CN115763439A - Partition electromagnetic shielding module, preparation method, circuit board and electronic product - Google Patents

Abstract

The invention discloses a partition electromagnetic shielding module, a preparation method, a circuit board and electronic products. The module includes a substrate, a ground connection pad, a flip chip, a chip or a component, a shielding wire arc, a plastic package, and an electromagnetic shielding layer. On the substrate, and between the flip chip and the chip or component, the plastic package covers the ground connection pad, the flip chip, the chip or component, and the shielding arc. The electromagnetic shielding layer is located on the surface of the plastic package, and the shielding arc is set on the Between the flip chip and the chip or component, and one end of the shielding arc is connected to the weldable metal layer, and the other end is connected to the electromagnetic shielding layer. The invention can reduce the arc height of the shielding line, improve the packaging quality, simplify the process difficulty, and improve the packaging integration degree to a certain extent.

Description

Partition electromagnetic shielding module, preparation method, circuit board and electronic product

technical field

The invention relates to a partitioned electromagnetic shielding module, a preparation method of the partitioned electromagnetic shielding module, a circuit board and an electronic product with the partitioned electromagnetic shielding module, and belongs to the technical field of chip packaging.

Background technique

As the integration of electronic components is getting higher and higher, the distance between components in integrated circuits is getting smaller and smaller, resulting in increasingly serious problems of mutual interference between components. In order to prevent the occurrence of electromagnetic interference between chips, or between chips and components, the electromagnetic shielding of partitions is usually realized by bonding wires or slotting and filling shielding media on the plastic package. The specific wire bonding methods include: wire bonding on the substrate to form metal mesh, metal fences, and metal vertical lines, etc., so that the electromagnetic shielding layer covered on the surface of the plastic package is connected to the shielding wire arc to achieve electromagnetic shielding.

In the Chinese invention patent with the patent number ZL 202110202607.8, an electromagnetic shielding packaging structure and an electromagnetic shielding packaging method are disclosed. The electromagnetic shielding packaging structure includes a substrate, at least two chips mounted on the substrate, a shielding wire arc arranged on the substrate, a plastic package covering the chip and the shielding wire arc, and a metal shielding layer covering the surface of the plastic package, Wherein, the shielding wire arc is punched on the ground pad around the chip. However, the height of the wire arc used in this wire bonding method is high, which makes the wire bonding operation difficult and the stability of the wire arc is poor.

Contents of the invention

The primary technical problem to be solved by the present invention is to provide a module for partitioning electromagnetic shielding.

Another technical problem to be solved by the present invention is to provide a method for preparing a partitioned electromagnetic shielding module.

Another technical problem to be solved by the present invention is to provide a circuit board with the electromagnetic shielding module of the partition.

Another technical problem to be solved by the present invention is to provide an electronic product with the electromagnetically shielded modules of the partitions.

For realizing above-mentioned technical purpose, the present invention adopts following technical scheme:

According to the first aspect of the embodiments of the present invention, there is provided a module for partitioned electromagnetic shielding, including a substrate, a ground connection pad, a flip chip, a chip or a component, a shielded wire arc, a plastic package, and an electromagnetic shielding layer,

The surface of the flip chip away from the substrate is provided with a wire-bondable metal layer,

The ground connection pad is located on the substrate and between the flip chip and the chip or component,

The plastic package covers the ground connection pad, flip chip, chip or component, and shielding arc,

The electromagnetic shielding layer is located on the surface of the plastic package,

The shielding arc is arranged between the flip chip and the chip or component, and one end of the shielding arc is connected to the wire-weldable metal layer, and the other end is connected to the electromagnetic shielding layer.

Preferably, the shielding arc includes a first arc and a second arc, the first arc is connected to the weldable metal layer and the electromagnetic shielding layer; the second arc is connected to the ground connection pads and the electromagnetic shield.

Preferably, the wire-bondable metal layer covers the entire backside of the flip chip, or covers the outer periphery of the flip chip.

Wherein preferably, the shielded wire arc is straight, L-shaped or square-shaped.

Preferably, when the shielding arc is straight or L-shaped, the wire-bondable metal layer covers the outer periphery of the flip chip; when the shielding arc is in the shape of a square, the A wire-bondable metal layer covers the entire backside of the flip chip.

According to the second aspect of the embodiments of the present invention, there is provided a method for preparing a partitioned electromagnetic shielding module, comprising the following steps:

S1: forming a ground connection pad on the substrate;

S2: Install flip chips and chips or components on the substrate;

S3: forming a wire-bondable metal layer on the backside of the flip chip;

S5: making a wire between the ground connection pad and the weldable metal layer to form a shielded wire arc;

S5: forming a plastic package on the substrate, exposing the top of the shielding arc to the surface of the plastic package;

S6: forming an electromagnetic shielding layer on the back of the plastic package, and electrically connecting the electromagnetic shielding layer to the shielding arc;

S7: performing singulation on the substrate.

According to a third aspect of the embodiments of the present invention, there is provided a method for preparing a partitioned electromagnetic shielding module, including the following steps:

S1: forming a ground connection pad on the substrate;

S2: Install flip chips and chips or components on the substrate;

S3: forming a wire-bondable metal layer on the backside of the flip chip;

S5: making a wire between the ground connection pad and the weldable metal layer to form a shielded wire arc;

S5: forming a plastic package on the substrate, and thinning the plastic package to cut off the bonding wire to form a shielding arc and expose the shielding arc;

S6: forming an electromagnetic shielding layer on the back of the plastic package, and electrically connecting the electromagnetic shielding layer to the shielding arc;

S7: performing singulation on the substrate.

According to a fourth aspect of the embodiments of the present invention, there is provided a method for preparing a partitioned electromagnetic shielding module, comprising the following steps:

S1: forming a ground connection pad on the substrate;

S2: Install flip chips and chips or components on the substrate;

S3: forming a wire-bondable metal layer on the backside of the flip chip;

S5: making a wire between the ground connection pad and the weldable metal layer to form a shielded wire arc;

S5: forming a plastic package on the substrate, exposing the top of the shielding arc to the surface of the plastic package;

S6: Singling the substrate;

S7: Form an electromagnetic shielding layer on a single package, and electrically connect the electromagnetic shielding layer to the shielding arc.

According to a fifth aspect of the embodiments of the present invention, there is provided a method for preparing a partitioned electromagnetic shielding module, including the following steps:

S1: forming a ground connection pad on the substrate;

S2: Install flip chips and chips or components on the substrate;

S3: forming a wire-bondable metal layer on the backside of the flip chip;

S5: making a wire between the ground connection pad and the weldable metal layer to form a shielded wire arc;

S5: forming a plastic package on the substrate, and thinning the plastic package to cut off the bonding wire to form a shielding arc and expose the shielding arc;

S6: Singling the substrate;

S7: Form an electromagnetic shielding layer on a single package, and electrically connect the electromagnetic shielding layer to the shielding arc.

According to a sixth aspect of the embodiments of the present invention, there is provided a circuit board, which includes the aforementioned partitioned electromagnetic shielding module.

According to a seventh aspect of the embodiments of the present invention, there is provided an electronic product, including the aforementioned partitioned electromagnetic shielding module.

Compared with the prior art, the present invention has the following technical effects: the electromagnetic shielding between chips and components or between chips is realized by bonding wires on the back of the flip chip and the ground connection pads around it. Through this wire bonding method, the height of the shielding wire arc can be reduced, the packaging quality can be improved, and the difficulty of the process can be simplified. To a certain extent, the space utilization rate of the substrate is improved to meet the requirement of increasing the packaging integration.

Description of drawings

1 to 7 are flow charts of a method for preparing a partitioned electromagnetic shielding module in the first embodiment of the present invention;

8 to 9 are schematic diagrams of different steps in the method for preparing a module for partitioned electromagnetic shielding in the second embodiment of the present invention and in the first embodiment;

10 is a schematic diagram of a wire-bondable metal layer of a flip chip in an embodiment of the present invention;

Fig. 11 (a) is a schematic diagram of a form of the wire-bondable metal layer in Fig. 10;

Figure 11(b) is a schematic diagram of another form of the wire-bondable metal layer in Figure 10;

Fig. 12(a) to Fig. 12(b) are structural schematic diagrams of an implementation mode of a partitioned electromagnetic shielding module in the third embodiment of the present invention;

Fig. 13(a) to Fig. 13(b) are structural schematic diagrams of another implementation of the partitioned electromagnetic shielding module in the third embodiment of the present invention;

14 to 16 are flow charts of a method for preparing a partitioned electromagnetic shielding module in the fourth embodiment of the present invention;

17 to 18 are schematic diagrams of different steps of an alternative method for preparing a partitioned electromagnetic shielding module in the fourth embodiment of the present invention.

Detailed ways

The technical content of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

<First embodiment>

As shown in Figures 1 to 7, the first embodiment of the present invention discloses a method for preparing a partitioned electromagnetic shielding module, including the following steps:

S1: Form the ground connection pad 11 on the substrate 12 .

As shown in FIG. 1 , the substrate 12 includes a substrate 121 , a functional circuit 122 , and a ground wire 123 on the sidewall of the substrate. The base material 121 is a dielectric material such as ceramics, PP, epoxy resin, etc., and is preferably multi-layered. The functional circuits 122 are distributed on the multi-layer substrate 121 . The layout of the functional circuit 122 is understood by those skilled in the art to be different according to specific application scenarios, so details are not described here. The substrate sidewall grounding wire 123 is distributed on the sidewall of the substrate 12, one end is grounded, and the other end is exposed on the sidewall of the substrate 12, which is convenient to connect with the electromagnetic shielding layer 17 covering the surface of the sidewall of the substrate 12 to prevent external electromagnetic interference.

The ground connection pad 11 is located on the upper surface of the substrate 12 and is used to provide electrical connection for the subsequent wire-bonding package. Its material can be one or more of Cu, Al, Au, Ag, Sn and other materials, or it can be its alloy. The ground connection pad 11 can be formed during the manufacturing process of the substrate 12 , or can be formed by pasting a metal block on the substrate 12 by SMT (Surface Mount Technology) or other methods. The ground connection pads 11 can be distributed independently of each other, or partly connected into a strip, or all connected into a whole strip.

S2: Install flip chip 13 and chips or components 14 on substrate 12 .

As shown in FIG. 2 , in this embodiment, the flip chip 13 is a chip such as SAW, BAW, etc. that has requirements against electromagnetic interference, and is an electromagnetic interference sensitive device. The chip or component 14 is a source of electromagnetic interference, which interferes with the flip chip 13 . Therefore, the flip chip 13 needs to be shielded by wire bonding to protect it from interference from chips or components 14 .

The front side of the flip chip 13 (the surface facing the substrate) includes bumps 21 , and its back side has a wire-bondable metal layer 22 (details will be described later). The flip chip 13 can be packaged by FC or SMT, and the bumps 21 are soldered to the substrate 12 . The material of the bump 21 is a material that can be soldered and electrically connected, and is generally a solder ball. The thickness of the wire-bondable metal layer 22 needs to be greater than 1 um, which is used to increase the bonding force between the flip-chip 13 and the shielded wire arc 15, and facilitate subsequent wire-bonding operations.

The electrical connection between the chip or component 14 and the substrate 12 can be wire bonding (WB), flip chip (FC) or surface mount (SMT) and other common semiconductor packaging processes.

The ground connection pad 11 is located between two mutually interfering devices, that is, between the flip chip 13 and the chip or component 14 , and can be flexibly designed according to circuit routing requirements.

S3: forming a wire-bondable metal layer 22 on the back surface of the flip chip 13 .

To form the wire-bondable metal layer 22 , in this embodiment, evaporation technology is used, but other technologies, such as sputtering technology, can also be used. Hereinafter, vapor deposition is taken as an example for description.

The wire-bondable metal layer 22 is a three-layer metal process structure, which can be respectively an adhesion layer, a transition layer and a conductive layer according to its functions. Upper adhesion layer (contact layer): Generally, a material with good adhesion, close to the thermal expansion coefficient of the wafer material, and a small ohmic contact coefficient with it is selected; in this embodiment, the wafer material is a silicon wafer, so it can be selected Chrome or titanium, here titanium is used.

Lower adhesion layer (protective layer): It is the outermost layer on the back of the chip, which has stable performance, is not easy to oxidize, is easy to solder with the solder layer, and has good electrical and thermal conductivity. Metals such as gold and silver can be used. Silver is chosen in this example.

Barrier layer (filling layer): It plays a transitional role between the contact layer and the conductive layer, and the gold and silver films cannot be directly made on the chromium and titanium metal films. Since the gold and silver films are easily soluble in solder such as tin and silver, the solder is directly in contact with the titanium and chromium metal films, but these metals are difficult to solder, resulting in poor chip soldering performance; A barrier layer is provided between them, usually nickel.

In this embodiment, the titanium layer (1KA) is evaporated first, then the nickel layer (2KA) is evaporated, and finally the silver layer (10KA) is evaporated.

S4: Make a wire between the ground connection pad 11 and the wire-weldable metal layer 22 to form a shielded wire arc 15 .

As shown in FIG. 3 , the first end 151 of the shielding arc 15 is hit on the ground connection pad 11 , and the second end 152 is hit on the wire-bondable metal layer 22 of the flip chip 13 . The bonding wire used for bonding may be one or more of conductive bonding wires such as Au, Cu, and Al.

Since the height of the flip chip 13 is high, the distance L1 from the first end 151 to the top A of the bonding wire is smaller than the distance L2 from the second end 152 to the top A of the bonding wire (ie, L1<L2). In the conventional technology, the first end and the second end of the bonding wire are drawn from the substrate or the ground connection pad, so the distance from the first end to the top of the bonding wire is basically the same as the distance from the second end to the top of the bonding wire, In this way, the entire bonding wire length L≈2*L2. However, in the embodiment of the present invention, the entire bonding wire length L=L1+L2<2*L2, thus shortening the entire bonding wire length L. As we all know, the longer the slender bonding wire is, the worse its ability to withstand the molding pressure in the plastic encapsulation process, and the easier it is to shift or collapse, which will lead to poor electromagnetic shielding effect. Therefore, the embodiment of the present invention utilizes the height of the flip-chip to shorten the length of L1, which shortens the length L of the entire bonding wire, which is beneficial to improve the electromagnetic shielding effect.

Moreover, the length L of the entire wire bonding is shortened, and the difficulty of the wire bonding operation is also reduced accordingly.

S5: forming a plastic package 16 on the substrate 12, and thinning the plastic package 16, so as to cut off the bonding wire to form the shielding arc 15 and expose the shielding arc 15.

As shown in FIG. 4 , a plastic package 16 covering the flip chip 13 , the chip or component 14 , the shielding arc 15 and the ground connection pad 11 is formed on the substrate 12 . At this time, the shielded wire arc 15 is not exposed to the plastic package 16 , that is, the height of the plastic package 16 is obviously greater than the height of the top A of the shielded wire arc 15 .

Then, as shown in FIG. 5 , the plastic package body 16 is thinned by back grinding process, etc., so that the top of the bonding wire is truncated and two sections of shielding arcs 15 are formed, and the tops of the two sections of shielding arcs 15 are exposed from the The back side (the surface away from the substrate) of the plastic package 16 is exposed.

S6: Form an electromagnetic shielding layer 17 on the back of the plastic package 16, and electrically connect the electromagnetic shielding layer 17 to the shielding arc 15.

As shown in FIG. 6 , a metal electromagnetic shielding layer 17 is formed on the back of the plastic package 16 by sputtering, coating and other processes. Moreover, the electromagnetic shielding layer 17 is electrically connected to the exposed top end of the shielding arc 15 . In this embodiment, the electromagnetic shielding layer 17 is covered on the surface of the plastic package 16 by means of electroplating, sputtering, etc. to form a shielding layer on the surface of the entire strip level (also referred to as “board level”) packaging structure. Furthermore, electromagnetic shielding is realized by connecting the shielding wire arc 15 exposed on the surface of the plastic package 16 to the ground connection pad 11 or the wire-weldable metal layer 22 .

The wire-weldable metal layer 22 is used for mechanical connection and circuit conduction of the shielding arc 15 on the flip chip 13, and the interference signal is transmitted to the electromagnetic shielding layer 17 through the shielding arc 15, and then to the ground connection pad 11 through the electromagnetic shielding layer 17 , so as to achieve electromagnetic shielding.

In this embodiment, the electromagnetic shielding layer 17 is a metal layer, including a three-layer structure, namely a stainless steel layer, a copper layer and a stainless steel layer, covering the surface of the plastic package 16 .

S7: performing singulation on the substrate 12 .

As shown in FIG. 7 , the electromagnetic-shielded substrate 12 is cut to form a single-partitioned electromagnetic-shielded module.

<Second Embodiment>

As an alternative, after the steps described in S1 to S5 in the first embodiment, that is, after backgrinding the plastic package 16, as shown in FIG. As shown, the covering of the electromagnetic shielding layer 17 is performed under a single unit level. In this manner, the electromagnetic shielding layer 17 covers all surfaces except the bottom surface of a single module, and the electromagnetic shielding layer 17 can not only be connected to the ground wire through the shielding arc 15, but also can be connected to the ground wire 123 on the side wall of the substrate.

<Third Embodiment>

This embodiment provides a module obtained by adopting the aforementioned module preparation method of partitioned electromagnetic shielding.

As shown in FIG. 7 and FIG. 9 , the partitioned electromagnetic shielding module includes a ground connection pad 11 , a substrate 12 , a flip chip 13 , a chip or component 14 , a shielding arc 15 , a plastic package 16 and an electromagnetic shielding layer 17 .

Shielding loops 15 are arranged between flip chip 13 and chip or component 14 . The shielding loop 15 includes a first loop 15A and a second loop 15B. Wherein, the first arc 15A has a first end 151 and a first top 151A; the second arc 15B has a second end 152 and a second top 152B. The first end 151 of the first line arc 15A is connected to the wire-bondable metal layer 22 on the flip chip 13, and the first top end 151A is connected to the electromagnetic shielding layer 17; the second end 152 of the second line arc 152 is connected to the ground connection pad 11 connection, the second top end 152B is connected to the electromagnetic shielding layer 17 . As a result, a grounded shielded arc 15 is formed.

Referring to FIG. 10 , FIG. 11( a ) and FIG. 11( b ), the wire-bondable metal layer 22 on the backside of the flip chip 13 may have different shapes. The wire-bondable metal layer 22 may cover the entire backside of the flip chip 13 , or may only cover the outer periphery of the flip chip 13 .

According to the different shielding requirements, the wiring form of the shielding arc 15 is also different. In the foregoing embodiments, the shielding arc 15 is only located between the flip chip 13 and the chip or component 14 , that is, the shielding arc 15 is only in a straight line. However, according to different shielding requirements, the shielding arc 15 can also be L-shaped or square-shaped. Preferably, when the shielding arc 15 is linear or L-shaped, the metal layer 22 that can be bonded covers the outer periphery of the flip chip; the entire backside of the flip chip.

As shown in Figure 12(a) and 12(b), the electromagnetic shielding module of the partition includes a ground connection pad 11, a substrate 12, a flip chip 13, a chip or component 14, a shielding wire arc 15, and a plastic package body 16 for electromagnetic shielding. Layer 17, and the second component 18. In the figure, the right side of the flip chip 13 is the chip or component 14 , and the front side of the flip chip 13 is the second component 18 .

As shown in Figure 12 (a), between the flip chip 13 and the second component 18, and between the flip chip 13 and the chip or component 14, a ground connection pad 11 is formed, so the shielding arc 15 An L-shape is formed on the ground connection pad 11 and the flip chip 13 to provide electromagnetic shielding between the flip chip 13 and the component 18 , and to form an electromagnetic shield between the flip chip 13 and the chip or component 14 .

As shown in Figure 12(b), the ground connection pad 11 forms a ring-shaped area around the flip chip 13, and the shielding arc 15 is also distributed around the flip chip 13, connecting the flip chip 13 with the second component 18, Chips or components 14 are electromagnetically shielded. The shielding effect of the electromagnetic shielding realized by this zigzag-shaped wiring form is better than that of the L-shaped shielding arc 15 shown in FIG. 12( a ).

Fig. 13 (a) and Fig. 13 (b) have illustrated that the left and right sides of flip chip 13 are respectively provided with the second component parts 19 and the 3rd component parts 20 that need electromagnetic shielding, and the front side of flip chip 13 is The first component 18. Similarly, the wiring pattern can be L-shaped (shown in Figure 13(a)) or square-shaped (shown in Figure 13(b)). The shielding arc on the flip chip 13 can isolate the interference from the third component 20 from the flip chip 13 or the second component 19 . Similarly, the interference from the flip chip 13 or the second component 19 can also be isolated by the shielding arc on the flip chip 13 to prevent the third component 20 from being interfered.

Thus, electromagnetic interference between chips or components, or between chips and components can be prevented.

<Fourth Embodiment>

This embodiment discloses another manufacturing method of a partitioned electromagnetic shielding module. The difference between this embodiment and the first embodiment is that when the chip is plastic-encapsulated, the height of the plastic package 16 is relatively low, as shown in FIG. , no need to backgrind the plastic package 16.

Specifically, as shown in Figures 14 to 16, the preparation method of the partitioned electromagnetic shielding module includes the following steps:

S1: forming ground connection pads 11 on the substrate 12;

S2: installing flip chips 13 and chips or components 14 on the substrate 12;

S3: forming a wire-bondable metal layer 22 on the back surface of the flip chip 13;

S5: Make a wire between the ground connection pad 11 and the weldable metal layer 22 to form a shielded wire arc 15;

S5: forming a plastic package 16 on the substrate 12, exposing the top end A of the shielding arc 15 to the surface of the plastic package 16;

S6: forming an electromagnetic shielding layer 17 on the back of the plastic package 16, so that the electromagnetic shielding layer 17 is electrically connected to the shielding arc 15;

S7: performing singulation on the substrate 12 .

As an alternative, after the steps shown in S1-S5, as shown in FIG. 17 , the substrate 12 is first cut into pieces, and then as shown in FIG. 18 , the single module is covered with the electromagnetic shielding layer 17 . Similarly, in this way, the electromagnetic shielding layer 17 covers all surfaces except the bottom surface of a single module, and the electromagnetic shielding layer 17 can not only be connected to the grounding wire through the shielding wire arc 15, but also can be connected to the grounding wire 123 on the side wall of the substrate. connected.

<Fifth Embodiment>

The present invention also provides a circuit board with the aforementioned partitioned electromagnetic shielding module. This circuit board can be used in electronic products such as smartphones and tablets.

<Sixth Embodiment>

The present invention also provides an electronic product with the aforementioned partitioned electromagnetic shielding module. The electronic product may be a smartphone, a tablet computer, a wearable electronic device, an intelligent connected car, and the like.

In multiple embodiments of the present invention, the electromagnetic shielding between chips and components or between chips is realized by bonding wires on the ground connection pads on the back of the flip chip and its surroundings. Through this wire bonding method, the height of the shielding wire arc can be reduced, the packaging quality can be improved, and the difficulty of the process can be simplified. To a certain extent, the space utilization rate of the substrate is improved to meet the requirement of increasing the packaging integration.

The module, preparation method, circuit board and electronic product provided by the present invention are described in detail above. For those of ordinary skill in the art, any obvious changes made to it without departing from the essence of the present invention will constitute an infringement of the patent right of the present invention and will bear corresponding legal responsibilities.

Claims (11)

1. The utility model provides a module of subregion electromagnetic shield, includes base plate, ground connection gasket, flip chip, chip or components and parts, shielding line arc, plastic-sealed body and electromagnetic shield layer, its characterized in that:

the surface of the flip chip remote from the substrate is provided with a solderable wire metal layer,

the ground connection pad is located on the substrate and between the flip chip and the chip or component,

the plastic package body covers the grounding connecting pad, the flip chip, the chip or the component and the shielding wire arc,

the electromagnetic shielding layer is positioned on the surface of the plastic package body,

the shielding wire arc is arranged between the flip chip and the chip or the component, one end of the shielding wire arc is connected with the weldable wire metal layer, and the other end of the shielding wire arc is connected with the electromagnetic shielding layer.

2. The partitioned electromagnetically shielded module of claim 1, wherein:

the shielding wire arcs comprise a first wire arc and a second wire arc, and the first wire arc is connected with the weldable wire metal layer and the electromagnetic shielding layer; the second wire arc is connected with the grounding connecting pad and the electromagnetic shielding layer.

3. The partitioned electromagnetically shielded module of claim 2, wherein:

the wire bondable metal layer covers the entire back surface of the flip chip or covers the outer perimeter of the flip chip.

4. A zoned electromagnetic shielding module according to claim 2, wherein:

the shielding line arc is linear, L-shaped or square.

5. The partitioned electromagnetically shielded module of claim 4, wherein:

when the shielding wire arc is in a linear shape or an L shape, the weldable wire metal layer covers the outer periphery of the flip chip; when the shielding wire arc is in a square shape, the solderable wire metal layer covers the whole back of the flip chip.

6. A preparation method of a partitioned electromagnetic shielding module is characterized by comprising the following steps:

s1: forming a ground connection pad on a substrate;

s2: mounting a flip chip and a chip or a component on a substrate;

s3: forming a solderable wire metal layer on the back surface of the flip chip;

s5: routing between the grounding connecting pad and the weldable metal layer to form a shielding wire arc;

s5: forming a plastic package body on the substrate, and exposing the top end of the shielding wire arc to the surface of the plastic package body;

s6: forming an electromagnetic shielding layer on the back of the plastic package body, so that the electromagnetic shielding layer is electrically connected with the shielding wire arc;

s7: and singulating the substrate.

7. A preparation method of a partitioned electromagnetic shielding module is characterized by comprising the following steps:

s1: forming a ground connection pad on a substrate;

s2: mounting a flip chip and a chip or a component on a substrate;

s3: forming a solderable wire metal layer on the back surface of the flip chip;

s5: routing between the grounding connecting pad and the weldable metal layer to form a shielding wire arc;

s5: forming a plastic package body on the substrate, thinning the plastic package body to cut off the routing to form a shielding line arc and expose the shielding line arc;

s6: forming an electromagnetic shielding layer on the back of the plastic package body, so that the electromagnetic shielding layer is electrically connected with the shielding wire arc;

s7: and cutting the substrate into single pieces.

8. A preparation method of a partitioned electromagnetic shielding module is characterized by comprising the following steps:

s1: forming a ground connection pad on a substrate;

s2: mounting a flip chip and a chip or a component on a substrate;

s3: forming a solderable wire metal layer on the back surface of the flip chip;

s5: routing between the grounding connecting pad and the weldable metal layer to form a shielding wire arc;

s5: forming a plastic package body on the substrate, and exposing the top end of the shielding wire arc to the surface of the plastic package body;

s6: singulating the substrate;

s7: and forming an electromagnetic shielding layer for the single packaging body, and enabling the electromagnetic shielding layer to be electrically connected with the shielding wire arc.

9. A preparation method of a partitioned electromagnetic shielding module is characterized by comprising the following steps:

s1: forming a ground connection pad on a substrate;

s2: mounting a flip chip and a chip or a component on a substrate;

s3: forming a solderable wire metal layer on the back surface of the flip chip;

s5: routing between the grounding connecting pad and the weldable wire metal layer to form a shielding wire arc;

s5: forming a plastic package body on the substrate, thinning the plastic package body to cut off the routing to form a shielding wire arc and expose the shielding wire arc;

s6: singulating the substrate;

s7: and forming an electromagnetic shielding layer for the single packaging body, and enabling the electromagnetic shielding layer to be electrically connected with the shielding wire arc.

10. A circuit board, comprising the partitioned electromagnetically shielded module as claimed in any one of claims 1 to 5.

11. An electronic product, characterized in that it comprises a partitioned electromagnetically shielded module as claimed in any one of claims 1 to 5.

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