CN115377651A - Antenna package - Google Patents

Abstract

Embodiments of the present disclosure generally relate to antenna packages. A package includes an upper layer mounted to a lower layer. The upper layer comprises a stack of insulating layers and conductive elements and comprises a first conductive track of the antenna. The plastic element rests on the stack. A first cavity is defined in the plastic element. The second electrically conductive track of the antenna is located on a wall of the plastic element (e.g. in or adjacent the first cavity). A second cavity is also defined in the plastic element surrounding the first cavity. The third conductive track of the antenna is located on a wall of the plastic element (e.g. in the second cavity). A third cavity is defined between the upper and lower layers, and an integrated circuit chip is mounted within the third cavity and electrically connected to the antenna.

Description

Antenna package

priority

This application claims the benefit of priority from French Application No. 2105186, filed May 18, 2021, the contents of which are incorporated by reference in their entirety to the fullest extent permitted by law.

technical field

The present disclosure relates generally to electronic devices, and in particular, to devices including antennas in packages and methods of manufacturing the same.

Background technique

An antenna is an element used to transmit (transmitter) or receive (receiver) electromagnetic waves. Antennas are fundamental elements in radio systems.

Contents of the invention

One embodiment provides a package comprising: a stack in an upper layer, the stack including an insulating layer and a conductive element; an element made of plastic resting on the stack and defining a first cavity; and an antenna comprising a first conductive track in the stack and a second conductive track on a side wall of the first cavity of the element.

Another embodiment provides a method for manufacturing a package, in order to form the upper layer, the method includes: forming a stack comprising an insulating layer and a conductive element, and including a first conductive track forming part of the antenna; forming a an element resting on the stack and defining a first cavity between the element and the stack; and forming a second conductive track resting on a wall of the element.

According to one embodiment, the first cavity is filled with a first material having a dielectric constant less than 20.

According to one embodiment, the encapsulation defines a second cavity surrounding the first cavity.

According to one embodiment, the second chamber is separated from the first chamber by a wall extending the entire height of the first chamber and resting on the stack.

According to one embodiment, the second cavity comprises a third conductive track extending along at least one side wall of the second cavity.

According to one embodiment, the third conductive track comprises a first portion extending from the stack on the second wall of the element and a second portion extending on the bottom of the second cavity.

According to one embodiment, the second portion of the third conductive track is coplanar with the plane of the second conductive track.

According to one embodiment, the second portion of the third conductive track extends in a different plane than the plane of the second conductive track.

According to one embodiment, the third conductive track is electrically coupled to the first conductive track.

According to one embodiment, the second cavity is filled with a second material different from the first material filling the first cavity.

According to one embodiment, the method comprises, after forming the element, filling the first cavity and the second cavity with the first material and the second material, respectively.

According to one embodiment, the encapsulation comprises a lower layer attached to said upper layer and defining a third cavity between said upper layer and said lower layer.

According to one embodiment, the package comprises a fourth conductive track extending into the stack between the first conductive track and the third cavity.

According to one embodiment, the element is made of a thermoplastic material doped with a non-conductive inorganic metal compound.

According to one embodiment, the element is formed by a laser direct structuring method.

Description of drawings

The foregoing and other features and advantages will be described in detail in the following description of specific embodiments, given by way of illustration and not limitation.

Figure 1 is a cross-sectional view of one embodiment of an electronic device;

Figure 2 is a cross-sectional view of another embodiment of an electronic device;

3 is a cross-sectional view of another embodiment of an electronic device;

Figure 4 is a cross-sectional view of another embodiment of an electronic device;

5 is a cross-sectional view of another embodiment of an electronic device; and

FIG. 6 shows an example of a method for manufacturing a part of the embodiment of FIG. 1 .

Detailed ways

In the various figures, the same features are indicated by the same reference numerals. In particular, common structural and/or functional features may have the same references and may arrange the same structural, dimensional and material properties in the various embodiments.

For purposes of clarity, only the operations and elements useful for understanding the embodiments described herein have been shown and described in detail.

Unless otherwise stated, when referring to two elements connected together, this means that there is no direct connection of any intermediate elements other than conductors, and when referring to two elements coupled together, it means that the two elements may be connected or they may be coupled via one or more other elements.

In the following disclosure, unless otherwise indicated, when referring to absolute position qualifiers, such as the terms "front", "rear", "top", "bottom", "left", "right", etc., or relative position qualifiers Words such as the terms "above", "below", "higher", "lower", etc., or qualifiers for orientation such as "horizontal", "vertical", etc., refer to the orientation shown in the drawings.

The expressions "about", "approximately", "substantially" and "approximately" mean within 10%, and preferably within 5%, unless otherwise stated.

FIG. 1 is a cross-sectional view of one embodiment of an electronic device 10 . Device 10 is an antenna device, more specifically, an antenna in a package ("AiP").

Device 10 includes an integrated circuit chip 12 . Chip 12 is located in the package. Thus, chip 12 is protected by the package. Antenna 14 is coupled to chip 12 to allow the chip to transmit or receive signals through antenna 14 .

The package includes, for example, a support (lower layer) 16 . The support 16 is, for example, a semiconductor substrate comprising, for example, electronic components or a stack of insulating layers including conductive tracks.

The package also includes an upper layer 18 . The upper layer 18 and the lower layer 16 are attached to each other by conductive elements 20 . For example, the upper layer 18 and the lower layer 16 are soldered together by solder balls to form the sidewalls of the package. The solder balls allow, for example, electrical connection of the lower layer to the upper layer. The cavity 22 in which the chip 12 is located is thus defined between the lower and upper layers and within the metal ring formed by the conductive element 20 .

Alternatively, chip 12 may be located at another location in the package. For example, chip 12 may be located in stack 24 , in other words, consist of layers of stack 24 .

The upper layer 18 includes a stack 24 of layers. For example, stack 24 constitutes an interconnection network comprising insulating layers and conductive tracks. For example, stack 24 includes insulating or dielectric layers, such as insulating or dielectric layers of different dielectric materials. For example, the stack 24 includes a lower layer 26 of a first dielectric material, ie, closest to the lower layer 16 . The stack 24 includes an intermediate layer 28 resting on a layer 26 of a second dielectric material. The second material is preferably different from the first material. Stack 24 includes an upper layer 30 resting on, for example, layer 28 of a first dielectric material.

For example, stack 24 includes metal posts 32 flush with the underside of the insulating layer closest to support 16 , ie, the layer closest to cavity 22 . The support 16 includes a metal post 34 flush with its upper surface (ie, the face closest to the cavity 22 ), opposite the post 32 . Studs 32 and 34 allow electrical connection of the upper and lower layers via ball 20 . For example, a ball 20 is positioned between each post 32 and a corresponding post 34 .

Antenna 14 includes an antenna structure including, for example, one or more metal layers 36 or metal tracks in stack 24 , preferably between upper layers 30 . In the example shown in Figure 1, only one layer 36 is shown. Layer 36 is coupled to chip 12 , for example via conductive tracks 38 located in stack 24 . This allows chip 12 to actuate layer 36 in order to transmit or receive signals. Layer 36 is also coupled to ground, eg via track 38 .

For example, the stack 24 includes a metal track 40 surrounded by the lower layer 26 , the metal track 40 extending opposite the chip 12 , preferably extending opposite the entire chip 12 . Track 40 forms a protective shield for chip 12 . Track 40 is located between layer 36 and chip 12 . According to another embodiment, where chip 12 is not located opposite layer 36 , track 40 may not be present.

The upper layer 18 also includes an upper element 42 . Component 42 rests on stack 24 . Element 42 includes a base 50 . The base 50 is, for example, planar. The base 50 extends opposite the stack 24 , preferably the entire stack 24 . Element 42 also includes walls 48 and 52 . Walls 48 and 52 are located between base 50 and stack 24 . More specifically, base 50 rests on walls 48 and 52 . Thus, the base is supported by the walls 48 and 52 , and the walls 48 and 52 rest on the stack 24 .

Element 42 is made of plastic material. For example, element 42 is made of a thermoplastic material, for example doped with a non-conductive metal-inorganic compound. Element 42 is made, for example, of hard plastic based on epoxy resin. Element 42 includes base 50 and walls 48 and 52, and is preferably formed as a single unit constituting the cover.

Element 42 defines a lumen 44 . Once the element 42 is attached to the stack, the cavity 44 is a closed cavity, ie a cavity that is enclosed on all sides. Cavity 44 is preferably central. Cavity 44 preferably faces protective layer 40 . Layer 40 is preferably between chip 12 and cavity 44 . Cavity 44 preferably faces layer 36 .

Cavity 44 is defined by base 50 and stack 24 in a first direction (eg, a vertical direction) and by walls 48 in a plane orthogonal to a first dimension (eg, a horizontal plane). The base 50 forms the bottom of the cavity. Wall 48 surrounds cavity 44 .

In the embodiment of FIG. 1 , element 42 also defines a closed cavity 46 . Cavity 46 preferably extends around cavity 44 . Cavity 46 preferably forms a ring around cavity 44 . Cavity 46 is separated from cavity 44 by wall 48 .

Cavity 46 is defined by base 42 and stack 24 in a first direction (eg, vertical direction) and by walls 48 and 52 in a plane orthogonal to a first dimension (eg, horizontal). Wall 52 surrounds cavity 46 . The base 50 forms the bottom of the cavity. Cavity 46 surrounds wall 48 . The wall 52 thus forms the outer side wall of the element 42 . Wall 52 is preferably coplanar with the side walls of stack 24 .

In the example of FIG. 1 , the base 50 has a substantially constant thickness. Thus, according to the embodiment of FIG. 1 , cavities 44 and 46 are substantially equal in height.

Element 42 is attached to stack 24 . For example, element 42 is attached to stack 24 by an adhesive layer not shown.

In addition to layer 36 , antenna 14 includes a conductive layer or track (patch) 54 on a base 50 in cavity 44 . Layer 54 is preferably made of metal. Layer 54 is located opposite a portion of layer 36, or more generally, the collection of layers 36 that forms the active portion of the antenna. Layer 54 allows the emission of signals of the antenna obtained by excitation of layer 36 . Layer 54 is electrically isolated, in particular from layer 36 . In other words, layer 54 is not in contact with any conductive elements, and in particular is not electrically coupled with layer 36 .

According to the embodiment of FIG. 1 , the antenna 14 comprises a secondary part conductive layer or track 58 which participates in the excitation of the antenna. The secondary part 58 is preferably a metal layer, preferably the same metal as layer 36 . The secondary part 58 extends over the element 42 into the cavity 46 . The secondary part 58 forms a conductive ring around the cavity 44 . Thus, the secondary part 58 extends over the wall of the cavity 46 . The secondary part 58 extends from the stack 24 the height of one of the walls 48 , 52 , preferably the entire height of the wall 52 . The secondary portion 58 preferably extends into the cavity 46 over at least a portion of the base 50 (ie, the bottom of the cavity 46 , preferably in the plane of the layer 54 ). The secondary part 58 is therefore preferably L-shaped in cross-sectional view. Thus, the secondary part preferably comprises a leg directed towards the stack 24 , and a leg directed towards the layer 54 , eg coplanar with the layer 54 .

Secondary portion 58 is coupled to layer 36 by at least one conductive element 60 , such as at least one conductive via or ring. At least one conductive element 60 extends through one or more insulating layers of stack 24 in order to reach layer 36 . In other words, at least one conductive element 60 is in contact with layer 36 and extends to the upper surface of stack 24 . The secondary part 58 rests in contact with an element 60 which is flush with the upper surface of the stack 24 .

Cavity 44 is filled with material 56 . The material has, for example, a dielectric constant of less than 20, preferably less than 10, more preferably less than 3, eg greater than 1 . Material 56 is, for example, air.

Cavity 46 is filled with a second material 47 , preferably different from the first material filling cavity 44 . The dielectric constant of the second material is, for example, less than 20, preferably less than 10, more preferably less than 3, eg greater than 1. Material 47 is, for example, air. Alternatively, material 47 may be the same material as material 56 . Alternatively, material 47 may be a conductive material.

Substrate 50 preferably has a thickness of less than 100 μm, preferably less than 50 μm. Preferably, base 50 is as thin as possible while avoiding deformation of element 42 . The wall 48 extending from the base 50 to the stack 24 provides a stabilizer and ensures that the base 50 does not deform.

Layer 54 has a thickness, for example, between 5 μm and 30 μm. Layer 58 has, for example, the same thickness as layer 54 . Layer 58 has a thickness, for example, between 20 μm and 50 μm.

Layer 36 and layer 40 are for example separated by a distance between 250 μm and 400 μm, for example substantially equal to 350 μm. The distance between layer 54 and layer 36 depends, for example, on the wavelength range emitted or received by antenna 14 . For example, for a signal with a frequency substantially equal to 60 GHz, the distance between layer 54 and layer 36 is substantially equal to 400 μm. Preferably, the distance between layer 54 and layer 36 is greater than 150 μm, for example greater than 200 μm.

The distance between layer 54 and layer 36 is an important characteristic of the antenna package. In practice, the distance between layer 54 and layer 36 must be high enough to allow layer 54 to radiate through the signal. Layer 54 and layer 36 are further separated by a material having properties, in particular a dielectric constant, allowing efficient signal passage.

A layer of material may be selected to form that fills cavity 44 on the stack and forms layer 54 thereon. However, it may not be possible to precisely select the thickness of the layer depending on the manner of use.

FIG. 2 is a cross-sectional view of another embodiment of an electronic device 61 .

Device 61 differs from device 10 of FIG. 1 in that base 50 facing cavity 46 has a different thickness than base 50 facing cavity 44 , preferably greater than the thickness of base 50 facing cavity 44 . In other words, the height of cavity 46 is less than the height of cavity 44 . The upper surface of base 50, the surface furthest from cavities 44 and 46, is planar.

Layers 54 and 58 are located in their respective cavities as described in connection with FIG. 1 . Layer 58 includes legs extending above wall 52 and legs extending above base 50 and thus not in the same plane as layer 54 .

According to another embodiment, the legs of the layer 58 extending above the base 50 are coplanar with the layer 54, and the thickness of the base 50 facing the cavity 46 is different from, preferably greater than, the thickness of the base 50 facing the cavity 44. The thickness of cavity 44.

FIG. 3 is a cross-sectional view of another embodiment of an electronic device 70 .

Device 70 differs from the embodiment of FIGS. 1 and 2 in that device 70 does not include cavity 46 . Thus, element 42 forms a single cavity 44 . Cavity 44 includes layer 54 and material 56 as described with respect to FIG. 1 . A wall 48 laterally surrounding the cavity 44 forms the side walls of the element 42 and thus forms part of the side walls of the upper layer 18 . Element 42 thus corresponds to a block comprising a single cavity corresponding to cavity 44 . Wall 48 is thus coplanar with the side walls of stack 24 .

Stack 24 preferably does not include conductive elements 60 . Antenna 14 does not include secondary part 58 .

FIG. 4 is a cross-sectional view of another embodiment of an electronic device 80 .

The device 80 differs from the embodiment of FIG. 1 in that the secondary part 58 is not present in the cavity 46 . Thus, cavity 46 only includes material 47 .

As in the embodiment of FIG. 3 , the conductive element 60 is absent.

FIG. 5 is a cross-sectional view of another embodiment of an electronic device 90 .

Device 90 differs from the embodiment of FIG. 1 in that layer 54 is located on the upper surface of base 50 , ie on the upper surface of element 42 . Layer 54 is located opposite cavity 44 . The layer 54 has, for example, dimensions in the horizontal plane which are smaller than or equal to the dimensions of the cavity 44 . Thus, cavity 44 is only filled with material 56 . The secondary part 58 therefore lies in a different plane than the plane including the layer 54 . In particular, the legs of the secondary part 58 resting on the base 50 are not coplanar with the layer 54 .

FIG. 6 illustrates an example method for fabricating a portion of the embodiment of FIG. 1 . More specifically, FIG. 6 includes four cross-sectional views A, B, C, and D, each illustrating a step in a method for manufacturing a portion of the embodiment of FIG. 1 . The steps shown by views A, B, C and D are preferably sequential.

View A of FIG. 6 shows the steps of forming the element 42 or cover. Preferably, element 42 is formed by injecting the material making up element 42 into a mold having the desired shape of element 42 . Injection is done, for example, by means of a syringe or by a suitable element, for example as part of the machine used to manufacture element 42 . The material making up element 42 is preferably in liquid form during injection. The material is then brought to a solid phase, for example by heat treatment, ie by increasing its temperature. Then remove the mold.

The material constituting the element 42 is plastic. The material constituting the element 42 is preferably a material compatible with the laser direct structuring (LDS) method, in other words, a thermoplastic material doped with a non-conductive metal-inorganic compound.

View B of FIG. 6 shows laser activation of layer locations 54 and 58 to produce a metallized substrate for these locations.

During the step shown in view C of FIG. 6, element 42 is placed in the electroless bath composition. As a result, layers 54 and 58 are formed at the locations activated in the step of view B of FIG. 6 .

Alternatively, the location activated in view B of the step of FIG. 6 is greater than layers 54 and 58 . Thus, the steps of view C of FIG. 6 allow the formation of metal layers having dimensions larger than those of layers 54 and 58 . These layers are then etched to form layers 54 and 58 .

In the step of view D of FIG. 6 cavities 44 and 46 are filled with material 56 and 47 respectively. For example, the material is deposited in the cavity in liquid form and solidified, for example by an annealing step.

In a subsequent step, not shown, the element 42 is attached to the stack 24 .

FIG. 6 illustrates the fabrication of the embodiment of FIG. 1 . However, by modifying the shape of the mold shown in view A of FIG. 6 and by modifying the laser activation position of the step in view B of FIG. 6 , the method described is applicable to the embodiments of FIGS. 2 to 5 .

Steps B and C of FIG. 6 corresponding to the direct laser structuring method can be replaced by other metal layer deposition steps, such as sputtering steps or spraying steps. However, the material of element 42 may be different from that discussed in connection with view A of FIG. 6 . Element 42 may then be made of any plastic material suitable for forming element 42 and for depositing metal layers.

An advantage of the described embodiment is that the distance between the radiating conductive layer 54 (otherwise referred to as a "patch") and the actuation layer 36 can be better controlled. This distance can thus advantageously be reduced in order to reduce the size of the package while maintaining a sufficient distance for the operation of the antenna.

Another advantage of the described embodiment is that it allows separation of layer 54 and layer 36 by material 56 independently of the type of structure. In fact, the structure is held by the plastic element or cover 42 and the strength of the material 56 does not affect the strength of the enclosure.

Another advantage of the described embodiment is that the material 47 of the surrounding layer 58 and the material 56 of the surrounding layer 54 can be selected differently from each other.

Various embodiments and modifications have been described. Those skilled in the art will appreciate that certain features of these embodiments may be combined, and that other variations will readily occur to those skilled in the art.

Finally, based on the functional description provided above, the practical implementation of the embodiments and variants described herein is within the capabilities of a person skilled in the art.

Claims (29)

1. A package comprising: upper layer, including: Stacks, including insulating layers and conductive elements; A plastic element having a first side resting on the stack, a second side opposite the first side, and including a first cavity extending from the first side into the plastic element, the first a cavity has a first height less than the thickness of the plastic element between the first side and the second side; and An antenna comprising a first conductive track in the stack and a second conductive track on the wall of the plastic element. 2. The package of claim 1, wherein the second conductive track is located at the bottom of the first cavity. 3. The package of claim 2, wherein the first cavity is filled with a first material having a dielectric constant less than 20. 4. The package of claim 1, wherein the second conductive track is above the first cavity on the second side of the plastic element. 5. The package of claim 1, wherein the plastic component further comprises a second cavity extending into the plastic component from the first side, the second cavity has a second height, the first cavity A second height is less than the thickness of the plastic element between the first side and the second side, and the second cavity surrounds the first cavity. 6. The package of claim 5, wherein the second cavity is separated from the first cavity by a first wall extending the first height of the first cavity and resting on on the stack. 7. The package of claim 5, wherein the antenna further comprises a third conductive track located within the second cavity. 8. The package of claim 7, wherein the third conductive track comprises a first portion extending on a sidewall of the second cavity and a second portion extending on a bottom of the second cavity. 9. The package of claim 8, wherein the second conductive track is located at the bottom of the first cavity, and wherein the second portion of the third conductive track is in contact with the second conductive track Coplanar. 10. The package of claim 8, wherein the second conductive track is located at the bottom of the first cavity, and wherein the second portion of the third conductive track is in contact with the second conductive track. The planes of the tracks extend in different planes. 11. The package of claim 7, wherein the third conductive track is electrically coupled to the first conductive track. 12. The package of claim 5, wherein the first cavity is filled with a first dielectric material, and wherein the second cavity is filled with a second dielectric material different from the first dielectric material. 13. The package of claim 1, further comprising: Lower layer; wherein said upper layer is attached to said lower layer by electrical connection elements; wherein a third cavity is defined between said upper layer and said lower layer and is surrounded by said electrical connection element; and an integrated circuit chip located within the third cavity and electrically connected to the antenna. 14. The package of claim 13, further comprising a fourth conductive track extending into the stack between the first conductive track and the third cavity. 15. The package of claim 1, wherein the plastic element is made of a thermoplastic material doped with a non-conductive inorganic metal compound. 16. A method for manufacturing a package comprising: The upper layer is formed by the following operations; forming a stack comprising an insulating layer and a conductive element and comprising a first conductive track forming part of the antenna; forming a plastic element having a first side and a second side opposite the first side, wherein forming the plastic element includes forming a first cavity extending from the first side into the plastic element , the first cavity has a first height, the first height is less than the thickness of the plastic element between the first side and the second side; mounting the plastic element to the stack, wherein the first side rests on the stack and the first cavity is closed by the stack; and A second conductive track resting on the wall of the plastic element is formed. 17. The method of claim 16, further comprising filling the first cavity with a first material having a dielectric constant less than 20. 18. The method of claim 16, wherein forming the plastic element further comprises forming a second cavity extending from the first side into the plastic element, the second cavity having a second height, the The second height is less than the thickness of the plastic element between the first side and the second side, the second cavity surrounding the first cavity. 19. The method of claim 18, further comprising forming a third conductive track extending along at least one wall of the second cavity. 20. The method of claim 19, wherein the third conductive track includes a first portion extending on a sidewall of the second cavity and a second portion extending on a bottom of the second cavity. 21. The method of claim 20, wherein the second conductive track extends over the bottom of the first cavity, and the second portion of the third conductive track is in common with the second conductive track. noodle. 22. The method of claim 20, wherein the second conductive track extends over the bottom of the first cavity, and the second portion of the third conductive track is in contact with the second conductive track extend in different planes of the plane. 23. The method of claim 19, further comprising electrically coupling the third conductive track to the first conductive track. 24. The method of claim 18, further comprising filling the first cavity with a first dielectric material and filling the second cavity with a second dielectric material different from the first dielectric material. 25. The method of claim 24, wherein forming the plastic element comprises molding, and wherein filling the first cavity and the second cavity with the first dielectric material and the second dielectric material, respectively Two cavities occur after molding. 26. The method of claim 16, further comprising: form the lower layer; and The upper layer is attached to the lower layer, the attachment defining a third cavity between the upper layer and the lower layer. 27. The method of claim 26, further comprising forming a fourth conductive track extending into the stack between the first conductive track and the third cavity. 28. The method of claim 16, wherein the plastic element is made of a thermoplastic material doped with a non-conductive inorganic metal compound. 29. The method of claim 28, wherein forming the plastic element comprises performing a laser direct structuring operation.

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