CN115406557B - Temperature measurement method and device - Google Patents
Temperature measurement method and deviceInfo
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- CN115406557B CN115406557B CN202110577944.5A CN202110577944A CN115406557B CN 115406557 B CN115406557 B CN 115406557B CN 202110577944 A CN202110577944 A CN 202110577944A CN 115406557 B CN115406557 B CN 115406557B
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- thermal power
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B15/00—Systems controlled by a computer
- G05B15/02—Systems controlled by a computer electric
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/20—Pc systems
- G05B2219/26—Pc applications
- G05B2219/2642—Domotique, domestic, home control, automation, smart house
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
本申请实施例提供了一种温度测量方法及装置，该方法包括：获取电子产品的当前工作状态；根据预设的工作状态与热功耗补偿值的对应关系，确定当前工作状态对应的当前热功耗补偿值，工作状态下电子产品的原始热功耗与补偿热功耗的和值为预设热功耗，电子产品的补偿热功耗为利用工作状态对应的热功耗补偿值获得的电子产品的热功耗；使用当前热功耗补偿值，对电子产品进行热功耗补偿；获取热功耗补偿后电子产品测得的当前原始环境温度；使用预设热功耗下的预设补偿温度，对当前原始环境温度进行温度补偿，得到当前实际环境温度。应用本申请实施例提供的技术方案，提高具有多种功能的电子产品测得实际环境温度的精度。
The embodiment of the present application provides a temperature measurement method and device, which includes: obtaining the current working state of an electronic product; determining the current thermal power consumption compensation value corresponding to the current working state based on the correspondence between the preset working state and the thermal power consumption compensation value, wherein the sum of the original thermal power consumption and the compensated thermal power consumption of the electronic product in the working state is the preset thermal power consumption, and the compensated thermal power consumption of the electronic product is the thermal power consumption of the electronic product obtained by using the thermal power consumption compensation value corresponding to the working state; using the current thermal power consumption compensation value to perform thermal power consumption compensation on the electronic product; obtaining the current original ambient temperature measured by the electronic product after thermal power consumption compensation; using the preset compensation temperature under the preset thermal power consumption to perform temperature compensation on the current original ambient temperature to obtain the current actual ambient temperature. The technical solution provided by the embodiment of the present application is applied to improve the accuracy of the actual ambient temperature measured by electronic products with multiple functions.
Description
Technical Field
The application relates to the technical field of intelligent home, in particular to a temperature measurement method and device.
Background
In smart home products, it is often necessary to accurately measure the temperature of the indoor environment. The current common temperature measurement mode is that the difference value between the original ambient temperature measured by the temperature sensor in the intelligent home product and the actual ambient temperature is used as a fixed value, and the temperature actually measured by the temperature sensor is subjected to temperature compensation to obtain the actual ambient temperature.
When the thermal power consumption of the intelligent household product is a fixed value, the temperature measurement mode can accurately measure the ambient temperature. However, the functions of the smart home products are more and more, and under different functions, the heat power consumption of the smart home products is different. The difference between the original temperature measured by the temperature sensor and the ambient temperature is different under different heat power consumption, which results in that the actual ambient temperature cannot be accurately measured in the above-mentioned manner.
Disclosure of Invention
The embodiment of the application aims to provide a temperature measuring method and a temperature measuring device so as to improve the accuracy of measuring the actual environment temperature of electronic products with multiple functions. The specific technical scheme is as follows:
in a first aspect, an embodiment of the present application provides a temperature measurement method, including:
acquiring the current working state of the electronic product;
Determining a current thermal power consumption compensation value corresponding to a current working state according to a corresponding relation between the preset working state and the thermal power consumption compensation value, wherein the sum of the original thermal power consumption and the compensation thermal power consumption of the electronic product in the working state is the preset thermal power consumption, and the compensation thermal power consumption of the electronic product is the thermal power consumption of the electronic product obtained by utilizing the thermal power consumption compensation value corresponding to the working state;
using the current heat power compensation value to carry out heat power compensation on the electronic product;
acquiring the current original environment temperature measured by the electronic product after heat consumption compensation;
and performing temperature compensation on the current original environment temperature by using the preset compensation temperature under the preset thermal power consumption to obtain the current actual environment temperature.
Optionally, the corresponding relation between the preset working state and the thermal power compensation value comprises a corresponding relation between the preset working state and the thermal power compensation value of each functional module included in the electronic product, wherein the sum value of the original thermal power consumption and the compensation thermal power consumption of each functional module in the working state is the preset sub thermal power consumption of the functional module, the compensation thermal power consumption of each functional module is the thermal power consumption of the functional module obtained by using the thermal power compensation value of the functional module corresponding to the working state, and the sum value of the original thermal power consumption and the preset sub thermal power consumption of all functional modules included in the electronic product is the preset thermal power consumption;
the step of determining the current thermal power consumption compensation value corresponding to the current working state according to the corresponding relation between the preset working state and the thermal power consumption compensation value comprises the following steps:
determining a current thermal power consumption compensation value of each functional module corresponding to the current working state according to the corresponding relation between the preset working state and the thermal power consumption compensation value of each functional module;
The step of using the current thermal power compensation value to perform thermal power compensation on the electronic product includes:
and carrying out heat power consumption compensation on each functional module by using the current heat power consumption compensation value of each functional module.
Optionally, each functional module is respectively preset with a heating component, and the heat power consumption compensation value is a current value;
The step of performing thermal power compensation on each functional module by using the current thermal power compensation value of each functional module includes:
And supplying power to a heating component preset on each functional module according to the current value of each functional module.
Optionally, the heating component is a heating film or a heating resistor.
Optionally, the thermal power compensation value is a chip working parameter of the functional module;
The step of performing thermal power compensation on each functional module by using the current thermal power compensation value of each functional module includes:
and carrying out heat power consumption compensation on each functional module according to the current chip working parameters of each functional module.
Optionally, the maximum compensation thermal power consumption of each functional module is greater than or equal to the difference between the maximum thermal power consumption and the minimum thermal power consumption of the functional module.
In a second aspect, an embodiment of the present application provides a temperature measurement device, the device including:
the first acquisition unit is used for acquiring the current working state of the electronic product;
The electronic product comprises a determining unit, a control unit and a control unit, wherein the determining unit is used for determining a current thermal power consumption compensation value corresponding to a current working state according to a corresponding relation between the preset working state and the thermal power consumption compensation value, the sum of original thermal power consumption and compensation thermal power consumption of the electronic product in the working state is the preset thermal power consumption, and the compensation thermal power consumption of the electronic product is the thermal power consumption of the electronic product obtained by utilizing the thermal power consumption compensation value corresponding to the working state;
the first compensation unit is used for carrying out heat power compensation on the electronic product by using the current heat power compensation value;
the second acquisition unit is used for acquiring the current original environment temperature measured by the electronic product after the thermal power consumption compensation;
And the second compensation unit is used for performing temperature compensation on the current original environment temperature by using the preset compensation temperature under the preset thermal power consumption to obtain the current actual environment temperature.
Optionally, the corresponding relation between the preset working state and the thermal power compensation value comprises a corresponding relation between the preset working state and the thermal power compensation value of each functional module included in the electronic product, wherein the sum value of the original thermal power consumption and the compensation thermal power consumption of each functional module in the working state is the preset sub thermal power consumption of the functional module, the compensation thermal power consumption of each functional module is the thermal power consumption of the functional module obtained by using the thermal power compensation value of the functional module corresponding to the working state, and the sum value of the original thermal power consumption and the preset sub thermal power consumption of all functional modules included in the electronic product is the preset thermal power consumption;
the determining unit is specifically configured to determine, according to a preset correspondence between a working state and a thermal power consumption compensation value of each functional module, a current thermal power consumption compensation value of each functional module corresponding to the current working state;
the first compensation unit is specifically configured to perform thermal power compensation on each functional module by using a current thermal power compensation value of each functional module.
Optionally, each functional module is respectively preset with a heating component, and the heat power consumption compensation value is a current value;
the first compensation unit is specifically configured to supply power to a heating component preset on each functional module according to the current value of each functional module.
Optionally, the heating component is a heating film or a heating resistor.
Optionally, the thermal power compensation value is a chip working parameter of the functional module;
the first compensation unit is specifically configured to perform thermal power compensation on each functional module according to the current chip operating parameter of each functional module.
Optionally, the maximum compensation thermal power consumption of each functional module is greater than or equal to the difference between the maximum thermal power consumption and the minimum thermal power consumption of the functional module.
In a third aspect, an embodiment of the present application provides an electronic product, including a processor and a memory, where the memory is configured to store a computer program, and the processor is configured to implement any one of the steps of the temperature measurement method described above when executing the program stored in the memory.
In a fourth aspect, embodiments of the present application provide a computer-readable storage medium having a computer program stored therein, which when executed by a processor, implements any of the above-described temperature measurement method steps.
The embodiment of the application also provides a computer program which, when run on a computer, causes the computer to execute any one of the temperature measurement methods.
The embodiment of the application has the beneficial effects that:
In the technical scheme provided by the embodiment of the application, for the electronic products in various working states, different heat power compensation values are used for carrying out heat power compensation on the electronic products in different working states, so that the overall heat power consumption of the electronic products is constant and preset heat power consumption. Under the condition that the whole heat power consumption of the electronic product is constant, the original environment temperature measured by the electronic product is subjected to temperature compensation by using a fixed value (namely preset compensation temperature), so that the actual environment temperature can be accurately obtained, and the accuracy of measuring the actual environment temperature by the electronic product with multiple functions is improved.
Of course, it is not necessary for any one product or method of practicing the application to achieve all of the advantages set forth above at the same time.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are necessary for the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application and that other embodiments may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a compensation temperature in the related art;
FIG. 2 is a schematic diagram of compensation temperature according to the technical scheme provided by the embodiment of the application;
FIG. 3 is a schematic diagram of a first flow chart of a temperature measurement method according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a second flow chart of a temperature measurement method according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a third flow chart of a temperature measurement method according to an embodiment of the present application;
Fig. 6 is a schematic diagram of a first structure of an electronic product according to an embodiment of the present application;
FIG. 7 is a schematic diagram of a first structure of a temperature measuring device according to an embodiment of the present application;
fig. 8 is a schematic diagram of two structures of an electronic product according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. Based on the embodiments of the present application, all other embodiments obtained by the person skilled in the art based on the present application are included in the scope of protection of the present application.
For ease of understanding, the words appearing in the embodiments of the application are explained below.
Thermal power consumption refers to the power consumed by the device in the form of heat generation.
And the heat power consumption compensation is to increase the heat power consumption of the compensation module when the heat power consumption of the device is reduced, and to reduce the heat power consumption of the compensation module when the heat power consumption of the device is increased. The total heat consumption of the device and the compensation module is stable and unchanged.
At present, the functions of intelligent home products are more and more. Different functions correspond to different working states of the intelligent home product. Under different working states, the heat power consumption of the intelligent household products is different. Under different heat power consumption, the original environment temperature measured by the temperature sensor in the intelligent home product is different, and then the difference value between the original environment temperature measured by the temperature sensor and the actual environment temperature is different. The actual ambient temperature cannot be accurately measured by adopting a mode of carrying out temperature compensation on the temperature actually measured by the temperature sensor by a fixed value.
In addition, under the condition that the actual environment temperature is unchanged, when the intelligent household product switches the working state, the heat power consumption can be suddenly changed, but the temperature is not suddenly changed, but gradually changes along with time, and further the compensation temperature is also gradually changed along with the gradual change, as shown in fig. 1. In this case, in order to accurately measure the actual ambient temperature, it is necessary to test the difference between the original ambient temperature measured by the temperature sensor at different times during the switching of the operating state and the actual ambient temperature based on the above-described manner of performing temperature compensation on the temperature actually measured by the temperature sensor using a constant value. Resulting in an increase in the complexity of the temperature measurement. Combining with the actual ambient temperature changes, the complexity of temperature measurement will be further increased.
And, along with the function of intelligent house product more and more, the temperature change curve that brings because of operating condition switches is more and more complicated. The complex use condition of the intelligent home product cannot be covered by adopting a difference mode between the original ambient temperature and the actual ambient temperature measured by the temperature sensor at different moments in the switching process of the test working state. This presents a significant challenge to the difficulty and complexity of temperature measurement.
In order to solve the above problems, an embodiment of the present application provides a temperature measurement method, which can be applied to an electronic product having a temperature sensor or a controller connected to the electronic product. The electronic product can be the intelligent home product, and can also be other electronic products with temperature sensors. The controller can be an independent physical machine or integrated on the electronic product. For ease of understanding, the following description uses the controller as an execution body, and is not limited thereto.
In the temperature measurement method, for the electronic products in various working states, the controller uses different heat power compensation values to carry out heat power compensation on the electronic products in different working states, so that the whole heat power of the electronic products is constant and preset heat power consumption. Under the condition that the overall heat power consumption of the electronic product is constant, the relationship between the original ambient temperature, the compensation temperature, the actual ambient temperature and the heat power consumption measured by the electronic product is shown in fig. 2. At this time, the controller uses a fixed value (i.e. preset compensation temperature) to perform temperature compensation on the original ambient temperature measured by the electronic product, so that the actual ambient temperature can be accurately obtained, and the accuracy of measuring the actual ambient temperature by the electronic product with multiple functions is improved.
In addition, in the temperature measurement method, the actual environment temperature can be accurately obtained only by keeping the whole heat power consumption state of the electronic product constant and further carrying out temperature compensation on the original environment temperature measured by the electronic product by using a fixed value. The method is simple to operate, the accumulation of temperature in time does not need to be considered, the difficulty of temperature compensation is greatly reduced, the workload of testing the temperature and a temperature compensation algorithm is remarkably reduced, and errors accumulated in the working state switching process in time do not exist.
In addition, the constant value for temperature compensation does not change along with the change of the working state of the electronic product, so that the precision control of the constant value is easy, and various use conditions of the electronic product can be covered. The accuracy of measuring the actual environment temperature of the electronic product with multiple functions is further improved.
The temperature measuring method provided by the embodiment of the application is described in detail below through specific examples.
Referring to fig. 3, fig. 3 is a schematic flow chart of a first temperature measurement method according to an embodiment of the present application, where the method includes the following steps:
Step S31, the current working state of the electronic product is obtained.
The electronic product may have one or more operating states. For example, the operational state may include, but is not limited to, a normal operational state, a sleep state, a semi-sleep state, and the like. Under different working states, the signals fed back by the electronic product are different. In the embodiment of the application, different feedback signals can be adopted to represent different working states of the electronic product.
In the embodiment of the application, the controller can periodically acquire the current working state of the electronic product. The controller can also obtain the current working state of the electronic product according to the temperature measurement instruction after receiving the temperature measurement instruction input by the user. This is not limited.
Step S32, determining a current thermal power consumption compensation value corresponding to the current working state according to the corresponding relation between the preset working state and the thermal power consumption compensation value.
The sum of the original thermal power consumption and the compensation thermal power consumption of the electronic product in the working state is preset thermal power consumption. The compensation thermal power consumption of the electronic product is the thermal power consumption of the electronic product obtained by utilizing the thermal power consumption compensation value corresponding to the working state. In order to facilitate operation, the preset thermal power consumption is greater than or equal to the maximum thermal power consumption of the electronic product. When different feedback signals are adopted to represent different working states of the electronic product, corresponding adjustment signals can be adopted to represent corresponding heat power consumption compensation values.
In the embodiment of the application, the corresponding relation between the working state and the heat power consumption compensation value is preset in the controller. After the current working state of the electronic product is obtained, searching the corresponding relation comprising the current working state from the corresponding relation between the preset working state and the heat power consumption compensation value. And after the corresponding relation including the current working state is found, the controller takes the heat power consumption compensation value included in the corresponding relation as the current heat power consumption compensation value.
And step S33, performing heat power compensation on the electronic product by using the current heat power compensation value.
After the current heat power compensation value is obtained, the controller uses the current heat power compensation value to carry out heat power compensation on the electronic product. And the whole thermal power consumption of the electronic product after the thermal power consumption compensation is the preset thermal power consumption.
And step S34, acquiring the current original environment temperature measured by the electronic product after thermal power consumption compensation.
In the embodiment of the application, the electronic product comprises a temperature sensor. After the controller compensates the thermal power consumption of the electronic product, the temperature sensor included in the electronic product in the current working state measures the ambient temperature as the current original ambient temperature, and transmits the current original ambient temperature to the controller. Further, the controller obtains the current original environment temperature measured by the electronic product after the heat power consumption compensation.
And step S35, performing temperature compensation on the current original environment temperature by using a preset compensation temperature under preset thermal power consumption to obtain the current actual environment temperature.
In the embodiment of the application, the controller measures in advance the difference between the original ambient temperature and the actual ambient temperature measured by the electronic product under the preset thermal power consumption, namely the preset compensation temperature. And the controller performs temperature compensation on the current original environment temperature by using a preset compensation temperature under preset thermal power consumption to obtain the current actual environment temperature.
For example, the preset compensation temperature is-5 ℃, and the current original ambient temperature is 20 ℃. The controller uses the preset compensation temperature to carry out temperature compensation on the current original environment temperature, and the current actual environment temperature is 20+ (-5) =15 ℃.
By adopting the embodiment to measure the temperature, the accuracy of measuring the actual environment temperature of the electronic product with multiple functions is improved, and meanwhile, the complexity of temperature measurement operation is reduced.
In the embodiment of the application, the electronic product can be taken as a whole, namely, the heat power consumption compensation value in the preset corresponding relation is the heat power consumption compensation value aiming at the whole electronic product. This implementation is simple.
However, the electronic product includes a plurality of functional modules, different functions, and different spatial positions in the electronic product. And the spatial positions of the same functional module in different electronic products are completely different. The influence of different functions and space positions of the functional modules on the thermal power consumption of the electronic product is different.
In order to improve the applicability of the temperature measurement method provided by the embodiment of the application and further improve the accuracy of measuring the actual environmental temperature of the electronic product with multiple functions, in one embodiment of the application, the corresponding relation between the preset working state and the heat power consumption compensation value may include a corresponding relation between the preset working state and the heat power consumption compensation value of each functional module included in the electronic product. The sum of the original thermal power consumption and the compensation thermal power consumption of each functional module in a working state is a preset sub thermal power consumption of the functional module, and the compensation thermal power consumption of each functional module is the thermal power consumption of the functional module obtained by utilizing the thermal power consumption compensation value of the functional module corresponding to the working state. The sum of the original thermal power consumption and the preset sub thermal power consumption of all the functional modules included in the electronic product is the preset thermal power consumption.
For example, the electronic product includes functional modules A, B and C. The operating states of the electronic product include an operating state G 1 and an operating state G 2. At this time, the corresponding relationship between the preset working state in the controller and the thermal power consumption compensation value of each functional module included in the electronic product is shown in table 1.
TABLE 1
| Function module A | Functional module B | Function module C | |
| Operating state G 1 | Thermal power compensation value A 1 | Thermal power compensation value B 1 | Thermal power compensation value C 1 |
| Operating state G 2 | Thermal power compensation value A 2 | Thermal power compensation value B 2 | Thermal power compensation value C 2 |
In one example, for each functional module, the maximum compensated thermal power consumption of the functional module is equal to or greater than the difference between the maximum thermal power consumption and the minimum thermal power consumption of the functional module. It can be appreciated that each functional module can adjust the difference between the maximum thermal power consumption and the minimum thermal power consumption of the functional module to be greater than or equal to the maximum thermal power consumption of the functional module, so as to realize the adjustment of the thermal power consumption compensation value.
Based on the corresponding relation between the preset working state and the thermal power consumption compensation value of each functional module included in the electronic product, another temperature measurement method is provided in the embodiment of the present application, as shown in fig. 4, in the method, step S32 may be refined to step S321, and step S33 may be refined to step S331.
Step S321, determining the current thermal power consumption compensation value of each functional module corresponding to the current working state according to the corresponding relation between the preset working state and the thermal power consumption compensation value of each functional module.
In the embodiment of the application, after the current working state of the electronic product is obtained, the controller searches the corresponding relation comprising the current working state from the corresponding relation between the preset working state and the heat power consumption compensation value of each functional module. And after the corresponding relation including the current working state is found, the controller takes the heat power consumption compensation value of each functional module included in the corresponding relation as the current heat power consumption compensation value of the functional module.
The following description will take table 1 as an example. When the current working state is G 1, the controller can determine that the current thermal power compensation value of the functional module a is a 1, the current thermal power compensation value of the functional module B is B 1, and the current thermal power compensation value of the functional module C is C 1 according to the working state G 1 and table 1.
And step S331, performing heat power consumption compensation on each functional module by using the current heat power consumption compensation value of each functional module.
The explanation will be made with the above example in step S321. The controller determines that the current heat power compensation value of the functional module A is A 1, the current heat power compensation value of the functional module B is B 1, and the current heat power compensation value of the functional module C is C 1. The controller uses the heat power compensation value A 1 to compensate the heat power of the functional module A. The controller uses the heat power compensation value B 1 to compensate the heat power of the functional module B. The controller compensates the heat power consumption of the functional module C by using the heat power consumption compensation value C 1.
In the technical scheme provided by the embodiment of the application, the corresponding relation between the corresponding working state and the thermal power compensation value is respectively set for different functional modules by the controller, so that the thermal power compensation is respectively carried out on each functional module of the electronic product under different working states, the influence caused by the difference of the functions and the space positions of the functional modules can be effectively solved, the accuracy of measuring the actual environment temperature of the electronic product with multiple functions is further improved, and the applicability of the technical scheme provided by the embodiment of the application is enhanced.
In one embodiment of the application, the heating elements may be preset separately on each functional module. The heating component is the compensation module. The heating member may be a member having a heating function such as a heating film or a heating resistor. Under the condition that the heating component is preset on the functional module, the thermal power consumption compensation value can be a current value, and the current thermal power consumption compensation value is the current value.
Based on this, the step S331 may specifically be to supply power to the heating element preset on each functional module according to the current value of each functional module.
In the embodiment of the application, after determining the current heat power consumption compensation value of each functional module, namely the current value of each functional module, the controller supplies power to the preset heating component on each functional module according to the current value of the functional module.
For example, the functional module is a wireless fidelity (WIRELESS FIDELITY, WIFI) module. The working states of the WiFi module comprise a network distribution searching state, a dormancy keep-alive state, a normal networking streaming state and a high-rate downloading state. The original thermal power consumption of the WiFi module is P 1 in the network searching state of the distribution network, the original thermal power consumption of the WiFi module is P 2 in the dormancy and keep-alive state, the original thermal power consumption of the WiFi module is P 3 in the normal networking and outflow state, and the original thermal power consumption of the WiFi module is P 4 in the high-rate and quick downloading state. Wherein, P 1<P2<P3<P4. The preset sub-thermal power consumption of the WiFi module is P 4.
At this time, in the network searching state of the distribution network, the compensation heat consumption of the WiFi module is P 4-P1, the compensation value (i.e., current value) of the heat consumption is (P 4-P1)/U, in the sleep keep-alive state, the compensation heat consumption of the WiFi module is P 4-P2, the compensation value (i.e., current value) of the heat consumption is (P 4-P2)/U, in the normal networking outflow state, the compensation heat consumption of the WiFi module is P 4-P3, the compensation value (i.e., current value) of the heat consumption is (P 4-P3)/U, in the high-rate downloading state, the compensation heat consumption of the WiFi module is 0, and the compensation value (i.e., current value) of the heat consumption is 0. Wherein U represents the working voltage of the WiFi module.
When the current working state is determined to be the network searching state, the controller supplies power to a heating component preset on the WiFi module according to the current value (P 4-P1)/U. And when the current working state is determined to be the dormant keep-alive state, the controller supplies power to a heating component preset on the WiFi module according to the current value (P 4-P2)/U. And when the current working state is determined to be a normal networking outflow state, the controller supplies power to a heating component preset on the WiFi module according to the current value (P 4-P3)/U. And when the current working state is determined to be a high-rate and quick downloading state, the controller supplies power to a heating component preset on the WiFi module according to the current value 0.
In the embodiment of the application, the controller identifies the working state of the electronic product, and controls the input current of the heating component preset on the functional module in each working state, so that the stability of the total heat power consumption of the functional module can be ensured, the stability of the influence of the functional module on the temperature sensor is further ensured, and the accuracy of measuring the actual environment temperature of the electronic product with multiple functions is improved.
In one embodiment of the present application, the thermal power compensation value is a chip operating parameter of the functional module, and the current thermal power compensation value is a current chip operating parameter of the functional module.
Based on this, the step S331 may specifically be to perform thermal power compensation on each functional module according to the current chip operating parameter of each functional module.
In the embodiment of the application, after determining the current heat power consumption compensation value of each functional module, namely the current chip working parameter of each functional module, the controller adjusts the chip of the functional module according to the current chip working parameter of the functional module so that the chip working parameter of the functional module is updated to the current chip working parameter. The total thermal power consumption of the functional module at the current chip working parameters is the preset sub-thermal power consumption.
For example, the preset sub-thermal power consumption of the WiFi module is P 4. And after the WiFi module is subjected to heat power compensation according to the current chip working parameters of the WiFi module, the preset sub heat power consumption of the WiFi module reaches P 4.
In the embodiment of the application, the controller can also adopt other modes to compensate the heat power consumption of each functional module. This is not limited.
The temperature measurement method provided by the embodiment of the application is described in detail below with reference to the flow diagrams of the temperature measurement method shown in fig. 5 and 6.
In the temperature measurement method shown in fig. 5:
Step S51, determining the functional module included in the electronic product according to the function and the space position.
Specifically, the electronic product includes a plurality of devices that have an influence on temperature measurement. These devices constitute the set of influence sources. Each device in the influence source set is defined as a different functional module according to the function and the spatial position of each device in the influence source set.
And S52, presetting a thermal power consumption compensation measure for each functional module.
Specifically, a heating film or a heating resistor is preset on each functional module, or chip working parameters for thermal power consumption compensation are configured for each functional module.
Step S53, testing the original thermal power consumption of each functional module under different working states.
Here, each functional module should have a corresponding feedback signal, which can be denoted as feedback signal a, in different operating states.
And step S54, performing heat power consumption compensation on each functional module under different working states.
After the heat power consumption is compensated, for each functional module, the total heat power consumption of the functional module in different working states is a stable value. The signal for adjusting the compensation thermal power consumption can be referred to as an adjustment signal b.
In step S55, a one-to-one mapping relationship is established between the feedback signal a and the adjustment signal b. That is, a correspondence relation between the operating state and the heat power consumption compensation value is established.
In the embodiment of the present application, when the working state of the electronic product changes, each functional module generates a corresponding feedback signal a, so as to obtain a corresponding adjustment signal b of each functional module based on the mapping relationship in step S55. And carrying out heat power compensation on the functional modules by utilizing the adjusting signals b of each functional module, so that the heating state of the electronic product is stable, the original environment temperature measured by the temperature sensor is stable, and the difference value between the original environment temperature measured by the temperature sensor and the actual environment temperature is a fixed value. The controller can rapidly and accurately measure the actual ambient temperature by using the fixed value.
Fig. 6 is a diagram illustrating only 3 functional modules, i.e., the functional module 1, the functional module 2, and the functional module 3, in the electronic product, and is not limited thereto.
In fig. 6, the operating states of the functional modules 1,2 and 3 are monitored. When the working state of the functional module is monitored to change, namely, when the heat power consumption of the monitored functional module is changed, the functional module is subjected to heat power consumption compensation. The specific heat power compensation method is described in the above sections of fig. 3-4, and will not be repeated here.
And the heat power consumption compensation is carried out on the functional modules, so that the influence of all the functional modules on the temperature is a fixed value. And carrying out temperature compensation on the original environment temperature measured by the temperature sensor by utilizing the fixed value of the temperature influence of all the functional modules to obtain the actual environment temperature.
Based on the above temperature measurement method, the embodiment of the application further provides a temperature measurement device, as shown in fig. 7, which includes:
a first obtaining unit 71, configured to obtain a current working state of the electronic product;
The determining unit 72 is configured to determine, according to a preset correspondence between a working state and a thermal power consumption compensation value, a current thermal power consumption compensation value corresponding to the current working state, where a sum of original thermal power consumption and compensation thermal power consumption of the electronic product in the working state is the preset thermal power consumption, and the compensation thermal power consumption of the electronic product is the thermal power consumption of the electronic product obtained by using the thermal power consumption compensation value corresponding to the working state;
a first compensation unit 73, configured to perform thermal power compensation on the electronic product using the current thermal power compensation value;
a second obtaining unit 74, configured to obtain a current original environmental temperature measured by the electronic product after thermal power compensation;
the second compensation unit 75 is configured to perform temperature compensation on the current original ambient temperature by using a preset compensation temperature under preset thermal power consumption, so as to obtain a current actual ambient temperature.
In an alternative embodiment, the corresponding relation between the preset working state and the heat power consumption compensation value comprises a corresponding relation between the preset working state and the heat power consumption compensation value of each functional module included in the electronic product, wherein the sum value of the original heat power consumption and the compensation heat power consumption of each functional module in the working state is the preset sub heat power consumption of the functional module, the compensation heat power consumption of each functional module is the heat power consumption of the functional module obtained by using the heat power consumption compensation value of the functional module corresponding to the working state, and the sum value of the original heat power consumption and the preset sub heat power consumption of all the functional modules included in the electronic product is the preset heat power consumption;
the determining unit 72 may specifically be configured to determine, according to a preset correspondence between the working state and the thermal power consumption compensation value of each functional module, a current thermal power consumption compensation value of each functional module corresponding to the current working state;
The first compensation unit 73 may be specifically configured to perform thermal power compensation on each functional module using the current thermal power compensation value of each functional module.
In an alternative embodiment, each functional module is respectively preset with a heating component, and the heat power consumption compensation value is a current value;
the first compensation unit 73 may be specifically configured to supply power to a heating element preset on each functional module according to a current value of each functional module.
In an alternative embodiment, the heating element may be a heating film or a heating resistor.
In an alternative embodiment, the thermal power compensation value may be a chip operating parameter of the functional module;
The first compensation unit 73 may specifically be configured to perform thermal power compensation on each functional module according to the current chip operating parameter of each functional module.
In an alternative embodiment, the maximum compensated thermal power consumption of each functional module is greater than or equal to the difference between the maximum thermal power consumption and the minimum thermal power consumption of the functional module.
In the technical scheme provided by the embodiment of the application, for the electronic products in various working states, different heat power compensation values are used for carrying out heat power compensation on the electronic products in different working states, so that the overall heat power consumption of the electronic products is constant and preset heat power consumption. Under the condition that the overall thermal power of the electronic product is constant, the original environment temperature measured by the electronic product is subjected to temperature compensation by using a fixed value (namely preset compensation temperature), so that the actual environment temperature can be accurately obtained, and the accuracy of measuring the actual environment temperature by the electronic product with multiple functions is improved.
Based on the above temperature measurement method, the embodiment of the application further provides an electronic product, as shown in fig. 8, which comprises a processor 81, a memory 82 and a temperature sensor 83, wherein the memory 82 is used for storing a computer program, the temperature sensor 83 is used for measuring the original ambient temperature, and the processor 81 is used for implementing any of the above temperature measurement method steps when executing the program stored on the memory 82.
The Memory may include random access Memory (Random Access Memory, RAM) or may include Non-Volatile Memory (NVM), such as at least one disk Memory. Optionally, the memory may also be at least one memory device located remotely from the aforementioned processor.
The Processor may be a general purpose Processor including a central processing unit (Central Processing Unit, CPU), a network Processor (Network Processor, NP), etc., or may be a digital signal Processor (DIGITAL SIGNAL Processor, DSP), application SPECIFIC INTEGRATED Circuit (ASIC), field-Programmable gate array (Field-Programmable GATE ARRAY, FPGA) or other Programmable logic device, discrete gate or transistor logic device, discrete hardware components.
In yet another embodiment of the present application, a computer readable storage medium is provided, in which a computer program is stored, which when executed by a processor, implements any of the above-described temperature measurement method steps.
In a further embodiment of the present application, there is also provided a computer program which, when run on a computer, causes the computer to perform any of the temperature measurement method steps described above.
In the above embodiments, it may be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded and executed on a computer, produces a flow or function in accordance with embodiments of the present application, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a computer network, or other programmable apparatus. The computer instructions may be stored in or transmitted from one computer-readable storage medium to another, for example, by wired (e.g., coaxial cable, optical fiber, digital Subscriber Line (DSL)), or wireless (e.g., infrared, wireless, microwave, etc.). The computer readable storage medium may be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. that contains an integration of one or more available media. The usable medium may be a magnetic medium (e.g., floppy disk, hard disk, tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid state disk Solid STATE DISK (SSD)), etc.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
In this specification, each embodiment is described in a related manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for the temperature measuring device, the electronic product, the computer-readable storage medium and the computer program embodiment, the description is relatively simple, since it is substantially similar to the method embodiment, and reference is made to the description of the method embodiment for relevant points.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the protection scope of the present application.
Claims (14)
1. A method of temperature measurement, the method comprising:
acquiring the current working state of the electronic product;
Determining a current thermal power consumption compensation value corresponding to a current working state according to a corresponding relation between the preset working state and the thermal power consumption compensation value, wherein the sum of the original thermal power consumption and the compensation thermal power consumption of the electronic product in the working state is the preset thermal power consumption, and the compensation thermal power consumption of the electronic product is the thermal power consumption of the electronic product obtained by utilizing the thermal power consumption compensation value corresponding to the working state;
using the current heat power compensation value to carry out heat power compensation on the electronic product;
acquiring the current original environment temperature measured by the electronic product after heat consumption compensation;
and performing temperature compensation on the current original environment temperature by using the preset compensation temperature under the preset thermal power consumption to obtain the current actual environment temperature.
2. The method of claim 1, wherein the correspondence between the preset operating state and the thermal power compensation value includes a correspondence between the preset operating state and the thermal power compensation value of each functional module included in the electronic product, a sum of original thermal power consumption and compensation thermal power consumption of each functional module in the operating state is a preset sub thermal power consumption of the functional module, the compensation thermal power consumption of each functional module is a thermal power consumption of the functional module obtained by using the thermal power compensation value of the functional module corresponding to the operating state, and a sum of original thermal power consumption and preset sub thermal power consumption of all functional modules included in the electronic product is the preset thermal power consumption;
the step of determining the current thermal power consumption compensation value corresponding to the current working state according to the corresponding relation between the preset working state and the thermal power consumption compensation value comprises the following steps:
determining a current thermal power consumption compensation value of each functional module corresponding to the current working state according to the corresponding relation between the preset working state and the thermal power consumption compensation value of each functional module;
The step of using the current thermal power compensation value to perform thermal power compensation on the electronic product includes:
and carrying out heat power consumption compensation on each functional module by using the current heat power consumption compensation value of each functional module.
3. The method according to claim 2, wherein each functional module is provided with a heating component, and the heat power consumption compensation value is a current value;
The step of performing thermal power compensation on each functional module by using the current thermal power compensation value of each functional module includes:
And supplying power to a heating component preset on each functional module according to the current value of each functional module.
4. A method according to claim 3, wherein the heating element is a heating film or a heating resistor.
5. The method of claim 2, wherein the thermal power compensation value is a chip operating parameter of a functional module;
The step of performing thermal power compensation on each functional module by using the current thermal power compensation value of each functional module includes:
and carrying out heat power consumption compensation on each functional module according to the current chip working parameters of each functional module.
6. The method of any of claims 1-5, wherein the maximum compensated thermal power consumption of each functional module is greater than or equal to the difference between the maximum thermal power consumption and the minimum thermal power consumption of the functional module.
7. A temperature measurement device, the device comprising:
the first acquisition unit is used for acquiring the current working state of the electronic product;
The electronic product comprises a determining unit, a control unit and a control unit, wherein the determining unit is used for determining a current thermal power consumption compensation value corresponding to a current working state according to a corresponding relation between the preset working state and the thermal power consumption compensation value, the sum of original thermal power consumption and compensation thermal power consumption of the electronic product in the working state is the preset thermal power consumption, and the compensation thermal power consumption of the electronic product is the thermal power consumption of the electronic product obtained by utilizing the thermal power consumption compensation value corresponding to the working state;
the first compensation unit is used for carrying out heat power compensation on the electronic product by using the current heat power compensation value;
the second acquisition unit is used for acquiring the current original environment temperature measured by the electronic product after the thermal power consumption compensation;
And the second compensation unit is used for performing temperature compensation on the current original environment temperature by using the preset compensation temperature under the preset thermal power consumption to obtain the current actual environment temperature.
8. The apparatus of claim 7, wherein the correspondence between the preset operation state and the thermal power compensation value includes a correspondence between a preset operation state and a thermal power compensation value of each functional module included in the electronic product, a sum of original thermal power consumption and compensation thermal power consumption of each functional module in the operation state is a preset sub thermal power consumption of the functional module, the compensation thermal power consumption of each functional module is a thermal power consumption of the functional module obtained by using the thermal power compensation value of the functional module corresponding to the operation state, and a sum of original thermal power consumption and preset sub thermal power consumption of all functional modules included in the electronic product is the preset thermal power consumption;
the determining unit is specifically configured to determine, according to a preset correspondence between a working state and a thermal power consumption compensation value of each functional module, a current thermal power consumption compensation value of each functional module corresponding to the current working state;
the first compensation unit is specifically configured to perform thermal power compensation on each functional module by using a current thermal power compensation value of each functional module.
9. The device according to claim 8, wherein each functional module is provided with a heating component, and the heat power consumption compensation value is a current value;
the first compensation unit is specifically configured to supply power to a heating component preset on each functional module according to the current value of each functional module.
10. The device of claim 9, wherein the heating component is a heating film or a heating resistor.
11. The apparatus of claim 8, wherein the thermal power compensation value is a chip operating parameter of a functional module;
the first compensation unit is specifically configured to perform thermal power compensation on each functional module according to the current chip operating parameter of each functional module.
12. The apparatus of any of claims 7-11, wherein the maximum compensated thermal power consumption of each functional module is greater than or equal to the difference between the maximum thermal power consumption and the minimum thermal power consumption of the functional module.
13. An electronic product comprising a processor and a memory, said memory for storing a computer program, said processor being adapted to carry out the method steps of any one of claims 1-6 when the program stored on the memory is executed.
14. A computer-readable storage medium, characterized in that the computer-readable storage medium has stored therein a computer program which, when executed by a processor, implements the method steps of any of claims 1-6.
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