CN115543067A - Tactile feedback device - Google Patents

Abstract

The present disclosure provides a tactile feedback device, comprising: a substrate; a plurality of electrodes disposed on the substrate; at least one high dielectric material layer disposed on the plurality of electrodes; and an anti-reflection layer disposed on the at least one electrode. on a layer of high dielectric material.

Description

Haptic feedback device

technical field

The present disclosure relates to a tactile feedback device, in particular to a tactile feedback device configured with a high dielectric material layer.

Background technique

The existing electric field type haptic feedback (haptic) device covers the electrode with an anti-reflection layer. However, when this structure is subjected to electrostatic discharge (ESD) tests or under high-voltage operation, the anti-reflection layer will not be able to effectively withstand high voltage. However, it is broken down, causing damage to the anti-reflective layer and the electrode.

The current ways to prevent high voltage damage include increasing the thickness of the anti-reflection layer, increasing the shielding layer, or reducing charge accumulation. However, simply increasing the thickness of the anti-reflection layer may cause the failure of the tactile feedback function. However, the method of setting a shielding layer or reducing charge accumulation cannot meet the current test specifications, and if the resistance of the shielding layer is too low, the tactile feedback function will fail.

Contents of the invention

According to an embodiment of the present disclosure, a tactile feedback device is provided, comprising: a substrate; a plurality of electrodes disposed on the substrate; at least one high dielectric material layer disposed on the electrodes; and an anti-reflection layer, disposed on the at least one high dielectric material layer.

Description of drawings

Embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. It should be noted that the various features are not drawn to scale and are used for illustrative purposes only. In fact, the dimensions of elements may be enlarged or reduced to clearly represent the technical features of the embodiments of the present disclosure.

FIG. 1 is a schematic cross-sectional view of a tactile feedback device according to an embodiment of the present disclosure;

FIG. 2 is a schematic cross-sectional view of a tactile feedback device according to an embodiment of the present disclosure;

FIG. 3 is a schematic cross-sectional view of a tactile feedback device according to an embodiment of the present disclosure;

FIG. 4 is an electrical and tactile feedback test of a high dielectric material layer according to an embodiment of the present disclosure;

FIG. 5 is an electrical and tactile feedback test of a low-dielectric material layer according to an embodiment of the present disclosure;

FIG. 6 is an electrical and tactile feedback test of a low dielectric material layer according to an embodiment of the present disclosure.

Symbol Description:

10: Haptic feedback device

12: Substrate

14: electrode

15: Low dielectric material layer

15a: the first low dielectric material layer

15b: the second low dielectric material layer

15c: the third low dielectric material layer

16: High dielectric material layer

16a: the first high dielectric material layer

16b: the second high dielectric material layer

18: hardened layer

20: Anti-reflection layer

22: Anti-fouling layer

T _HC : Thickness of hardened layer

T _HD : Thickness of high dielectric material layer

T _HD1 : the thickness of the first high dielectric material layer

T _HD2 : the thickness of the second high dielectric material layer

T _LD : Thickness of the low dielectric material layer

T _LD1 : the thickness of the first low dielectric material layer

T _LD2 : the thickness of the second low dielectric material layer

T _LD3 : the thickness of the third low dielectric material layer

detailed description

The following disclosure provides many different embodiments to implement the different features of the present invention. The following disclosure describes specific examples of various components and their arrangements to simplify the description. Of course, these specific examples are not intended to be limiting. For example, if an embodiment of the present disclosure describes that a first characteristic component is formed on or above a second characteristic component, it may include embodiments in which the first characteristic component is in direct contact with the second characteristic component, and also Embodiments may be included in which additional features are formed between the first and second features such that the first and second features may not be in direct contact.

It should be understood that additional operational steps may be performed before, during or after the method, and in other embodiments of the method, some of the operational steps may be replaced or omitted.

In addition, spatial terms such as "below", "beneath", "lower", "above", "above", "higher" and similar terms may be used herein, These spatially relative terms are used to facilitate the description of the relationship between one (some) element or feature and another (some) element or feature in the drawings. orientation, and the orientation depicted in the accompanying drawings. When the device is turned in a different orientation (rotated by 45 degrees or otherwise), the spatially relative adjectives used therein will also be interpreted in terms of the turned orientation. Furthermore, when it is mentioned that a first material layer is located on or over a second material layer, it includes the situation that the first material layer is in direct contact with the second material layer, or there may be one or more other material layers interposed therebetween. layer, in which case there may be no direct contact between the first material layer and the second material layer. In some embodiments of the present disclosure, terms such as "connection" and "interconnection" related to bonding and connection, unless otherwise specified, may mean that two structures are in direct contact, or may also mean that two structures are not in direct contact, There are other structures located between these two structures. And the terms about joining and connecting may also include the situation that both structures are movable, or both structures are fixed.

In the description, the terms "about", "approximately", "approximately", "approximately", "substantially", "the same", and "similar" usually mean that a characteristic value is within plus or minus 15% of a given value. within, or within plus or minus 10%, or within plus or minus 5%, or within plus or minus 3%, or within plus or minus 2%, or within plus or minus 1%, or within plus or minus 0.5% scope. The quantities given here are approximate quantities, that is to say, "about", "approximately", "approximately", "approximately" and "substantially" can still be implied if there is no specific description of "about", "approximately", "substantially" The meanings of "approximately", "approximately", "approximately", and "substantially".

It should be understood that although the terms "first", "second", "third", etc. are used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the technology of the present disclosure.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It can be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having meanings consistent with the background or context of the related art and the present disclosure, and should not be interpreted in an idealized or overly formal manner. Interpretation, unless otherwise defined in the embodiments of the present disclosure.

Please refer to FIG. 1 , according to an embodiment of the present disclosure, a tactile feedback device 10 is provided. FIG. 1 is a schematic cross-sectional view of a tactile feedback device 10 .

In FIG. 1 , the tactile feedback device 10 includes a substrate 12 , a plurality of electrodes 14 , a high dielectric material layer 16 , a hardening layer 18 , an antireflective layer 20 , and an antifouling layer 22 . The electrodes 14 are disposed on the substrate 12 . The high dielectric material layer 16 is disposed on the electrodes 14 and filled between the electrodes 14 . The hardening layer 18 is disposed on the high dielectric material layer 16 . The anti-reflection layer 20 is disposed on the hardened layer 18 . The anti-fouling layer 22 is disposed on the anti-reflection layer 20 .

In some embodiments, the substrate 12 may include a rigid substrate, such as a glass substrate, but the disclosure is not limited thereto. In some embodiments, the substrate 12 may include a flexible substrate, such as a polyimide (PI) substrate, but the disclosure is not limited thereto. In some embodiments, the electrodes 14 may be formed of any suitable conductive material.

In some embodiments, the dielectric constant of the high dielectric material layer 16 is about 10-40. In some embodiments, the dielectric constant of the high dielectric material layer 16 is about 10-15. In some embodiments, the high dielectric material layer 16 may include organic dielectric materials doped with high dielectric nanoparticles, for example, polyvinylphenol (PVP), polymethacrylate (PMMA), or polyvinyl alcohol doped Titanium dioxide (TiO2), barium titanate (BaTiO3) or zirconia (ZrO2), but the present disclosure is not limited thereto. In some embodiments, the high dielectric material layer 16 may include inorganic high dielectric materials, such as hafnium dioxide, aluminum nitride, or titanium dioxide, but the disclosure is not limited thereto. In some embodiments, the thickness T _HD of the high dielectric material layer 16 is approximately between 4 μm and 20 μm. In some embodiments, the thickness T _HD of the high dielectric material layer 16 is approximately between 4 microns and 8 microns.

In some embodiments, the hardening layer 18 may include a high-hardness organic material, such as silicone material, epoxy resin or silicone resin, but the disclosure is not limited thereto. In some embodiments, the thickness T _HC of the hardened layer 18 is approximately between 4 μm and 10 μm.

In some embodiments, the dielectric constant of the anti-reflection layer 20 is about 3-10. In some embodiments, the antireflection layer 20 may include inorganic low dielectric materials, such as silicon oxide, silicon nitride or silicon oxynitride, but the disclosure is not limited thereto.

In some embodiments, the antifouling layer 22 may include organic fluorine or titanium dioxide, but the disclosure is not limited thereto.

Please refer to FIG. 2 , according to an embodiment of the present disclosure, a tactile feedback device 10 is provided. FIG. 2 is a schematic cross-sectional view of the tactile feedback device 10 .

In FIG. 2 , the tactile feedback device 10 includes a substrate 12 , a plurality of electrodes 14 , a low dielectric material layer 15 , a high dielectric material layer 16 , a hardening layer 18 , an antireflection layer 20 , and an antifouling layer 22 . The electrodes 14 are disposed on the substrate 12 . The low dielectric material layer 15 is disposed on the electrodes 14 and filled between the electrodes 14 . The high dielectric material layer 16 is disposed on the low dielectric material layer 15 . The hardening layer 18 is disposed on the high dielectric material layer 16 . The anti-reflection layer 20 is disposed on the hardened layer 18 . The anti-fouling layer 22 is disposed on the anti-reflection layer 20 . In some embodiments, the order of setting the low dielectric material layer 15 and the high dielectric material layer 16 can be adjusted, for example, the high dielectric material layer 16 is disposed on the electrode 14 and filled between the electrodes 14, and the low dielectric material layer 16 The electrical material layer 15 is disposed on the high dielectric material layer 16 (not shown).

In some embodiments, the substrate 12 may include a rigid substrate, such as a glass substrate, but the disclosure is not limited thereto. In some embodiments, the substrate 12 may include a flexible substrate, such as a polyimide (PI) substrate, but the disclosure is not limited thereto. In some embodiments, the electrodes 14 may be formed of any suitable conductive material.

In some embodiments, the dielectric constant of the low dielectric material layer 15 is about 3-10. In some embodiments, the dielectric constant of the low dielectric material layer 15 is about 4-7. In some embodiments, the low dielectric material layer 15 may include an inorganic low dielectric material, such as silicon oxide, silicon nitride or silicon oxynitride, but the disclosure is not limited thereto. In some embodiments, the thickness T _LD of the low dielectric material layer 15 is approximately between 0.1 μm and 10 μm. In some embodiments, the thickness T _LD of the low dielectric material layer 15 is approximately between 0.3 μm and 3 μm.

In some embodiments, the dielectric constant of the high dielectric material layer 16 is about 10-40. In some embodiments, the dielectric constant of the high dielectric material layer 16 is about 10-15. In some embodiments, the high dielectric material layer 16 may include organic high dielectric materials doped high dielectric nanoparticles, for example, polyvinylphenol (PVP), polymethacrylate (PMMA), or polyvinyl alcohol doped Titanium dioxide (TiO2), barium titanate (BaTiO3) or zirconia (ZrO2), but the present disclosure is not limited thereto. In some embodiments, the high dielectric material layer 16 may include inorganic high dielectric materials, such as hafnium dioxide, aluminum nitride, or titanium dioxide, but the disclosure is not limited thereto. In some embodiments, the thickness T _HD of the high dielectric material layer 16 is approximately between 4 μm and 20 μm. In some embodiments, the thickness T _HD of the high dielectric material layer 16 is approximately between 4 microns and 8 microns.

In some embodiments, the hardening layer 18 may include a high-hardness organic material, such as silicone material, epoxy resin or silicone resin, but the disclosure is not limited thereto. In some embodiments, the thickness T _HC of the hardened layer 18 is approximately between 4 μm and 10 μm.

In some embodiments, the dielectric constant of the anti-reflection layer 20 is about 4-10. In some embodiments, the antireflection layer 20 may include inorganic low dielectric materials, such as silicon oxide, silicon nitride or silicon oxynitride, but the disclosure is not limited thereto.

In some embodiments, the antifouling layer 22 may include fluorine-based organics or titanium dioxide, but the disclosure is not limited thereto.

Please refer to FIG. 3 , according to an embodiment of the present disclosure, a tactile feedback device 10 is provided. FIG. 3 is a schematic cross-sectional view of the tactile feedback device 10 .

In FIG. 3 , the tactile feedback device 10 includes a substrate 12, a plurality of electrodes 14, a first low dielectric material layer 15a, a first high dielectric material layer 16a, a second low dielectric material layer 15b, a second high dielectric material layer The material layer 16b, the third low dielectric material layer 15c, the hardening layer 18, the antireflection layer 20, and the antifouling layer 22. The electrodes 14 are disposed on the substrate 12 . The first low dielectric material layer 15 a is disposed on the electrodes 14 and filled between the electrodes 14 . The first high dielectric material layer 16a is disposed on the first low dielectric material layer 15a. The second low dielectric material layer 15b is disposed on the first high dielectric material layer 16a. The second high dielectric material layer 16b is disposed on the second low dielectric material layer 15b. The third low dielectric material layer 15c is disposed on the second high dielectric material layer 16b. The hardening layer 18 is disposed on the third low dielectric material layer 15c. The anti-reflection layer 20 is disposed on the hardened layer 18 . The anti-fouling layer 22 is disposed on the anti-reflection layer 20 . In this embodiment, the low dielectric material layers ( 15 a , 15 b , 15 c ) and high dielectric material layers ( 16 a , 16 b ) are alternately disposed between the electrodes 14 and the antireflection layer 20 as shown in FIG. 3 . In some embodiments, the low dielectric material layers ( 15 a , 15 b , 15 c ) and the high dielectric material layers ( 16 a , 16 b ) can also be alternately arranged in other ways (not shown). In some embodiments, the low dielectric material layers ( 15 a , 15 b , 15 c ) and the high dielectric material layers ( 16 a , 16 b ) may also be arranged in a non-alternating manner (not shown).

In some embodiments, the substrate 12 may include a rigid substrate, such as a glass substrate, but the disclosure is not limited thereto. In some embodiments, the substrate 12 may include a flexible substrate, such as a polyimide (PI) substrate, but the disclosure is not limited thereto. In some embodiments, the electrodes 14 may be formed of any suitable conductive material.

In some embodiments, the dielectric constants of the first low dielectric material layer 15 a , the second low dielectric material layer 15 b , and the third low dielectric material layer 15 c are about 3-10. In some embodiments, the dielectric constants of the first low dielectric material layer 15 a , the second low dielectric material layer 15 b , and the third low dielectric material layer 15 c are about 4-7. In some embodiments, the first low dielectric material layer 15a, the second low dielectric material layer 15b, and the third low dielectric material layer 15c may include organic low dielectric materials, such as oxane materials, epoxy resins, etc. Or silicone resin, but the present disclosure is not limited thereto. In some embodiments, the first low dielectric material layer 15a, the second low dielectric material layer 15b, and the third low dielectric material layer 15c may include inorganic low dielectric materials, such as silicon oxide, silicon nitride or silicon oxynitride, but the disclosure is not limited thereto. In some embodiments, the thickness T _LD1 of the first low dielectric material layer 15a, the thickness T _LD2 of the second low dielectric material layer 15b, and the thickness T _LD3 of the third low dielectric material layer 15c are respectively about 0.1 microns to 10 microns. In some embodiments, the thickness T _LD1 of the first low dielectric material layer 15a, the thickness T _LD2 of the second low dielectric material layer 15b, and the thickness T _LD3 of the third low dielectric material layer 15c are respectively about 0.3 between microns and 3 microns.

In some embodiments, the dielectric constants of the first high dielectric material layer 16a and the second high dielectric material layer 16b are about 10-40. In some embodiments, the dielectric constants of the first high dielectric material layer 16a and the second high dielectric material layer 16b are about 10-15. In some embodiments, the first high dielectric material layer 16a and the second high dielectric material layer 16b may include organic high dielectric materials doped with high dielectric nanoparticles, for example, polyvinylphenol (PVP), polymethyl Acrylate (PMMA), or polyvinyl alcohol doped titanium dioxide (TiO2), barium titanate (BaTiO3), or zirconia (ZrO2), but the disclosure is not limited thereto. In some embodiments, the first high dielectric material layer 16a and the second high dielectric material layer 16b may include inorganic high dielectric materials, such as hafnium dioxide, aluminum nitride, or titanium dioxide, but the disclosure is not limited thereto. . In some embodiments, the thickness T _HD1 of the first high dielectric material layer 16 a and the thickness T _HD2 of the second high dielectric material layer 16 b are respectively approximately between 4 μm and 20 μm. In some embodiments, the thickness T _HD1 of the first high dielectric material layer 16 a and the thickness T _HD2 of the second high dielectric material layer 16 b are respectively approximately between 4 micrometers and 8 micrometers. In some embodiments, the total thickness (T _HD1 +T _HD2 ) of the high dielectric material layer is greater than the total thickness (T _LD1 +T _LD2 +T _LD3 ) of the low dielectric material layer.

In some embodiments, the hardening layer 18 may include a high-hardness organic material, such as silicone material, epoxy resin or silicone resin, but the disclosure is not limited thereto. In some embodiments, the thickness T _HC of the hardened layer 18 is approximately between 4 μm and 10 μm.

In some embodiments, the dielectric constant of the anti-reflection layer 20 is about 3-10. In some embodiments, the antireflection layer 20 may include inorganic low dielectric materials, such as silicon oxide, silicon nitride or silicon oxynitride, but the disclosure is not limited thereto.

In some embodiments, the antifouling layer 22 may include organic fluorine or titanium dioxide, but the disclosure is not limited thereto.

Example 1

Electrical properties and tactile feedback test of the disclosed high dielectric material layer

In this embodiment, the electrical properties and tactile feedback tests are performed on the high dielectric material layer used in the present disclosure, so as to evaluate whether the above high dielectric material layer complies with regulations. Here, a high-dielectric material layer with a dielectric constant of 11 is selected for compliance testing of ESD and tactile feedback, and the results are shown in Figure 4. Please refer to Figure 4, the compliance standard for ESD is a allowable breakdown voltage up to 15KV, and the compliance standard for haptic feedback is 20% of the standard value. It can be seen from the figure that when the thickness of the high dielectric material layer is set at 5 to 8 microns, the high dielectric material layer can pass the ESD test, and its tactile feedback can maintain 40% to 60% of the effect. The test results show that the above-mentioned high dielectric material layer can provide an appropriate and sufficient design window for application in the tactile feedback device of the present disclosure.

Comparative example 1

Electrical properties and tactile feedback test of low dielectric material layer(1)

In this comparative example, the electric properties and tactile feedback tests of the low-dielectric material layer are conducted to evaluate whether the above-mentioned low-dielectric material layer complies with regulations. Here, a low-dielectric material layer with a dielectric constant of 3.85 is selected for compliance testing of ESD and tactile feedback, and the results are shown in Figure 5. Please refer to Figure 5, the compliance standard for ESD is a allowable breakdown voltage up to 15KV, and the compliance standard for haptic feedback is 20% of the standard value. It can be seen from the figure that when the thickness of the above-mentioned low-dielectric material layer is less than 4 microns, although the low-dielectric material layer can maintain the tactile feedback effect, it cannot pass the ESD test. Only when the thickness is set to be greater than 12 microns can the ESD test be passed. However, at this time, the tactile feedback of the low dielectric material layer has dropped below 20% (no tactile feedback effect). The test results show that the above-mentioned low-dielectric material layer does not provide any design space, and is not suitable for the tactile feedback device of the present disclosure.

Comparative example 2

Electrical properties and tactile feedback test of low dielectric material layer(2)

In this comparative example, the electric properties and tactile feedback tests of the low-dielectric material layer are conducted to evaluate whether the above-mentioned low-dielectric material layer complies with regulations. Here, a low-dielectric material layer with a dielectric constant of 3.47 is selected for compliance testing of ESD and tactile feedback, and the results are shown in Figure 6. Please refer to Figure 6, the compliance standard for ESD is a allowable breakdown voltage up to 15KV, and the compliance standard for haptic feedback is 20% of the standard value. It can be seen from the figure that when the thickness of the above-mentioned low-dielectric material layer is less than 6 microns, although the low-dielectric material layer can maintain the tactile feedback effect, it cannot pass the ESD test. Only when the thickness is set to be greater than 8 microns can the ESD test be passed. However, at this time, the tactile feedback of the low dielectric material layer has dropped below 20% (no tactile feedback effect). The test results show that the above-mentioned low-dielectric material layer does not provide any design space, and is not suitable for the tactile feedback device of the present disclosure.

In the present disclosure, a single high-dielectric material layer or a composite layer composed of a high-dielectric material layer and a low-dielectric material layer is arranged between the anti-reflection layer and the electrode, by introducing a specific high-dielectric material that can store static charges Electrical materials (with a dielectric constant between about 10 and 40) to solve the problem that the traditional anti-reflection layer is easily broken down during the ESD test, and effectively avoid the tactile feedback function caused by simply increasing the thickness of the anti-reflection layer failure problem.

The components of some of the above embodiments are described so that those skilled in the art can better understand the viewpoints of the embodiments of the present disclosure. Those skilled in the art should understand that they can design or modify other processes and structures based on the embodiments of the present disclosure to achieve the same purpose and/or advantages as the embodiments introduced here. Those skilled in the art should also understand that such equivalent structures do not depart from the spirit and scope of the present disclosure, and they can make various changes and substitutions without departing from the spirit and scope of the present disclosure. and replace. Therefore, the scope of protection of the present disclosure should be defined by the appended claims. In addition, although the present disclosure has been disclosed above with several preferred embodiments, they are not intended to limit the present disclosure.

Reference throughout this specification to features, advantages, or similar language, does not imply that all features and advantages that may be realized with the present disclosure should or can be achieved in any single embodiment of the disclosure. Conversely, language referring to the features and advantages is understood to mean that a specific feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the present disclosure. Thus, discussions of the features and advantages, and similar language, throughout this specification may, but do not necessarily, refer to the same embodiment.

Furthermore, the described features, advantages, and characteristics of the disclosure may be combined in any suitable manner in one or more embodiments. One skilled in the relevant art will recognize, from the description herein, that the present disclosure can be practiced without one or more of the specific features or advantages of a particular embodiment. In other cases, additional features and advantages may be recognized in certain embodiments, which may not be present in all embodiments of the present disclosure.

Claims (10)

1. A tactile feedback device, comprising: a substrate; a plurality of electrodes arranged on the substrate; at least one high dielectric material layer disposed on the plurality of electrodes; and An anti-reflection layer is disposed on the at least one high dielectric material layer. 2. The tactile feedback device according to claim 1, wherein the at least one high dielectric material layer comprises a high dielectric material layer. 3 . The tactile feedback device according to claim 2 , wherein the dielectric constant of the high dielectric material layer is between 10 and 40. 4 . 4. The tactile feedback device according to claim 2, wherein the thickness of the high dielectric material layer is between 4 microns and 20 microns. 5. The tactile feedback device as claimed in claim 2, further comprising a low dielectric material layer disposed on one side of the high dielectric material layer. 6 . The tactile feedback device according to claim 5 , wherein the dielectric constant of the low dielectric material layer is between 4 and 10. 7. The haptic feedback device according to claim 1, wherein the at least one high dielectric material layer comprises a plurality of high dielectric material layers. 8 . The tactile feedback device as claimed in claim 7 , further comprising a plurality of low dielectric material layers arranged alternately with the plurality of high dielectric material layers. 9. The tactile feedback device according to claim 8, wherein the total thickness of the plurality of high dielectric material layers is greater than the total thickness of the plurality of low dielectric material layers. 10. The tactile feedback device as claimed in claim 1, further comprising a hardened layer disposed on the at least one high dielectric material layer.

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