CN115811879B - A semiconductor particle mounting device - Google Patents
A semiconductor particle mounting device Download PDFInfo
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- CN115811879B CN115811879B CN202211371412.7A CN202211371412A CN115811879B CN 115811879 B CN115811879 B CN 115811879B CN 202211371412 A CN202211371412 A CN 202211371412A CN 115811879 B CN115811879 B CN 115811879B
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- 239000002245 particle Substances 0.000 title claims abstract description 229
- 239000004065 semiconductor Substances 0.000 title claims abstract description 215
- 230000007246 mechanism Effects 0.000 claims abstract description 212
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 84
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 42
- 230000009471 action Effects 0.000 claims abstract description 6
- 230000001360 synchronised effect Effects 0.000 claims description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 13
- 230000005288 electromagnetic effect Effects 0.000 claims description 4
- 230000002441 reversible effect Effects 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 abstract description 15
- 239000010410 layer Substances 0.000 description 29
- 238000000034 method Methods 0.000 description 22
- 230000008569 process Effects 0.000 description 19
- 239000000463 material Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 9
- 238000001179 sorption measurement Methods 0.000 description 7
- 230000000007 visual effect Effects 0.000 description 5
- 230000005389 magnetism Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 210000004209 hair Anatomy 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本发明公开了一种半导体颗粒的贴装装置，包括：振动导入装置，整列输送装置，所述的整列输送装置包括输送装置和柔性整列排布机构，输送装置包括设置在振动导入装置出口处的输料机构和设置在振动导入装置出口下方的磁吸输送机构，磁吸输送机构中设置有对半导体颗粒镍盖层产生磁吸力的磁吸输送带和整列通道；柔性整列排布机构中设置有对半导体颗粒产生翻转力的柔性整列部件；半导体颗粒在翻转力和磁吸力的作用下其上的镍盖层呈上下位置排布且被整列排布输送；电磁贴装机构，所述的电磁贴装机构包括联动设置的颗粒夹取机构和贴装机构。实现了半导体颗粒整列备料输送装贴的全自动化设计，提高了贴装效率，降低了成本，操作方便，贴装质量高。
The present invention discloses a semiconductor particle mounting device, comprising: a vibration introduction device, an array conveying device, the array conveying device comprising a conveying device and a flexible array arrangement mechanism, the conveying device comprising a feeding mechanism arranged at the outlet of the vibration introduction device and a magnetic suction conveying mechanism arranged below the outlet of the vibration introduction device, the magnetic suction conveying mechanism is provided with a magnetic suction conveying belt and an array channel for generating magnetic attraction to the nickel cover layer of the semiconductor particles; the flexible array arrangement mechanism is provided with a flexible array component for generating a flipping force to the semiconductor particles; the nickel cover layer on the semiconductor particles is arranged in an upper and lower position under the action of the flipping force and the magnetic attraction force and is arranged and transported in an array; an electromagnetic mounting mechanism, the electromagnetic mounting mechanism comprising a particle clamping mechanism and a mounting mechanism arranged in linkage. The fully automated design of semiconductor particle array preparation, conveying and mounting is realized, the mounting efficiency is improved, the cost is reduced, the operation is convenient, and the mounting quality is high.
Description
Technical Field
The invention relates to the technical field of semiconductor refrigeration manufacturing, in particular to a semiconductor particle mounting device which has a column arrangement function and can aim at cube semiconductor particles.
Background
Along with the increase of the miniaturization demand of semiconductor refrigerators, if regular cube semiconductor particles appear in the manufacturing process of small semiconductor refrigerating sheets, the regular cube semiconductor particles are very difficult to be listed in a TRAY (TRAY), hand swing is required to be carried out through manual identification, the particle size is very small and difficult to be identified, suction deficiency can occur when a conventional vacuum suction nozzle is used, the suction nozzle bumps on peripheral semiconductor particles, and the mounted semiconductor particles are easy to bump on, so that the mounting quality is affected.
In the prior art, aiming at the problems of low efficiency and the like of manual electronic component mounting, an automatic mounting device is adopted, but the existing automatic mounting device is mostly mounted by adopting a vacuum suction nozzle adsorption mode, because the cube semiconductor particles are provided with two nickel cover layers, the nickel cover layers cannot be identified by vacuum adsorption, the nickel cover layers are required to be manually placed in advance, and then are adsorbed and mounted through the vacuum suction nozzle, the problem of low efficiency still exists, and the mounted semiconductor particles are easily touched, so that the mounting quality is influenced. The existing technical proposal can not meet the automatic mounting of the cube semiconductor particles with nickel cover layers on both sides.
Therefore, it is highly desirable to design a mounting device capable of performing direction correction arrangement of square semiconductor particles, then electromagnetic adsorption, and automatic mounting without affecting the already mounted semiconductor particles.
Disclosure of Invention
The invention aims to solve the problems of low efficiency, low quality and efficiency of vacuum adsorption mounting and the like of the traditional manual mounting, and provides a mounting device capable of realizing full-automatic mounting of a cubic semiconductor, having high mounting quality and high efficiency, and meeting the requirements of rapid, high-efficiency and high-quality mounting of the cubic semiconductor particles with opposite nickel cover layers of different specifications.
The technical scheme adopted by the invention for realizing the first invention purpose is that the mounting device of the semiconductor particles comprises:
the vibration leading-in device is used for realizing vibration type material guiding of the semiconductor particles;
The whole row conveying device is communicated with the outlet of the vibration leading-in device and is used for arranging the nickel coating layers on the semiconductor particles in a consistent direction and conveying the nickel coating layers after the whole row; the arranging and conveying device comprises a conveying device and a flexible arranging and arranging mechanism, wherein the conveying device comprises a conveying mechanism arranged at the outlet of the vibration leading-in device and a magnetic attraction and conveying mechanism arranged below the outlet of the vibration leading-in device, a magnetic attraction and conveying belt and an arranging channel which generate magnetic attraction for the nickel cover layer of the semiconductor particles are arranged in the magnetic attraction and conveying mechanism, and a flexible arranging component which generates turning force for the semiconductor particles is arranged in an upper-lower position and is arranged and conveyed in an arranging way under the action of the turning force and the magnetic attraction;
the electromagnetic mounting mechanism is arranged at the output end of the whole row of conveying devices and is used for realizing electromagnetic mounting of semiconductor particles, and the electromagnetic mounting mechanism comprises a particle clamping mechanism and a mounting mechanism which are arranged in a linkage manner.
The mounting device of the semiconductor particles is characterized in that a vibration introduction device is arranged, the cubic semiconductor particles are placed into the vibration introduction device before mounting, and are vibrated, so that the cubic semiconductor particles are conveyed downwards in a vibrating mode, at the moment, the cubic semiconductor particles are sequentially vibrated and are conveyed downwards in a one-by-one arrangement mode, but the orientations of nickel cover layers on the cubic semiconductor particles are inconsistent; the magnetic suction conveyer belt and the flexible arranging mechanism are arranged in the arranging conveyer device, the cubic semiconductor particles are sequentially and orderly conveyed from the vibration leading-in device and fall onto the magnetic suction conveyer belt according to a certain time interval, in the falling process, the magnetic attraction of the magnetic suction conveyer belt and the nickel cover layer on the cubic semiconductor particles can generate attraction force, therefore, most of the cubic semiconductor particles can be adsorbed on the magnetic suction conveyer belt in the upper and lower states of the nickel cover layer in the falling process, and part of the cubic semiconductor particles which are not in the upper and lower states of the nickel cover layer can generate friction force between the cubic semiconductor particles and the flexible arranging mechanism in the moving process of the magnetic suction conveyer belt, namely the flexible arranging mechanism generates a friction overturning force on the cubic semiconductor particles, meanwhile, due to the magnetic attraction effect of the magnetic suction conveyer belt, the friction overturning force and the magnetic attraction jointly enable the cubic semiconductor particles which are not in the upper and lower states to be overturned, the nickel cover surface to be finally adsorbed on the magnetic suction conveyer belt, when the cubic semiconductor particles are in the upper and lower states, the cubic semiconductor particles are adsorbed on the magnetic suction conveyer belt, the cubic semiconductor particles are further arranged in the moving along with the magnetic suction conveyer belt in the moving process of the magnetic suction conveyer belt, and the magnetic crystal semiconductor particles are arranged in the magnetic column, and the magnetic column arranging mechanism are arranged in the magnetic column way, and the magnetic arranging mechanism is arranged in the magnetic column way, when the mounting is needed, the mounting mechanism is lifted upwards to be in a state to be mounted, at the moment, the particle clamping mechanism is operated to clamp and drive the cubic semiconductor particles at the outlet of the whole row of channels to move right below the mounting mechanism, when the cubic semiconductor particles move right below the mounting mechanism, the particle clamping mechanism stops moving, at the moment, the mounting mechanism moves downwards to the position above the nickel cover layer of the cubic semiconductor particles to generate magnetic attraction force on the nickel cover layer of the cubic semiconductor particles, and the cubic semiconductor particles are adsorbed on the mounting mechanism to drive the cubic semiconductor particles to move downwards together, and when the cubic semiconductor particles move to the mounting position of the semiconductor refrigeration chip substrate, the cubic semiconductor particles are directly mounted, so that one-time automatic operation of conveying, arranging, clamping and mounting the cubic semiconductor particles is realized. The transfer and mounting rates of the cube semiconductor particles are consistent, and the cycle is reciprocated, so that the mounting efficiency and the mounting quality are effectively improved. According to the semiconductor particle mounting device, for semiconductor particles with different shapes and sizes, the vibration leading-in device and the whole row conveying device can be correspondingly arranged according to the size model of the semiconductor particles, so that the universality design of semiconductor particle mounting is realized, and the mounting cost is greatly reduced.
Preferably, the vibration introducing device comprises a feeding funnel, a vibration motor driving the feeding funnel to vibrate, a conveying pipe communicated with the feeding funnel and a feeding hose connected to the lower end of the conveying pipe, wherein the caliber of the feeding hose is matched with that of the semiconductor particles, and the semiconductor particles can pass through the feeding hose singly and sequentially. The vibration leading-in device drives the feeding hopper to carry out vibration type feeding preferably through the vibration motor, a conveying pipe is arranged below the feeding hopper, the cube semiconductor particles after vibration are sequentially vibrated to the inside of the conveying pipe to be orderly dropped, the lower end of the conveying pipe is connected with a feeding hose, and the cube semiconductor particles enter the feeding hose through the conveying pipe. The purpose of setting up the feed hose is mainly convenient cube semiconductor granule can be extruded by orderly and clearance in proper order through the conveying mechanism who sets up in the feed hose lower extreme to fall on the conveyer belt is inhaled to magnetism.
Preferably, the material conveying mechanism is symmetrically provided with two groups of material conveying gears, the rotation directions of the two groups of material conveying gears are opposite, the distance between tangential lines of the rotation directions of the two groups of material conveying gears is matched with the width of the semiconductor particles, the semiconductor particles are driven to pass through by the opposite rotation force, and the material conveying gears are driven to rotate by a gear power motor and enable the semiconductor particles to fall on the magnetic conveying belt orderly and according to a certain time interval by controlling the rotation speed. The material conveying mechanism is mainly composed of material conveying gears symmetrically arranged on two sides of an outlet of a feeding hose, and the two groups of material conveying gears which are turned reversely drive the cubic semiconductor particles to be sequentially and intermittently output from the feeding hose, so that ordered conveying of the cubic semiconductor particles is realized, enough turnover space of the cubic semiconductor particles falling on a magnetic suction conveying belt is ensured, and all the cubic semiconductor particles are finally distributed in a nickel cover layer up-down state.
Preferably, the magnetic attraction conveying mechanism further comprises a gear driving mechanism and an array channel, the gear driving mechanism comprises an array gear and an array gear driving mechanism, the array gear drives rotation through the array gear driving mechanism and drives the magnetic attraction conveying belt to move, and the array channel comprises an array inclined channel and an array outlet for enabling semiconductor particles to sequentially pass through. The magnetic suction conveying mechanism is further provided with a gear driving mechanism and an array channel, the array gear driving mechanism drives the array gear to rotate, the array gear drives the magnetic suction conveying belt arranged on the array gear to move, the array channel is arranged at the output end of the magnetic suction conveying belt, and the regular cube semiconductor particles sequentially move to the array outlet through an array inclined channel, so that the array outlet is sequentially arranged in an array mode, and the particle clamping mechanism is convenient to clamp sequentially.
Preferably, the flexible alignment part is arranged above the magnetic attraction conveyor belt, and comprises a plurality of flexible alignment fuzzes which are contacted with the semiconductor particles and generate turning friction force with different lengths. The flexible alignment member is disposed above the magnetic attraction conveyor and is spaced from the magnetic attraction conveyor by a distance less than the height of the semiconductor particles so as to generate a frictional flip force upon the semiconductor particles during their movement. The flexible whole-row part is preferably flexible whole-row fuzzes with different lengths, so that the flexible whole-row fuzzes can not hurt the semiconductor particles, and can be contacted with the semiconductor particles and generate overturning friction force, so that the semiconductor particles can be effectively overturned to a state that the nickel cover layer is in an up-down position.
Preferably, the particle clamping mechanism comprises a group of friction driving mechanisms which are arranged at two sides of the output end of the magnetic attraction conveyor belt in a clamping structure, a friction clamping channel is formed between the friction driving mechanisms at two sides, the friction driving mechanism comprises a driving end and a driven end, the driven end is arranged at one end of the magnetic attraction conveyor belt, the driving end is far away from the magnetic attraction conveyor belt, and the driving end rotates relatively outwards and inwards with the driven end as a center. The particle clamping mechanism is used for realizing clamping movement of semiconductor particles, so that in order to ensure that the semiconductor particles are not damaged in the clamping process, a friction driving mechanism is preferred, a friction clamping channel is formed through two groups of friction driving mechanisms, and when the semiconductor particles are clamped, the semiconductor particles are kept motionless by the two friction driving mechanisms, and the friction driving mechanisms move to drive the semiconductor particles to move together. Because the particle clamping mechanism needs to be linked with the mounting mechanism, the friction driving mechanism is provided with a driving end and a driven end, and the driving end can rotate relative to the driven end, so that the clamping and loosening of the semiconductor particles are realized.
Preferably, the friction driving mechanism comprises a friction gear driving mechanism and a friction soft belt, the friction gear driving mechanism comprises a driving mechanism and a driven driving mechanism, the driving mechanism comprises a driving gear and a driving gear driving mechanism, the driving gear driving mechanism comprises a power module for providing power and a moving module for realizing movement, the driven driving mechanism comprises a driven gear, the friction soft belt is wound on the driving gear and the driven gear and is driven to rotate around the driving gear and the driven gear through the driving gear, and the driving gear is arranged in an arc-shaped track limiting groove in a sliding mode. The friction driving mechanism comprises a friction gear driving mechanism and a friction soft belt, wherein the friction gear driving mechanism comprises an active driving mechanism and a passive driving mechanism, an active gear is arranged in the active driving mechanism, a passive gear is arranged in the passive driving mechanism, the active gear is driven by a power module to rotate, the active gear is controlled by a moving module to integrally move, and the power module and the moving module realize the rotation and movement setting of the active driving mechanism, so that the gap setting of a clamping working state and an opening non-working state is realized. The friction soft belt is used for clamping semiconductor particles, and the friction soft belt is driven by the driving gear to rotate around the driven gear and the driving gear so as to drive the clamped semiconductor particles to move. The position of the driving gear is provided with a limiting groove, and the limiting groove is an arc-shaped track to limit the position of the driving gear.
Preferably, the power module comprises a power motor, a power gear connected with the power motor, two synchronous gears arranged on the power gear, and a direction gear meshed with the synchronous gears and driven at the same speed, wherein the direction gear is connected with the driving gear through a connecting shaft, the two synchronous gears are respectively meshed with the two direction gears and are opposite in driving direction, and the moving module comprises a contact block arranged on the connecting shaft and a reset spring connected with the connecting shaft in a pressing mode. The power module is used for providing rotary power for the driving gears, the power motor mainly drives the power gears to rotate, and power is transmitted to two opposite directions through the meshed synchronous gears and the direction gears, so that the two driving gears are driven to rotate reversely, the two driving gears drive the two driven gears to rotate reversely, and the friction soft belt is driven to clamp the semiconductor particles. The moving module realizes outward and inward movement of the driving gear by a contact block and a reset spring on the connecting shaft, when the two friction soft belts are in parallel positions, the semiconductor particles are in direct contact with each other and clamped by the two friction soft belts, and the semiconductor particles are driven to move to the lower part of the electromagnetic mounting mechanism along with the friction soft belts by the friction force of deformation extrusion. And when the two friction soft belts are in a splayed state, the friction soft belts are in a stop state, so that the electromagnetic mounting mechanism is convenient to mount. The contact block can rotate in the horizontal plane under the drive of the connecting shaft, and the return spring can control the direction gear and the driving gear to return.
Preferably, the electromagnetic mounting mechanism comprises a mounting motor, a mounting head assembly and a linkage mechanism, wherein the mounting motor is vertically arranged above the conveying end of the magnetic suction conveying belt, the mounting head assembly is vertically connected to an output shaft of the mounting motor, the mounting head assembly moves up and down under the control of the mounting motor, and the linkage mechanism is connected with the mounting head assembly in a matched mode. The electromagnetic mounting mechanism mainly comprises a mounting motor and a mounting head assembly, the mounting head assembly can move up and down through the driving of the mounting motor, so that electromagnetic adsorption and mounting of semiconductor particles are realized, linkage between clamping and mounting are realized, transfer and mounting speed of the regular cube semiconductor particles in the whole mounting process are consistent, periodic reciprocation is realized, full-automatic mounting is realized, and therefore, a linkage mechanism is further arranged, so that the particle clamping mechanism does not act when the electromagnetic mounting mechanism is mounted, and the particle clamping mechanism acts when the electromagnetic mounting mechanism is mounted, and coordinated linkage between the mechanisms is realized through such arrangement, so that the working efficiency can be effectively improved.
Preferably, the mounting head assembly comprises a mounting head and an inverted trapezoid head arranged at the lower end of the mounting head, an electromagnetic motor for controlling a power switch and the current is arranged in the mounting head, an iron core is fixedly connected to the inside of the trapezoid head, an electric wire is wound on the iron core, the electromagnetic motor forms an electromagnetic effect through the electric wire wound on the outer ring of the iron core, the linkage mechanism comprises a moving block and a pull-down spring connected to the lower end of the moving block, a bump is arranged on the moving block, a stirring block for stirring the bump is arranged on the mounting head corresponding to the bump, and the moving block is in contact with the particle clamping mechanism and drives the particle clamping mechanism to open or close. The mounting head component mainly comprises a mounting head and a trapezoid head, wherein the trapezoid head is arranged to ensure that other semiconductor particles which are already mounted cannot be influenced in the mounting process, and each time of mounting can be guaranteed to be mounted according to a set position. The inside iron core that is provided with the electric wire around being provided with of trapezoidal head, the inside electromagnetic motor that is provided with of mounting head forms electromagnetic effect through electromagnetic motor and the iron core that is provided with the electric wire around, and electromagnetic motor opens and produces the electromagnetic field to adsorb with the nickel coating on the semiconductor particle, realize the removal and the mounting of semiconductor particle. The linkage mechanism mainly comprises a moving block with a lug, a pull-down spring which generates downward tension to the moving block, a poking block is arranged on the mounting head corresponding to the lug on the moving block, the mounting head is abutted against the moving block when moving upwards to the position of the lug on the moving block, so that the moving block is driven to move upwards against the tension of the pull-down spring, the moving block is contacted with the particle clamping mechanism, particularly, is contacted with the contact block in the particle clamping mechanism, the appearance of the moving block is matched with that of the contact block, and the contact block can rotate on a horizontal plane and the two contact blocks are arranged in a front-back symmetrical mode by taking the moving block as a center.
The semiconductor particle mounting device has the beneficial effects that the full-automatic design of the whole row of the cubic semiconductor particles for material preparation, conveying, mounting and mounting is realized. The vacuum suction nozzle has the advantages that the problem that in the prior art, the vacuum suction nozzle is used for adsorbing the semiconductor particles from the tray to the target position on the substrate, the semiconductor particles are directly conveyed from the ballistic type whole-row conveying device, the transferring and moving process of equipment is reduced, the mounting efficiency is improved, the cost is reduced, the operation is convenient, the mounting quality is high, the device integration level is higher, the size is smaller, and the functional compactness is stronger.
Drawings
FIG. 1 is an enlarged view of an orthocube semiconductor particle of the present invention;
fig. 2 is a schematic structural view of a mounting apparatus for semiconductor particles according to the present invention;
FIG. 3 is a partial sectional view of a mounting apparatus for semiconductor particles of the present invention;
FIG. 4 is a schematic illustration of the friction drive mechanism of FIG. 3 in a deactivated state;
FIG. 5 is a schematic illustration of the friction drive mechanism of FIG. 3 in an operative condition;
FIG. 6 is a schematic illustration of the B-B drive gear drive mechanism of FIG. 3 in a deactivated state;
FIG. 7 is a schematic view of the B-B drive gear drive mechanism of FIG. 3 in an operative state
In the figure, 100 parts of cubic semiconductor particles, 101 parts of nickel cover layer, 200 parts of substrate, 201 parts of target position, 300 parts of device main body, 301 parts of conveying channel, 302 parts of preparation cavity, 303 parts of moving cavity, 304 parts of linkage cavity, 305 parts of power cavity;
1. a vibration introducing device 1-1, an outlet of the vibration introducing device;
2. An entire row conveying device 21 and an output end;
3. an electromagnetic mounting mechanism;
4. a material conveying mechanism 41 and a material conveying gear;
5. a magnetic suction conveying mechanism 51, a gear driving mechanism 52 and an entire gear;
6. The magnetic suction conveying belt, 7, an alignment channel, 8, a flexible alignment part, 9, a particle clamping mechanism, 10, an electromagnetic type mounting mechanism, 11, a friction driving mechanism, 13, a friction soft belt, 14, an active driving mechanism, 15, a passive driving mechanism, 16, a driving gear, 17, a power motor, 18, a power gear, 19, a synchronous gear, 20, a direction gear, 22, a connecting shaft, 23, a contact block, 24, a return spring, 25, a passive gear, 26, a mounting motor, 27, a mounting head assembly, 28, a mounting head, 29, a trapezoidal head, 30, an iron core, 31, an electric wire, 32, an electromagnetic motor, 33, a linkage mechanism, 34, a moving block, 35, a pull-down spring, 36, a bump, 37, a toggle block, 38, a mounting tube, 39, a visual identification module, 40 and a limiting groove.
Detailed Description
The various aspects of the invention are described in detail below with reference to particular embodiments and with reference to the accompanying drawings.
Example 1:
In the embodiment shown in fig. 1 and 2, the semiconductor particles of the present invention are cubic semiconductor particles 100, and the semiconductor particles are plated with a nickel cap layer 101 on opposite sides thereof, as shown in fig. 1. A semiconductor pellet mounting apparatus for automatically mounting cubic semiconductor pellets 100 to a target position 201 of a substrate 200 of a semiconductor refrigeration sheet. The semiconductor pellet mounting apparatus includes an integrated apparatus body 300. As shown in fig. 2, a semiconductor particle mounting apparatus includes:
A vibration introducing device 1 for realizing vibration type material guiding of the cubic semiconductor particles;
the whole row conveying device 2 is communicated with the vibration introducing device outlet 1-1 and is used for carrying out consistent arrangement of the orientation of the nickel cover layer 101 on the square semiconductor particles 100 and carrying out whole row after the whole row, the whole row conveying device 2 comprises a conveying device and a flexible whole row arrangement mechanism, the conveying device comprises a conveying mechanism 4 arranged at the vibration introducing device outlet 1-1 and a magnetic suction conveying mechanism 5 arranged below the vibration introducing device outlet 1-1, a magnetic suction conveying belt 6 and a whole row channel 7 which are arranged in the magnetic suction conveying mechanism 5 and are used for generating magnetic suction force on the nickel cover layer 101 of the semiconductor particles, and a flexible whole row component 8 which is used for generating overturning force on the semiconductor particles is arranged at an upper position and a lower position under the action of the overturning force and the magnetic suction force and is arranged in a whole row and is carried out by a ballistic way through the whole row channel;
The electromagnetic mounting mechanism 3 is arranged at the output end 21 of the whole row of conveying devices 2 and is used for realizing electromagnetic mounting of semiconductor particles, and the electromagnetic mounting mechanism 3 comprises a particle clamping mechanism 9 and an electromagnetic mounting mechanism 10 which are arranged in a linkage manner.
The whole row of conveying devices 2 and the electromagnetic mounting mechanisms 3 are integrated in the device main body 300, and the whole device is formed by the vibration leading-in device 1, the whole row of conveying devices 2 and the electromagnetic mounting mechanisms 3, so that the full automation of feeding, conveying and mounting is realized.
The vibration introducing device 1 is used for realizing vibration conveying of square semiconductor particles and specifically comprises a feeding funnel 110, a vibration motor 112 driving the feeding funnel 110 to vibrate, a conveying pipe 111 communicated with the feeding funnel 110, and a feeding hose 113 connected to the lower end of the conveying pipe 111, wherein the caliber of the feeding hose 113 is matched with that of the semiconductor particles, and the semiconductor particles can pass through the feeding hose in sequence. A vibration motor 112 is connected to the feeding funnel 110, and the vibration motor 112 drives the feeding funnel 110 to vibrate, so that the cubic semiconductor particles in the feeding funnel 110 enter the conveying pipe 111 fixedly connected to the lower end of the feeding funnel one by one, and vibration introduction of the cubic semiconductor particles is realized.
The whole column conveying device 2 is arranged in a ballistic column module structure, is connected with the vibration introducing device 1 through a feeding hose 113 and is used for arranging the nickel coating 101 on the cubic semiconductor particles in an up-down position and sequentially conveying the cubic semiconductor particles in a column ballistic manner, and the cubic semiconductor particles sequentially enter the feeding hose 113 from the conveying pipe 111 and enter the feeding hose 113, but the nickel coating 101 on the semiconductor is not uniformly oriented.
The whole row conveying device specifically comprises a conveying device and a flexible whole row arrangement mechanism, the conveying device comprises a conveying mechanism 4 and a magnetic suction conveying mechanism 5, the conveying mechanism 4 is symmetrically arranged at the outlet of the lower end of a feeding hose 113, the width between the conveying mechanisms 4 is the width of square semiconductor particles, the whole row conveying device specifically comprises a conveying gear 41 and a gear power motor for driving the conveying gear to rotate, the conveying gear 41 is symmetrically arranged at the left side and the right side of the outlet of the feeding hose 113, the conveying gear 41 is in left-right tight contact with the outlet of the lower end of the feeding hose 113, the rotation direction is reverse, and when the conveying gear 41 rotates under the driving of the gear power motor, the square semiconductor particles 100 fall into the magnetic suction conveying mechanism 5 from the outlet of the feeding hose 113 under the driving of the conveying gears 41 at two sides. The feed gear 41 can cause the regular cube semiconductor particles 100 to fall onto the magnetic attraction transport mechanism 5 in order and with a certain time gap by controlling the rotation speed.
The magnetic attraction conveying mechanism 5 is arranged inside a conveying channel 301 arranged in the device main body 300, the magnetic attraction conveying mechanism 5 comprises a gear driving mechanism 51, a magnetic attraction conveying belt 6 with magnetism and an array channel 7, the magnetic attraction conveying belt 6 moves in the clockwise direction in the conveying channel 301 under the driving of the gear driving mechanism 51, the magnetic attraction conveying belt 6 with magnetism is arranged right below the outlet of the feeding hose 113, the conveying gear 41 enables the cubic semiconductor particles to orderly fall onto the magnetic attraction conveying belt 6 according to a certain time interval by controlling the rotating speed, and because attraction force is generated by the magnetism of the magnetic attraction conveying belt 6 and the nickel cover layer 101 on the cubic semiconductor particles, the nickel cover layer 101 with high probability of the cubic semiconductor particles in the falling process can appear to fall on the magnetic attraction conveying belt 6, and the magnetic attraction conveying belt 6 moves under the driving of the gear driving mechanism 51, so that the cubic semiconductor particles are driven to move along the moving direction of the magnetic attraction conveying belt 6. The gear driving mechanism 51 comprises an array gear 52 and an array gear driving mechanism, the array gear 52 drives the magnetic attraction conveyor belt 6 to move through the array gear driving mechanism, and the array channel 7 comprises an array inclined channel 71 and a ballistic array outlet 72 for enabling semiconductor particles to pass through in sequence.
The flexible whole-row arrangement mechanism is arranged on the inner wall of the conveying channel 301 above the magnetic attraction conveying belt 6, flexibly contacts with the cubic semiconductor particles in the moving process of the cubic semiconductor particles, and can drive the cubic semiconductor particles which are not adsorbed by the magnetic attraction conveying belt 6 to turn over. The flexible whole row part 8 is arranged above the magnetic attraction conveyor belt 6, and the flexible whole row part 8 comprises a plurality of flexible whole row soft hairs which are contacted with semiconductor particles and generate turning friction force with different lengths. The specific flexible alignment member 8 is provided on the inner wall of the conveying passage 301, forms an alignment fluff turning mechanism above the magnetic attraction conveying belt 6, contacts the cubic semiconductor particles on the magnetic attraction conveying belt, turns over the cubic semiconductor particles which are not oriented vertically by the nickel cap layer 101 by contact friction, aligns all the cubic semiconductor particles on the magnetic attraction conveying belt 6 into a state of being oriented vertically by suction force and friction force, and then is sequentially conveyed.
The alignment passage 7 includes an alignment inclined passage 71 which is inclined and an alignment outlet 72 which is low in height and through which only regular cube semiconductor particles can pass in sequence, the gear drive mechanism 51 is arranged below the alignment outlet 72, and the magnetic attraction conveyor belt 6 is wound on the gear drive mechanism 51 and forms a horizontal movement type magnetic attraction conveyor belt after being driven by the gear drive mechanism 51 to rotate clockwise around the gear drive mechanism 51. The alignment inclined channels 71 are gradually narrowed to form a narrow alignment outlet 72 along with the regular cube semiconductor particles on the magnetic attraction conveyor belt 6.
The electromagnetic mounting mechanism 3 comprises a particle clamping mechanism 9 and an electromagnetic mounting mechanism 10, and the particle clamping mechanism 9 is linked with the electromagnetic mounting mechanism 10.
The particle clamping mechanism 9 comprises a group of friction driving mechanisms 11 which are arranged on two sides of the magnetic attraction conveyor belt 6 in a clamping structure and are used for sequentially clamping the cubic semiconductor particles on the magnetic attraction conveyor belt 6.
As shown in fig. 3, the friction driving mechanism 11 is disposed inside the device main body 300 in the same horizontal direction as the conveying channel 301, and is disposed horizontally, where the friction driving mechanism 11 is disposed symmetrically front and back at the end of the output end of the magnetic attraction conveyor belt 6, one end of the friction driving mechanism 11, which is close to the magnetic attraction conveyor belt 6, is a passive end, one end, which is far away from the magnetic attraction conveyor belt, is an active end, and the active end can rotate relatively outwards and inwards with the passive end as the center, so that the friction driving mechanisms 11 on the front and back sides are in an open-close state. The friction driving mechanism 11 does not act, that is, when the friction driving mechanisms 11 at the front side and the rear side are in an open state, the two driving ends reversely move away from each other, the electromagnetic mounting mechanism 10 acts, when the friction driving mechanisms 11 at the front side and the rear side are in a parallel state, a friction clamping channel is formed between the friction driving mechanisms 11 at the front side and the rear side, as the friction driving mechanisms 11 are in a driving state, the cubic semiconductor particles at the output end of the magnetic conveying belt 6 are clamped between the friction driving mechanisms 11 from the magnetic conveying belt 6, the driven ends of the two friction driving mechanisms are clamped and driven to move in a suspended mode towards the driving ends by friction force, when the electromagnetic mounting mechanism 10 moves to the right below the electromagnetic mounting mechanism 10, the electromagnetic mounting mechanism 10 downwards moves to be adsorbed by the nickel cap layer 101 on the cubic semiconductor particles, and drives the cubic semiconductor particles adsorbed together to downwards move, and at the moment, the friction driving mechanism 11 resets to be in the open state. The electromagnetic mounting mechanism 10 mounts the right cube semiconductor particles at the target position 201 on the substrate 200 directly below, realizing one-time mounting without the need for mounting after shipping by a tray.
As shown in fig. 4 and 5, the friction driving mechanism 11 comprises a friction gear driving mechanism and a friction soft belt 13, the friction gear driving mechanism comprises a driving mechanism 14 and a driven driving mechanism 15, the driving mechanism 14 comprises a driving gear 16 and a driving gear rotating mechanism, the driving gear driving mechanism comprises a power module for providing power and a moving module for realizing movement, as shown in fig. 6 and 7, a power cavity 305 is arranged on a device main body 300, the power module comprises a power motor 17, a power gear 18 connected with the power motor, two synchronous gears 19 arranged on the power gear, and a direction gear 20 meshed with the synchronous gears and driven at the same speed, the direction gear 20 is connected with the driving gear 16 through a connecting shaft 22, the two synchronous gears 19 are respectively meshed with the two direction gears 20 and have opposite driving directions, and the moving module comprises a contact block 23 arranged on the connecting shaft 22 and a reset spring 24 connected with the connecting shaft 22 in a pressing manner. The power gear 18 is disposed within the power chamber 305. The driving gear 16 is slidably disposed on the lower wall of the movable space of the friction soft belt 13, and a limiting groove 40 is disposed on the lower wall, and the limiting groove 40 is a circular arc track to limit the moving position of the driving gear 16.
The passive driving mechanism 15 comprises a passive gear 25, and the friction soft belt 13 is wound on the driving gear 16 and the passive gear 25 and is driven to rotate around the driving gear 16 and the passive gear 25 through the driving gear 16.
The driven gears 25 are arranged on the left side and the right side of the output end of the magnetic attraction conveying belt 6, and the distance between the driven gears 25 on the left side and the right side is matched with the width of the cubic semiconductor particles. The power of the drive gear 16 is provided by a power module. The friction soft belt 13 moves according to the movement of the driving gear 16, and the movement of the driving gear 16 is controlled by the movement module. As shown in fig. 5, when the friction soft belt 13 is in the parallel position, the cubic semiconductor particles are in direct contact with the friction soft belt 13, and the cubic semiconductor particles are driven to move under the electromagnetic mounting mechanism 10 by the friction force of the deforming and pressing.
The device main body 300 is provided with a preparation cavity 302, the preparation cavity 302 is arranged above the running space of the friction soft belt 13, the electromagnetic type mounting mechanism 10 is arranged inside the preparation cavity 302 in a vertically movable mode, the electromagnetic type mounting mechanism 10 comprises a mounting motor 26 and a mounting head assembly 27, the mounting motor 26 is vertically arranged at the top of the preparation cavity 302, the mounting head assembly 27 is vertically connected to an output shaft of the mounting motor 26, and the mounting head assembly 27 can vertically move under the control of the mounting motor 26.
The mounting head assembly 27 comprises a mounting head 28 and an inverted trapezoid head 29 arranged at the lower end of the mounting head, an iron core 30 is fixedly connected inside the trapezoid head 29, an electric wire 31 is wound on the iron core 30, an electromagnetic motor 32 is arranged inside the mounting head, the electromagnetic motor 32 can control a power switch and the current, and the electromagnetic motor 32 forms an electromagnetic effect through the electric wire 31 wound on the outer ring of the iron core 30.
The device also comprises a linkage mechanism 33, wherein the linkage mechanism 33 is arranged in the device main body 300 and is respectively connected with the electromagnetic mounting mechanism 10 and the friction driving mechanism 11, so that the cooperation linkage between the electromagnetic mounting mechanism 10 and the friction driving mechanism 11 is realized. Specifically, a moving cavity 303 is provided on a side wall of the preparation cavity 302 above the friction soft belt 13, and the linkage mechanism 33 is provided inside the moving cavity 303 and can move up and down along the moving cavity 303.
The linkage 33 includes a moving block 34 and a pull-down spring 35. The movable block 34 is slidably disposed in the movable cavity 303, the movable block 34 can move up and down along the movable cavity 303, one end of the pull-down spring 35 is fixed at the lower end of the movable block 34, the other end is fixed at the bottom of the movable cavity 303, and the upper end of the movable block 34 is fixedly connected with a bump 36 extending into the preparation cavity.
The mounting head 28 is fixedly connected with a poking block 37 facing one side of the lug, in the upward movement process of the mounting head 28, the upper surface of the poking block 37 is abutted against the lower surface of the lug 36 when moving to the position of the lug 36, so that the lug 36 is driven to move upward together, the moving block 34 connected with the lug is driven to move upward together against the pulling force of the pull-down spring 35, and when the mounting head 28 moves to the top of the preparation cavity 302, namely, the upper limit position, the upper surface of the poking block 37 is abutted against the lower surface of the lug, and the upper surface of the lug 36 is abutted against the upper cavity wall of the moving cavity 303, so that the movement of the brake block is limited.
A linkage cavity 304 is arranged in the side wall of the moving cavity 303, the contact block 23 on the connecting shaft 22 in the friction driving mechanism 11 is rotatably arranged in the linkage cavity 304, the contact blocks 23 are symmetrically arranged on two sides of the moving block 34 and are contacted with the moving block 34, and the contact blocks 23 can rotate in the horizontal plane. The two contact blocks 23 are symmetrical back and forth by taking the moving block 34 as a symmetrical center, and when the contact ends of the contact blocks 23 and the moving block 34 horizontally rotate, the two contact blocks 23 are concentric and fixed.
The mounting head assembly 27 is slidably disposed inside a mounting tube 38 and can be mounted by extending out along the mounting tube 38, the mounting tube 38 is coaxially disposed with the preparation chamber 302, a visual recognition module 39 is fixedly connected to the outside of the lower end of the mounting tube 38, the visual recognition module 39 performs signal recognition on the mounting process and the position, and visual information is fed back to the mounting device, so that the mounting device is assisted to perform actions, and the mounting position of the cubic semiconductor particles on the substrate 200 is ensured, so that the mounting of the cubic semiconductor particles on the whole substrate is realized.
The semiconductor particle mounting device firstly pours P-type or N-type regular cube semiconductor particles into a feeding hopper, the regular cube semiconductor particles are conveyed into a corresponding-size arranging and conveying device in a rotary vibration mode according to the size of the regular cube semiconductor particles, the regular cube semiconductor particles are arranged into a single row but the directions of nickel cover layers are inconsistent along with the size reduction of a conveying channel, the feeding hose and a discontinuous feeding and conveying gear 41 control the semiconductor particles to orderly fall onto a magnetic attraction conveying belt 6 at intervals, the magnetic attraction conveying belt 6 performs circumferential rotation in a cavity, a fine hair arranging and soft hair overturning mechanism above the magnetic attraction conveying belt 6 forms resistance to the regular cube semiconductor particles with the nickel cover layers not facing upwards, the method comprises the steps of generating overturning force on the cubic semiconductor particles, generating adsorption force on the nickel cover layer by the magnetic attraction conveyor belt, overturning the nickel cover surface on the cubic semiconductor particles towards the magnetic attraction conveyor belt under the action of double forces until the cubic semiconductor particles are overturned and the nickel cover layer is arranged up and down, conveying the nickel cover surface to an output port of the magnetic attraction conveyor belt through the magnetic attraction conveyor belt, namely an electromagnetic mounting port, adjusting suction force by adjusting current size and controlling on and off, and carrying out mounting on the square semiconductor particles through identification and positioning of a camera. Similarly, the method is applicable to semiconductor particles with different shapes and sizes after using pipelines and transfer ports with different sizes.
Specifically, a plurality of different sizes of feeding hoppers 110 may be provided to match various sizes of cubic semiconductor particles, as shown in fig. 2, the cut cubic semiconductor particles are poured into the corresponding feeding hoppers 110, the vibration motor 112 controls the feeding hoppers to vibrate, the cubic semiconductor particles in the feeding hoppers fall into the fine conveying pipes 111, and the size of the conveying pipes 111 is close to the size of the cubic semiconductor particles, so that the cubic semiconductor particles are stacked one by one in continuous vibration. The square semiconductor particles passing through the conveying pipe 111 continue to enter the soft feeding hose 113, the tail end of the feeding hose 113 is controlled by the conveying gear 41, the rotating speed of the conveying gear 41 can control the falling gap of the square semiconductor particles, the square semiconductor particles fall on the magnetic conveying belt 6 from the feeding hose 113, the magnetic conveying belt 6 is driven to rotate clockwise due to clockwise rotation of the alignment gear 52, so that horizontal movement of the magnetic conveying belt 6 is achieved, the nickel cover layer 101 on the upper side and the lower side of the square semiconductor particles can be enabled to be upwards and downwards attracted on the magnetic conveying belt 6 due to the attraction force of the magnetic conveying belt 6 after the square semiconductor particles fall, small parts of the square semiconductor particles can be in an unstable state, the square semiconductor particles move clockwise along with the magnetic conveying belt 6 along with the movement of the magnetic conveying belt 6, the soft square semiconductor particles above the magnetic conveying belt 6 are enabled to rotate clockwise in a rotating mode due to the clockwise rotation of the alignment gear 52, the square semiconductor particles are enabled to be in an unstable state due to the fact that the nickel cover layer 101 on the magnetic conveying belt is not enabled to be in a stable state, and the magnetic carrier tape is enabled to be in a state of being stacked with the square semiconductor particles, and the magnetic carrier tape is enabled to be in a stable state, and the magnetic carrier tape is enabled to be in a state of being in front of the magnetic carrier tape is not to be in a stable state, and the magnetic carrier tape is enabled to be in a state is enabled to be in contact with the magnetic carrier state.
In the mounting process, the mounting motor 26 can control the mounting head 28 to move up and down along the preparation cavity 302 and extend out of the mounting tube 38, as shown in fig. 3, before mounting, the mounting head 28 is controlled by the mounting motor 26 to rise to the top end of the preparation cavity 302, in a state to be mounted, just before the mounting head 28 moves down, friction soft belt 13 moves the cubic semiconductor particles right under the trapezoidal head 29 at the lower end of the mounting head (see fig. 5), at this time, electromagnetic motor 32 is energized, so that suction force is generated at the lower end of the iron core 30, the upper end of the nickel cap layer 101 of the cubic semiconductor particles is adsorbed and clinged to the lower surface of the trapezoidal head 29, then the mounting head 28 is controlled by the mounting motor 26 to move down, the poking block 37 moves along with the mounting head 28 in the process that the mounting head 28 moves down, after the bump 36 arranged on the mounting head is separated from the poking block 37, the upper surface of the poking block 37 is not propped against the lower surface of the protruding block 36, the protruding block 36 and the moving block 34 connected with the protruding block lose support, the moving block moves downwards to the lower limit position of the moving cavity under the resilience force of the pull-down spring 35, in the process of moving the moving block 34 downwards, the front and rear contact blocks 23 propped against the moving block 34 are matched with the front and rear contact blocks 23 due to the external dimension of the moving block 34, at the moment, the front and rear contact blocks 23 are driven by the moving block 34 to move, so that the direction gear 20 and the driving gear 16 are driven to move to a position far away from the axis of the moving block 34, and the direction gear 20 and the driving gear 16 are driven to be in an open state, at the moment, the direction gear 20 and the driving gear 16 lose power, the friction soft belt 13 stops moving, the front and rear friction soft belt 13 is in a splayed open state (see fig. 4), and the driven gear 25 limits the movement of the positive cube semiconductor particles at the front end of the friction soft belt 13 after the friction soft belt 13 rotates. By the aid of the visual recognition module 39, the mounting head 28 moves down to the coordinate height and position to mount and fix the cubic semiconductor particles on the substrate 200, at this time, the electromagnetic motor 32 is powered off, the trapezoidal head 29 loses suction with the cubic semiconductor particles, and the mounting of the cubic semiconductor particles is completed.
When the mounting is completed and the mounting head 28 moves upward, the upper surface of the poking block 37 abuts against the lower surface of the protruding block 36 in the process of upward movement of the mounting head 28, the protruding block and the moving block are driven to move upward to the upper limit position, at this time, the contact block 23 also returns to the initial position due to the return force of the return spring 24 because of the return of the moving block 34, and at this time, the front-rear direction gear 20 is meshed with the synchronous gear 19. In the process, the power motor 17 provides power to control the power gear 18 to rotate, the power gear 18 rotates to drive the synchronous gear 19 to rotate, the synchronous gear 19 rotates after being meshed with the direction gear 20, the front and rear direction gears rotate in opposite directions, the front and rear direction gears drive the driving gear 16 to rotate through the connecting shafts 22 respectively, the driving gear 16 drives the friction soft belt 13 to rotate clockwise, the friction soft belt 13 drives the square semiconductor particles at the front end of the friction soft belt 13 to move to the lower part of the mounting head 28 in a hanging manner due to friction force, and the reciprocating cycle is performed to realize full-automatic mounting, so that the operation is convenient and quick, the efficiency is high, and the mounting is accurate.
The semiconductor particle mounting device replaces the conventional TARY for semiconductor particle preparation and mounting, solves the problems of complex mounting operation, time consumption and the like, and provides a full-automatic design of full-line preparation, conveying and mounting of the regular cube semiconductor particles. The method solves the problem that the vacuum suction nozzle is used for adsorbing semiconductor particles from the tray to the target position (substrate) for mounting in the prior art, and directly conveys the semiconductor particles from the trajectory, so that the transferring and moving process of equipment is reduced, and the mounting efficiency is improved. The electromagnetic adsorption is used for replacing the vacuum suction nozzle, the ultra-micro vacuum suction nozzle with high process cost is replaced in a low-cost mode, the characteristics of semiconductor particles are combined for mounting, the operation is convenient, the mounting quality is improved, and the mounting efficiency is improved. The space of the mounting device is optimized, the device integration level is higher, the volume is smaller, and the functional compactness is stronger.
The embodiments described in the present specification are merely examples of implementation forms of the inventive concept, and the scope of protection of the present invention should not be construed as being limited to the specific forms set forth in the embodiments, but the scope of protection of the present invention and the equivalent technical means that can be conceived by those skilled in the art based on the inventive concept.
Claims (9)
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| SG112893A1 (en) * | 2000-08-22 | 2005-07-28 | Matsushita Electric Industrial Co Ltd | Component mounting apparatus and method |
| JP4901158B2 (en) * | 2005-08-15 | 2012-03-21 | 株式会社アポロ技研 | Parts feeder |
| CN104780717B (en) * | 2015-05-06 | 2019-01-25 | 东莞市捷视电子科技有限公司 | Double-end chip mounter of institutional advancement |
| DE202017001793U1 (en) * | 2016-10-09 | 2018-01-10 | Zynp Corporation | Manufacturing device for burr cylinder liner and burr cylinder liner |
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| CN104070910A (en) * | 2014-07-04 | 2014-10-01 | 佛山科学技术学院 | Monorail automatic paving equipment for multi-color mosaic particles |
| CN113838762A (en) * | 2021-09-06 | 2021-12-24 | 佑光智能半导体科技(深圳)有限公司 | A semiconductor mounting method and semiconductor mounting equipment using the same |
| CN114655637A (en) * | 2022-03-22 | 2022-06-24 | 南通大学 | A boiler feeding device |
| CN217626043U (en) * | 2022-04-25 | 2022-10-21 | 佛山市飞驰自动化设备有限公司 | Forward conveying device for bulb production |
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