CN115976617B - Silver plating process method for auxiliary anode and aluminum alloy multi-bend waveguide part - Google Patents
Silver plating process method for auxiliary anode and aluminum alloy multi-bend waveguide part Download PDFInfo
- Publication number
- CN115976617B CN115976617B CN202211478358.6A CN202211478358A CN115976617B CN 115976617 B CN115976617 B CN 115976617B CN 202211478358 A CN202211478358 A CN 202211478358A CN 115976617 B CN115976617 B CN 115976617B
- Authority
- CN
- China
- Prior art keywords
- waveguide
- auxiliary anode
- silver plating
- electrolyte
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007747 plating Methods 0.000 title claims abstract description 110
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 79
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 76
- 239000004332 silver Substances 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims abstract description 58
- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 23
- 239000003792 electrolyte Substances 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- 239000004744 fabric Substances 0.000 claims abstract description 21
- 229920000728 polyester Polymers 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims abstract description 15
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 13
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 10
- 239000011701 zinc Substances 0.000 claims abstract description 10
- 238000007598 dipping method Methods 0.000 claims abstract description 8
- 238000011282 treatment Methods 0.000 claims abstract description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 238000012805 post-processing Methods 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims 1
- 238000009713 electroplating Methods 0.000 abstract description 27
- 238000009941 weaving Methods 0.000 abstract description 3
- 238000004804 winding Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 6
- 238000012797 qualification Methods 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 230000004087 circulation Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000005187 foaming Methods 0.000 description 4
- 229920004933 Terylene® Polymers 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 230000037452 priming Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009954 braiding Methods 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 230000004089 microcirculation Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004649 discoloration prevention Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an auxiliary anode which is a soluble flexible auxiliary anode or an insoluble flexible auxiliary anode, wherein the soluble flexible auxiliary anode comprises a spring and polyester cloth, the spring is formed by winding metal wires of the same type as metal to be plated, the polyester cloth is wrapped on the outer surface of the spring, the insoluble flexible auxiliary anode comprises a wire mesh and polyester cloth, the wire mesh is formed by weaving metal wires of different types as metal to be plated, and the polyester cloth is wrapped on the outer surface of the wire mesh. The invention also discloses a silver plating process method for the aluminum alloy multi-bend waveguide part, which comprises the steps of secondary zinc dipping, chemical nickel plating, copper plating, silver plating and post treatment on the waveguide after chemical nickel plating by using the flexible auxiliary anode, wherein an electrolyte liquid guide tube reciprocates in a waveguide cavity in the silver plating process, and the uniformity of the plating in the cavity is improved. The invention effectively solves the problem of adding the auxiliary anode, and realizes high-quality electroplating of the multi-bend waveguide.
Description
Technical Field
The invention belongs to the technical field of surface engineering, and particularly relates to a silver plating process method for an aluminum alloy multi-bend waveguide part.
Background
The realization of "light weight" of satellite payload products is an important development goal, and very strict requirements are placed on the weight of each stand-alone product. The flangeless waveguide has the advantages of light weight, small occupied space, compact installation and the like, and is more and more widely applied to model products. The flangeless waveguide design is also one of the effective ways to achieve "light weight".
Flangeless waveguides are typically welded from multiple segments of straight waveguides and bent waveguides, as shown in fig. 1. If the surface treatment is performed after the welding forming by adopting a brazing method, the silver plating of the multi-bend waveguide cannot be realized by the existing surface treatment process, so that the sub-waveguide sections can only be welded after silver plating. This results in an increased number of sub-waveguide segments, increased welds, accumulated dimensional accuracy deviations, reduced dimensional accuracy of the waveguide assembly, and reduced production efficiency of flangeless waveguides when the waveguide assembly is disassembled. Due to the soldering principle, only the surface of the part with the coating can be welded, and if the waveguide is to be shaped, the welding of the whole waveguide is also required to be carried out.
Therefore, how to solve the difficult problem of silver plating of long waveguides and multi-bend waveguides, so as to reduce the number of welding clamps of the waveguide assembly, improve the dimensional accuracy of the waveguides, and improve the electrical performance of the waveguide assembly is one of the main contents of the process improvement which is urgently needed at present.
The biggest difficulty of silver plating of the aluminum alloy double-bend (and multi-bend) waveguide is that due to the particularity of the turning structure, the conventional hard auxiliary anode is very difficult to add in the electroplating process, and the turning part in the cavity is tightly attached to the auxiliary anode, so that the problem of plating quality at the part is easy to occur, the solution circulation in the cavity is more difficult, so that the current method cannot ensure the plating quality in the cavity, and the qualification rate is close to zero.
Disclosure of Invention
The invention aims to overcome the defects and provide a silver plating process method for auxiliary anodes and aluminum alloy multi-bend waveguide parts, which solves the technical problem that the conventional auxiliary anodes cannot be effectively added into a waveguide cavity, and realizes high-quality electroplating of the multi-bend waveguide.
In order to achieve the above purpose, the present invention provides the following technical solutions:
an auxiliary anode is a soluble flexible auxiliary anode or an insoluble flexible auxiliary anode;
the soluble flexible auxiliary anode comprises a spring and polyester cloth;
the spring is formed by winding metal wires of the same kind as the metal to be plated, polyester cloth is wrapped on the outer surface of the spring, one end of the spring is led out and then connected to the anode end of a power supply, and the cross section size of the spring is 2-4 mm smaller than the caliber size of the waveguide;
the insoluble flexible auxiliary anode comprises a wire mesh and polyester cloth;
The wire mesh is formed by weaving wires of different types with the wires to be plated, polyester cloth is wrapped on the outer surface of the wire mesh, one end of the wire mesh is led out and then connected to the anode end of a power supply, and the cross section size of the wire mesh is 2-4 mm smaller than the caliber size of the waveguide.
Further, when the metal to be plated is copper or silver, the metal wires used by the spring are red copper wires or pure silver wires respectively, and the metal wires used by the metal wire mesh are platinized titanium wires;
In the platinized titanium wire, the diameter of the titanium wire is 20-50 micrometers, and the thickness of the platinum coating is 1-3 micrometers.
Further, the porosity of the terylene cloth wrapped on the outer surface of the spring or the outer surface of the metal wire mesh is more than or equal to 100 meshes, and the number of layers is more than or equal to 3.
Further, the ratio of the auxiliary anode surface area to the waveguide inner surface area is 0.3-1.2:1.
A silver plating process method for an aluminum alloy multi-bend waveguide part comprises the following steps:
s1, performing secondary zinc dipping treatment on the cleaned waveguide;
S2, carrying out chemical nickel plating on the waveguide subjected to the secondary zinc dipping treatment;
s3, copper plating and silver plating are sequentially carried out on the chemical nickel-plated waveguide by using the auxiliary anode, and the electrolyte catheter reciprocates in the waveguide cavity in the silver plating process;
s4, post-processing is carried out on the silver-plated waveguide.
Further, in the steps S3 of silver plating, copper plating and silver plating, two independently controlled power supplies are adopted to respectively plate the outer surface and the inner surface of the waveguide.
Further, in step S3, the copper plating current density of the inner surface of the waveguide is 1.0A/dm 2～2A/dm2, and the silver plating current density of the inner surface of the waveguide is 0.2A/dm 2～0.4A/dm2. The plating conditions of the outer surface may be the same as those of the inner surface, but if the plating thickness requirements of the inner and outer surfaces are different, the process parameters may be set independently within the process range.
Further, in step S3, the method for making the electrolyte catheter reciprocate in the waveguide cavity is as follows:
the electrolyte liquid guide tube is communicated with the outlet of the electrolyte filter by a pipeline;
Placing an electrolyte liquid guide tube from the first end of the waveguide, pushing the electrolyte liquid guide tube to the second end at intervals of fixed time m until the distance between the opening of the electrolyte liquid guide tube and the second end of the waveguide is less than or equal to l, and then pulling the electrolyte liquid guide tube back to the first end of the waveguide at intervals of fixed time m until the electrolyte liquid guide tube returns to the first end of the waveguide;
and placing the electrolyte liquid guide tube from the second end of the waveguide, pushing the electrolyte liquid guide tube to the first end at intervals of fixed time m until the distance between the orifice of the electrolyte liquid guide tube and the first end of the waveguide is less than or equal to l, and then pulling the electrolyte liquid guide tube back to the second end of the waveguide at intervals of fixed time m until the electrolyte liquid guide tube returns to the second end of the waveguide.
Further, the method comprises the steps of, m=x/(L-8);
x is silver plating total time, the unit is min, L is total length of the waveguide, and the unit is cm;
l=3~5cm;
the flow rate of the electrolyte flowing out of the electrolyte liquid guide tube is 0.5-3L/min.
Further, the auxiliary anode is a soluble flexible auxiliary anode or an insoluble flexible auxiliary anode, and the auxiliary anode is arranged in the waveguide cavity;
the soluble flexible auxiliary anode comprises a spring and polyester cloth;
the spring is formed by winding a copper wire or a pure silver wire, polyester cloth is wrapped on the outer surface of the spring, one end of the spring is led out and then connected to the anode end of a power supply, and the cross section size of the spring is 2-4 mm smaller than the caliber size of the waveguide;
the insoluble flexible auxiliary anode comprises a wire mesh and polyester cloth;
the wire mesh is formed by braiding platinized titanium wires, polyester cloth is wrapped on the outer surface of the wire mesh, one end of the wire mesh is led out and then connected to the anode end of a power supply, and the cross section size of the wire mesh is 2-4 mm smaller than the caliber size of the waveguide.
Further, the thickness of the nickel layer formed in the step S2 is 2-4 μm;
the thickness of the copper layer formed in the step S3 is 2-4 mu m, the thickness of the silver layer is 7-20 mu m, and the thickness of the plating layer can be determined according to requirements.
Compared with the prior art, the invention has at least one of the following beneficial effects:
(1) The invention creatively provides a flexible auxiliary anode which can generate shape-following deformation with the inner cavity of the waveguide, effectively solves the problem of adding the auxiliary anode, and realizes high-quality electroplating of double-bend (multi-bend) waveguides;
(2) The process is easy to control, chemical nickel plating is adopted as a priming layer, an auxiliary anode is combined, solution microcirculation and other measures are adopted, and the electroplating processes inside and outside the waveguide cavity are controlled by adopting a double-electroplating power supply electroplating technology, so that the process control is easier;
(3) The process method is reliable in quality, can effectively improve the quality of the silver coating in the cavity of the double-bend (multi-bend) flangeless waveguide part, has no phenomena of foaming, skinning, falling and the like of the surface coating through a 220 ℃ thermal shock bonding force test, is baked for 30 minutes at 330 ℃, has no skinning and foaming of the coating, and has the non-uniformity of the thickness of the coating in the cavity of less than or equal to 15 percent.
Drawings
FIG. 1 is a schematic diagram of a typical aluminum alloy multi-bend waveguide part;
FIG. 2 is a schematic view of a soluble flexible auxiliary anode of the present invention, wherein (a) is a spring schematic view and (b) is an overall schematic view of the auxiliary anode;
FIG. 3 is a schematic view of a wire mesh in an insoluble flexible auxiliary anode of the present invention;
FIG. 4 is a flow chart of the silver plating process of the aluminum alloy multi-bend waveguide part of the invention;
Fig. 5 is a graph showing the effect of the U-bend waveguide of the present invention after silver plating.
Detailed Description
The features and advantages of the present invention will become more apparent and clear from the following detailed description of the invention.
The word "exemplary" is used herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. Although various aspects of the embodiments are illustrated in the accompanying drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
In the welding production process of the flangeless waveguide assembly, some process and quality problems exist, such as the problems that the brazing rate of part of the clamp is not high, the dimensional accuracy of the flangeless waveguide assembly is insufficient, the electrical performance of part of the flangeless waveguide assembly is not up to standard, and the product welding once qualification rate is only about 70%.
According to the structural characteristics of the flangeless aluminum alloy double-bend or multi-bend waveguide, the invention provides proper pictographic flexible auxiliary anode designed and manufactured during chemical nickel priming and electroplating and circulation measures for increasing solution in the waveguide cavity through researches and experiments, and the electroplating process in the waveguide cavity and the electroplating process outside the cavity are respectively controlled by adopting a double-electroplating power supply electroplating technology, so that the problem that the flangeless waveguide part with double bends (multi-bends) cannot be plated with silver is effectively solved, the plating quality and qualification rate can be greatly improved, and the design requirement is met.
According to the silver plating process for the aluminum alloy double-bend or multi-bend waveguide, silver plating is carried out on the aluminum alloy double-bend or multi-bend waveguide, the quality of appearance, binding force, thickness, weldability, sulfur resistance and the like of the silver plating layer inside and outside a cavity meet the requirements of QJ458-88 silver plating technical conditions, the thickness of the silver plating layer inside the cavity meets the 16-micrometer silver plating thickness requirement, the thickness non-uniformity of the silver plating layer inside the cavity is less than or equal to 15%, and the high temperature resistance of the silver plating layer reaches 330 ℃ per 30min, and the silver plating layer does not peel or foam. The qualification rate of primary electroplating is improved from 0% to more than 90%.
The technical scheme includes that a chemical nickel layer is plated on an aluminum alloy multi-bend flangeless waveguide as a bottom plating layer, damage to a zinc dipping layer on the inner surface of a waveguide cavity when an auxiliary anode is added during copper plating and silver plating is avoided, plating binding force is improved, a pictographic flexible auxiliary anode is designed, manufactured and added in the copper plating and silver plating processes, the ratio of the area of the auxiliary anode to the area of the inner surface of the waveguide cavity is controlled to be 0.3-1.2:1, the quality of the inner plating layer is improved, two electroplating power supplies are adopted and are respectively used for electroplating the outer surface of the waveguide cavity and the inner surface of the cavity, copper plating current density of the inner surface is independently controlled to be 1.0A/dm 2～2A/dm2, silver plating current density is controlled to be 0.2A/dm 2～0.4A/dm2, meanwhile, solution is added in the waveguide cavity in the electroplating process to circulate, and an inner lead-in pipe (electrolyte liquid guide pipe) reciprocates in the waveguide cavity in the silver plating process, so that thickness uniformity of the inner plating layer in the cavity is improved, and the quality of the inner plating layer can be better ensured.
The method for making the ingress pipe reciprocate in the waveguide cavity is that a pipeline and a valve are added at the outlet end of the electrolyte filter through a tee joint and fixed on the inner wall of the plating tank, and the other pipeline still flows into the plating tank in a normal mode. Meanwhile, a plurality of small holes are designed on the newly added pipeline, a nozzle with proper size is arranged on each small hole, a fine soft silica gel tube (liquid guide tube) is arranged on a nozzle opening, and the caliber and the length of the silica gel tube can be adaptively adjusted according to the caliber of the plated waveguide.
When the waveguide is silvered, the outlet end of the silicone tube is put in from one end of the waveguide, and the flow is regulated and controlled by the valve. The catheter is pushed forward for 4cm every m minutes until the catheter opening is about 4cm away from the other end, then the catheter is pulled back and pulled back for 4cm every m minutes, and after the catheter reaches the end, the catheter is taken out and put in from the other end of the catheter, and the catheter is pushed forward and pulled back in the same way. The time m is determined by the length of the waveguide and the required plating time, m=x++l-8, x being the total time (min) for silvering and L being the total length (cm) of the waveguide. It should be noted that the catheter may not reciprocate back and forth within the wave cavity during plating due to the thin copper plating thickness and short time.
The technical core parts of the invention are design and manufacture of pictographic flexible auxiliary anode, dual-power electroplating technology and mobile solution circulation technology.
The auxiliary anode comprises a soluble flexible auxiliary anode or an insoluble flexible auxiliary anode:
as shown in fig. 2, the manufacturing method of the soluble flexible auxiliary anode comprises the following steps:
1) Cleaning red copper wires (for manufacturing copper plating flexible auxiliary anode) and pure silver wires (with purity more than or equal to 99.9%) (for manufacturing silver plating flexible auxiliary anode) by adopting acetone or ethanol soaking or ultrasonic wave to remove oil stains on the surface;
2) Naturally airing the copper wires and the pure silver wires which are soaked and cleaned in the step 1);
3) According to the caliber and the inner cavity size of the waveguide, the copper wire and the pure silver wire in the step 2) are wound into a spring with the caliber of (A- (2-4 mm) × (B- (2-4 mm)), wherein A, B is the caliber size of the waveguide;
4) Leading out one end of the spring in the step 3) in a wire shape, and connecting the spring to the anode end of a power supply;
5) Wrapping the waveguide mouth pictographic spring in the step 4) with clean terylene cloth with the mesh more than or equal to 100 meshes, and at least 3 layers;
6) And (3) adding the flexible copper anode and the flexible silver anode with the waveguide port in the shape of the pictographic spring obtained in the step (5) into the waveguide cavity during copper plating and silver plating respectively.
As shown in fig. 3, the manufacturing method of the insoluble flexible auxiliary anode comprises the following steps:
1) Platinating titanium wires with diameters of 20-50 micrometers to 1-3 micrometers;
2) Braiding the platinized titanium wires in the first step into a net shape, as shown in fig. 2;
3) Selecting a platinum-plated titanium wire mesh (which can be laminated) with proper size (generally less than or equal to 2-4 mm of the waveguide caliber) in the step 2) according to the waveguide caliber and the inner cavity size, binding and leading out one end by using a platinum wire, and connecting the platinum wire mesh to the anode end of a power supply;
4) Removing oil and chemical oil from the platinized titanium wire mesh obtained in the step 3) by adopting an organic solvent, and removing oil stains on the surface of the platinized titanium wire mesh;
5) Wrapping the platinized titanium wire mesh laminated flexible auxiliary anode (the size of which is similar to that of the soluble anode) obtained in the step 4) with clean terylene cloth with the size more than or equal to 100 meshes, and at least 3 layers;
6) And (3) adding the insoluble flexible anode obtained in the step (5) into the waveguide cavity during copper plating and silver plating respectively.
The flexible auxiliary anode is beneficial to the auxiliary anode to deform along with the shape in the waveguide cavity and adapt to the bending of the waveguide cavity, and the polyester cloth in the auxiliary anode has the effects of preventing impurities generated by the dissolution of the auxiliary anode from adhering to the inner wall of the waveguide when the soluble flexible auxiliary anode is used for electroplating, affecting the smoothness and performance of the coating, and avoiding the auxiliary anode from contacting the waveguide in the electroplating process. The reason why the platinized titanium wires are made into the net-shaped structure is that the net-shaped structure is difficult to form due to the large rigidity, but the net-shaped structure can be realized by weaving the platinized micro-wires and has flexibility.
The process method of the invention has the following characteristics:
(1) The difficult problem that the double-bending (multi-bending) waveguide cannot be electroplated is solved.
(2) The technological process is easy to control, chemical nickel plating is adopted as a priming layer, the problem of adding the auxiliary anode can be effectively solved by designing and manufacturing a pictographic flexible auxiliary anode, and simultaneously, measures such as solution microcirculation and the like are adopted for the design in the cavity, and the electroplating process in the waveguide cavity and the electroplating process outside the cavity are controlled by adopting a double electroplating power supply electroplating technology, so that the process control is easier.
(3) The process method is reliable in quality, can effectively improve the quality of the silver coating in the cavity of the double-bend (multi-bend) flangeless waveguide part, has no phenomena of foaming, skinning, falling and the like of the surface coating through a 220 ℃ thermal shock bonding force test, is baked for 30 minutes at 330 ℃, has no skinning and foaming of the coating, and has the non-uniformity of the thickness of the coating in the cavity of less than or equal to 15 percent.
Examples:
The technological process of silver plating of the multi-bend flangeless waveguide is shown in fig. 4, and comprises the following steps:
Pretreatment, namely, pretreatment of aluminum alloy such as organic solvent degreasing, chemical degreasing, alkali corrosion, acid cleaning and the like;
secondary zinc dipping, namely primary zinc dipping, 50% zinc removal and secondary zinc dipping;
chemical nickel plating, namely alkaline chemical nickel plating and acidic chemical nickel plating;
plating silver, copper plating, pre-plating silver and plating silver, wherein in the step, the plating of the inner cavity of the waveguide is realized by using an auxiliary anode, and the plating of the outer surface of the waveguide is realized by using an external anode.
Silver plating post-treatment, drying, dehydrogenation, silver discoloration prevention treatment and packaging.
According to the silver plating process for the aluminum alloy double-bend or multi-bend waveguide, silver plating is carried out on the aluminum alloy double-bend or multi-bend waveguide, the quality of appearance, binding force, thickness, weldability, sulfur resistance and the like of the silver plating layer inside and outside a cavity meet the requirements of QJ458-88 silver plating technical conditions, the thickness of the silver plating layer inside the cavity meets the 16-micrometer silver plating thickness requirement, the thickness non-uniformity of the silver plating layer inside the cavity is less than or equal to 15%, and the high temperature resistance of the silver plating layer reaches 330 ℃ per 30min, and the silver plating layer does not peel or foam. The qualification rate of primary electroplating is improved from 0% to more than 90%. The effect of the waveguide part is shown in fig. 5.
Controlling the ratio of the area of the auxiliary anode to the area of the inner surface of the waveguide cavity to be 0.3-1.2:1;
Two electroplating power supplies are adopted and are respectively used for electroplating the outer surface and the inner surface of the waveguide cavity, copper plating current density is controlled to be 1.2A/dm 2～1.5A/dm2, silver plating current density is controlled to be 0.2A/dm 2～0.4A/dm2, meanwhile, solution is added into the waveguide cavity for circulation in the electroplating process, the flow rate of the solution is 0.5-3L/min, and the solution pouring pipe moves back and forth in the waveguide cavity in a reciprocating manner (generally 4-8 times) in the silver plating process, so that the thickness uniformity of a plating layer in the cavity is improved.
The invention has been described in detail in connection with the specific embodiments and exemplary examples thereof, but such description is not to be construed as limiting the invention. It will be understood by those skilled in the art that various equivalent substitutions, modifications or improvements may be made to the technical solution of the present invention and its embodiments without departing from the spirit and scope of the present invention, and these fall within the scope of the present invention. The scope of the invention is defined by the appended claims.
What is not described in detail in the present specification is a well known technology to those skilled in the art.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211478358.6A CN115976617B (en) | 2022-11-23 | 2022-11-23 | Silver plating process method for auxiliary anode and aluminum alloy multi-bend waveguide part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211478358.6A CN115976617B (en) | 2022-11-23 | 2022-11-23 | Silver plating process method for auxiliary anode and aluminum alloy multi-bend waveguide part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115976617A CN115976617A (en) | 2023-04-18 |
| CN115976617B true CN115976617B (en) | 2024-11-29 |
Family
ID=85971131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211478358.6A Active CN115976617B (en) | 2022-11-23 | 2022-11-23 | Silver plating process method for auxiliary anode and aluminum alloy multi-bend waveguide part |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115976617B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000051998A (en) * | 1999-01-28 | 2000-08-16 | 김계형 | Method of Silver-plating Microwave Band Pass Cavity Filter Products |
| CN202465932U (en) * | 2011-12-27 | 2012-10-03 | 中国航空工业第六○七研究所 | Flexible auxiliary anode for electroplating inner cavity of multi-bend waveguide |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2520009A1 (en) * | 1982-01-21 | 1983-07-22 | France Etat | PROCESS OF INTERNAL CHROMING OF A TUBULAR ELEMENT, ANODE FOR ITS IMPLEMENTATION AND CHROME ELEMENT OBTAINED ACCORDING TO THIS PROCESS |
| EP0423904B1 (en) * | 1986-12-23 | 1993-11-24 | The Whitaker Corporation | Improved anode assembly for selective plating apparatus |
| US5065944A (en) * | 1989-07-27 | 1991-11-19 | D.E.M. Controls Of Canada | Reinforced spray manifold |
| US20040108215A1 (en) * | 2002-12-06 | 2004-06-10 | Com Dev Ltd. | Electroplating anode assembly |
| JP2009024242A (en) * | 2007-07-23 | 2009-02-05 | Mitsubishi Electric Corp | Metal pipe plating apparatus and metal pipe plating method |
| JP5219753B2 (en) * | 2008-11-14 | 2013-06-26 | 中嶋金属株式会社 | Thin tube inner wall plating method |
| JP2013060623A (en) * | 2011-09-13 | 2013-04-04 | Fts:Kk | Auxiliary electrode for plating inner surface of long object |
| US9496522B2 (en) * | 2013-12-13 | 2016-11-15 | Universal Display Corporation | OLED optically coupled to curved substrate |
| CN104562117A (en) * | 2013-10-16 | 2015-04-29 | 瑞安市锐波汽缸制造有限公司 | Electroplating device for inner surface of cylinder |
| KR101365747B1 (en) * | 2013-11-12 | 2014-02-20 | 홍영수 | Electroplating apparatus for plating inner surface of hollow curved metal product and electroplating method of inner surface of hollow curved metal product using the same |
| CN203613285U (en) * | 2013-11-19 | 2014-05-28 | 中国电子科技集团公司第三十八研究所 | Conductive device for waveguide mandrel electroplating |
| CN111048881A (en) * | 2019-12-30 | 2020-04-21 | 南京驰韵科技发展有限公司 | Surface treatment equipment for terahertz waveguide inner cavity |
| CN111934065B (en) * | 2020-06-30 | 2022-03-04 | 西安空间无线电技术研究所 | Broadband abrasion-resistant circular waveguide rotary joint and design method |
| CN112053980A (en) * | 2020-09-28 | 2020-12-08 | 河南理工大学 | A micro-wire connection device |
| CN112575363A (en) * | 2020-11-06 | 2021-03-30 | 仓谷医疗科技(浙江)有限公司 | Diamond lathe needle electroplating device with good electroplating effect and electroplating process thereof |
| CN114635124B (en) * | 2022-03-09 | 2024-03-12 | 中国电子科技集团公司第十四研究所 | Manufacturing method of aluminum alloy small-caliber deep cavity inner surface weldable coating |
-
2022
- 2022-11-23 CN CN202211478358.6A patent/CN115976617B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000051998A (en) * | 1999-01-28 | 2000-08-16 | 김계형 | Method of Silver-plating Microwave Band Pass Cavity Filter Products |
| CN202465932U (en) * | 2011-12-27 | 2012-10-03 | 中国航空工业第六○七研究所 | Flexible auxiliary anode for electroplating inner cavity of multi-bend waveguide |
Non-Patent Citations (2)
| Title |
|---|
| 复杂铜波导的内腔镀银工艺;易伟红等;《表面技术》;20121010;第41卷(第5期);105-107 * |
| 无法兰波导组件焊接质量提升工艺研究;胡 赫等;《航天制造技术》;20231225(第6期);40-44 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115976617A (en) | 2023-04-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202465932U (en) | Flexible auxiliary anode for electroplating inner cavity of multi-bend waveguide | |
| JP5023143B2 (en) | Insulating spacer for inner plating and auxiliary anode unit | |
| CN101565842B (en) | Manufacturing method of copper cladding aluminum conductor using rolling electrodeposition method | |
| CN107824630A (en) | A kind of metal wire, its manufacture method and tire | |
| CN100507065C (en) | Carbon fiber reinforced nickel-based composite material and preparation method thereof | |
| JP6668334B2 (en) | Method and apparatus for the production of metal-coated optical fibers and resulting optical fibers | |
| JP2010285652A (en) | Method and apparatus for plating bus-bar | |
| CN112941513B (en) | Production method of cyanide-free electroplating copper-clad aluminum wire | |
| CN115976617B (en) | Silver plating process method for auxiliary anode and aluminum alloy multi-bend waveguide part | |
| CN114540892A (en) | Surface treatment method of titanium alloy ingot blank | |
| CN102632687A (en) | Method for manufacturing integral wire mesh | |
| CN101812708B (en) | Method for plating chromium on molybdenum core rod | |
| JP6764224B2 (en) | Multiple wall pipe and its manufacturing method | |
| CN104195606B (en) | Thick nickel-iron-tungsten ternary alloy plating layer and preparation method thereof | |
| CN1325953C (en) | metal coated optical fiber | |
| CN1900357B (en) | Process for local chemical plating long pipe surface | |
| CN111197126A (en) | Porous ternary Cu-ZnNi alloy material and preparation method and application thereof | |
| CN201477910U (en) | Tinned copper clad copper metal composite wire | |
| US3511283A (en) | Copper-coated stainless steel tube | |
| CN111979566A (en) | Antenna element surface metallization method | |
| CN112725872B (en) | Device and method for high-speed electrodeposition of metal on continuous carbon fiber surface | |
| CN102615930B (en) | Manufacturing method for printing rotary screen | |
| CN115283944A (en) | Method for manufacturing stainless steel-copper composite thin-walled tube | |
| CN114232042A (en) | Local black nickel electroplating processing technology and processing jig for stainless steel plate | |
| US3546080A (en) | Method of coating stainless steel tube with copper |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |