[go: up one dir, main page]

CN115620975A - Apparatus and method for creating an opening through a metal oxide varistor coating - Google Patents

Apparatus and method for creating an opening through a metal oxide varistor coating Download PDF

Info

Publication number
CN115620975A
CN115620975A CN202110808647.7A CN202110808647A CN115620975A CN 115620975 A CN115620975 A CN 115620975A CN 202110808647 A CN202110808647 A CN 202110808647A CN 115620975 A CN115620975 A CN 115620975A
Authority
CN
China
Prior art keywords
cutting device
platform
coupled
movs
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110808647.7A
Other languages
Chinese (zh)
Inventor
闵龙
宋东健
陆利兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Littelfuse Electronic Co Ltd
Original Assignee
Dongguan Littelfuse Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Littelfuse Electronic Co Ltd filed Critical Dongguan Littelfuse Electronic Co Ltd
Priority to CN202110808647.7A priority Critical patent/CN115620975A/en
Publication of CN115620975A publication Critical patent/CN115620975A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C10/00Adjustable resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

公开了用于创建穿过金属氧化物变阻器(MOV)涂层的开口的方式。在一些实施例中,装配件可以包括:切割设备,其包括切割装置;可转动平台,其与切割设备相耦合;以及与可转动平台相耦合的多个金属氧化物变阻器(MOV),其中切割装置能够朝向可转动平台偏置,以在形成于多个MOV中的每个上面的涂层中形成开口。

Figure 202110808647

Approaches for creating openings through metal oxide varistor (MOV) coatings are disclosed. In some embodiments, the assembly may include: a cutting device including a cutting device; a rotatable platform coupled to the cutting device; and a plurality of metal oxide varistors (MOVs) coupled to the rotatable platform, wherein the cutting The device can be biased toward the rotatable platform to form openings in the coating formed on each of the plurality of MOVs.

Figure 202110808647

Description

用于创建穿过金属氧化物变阻器涂层的开口的设备和方法Apparatus and method for creating openings through metal oxide varistor coatings

技术领域technical field

实施例涉及电路保护装置的领域,并且更具体地,涉及用于创建穿过金属氧化物变阻器(MOV)涂层的开口的设备和方法。Embodiments relate to the field of circuit protection devices, and more particularly, to apparatus and methods for creating openings through metal oxide varistor (MOV) coatings.

背景技术Background technique

过压保护装置被用于保护电子电路和组件,免受由于过压故障状况引起的损坏。这些过压保护装置可以包括被连接在要被保护的电路与接地线之间的金属氧化物变阻器(MOV)。MOV具有电流-电压特性,这允许其被用于保护这种电路免受灾难性的电压浪涌。MOV一般是由陶瓷盘(通常基于ZnO)、作为电极的电接触层(例如Ag(银)电极)、以及分别连接在第一表面和第二表面的第一金属引线和第二金属引线组成,其中第二表面与第一表面相对。在许多情况下,MOV还可以被提供有围绕着陶瓷盘和其它材料的绝缘涂层。在制造期间,窗口通过涂层被形成,以提供对MOV的陶瓷盘和/或其它内部组件的访问。然而,此窗口开口过程是人工完成的,这是劳动密集型的并且降低了产量。Overvoltage protection devices are used to protect electronic circuits and components from damage due to overvoltage fault conditions. These overvoltage protection devices may comprise metal oxide varistors (MOVs) connected between the circuit to be protected and ground. MOVs have current-voltage characteristics that allow them to be used to protect such circuits from catastrophic voltage surges. MOV is generally composed of a ceramic disc (usually based on ZnO), an electrical contact layer as an electrode (such as an Ag (silver) electrode), and a first metal lead and a second metal lead connected to the first surface and the second surface, respectively, Wherein the second surface is opposite to the first surface. In many cases, MOVs can also be provided with an insulating coating surrounding the ceramic disk and other materials. During fabrication, windows are formed through the coating to provide access to the MOV's ceramic disk and/or other internal components. However, this window opening process is done manually, which is labor intensive and reduces throughput.

提供本公开正是关于现有技术的此种及其它缺陷的。It is with regard to this and other deficiencies of the prior art that the present disclosure is provided.

发明内容Contents of the invention

提供发明内容是为了以简化的方式介绍概念的选择,所述概念将在以下详细的说明说中被进一步描述。发明内容并非旨在识别所要求保护的主题的关键或必要特征,也不旨在辅助确定所要求保护的主题的范围。This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be an aid in determining the scope of the claimed subject matter.

在一种方式中,设备可以包括:切割设备,其包括切割装置;可转动平台,其与切割设备相邻近;以及多个金属氧化物变阻器(MOV),其与可转动平台相耦合,其中切割装置能够朝向可转动平台偏置,以在提供于多个MOV中的每个上面的涂层中形成开口。In one approach, the apparatus may include: a cutting apparatus including a cutting device; a rotatable platform adjacent to the cutting apparatus; and a plurality of metal oxide varistors (MOVs) coupled to the rotatable platform, wherein The cutting device can be biased toward the rotatable platform to form openings in the coating provided on each of the plurality of MOVs.

在另一方式中,系统可以包括:切割设备,其包括切割装置;平台,其与切割设备相邻近;以及多个金属氧化物变阻器(MOV),其与平台相耦合,其中切割装置能够朝向可转动平台偏置,以在提供于多个MOV中的每个上面的涂层中形成开口,并且其中可转动平台相对于切割设备旋转。In another aspect, a system may include: a cutting device including a cutting device; a platform adjacent to the cutting device; and a plurality of metal oxide varistors (MOVs) coupled to the platform, wherein the cutting device can be oriented toward The rotatable platform is biased to form openings in the coating provided on each of the plurality of MOVs, and wherein the rotatable platform rotates relative to the cutting device.

在又另一方式中,方法可以包括:提供包括切割装置的切割设备,并且将平台安装在切割装置附近,其中多个金属氧化物变阻器(MOV)与平台相耦合。该方法还可以包括将平台旋转,并且使切割装置朝向平台偏置以作用于(impact)多个MOV中的每个上面的涂层。In yet another approach, a method may include providing a cutting apparatus including a cutting device, and mounting a platform proximate to the cutting device, wherein a plurality of metal oxide varistors (MOVs) are coupled to the platform. The method may also include rotating the platform and biasing the cutting device toward the platform to impact the coating on each of the plurality of MOVs.

附图说明Description of drawings

附图示出了目前公开的实施例的示例性方式,其被设计用于其原理的实际应用,并且其中:The drawings illustrate exemplary manners of the presently disclosed embodiments, which are designed for practical application of the principles thereof, and in which:

图1是根据本公开实施例的装配件的透视图;FIG. 1 is a perspective view of an assembly according to an embodiment of the disclosure;

图2是根据本公开实施例的图1的装配件的俯视图;2 is a top view of the assembly of FIG. 1 according to an embodiment of the disclosure;

图3是根据本公开实施例的装配件的切割装置的透视图;3 is a perspective view of a cutting device of an assembly according to an embodiment of the disclosure;

图4是根据本公开实施例的包括MOV的模块的透视图;4 is a perspective view of a module including MOVs according to an embodiment of the disclosure;

图5是根据本公开实施例的装配件的部分透视图;5 is a partial perspective view of an assembly according to an embodiment of the disclosure;

图6是根据本公开实施例的穿过MOV的涂层所形成的开口的俯视透视图;以及6 is a top perspective view of an opening formed through a coating of an MOV according to an embodiment of the disclosure; and

图7是根据本公开实施例的方法的流程图。FIG. 7 is a flowchart of a method according to an embodiment of the disclosure.

附图未必是按比例绘制的。附图仅是代表性的,而并非旨在描绘本公开的特定参数。附图旨在描绘本公开的示例性实施例,并且因此不应当被认为是对范围的限制。在附图中,相同的标号表示相同的元件。The drawings are not necessarily drawn to scale. The drawings are representative only, not intended to portray specific parameters of the disclosure. The drawings are intended to depict exemplary embodiments of the present disclosure and therefore should not be considered limiting of scope. In the drawings, the same reference numerals denote the same elements.

此外,为了说明清楚,一些附图中的某些元件可以被省略或未按比例示出。为了说明清楚,截面图可以是以“切片”或“近视”的形式的横截面视图,其在“真实”的横截面视图中省略了另外可见的某些背景线。此外,为了清楚,在某些附图中一些附图标记可以被省略。Additionally, certain elements in some of the drawings may be omitted or not shown to scale for clarity of illustration. For clarity of illustration, a cross-sectional view may be a "slice" or "close-up" cross-sectional view that omits certain background lines that would otherwise be visible in a "true" cross-sectional view. Also, some reference numerals may be omitted in some drawings for clarity.

具体实施方式detailed description

现在将在下文中参照附图更完全地描述根据本公开的装配件、装置和方法,其中示出了实施例。所述装配件、装置和方法可以被具体表现为许多不同的形式,并且不应当被解释为被限制于本文中所阐述的实施例。相反,提供这些实施例使得本公开将是详尽的和完整的,并且将向本领域技术人员充分传达本公开的范围。Assemblies, devices and methods according to the present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments are shown. The assemblies, devices and methods may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

如将在本文中更详细地描述的,本公开的实施例提供了一种用于在具有一致性且不损坏底层MOV磁盘的情况下在MOV涂层上开口窗口的有效方式。在一些方式中,装配件可以包括与可转动平台相邻近的切割设备,其支撑多个MOV。在将MOV和/或平台定位在切割设备的附近之前,MOV涂层可以被加热以软化涂层。一旦被软化,穿透MOV涂层的冲压力可以被减小以便避免损坏MOV盘。在一些实施例,切割设备可以包括弹簧,其与切割设备的冲压刀片相耦合以控制冲压力。因此,本文中的实施例有利地提供了尺寸一致性,良好控制的冲压力和更大的装置产量。As will be described in more detail herein, embodiments of the present disclosure provide an efficient way to open windows in MOV coatings with consistency and without damaging the underlying MOV disk. In some approaches, the assembly may include a cutting device adjacent to a rotatable platform that supports a plurality of MOVs. The MOV coating may be heated to soften the coating prior to positioning the MOV and/or platform in the vicinity of the cutting device. Once softened, the punch force that penetrates the MOV coating can be reduced in order to avoid damage to the MOV disk. In some embodiments, the cutting device may include a spring coupled to the punching blade of the cutting device to control the punching force. Thus, the embodiments herein advantageously provide dimensional consistency, well-controlled stamping force, and greater device throughput.

转向图1-2,将描述根据本公开实施例的装配件100。装配件100可以包括切割设备102,其包括切割装置104,其可以是能够穿透MOV 112的覆层或涂层110的冲压刀片或其它合适的组件。切割设备102可以与支撑结构106相耦合或整体形成。虽然是非限制性的,但是支撑结构106可以包括被定位在大约腰高的平台或桌台108,以便于操作者使用。Turning to FIGS. 1-2 , an assembly 100 according to an embodiment of the present disclosure will be described. Assembly 100 may include cutting apparatus 102 including cutting device 104 , which may be a punching blade or other suitable component capable of penetrating cladding or coating 110 of MOV 112 . Cutting device 102 may be coupled or integrally formed with support structure 106 . Although not limiting, the support structure 106 may include a platform or table 108 positioned at about waist height for ease of use by the operator.

装配件100还可以包括延伸至桌台108以上的可转动平台114。在一些实施例中,可转动平台114可以被固定到可转动柱(column)116,其延伸穿过桌台108的开口118。可转动平台114可以包括与顶部表面122相耦合的多个基座模块120。如图所示,基座模块120可以围绕可转动平台114的中心以环形图样被排列。基座模块120中的每个可以包含MOV 112。在使用中,可转动平台114可以顺序地旋转到MOV 112中的每个位于切割装置104下方的位置,使得可以穿过涂层110形成开口125。切割设备102可在垂直于由可转动平台114的顶部表面122所定义的平面的方向上偏置(例如上/下)以接合每个MOV。Assembly 100 may also include a rotatable platform 114 that extends above table 108 . In some embodiments, the rotatable platform 114 may be secured to a rotatable column 116 that extends through the opening 118 of the table top 108 . The rotatable platform 114 may include a plurality of base modules 120 coupled to a top surface 122 . As shown, the base modules 120 may be arranged in a circular pattern around the center of the rotatable platform 114 . Each of base modules 120 may contain MOV 112 . In use, rotatable platform 114 may be rotated sequentially into a position where each of MOVs 112 is below cutting device 104 such that opening 125 may be formed through coating 110 . The cutting apparatus 102 may be biased (eg, up/down) in a direction perpendicular to the plane defined by the top surface 122 of the rotatable platform 114 to engage each MOV.

在一些实施例中,涂层110可以在切割之前通过加热MOV 112和涂层110被预软化。例如,在可转动平台114被附接到支撑结构106之前,包括基座模块120和MOV 112的可转动平台114可以在另一区域(例如加热室)中被加热。然后,可转动平台114可以被转移到支撑结构106,以用于由切割设备102处理。可替选地,可转动平台114、基座模块120和MOV 112可以在被固定到支撑结构106时被加热。虽然是非限制性的,但是涂层110可以经受160℃-220℃之间的温度。In some embodiments, coating 110 may be pre-softened by heating MOV 112 and coating 110 prior to cutting. For example, rotatable platform 114 including base module 120 and MOV 112 may be heated in another area (eg, a heating chamber) before rotatable platform 114 is attached to support structure 106 . The rotatable platform 114 may then be transferred to the support structure 106 for handling by the cutting device 102 . Alternatively, rotatable platform 114 , base module 120 and MOV 112 may be heated while being secured to support structure 106 . Although not limiting, coating 110 may withstand temperatures between 160°C and 220°C.

现在转向图3,将据此更详细地描述示例切割装置104。如图所示,切割装置104可以包括柱(post)130和底座132,其中柱130包括自由端134,其包括可操作以作用于MOV 112的涂层110的一个或多个边缘136。在示出的实施例中,柱130的自由端134可以具有期望尺寸的矩形剖面/横截面。然而,本公开不限于柱130的任何特定形状或者一个或多个尺寸。如进一步所示出的,底座132一般可以是具有一个或多个开口138的矩形形状,以用于使用例如螺丝或其它紧固件(未示出)将切割装置104固定到切割设备102。Turning now to FIG. 3 , an example cutting device 104 will be described in greater detail accordingly. As shown, cutting device 104 may include a post 130 including a free end 134 including one or more edges 136 operable to engage coating 110 of MOV 112 and a base 132 . In the illustrated embodiment, the free end 134 of the post 130 may have a rectangular profile/cross-section of desired dimensions. However, the present disclosure is not limited to any particular shape or dimension or dimensions for post 130 . As further shown, base 132 may be generally rectangular in shape with one or more openings 138 for securing cutting device 104 to cutting apparatus 102 using, for example, screws or other fasteners (not shown).

图4更详细地示出了示例基座模块120。基座模块120可以包括下面部分140和从下面部分延伸的上面部分142。下面部分140可以包括一个或多个开口144,以用于将基座模块120固定到可转动平台114。上面部分142可以包括顶部表面148中的凹槽146以将MOV 112容纳在其中。将理解的是,用于基座模块120的不同的配置和/或尺寸在其它实施例中是可能的。FIG. 4 shows an example base module 120 in more detail. The base module 120 may include a lower portion 140 and an upper portion 142 extending from the lower portion. Lower portion 140 may include one or more openings 144 for securing base module 120 to rotatable platform 114 . Upper portion 142 may include a groove 146 in top surface 148 to receive MOV 112 therein. It will be appreciated that different configurations and/or dimensions for the base module 120 are possible in other embodiments.

图5更详细地展示了切割设备102的一部分。在一些实施例中,切割设备102可以包括顶板150、中央板152和底板154,其中切割装置104可以直接耦合到底板154。偏置装置156(例如液压装置、气动装置、电机等)可以包括与底板154相耦合的轴158。在使用中,轴158可以被向上和向下偏置,以使底板154与切割装置104相对于可转动平台114移动。在一些实施例中,一个或多个弹簧160(例如压缩弹簧)可以被提供以缓冲在切割装置104接合MOV 112的涂层110时来自切割装置104的作用力。将理解的是,用于切割设备102的不同配置在其它实施例中是可能的。Figure 5 shows a portion of the cutting device 102 in more detail. In some embodiments, cutting apparatus 102 may include a top plate 150 , a central plate 152 , and a bottom plate 154 , wherein cutting device 104 may be coupled directly to bottom plate 154 . A biasing device 156 (eg, hydraulic, pneumatic, electric, etc.) may include a shaft 158 coupled to the base plate 154 . In use, the shaft 158 may be biased upward and downward to move the base plate 154 and cutting device 104 relative to the rotatable platform 114 . In some embodiments, one or more springs 160 (eg, compression springs) may be provided to dampen forces from the cutting device 104 as the cutting device 104 engages the coating 110 of the MOV 112 . It will be appreciated that different configurations for cutting device 102 are possible in other embodiments.

图6展示了在穿过涂层110的开口125的形成之后的示例MOV 112。如图所示,可以是矩形的开口125提供了对MOV 112的陶瓷盘160的访问。穿过涂层110的窗口125的形状可以按照需要被容易地修改。虽然是非限制性的,但是涂层110可以是提供在MOV 112上面(除了向外延伸的导体155和156的一部分之外)的环氧树脂或类似的绝缘体。FIG. 6 illustrates example MOV 112 after formation of opening 125 through coating 110 . As shown, opening 125 , which may be rectangular, provides access to ceramic disc 160 of MOV 112 . The shape of the window 125 through the coating 110 can be easily modified as desired. Although not limiting, coating 110 may be an epoxy or similar insulator provided over MOV 112 (except for a portion of outwardly extending conductors 155 and 156 ).

图7展示了根据本公开实施例的示例方法200。在框201处,方法200可以包括提供包括切割装置的切割设备。在一些实施例中,切割装置可以是能够穿透MOV 112的环氧树脂覆层或涂层的冲压刀片或其它合适的组件。FIG. 7 illustrates an example method 200 according to an embodiment of the disclosure. At block 201 , method 200 may include providing a cutting apparatus including a cutting device. In some embodiments, the cutting device may be a stamping blade or other suitable component capable of penetrating the epoxy cladding or coating of MOV 112 .

在框202处,方法200可以包括将可转动平台安装在切割设备的附近,其中多个MOV与可转动平台相耦合。在一些实施例中,可转动平台可以是圆形的,并且MOV可以通过对应的基座模块与可转动平台相耦合。在一些实施例中,可转动平台和切割设备可以与支撑结构相耦合。At block 202, method 200 may include mounting a rotatable platform proximate to a cutting apparatus, wherein a plurality of MOVs are coupled to the rotatable platform. In some embodiments, the rotatable platform may be circular, and the MOV may be coupled to the rotatable platform through a corresponding base module. In some embodiments, a rotatable platform and cutting device may be coupled to a support structure.

在框203处,方法200可以包括将平台旋转并且使切割装置朝向平台偏置,以作用于多个MOV中的每个上面的涂层。更具体地,切割装置可以在不损坏直接位于涂层下方的盘的情况下在多个MOV中的每个上面的涂层中形成开口。在一些实施例中,切割装置在垂直于由平台的顶部表面所定义的平面的方向上被偏置的。在一些实施例中,在多个MOV中的每个上面的涂层中形成开口之前,多个MOV被加热。At block 203 , method 200 may include rotating the platform and biasing the cutting device toward the platform to act on the coating on each of the plurality of MOVs. More specifically, the cutting device can form openings in the coating above each of the plurality of MOVs without damaging the disk directly below the coating. In some embodiments, the cutting device is biased in a direction perpendicular to the plane defined by the top surface of the platform. In some embodiments, the plurality of MOVs are heated prior to forming openings in each of the overlying coatings in the plurality of MOVs.

如本文中所使用的,以单数形式所述并且以词语“一”或“一个”开展的元件或步骤被理解为不排除多个元件或步骤,除非明确地描述这样的排除。此外,对于本公开的“一个实施例”的参照并非旨在被解释为排除同样结合了所述特征的额外实施例的存在。As used herein, an element or step recited in the singular and proceeded with the word "a" or "an" is understood as not excluding plural elements or steps, unless such exclusion is explicitly stated. Furthermore, references to "one embodiment" of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features.

“包括”、“包含”或“具有”以及其在文中变型的使用,意味着涵盖其后所列出的项目和其等同物以及额外的项目。因此,术语“包括”、“包含”或“具有”及其变型是开放式的表达,并且可以在本文中被互换使用。The use of "comprising", "comprising" or "having" and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Accordingly, the terms "comprising", "comprising" or "having" and variations thereof are open-ended expressions and may be used interchangeably herein.

如在本文中所使用的短语“至少一个”、“一个或多个”和“和/或”是开放式的表达,并且在操作中既是连接词也是反意连接词。例如,“A、B和C中的至少一个”、“A、B或C中的至少一个”、“A、B和C中的一个或多个”、“A、B或C中的一个或多个”和“A、B和/或C”意味着单独地A,单独地B,单独地C,A和B一起,A和C一起,B和C一起,或A、B和C一起。As used herein, the phrases "at least one", "one or more" and "and/or" are open-ended expressions and are both conjunctions and anti-conjunctions in operation. For example, "at least one of A, B and C", "at least one of A, B or C", "one or more of A, B and C", "one of A, B or C or A plurality of" and "A, B and/or C" means A alone, B alone, C alone, A and B together, A and C together, B and C together, or A, B and C together.

所有方向的参照(例如近侧、远侧、上面的、下面的、向上的、向下的、左、右、侧向、纵向、前面的、后面的、顶部、底部、上方的、下方的、垂直的、水平的、径向的、轴向的、顺时针的,和逆时针的)只是用于标识目的,以帮助读者对于本公开的理解。所述方向的参照并不创建限制性,尤其是对于本公开的位置、方位或使用。连接参照(例如附接的、耦合的、连接的和结合的)除非另有说明,否则应当被广义地解释并且可以包括元件的连接之间的中间件和元件之间的相对运动。同样地,连接参照并非意指两个元件是直接相连接的和彼此固定。All directional references (e.g., proximal, distal, superior, inferior, upward, downward, left, right, lateral, longitudinal, anterior, posterior, top, bottom, superior, inferior, Vertical, horizontal, radial, axial, clockwise, and counterclockwise) are used for identification purposes only to aid the reader's understanding of the present disclosure. References to directions do not create limitations, especially as to position, orientation or use of the present disclosure. Connection references (eg, attached, coupled, connected, and joined) are to be construed broadly and may include intermediates between a connection of elements and relative movement between elements unless otherwise indicated. Likewise, connection references do not imply that two elements are directly connected and fixed to each other.

此外,标识参照(例如主要的、次要的、第一、第二、第三、第四等)并非旨在暗示重要性或优先级,并且被用于将一个特征与另一个区分开。所述附图是用于说明的目的,并且所附图示中所反映的尺寸、位置、顺序和相对大小可以变化。Furthermore, identifying references (eg, primary, secondary, first, second, third, fourth, etc.) are not intended to imply importance or priority, and are used to distinguish one characteristic from another. The drawings are for illustration purposes and the dimensions, positions, order and relative sizes reflected in the drawings may vary.

此外,术语“基本上”或“大约地”以及术语“近似的”或“大概地”可以在一些实施例中被互换使用,并且能够使用由本领域技术人员可接受的任何相对测量进行描述。例如,这些术语可以用作与参照参数的比较,以指示能够提供预期功能的误差。虽然是非限制性的,但是与参照参数的误差可以是例如,小于1%、小于3%、小于5%、小于10%、小于15%、小于20%等的量。Furthermore, the terms "substantially" or "approximately" and the terms "approximately" or "approximately" may be used interchangeably in some embodiments and can be described using any relative measure acceptable to those skilled in the art. For example, these terms may be used as a comparison to reference parameters to indicate an error in providing expected function. Although not limiting, the error from the reference parameter can be, for example, by an amount less than 1%, less than 3%, less than 5%, less than 10%, less than 15%, less than 20%, etc.

尽管在本文中已经描述了本公开的某些实施例,但是本公开不限于此,因为本公开与本领域将允许的范围一样广泛,并且说明书可以同样地被阅读。因此,以上说明书不应被解释为限制性的。相反,以上说明书仅是作为特定实施例的选例。本领域的技术人员将在所附权利要求书的范围和精神内预想到其它的修改。Although certain embodiments of the disclosure have been described herein, the disclosure is not so limited because the disclosure is as broad as the art will allow and the specification is read as such. Accordingly, the above description should not be construed as limiting. Rather, the foregoing description is presented as a selection of specific embodiments only. Those skilled in the art will envision other modifications within the scope and spirit of the claims appended hereto.

Claims (20)

1.一种装配件,包括1. An assembly comprising 切割设备,其包括切割装置;Cutting equipment, which includes a cutting device; 可转动平台,其与所述切割设备相邻近;以及a rotatable platform adjacent to the cutting device; and 多个电路保护装置,其与所述可转动平台相耦合,其中所述切割装置能够朝向所述可转动平台偏置,以在形成于所述多个电路保护装置中的每个电路保护装置上面的涂层中形成开口。a plurality of circuit protection devices coupled to the rotatable platform, wherein the cutting device is biasable toward the rotatable platform to overly each circuit protection device formed in the plurality of circuit protection devices Openings are formed in the coating. 2.根据权利要求1所述的装配件,其中所述切割装置是冲压刀片,并且其中所述切割设备能够在垂直于由所述可转动平台的顶部表面定义的平面的方向上偏置。2. The assembly of claim 1, wherein the cutting means is a punch blade, and wherein the cutting device is biasable in a direction perpendicular to a plane defined by the top surface of the rotatable platform. 3.根据权利要求1所述的装配件,其中所述可转动平台和所述切割设备与支撑结构相耦合。3. The assembly of claim 1, wherein the rotatable platform and the cutting device are coupled to a support structure. 4.根据权利要求1所述的装配件,还包括多个基座模块,其中多个模块中的每个基座模块支撑所述多个电路保护装置中的对应的电路保护装置。4. The assembly of claim 1, further comprising a plurality of base modules, wherein each base module of the plurality of modules supports a corresponding circuit protection device of the plurality of circuit protection devices. 5.根据权利要求1所述的装配件,其中所述切割设备包括板,并且其中所述切割装置与所述板相耦合。5. The fitting of claim 1, wherein the cutting device comprises a plate, and wherein the cutting device is coupled to the plate. 6.根据权利要求5所述的装配件,还包括与所述板相耦合的一个或多个弹簧。6. The fitting of claim 5, further comprising one or more springs coupled to the plate. 7.根据权利要求5所述的装配件,其中所述切割装置包括柱和底座,其中所述柱包括自由端,其包括可操作以作用于所述电路保护装置的所述涂层的一个或多个边缘,并且其中所述底座与所述板相耦合。7. The assembly of claim 5, wherein said cutting device includes a post and a base, wherein said post includes a free end comprising one or both of said coatings operable to act on said circuit protection device. a plurality of edges, and wherein the base is coupled to the plate. 8.根据权利要求7所述的装配件,其中所述柱的所述自由端具有矩形剖面。8. The fitting of claim 7, wherein the free end of the post has a rectangular cross-section. 9.一种系统,包括:9. A system comprising: 切割设备,其包括切割装置;Cutting equipment, which includes a cutting device; 平台,其与所述切割设备相邻近;以及a platform adjacent to the cutting device; and 多个金属氧化物变阻器MOV,其与所述平台相耦合,其中所述切割装置能够朝向可转动平台偏置,以在提供于所述多个MOV中的每个MOV上面的涂层中形成开口,并且其中所述可转动平台相对于所述切割设备旋转。a plurality of metal oxide varistors MOVs coupled to the platform, wherein the cutting device is biasable toward the rotatable platform to form openings in the coating provided over each MOV of the plurality of MOVs , and wherein the rotatable platform rotates relative to the cutting device. 10.根据权利要求9所述的系统,其中所述切割装置是冲压刀片,并且其中所述切割设备能够在垂直于由所述平台的顶部表面定义的平面的方向上偏置。10. The system of claim 9, wherein the cutting device is a punch blade, and wherein the cutting device is biasable in a direction perpendicular to a plane defined by the top surface of the platform. 11.根据权利要求9所述的系统,其中所述平台和所述切割设备与支撑结构相耦合。11. The system of claim 9, wherein the platform and the cutting device are coupled to a support structure. 12.根据权利要求9所述的系统,还包括多个基座模块,其中多个模块中的每个基座模块支撑所述多个MOV中的对应的MOV。12. The system of claim 9, further comprising a plurality of base modules, wherein each base module of the plurality of modules supports a corresponding MOV of the plurality of MOVs. 13.根据权利要求9所述的系统,其中所述切割设备包括:13. The system of claim 9, wherein the cutting device comprises: 与所述切割装置相耦合的板;以及a plate coupled to the cutting device; and 与所述板相耦合的一个或多个弹簧。One or more springs coupled to the plate. 14.根据权利要求9所述的系统,其中所述切割装置包括柱和底座,其中所述柱包括自由端,其包括可操作以作用于所述MOV的所述涂层的一个或多个边缘。14. The system of claim 9, wherein the cutting device includes a post and a base, wherein the post includes a free end including one or more edges operable to act on the coating of the MOV . 15.根据权利要求14所述的系统,其中所述柱的所述自由端具有矩形剖面。15. The system of claim 14, wherein the free end of the post has a rectangular cross-section. 16.一种方法,包括:16. A method comprising: 提供切割设备,所述切割设备包括切割装置;providing cutting equipment, said cutting equipment comprising a cutting device; 将平台安装在所述切割设备的附近,其中多个金属氧化物变阻器MOV与所述平台相耦合;以及mounting a platform adjacent to the cutting device, wherein a plurality of metal oxide varistors MOVs are coupled to the platform; and 将所述平台旋转,并且使所述切割装置朝向所述平台偏置以作用于所述多个MOV中的每个MOV上面的涂层。The stage is rotated and the cutting device is biased toward the stage to act on the coating on each MOV of the plurality of MOVs. 17.根据权利要求16所述的方法,还包括在所述多个MOV中的每个MOV上面的所述涂层中形成开口。17. The method of claim 16, further comprising forming openings in the coating over each MOV of the plurality of MOVs. 18.根据权利要求17所述的方法,还包括在所述多个MOV中的每个MOV上面的所述涂层中形成所述开口之前,将所述多个MOV加热。18. The method of claim 17, further comprising heating the plurality of MOVs prior to forming the openings in the coating over each of the plurality of MOVs. 19.根据权利要求16所述的方法,还包括将所述平台和所述切割设备耦合到支撑结构。19. The method of claim 16, further comprising coupling the platform and the cutting device to a support structure. 20.根据权利要求16所述的方法,还包括使所述切割装置在垂直于由所述平台的顶部表面定义的平面的方向上偏置。20. The method of claim 16, further comprising biasing the cutting device in a direction perpendicular to a plane defined by the top surface of the platform.
CN202110808647.7A 2021-07-16 2021-07-16 Apparatus and method for creating an opening through a metal oxide varistor coating Pending CN115620975A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110808647.7A CN115620975A (en) 2021-07-16 2021-07-16 Apparatus and method for creating an opening through a metal oxide varistor coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110808647.7A CN115620975A (en) 2021-07-16 2021-07-16 Apparatus and method for creating an opening through a metal oxide varistor coating

Publications (1)

Publication Number Publication Date
CN115620975A true CN115620975A (en) 2023-01-17

Family

ID=84856013

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110808647.7A Pending CN115620975A (en) 2021-07-16 2021-07-16 Apparatus and method for creating an opening through a metal oxide varistor coating

Country Status (1)

Country Link
CN (1) CN115620975A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4825555A (en) * 1986-10-31 1989-05-02 Dainippon Screen Mfg. Co., Ltd. Apparatus for automatic forming on a film material of both a mask film pattern and a positioning hole
US20100269650A1 (en) * 2007-12-21 2010-10-28 Yoshitami Hojo Dicing apparatus and dicing method
CN108098161A (en) * 2018-01-09 2018-06-01 苏州辰晟优机电科技有限公司 A kind of multifunction laser Cutting platform
US20180154602A1 (en) * 2016-12-01 2018-06-07 The C.W. Zumbiel Company 3D Printed Paperboard Creasing/Cutting Rule
KR20190113250A (en) * 2018-03-28 2019-10-08 (유)엠아이알 Smart material cutting apparatus
CN209850132U (en) * 2019-03-12 2019-12-27 雒建顺 Cutting device for machining

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4825555A (en) * 1986-10-31 1989-05-02 Dainippon Screen Mfg. Co., Ltd. Apparatus for automatic forming on a film material of both a mask film pattern and a positioning hole
US20100269650A1 (en) * 2007-12-21 2010-10-28 Yoshitami Hojo Dicing apparatus and dicing method
US20180154602A1 (en) * 2016-12-01 2018-06-07 The C.W. Zumbiel Company 3D Printed Paperboard Creasing/Cutting Rule
CN108098161A (en) * 2018-01-09 2018-06-01 苏州辰晟优机电科技有限公司 A kind of multifunction laser Cutting platform
KR20190113250A (en) * 2018-03-28 2019-10-08 (유)엠아이알 Smart material cutting apparatus
CN209850132U (en) * 2019-03-12 2019-12-27 雒建顺 Cutting device for machining

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Ю.Л.ПОЛЯКОВ: "合金材料的板材冲压(1)", 模具技术, 31 December 1989 (1989-12-31), pages 119 - 127 *

Similar Documents

Publication Publication Date Title
EP3493255B1 (en) Seal ring structure, semiconductor die, and method for detecting cracks on semiconductor die
CN113348600B (en) Cable preparation device
CN105336685A (en) Wafer cutting method possessing test pattern
CN105633060B (en) Integrated circuit device and electrostatic protection device thereof
CN115620975A (en) Apparatus and method for creating an opening through a metal oxide varistor coating
CN113097086B (en) Preparation method of to-be-failed analysis sample and to-be-failed analysis sample
CN101752348B (en) Electrostatic discharge protection device and its protection method
AU2004200337B2 (en) Active part of a surge arrester
US10790276B2 (en) Methods, apparatus, and system for metal-oxide-semiconductor field-effect transistor (MOSFET) with electrostatic discharge (ESD) protection
CN206420915U (en) Test of lightning arrester specific purpose tool
EP2308088A1 (en) Improved meander resistor
CN104237769B (en) The reliability test system of millimeter-wave monolithic circuit chip and method of testing thereof
CN104416247A (en) Coaxial groove machining electrode for connector and manufacturing method of machining electrode
TW200820413A (en) ESD protection apparatus and method for forming an ESD protection circuit
Desnica et al. Comparative characteristics of thick-film integrated LC filters
CN211479792U (en) Protective device
CN203562426U (en) Laser-trimmed integrated chip structure
CN114023723B (en) High-voltage device testing structure and defect detection method
CN105931961A (en) Low temperature fabrication of lateral thin film varistor
CN101819940B (en) Method and structure for testing wafer
TWI739278B (en) Method, apparatus, and system for improving scaling of isolation structures for gate, source, and/or drain contacts
TW413953B (en) Semiconductor resistor device capable of bearing high voltage
CN222939713U (en) Metal Oxide Varistors
CN214622937U (en) WLCSP packaging test probe card
CN221125640U (en) Plug with piezoresistor

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination