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CN115565972B - A heat spreader with high efficiency in heat dissipation and a method for manufacturing the same - Google Patents

A heat spreader with high efficiency in heat dissipation and a method for manufacturing the same Download PDF

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CN115565972B
CN115565972B CN202211198297.8A CN202211198297A CN115565972B CN 115565972 B CN115565972 B CN 115565972B CN 202211198297 A CN202211198297 A CN 202211198297A CN 115565972 B CN115565972 B CN 115565972B
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gradient
lower plate
mesh area
upper plate
mesh
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CN115565972A (en
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曹泷
郭家驹
王光辉
赵露星
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Zhengzhou University of Light Industry
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention provides a soaking plate with high-efficiency heat dissipation and a manufacturing method thereof, the soaking plate is divided into an upper plate, a gradient hydrophobic layer, a gradient hydrophilic layer and a lower plate, the gradient hydrophilic layer is constructed on the lower plate by adopting a sintering-electroplating technology, cold end liquid rapidly flows to a hot end through the action of Laplacian force, working media can be rapidly vaporized into steam after the soaking plate absorbs heat, the upper plate is provided with the gradient hydrophobic layer, liquid drops formed by the steam under the action of the Laplacian force of the gradient hydrophobic layer and the pressure difference of the cold end and the hot end can be rapidly transferred to the cold end, liquid films or liquid drops form a liquid pool on the cold end, the liquid drops rapidly fall under the double actions of hydrophobicity and gravity, the thermal resistance between a wall surface and the steam is reduced, and the gradient hydrophobic layer and the steam can fully exchange heat. The heat exchange device has the beneficial effects that based on a bionic principle, a gradient structure of the lower surface of the upper plate and the upper surface of the lower plate is established, the moving speed of a liquid phase towards a hot end and a vapor phase towards a cold end is accelerated, the heat exchange is enhanced, the heat exchange efficiency is improved, and a high-efficiency circulating heat exchange system is formed.

Description

Soaking plate with efficient heat dissipation and manufacturing method thereof
Technical Field
The invention relates to the technical field of heat dissipation devices, in particular to a soaking plate capable of efficiently dissipating heat and a manufacturing method thereof.
Background
The vapor chamber is used as a main component for heat energy transfer, is widely applied to different fields of new energy automobiles, household appliances, industrial production and the like, optimizes the structural process of the vapor chamber, strengthens the heat energy transfer efficiency, reduces the loss of heat exchange equipment and is an important means for improving the overall performance of the system.
In recent years, with the development of high performance, integration and miniaturization of electronic components, the problem of heat dissipation of electronic chips has been increasingly prominent. At present, the conventional soaking plate structure cannot meet the heat dissipation requirement of electronic chips under the increasing high heat flux density. Heat transfer devices face increasing difficulties and challenges, especially in mobile terminals such as smartphones, tablet computers, etc., and thermal management designs are very difficult.
In the soaking plate, a layer of air film is formed on the boiling surface due to the large amount of aggregation of air bubbles, the heat transfer surface is deteriorated, the heat transfer process is increased, the heat transfer coefficient is reduced suddenly, a liquid film and liquid drops are formed on the condensing surface due to the condensation of steam on the condensing surface, the heat transfer paths of the steam and the wall surface are increased, and the heat transfer efficiency is reduced.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a soaking plate with high heat dissipation efficiency and a manufacturing method thereof, which can improve the heat dissipation efficiency and meet the heat dissipation requirement of an electronic chip.
In order to solve the problems, the technical scheme adopted by the invention is as follows:
The utility model provides a high-efficient radiating soaking plate, including upper plate (1), gradient hydrophobic layer (2), gradient hydrophilic layer (3), hypoplastron (4), upper plate (1) and hypoplastron (4) both ends all have connecting portion (5), the clearance is left at the middle part of upper plate (1) and hypoplastron (4), connect fixedly and seal through the welding mode between connecting portion (5), gradient hydrophobic layer (2) are attached to the below of upper plate (1), gradient hydrophilic layer (3) are attached to the top of hypoplastron (4), gradient hydrophobic layer (2) are the nanometer ripple form structure of a plurality of sections different degree of depth on upper plate (1), gradient hydrophilic layer (3) are the region that the sintering of hypoplastron (4) upper surface has copper powder granule of different mesh numbers.
Preferably, the nano corrugated structure of the gradient hydrophobic layer (2) is manufactured by a femtosecond laser method, and a plurality of sections of the nano corrugated structure are divided into four sections of a 50 mu J area (201), a 80 mu J area (202), a 120 mu J area (203) and a 155 mu J area (204) according to the pulse energy, and the four sections are connected in sequence from small to large.
Preferably, the gradient hydrophilic layer (3) is manufactured by adopting a sintering-electroplating method, and a 50-mesh area (301), a 100-mesh area (302), a 150-mesh area (303), a 200-mesh area (304) and a 250-mesh area (305) are sequentially arranged above the lower plate (4) and are sequentially connected from small to large.
Preferably, the upper plate (1) and the lower plate (4) are preferably copper plates.
The method for manufacturing the soaking plate with high heat dissipation according to claim 1-4, comprising the following steps:
S1, manufacturing a nano corrugated structure of a gradient hydrophobic layer (2) by adopting a femtosecond laser method, fixing a scanning interval to be 50 mu m, enabling a lens focal length to be 200mm, scanning the lower part of an upper plate (1) according to a scanning speed of 0.5mm/S, and sequentially selecting pulse energy of the femtosecond laser to be 50 mu J, 80 mu J, 120 mu J and 155 mu J on the upper plate (1), wherein the nano corrugated structure with different depths is formed under the repeated action of different pulses under the condition that the pulse power of the femtosecond pulse laser exceeds an ablation threshold value;
S2, after femtosecond laser processing, placing the mixture into a fluorosilane ethanol solution with the concentration of 1%, standing and soaking for 3 to 5 hours, then taking out the mixture and placing the mixture into a blast drying oven with the temperature of 120 ℃, and standing and cooling the mixture after baking for 4 hours to obtain an upper plate (1) with a gradient hydrophobic layer (2);
S3, equally dividing the upper part of the lower plate (4) into five equal parts of areas, namely a 50-mesh area (301), a 100-mesh area (302), a 150-mesh area (303), a 200-mesh area (304) and a 250-mesh area (305), coating adhesive in the areas, and correspondingly bonding 50-mesh copper powder particles, 100-mesh copper powder particles, 150-mesh copper powder particles, 200-mesh copper powder particles and 250-mesh copper powder particles in the five areas of the 50-mesh area (301), the 100-mesh area (302), the 150-mesh area (303), the 200-mesh area (304) and the 250-mesh area (305);
s4, placing the lower plate (4) processed in the step S3 into a tube furnace, firstly raising the temperature in the furnace to 600 ℃ at the speed of 5 ℃ per minute, keeping for 10 minutes to remove the adhesive, then heating to 850 ℃ at the same speed, and preserving the heat for 2 hours;
S5, placing the lower plate (4) sintered in the step S4 into an electroplating device for electroplating treatment, wherein a copper sheet is used as an anode in an electroplating bath of the electroplating device, the sintered lower plate (4) is used as a cathode, and electrolytic copper simple substances are attached to the sintered lower plate (4) to form a gradient hydrophilic layer (3) with a micro-nano particle structure on the surface;
S6, the upper plate (1) and the lower plate (4) manufactured through the step S2 and the step S4 are aligned and welded together through the connecting parts of the upper plate and the lower plate, the gradient hydrophobic layer (2) on the lower surface of the upper plate (1) and the gradient hydrophilic layer (3) on the upper surface of the lower plate (4) are opposite, and a gap is reserved between the gradient hydrophobic layer (2) and the gradient hydrophilic layer (3).
Preferably, nitrogen is continuously introduced to isolate oxygen during the entire sintering process of step S4.
Preferably, in step S5, the plating solution of the plating apparatus is preferably a mixed solution of 0.8mol/L CuSO 4、1.5mol/L H2SO4 and 0.2mol/L HCl.
Preferably, the electroplating device adopts an electroplating time of 40min and a current density of 0.4mA/mm 2.
The invention has the beneficial effects that:
1. According to the invention, based on a bionic structure, a gradient hydrophobic layer is established on the upper plate, after liquid drops and a liquid film are condensed on the wall surface, the gradient surface generates Laplacian force on the liquid drops, so that the liquid drops are spontaneously and directionally transported, the liquid drops are pushed to the cold end rapidly, the heat transfer path between the wall surface and steam is reduced, and the heat exchange efficiency is improved;
2. the hydrophobic structure of the upper plate can enable the wall liquid drops to drop rapidly, quicken the replenishment rate of the bottom liquid pool in the vapor chamber, improve the deterioration of heat exchange and improve the boiling heat transfer coefficient;
3. the gradient hydrophilic layer is manufactured by adopting the sintering-electroplating coupling method, and the wettability of different roughness is utilized to enable the liquid pool to spontaneously move to the hot end at the bottom, so that the migration speed of liquid on the lower plate is improved;
4. The surface of the lower plate in a micron scale formed by sintering increases the contact area of the surface and liquid, improves the heat exchange efficiency, provides more capillary force for a nano particle layer formed by electroplating, can form more vaporization cores, and further improves the boiling heat exchange coefficient.
Drawings
FIG. 1 is a schematic cross-sectional view of the structure of the present invention;
FIG. 2 is a schematic diagram of gradient hydrophobic layer gas migration;
fig. 3 is a schematic of gradient hydrophilic layer liquid migration.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without any inventive effort, are intended to be within the scope of the invention.
As shown in figures 1-3, the soaking plate with high-efficiency heat dissipation comprises an upper plate 1, a gradient hydrophobic layer 2, a gradient hydrophilic layer 3 and a lower plate 4, wherein the upper plate 1 and the lower plate 4 are preferably copper plates, connecting parts 5 are arranged at two ends of the upper plate 1 and the lower plate 4, gaps are reserved at the middle parts of the upper plate 1 and the lower plate 4, the connecting parts 5 are fixedly sealed through a welding mode, the sealing between the upper plate 1 and the lower plate 4 can be realized through a pressing mode, the gradient hydrophobic layer 2 is attached below the upper plate 1, the gradient hydrophilic layer 3 is attached above the lower plate 4, gaps are reserved between the gradient hydrophilic layer 2 and the gradient hydrophilic layer 3, working media are reserved in the gaps, the gradient hydrophobic layer 2 is a nano corrugated structure with a plurality of sections of different depths on the upper plate 1, and the gradient hydrophilic layer 3 is a region with copper powder particles with different meshes sintered on the lower plate 4.
The nano corrugated structure of the gradient hydrophobic layer 2 is manufactured by a femtosecond laser method, and a plurality of sections of nano corrugated structures are divided into four sections of a 50 mu J area 201, a 80 mu J area 202, a 120 mu J area 203 and a 155 mu J area 204 according to the size of pulse energy, and the four sections are connected in sequence from small to large.
The gradient hydrophilic layer 3 is manufactured by adopting a sintering-electroplating method, and a 50 mesh area 301, a 100 mesh area 302, a 150 mesh area 303, a 200 mesh area 304 and a 250 mesh area 305 are sequentially connected above the lower plate 4 from small to large.
The working medium can generate water vapor after being heated, the water vapor can form liquid drops on the gradient hydrophobic layer 2, and the liquid drops can spontaneously move to a 155 mu J area which is close to a cold end due to the gradient nano corrugated structure on the gradient hydrophobic layer 2, so that the liquid drops can quickly drop on the lower plate 4 at the cold end.
On the upper surface of the lower plate (4), the hydrophilic areas with different gradients, namely a 50 mesh area 301, a 100 mesh area 302, a 150 mesh area 303, a 200 mesh area 304 and a 250 mesh area 305, are utilized to lead the liquid to spontaneously move from a cold end (the 250 mesh area 305 is close to the cold end) to a hot end (the 50 mesh area 301 is close to the hot end), so that the migration speed of the liquid on the lower plate (4) is improved.
The method for manufacturing the soaking plate with high heat dissipation according to claim 1-4, comprising the following steps:
S1, manufacturing a nano corrugated structure of a gradient hydrophobic layer 2 by adopting a femtosecond laser method, fixing a scanning interval to be 50 mu m, enabling a lens focal length to be 200mm, scanning the lower part of an upper plate 1 according to a scanning speed of 0.5mm/S, sequentially selecting pulse energy of the femtosecond laser to be 50 mu J, 80 mu J, 120 mu J and 155 mu J on the upper plate 1, and forming the nano corrugated structure with different depths under the repeated action of different pulses under the condition that the pulse power of the femtosecond pulse laser exceeds an ablation threshold value;
S2, after femtosecond laser processing, placing the mixture into a fluorosilane ethanol solution with the concentration of 1%, standing and soaking for 3 to 5 hours, then taking out the mixture and placing the mixture into a blast drying oven with the temperature of 120 ℃, and standing and cooling the mixture after baking for 4 hours to obtain an upper plate 1 with a gradient hydrophobic layer 2;
S3, firstly, uniformly dividing the upper part of the lower plate 4 into five equal parts of areas, namely a 50-mesh area 301, a 100-mesh area 302, a 150-mesh area 303, a 200-mesh area 304 and a 250-mesh area 305, coating adhesive in the areas, and correspondingly bonding 50-mesh copper powder particles, 100-mesh copper powder particles, 150-mesh copper powder particles, 200-mesh copper powder particles and 250-mesh copper powder particles in the five areas of the 50-mesh area 301, the 100-mesh area 302, the 150-mesh area 303, the 200-mesh area 304 and the 250-mesh area 305;
S4, placing the lower plate 4 processed in the step S3 into a tube furnace, firstly raising the temperature in the furnace to 600 ℃ at a speed of 5 ℃ per minute, keeping for 10 minutes to remove the adhesive, then heating to 850 ℃ at the same speed, preserving heat for 2 hours, and continuously introducing nitrogen to isolate oxygen in the whole sintering process;
S5, placing the sintered lower plate 4 in the step S4 into an electroplating device for electroplating treatment, wherein the electroplating liquid of the electroplating device is preferably a mixed liquid composed of 0.8mol/L CuSO 4、1.5mol/L H2SO4 and 0.2mol/L HCl, the electroplating time is 40min, the current density is 0.4mA/mm 2, in an electroplating bath of the electroplating device, a copper sheet is used as an anode, the sintered lower plate 4 is used as a cathode, and electrolytic copper simple substances are attached to the sintered lower plate 4 to form a gradient hydrophilic layer 3 with a nano-particle structure on the surface;
S6, the upper plate 1 and the lower plate 4 manufactured through the step S2 and the step S4 are aligned and welded together through the connecting parts of the upper plate 1 and the lower plate, the gradient hydrophobic layer 2 on the lower surface of the upper plate 1 and the gradient hydrophilic layer 3 on the upper surface of the lower plate 4 are opposite, and a gap is reserved between the gradient hydrophobic layer 2 and the gradient hydrophilic layer 3.
The working principle is that heat generated by the operation of a processor is conducted to the evaporation end of a soaking plate, an internal working medium absorbs the heat and generates gasification to become steam, at the moment, the upper plate 1 forms a gradient nanoscale corrugated hydrophobic structure after being processed by femtosecond laser, liquid drops of the upper plate 1 quickly reach a cold end and quickly fall due to the Laplacian force formed by internal air pressure and a wall surface, the liquid drops formed by the upper plate 1 can fall onto a gradient hydrophilic layer 3 of the lower plate 2, which is constructed by a sintering electroplating technology, and liquid at the cold end can quickly flow to a hot end under the capillary action of the inner wall of a cavity, and evaporation and heat absorption are performed again.

Claims (5)

1.一种高效散热的均热板，其特征在于，包括上板(1)、梯度疏水层(2)、梯度亲水层(3)、下板(4)，上板(1)和下板(4)为铜板，上板(1)和下板(4)的两端均带有连接部(5)，上板(1)和下板(4)的中部留有间隙，连接部(5)之间通过焊接方式连接固定和密封，梯度疏水层(2)附着在上板(1)的下方，梯度亲水层(3)附着在下板(4)的上方，梯度疏水层(2)为上板(1)上若干段不同深度的纳米波纹状结构，梯度亲水层(3)为下板(4)上表面烧结有不同目数的铜粉颗粒的区域；1. A heat spreader with high efficiency in heat dissipation, characterized in that it comprises an upper plate (1), a gradient hydrophobic layer (2), a gradient hydrophilic layer (3), and a lower plate (4), wherein the upper plate (1) and the lower plate (4) are copper plates, both ends of the upper plate (1) and the lower plate (4) are provided with connecting parts (5), a gap is left in the middle of the upper plate (1) and the lower plate (4), the connecting parts (5) are connected, fixed and sealed by welding, the gradient hydrophobic layer (2) is attached to the bottom of the upper plate (1), the gradient hydrophilic layer (3) is attached to the top of the lower plate (4), the gradient hydrophobic layer (2) is a nano-corrugated structure of several sections with different depths on the upper plate (1), and the gradient hydrophilic layer (3) is a region on the upper surface of the lower plate (4) where copper powder particles of different mesh sizes are sintered; 采用飞秒激光的方法制作梯度疏水层(2)的纳米波纹状结构，根据脉冲能量的大小，将若干段纳米波纹状结构分为50μJ区(201)、80μJ区(202)、120μJ区(203)、155μJ区(204)四个区段，上述四个区段从小到大依次相接；A nano-corrugated structure of a gradient hydrophobic layer (2) is manufactured by a femtosecond laser method. According to the magnitude of pulse energy, a plurality of sections of the nano-corrugated structure are divided into four sections: a 50 μJ section (201), an 80 μJ section (202), a 120 μJ section (203), and a 155 μJ section (204). The four sections are connected in order from small to large. 梯度亲水层(3)采用烧结-电镀的方法制作，在下板(4)上方依次为50目区(301)、100目区(302)、150目区(303)、200目区(304)、250目区(305)，上述五个区从小到大依次相接。The gradient hydrophilic layer (3) is manufactured by a sintering-electroplating method. Above the lower plate (4), there are a 50-mesh area (301), a 100-mesh area (302), a 150-mesh area (303), a 200-mesh area (304), and a 250-mesh area (305), and the five areas are connected in sequence from small to large. 2.如权利要求1所述的一种高效散热的均热板的制作方法，其步骤包括：2. The method for manufacturing a heat spreader with high efficiency heat dissipation as claimed in claim 1, comprising the steps of: S1、采用飞秒激光的方法制作梯度疏水层(2)的纳米波纹状结构，将扫描间距固定为50μm，透镜焦距为200mm，并按照0.5mm/s的扫描速度扫描上板(1)的下方，飞秒激光的脉冲能量在上板(1)上依次选择为50μJ、80μJ、120μJ、155μJ，在飞秒脉冲激光的脉冲功率超过烧蚀阈值的情况下，不同脉冲的反复作用下形成具有不同深度的纳米波纹状的结构；S1. A nano-corrugated structure of a gradient hydrophobic layer (2) is produced by a femtosecond laser method. The scanning interval is fixed at 50 μm, the focal length of the lens is 200 mm, and the bottom of the upper plate (1) is scanned at a scanning speed of 0.5 mm/s. The pulse energy of the femtosecond laser is selected to be 50 μJ, 80 μJ, 120 μJ, and 155 μJ on the upper plate (1). When the pulse power of the femtosecond pulse laser exceeds the ablation threshold, nano-corrugated structures with different depths are formed under the repeated action of different pulses. S2、在飞秒激光加工后，放入浓度为1％的氟硅烷乙醇溶液中，静置浸泡3到5小时，随后取出放入温度设置为120℃的鼓风干燥箱中，烘烤时间为4小时后静置冷却得到带有梯度疏水层(2)的上板(1)；S2, after femtosecond laser processing, put it into a 1% fluorosilane ethanol solution, let it stand and soak for 3 to 5 hours, then take it out and put it into a forced air drying oven set at 120°C, bake it for 4 hours, then let it stand and cool to obtain an upper plate (1) with a gradient hydrophobic layer (2); S3、首先将下板(4)上方均分成五等份的区域，即50目区(301)、100目区(302)、150目区(303)、200目区(304)、250目区(305)，并在该区域内涂抹粘合剂，将50目铜粉颗粒、100目铜粉颗粒、150目铜粉颗粒、200目铜粉颗粒、250目铜粉颗粒对应粘合在50目区(301)、100目区(302)、150目区(303)、200目区(304)、250目区(305)五个区域内；S3, firstly, the upper part of the lower plate (4) is evenly divided into five equal areas, namely, a 50-mesh area (301), a 100-mesh area (302), a 150-mesh area (303), a 200-mesh area (304), and a 250-mesh area (305), and adhesive is applied to the area, and 50-mesh copper powder particles, 100-mesh copper powder particles, 150-mesh copper powder particles, 200-mesh copper powder particles, and 250-mesh copper powder particles are bonded to the five areas of the 50-mesh area (301), the 100-mesh area (302), the 150-mesh area (303), the 200-mesh area (304), and the 250-mesh area (305); S4、将经过步骤S3处理后的下板(4)放入到管式炉中，首先以5℃/min的速度将炉内温度升高至600℃，并保持10min以去除粘合剂，然后以相同的速度加热至850℃，保温2小时；S4, placing the lower plate (4) treated in step S3 into a tube furnace, first raising the temperature in the furnace to 600°C at a rate of 5°C/min, and maintaining it for 10 minutes to remove the adhesive, and then heating it to 850°C at the same rate and maintaining it for 2 hours; S5、经步骤S4烧结完成后的下板(4)放入电镀装置进行电镀处理，在电镀装置的电镀槽中，铜片作为阳极，烧结后的下板(4)作阴极，电解出的铜单质附着在烧结过后的下板(4)上，在表面上形成微-纳米颗粒结构的梯度亲水层(3)；S5, the lower plate (4) after sintering in step S4 is placed in an electroplating device for electroplating. In the electroplating tank of the electroplating device, the copper sheet serves as an anode and the sintered lower plate (4) serves as a cathode. The electrolyzed copper element adheres to the sintered lower plate (4) to form a gradient hydrophilic layer (3) with a micro-nano particle structure on the surface; S6、经步骤S2和步骤S4制作好的上板(1)和下板(4)对齐并通过两者的连接部焊接在一起，此时上板(1)下表面的梯度疏水层(2)和下板(4)上表面的梯度亲水层(3)正对，且梯度疏水层(2)和梯度亲水层(3)留有间隙。S6. The upper plate (1) and the lower plate (4) manufactured in step S2 and step S4 are aligned and welded together through the connection portion thereof. At this time, the gradient hydrophobic layer (2) on the lower surface of the upper plate (1) and the gradient hydrophilic layer (3) on the upper surface of the lower plate (4) are directly opposite, and a gap is left between the gradient hydrophobic layer (2) and the gradient hydrophilic layer (3). 3.根据权利要求2所述的高效散热的均热板的制作方法，其特征在于，在步骤S4的整个烧结过程中，持续通入氮气以隔绝氧气。3. The method for manufacturing a heat spreader with high efficiency in heat dissipation according to claim 2, characterized in that during the entire sintering process of step S4, nitrogen is continuously introduced to isolate oxygen. 4.根据权利要求2所述的高效散热的均热板的制作方法，其特征在于，在步骤S5中，电镀装置的电镀液为0.8mol/L CuSO4、1.5mol/L H2SO4和0.2mol/L HCl组成的混合液。4 . The method for manufacturing a heat sink with high efficiency heat dissipation according to claim 2 , wherein in step S5 , the plating solution of the electroplating device is a mixed solution consisting of 0.8 mol/L CuSO 4 , 1.5 mol/L H 2 SO 4 and 0.2 mol/L HCl. 5.根据权利要求2所述的高效散热的均热板的制作方法，其特征在于，电镀装置采用的电镀时间为40min、电流密度为0.4mA/mm2。5 . The method for manufacturing a heat sink with high efficiency heat dissipation according to claim 2 , wherein the electroplating time used by the electroplating device is 40 minutes and the current density is 0.4 mA/mm 2 .
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