CN115663089A - Light emitting device and manufacturing method thereof - Google Patents

Abstract

The invention provides a light-emitting device and a manufacturing method thereof, wherein the light-emitting device comprises a substrate, an LED chip, a dam and a composite fluorescent powder adhesive film, the dam is arranged on the substrate and forms a cavity with the substrate, the LED chip is arranged on the substrate and is positioned in the cavity, and the composite fluorescent powder adhesive film is attached to the upper surface of the LED chip. The invention can not only improve the packaging efficiency and avoid the generation of dispensing bubbles, but also reduce the color temperature deviation of the light-emitting device and make the color temperature more uniform.

Description

Light emitting device and manufacturing method thereof

technical field

The invention relates to the technical field of LED chips, in particular to a light emitting device and a manufacturing method of the light emitting device.

Background technique

LED (Ligit-Emitting Diode, light-emitting diode) is a commonly used light-emitting device, which has the advantages of long life, low power consumption and fast response speed. Due to these advantages, it is widely used in display devices, vehicle lamps, General lighting, infrared sensing and ultraviolet disinfection and other fields.

LEDs usually use chips that emit blue light and are paired with yellow phosphors to excite yellow light through the yellow phosphors and mix to form white light. There are two processes for using blue-ray chips with fluorescent powder: one is glue dispensing. After the solid crystal is completed, the prepared mixed fluorescent glue is filled into the LED bowl through the glue dispenser. The mixed fluorescent glue contains silica gel, yellow fluorescent Pink, Red Phosphor and Diffuser. The second is the form of sticking a fluorescent adhesive film on the LED chip, and the fluorescent adhesive film is a mixed single-layer adhesive film. Among them, the above-mentioned first process has problems such as low packaging efficiency and easy generation of dispensing bubbles. The above-mentioned second process can effectively improve packaging efficiency and avoid the generation of dispensing bubbles, but color temperature deviations are prone to occur during actual use. Bigger problem.

Contents of the invention

In order to solve the above technical problems, the present invention provides a light-emitting device and a manufacturing method thereof, which can not only improve packaging efficiency, avoid the generation of dispensing bubbles, but also reduce the color temperature deviation of the light-emitting device and make the color temperature more uniform.

The technical scheme that the present invention adopts is as follows:

A light-emitting device, including a substrate, an LED chip, a dam and a composite phosphor adhesive film, the dam is arranged on the substrate and forms a cavity with the substrate, and the LED chip is arranged on the substrate above and located in the cavity, the composite phosphor film is pasted on the upper surface of the LED chip.

The height of the upper surface of the LED chip is equal to the height of the upper surface of the dam, and the composite phosphor film covers both the upper surface of the LED chip and the upper surface of the dam.

The height of the upper surface of the LED chip is lower than the height of the upper surface of the dam, and after the composite phosphor adhesive film is pasted, the height of the upper surface of the composite phosphor adhesive film from the upper surface of the dam is flush.

The composite fluorescent powder adhesive film is composed of a multi-layer structure.

The multi-layer structure includes a yellow phosphor layer, a red phosphor layer, a diffusion particle layer and a substrate layer.

The multi-layer structure includes a mixed phosphor layer, a diffusion particle layer and a substrate layer.

A method for manufacturing a light-emitting device, comprising the following steps: making the composite phosphor adhesive film; placing the LED chip on the substrate through a crystal-bonding operation; making the dam, and placing the composite phosphor The powder glue film is pasted on the upper surface of the LED chip.

Making the dam, and affixing the composite phosphor film on the upper surface of the LED chip, specifically includes: making the dam by a dam machine or making the dam by molding, wherein , the height of the upper surface of the dam is flush with the height of the upper surface of the LED chip; the upper surface of the LED chip and the upper surface of the dam are coated with adhesive; The composite phosphor film is pasted on the upper surface of the LED chip and the upper surface of the dam.

Making the dam, and affixing the composite phosphor film on the upper surface of the LED chip, specifically includes: making the first part of the dam by a dam machine or making the dam by pressing a film. The first part of the dam, wherein the height of the upper surface of the first part of the dam is level with the height of the upper surface of the LED chip; the upper surface of the LED chip and the upper surface of the first part of the dam are coated Adhesive glue; the composite phosphor adhesive film is pasted on the upper surface of the LED chip and the upper surface of the first part of the dam through the adhesive glue; the composite phosphor adhesive film is cut off on the upper surface of the dam In the first area of the upper surface of the first part, the second area of the upper surface of the LED chip is reserved with the composite phosphor adhesive film; around the second area, the first dam of the dam is formed by the dam mechanism Two parts or the second part of the dam is made by pressing film, so that the height of the upper surface of the composite phosphor film is equal to the height of the upper surface of the second part of the dam.

Beneficial effects of the present invention:

In the present invention, by fixing the LED chip on the substrate, the dam and the substrate form a cavity and the LED chip is located in the cavity, and the composite phosphor film is attached to the upper surface of the LED chip, thereby not only improving the packaging efficiency , to avoid the generation of dispensing bubbles, and can reduce the color temperature deviation of the light emitting device, so that the color temperature is more uniform.

Description of drawings

FIG. 1 is a schematic structural view of a light emitting device according to an embodiment of the present invention;

2 is a schematic structural view of a light emitting device according to another embodiment of the present invention;

Fig. 3 is a schematic structural view of a composite phosphor film according to an embodiment of the present invention;

4 is a schematic structural view of a composite phosphor film according to another embodiment of the present invention;

Fig. 5 is a flowchart of a method for manufacturing a light emitting device according to an embodiment of the present invention.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

As shown in FIG. 1 , the light-emitting device of the embodiment of the present invention includes a substrate 10, an LED chip 20, a dam 30 and a composite phosphor adhesive film 40. The dam 30 is arranged on the substrate 10 and forms a cavity with the substrate 10. , the LED chip 20 is disposed on the upper surface of the substrate 10 and located in the cavity, and the composite phosphor adhesive film 40 is pasted on the upper surface of the LED chip 20 .

In one embodiment of the present invention, a die-bonding area is provided at the center of the substrate 10 , and a die-bonding glue can be used to fix the LED chip 20 in the die-bonding area.

As shown in Figure 1, in one embodiment of the present invention, the height of the upper surface of the LED chip 20 is level with the height of the upper surface of the dam 30, and the composite phosphor adhesive film 40 covers the upper surface of the LED chip 20 and the dam simultaneously. 30 on the upper surface. In other embodiments of the present invention, the dam 30 can be made of white glue.

As shown in Figure 2, in another embodiment of the present invention, the height of the upper surface of the LED chip 20 is lower than the height of the upper surface of the dam 30, after the composite phosphor adhesive film 40 is pasted, the composite phosphor adhesive film 40 The height of the upper surface is equal to the height of the upper surface of the dam 30, that is to say, the composite phosphor adhesive film 40 is also located in the cavity.

In an embodiment of the present invention, the composite phosphor adhesive film 40 may be composed of a multi-layer structure.

As shown in FIG. 3 , in one embodiment of the present invention, the composite phosphor film 40 may be a multi-layer structure including a substrate layer 41 , a diffusion particle layer 42 , a red phosphor layer 43 and a yellow phosphor layer 44 . Among them, the substrate layer 41 can be made of materials such as transparent silica gel and transparent PI (Polyimide, polyimide), the diffusion particle layer 42 can be formed by mixing silica gel with diffusion particles with a particle size of 4-8um, and the red phosphor layer 43 and yellow phosphor The powder layer 44 can be formed by mixing silica gel with materials such as rare earth garnet, silicate, nitrogen-containing compound and sulfide.

As shown in FIG. 4 , in another embodiment of the present invention, the composite phosphor adhesive film 40 may also be a multi-layer structure including a substrate layer 41 , a diffusion particle layer 42 and a mixed phosphor layer 45 . Wherein, the mixed phosphor layer 45 can be made of silica gel mixed with yellow phosphor and red phosphor.

According to the light-emitting device of the embodiment of the present invention, by fixing the LED chip on the substrate, the dam and the substrate form a cavity and the LED chip is located in the cavity, and the composite phosphor film is pasted on the upper surface of the LED chip. Therefore, not only can the encapsulation efficiency be improved, and the generation of dispensing bubbles can be avoided, but also the color temperature deviation of the light emitting device can be reduced to make the color temperature more uniform.

Corresponding to the light emitting device of the above embodiments, the present invention further provides a method for manufacturing the light emitting device.

As shown in FIG. 5, the manufacturing method of the light emitting device according to the embodiment of the present invention includes the following steps:

S1, making a composite phosphor film.

In one embodiment of the present invention, step S1 may specifically include the following steps: First, the substrate layer may be obtained by coating or spraying using materials such as transparent silica gel and transparent PI, and then baked after obtaining the substrate layer Forming and curing. Furthermore, the diffusion particles with a particle size of 4-8um mixed with silica gel are coated or sprayed on the cured substrate layer to form a diffusion particle layer, and the substrate layer and the diffusion particle layer are baked and cured. Furthermore, the red phosphor layer can be formed by coating or spraying the red phosphor mixed with silica gel on the diffusion particle layer, and the substrate layer, the diffusion particle layer and the red phosphor layer are baked and cured. Finally, use yellow phosphor mixed with silica gel to coat or spray on the red phosphor layer to form a yellow phosphor layer, and bake the substrate layer, diffusion particle layer, red phosphor layer and yellow phosphor layer to form and cure , to form a composite phosphor layer adhesive film.

In another embodiment of the present invention, step S1 may specifically include the following steps: First, the substrate layer may be obtained by coating or spraying using materials such as transparent silica gel and transparent PI, and after obtaining the substrate layer, bake it Bake to form and solidify. Furthermore, the diffusion particles with a particle size of 4-8um mixed with silica gel are coated or sprayed on the cured substrate layer to form a diffusion particle layer, and the substrate layer and the diffusion particle layer are baked and cured. Finally, use yellow phosphor and red phosphor to mix silica gel to form a mixed phosphor, and use the mixed phosphor to coat or spray on the diffusion particle layer to form a mixed phosphor layer, and the substrate layer, the diffusion particle layer and the mixed fluorescent powder The powder layer is baked, molded and solidified to form a composite phosphor layer adhesive film.

S2, disposing the LED chip on the substrate through a crystal bonding operation.

In one embodiment of the present invention, a die-bonding area is provided in the center of the substrate, and a die-bonding glue can be used to fix the LED chip in the die-bonding area.

S3, making a dam, and affixing the composite phosphor film on the upper surface of the LED chip.

In one embodiment of the present invention, step S3 may specifically include the following steps: the dam may be fabricated by a dam mechanism or formed by pressing film, wherein the height of the upper surface of the dam is equal to the height of the upper surface of the LED chip Qi; the upper surface of the LED chip and the upper surface of the dam are coated with adhesive, wherein the adhesive can be doped with yellow phosphor powder; the composite phosphor film is pasted on the upper surface of the LED chip and the dam by the adhesive At the same time, press the composite phosphor film to eliminate air bubbles. Thus, the light emitting device shown in FIG. 1 can be manufactured.

In another embodiment of the present invention, step S3 may specifically include the following steps: the first part of the dam may be made by a dam mechanism or the first part of the dam may be made by compression molding, wherein the upper surface of the first part of the dam The height is flush with the upper surface of the LED chip; the upper surface of the LED chip and the upper surface of the first part of the dam are coated with adhesive, wherein the adhesive is not doped with yellow phosphor powder; the composite fluorescent The powder glue film is attached to the upper surface of the LED chip and the upper surface of the first part of the dam, and at the same time, the composite phosphor glue film can be pressed to eliminate air bubbles; the part of the composite phosphor glue film on the upper surface of the first part of the dam can be cut off. The first area, the second area where the composite phosphor film is kept on the upper surface of the LED chip, wherein the first area can be cut off by a cutting process or a scribing process; surrounding the second area, a dam can be made by a dam mechanism or make the second part of the dam by compression molding, so that the height of the upper surface of the composite phosphor film is level with the height of the upper surface of the second part of the dam. Thus, a light emitting device as shown in FIG. 2 can be fabricated.

In one embodiment of the present invention, the adhesive can be cured by baking, so that the composite phosphor adhesive film adheres firmly to the upper surface of the LED chip and does not easily fall off.

Finally, blanking and light-splitting tapes are performed on the light-emitting device.

According to the manufacturing method of the light-emitting device according to the embodiment of the present invention, by making a composite phosphor film, disposing the LED chip on the substrate, and making a dam, attaching the composite phosphor film to the upper surface of the LED chip, by Therefore, not only can the encapsulation efficiency be improved, and the generation of dispensing bubbles can be avoided, but also the color temperature deviation of the light emitting device can be reduced to make the color temperature more uniform.

In the description of the present invention, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. "Plurality" means two or more, unless otherwise clearly and specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.

Any process or method descriptions in flowcharts or otherwise described herein may be understood to represent modules, segments or portions of code comprising one or more executable instructions for implementing specific logical functions or steps of the process , and the scope of preferred embodiments of the invention includes alternative implementations in which functions may be performed out of the order shown or discussed, including substantially concurrently or in reverse order depending on the functions involved, which shall It is understood by those skilled in the art to which the embodiments of the present invention pertain.

The logic and/or steps represented in the flowcharts or otherwise described herein, for example, can be considered as a sequenced listing of executable instructions for implementing logical functions, can be embodied in any computer-readable medium, For use with instruction execution systems, devices, or devices (such as computer-based systems, systems including processors, or other systems that can fetch instructions from instruction execution systems, devices, or devices and execute instructions), or in conjunction with these instruction execution systems, devices or equipment used. For the purposes of this specification, a "computer-readable medium" may be any device that can contain, store, communicate, propagate or transmit a program for use in or in conjunction with an instruction execution system, device or device. More specific examples (non-exhaustive list) of computer-readable media include the following: electrical connection with one or more wires (electronic device), portable computer disk case (magnetic device), random access memory (RAM), Read Only Memory (ROM), Erasable and Editable Read Only Memory (EPROM or Flash Memory), Fiber Optic Devices, and Portable Compact Disc Read Only Memory (CDROM). In addition, the computer-readable medium may even be paper or other suitable medium on which the program can be printed, since the program can be read, for example, by optically scanning the paper or other medium, followed by editing, interpretation or other suitable processing if necessary. The program is processed electronically and stored in computer memory.

It should be understood that various parts of the present invention can be realized by hardware, software, firmware or their combination. In the embodiments described above, various steps or methods may be implemented by software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented by any one or combination of the following techniques known in the art: Discrete logic circuits, ASICs with suitable combinational logic gates, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.

Those of ordinary skill in the art can understand that all or part of the steps carried by the methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium. During execution, one or a combination of the steps of the method embodiments is included.

In addition, each functional unit in each embodiment of the present invention may be integrated into one processing module, each unit may exist separately physically, or two or more units may be integrated into one module. The above-mentioned integrated modules can be implemented in the form of hardware or in the form of software function modules. If the integrated modules are realized in the form of software function modules and sold or used as independent products, they can also be stored in a computer-readable storage medium.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.

Claims (9)

1. The utility model provides a light-emitting device, its characterized in that, includes base plate, LED chip, box dam and compound phosphor powder glued membrane, the box dam set up in the higher authority of base plate and with the base plate is formed with the cavity, the LED chip set up in the higher authority of base plate just is located in the cavity, compound phosphor powder glued membrane pastes and locates the upper surface of LED chip.

2. The light emitting device of claim 1, wherein the height of the upper surface of the LED chip is flush with the height of the upper surface of the dam, and the composite phosphor adhesive film covers both the upper surface of the LED chip and the upper surface of the dam.

3. The light emitting device of claim 1, wherein a height of an upper surface of the LED chip is lower than a height of an upper surface of the dam, and after the composite phosphor adhesive film is attached, the height of the upper surface of the composite phosphor adhesive film is flush with the height of the upper surface of the dam.

4. The light-emitting device according to claim 2 or 3, wherein the composite phosphor adhesive film is composed of a multilayer structure.

5. The light-emitting device according to claim 4, wherein the multilayer structure comprises a substrate layer, a diffusing particle layer, a red phosphor layer, and a yellow phosphor layer.

6. The light-emitting device according to claim 4, wherein the multilayer structure comprises a substrate layer, a diffusion particle layer, and a mixed phosphor layer.

7. A method of manufacturing a light emitting device according to any one of claims 1 to 6, comprising the steps of:

manufacturing the composite fluorescent powder adhesive film;

arranging the LED chip on the substrate through die bonding;

and manufacturing the box dam, and pasting the composite fluorescent powder adhesive film on the upper surface of the LED chip.

8. The method for manufacturing a light emitting device according to claim 7, wherein the step of manufacturing the dam and attaching the composite phosphor adhesive film to the upper surface of the LED chip specifically comprises:

the dam is manufactured through a dam mechanism or is manufactured through compression molding, wherein the height of the upper surface of the dam is flush with that of the upper surface of the LED chip;

coating adhesive on the upper surface of the LED chip and the upper surface of the dam;

and the composite fluorescent powder adhesive film is adhered to the upper surface of the LED chip and the upper surface of the box dam through the adhesive glue.

9. The method for manufacturing a light emitting device according to claim 7, wherein the step of manufacturing the dam and attaching the composite phosphor adhesive film to the upper surface of the LED chip specifically includes:

manufacturing a first part of the box dam through a box dam machine or manufacturing the first part of the box dam through compression molding, wherein the height of the upper surface of the first part of the box dam is flush with that of the upper surface of the LED chip;

coating adhesive on the upper surface of the LED chip and the upper surface of the first part of the dam;

the composite fluorescent powder adhesive film is attached to the upper surface of the LED chip and the upper surface of the first part of the box dam through the adhesive glue;

cutting off a first area of the composite fluorescent powder adhesive film on the upper surface of the first part of the dam, and reserving a second area of the composite fluorescent powder adhesive film on the upper surface of the LED chip;

and surrounding the second area, manufacturing a second part of the box dam through a box dam machine or manufacturing the second part of the box dam through compression molding, so that the height of the upper surface of the composite fluorescent powder adhesive film is flush with that of the second part of the box dam.

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