CN115458498A - Semiconductor devices and lead frames - Google Patents

Abstract

The present application provides a semiconductor device and a lead frame for constructing the semiconductor device, the semiconductor device includes at least one semiconductor chip attached to a base island; wherein a metal part is attached to the surface of the semiconductor chip ; at least one supporting part is located at a position spaced from the base island, and has at least one positioning area; wherein, the metal piece extends from the surface of the semiconductor chip into the positioning area of the supporting part to fix in the positioning area of the supporting part.

Description

Semiconductor devices and lead frames

technical field

The present application relates to the field of semiconductor packaging, in particular to a semiconductor device and a lead frame used to construct the semiconductor device.

Background technique

Packaged products are usually obtained by mounting the chip on the lead frame, electrically connecting the chip and the lead frame with bonding wires, and finally packaging it with packaging materials.

FIG. 1 is a schematic structural diagram of a conventional semiconductor device 1000 in the art. As shown in FIG. 1 , the semiconductor device 1000 includes a first chip 1021 and a third chip 1023 attached to a first base island 1011 , and a second chip 1022 attached to a second base island 1012 . A plurality of lead fingers 1013 are disposed around the first base island 1011 and the second base island 1012 . As shown in Figure 1, the pads of the third chip 1023 and the second chip 1022 are electrically connected to a lead finger 1013 through a lead 103 respectively, and the first chip 1021 and the second chip 1022 Then, they are electrically connected through a metal piece 104 . In the conventional semiconductor device 1000 shown in FIG. 1 , one end of the metal piece 104 is fixed on a supporting portion 1014 . The metal piece 104 is used to electrically connect the first chip 1021 and the second chip 1022 , and can also be used to realize the heat dissipation function, and is usually in the shape of a sheet made of metallic copper or an alloy containing copper.

In the conventional semiconductor device 1000 shown in FIG. 1 , the metal part 104 is usually fixed by reflow soldering. During the reflow soldering process, the metal part 104 will float above the fluid solder paste, drift or even rotate. However, the accuracy of the final welded product is not high enough. In the process of fixing the metal piece 104 by adhesive fusion, the metal piece 104 is also prone to problems such as offset and rotation, which lead to deviations in accuracy.

Therefore, it is necessary to provide a new semiconductor device to overcome the above defects.

Contents of the invention

The purpose of the present application is to provide a semiconductor device and a lead frame used for manufacturing the semiconductor device. By setting the positioning area for the metal part, the problem of deviation in precision caused by the offset and rotation generated during the installation of the metal part is solved.

In order to achieve the above object, according to one aspect of the present application, a semiconductor device is provided, including at least one semiconductor chip attached to a base island; wherein, a metal part is attached to the surface of the semiconductor chip; at least one supporting portion Located at a position spaced from the base island, and having at least one positioning area; wherein, the metal piece extends from the surface of the semiconductor chip into the positioning area of the support part, so as to be fixed on the support part within the location zone of the .

In some embodiments, the positioning area is formed by removing at least part of the thickness of the support portion.

In some embodiments, the support portion has a first surface, and the positioning area is formed by removing part of the thickness from the first surface of the support portion; wherein, the first surface of the support portion is the The supporting portion faces one side surface of the metal piece.

In some embodiments, the metal part includes a first part attached to the surface of the semiconductor chip, a second part fixed in the positioning area of the support part, and a connection between the first part and the The connection part of the second part; wherein, the surface of the second part of the metal part is attached to the positioning area.

In some embodiments, the positioning area is a through hole disposed on the supporting part.

In some embodiments, the metal part includes a first part attached to the surface of the semiconductor chip, a second part fixed in the positioning area of the support part, and a connection between the first part and the A connecting portion of the second portion; wherein, the second portion of the metal member extends into the through hole.

In some embodiments, a part of the surface of the connecting portion of the metal piece is attached to the supporting portion.

In some embodiments, the support portion has a first surface, and has at least one first positioning area and at least one second positioning area; wherein, the first positioning area is removed from the first surface of the support portion part of the thickness, and the second positioning area is a through hole provided in the supporting part.

In some embodiments, the metal member includes a first portion attached to the surface of the semiconductor chip, a second portion extending into the second positioning area, and a connection between the first portion and the second positioning area. The connecting part of the two parts; wherein, a part of the surface of the connecting part of the metal part is attached to the first positioning area.

In some embodiments, at least one protrusion is provided on the surface of the metal part facing the semiconductor chip, and the semiconductor chip is bonded to the protrusion through a conductive material.

In some embodiments, the semiconductor device further includes a plurality of lead fingers, and each lead finger is connected to the semiconductor chip through a lead.

In some embodiments, the semiconductor device further includes a second chip, and the second chip is attached to a second base island; wherein, the second chip and the semiconductor chip are electrically connected through the metal member. sexual connection.

In some embodiments, a plurality of protrusions are provided on the surface of the metal part facing the semiconductor chip and the second chip, and the semiconductor chip and the second chip are respectively connected to the semiconductor chip and the second chip through a conductive material. Raised fit.

In some embodiments, the semiconductor device further includes a plurality of lead fingers, and the semiconductor chip and the second chip are respectively connected to a lead finger through a lead.

According to another aspect of the present application, a lead frame is provided for a semiconductor device; the lead frame includes at least one package unit, each package unit includes: at least one base island for receiving a semiconductor chip; at least one The support part is spaced from the base island and has at least one positioning area; and a plurality of lead fingers are arranged around the base island for receiving leads; wherein, the positioning area removes at least one positioning area from the support part. part thickness.

According to an aspect of the present application, it is provided that the support portion has a first surface, and the positioning area is formed by removing part of the thickness from the first surface of the support portion; wherein, the first surface of the support portion is The supporting portion is used for receiving a surface of a metal piece.

According to an aspect of the present application, the positioning area is provided as a through hole disposed on the support portion.

According to an aspect of the present application, it is provided that the supporting part has a first surface and includes at least one first positioning area and at least one second positioning area; wherein, the first positioning area is the first positioning area of the supporting part. The surface is formed by removing part of the thickness, and the second positioning area is a through hole provided in the supporting part.

In this application, by forming different positioning areas on the support part used to fix the metal part, and at the same time cooperate with the adjusted structure of the metal part for fixing, so that a gap is formed between the metal part and the support part. The relatively fixed corresponding positional relationship further solves the problem of precision deviation caused by offset rotation generated during the setting of metal parts.

Description of drawings

FIG. 1 is a schematic structural diagram of a semiconductor device 1000 in the prior art;

2A is a top view of the first chip, the second chip, the first base island, the second base island, lead fingers and leads integrated into the semiconductor device 1;

FIG. 2B is a schematic structural view of the semiconductor device 1 in FIG. 2A with metal parts removed;

Fig. 2C and Fig. 2D are the sectional view at 2C-2C ' place among Fig. 2A;

3A is a top view of the first chip, the second chip, the first base island, the second base island, lead fingers and leads integrated into the semiconductor device 2;

Fig. 3B and Fig. 3 C are the sectional view at 2B-2B' place among Fig. 3A;

4A is a top view of the first chip, the second chip, the first base island, the second base island, lead fingers and leads integrated into the semiconductor device 3;

Fig. 4B is a sectional view at 4B-4B' place among Fig. 4A; Fig. 4C is a sectional view at 4C-4C' place among Fig. 4A;

5A is a top view of the first chip, the second chip, the first base island, the second base island, lead fingers and leads integrated into the semiconductor device 4;

Figure 5B is a cross-sectional view at 5B-5B' in Figure 4A;

Fig. 6A is a schematic structural view of a lead frame 100 according to an embodiment of the present application, and Fig. 6B is a cross-sectional view at 6B-6B' in Fig. 6A;

Fig. 7A is a schematic structural diagram of a lead frame 200 according to an embodiment of the present application, and Fig. 7B is 7B-7B' in Fig. 7A

cross-sectional view at

FIG. 8A is a schematic structural diagram of a lead frame 300 according to an embodiment of the present application, and FIG. 8B is a schematic structural diagram of a lead frame 400 according to an embodiment of the present application.

detailed description

Hereinafter, the technology of the present application will be described in detail in combination with specific implementation manners. It should be understood that the following specific embodiments are only used to help those skilled in the art understand the present application, rather than limiting the present application.

Embodiment 1 Semiconductor Device 1

In this embodiment, a semiconductor device 1 is provided. As shown in FIG. 2A and FIG. 2B, the semiconductor device 1 of this embodiment includes a first chip 121 and a third chip 123 attached to the first base island 111, and a second chip 123 attached to the second base island 112. Chip 122. The semiconductor device 1 of this embodiment also includes a plurality of lead fingers 113, the bonding pads of the third chip 123 and the second chip 122 are respectively electrically connected to a lead finger 113 through a lead 13, and the The first chip 121 is electrically connected to the second chip 122 through a metal piece 14 . The metal parts 14 are attached to the surfaces of the first chip 121 and the third chip 123 respectively.

As shown in FIG. 2B and FIG. 2C , a support portion 114 is provided at a position spaced from the first base island 111 (and/or the second base island 112 ) for fixing the metal piece 14 . In order to better position the metal piece 14 during the manufacturing process, the support portion 114 has a positioning area 1141 .

Those skilled in the art can understand that the semiconductor device 1 also includes a base for plastic packaging the first base island 111, the second base island 112, the lead fingers 113, the first chip 121, the second chip 122, and the third chip. 123 , the packaging material EM of the leads 13 and the metal parts 14 .

Specifically, as shown in FIG. 2C, the metal member 14 includes a first portion 141 attached to the surface of the first chip 121 (and the second chip 122 in FIG. 2A ), fixed on the support portion The second part 142 in the positioning area 1141 of 114 , and the connecting part 143 connecting the first part 141 and the second part 142 . In addition, the side surface of the metal member 140 facing the first chip 121 (and the second chip 122 in FIG. 2A ) is provided with the first chip 121 (and the second chip in FIG. 2A ). 122) The corresponding protrusion 144, the first chip 121 (and the second chip 122 in FIG. 2A ) is attached to the corresponding protrusion 144 through a conductive material.

The supporting part 114 has a first surface 114a, which is the side surface of the supporting part 114 facing the metal part 14, that is, the first surface 114a is the side surface of the supporting part 114 in FIG. 2C upper surface. The positioning area 1141 is formed by removing part of the thickness of the first surface 114 a of the supporting portion 114 . That is to say, in this embodiment, in order to better position the metal piece 14, part of the thickness of the first surface 114a of the support portion 114 is removed to form a groove-shaped positioning on the first surface 114a. District 1141.

Thus, after attaching the metal piece 14 as shown in FIG. 2A , as shown in FIG. 2D , the metal piece 14 is removed from the first chip 121 (and the second chip 122 in FIG. The surface extends into the positioning area 1141 of the support portion 114 , and makes the surface of the second portion 142 adhere to the positioning area 1141 .

Embodiment 2 Semiconductor device 2

In this embodiment, a semiconductor device 2 is provided. The semiconductor device 2 in this embodiment is a modification of the semiconductor device 1 in the first embodiment, and its structure is basically the same as that of the semiconductor device 1 in the first embodiment, except that the structure of the positioning area and the metal parts are different.

Similar to the semiconductor device 1, as shown in FIG. 3A, the semiconductor device 2 of this embodiment includes a first chip 221 and a third chip 223 attached to the first base island 211, and a second chip attached to the second base island. 212 of the second chip 222 . The semiconductor device 2 of this embodiment also includes a plurality of lead fingers 213, the pads of the third chip 223 and the second chip 222 are electrically connected to a lead finger 213 through a lead 23 respectively, and the The first chip 221 is electrically connected to the second chip 222 through a metal piece 24 . The metal parts 24 are attached to the surfaces of the first chip 221 and the third chip 223 respectively, and the metal parts 24 are fixed on a surface connected to the first base island 211 (and/or the second base island 211). islands 212) spaced support portions 214.

It can be understood by those skilled in the art that the semiconductor device 2 also includes plastic packaging for the first base island 211, the second base island 212, the lead fingers 213, the first chip 221, the third chip 223, and the second chip. 222, the encapsulation material EM of the leads 23 and the metal parts 24.

The difference from the semiconductor device 1 in Embodiment 1 is that, as shown in FIG. 3B , the metal member 24 includes a surface attached to the first chip 221 (and the second chip 222 in FIG. 3A ). The first part 241 , the second part 242 fixed to the supporting part 214 , and the connection part 243 connecting the first part 241 and the second part 242 . In addition, the side surface of the metal part 240 facing the first chip 221 (and the second chip 222 in FIG. 3A ) is provided with the first chip 221 (and the second chip 222 in FIG. 222) the corresponding protrusion 244, the first chip 221 (and the second chip 222 in FIG. 3A ) is bonded to the corresponding protrusion 244 through a conductive material.

The difference from the semiconductor device 1 in Embodiment 1 is that, as shown in FIGS. 3A and 2B , the support portion 214 has a first surface 214a, and the first surface 214a is where the support portion 214 faces the metal member. One side surface of 24, that is, the first surface 214a is the upper surface of the support portion 214 in FIG. 3B. In order to better position the metal component 24 during the manufacturing process, the support portion 214 has a positioning area 2141 .

The difference from the semiconductor device 1 in Embodiment 1 is that, as shown in FIG. 3B , the positioning region 2141 in this embodiment removes all the thickness from the first surface 214a of the support portion 214 so as to form on the support portion 214 The positioning area 2141 in the form of a through hole is formed.

Thus, after mounting the metal piece 24 as shown in FIG. 3A, as shown in FIG. 3C, the metal piece 21 is removed from the first chip 221 (and the third chip 23 in FIG. 2A ) The surface extends into the positioning area 1141 of the support portion 114 and makes the second portion 242 extend into the positioning area 2141 .

Embodiment 3 Semiconductor Device 3

In this embodiment, a semiconductor device 3 is provided. The semiconductor device 3 in this embodiment is a modification of the semiconductor device 1 in the first embodiment, and its structure is basically the same as that of the semiconductor device 1 in the first embodiment, except that the structure of the positioning area and the metal parts are different.

Similar to the semiconductor device 1, as shown in FIG. 4A, the semiconductor device 3 of this embodiment includes a first chip 321 and a second chip 322 attached to the first base island 311, and a second chip 322 attached to the second base island. 312 of the third chip 323 . The semiconductor device 3 of this embodiment also includes a plurality of lead fingers 313, the pads of the second chip 322 and the third chip 323 are electrically connected to a lead finger 313 through a lead 33 respectively, and the The first chip 321 is electrically connected to the third chip 323 through a metal piece 34 . The metal parts 34 are attached to the surfaces of the first chip 321 and the second chip 322 respectively, and the metal parts 34 are fixed on a surface connected to the first base island 311 (and/or the second base island 311). islands 312) spaced support portions 314.

Those skilled in the art can understand that the semiconductor device 3 also includes a base for plastic packaging the first base island 311, the second base island 312, the lead fingers 313, the first chip 321, the second chip 322, and the third chip. 323 , the encapsulation material EM of the leads 33 and the metal parts 34 .

In order to better position the metal component 34 during the manufacturing process, the support portion 314 has a positioning area 3141 . Different from the semiconductor device 1 of the first embodiment, as shown in FIGS. 4A and 3B , the positioning area 3141 is a plurality of through holes formed in the support portion 314 .

Specifically, as shown in FIG. 4A and FIG. 4B, the support portion 314 has a first surface 314a, and the first surface 314a is a side surface of the support portion 314 facing the metal piece 34, that is, the first The surface 314a is the upper surface of the support portion 314 in FIG. 4B . The positioning area 3141 in this embodiment removes the entire thickness of the first surface 314 a of the support portion 314 to form a plurality of positioning areas 3141 in the form of through holes in the support portion 314 .

As shown in FIG. 4B and FIG. 4C, the metal member 34 includes a first part 341 attached to the surface of the first chip 321 and the second chip 322, and a second part 342 extending into the positioning area 3141. , and a connecting portion 343 connecting the first portion 341 and the second portion 342 . As shown in FIG. 4C , part of the surface of the connecting portion 343 is attached to the first surface 314 a of the supporting portion 314 . As shown in FIG. 4B , the side surface of the metal part 34 facing the second chip 322 is provided with a protrusion 344 corresponding to the second chip 322 ; similarly, as shown in FIG. 4C , the metal part 34 A protrusion 344 corresponding to the first chip 321 is disposed on a surface facing the first chip 321 .

Embodiment 4 Semiconductor device 4

In this embodiment, a semiconductor device 4 is provided. The semiconductor device 4 in this embodiment is a modification of the semiconductor device 3 in the third embodiment, and its structure is basically the same as that of the semiconductor device 3 in the third embodiment, except that the setting of the positioning area is different.

Specifically, like the semiconductor device 3, as shown in FIG. 5A, the semiconductor device 4 of this embodiment includes a first chip 421 and a second chip 422 attached to the first base island 411, and a second chip 422 attached to the first base island 411. The third chip 423 of the second base island 412 . The semiconductor device 4 of this embodiment also includes a plurality of lead fingers 413, the pads of the second chip 422 and the third chip 423 are respectively electrically connected to a lead finger 413 through a lead 43, and the The first chip 421 is electrically connected to the third chip 423 through a metal piece 44 . The metal parts 44 are attached to the surfaces of the first chip 421 and the second chip 422 respectively, and the metal parts 44 are fixed on a surface connected to the first base island 411 (and/or the second base island 411). islands 312) spaced apart support portions 414.

Those skilled in the art can understand that the semiconductor device 3 also includes a base for plastic packaging the first base island 311, the second base island 312, the lead fingers 313, the first chip 321, the second chip 322, and the third chip. 323 , the encapsulation material EM of the leads 33 and the metal parts 34 .

In this embodiment, similar to Embodiment 3, in order to better position the metal piece 44 during the manufacturing process, the support portion 414 has a positioning area. The difference from the semiconductor device 3 in Embodiment 3 is that, as shown in FIG. 5A , the support portion 414 in this embodiment is provided with a first positioning area 4141 and a second positioning area 4142, wherein the second positioning area The location and structure of 4142 are the same as those of the positioning area 3414 in Embodiment 3, and will not be repeated here. In addition, in this embodiment, the structure of the metal part 44 is the same as that of the metal part 34 provided in the third embodiment, and will not be repeated here.

As shown in FIG. 5B , similar to Embodiment 3, the support portion 414 in this embodiment has a first surface 414a, and the first surface 414a is the side of the support portion 414 facing the metal piece 44 The surface, that is, the first surface 414a is the upper surface of the support portion 414 in FIG. 5B . The second positioning area 4142 in this embodiment is the second positioning area 4142 in the shape of a groove formed on the supporting portion 414 by removing part of the thickness from the first surface 414 a of the supporting portion 414 .

Therefore, different from Embodiment 3 shown in FIG. 4C, as shown in FIG. 5B, the connection portion 443 of the metal piece 44 of this embodiment extends into the second positioning area 4142 of the support portion 414, and the connection portion 443 is attached to the surface of the second positioning area 4142 .

Embodiment 5 Lead frame 100 and lead frame 200

This embodiment provides a lead frame 100 for manufacturing the semiconductor device 1 of the first embodiment. Those skilled in the art can understand that the lead frame 100 includes one or more packaging units defined by packaging lines W, and the packaging units are connected by an outer frame 101 . FIG. 6A shows a structure of a packaging unit.

As shown in FIG. 6A, in a package unit, the lead frame 100 includes a first base island 111, a second base island 112, a plurality of lead fingers 113 surrounding the first base island 111 and the second base island 112, and The supporting portion 114 is spaced apart from the first base island 111 and the second base island 112 . Those skilled in the art can understand that the first base island 111 , the second base island 112 , the lead fingers 113 and the support portion 114 are also connected through the outer frame 101 to form a complete lead frame 100 .

As shown in FIG. 6B and the corresponding FIG. 2C of Embodiment 1, in this embodiment, the support portion 114 has a first surface 114a, and the first surface 114a of the support portion 114 removes part of the thickness to form a positioning Region 1141 , thus, the positioning region 1141 is a groove formed by removing part of the thickness from the surface of the support part 114 .

Embodiment 6 Lead frame 200

This embodiment provides a lead frame 200 for manufacturing the semiconductor device 2 of the second embodiment. Those skilled in the art can understand that the lead frame 200 includes one or more packaging units defined by packaging lines W, and the packaging units are connected by an outer frame 201 . FIG. 7A shows a structure of a packaging unit.

As shown in FIG. 7A, in a package unit, the lead frame 200 includes a first base island 211, a second base island 212, a plurality of lead fingers 213 surrounding the first base island 211 and the second base island 212, and The supporting portion 214 is spaced apart from the first base island 211 and the second base island 212 . Those skilled in the art can understand that the first base island 211 , the second base island 212 , the lead fingers 213 and the support portion 214 are also connected through the outer frame 201 to form a complete lead frame 200 .

As shown in FIG. 7B and the corresponding FIG. 3B of Embodiment 2, in this embodiment, the support portion 214 has a first surface 214a, and the first surface 214a of the support portion 214 removes all thicknesses to form a positioning area 2141 , thus, the positioning area 2141 is a through hole formed in the support portion 214 .

Embodiment 7 Lead frame 300 and lead frame 400

In this embodiment, the lead frame 300 used to prepare the semiconductor device 3 of the third embodiment and the lead frame 400 used to prepare the semiconductor device 4 of the fourth embodiment are respectively provided.

The lead frame 300 includes one or more packaging units defined by packaging lines W, and the packaging units are connected by an outer frame 301 . FIG. 8A shows the structure of a packaging unit. As shown in FIG. 8A, in a package unit, the lead frame 300 includes a first base island 311, a second base island 312, a plurality of lead fingers 313 surrounding the first base island 311 and the second base island 312, and The supporting portion 314 is spaced apart from the first base island 311 and the second base island 312 . Those skilled in the art can understand that the first base island 311 , the second base island 312 , the lead fingers 313 and the support portion 314 are also connected through the outer frame 301 to form a complete lead frame 300 .

As shown in FIG. 8A , in the lead frame 300 of this embodiment, the support portion 314 has two positioning areas 3141 , and the positioning areas 3141 are through holes.

As shown in FIG. 8B , the lead frame 400 includes one or more packaging units defined by packaging lines W, and the packaging units are connected through an outer frame 401 . FIG. 7B shows a structure of a packaging unit. As shown in FIG. 7B, in a package unit, the lead frame 400 includes a first base island 411, a second base island 412, a plurality of lead fingers 413 surrounding the first base island 41 and the second base island 412, and The supporting portion 414 is spaced apart from the first base island 411 and the second base island 412 . Those skilled in the art can understand that the first base island 411 , the second base island 412 , the lead fingers 413 and the support portion 414 are also connected through the outer frame 401 to form a complete lead frame 400 .

As shown in FIG. 7B, in the lead frame 400 of this embodiment, the support portion 414 has two first positioning areas 4141 and second positioning areas 4142, wherein the first positioning areas 4141 are all through holes, and the second positioning area 4141 The second positioning area 4142 is a groove formed on the surface of the support portion 414 .

The present application has been described by the above-mentioned related embodiments, but the above-mentioned embodiments are only examples for implementing the present application. It must be pointed out that the disclosed embodiments do not limit the scope of the application. On the contrary, modifications and equivalent arrangements included in the spirit and scope of the claims are included in the scope of the present application.

Claims (18)

1. A semiconductor device comprising at least one semiconductor chip attached to a base island, characterized in that, A metal piece is attached to the surface of the semiconductor chip; At least one supporting part is located at a position spaced from the base island and has at least one positioning area; wherein, The metal piece extends from the surface of the semiconductor chip into the positioning area of the supporting part so as to be fixed in the positioning area of the supporting part. 2 . The semiconductor device according to claim 1 , wherein the positioning region is formed by removing at least part of the thickness of the support portion. 3 . 3. The semiconductor device according to claim 1, wherein the support portion has a first surface, and the positioning region is formed by removing part of the thickness from the first surface of the support portion; wherein the support portion The first surface of the part is a side surface of the supporting part facing the metal piece. 4. The semiconductor device according to claim 3, wherein the metal part comprises a first part attached to the surface of the semiconductor chip, a second part fixed in the positioning area of the supporting part. part, and a connection part connecting the first part and the second part; wherein, the surface of the second part of the metal part is attached to the positioning area. 5 . The semiconductor device according to claim 1 , wherein the positioning region is a through hole disposed on the support portion. 6 . 6. The semiconductor device according to claim 5, wherein the metal part comprises a first part attached to the surface of the semiconductor chip, a second part fixed in the positioning area of the supporting part. part, and a connection part connecting the first part and the second part; wherein, the second part of the metal part extends into the through hole. 7 . The semiconductor device according to claim 6 , wherein a part of the surface of the connecting portion of the metal member is attached to the supporting portion. 8 . 8. The semiconductor device according to claim 1, wherein the support portion has a first surface, and has at least one first positioning area and at least one second positioning area; wherein, the first positioning area It is formed by removing part of the thickness of the first surface of the support part, and the second positioning area is a through hole provided in the support part. 9. The semiconductor device according to claim 8, wherein the metal member comprises a first portion attached to the surface of the semiconductor chip, a second portion extending into the second positioning area, and A connection portion connecting the first portion and the second portion; wherein, a part of the surface of the connection portion of the metal piece is attached to the first positioning area. 10. The semiconductor device according to any one of claims 1 to 9, wherein at least one protrusion is provided on the surface of the metal member facing the semiconductor chip, and the semiconductor chip is passed through a conductive material. Fits the bumps. 11. The semiconductor device according to any one of claims 1 to 9, characterized in that, the semiconductor device further comprises a plurality of lead fingers, and each lead finger is connected to the semiconductor chip through a lead. 12. The semiconductor device according to claim 1, wherein the semiconductor device further comprises a second chip, and the second chip is attached to a second substrate; wherein, the second chip and The semiconductor chip is electrically connected through the metal piece. 13. The semiconductor device according to claim 12, wherein a plurality of protrusions are arranged on the surface of the metal part facing the semiconductor chip and the second chip, and the semiconductor chip and the second chip The second chip is bonded to the bumps through the conductive material respectively. 14. The semiconductor device according to claim 12 or 13, characterized in that, the semiconductor device further comprises a plurality of lead fingers, and the semiconductor chip and the second chip are respectively connected to a lead finger through a lead. 15. A lead frame for a semiconductor device, characterized in that the lead frame includes at least one package unit, each package unit includes: at least one substrate for receiving a semiconductor chip; at least one support portion spaced from the base island and having at least one positioning area; and, a plurality of lead fingers disposed around the base island for receiving leads; wherein, The positioning area is formed by removing at least part of the thickness of the supporting part. 16. The lead frame according to claim 15, wherein the support portion has a first surface, and the positioning area is formed by removing part of the thickness from the first surface of the support portion; wherein the support portion The first surface of the portion is a surface of the support portion for receiving a metal piece. 17. The semiconductor device according to claim 15, wherein the positioning area is a through hole disposed on the support portion. 18. The semiconductor device according to claim 15, wherein the support portion has a first surface and includes at least one first positioning area and at least one second positioning area; wherein, the first positioning area It is formed by removing part of the thickness of the first surface of the support part, and the second positioning area is a through hole provided on the support part.

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