Common mode feed mode wide stop band filter based on multilayer LCP technology
Technical Field
The application relates to the field of microwave passive devices, in particular to a common mode feed mode wide stop band filter based on a multilayer LCP technology.
Background
With the explosive development of modern wireless communication technology, patch resonators are being widely studied due to their high power handling capability and low insertion loss. Whereas, since the conventional two design methods can have a large amount of higher order harmonics, the higher order modes can be suppressed by introducing low pass elements, but the overall size of the circuit is increased. A common mode feed mode is provided, and a filter with high performance and wide stop band is designed on the basis of not introducing any additional element by reasonably arranging the positions of metal through holes.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, the application provides a common mode feed mode wide stop band filter based on a multilayer LCP technology, which can be designed to have high performance and wide stop band without introducing any additional elements.
According to the embodiment of the first aspect of the application, the common mode feed mode wide stop band filter based on the multilayer LCP technology comprises a top layer T-shaped junction microstrip feeder, an upper layer square patch resonator, a middle layer metal grounding plate, a lower layer square patch resonator and a bottom layer T-shaped junction microstrip feeder which are sequentially arranged from top to bottom, wherein the top layer T-shaped junction microstrip feeder is connected with the upper layer square patch resonator through a first metal through hole and a second metal through hole, and the bottom layer T-shaped junction microstrip feeder is connected with the lower layer square patch resonator through a third metal through hole and a fourth metal through hole. The top layer T-shaped junction microstrip feeder consists of a first rectangular microstrip line, a second rectangular microstrip line, a third rectangular microstrip line and a fourth rectangular microstrip line, one end of the first rectangular microstrip line is connected with a feed port, the other end of the first rectangular microstrip line is vertically connected with the second rectangular microstrip line, the third rectangular microstrip line and the fourth rectangular microstrip line are respectively connected with two ends of the second rectangular microstrip line, the third rectangular microstrip line and the fourth rectangular microstrip line are parallel, one end of a first metal through hole is connected with the third rectangular microstrip line, the other end of the first metal through hole is connected with the upper layer square patch resonator, one end of the second metal through hole is connected with the fourth rectangular microstrip line, the other end of the second metal through hole is connected with the upper layer square patch resonator, the bottom layer T-shaped junction microstrip line consists of a fifth rectangular microstrip line, a sixth rectangular microstrip line, a seventh rectangular microstrip line and an eighth rectangular microstrip line, one end of the fifth rectangular microstrip line is connected with the feed port, the other end of the fifth rectangular microstrip line is vertically connected with the sixth rectangular microstrip line, the seventh rectangular microstrip line and the seventh microstrip line are respectively connected with the sixth rectangular microstrip line, one end of the seventh microstrip line and the seventh microstrip line is connected with the other end of the seventh microstrip line, the other end of the fourth microstrip line is connected with the fourth microstrip line, the projection of the top layer T-shaped junction microstrip feeder line on the plane of the upper square patch resonator and the projection of the bottom layer T-shaped junction microstrip feeder line on the plane of the upper square patch resonator are symmetrical with respect to a central line of the upper square patch resonator;
The projections of the upper square patch resonator and the lower square patch resonator on the plane of the middle layer metal grounding plate coincide;
And the first rectangular grooves and the second rectangular grooves which are symmetrically distributed are etched on the middle-layer metal grounding plate and are used for coupling and transmitting signals of the upper-layer square patch resonator to the lower-layer square patch resonator.
According to some embodiments of the application, the top layer T-junction microstrip feed line and the bottom layer T-junction microstrip feed line are respectively composed of four rectangular microstrip lines, wherein the top layer T-junction microstrip feed line and the bottom layer T-junction microstrip feed line are symmetrical about a vertical direction AA' symmetry axis.
According to some embodiments of the present application, the middle layer metal grounding plate is etched with two symmetrical rectangular grooves for establishing the coupling between the upper and lower square patch resonators, so as to realize the second order filter response, wherein the upper and lower square patch resonators are symmetrical about the symmetry axes of AA ', BB', and are located at the same position in the vertical direction.
According to some embodiments of the application, the first metal via, the second metal via, the third metal via, and the fourth metal via are all metallized vias.
According to the common mode feed mode wide stop band filter based on the multilayer LCP technology, the common mode feed mode is utilized, the excitation of a high-order mode is avoided through reasonably arranging the positions of metal through holes, and the wide stop band filter is realized.
Compared with the prior art, the patch band-pass filter has the advantages that the excitation of higher harmonic waves is restrained by utilizing the characteristics of the feed structure and the resonance characteristics of the resonance mode of the resonator under the condition that no extra perturbation element is introduced, and the patch band-pass filter with high frequency selectivity and wide stop band restraining property is designed.
Drawings
The application is further described with reference to the accompanying drawings and examples, in which:
fig. 1 is a schematic perspective view of a common mode feeding wide stop band filter based on a multilayer LCP technology according to an embodiment of the present application;
FIG. 2 is a schematic diagram of the dimensions of a top T-junction microstrip feeder structure of a common mode feed mode wide stop band filter based on a multilayer LCP technology according to an embodiment of the present application;
FIG. 3 is a schematic diagram of the structural dimensions of an upper square patch resonator of a common mode feed wide stop band filter based on multilayer LCP technology according to an embodiment of the present application;
FIG. 4 is a schematic structural dimension diagram of an intermediate layer metal grounding plate of a common mode feed mode wide stop band filter based on a multilayer LCP technology according to an embodiment of the present application;
FIG. 5 is a schematic diagram of the structural dimensions of a lower square patch resonator of a common mode feed wide stop band filter based on multilayer LCP technology according to an embodiment of the present application;
FIG. 6 is a schematic diagram showing the dimensions of the bottom structure of a common mode feed wide stop band filter based on a multilayer LCP technology according to an embodiment of the present application;
fig. 7 is a schematic circuit structure layered diagram of a common mode feeding type wide stop band filter based on a multilayer LCP technology according to an embodiment of the present application.
Reference numerals:
The application is further described with reference to the accompanying drawings and examples, in which:
The top layer T-junction microstrip feeder 1, the first rectangular microstrip line 101, the second rectangular microstrip line 102, the third rectangular microstrip line 103, the fourth rectangular microstrip line 104, the upper layer square patch resonator 2, the middle layer metal ground plate 3, the first rectangular slot 301, the second rectangular slot 302, the lower layer square patch resonator 4, the bottom layer T-junction microstrip feeder 5, the fifth rectangular microstrip line 501, the sixth rectangular microstrip line 502, the seventh rectangular microstrip line 503, the eighth rectangular microstrip line 504, the first metal through hole 601, the second metal through hole 602, the third metal through hole 603 and the fourth metal through hole 604.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
In the description of the present application, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present application and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.
In the description of the present application, the meaning of a number is one or more, the meaning of a number is two or more, and greater than, less than, exceeding, etc. are understood to exclude the present number, and the meaning of a number is understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present application, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present application can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
In the description of the present application, the descriptions of the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Embodiment 1a common mode feed mode wide stop band filter based on multilayer LCP technology according to an embodiment of the present application is described below with reference to fig. 1.
As shown in fig. 1, the common mode feed mode wide stop band filter based on the multilayer LCP technology according to the embodiment of the present application includes a top layer T-shape 1, an upper layer square patch resonator 2, a middle layer metal ground plate 3, a lower layer square patch resonator 4, and a bottom layer T-junction microstrip feed line 5 sequentially disposed from top to bottom.
The top layer T-shaped microstrip feeder 1 is connected with the upper layer square patch resonator 2 through a first metal through hole 601 and a second metal through hole 602 for transmitting input signals, and the bottom layer T-shaped microstrip feeder is connected with the lower layer square patch resonator through a third metal through hole 603 and a fourth metal through hole 604 for transmitting output signals.
In some embodiments of the present application, as shown in fig. 2 and 3, the top-layer T-junction microstrip feed line is composed of a first rectangular microstrip line 101, a second rectangular microstrip line 102, a third rectangular microstrip line 103 and a fourth rectangular microstrip line 104, one end of a first metal via 601 is connected to the third rectangular microstrip line 103, the other end is connected to the upper square patch resonator 2, one end of a second metal via 602 is connected to the fourth rectangular microstrip line 104, and the other end is connected to the upper square patch resonator 2.
In some embodiments of the present application, as shown in fig. 3 and 5, since the electric fields of TM 20、TM02、TM21 and TM 22 modes are distributed to be zero and the electric field of TM 01 mode is distributed to be stronger at the positions where the adjacent two sides of the upper square patch resonator 2 and the lower square patch resonator 4 are separated by L1 and L2, the first metal through hole 601 and the second metal through hole 602 are suitable to be placed as input feeder lines, so that the suppression of the higher modes such as TM 20 and TM 02 can be realized, thereby meeting the requirements of the device on wide stop band design.
In some embodiments of the present application, as shown in fig. 4, first rectangular grooves 301 and second rectangular grooves 302 symmetrically distributed are etched on the middle layer metal ground plate 3 for coupling and transmitting signals of the upper layer square patch resonator 2 to the lower layer square patch resonator 4.
In some embodiments of the present application, the LCP core film and adhesive film materials employed have a relative dielectric constant of 3.0 and a loss tangent of 0.0021. In some embodiments of the application, and in conjunction with FIGS. 2-6, the dimensional parameters are as follows (unit: millimeter ):L=20.5,L1=5.25,L2=5.7,l1=8.6,l2=5,l3=2.9,w1=0.7,w2=1.4,w50=1,ls=7.06,ws=0.5,t=10,d=0.6, corresponds to a waveguide length dimension of 0.6λg×0.66 λg, where λg is the length of the waveguide at 4.05GHz (filter center frequency).
The center frequency of the common mode feed mode wide stop band filter based on the multilayer LCP technology is 4.05GHz, and the 3dB passband relative bandwidth is 12.5%. The analog return loss in the passband is better than 22dB and the minimum insertion loss in the passband is better than 1.02dB.
The embodiments of the present application have been described in detail with reference to the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present application. Furthermore, embodiments of the application and features of the embodiments may be combined with each other without conflict.