CN115605046B - Display module and display device - Google Patents
Display module and display deviceInfo
- Publication number
- CN115605046B CN115605046B CN202211286436.2A CN202211286436A CN115605046B CN 115605046 B CN115605046 B CN 115605046B CN 202211286436 A CN202211286436 A CN 202211286436A CN 115605046 B CN115605046 B CN 115605046B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0067—Devices for protecting against damage from electrostatic discharge
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- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
Abstract
本申请涉及一种显示模组及显示装置。显示模组具有显示区域和非显示区域；显示模组包括：显示基板，显示基板包括衬底，以及位于衬底上的金属层，金属层包括信号走线，信号走线延伸至非显示区域远离显示区域的边缘；静电防护层，至少部分静电防护层设置于显示基板沿垂直于显示基板的厚度方向的外周侧，且与非显示区域的信号走线电连接。通过设置静电防护层与走线电连接就能将走线上的静电导到静电防护层上，从而可以避免走线上的静电顺着走线流入显示模组的内部，并通过静电防护层将走线上的静电释放，可以改变走线上的静电的原有流向，同时静电防护层也能够阻挡外部的静电。因此，采用本申请的方案的显示模组具备更优良的抗静电能力。
The present application relates to a display module and a display device. The display module has a display area and a non-display area; the display module includes: a display substrate, the display substrate includes a substrate, and a metal layer located on the substrate, the metal layer includes a signal trace, and the signal trace extends to the edge of the non-display area away from the display area; an electrostatic protection layer, at least part of the electrostatic protection layer is arranged on the outer peripheral side of the display substrate along a thickness direction perpendicular to the display substrate, and is electrically connected to the signal trace in the non-display area. By providing an electrostatic protection layer electrically connected to the trace, the static electricity on the trace can be conducted to the electrostatic protection layer, thereby preventing the static electricity on the trace from flowing along the trace into the interior of the display module, and releasing the static electricity on the trace through the electrostatic protection layer, which can change the original flow direction of the static electricity on the trace, and at the same time, the electrostatic protection layer can also block external static electricity. Therefore, the display module using the solution of the present application has better anti-static ability.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a display module and a display device.
Background
An organic light-Emitting Diode (OLED) has excellent characteristics of self-luminescence, high brightness, wide viewing angle, high contrast, low power consumption, fast response speed, wide operating temperature range, high luminous efficiency, simple process, etc., so that OLED display panels are increasingly widely used. However, static electricity is generated during the use of the OLED display panel. How to improve the antistatic capability of the OLED display panel is a problem to be solved at present.
Disclosure of Invention
Accordingly, it is desirable to provide a display module and a display device having more excellent antistatic ability.
The display module comprises a display substrate and an electrostatic protection layer, wherein the display substrate comprises a substrate and a metal layer positioned on the substrate, the metal layer comprises a signal wire, the signal wire extends to the edge of the non-display area far away from the display area, and the electrostatic protection layer is at least partially arranged on the outer peripheral side of the display substrate in the thickness direction perpendicular to the display substrate and is electrically connected with the signal wire of the non-display area.
In one embodiment, the electrostatic protection layer comprises a first electrostatic protection layer and a second electrostatic protection layer, wherein the first electrostatic protection layer is arranged on at least one side of the display substrate along the thickness direction of the display substrate, and the second electrostatic protection layer is arranged on the outer periphery side of the display substrate along the thickness direction perpendicular to the display substrate and is electrically connected with the signal wire and the first electrostatic protection layer respectively.
In one embodiment, the metal layer, the first electrostatic protection layer and the second electrostatic protection layer are made of the same material.
In one embodiment, the display module further comprises a packaging layer arranged on the light emitting side of the display substrate, wherein the first electrostatic protection layer covers one side, far away from the display substrate, of the packaging layer in the non-display area, and/or covers one side, far away from the packaging layer, of the display substrate in the non-display area.
In one embodiment, the non-display area is arranged around the display area, the first electrostatic protection layer comprises a first sub-electrostatic protection layer located in the non-display area and a second sub-electrostatic protection layer located in the display area, wherein the first sub-electrostatic protection layer comprises a continuous pattern, and the second sub-electrostatic protection layer comprises a grid-shaped pattern.
In one embodiment, the display substrate comprises a plurality of thin film transistors arranged on the substrate, and the orthographic projection of the second sub-static protective layer on the substrate covers the orthographic projection of the channel region of each thin film transistor on the substrate.
In one embodiment, the first sub-static electricity protection layer includes a plurality of stripe-shaped protection structures spaced around the display area.
In one embodiment, in the non-display area, the orthographic projection of a part of the signal trace on the substrate is located outside the orthographic projection of the packaging layer on the substrate, and the orthographic projection of the first electrostatic protection layer on the substrate covers the orthographic projection of a part of the signal trace on the substrate outside the packaging layer.
In one embodiment, the display substrate further comprises a plurality of functional film layers stacked between the metal layer and the packaging layer, and a contact hole located in the non-display area, wherein the contact hole penetrates through the functional film layers, and the first electrostatic protection layer fills the contact hole and is electrically connected with the signal wiring.
In one embodiment, the first electrostatic protection layer located at a side of the encapsulation layer away from the display substrate is electrically connected to the first electrostatic protection layer located at a side of the display substrate away from the encapsulation layer through the second electrostatic protection layer.
A display device is characterized by comprising the display module.
In one embodiment, the display device further includes a frame, and the frame covers a side of the electrostatic protection layer away from the display substrate.
According to the display module and the display device, the substrate and the metal layer on the substrate are arranged in the display substrate, the metal layer comprises the signal wiring used for connecting the electric signals, the signal wiring extends to the outer side edge of the metal layer, so that data interaction and power supply circuits can be provided for the display module, at least part of the static protection layer is arranged on the outer peripheral side of the display substrate and is electrically connected with the signal wiring of the non-display area, and static electricity is most easily generated on the signal wiring due to charge accumulation because the signal wiring is used for transmitting the electric signals. If static is led into the display module assembly through the signal wiring, the device in the display module assembly is damaged, and the static protection layer is electrically connected with the signal wiring to conduct the static on the signal wiring to the static protection layer, so that the static on the signal wiring is prevented from flowing into the display module assembly along the signal wiring, the static on the signal wiring is discharged through the static protection layer, the original flow direction of the static on the signal wiring can be changed, and meanwhile, the static protection layer can also block the external static. Therefore, the display module adopting the scheme of the application has better antistatic capability.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments or the conventional techniques of the present application, the drawings required for the descriptions of the embodiments or the conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.
FIG. 1 is a schematic diagram of a display module according to an embodiment;
FIG. 2 is a schematic diagram of a display module according to another embodiment;
FIG. 3 is a schematic diagram of a display module according to another embodiment;
FIG. 4 is a schematic diagram of a display module according to another embodiment;
FIG. 5 is a schematic diagram of a display module including a package layer according to an embodiment;
FIG. 6 is a schematic diagram of a display module including a package layer according to another embodiment;
FIG. 7 is a schematic diagram of a display module including a package layer according to another embodiment;
FIG. 8 is a schematic diagram of the structure of an electrostatic protection layer according to an embodiment;
FIG. 9 is a schematic diagram of a structure of a display substrate according to an embodiment;
FIG. 10 is a schematic diagram showing the relative positions of the second ESD protection layer and the display substrate according to one embodiment;
FIG. 11 is a schematic diagram of a first sub-electrostatic protection layer according to an embodiment;
FIG. 12 is a schematic diagram of a display module according to another embodiment;
FIG. 13 is a schematic diagram of a display module according to another embodiment;
FIG. 14 is a schematic diagram showing an exemplary structure of a display module according to an embodiment;
fig. 15 is a schematic structural view of a display device according to an embodiment.
The reference numerals indicate that the A1-display area, the A2-non-display area, the 10-display substrate, the 11-metal layer, the 110-signal wiring, the 20-electrostatic protection layer, the 21-first electrostatic protection layer, the 22-second electrostatic protection layer, the 40-encapsulation layer, the 41-cover plate, the 42-glass glue layer, the 211-first sub-electrostatic protection layer, the 212-second sub-electrostatic protection layer, the 12-substrate, the 13-thin film transistor, the 50-plurality of functional film layers, the 60-contact hole, the 51-insulating medium layer, the 52-interlayer insulation layer, the 54-buffer layer, the 55-isolation layer and the 70-frame.
Detailed Description
In order that the application may be readily understood, a more complete description of the application will be rendered by reference to the appended drawings. Embodiments of the application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that the terms first, second, etc. as used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another element.
Spatially relative terms, such as "under", "below", "beneath", "under", "above", "over" and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. Furthermore, the device may also include an additional orientation (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. Further, "connection" in the following embodiments should be understood as "electrical connection", "communication connection", and the like if there is transmission of electrical signals or data between objects to be connected.
As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," and/or the like, specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof. Also, the term "and/or" as used in this specification includes any and all combinations of the associated listed items.
In one embodiment, as shown in fig. 1, a display module is provided, which has a display area A1 and a non-display area A2, and includes a display substrate 10, a metal layer 11, and an electrostatic protection layer 20.
The display area A1 refers to an area of the display substrate 10 for realizing display, the non-display area A2 refers to a frame area of the display substrate 10 or a hole digging area of the display substrate 10, and the non-display area A2 is generally used for setting driving signal wires and driving circuits, for example, an Array substrate row driving (GOA) driving circuit or for setting an on-screen camera, a receiver or a speaker, etc.
The display substrate 10 includes a substrate 12 and a metal layer 11 on the substrate 12, wherein the metal layer 11 includes a signal trace 110, and the signal trace 110 extends to an edge of the non-display area A2 away from the display area A1.
Illustratively, the portion of the metal layer 11 located in the display area A1 of the display substrate 10 may further include an electrode layer, a capacitive metal, etc. of the display substrate 10, so as to satisfy the requirement that the display module displays an image, and the portion of the metal layer 11 located in the non-display area A2 of the display substrate 10 may include a signal trace. In particular, the signal trace 110 may include an ELVSS signal trace for connection to a common potential. Optionally, the signal trace 110 may also include a drive line for transmitting a drive power signal. The signal trace 110 extends to an edge of the non-display area A2 away from the display area A1, so as to facilitate conducting static electricity on the signal trace 110 to an outer edge of the display substrate.
At least a part of the electrostatic protection layer 20 is disposed on the outer peripheral side of the display substrate 10 along the thickness direction perpendicular to the display substrate 10, and is electrically connected to the signal trace 110 of the non-display area A2. Specifically, the electrostatic protection layer 20 is a conductive material, and may be a metal or a metal oxide, and may function to guide electrostatic transmission. Metals such as gold, silver, molybdenum, aluminum, or titanium, or metal oxides such as Indium Tin Oxide (ITO) may also be included. Through setting up static inoxidizing coating 20, can release the static through the metal of large tracts of land to avoid static to cause the damage to the display module assembly.
In this embodiment, the substrate and the metal layer on the substrate are disposed in the display substrate, and the metal layer includes a signal trace for connecting an electrical signal, and the signal trace extends to an outer edge of the non-display area, so as to provide a line for data interaction and power supply for the display module, where at least part of the electrostatic protection layer is disposed on an outer peripheral side of the display substrate and is electrically connected to the signal trace of the non-display area, and since the signal trace is used for transmitting the electrical signal, static electricity is easily generated on the signal trace due to charge accumulation. If static is led into the display module assembly through the signal wiring, the device in the display module assembly is damaged, and the static protection layer is electrically connected with the signal wiring to conduct static on the signal wiring to the static protection layer, so that static on the signal wiring is prevented from flowing into the display module assembly along the signal wiring, static on the signal wiring is discharged through the static protection layer, the original flow direction of static on the signal wiring can be changed, and meanwhile, the static protection layer can also block external static. Therefore, the display module adopting the scheme of the application has better antistatic capability.
In one embodiment, as shown in fig. 2, 3 and 4, the electrostatic protection layer 20 includes a first electrostatic protection layer 21 and a second electrostatic protection layer 22. The first electrostatic protection layer 21 is disposed on at least one side of the display substrate 10 in the thickness direction thereof. The second electrostatic protection layer 22 is disposed on the outer peripheral side of the display substrate 10 in the thickness direction perpendicular to the display substrate 10, and is electrically connected to the signal wiring 110 and the first electrostatic protection layer 21, respectively.
Illustratively, as shown in fig. 2, the first electrostatic protection layer 21 is disposed on the first side of the display substrate 10.
Illustratively, as shown in fig. 3, the first electrostatic protection layer 21 is disposed on a second side of the display substrate 10 opposite to the first side.
Illustratively, as shown in fig. 4, the first electrostatic protection layer 21 is disposed at the first side and the second side of the display substrate 10.
In one embodiment, as shown in fig. 5, in the non-display area A2, the first electrostatic protection layer 21 covers a side of the encapsulation layer 40 away from the display substrate 10.
In one embodiment, as shown in fig. 6, in the non-display area A2, the first electrostatic protection layer 21 covers a side of the display substrate 10 away from the encapsulation layer 40.
In this embodiment, the electrostatic protection layer is also disposed on at least one side of the thickness direction of the display substrate, so that the area of the electrostatic protection layer and the area covered by the electrostatic protection layer are increased, the area for discharging static is larger, static can be discharged more uniformly, and static discharge is faster. The antistatic capability of the display module is improved.
In one embodiment, the materials of the metal layer 11, the first electrostatic protection layer 21 and the second electrostatic protection layer 22 may be the same, or may be different, or may be at least two of the same, and the materials may be conductive materials, and may be metals or metal oxides, which can perform the function of guiding electrostatic transmission. Metals such as gold, silver, molybdenum, aluminum, or titanium, or metal oxides such as Indium Tin Oxide (ITO) may also be included.
Optionally, the metal layer 11, the first electrostatic protection layer 21 and the second electrostatic protection layer 22 are made of the same material. Thereby facilitating the conduction of static electricity.
In one embodiment, as shown in fig. 5, 6 and 7, the display module further includes an encapsulation layer 40, wherein the encapsulation layer 40 is disposed on the light emitting side of the display substrate 10.
Specifically, the encapsulation layer 40 may be an encapsulation substrate, and includes a glass adhesive layer 42 and a cover plate 41 that are sequentially stacked, and are disposed on the light emitting side of the display substrate 10, so that the display substrate 10 can be isolated, and the display substrate 10 is prevented from being corroded by external oxygen or water vapor to fail. For rigid screens, the display substrate 10 is typically encapsulated by way of a frit encapsulation, for example. The glass material is printed on the cover plate glass, the glass material is heated by moving the laser beam to be melted to form the airtight package, and the glass material is melted on the cover plate glass to form a layer of sealing body. The cover glass is the cover 41, and the melted glass frit is the glass cement layer 42.
In one embodiment, as shown in fig. 7, in the non-display area A2, the first electrostatic protection layer 21 covers a side of the encapsulation layer 40 away from the display substrate 10 and a side of the display substrate 10 away from the encapsulation layer 40.
Specifically, the electrostatic protection layer 20 may be disposed only on a side of the encapsulation layer 40 away from the display substrate 10, or may be disposed only on a side of the display substrate 10 away from the encapsulation layer 40, or may be disposed on both a side of the encapsulation layer 40 away from the display substrate 10 and a side of the display substrate 10 away from the encapsulation layer 40. Can be adjusted according to the requirements.
In this embodiment, the electrostatic protection layer 20 is designed to cover the side of the encapsulation layer 40 away from the display substrate 10 and/or the side of the encapsulation layer 40 away from the display substrate 10, so that the area of the electrostatic protection layer 20 and the area covered by the electrostatic protection layer 20 are increased, the area for releasing static electricity is larger, static electricity can be released more uniformly, static electricity is released more rapidly, and the antistatic capability of the display module can be improved.
In one embodiment, referring to fig. 7, the first electrostatic protection layer 21 on the side of the encapsulation layer 40 away from the display substrate 10 is electrically connected to the first electrostatic protection layer 21 on the side of the display substrate 10 away from the encapsulation layer 40 through the second electrostatic protection layer 22.
In this embodiment, the first electrostatic protection layer 21 on the side of the encapsulation layer 40 away from the display substrate 10 is electrically connected with the first electrostatic protection layer 21 on the side of the display substrate 10 away from the encapsulation layer 40 through the second electrostatic protection layer 22, so that the total area of the electrostatic protection layers can be increased, static electricity on the signal wires 110 can be rapidly evacuated, and the antistatic performance of the display module is improved.
In one embodiment, as shown in fig. 8, the non-display area A2 is disposed around the display area A1. The first electrostatic protection layer 21 includes a first sub-electrostatic protection layer 211 located in the non-display area A2, and a second sub-electrostatic protection layer 212 located in the display area A1.
The first sub-electrostatic protection layer 211 includes a continuous pattern, which may be a monolithic conductive material, or may be a metal material including a pattern with any shape, without limitation. The second sub-static electricity shield layer 212 includes a mesh-like pattern.
Specifically, the display area A1 refers to an area of the display substrate 10 for displaying, the non-display area A2 refers to a frame area of the display substrate 10, and the second sub-electrostatic protection layer 212 is disposed on a side of the display substrate 10 facing away from the light emitting side in the display area A1, so as not to block light emission of the display substrate 10.
In this embodiment, the first sub-electrostatic protection layer 211 and the second sub-electrostatic protection layer 212 are provided, and the second sub-electrostatic protection layer 212 is in a grid shape, so that the cost can be saved and the weight of the second sub-electrostatic protection layer 212 can be reduced while the area as large as possible is covered.
In one embodiment, as shown in fig. 9, the display substrate 10 includes a plurality of thin film transistors 13 (Thin Film Transistor, TFTs) disposed on a substrate 12. Illustratively, the channel material of the thin film transistor 13 may be indium gallium zinc oxide (IndiumGalliumZinc Oxide, IGZO), indium Tin Zinc Oxide (ITZO), indium zinc oxide (Indium Zinc Oxide, IZO), low temperature polysilicon (LowTemperature Poly-silicon, LTPS), single crystal silicon, or amorphous silicon (a-Si) and polysilicon (poly-Si). However, amorphous silicon is a photosensitive substance, and is liable to generate photocurrent after being irradiated with a light beam, and is liable to cause a phenomenon of light leakage, which causes flickering of a display screen of a display device, thereby affecting display of the display substrate 10. In order to avoid the occurrence of the photo-leakage phenomenon, in the embodiment of the present application, the orthographic projection of the second sub-electrostatic protection layer 212 on the substrate 12 covers the orthographic projection of the channel region of each thin film transistor 13 on the substrate 12, so as to avoid the occurrence of the photo-leakage.
As shown in fig. 10, the second sub-static electricity protection layer 212 is disposed on a side of the display substrate 10 facing away from the light emitting surface, and an orthographic projection of the second sub-static electricity protection layer 212 on the substrate 12 covers a channel region of the thin film transistor 13.
In this embodiment, the second sub-electrostatic protection layer 212 is used to shield the channel region of the TFT, so that the phenomenon of light leakage caused by irradiation of the light beam on the channel region of the TFT can be avoided, and meanwhile, the second sub-electrostatic protection layer 212 can also play a role in conducting and releasing static electricity. In addition, the second sub-electrostatic protection layer 212 is designed to be grid-shaped, so that materials required for the second sub-electrostatic protection layer 212 can be reduced, cost can be saved, and weight of the display module can be reduced.
In one embodiment, as shown in fig. 11, the first sub-static electricity protection layer 211 includes a plurality of stripe-shaped protection structures spaced around the display area A1.
Specifically, a plurality of stripe structures are arranged at intervals along the periphery of the display area A1.
In the present embodiment, the first sub-static electricity protection layer 211 is a plurality of stripe structures disposed around the display area A1, thereby also facilitating uniform discharge of static electricity.
In one embodiment, as shown in FIG. 12, in the non-display area A2, at least a portion of the signal trace 110 is orthographic projected onto the substrate 12, outside of the orthographic projection of the encapsulation layer 40 onto the substrate 12.
The front projection of the first electrostatic protection layer 21 on the substrate 12 covers the front projection of the part of the signal trace 110 located outside the encapsulation layer 40 on the substrate 12.
In the present embodiment, the metal layer extends to the outer side of the encapsulation layer 40, so that the signal trace 110 also extends to the outer side of the encapsulation layer, but the metal layer is covered in the first electrostatic protection layer 21, so that static electricity on the signal trace 110 can be evacuated through the first electrostatic protection layer 21, and meanwhile, the first electrostatic protection layer 21 can also block external static electricity from contacting the signal trace 110, so as to avoid the static electricity from entering the display module from the signal trace 110 and damaging the display module.
In one embodiment, as shown in fig. 13, the display substrate 10 further includes a plurality of functional film layers 50 and contact holes 60. Wherein:
the plurality of functional film layers 50 are stacked between the metal layer 11 and the encapsulation layer 40. Specifically, the plurality of functional film layers 50 may include an insulating layer, an interlayer dielectric layer, and the like.
The contact hole 60 is located in the non-display area A2, the contact hole 60 penetrates through the functional film layers 50, and the first electrostatic protection layer 21 fills the contact hole 60 and is electrically connected to the signal trace 110.
Specifically, the contact holes 60 penetrating through the functional film layers 50 are provided, so that a space can be provided for the first electrostatic protection layer 21, so that the first electrostatic protection layer 21 can be connected with the metal layer 11 through the contact holes 60, and further electrically connected with the signal trace 110, and static electricity on the signal trace 110 can be evacuated.
In this embodiment, through the contact holes 60 penetrating through the plurality of functional film layers 50, when the portions of the packaging layer 40 cut are more, the area capable of accommodating the first electrostatic protection layer 21 is reserved on the plurality of functional film layers 50, so that the first electrostatic protection layer 21 can be filled in the contact holes 60 and then be in contact with the metal layer 11, the effect of dispersing static electricity on the signal trace 110 in the metal layer 11 is achieved, and the contact holes 60 provide a larger electrical connection area for the electrostatic protection layer 20 and the metal layer 11, so that the first electrostatic protection layer 21 can disperse static electricity on the signal trace 110 better.
In one embodiment, as shown in fig. 14, the plurality of functional film layers 50 of the display module includes an insulating dielectric layer 51 and an interlayer insulating layer 52 laminated in this order.
Illustratively, the insulating dielectric layer 51 serves to insulate the capacitance from the signal traces, thereby avoiding shorting of the signal traces.
Illustratively, the interlayer insulating layer 52 may be a passivation layer, and can function as insulation.
In this embodiment, the plurality of functional film layers 50 are provided, so that the working requirements of the display module can be met, and the display module can work more stably.
In one embodiment, referring to fig. 14, the display substrate 10 further includes a buffer layer 54 and a spacer layer 55 sequentially stacked.
The buffer layer 54 and the isolation layer 55 are stacked between the metal layer 11 and the substrate 12.
Illustratively, the buffer layer 54 is capable of blocking external water oxygen and regulating the energy and temperature of the laser.
Illustratively, the isolation layer 55 can isolate the gate of the thin film transistor 13 from other semiconductor layers.
In this embodiment, the buffer layer 54 and the isolation layer 55 are provided, so that the working requirement of the display module can be met, and the display module can work more stably.
In one embodiment, a display device is provided, including the display module set described in the above embodiment.
Specifically, the display device may be a mobile or stationary terminal of a mobile phone, a television, a tablet computer, a notebook computer, an ultra-mobile personal computer, a UMPC, a personal digital assistant (personal digitalassistant, PDA), a virtual reality device, or the like.
In this embodiment, the display device using the display module has better antistatic performance.
In one embodiment, as shown in fig. 15, a display device is provided, which includes the display module set described in the above embodiment. The display device further comprises a frame 70, and the frame 70 covers a side of the electrostatic protection layer 20 away from the display substrate 10.
Specifically, the electrostatic protection layer 20 is electrically connected to the bezel 70, so that static electricity in the display module can be conducted to the bezel.
In this embodiment, the side of the electrostatic protection layer far away from the display substrate 10 is provided with the frame of the display device, which provides a static electricity evacuation channel, so that the electrostatic protection layer is convenient for conducting static electricity to the frame for evacuation.
In the description of the present specification, reference to the terms "some embodiments," "other embodiments," "desired embodiments," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211286436.2A CN115605046B (en) | 2022-10-20 | 2022-10-20 | Display module and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211286436.2A CN115605046B (en) | 2022-10-20 | 2022-10-20 | Display module and display device |
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| Publication Number | Publication Date |
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| CN115605046A CN115605046A (en) | 2023-01-13 |
| CN115605046B true CN115605046B (en) | 2025-09-23 |
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| CN116386462A (en) * | 2023-02-22 | 2023-07-04 | 昆山国显光电有限公司 | Display module and display device |
| CN120113381A (en) * | 2023-08-29 | 2025-06-06 | 京东方科技集团股份有限公司 | Display panel and manufacturing method thereof, and display device |
| CN119152778A (en) * | 2024-08-28 | 2024-12-17 | 天马新型显示技术研究院(厦门)有限公司 | Display panel, display device and spliced display device |
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| CN205828391U (en) * | 2016-06-30 | 2016-12-21 | 上海天马有机发光显示技术有限公司 | A kind of OLED display panel |
| CN114784058A (en) * | 2022-03-14 | 2022-07-22 | 华为技术有限公司 | Display and electronic equipment |
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| TWI628491B (en) * | 2016-07-29 | 2018-07-01 | 鴻海精密工業股份有限公司 | Anti-static display device |
| CN107845645B (en) * | 2017-09-28 | 2020-03-13 | 上海天马微电子有限公司 | A display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN205828391U (en) * | 2016-06-30 | 2016-12-21 | 上海天马有机发光显示技术有限公司 | A kind of OLED display panel |
| CN114784058A (en) * | 2022-03-14 | 2022-07-22 | 华为技术有限公司 | Display and electronic equipment |
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