CN115637127B - Build-up adhesive film for FC-BGA packaging loading board with low dielectric loss and preparation method and application thereof - Google Patents
Build-up adhesive film for FC-BGA packaging loading board with low dielectric loss and preparation method and application thereof Download PDFInfo
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Abstract
The invention discloses a low-dielectric-loss build-up adhesive film for an FC-BGA packaging loading plate, and a preparation method and application thereof, wherein the low-dielectric-loss build-up adhesive film for the FC-BGA packaging loading plate is prepared from the following raw materials in parts by weight: 45-60 parts of epoxy resin, 40-100 parts of inorganic filler, 5-10 parts of acrylic resin, 5-10 parts of phenoxy resin, 35-60 parts of phosphorus cyanate and 40-50 parts of boron-containing phenolic resin. According to the invention, the cyanate ester and the phenolic resin containing boron are introduced into the raw materials of the laminated adhesive film, and the interaction between the cyanate ester and the phenolic resin containing boron forms a triazine ring structure with extremely high crosslinking density, so that the dielectric property of the laminated adhesive film is improved. The phosphorus-containing cyanate and the boron-containing phenolic resin are introduced into the raw materials of the laminated adhesive film, and the three elements of phosphorus, nitrogen and boron in the raw material system of the laminated adhesive film are synergistic to improve the flame retardant property and the high temperature resistance of the laminated adhesive film.
Description
Technical Field
The invention relates to the field of resin materials, in particular to a build-up adhesive film for a FC-BGA packaging loading board with low dielectric loss, and a preparation method and application thereof.
Background
The IC package substrate functions as a semiconductor package: firstly, the chip is in electrical connection (transition) with a conventional printed circuit board (a main board, a mother board and a back board); secondly, provide protection and support for the chip, form the passageway of heat dissipation to make the package reach and accord with standard installation size. The flip chip ball grid array (FC-BGA) substrate is a high-density packaging carrier board capable of realizing high speed and multifunction of chips, and the build-up adhesive film is one of key core materials of SAP (super absorbent polymer) in the manufacturing process of the FC-BGA carrier board.
The existing build-up adhesive film material has insufficient dielectric property, is easy to form RC delay effect, further causes adverse effects such as signal transmission delay power loss and the like, and seriously influences the application of the build-up adhesive film material in a high-end semiconductor package carrier; meanwhile, the flame retardant property of the laminated adhesive film is poor, so that the application reliability of the laminated adhesive film is reduced, and the laminated adhesive film is also a problem to be solved urgently.
Accordingly, the prior art is still in need of improvement and development.
Disclosure of Invention
In view of the shortcomings of the prior art, the invention aims to provide a low dielectric loss build-up adhesive film for an FC-BGA packaging loading board, a preparation method and application thereof, and aims to solve the problem that the conventional build-up adhesive film is poor in dielectric property and flame retardant property.
The technical scheme of the invention is as follows:
the invention provides a build-up adhesive film for a low dielectric loss FC-BGA packaging loading plate, which is prepared from the following raw materials in parts by weight:
45-60 parts of epoxy resin, 40-100 parts of inorganic filler, 5-10 parts of acrylic resin, 5-10 parts of phenoxy resin, 35-60 parts of phosphorus cyanate and 40-50 parts of boron-containing phenolic resin.
Optionally, the phosphorus-containing cyanate is at least one of phosphorus-containing cyanate I, phosphorus-containing cyanate II, phosphorus-containing cyanate III and phosphorus-containing cyanate IV;
wherein, structural formula of the cyanate I containing phosphorus is:
the structural formula of the phosphorus-containing cyanate II is as follows:
the structural formula of the phosphorus-containing cyanate III is as follows:
the structural formula of the phosphorus-containing cyanate IV is as follows:
optionally, the boron-containing phenolic resin is selected from at least one of boron-containing phenolic resin I, boron-containing phenolic resin II, boron-containing phenolic resin III and boron-containing phenolic resin IV;
wherein, structural formula of the boron-containing phenolic resin I is:
the structural formula of the boron-containing phenolic resin II is as follows:
the structural formula of the boron-containing phenolic resin III is as follows:
the structural formula of the boron-containing phenolic resin IV is as follows:
optionally, the inorganic filler is selected from at least one of silica, alumina, glass, cordierite, barium sulfate, barium carbonate, talc, clay, mica, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate, calcium zirconate, zirconium phosphate.
Optionally, the raw materials of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss further comprise, in parts by weight: 10 to 25 parts of maleimide containing 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide groups.
Optionally, the maleimide containing the 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide group is at least one of bismaleimide I, bismaleimide II, bismaleimide III and bismaleimide IV;
wherein, structural formula of bismaleimide I is:
the structural formula of the bismaleimide II is as follows:
the structural formula of the bismaleimide III is as follows:
the structural formula of the bismaleimide IV is as follows:
optionally, the raw material of the build-up adhesive film for the FC-BGA packaging loading plate with low dielectric loss also comprises 10-20 parts of benzoxazine containing cage polysilsesquioxane in parts by weight.
Optionally, the benzoxazine containing the cage polysilsesquioxane has the structural formula:
wherein R has one of the following structures:
wherein "- - -" represents a ligation site.
In a second aspect, the present invention provides a method for preparing a build-up adhesive film for a low dielectric loss FC-BGA package carrier board according to the present invention, comprising the steps of:
providing a substrate;
mixing the raw materials of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss with an organic solvent to obtain slurry;
and transferring the slurry to the base material, and drying to obtain the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss.
Optionally, the drying temperature is 80-130 ℃, and the drying time is 3-10 min.
In a third aspect, the present invention provides a use of the build-up adhesive film for a low dielectric loss FC-BGA package carrier of the present invention as described above in flip chip ball grid array package carrier.
The beneficial effects are that: according to the invention, the phosphazene and the boron-containing phenolic resin are introduced into the raw materials of the build-up adhesive film for the FC-BGA packaging loading plate with low dielectric loss, and the phosphazene and the boron-containing phenolic resin interact to form a triazine ring structure with extremely high crosslinking density, and the polar atoms are symmetrically distributed around the C atoms in the triazine ring structure, so that the dipole polarization phenomenon is avoided to a great extent, the build-up adhesive film has extremely low dielectric constant and dielectric loss tangent, and the dielectric property of the build-up adhesive film is improved. The phosphorus-containing cyanate and the boron-containing phenolic resin are introduced into the raw materials of the laminated adhesive film, and the three elements of phosphorus, nitrogen and boron in the raw material system of the laminated adhesive film are synergistic to improve the flame retardant property and the high temperature resistance of the laminated adhesive film. Specifically, when the phosphorus-containing cyanate is combusted, the phosphorus group can generate phosphine hetero-phenanthrene groups in a gas phase, so that free radicals of gas phase pyrolysis gas can be captured, a stable structure is formed, and the free radical quenching effect is exerted; meanwhile, the nitrogen-containing structure in the phosphorus-containing cyanate can obtain a hindered amine structure with quenching effect, so that nonflammable gas is formed, the gas-phase dilution effect is exerted, the two can be mutually cooperated in gas phase, the flame-retardant effect is enhanced, and the flame-retardant efficiency and the high temperature resistance of the laminated adhesive film are effectively improved. The boron-containing phenolic resin has excellent heat resistance and ablation resistance by introducing boron element into the molecular structure of the phenolic resin, and the bond energy of B-O is 774.04kJ/mol and the bond energy of C-C is 334.72kJ/mol, so that the flame retardant property of the build-up adhesive film is effectively improved. Boron element is heated and decomposed to produce boric anhydride or boric acid to form glassy melt which is covered on the surface of the build-up adhesive film, so that the propagation of oxygen and heat is isolated, and the generation of dense smoke and molten drops can be inhibited. Therefore, the flame retardant property and the high temperature resistance of the laminated adhesive film are improved through the synergistic effect of phosphorus, nitrogen and boron elements in the raw material system of the laminated adhesive film.
Detailed Description
The invention provides a build-up adhesive film for a low dielectric loss FC-BGA packaging loading board, a preparation method and application thereof, and the invention is further described in detail below in order to make the purposes, technical schemes and effects of the invention clearer and more definite. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The embodiment of the invention provides a low-dielectric-loss build-up adhesive film for an FC-BGA packaging loading plate, which is prepared from the following raw materials in parts by weight:
45-60 parts of epoxy resin, 40-100 parts of inorganic filler, 5-10 parts of acrylic resin, 5-10 parts of phenoxy resin, 35-60 parts of phosphorus cyanate and 40-50 parts of boron-containing phenolic resin.
According to the embodiment of the invention, the phosphazene and the boron-containing phenolic resin are introduced into the raw materials of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss, and the phosphazene and the boron-containing phenolic resin interact to form the triazine ring structure with extremely high crosslinking density, and the polar atoms are symmetrically distributed around the C atoms in the triazine ring structure, so that the dipole polarization phenomenon is avoided to a large extent, the build-up adhesive film has extremely low dielectric constant and dielectric loss tangent, and the dielectric property of the build-up adhesive film is improved. The phosphorus-containing cyanate and the boron-containing phenolic resin are introduced into the raw materials of the laminated adhesive film, and the three elements of phosphorus, nitrogen and boron in the raw material system of the laminated adhesive film are synergistic to improve the flame retardant property and the high temperature resistance of the laminated adhesive film. Specifically, when the phosphorus-containing cyanate is combusted, the phosphorus group can generate phosphine phenanthrene groups in a gas phase, and can capture free radicals of gas phase pyrolysis gas to form a stable structure, thereby playing a role in quenching the free radicals and stopping the chain reaction of combustion; meanwhile, the nitrogen-containing structure in the phosphorus-containing cyanate can obtain a hindered amine structure with quenching effect, so that nonflammable gas is formed, the gas-phase dilution effect is exerted, the two can be mutually cooperated in gas phase, the flame-retardant effect is enhanced, and the flame-retardant efficiency and the high temperature resistance of the laminated adhesive film are effectively improved. The boron-containing phenolic resin has excellent heat resistance and ablation resistance by introducing boron element into the molecular structure of the phenolic resin, and the bond energy of B-O is 774.04kJ/mol and the bond energy of C-C is 334.72kJ/mol, so that the flame retardant property of the build-up adhesive film is effectively improved. Boron element is heated and decomposed to produce boric anhydride or boric acid to form glassy melt which is covered on the surface of the build-up adhesive film, so that the propagation of oxygen and heat is isolated, and the generation of dense smoke and molten drops can be inhibited. Therefore, the synergistic effect of phosphorus, nitrogen and boron elements (namely the synergistic effect of the phosphorus-containing cyanate and the boron-containing phenolic resin) in the raw material system of the laminated adhesive film realizes synchronous free radical quenching flame retardance, gas phase flame retardance and condensed phase flame retardance, and simultaneously prevents a plurality of factors of high polymer material combustion, thereby improving the flame retardance and high temperature resistance of the laminated adhesive film.
In one embodiment, the phosphorus-containing cyanate is selected from at least one of phosphorus-containing cyanate I, phosphorus-containing cyanate II, phosphorus-containing cyanate III, phosphorus-containing cyanate IV;
wherein, structural formula of the cyanate I containing phosphorus is:
the structural formula of the phosphorus-containing cyanate II is as follows:
the structural formula of the phosphorus-containing cyanate III is as follows:
the structural formula of the phosphorus-containing cyanate IV is as follows:
when the phosphazene with the structure is combusted, the phosphazene group can be generated in the gas phase by the phosphorus group (related to phosphorus element), so that free radicals of gas phase pyrolysis gas can be captured, a stable structure is formed, and the free radical quenching effect is exerted; meanwhile, the nitrogen-containing structure (related to nitrogen element) in the phosphorus-containing cyanate can obtain a hindered amine structure with quenching effect, so that nonflammable gas is formed, the gas-phase dilution effect is exerted, the two can cooperate with each other in gas phase, the flame-retardant effect is enhanced, and the flame-retardant efficiency and the high temperature resistance of the laminated adhesive film are effectively improved.
In one embodiment, the boron-containing phenolic resin is at least one selected from the group consisting of boron-containing bisphenol a type phenolic resin, boron-containing phenol type phenolic resin, boron-containing biphenyl type phenolic resin, and boron-containing dicyclopentadiene type phenolic resin, but is not limited thereto.
In one embodiment, the boron-containing phenolic resin is selected from at least one of boron-containing phenolic resin I, boron-containing phenolic resin II, boron-containing phenolic resin III, boron-containing phenolic resin IV;
wherein, structural formula of the boron-containing phenolic resin I is:
the structural formula of the boron-containing phenolic resin II is as follows:
the structural formula of the boron-containing phenolic resin III is as follows:
the structural formula of the boron-containing phenolic resin IV is as follows:
the boron-containing phenolic resin with the structure has excellent heat resistance and ablation resistance by introducing boron element into the molecular structure of the phenolic resin, and the bond energy of B-O is 774.04kJ/mol and the bond energy of C-C is 334.72kJ/mol, so that the flame retardant property of the build-up adhesive film is effectively improved. Further, boron element is heated and decomposed to generate boric anhydride or boric acid to form glassy melt which is covered on the surface of the laminated adhesive film, so that the propagation of oxygen and heat is isolated, the generation of dense smoke and molten drops can be inhibited, and the flame retardant property of the laminated adhesive film is improved. And the boron-containing phenolic resin and the phosphorus-containing cyanate ester interact to form a triazine ring structure with extremely high crosslinking density, and the polar atoms are symmetrically distributed around the C atoms, so that the dipole polarization phenomenon is avoided to a large extent, and the cured laminated adhesive film has good dielectric property.
The embodiment of the present invention is not limited to a specific type of epoxy resin, and the epoxy resin may be, for example, a biphenyl type epoxy resin, a phenol type epoxy resin (e.g., bisphenol type epoxy resin, etc.), a naphthol type epoxy resin, a novolac type epoxy resin, a dicyclopentadiene type epoxy resin, or an aralkyl type novolac epoxy resin (e.g., aralkyl biphenyl type novolac epoxy resin, aralkyl naphthol type novolac epoxy resin, etc.), but is not limited thereto.
In one embodiment, the inorganic filler is at least one selected from silica, alumina, glass, cordierite, barium sulfate, barium carbonate, talc, clay, mica, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate, calcium zirconate, zirconium phosphate, but not limited thereto.
Ext> inext> oneext> embodimentext>,ext> theext> acrylicext> resinext> isext> selectedext> fromext> atext> leastext> oneext> ofext> XXext> -ext> 5598ext> Zext> (ext> Japaneseext> waterext> -ext> loggingext> endext> productext> industryext>)ext>,ext> DOGext> -ext> Aext> (ext> Japaneseext> Newext> Yongcunext> chemicalext>)ext>,ext> DCPext> (ext> Japaneseext> Newext> Yongcunext> chemicalext>)ext>,ext> KGext> -ext> 3000ext> (ext> Japaneseext> Utilityext> industryext>)ext>,ext> MEext> -ext> 2000ext> (ext> Japaneseext> Utilityext> industryext>)ext>.ext>
In one embodiment, the phenoxy resin is at least one selected from FX280 (new japanese iron), FX293 (new japanese iron), YX8100 (mitsubishi chemical japan), YX7553BH30 (mitsubishi chemical japan), TER240C30 (guangdong homogyu).
In one embodiment, the raw materials of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss further comprise, in parts by weight: 10 to 25 parts of maleimide containing 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) groups. In the bismaleimide containing DOPO, the DOPO structure contains P element, the bismaleimide contains N element, and the P and N can play a synergistic flame retardant role in gas-solid two phases, so that the laminated adhesive film is endowed with excellent flame retardant property; in addition, DOPO molar volume is larger, and the large-volume functional groups can limit the movement of a high molecular chain segment and reduce the polarization degree, so that the dielectric constant and dielectric loss of the laminated adhesive film are effectively reduced.
In one embodiment, the maleimide containing a 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide group is selected from at least one of bismaleimide i, bismaleimide ii, bismaleimide iii, bismaleimide iv;
wherein, structural formula of bismaleimide I is:
the structural formula of the bismaleimide II is as follows:
the structural formula of the bismaleimide III is as follows:
the structural formula of the bismaleimide IV is as follows:
in one embodiment, the raw material of the build-up adhesive film for the FC-BGA packaging loading plate with low dielectric loss further comprises 10-20 parts by weight of benzoxazine containing cage Polysilsesquioxane (POSS). Silicon carbide is generated when a silicon-containing structure part in a POSS structure in the POSS-containing benzoxazine burns, and the silicon carbide isolation layer can prevent volatile substances generated by material burning from escaping, isolate oxygen from contacting with resin and prevent melt from dripping, so that the aim of flame retardance is fulfilled; in addition, the benzoxazine containing POSS has a plurality of micro-nano holes, the micro-nano holes contain air with extremely low dielectric constant, and the introduction of the micro-nano holes reduces the density of polarized molecules, so that the introduction of the micro-nano hole structure can reduce the dielectric constant of the build-up adhesive film. The addition of the benzoxazine containing POSS can further improve the flame retardance of the laminated adhesive film and reduce the dielectric constant of the laminated adhesive film.
In further embodiments, the POSS-containing benzoxazine is selected from one or more of POSS-containing benzoxazine i, POSS-containing benzoxazine ii, POSS-containing benzoxazine iii, POSS-containing benzoxazine iv, POSS-containing benzoxazine v;
wherein, the structural formula of the benzoxazine I containing POSS is:
wherein, the structural formula of R is:
the structural formula of the benzoxazine II containing POSS is as follows:wherein, the structural formula of R is:
the structural formula of the benzoxazine III containing POSS is as follows:wherein, the structural formula of R is:
the structural formula of the benzoxazine IV containing POSS is as follows:wherein, the structural formula of R is:
the structural formula of the benzoxazine V containing POSS is:wherein, the structural formula of R is:wherein "- - -" represents a ligation site.
In one embodiment, the raw materials of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss further comprise 0.1-1 part of a curing accelerator in parts by weight.
In one embodiment, the curing accelerator is selected from at least one of 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4, 5-dimethylol imidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, 4-dimethylaminopyridine in parts by weight.
In one embodiment, the raw materials of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss also comprise 3-9 parts of other auxiliary agents in parts by weight.
In one embodiment, the other auxiliary agent is at least one selected from the group consisting of a thickener, an antifoaming agent, a leveling agent, an adhesion imparting agent, and a colorant. These auxiliaries may be selected according to actual needs.
In one embodiment, the raw materials of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss further comprise 200-300 parts of organic solvent in parts by weight.
In one embodiment, the organic solvent is selected from at least one of toluene, xylene, butanone, methyl ethyl ketone, cyclohexanone, ethyl acetate, N-dimethylformamide.
In one embodiment, the thickness of the build-up adhesive film for FC-BGA package carrier plate with low dielectric loss is 10-100 μm.
The embodiment of the invention also provides a preparation method of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss, which comprises the following steps:
s1, providing a substrate;
s2, mixing the raw materials of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss, which is disclosed by the embodiment of the invention, with an organic solvent to obtain slurry;
s3, transferring the slurry to the base material, and drying to obtain the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss.
In step S1, in one embodiment, the thickness of the substrate is 10 to 150 μm. For example, it may be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm or 150 μm, etc.
In one embodiment, the substrate has a thickness of 25 to 50 μm.
The choice of substrate in the embodiments of the present invention is not particularly limited, and substrates commonly used in the art may be used, and exemplary substrates include, but are not limited to: PET release film, polyethylene film, polypropylene film or polyvinyl chloride film. Meanwhile, in order to facilitate the subsequent removal of the base material, the polyethylene film, the polypropylene film or the polyvinyl chloride film can be subjected to corona treatment in advance before use.
In step S2, in one embodiment, 45 to 60 parts of epoxy resin, 40 to 100 parts of inorganic filler, 5 to 10 parts of acrylic resin, 5 to 10 parts of phenoxy resin, 35 to 60 parts of phosphorus cyanate ester, 40 to 50 parts of boron-containing phenolic resin and 200 to 300 parts of organic solvent are mixed to obtain a slurry.
In one embodiment, 45 to 60 parts of epoxy resin, 40 to 100 parts of inorganic filler, 5 to 10 parts of acrylic resin, 5 to 10 parts of phenoxy resin, 35 to 60 parts of phosphorus cyanate, 40 to 50 parts of boron-containing phenolic resin, 10 to 25 parts of maleimide containing 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) groups, 10 to 20 parts of benzoxazine containing cage-type Polysilsesquioxane (POSS), 0.1 to 1 part of curing accelerator, 3 to 9 parts of other auxiliary agents and 200 to 300 parts of organic solvent are mixed to obtain slurry.
In one embodiment, the organic solvent is selected from at least one of toluene, xylene, butanone, methyl ethyl ketone, cyclohexanone, ethyl acetate, N-dimethylformamide.
In step S3, in one embodiment, the drying temperature is 80 to 130 ℃. For example, it may be 80 ℃, 85 ℃, 90 ℃, 95 ℃, 100 ℃, 105 ℃, 110 ℃, 115 ℃, 120 ℃, 125 ℃, 130 ℃, or the like.
In one embodiment, the drying time is 3 to 10 minutes. For example, it may be 3min, 4min, 5min, 6min, 7min, 8min, 9min or 10min, etc.
In one embodiment, the drying further comprises a post-treatment step, wherein the post-treatment method is to remove the substrate.
The embodiment of the invention also provides application of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss in the flip chip ball grid array packaging loading board. The flip chip ball grid array package loading board provided by the embodiment of the invention can improve the use safety and reliability of products.
The following is a detailed description of specific examples.
Some sources of raw materials in the following examples and comparative examples are as follows:
epoxy resin: biphenyl type epoxy resin (NC-3000-L of japan chemical), phenol type epoxy resin (WHR-991S of japan chemical), liquid bisphenol a type epoxy resin (jER 828EL of mitsubishi chemical), novolac type epoxy resin (KEP-1138 of korea KOLON);
inorganic filler: SOC2 and SOC4 of japan elegance Dou Ma;
acrylic resin: ext> XXext> -ext> 5598ext> Zext> ofext> theext> finishedext> productext> ofext> Japaneseext> waterext> accumulationext> industryext>,ext> DOGext> -ext> Aext> ofext> theext> Newext> Zhongcunext> chemicalext> ofext> Japanext>;ext>
Phenoxy resin: YX7553BH30 and YX8100 of mitsubishi chemistry of japan;
cyanate ester: BA230S75 and PT30 from Lonza Japan, CE01PS from Tian Zhou;
phenolic resin: dicyclopentadiene type phenol resin (PD 9110 of taiwan vinpoch of china);
benzoxazines (JBZ-OD 100 of JFE chemistry);
maleimide (BMI-689 of Designer Molecules, MIR-3000-70MT of Japanese chemical).
Example 1
The embodiment provides a low dielectric loss build-up adhesive film for an FC-BGA packaging loading plate, which comprises the following raw materials in parts by weight:
30 parts of biphenyl type epoxy resin (NC-3000-L), 5 parts of phenol type epoxy resin (WHR-991S), 10 parts of liquid bisphenol A type epoxy resin (jER 828 EL), 100 parts of silicon dioxide (SOC 2), 10 parts of acrylic resin (XX-5598Z), 5 parts of phenoxy resin (YX 7553BH 30), 35 parts of phosphorus-containing cyanate ester I, 50 parts of boron-containing phenolic resin III, 10 parts of bismaleimide III, 10 parts of benzoxazine (JBZ-OD 100), 0.1 part of 4-Dimethylaminopyridine (DMAP) and 300 parts of cyclohexanone.
The preparation method of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss comprises the following steps:
and uniformly mixing the raw material components and the proportion of the low dielectric loss build-up adhesive film for the FC-BGA packaging carrier plate, coating the mixture on a PET release film, drying the mixture at 80 ℃ for 10min, and removing the PET release film to obtain the low dielectric loss build-up adhesive film for the FC-BGA packaging carrier plate, wherein the thickness of the build-up adhesive film is 100 mu m.
Example 2
The embodiment provides a low dielectric loss build-up adhesive film for an FC-BGA packaging loading plate, which comprises the following raw materials in parts by weight:
30 parts of biphenyl type epoxy resin (NC-3000-L), 5 parts of phenol type epoxy resin (WHR-991S), 10 parts of liquid bisphenol A type epoxy resin (jER 828 EL), 100 parts of silicon dioxide (SOC 2), 10 parts of acrylic resin (XX-5598Z), 5 parts of phenoxy resin (YX 7553BH 30), 35 parts of phosphorus-containing cyanate ester I, 50 parts of boron-containing phenolic resin III, 10 parts of maleimide (BMI-689), 10 parts of benzoxazine I containing POSS, 0.1 part of 4-Dimethylaminopyridine (DMAP) and 300 parts of cyclohexanone.
The preparation method of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss comprises the following steps:
and uniformly mixing the raw material components of the low-dielectric-loss build-up adhesive film for the FC-BGA packaging carrier plate, coating the mixture on a PET release film, drying the mixture at 130 ℃ for 3min, and removing the PET release film to obtain the low-dielectric-loss build-up adhesive film for the FC-BGA packaging carrier plate, wherein the thickness of the build-up adhesive film is 10 mu m.
Example 3
The embodiment provides a low dielectric loss build-up adhesive film for an FC-BGA packaging loading plate, which comprises the following raw materials in parts by weight:
30 parts of biphenyl type epoxy resin (NC-3000-L), 5 parts of phenol type epoxy resin (WHR-991S), 10 parts of liquid bisphenol A type epoxy resin (jER 828 EL), 100 parts of silicon dioxide (SOC 2), 10 parts of acrylic resin (XX-5598Z), 5 parts of phenoxy resin (YX 7553BH 30), 35 parts of phosphorus-containing cyanate ester I, 50 parts of boron-containing phenolic resin III, 10 parts of bismaleimide III, 10 parts of benzoxazine I containing POSS, 0.1 part of 4-Dimethylaminopyridine (DMAP) and 300 parts of cyclohexanone.
The preparation method of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss comprises the following steps:
and uniformly mixing the raw material components of the low-dielectric-loss build-up adhesive film for the FC-BGA packaging carrier plate, coating the mixture on a PET release film, drying the mixture at 110 ℃ for 5min, and removing the PET release film to obtain the low-dielectric-loss build-up adhesive film for the FC-BGA packaging carrier plate, wherein the thickness of the build-up adhesive film is 40 mu m.
Example 4
The embodiment provides a low dielectric loss build-up adhesive film for an FC-BGA packaging loading plate, which comprises the following raw materials in parts by weight:
ext> 60ext> partsext> ofext> novolacext> epoxyext> resinext> (ext> KEPext> -ext> 1138ext>)ext>,ext> 40ext> partsext> ofext> siliconext> dioxideext> (ext> SOCext> 4ext>)ext>,ext> 5ext> partsext> ofext> acrylicext> resinext> (ext> DOGext> -ext> Aext>)ext>,ext> 10ext> partsext> ofext> phenoxyext> resinext> (ext> YXext> 8100ext>)ext>,ext> 60ext> partsext> ofext> phosphorusext> cyanateext> IIIext>,ext> 40ext> partsext> ofext> boronext> -ext> containingext> phenolicext> resinext> Iext>,ext> 25ext> partsext> ofext> bismaleimideext> Iext>,ext> 20ext> partsext> ofext> benzoxazineext> (ext> JBZext> -ext> ODext> 100ext>)ext>,ext> 1ext> partext> ofext> 4ext> -ext> dimethylaminopyridineext> (ext> DMAPext>)ext> andext> 200ext> partsext> ofext> butanoneext>.ext>
The preparation method of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss comprises the following steps:
and uniformly mixing the raw material components of the low-dielectric-loss build-up adhesive film for the FC-BGA packaging carrier plate, coating the mixture on a PET release film, drying the mixture at 80 ℃ for 10min, and removing the PET release film to obtain the low-dielectric-loss build-up adhesive film for the FC-BGA packaging carrier plate, wherein the thickness of the build-up adhesive film is 40 mu m.
Example 5
The embodiment provides a low dielectric loss build-up adhesive film for an FC-BGA packaging loading plate, which comprises the following raw materials in parts by weight:
ext> 60ext> partsext> ofext> novolacext> epoxyext> resinext> (ext> KEPext> -ext> 1138ext>)ext>,ext> 40ext> partsext> ofext> siliconext> dioxideext> (ext> SOCext> 4ext>)ext>,ext> 5ext> partsext> ofext> acrylicext> resinext> (ext> DOGext> -ext> Aext>)ext>,ext> 10ext> partsext> ofext> phenoxyext> resinext> (ext> YXext> 8100ext>)ext>,ext> 60ext> partsext> ofext> phosphorusext> cyanateext> IIIext>,ext> 40ext> partsext> ofext> boronext> -ext> containingext> phenolicext> resinext> Iext>,ext> 25ext> partsext> ofext> maleimideext> (ext> MIRext> -ext> 3000ext> -ext> 70ext> MText>)ext>,ext> 20ext> partsext> ofext> POSSext> -ext> containingext> benzoxazineext> IIIext>,ext> 1ext> partext> ofext> 4ext> -ext> dimethylaminopyridineext> (ext> DMAPext>)ext> andext> 200ext> partsext> ofext> butanoneext>.ext>
The preparation method of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss comprises the following steps:
and uniformly mixing the raw material components of the low-dielectric-loss build-up adhesive film for the FC-BGA packaging carrier plate, coating the mixture on a PET release film, drying the mixture at 130 ℃ for 3min, and removing the PET release film to obtain the low-dielectric-loss build-up adhesive film for the FC-BGA packaging carrier plate, wherein the thickness of the build-up adhesive film is 40 mu m.
Example 6
The embodiment provides a low dielectric loss build-up adhesive film for an FC-BGA packaging loading plate, which comprises the following raw materials in parts by weight:
ext> 60ext> partsext> ofext> novolacext> epoxyext> resinext> (ext> KEPext> -ext> 1138ext>)ext>,ext> 40ext> partsext> ofext> siliconext> dioxideext> (ext> SOCext> 4ext>)ext>,ext> 5ext> partsext> ofext> acrylicext> resinext> (ext> DOGext> -ext> Aext>)ext>,ext> 10ext> partsext> ofext> phenoxyext> resinext> (ext> YXext> 8100ext>)ext>,ext> 60ext> partsext> ofext> phosphorusext> cyanateext> IIIext>,ext> 40ext> partsext> ofext> boronext> -ext> containingext> phenolicext> resinext> Iext>,ext> 25ext> partsext> ofext> bismaleimideext> Iext>,ext> 20ext> partsext> ofext> POSSext> -ext> containingext> benzoxazineext> IIIext>,ext> 1ext> partext> ofext> 4ext> -ext> dimethylaminopyridineext> (ext> DMAPext>)ext> andext> 200ext> partsext> ofext> butanoneext>.ext>
The preparation method of the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss comprises the following steps:
the raw material components of the low-dielectric-loss build-up adhesive film for the FC-BGA packaging carrier plate with low dielectric loss are uniformly mixed and coated on a PET release film, and after the PET release film is dried for 3min at 120 ℃, the PET release film is removed, and the build-up adhesive film with low dielectric loss for the FC-BGA packaging carrier plate with the thickness of 40 mu m is obtained.
Comparative example 1
This comparative example provides a laminated adhesive film and a method for preparing the same, which are different from example 1 only in that,
the procedure of example 1 was repeated except that 35 parts of phosphorus-containing cyanate ester I was replaced with 30 parts of cyanate ester (BA 230S 75) and 5 parts of cyanate ester (PT 30), 50 parts of boron-containing phenolic resin III was replaced with 40 parts of dicyclopentadiene-type phenolic resin (PD 9110), and 10 parts of bismaleimide III was replaced with 10 parts of maleimide (BMI-689).
Comparative example 2
This comparative example provides a laminated adhesive film and a method for producing the same, which are different from example 4 only in that 60 parts of phosphorus-containing cyanate ester III are replaced with 60 parts of cyanate ester (CE 01 PS), 40 parts of boron-containing phenolic resin I are replaced with 40 parts of dicyclopentadiene type phenolic resin (PD 9110), 25 parts of bismaleimide I are replaced with 25 parts of maleimide (MIR-3000-70 MT), and the other conditions are the same as in example 4.
The performance of the laminated adhesive films in the above examples and comparative examples was tested as follows:
flame retardancy: laminating the laminating adhesive films with PET release films provided in the examples and the comparative examples and a substrate (MCL-E-705G of Hitachi chemical Co., ltd.) by a film laminating machine, and respectively laminating two laminating adhesive films (on the side without release film) on two sides of the substrate; after the lamination was completed, the release film on the laminate was removed, and heat-cured at 190℃for 90 minutes to form a cured product on both sides of the substrate, to obtain a laminate. The laminate (thickness: about 380 μm) was cut into a size of 12.7mm×127mm, and the edge radius at four corners was 1.27mm, and the test was performed in accordance with the UL-94V standard, and the test results were recorded.
Dielectric constant and dielectric loss tangent: curing the laminating adhesive with the PET release film provided in the examples and the comparative examples at 180 ℃ for 30min, and then peeling off the release film to obtain a pre-cured laminating adhesive film; the pre-cured build-up adhesive film was cut into test pieces (3 pieces) of 2mm×80mm, and then the dielectric constant and dielectric loss tangent of each test piece were measured using "HP8362B" of agilent technologies, inc. By means of cavity resonance perturbation method under the conditions of a measurement frequency of 5.8GHz and a measurement temperature of 23 ℃, and the average value of the dielectric constants and dielectric loss tangents of the 3 test pieces was calculated as the dielectric constant and dielectric loss tangents.
Table 1 test results
| Example 1 | Example 2 | Example 3 | Example 4 | |
| Flame retardancy (grade) | V-0 | V-0 | V-0 | V-0 |
| Dielectric constant | 3.4 | 3.5 | 3 | 3.4 |
| Dielectric loss tangent | 0.0099 | 0.0102 | 0.0088 | 0.0096 |
| Example 5 | Example 6 | Comparative example 1 | Comparative example 2 | |
| Flame retardancy (grade) | V-0 | V-0 | V-1 | V-1 |
| Dielectric constant | 3.3 | 2.9 | 4.0 | 3.9 |
| Dielectric loss tangent | 0.0095 | 0.0085 | 0.0121 | 0.0115 |
V-0: after the sample was subjected to the combustion test for 10 seconds twice, the flame was extinguished within 30 seconds, and no combustion products could fall. V-1: after the sample was subjected to the combustion test for 10 seconds twice, the flame was extinguished within 60 seconds, and no combustion products could fall.
In summary, the invention provides a build-up adhesive film for FC-BGA packaging carrier board with low dielectric loss, and a preparation method and application thereof, wherein the build-up adhesive film is prepared by adding phosphorus-containing cyanate and boron-containing phenolic resin into a build-up adhesive film raw material, and the three elements of phosphorus, nitrogen and boron in a build-up adhesive film system act synergistically, wherein phosphorus element releases phosphorus oxygen free radical under high temperature condition and combines with free radical for promoting combustion, thereby terminating chain reaction of combustion; the nitrogen element generates a flame-retardant nitrogen compound at high temperature to dilute the concentration of combustion gas near the flame, so that a flame-retardant effect is achieved; boron element is heated and decomposed to generate boric anhydride or boric acid to form glassy melt which is covered on the surface of the material, so that the propagation of oxygen and heat is isolated, and the generation of dense smoke and molten drops can be inhibited; the three synergistic effects are used for synchronously carrying out free radical quenching flame retardance, gas phase flame retardance and condensed phase flame retardance, preventing a plurality of factors of high polymer material combustion and improving the flame retardance and high temperature resistance of the laminated adhesive film. The triazine ring structure with extremely high crosslinking density is formed by interaction of the phosphorus-containing cyanate and the boron-containing phenolic resin, and the polar atoms are symmetrically distributed around the C atoms, so that the dipole polarization phenomenon is avoided to a large extent, and the cured laminated adhesive film has good dielectric property.
It is to be understood that the invention is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.
Claims (9)
1. The low dielectric loss build-up adhesive film for the FC-BGA packaging loading plate is characterized by being prepared from the following raw materials in parts by weight:
45-60 parts of epoxy resin, 40-100 parts of inorganic filler, 5-10 parts of acrylic resin, 5-10 parts of phenoxy resin, 35-60 parts of phosphorus cyanate, and 40-50 parts of boron-containing phenolic resin;
the phosphorus-containing cyanate is at least one selected from phosphorus-containing cyanate I, phosphorus-containing cyanate II, phosphorus-containing cyanate III and phosphorus-containing cyanate IV;
wherein, structural formula of the cyanate I containing phosphorus is:
the structural formula of the phosphorus-containing cyanate II is as follows:
the structural formula of the phosphorus-containing cyanate III is as follows:
the structural formula of the phosphorus-containing cyanate IV is as follows:
the boron-containing phenolic resin is at least one of boron-containing phenolic resin I, boron-containing phenolic resin II, boron-containing phenolic resin III and boron-containing phenolic resin IV;
wherein, structural formula of the boron-containing phenolic resin I is:
the structural formula of the boron-containing phenolic resin II is as follows:
the structural formula of the boron-containing phenolic resin III is as follows:
the structural formula of the boron-containing phenolic resin IV is as follows:
2. the build-up adhesive film for FC-BGA package carrier of claim 1, wherein the inorganic filler is at least one selected from the group consisting of silica, alumina, glass, cordierite, barium sulfate, barium carbonate, talc, clay, mica, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate, calcium zirconate, zirconium phosphate.
3. The low dielectric loss build-up adhesive film for FC-BGA package carrier of claim 1, further comprising, in parts by weight: 10 to 25 parts of maleimide containing 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide groups.
4. The build-up adhesive film for FC-BGA package carrier of claim 3, wherein said maleimide containing 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide group is at least one selected from the group consisting of bismaleimide i, bismaleimide ii, bismaleimide iii, bismaleimide iv;
wherein, structural formula of bismaleimide I is:
the structural formula of the bismaleimide II is as follows:
the structural formula of the bismaleimide III is as follows:
the structural formula of the bismaleimide IV is as follows:
5. the build-up adhesive film for a low dielectric loss FC-BGA package carrier of claim 1, wherein the raw material of the build-up adhesive film for a low dielectric loss FC-BGA package carrier further comprises 10-20 parts by weight of benzoxazine containing cage polysilsesquioxane.
6. The build-up adhesive film for a low dielectric loss FC-BGA package carrier of claim 5, wherein the benzoxazine containing cage polysilsesquioxane has the formula:
wherein R has one of the following structures:
wherein ,representing the ligation site.
7. A method for preparing a build-up adhesive film for a low dielectric loss FC-BGA package carrier board according to any one of claims 1 to 6, comprising the steps of:
providing a substrate;
mixing the raw material of the build-up adhesive film for the low dielectric loss FC-BGA packaging carrier plate according to any one of claims 1-6 with an organic solvent to obtain slurry;
and transferring the slurry to the base material, and drying to obtain the build-up adhesive film for the FC-BGA packaging loading board with low dielectric loss.
8. The method according to claim 7, wherein the drying temperature is 80 to 130 ℃ and the drying time is 3 to 10min.
9. Use of a build-up adhesive film for a low dielectric loss FC-BGA package carrier as defined in any one of claims 1-6 in a flip chip ball grid array package carrier.
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