)的材料为聚氯乙烯板。7. The fast-response multi-modal shape memory alloy soft actuator according to any one of claims 1 to 3, characterized in that the material of the elastic substrate (22) is a polyvinyl chloride board. 8.根据权利要求1-3中任一项所述的快速响应的多模态形状记忆合金软体驱动器,其特征在于,所述导热绝缘薄膜(23)柔性良好,具有高电绝缘性和高导热性,所述导热绝缘薄膜(23)的材料为氟化石墨烯薄膜。8. The fast-response multi-modal shape memory alloy soft actuator according to any one of claims 1 to 3, characterized in that the thermally conductive insulating film (23) has good flexibility, high electrical insulation and high thermal conductivity, and the material of the thermally conductive insulating film (23) is fluorinated graphene film.
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