CN116141808B - Method for producing ceramic copper-clad substrate with pins by using pre-grooved copper plate - Google Patents
Method for producing ceramic copper-clad substrate with pins by using pre-grooved copper plate Download PDFInfo
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- CN116141808B CN116141808B CN202310124262.8A CN202310124262A CN116141808B CN 116141808 B CN116141808 B CN 116141808B CN 202310124262 A CN202310124262 A CN 202310124262A CN 116141808 B CN116141808 B CN 116141808B
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
- B32B2038/047—Perforating
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
本发明涉及预开槽铜板生产带引脚陶瓷覆铜基板的方法，包括以下步骤，将铜片放置在氧化铝基板或者氮化铝基板上，然后进行氧化，铜片与空气接触的表面形成氧化亚铜；然后在铜片上表面开设贯穿两个侧面的引脚孔，在引脚孔内填充阻隔物；翻转铜片倒扣在氮化铝基板或氧化铝基板上，铜片具有氧化亚铜的一面与氮化铝基板或氧化铝基板贴合，进行烧结；在铜片表面设置多个去除区，去除区包括去除一区和去除二区，去除一区水平截面投影位于引脚孔水平截面投影内，去除二区位于两个去除一区之间，去除区去除被铜片上水平截面投影与去除区水平截面投影相重合的铜，最后去除阻隔物形成引脚，本方法能够在不影响铜板与氮化铝基板或氧化铝基板连接牢固性的情况下，加工出铜板的引脚。
The invention relates to a method for producing a ceramic copper-clad substrate with pins by using a pre-grooved copper plate. The method comprises the following steps: placing a copper sheet on an aluminum oxide substrate or an aluminum nitride substrate, and then oxidizing the copper sheet so that cuprous oxide forms on the surface of the copper sheet in contact with air; then opening a pin hole penetrating two side surfaces on the upper surface of the copper sheet, and filling a barrier in the pin hole; turning the copper sheet over and placing it on the aluminum nitride substrate or the aluminum oxide substrate, and a side of the copper sheet with cuprous oxide is bonded to the aluminum nitride substrate or the aluminum oxide substrate for sintering; arranging a plurality of removal areas on the surface of the copper sheet, wherein the removal areas comprise a first removal area and a second removal area, wherein the horizontal cross-sectional projection of the first removal area is located within the horizontal cross-sectional projection of the pin hole, and the second removal area is located between the two first removal areas, and the removal area removes the copper whose horizontal cross-sectional projection on the copper sheet overlaps with the horizontal cross-sectional projection of the removal area, and finally removing the barrier to form a pin. The method can process the pins of the copper sheet without affecting the firmness of the connection between the copper sheet and the aluminum nitride substrate or the aluminum oxide substrate.
Description
Technical Field
The invention belongs to the technical field of aluminum nitride substrates, and particularly relates to a method for producing a ceramic copper-clad substrate with pins by a pre-grooved copper plate.
Background
At present, the manufacturing methods of the aluminum nitride ceramic-based copper-clad plate mainly comprise (1) a direct bonding copper technology (DBC) and (2) a direct copper plating technology (DPC).
The direct bonding copper technology has very strict control requirement on the process temperature, and the copper layer surface can be melted into a eutectic phase only when the temperature is extremely stable within the temperature range of 1050-1090 ℃ so as to realize the tight bonding with the ceramic substrate.
DPC is a copper-clad plate manufacturing technology combining vacuum coating and electroplating technologies, and the principle is that a layer of copper film is deposited on an alumina or aluminum nitride ceramic substrate by utilizing the vacuum coating technology, and then the copper film is thickened by utilizing the electroplating technology. The process temperature of DPC is generally lower than 400 ℃, so that the phenomenon of damage or dimensional variation caused by high temperature to the material is avoided. The DPC ceramic-based copper-clad plate has the advantages of high heat dissipation, high reliability, high precision, low manufacturing cost and the like. The upper limit of the resolution of the metal circuit of the DPC ceramic-based copper-clad plate is about 10-50um (taking the depth-to-width ratio of 1:1 as a standard), and even can be thinner, and the surface flatness is high, so that the DPC ceramic-based copper-clad plate is very suitable for a flip-chip/eutectic process requiring high circuit accuracy and high flatness. However, the use of the electroplating technology causes environmental pollution on the one hand, and on the other hand, the bonding force between the copper film plated by electroplating and the ceramic substrate is not very strong, and micro-pores or holes are generated in the electroplating process.
In the prior art, when the aluminum nitride ceramic-based copper-clad plate is manufactured in two ways, the pin is arranged on the copper plate, the pin is arranged between the pin and the aluminum nitride ceramic-based copper-clad plate, and the connection firmness between the copper plate and the aluminum nitride ceramic-based is possibly affected when the pin is arranged.
Disclosure of Invention
In view of the defects of the prior art, the technical problem to be solved by the invention is to provide a basic method for producing the aluminum nitride ceramic copper-clad with the pins by pre-slotting the copper plate, which can process the pins of the copper plate under the condition of not affecting the connection firmness of the copper plate and the aluminum nitride substrate.
In order to solve the technical problems, the technical scheme adopted by the invention is that the basic method for producing the aluminum nitride ceramic copper-clad with pins by the pre-slotting copper plate comprises the following steps:
s1, placing a copper sheet on an aluminum nitride substrate or an aluminum nitride substrate, and then sintering to form cuprous oxide on the surface of the copper sheet contacted with air;
S2, forming pin holes penetrating through two side surfaces on the upper surface of the copper sheet, and filling barriers in the pin holes;
S3, turning over a copper sheet, reversely buckling the copper sheet on the aluminum nitride substrate or the aluminum oxide substrate, attaching one surface of the copper sheet with cuprous oxide to the aluminum nitride substrate, and performing secondary sintering;
And S4, arranging a plurality of removing areas on the surface of the copper sheet, wherein the removing areas comprise a removing first area and a removing second area, the horizontal section projection of the removing first area is positioned in the horizontal section projection of the pin hole, the removing second area is positioned between the two removing first areas, the copper of which the horizontal section projection on the copper sheet is overlapped with the horizontal section projection of the removing area is removed, and finally, the barrier is removed to form the pin.
Further, the basic method for producing the aluminum nitride ceramic copper-clad with the pins by the pre-slotting copper plate further comprises the steps of S5 and S5 that the easy-to-break slots are formed on the surface of the aluminum nitride substrate, and the horizontal section projection of the easy-to-break slots is positioned in the horizontal plane projection of the pin holes.
Further, in the step S3, the number of the pin holes is plural, and the plural pin holes are arranged at equal intervals along the length direction of the copper sheet.
Further, the barrier in step S2 is a magnesium oxide solid.
In step S5, an easy-breaking groove is formed on the aluminum nitride substrate or the aluminum oxide substrate by laser cutting.
Further, in the step S4, copper, which is formed by overlapping the projection of the horizontal section on the removed copper sheet with the projection of the horizontal section of the removed area, is removed by a developing etching process.
Further, the sintering temperature in the step S1 is 450-600 ℃.
Further, the sintering temperature in the step S2 is 1055-1085 ℃.
Further, in the step S1, the horizontal cross-section projection of the aluminum nitride substrate or the aluminum oxide substrate covers the horizontal cross-section projection of the copper sheet.
Compared with the prior art, the invention has the following beneficial effects:
1. The invention carries out the first sintering by placing the copper sheet on the aluminum nitride substrate or the aluminum nitride substrate, the surface and the peripheral surface of the copper sheet contacting with air form a cuprous oxide layer, then the upper surface of the copper sheet is provided with a plurality of equally spaced pin holes, the bottom surface and the side surface of the pin holes are copper, then the pin holes are filled with barriers, the copper sheet is reversely buckled on the aluminum oxide substrate or the aluminum nitride substrate for sintering, the sintering aims to enable the copper sheet to be sintered and connected with the aluminum oxide substrate or the aluminum nitride substrate, a Cu-Cu 2 O eutectic phase is generated between one surface with cuprous oxide and the aluminum nitride substrate at 1070 ℃ so as to enable the copper sheet and the aluminum nitride substrate to be firmly connected, the barriers are arranged to prevent the copper sheet above the pin holes from being connected with the aluminum nitride substrate, after sintering, developing and etching are carried out on the surface of a copper sheet, copper in the vertical directions of a first area and a second area is removed on the copper sheet, the copper sheet forms pins, a barrier is removed, cutting is carried out from the central line of the pins Kong Zhongxian in the width direction, and an aluminum oxide substrate or an aluminum nitride substrate coated copper sheet with pins is formed. Then the barrier is used for preventing copper above the pin holes from contacting with the ceramic surface during sintering, and then the copper above the pin holes is etched through a developing and etching process, so that the aluminum oxide substrate or aluminum nitride substrate copper-clad sheet with pins is directly formed.
2. The purpose of the barrier is to prevent the copper sheet above the pin holes from being connected to the alumina substrate or aluminum nitride substrate during sintering.
3. The purpose of setting up easily break off the groove is in order to be when using, conveniently will be formed the aluminium oxide base board or the aluminium nitride base board cover copper sheet that have the pin and break off into two along easily breaking off the groove off the fingers and thumb.
4. The removal area is removed by a developing and etching process, so that the method is more accurate and reasonable, and meets the product manufacturing requirements of the aluminum oxide substrate or the aluminum nitride substrate coated copper sheet.
Drawings
FIG. 1 is a schematic cross-sectional view of an aluminum nitride substrate and copper sheet of step S1 of the present invention;
FIG. 2 is a schematic cross-sectional view of the aluminum nitride substrate and copper sheet after the pin grooves are formed in step S2;
FIG. 3 is a schematic cross-sectional view of the aluminum nitride substrate and copper sheet of step S3 of the present invention;
FIG. 4 is a schematic cross-sectional view of the aluminum nitride substrate and copper sheet fabricated in example 1 of the present invention;
FIG. 5 is a schematic cross-sectional view of an aluminum nitride substrate and a copper sheet fabricated in accordance with example 2 of the present invention;
FIG. 6 is a schematic cross-sectional view of an aluminum nitride substrate and a copper sheet after dicing according to embodiment 1 of the present invention;
fig. 7 is a schematic cross-sectional view of the aluminum nitride substrate and the copper sheet after dicing according to embodiment 2 of the present invention.
The drawing comprises a1 aluminum nitride substrate, a 11 easily broken groove, a2 copper sheet, a 21 pin hole, a3 first partition channel, a4 second partition channel and a5 partition object.
Detailed Description
In order to make the above features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.
Examples
As shown in fig. 1-4 and 6, the embodiment provides a method for producing ceramic copper-clad with pins by pre-slotting copper plate, which comprises the following steps:
In the embodiment, an aluminum nitride substrate 1 is adopted, and in step S1, a copper sheet 2 is placed on the aluminum nitride substrate 1, specifically, the horizontal section projection of the aluminum nitride substrate 1 covers the horizontal section projection of the copper sheet 2, then oxidation is carried out, the sintering temperature is 450-600 ℃, the oxidation temperature is 460 ℃ in the embodiment, and cuprous oxide is formed on the surface of the copper sheet 2, which is contacted with air.
Step S2, machining a plurality of pin holes 21 on the upper surface of the copper sheet 2 at equal intervals along the length direction of the copper sheet 2, penetrating the pin holes 21 on two side surfaces, filling the barrier 5 in the pin holes 21, wherein the barrier 5 is made of a material which is not etched by etching liquid, and specifically, the barrier 5 is magnesium oxide.
Step S3, the copper sheet 2 is turned upside down and buckled on the aluminum nitride substrate 1, one surface of the copper sheet 2 with cuprous oxide is attached to the aluminum nitride substrate 1, namely, the openings of the pin holes 21 of the copper sheet 2 and the barrier 5 are attached to the aluminum nitride substrate 1, sintering is carried out, the sintering temperature is 1065-1083 ℃, the second sintering temperature in the embodiment is 1070 ℃, and the purpose of sintering is to enable one surface of the copper sheet 2 with copper oxide pressed to be connected with the aluminum nitride substrate 1.
And S4, arranging a plurality of removing areas on the surface of the copper sheet 2, wherein the removing areas comprise a removing first area and a removing second area, the horizontal section projection of the removing first area is positioned in the horizontal section projection of the pin hole 21, the removing second area is positioned between the two removing first areas, the copper of which the horizontal section projection on the copper sheet 2 is overlapped with the horizontal section projection of the removing area is removed, and finally the barrier 5 is removed to form pins. Specifically, in step S4, a developing etching process is used to remove copper whose horizontal cross-section projection on the copper sheet 2 coincides with the horizontal cross-section projection of the removal region. Firstly cleaning the surface of a copper sheet 2, pasting photoresist on the upper surface of the copper sheet 2, exposing the surface of the photoresist, solidifying after exposure, exposing a removing area, removing an unnecessary photoresist layer on the surface, etching the removing area through etching liquid after drying, removing an area to be etched to a barrier 5, removing copper etched from the area to form a first partition channel 3, removing two areas to be etched to a position where an aluminum nitride substrate 1 can be seen, removing copper etched from the two areas to form a second partition channel 4, using acid copper chloride etching liquid, alkaline copper chloride etching liquid and the like as etching liquid, puffing the residual photoresist layer on the surface of the copper sheet 2 by adopting an acid-base neutralization method, and cleaning the redundant photoresist layer by using clear water and ultrasonic waves.
The copper sheet 2 is placed on the aluminum nitride substrate 1 for oxidation, cuprous oxide is formed on the surface of the copper sheet 2 in contact with air, then a plurality of equally spaced pin holes 21 are formed on the upper surface of the copper sheet 2, copper is arranged on the bottom surface and the side surface of the formed pin holes 21, then a barrier 5 is filled in the pin holes 21, the copper sheet 2 is reversely buckled on the aluminum nitride substrate 1 for sintering, the purpose of sintering is to enable the copper sheet 2 and the aluminum nitride substrate 1 to be sintered and connected together, a Cu-Cu 2 O eutectic phase is generated between one surface with the cuprous oxide and the aluminum nitride substrate 1 at 1070 ℃ so that the copper sheet 2 and the aluminum nitride substrate 1 are firmly connected together, the purpose of arranging the barrier 5 is to prevent the copper sheet 2 above the pin holes 21 from being connected with the aluminum nitride substrate 1, after sintering, copper in the vertical directions of a first area and a second area is removed on the copper sheet 2 is etched, pins are formed on the copper sheet 2, the barrier 5 is removed, and a line in the width direction of the middle line of the pin is cut from the middle line of the copper sheet 2 in the hole 21, and the aluminum nitride substrate 1 with the pins are formed.
Examples
In this embodiment, an aluminum nitride substrate 1 is adopted, as shown in fig. 1-3, 5 and 7, and the difference between embodiment 2 and embodiment 1 is that the sintering temperature in step S1 is 450 degrees celsius, the sintering temperature in step S3 is 1080 degrees celsius, and the embodiment further has step S5, wherein step S5 is performed after step S4, step S5 is that an easy-breaking groove 11 is formed in the lower surface of the aluminum nitride substrate 1, the horizontal section projection of the easy-breaking groove 11 is located in the horizontal projection of the pin hole 21, and specifically, the easy-breaking groove 11 is formed on the aluminum nitride substrate by adopting a laser cutting mode. The purpose of the easy breaking groove 11 is to facilitate breaking the copper clad sheet 2 of the aluminum nitride substrate 1 with the pins into two pieces along the easy breaking groove 11 when the aluminum nitride substrate is to be used, and the aluminum nitride substrate is more convenient and quick. The remaining methods are the same except for the above differences.
The copper sheet 2 is placed on the aluminum nitride substrate 1 for oxidation, cuprous oxide is formed on the surface of the copper sheet 2 in contact with air, then a plurality of equally spaced pin holes 21 are formed on the upper surface of the copper sheet 2, copper is arranged on the bottom surface and the side surface of the formed pin holes 21, then a barrier 5 is filled in the pin holes 21, the copper sheet 2 is reversely buckled on the aluminum nitride substrate 1 for sintering, the sintering aims at enabling the copper sheet 2 and the aluminum nitride substrate 1 to be sintered and connected together, a Cu-Cu 2 O eutectic phase is generated between one surface with the cuprous oxide and the aluminum nitride substrate 1 at 1070 ℃ so that the copper sheet 2 and the aluminum nitride substrate 1 are firmly connected together, the barrier 5 is arranged for preventing the copper sheet 2 above the pin holes 21 from being connected with the aluminum nitride substrate 1, after sintering, copper on the surface of the copper sheet 2 is etched, copper on a first area and a second area is removed in the vertical direction, the barrier 5 is removed, the copper sheet 2 is formed with pins, the pins are cut from the middle line in the width direction of the middle line of the hole 21, the copper sheet 2 is easily cut, the copper sheet 2 with the pins are formed, the copper sheet 1 and the aluminum nitride substrate 1 with the pins are cut off, and then the aluminum nitride substrate 1 is cut by a laser cutting machine, and the aluminum nitride substrate 1 is cut, and the aluminum nitride substrate 11 is cut, and the aluminum nitride substrate is cut by 11 is cut.
While the basic principles and main features of the invention and advantages of the invention have been shown and described, it will be understood by those skilled in the art that the present invention is not limited by the foregoing embodiments, which are described in the foregoing description merely illustrate the principles of the invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined in the appended claims and their equivalents.
Claims (9)
1. The method for producing the ceramic copper-clad substrate with the pins by the pre-grooved copper plate is characterized by comprising the following steps of:
s1, placing a copper sheet on an alumina substrate or an aluminum nitride substrate, and oxidizing to form cuprous oxide on the surface of the copper sheet contacted with air;
S2, forming pin holes penetrating through two side surfaces on the upper surface of the copper sheet, and filling barriers in the pin holes;
s3, turning over a copper sheet, reversely buckling the copper sheet on the aluminum nitride substrate or the aluminum oxide substrate, attaching one surface of the copper sheet with cuprous oxide to the aluminum nitride substrate or the aluminum oxide substrate, and sintering;
And S4, arranging a plurality of removing areas on the surface of the copper sheet, wherein the removing areas comprise a removing first area and a removing second area, the horizontal section projection of the removing first area is positioned in the horizontal section projection of the pin hole, the removing second area is positioned between the two removing first areas, the copper of which the horizontal section projection on the copper sheet is overlapped with the horizontal section projection of the removing area is removed, and finally, the barrier is removed to form the pin.
2. The method for producing a ceramic copper-clad substrate with pins by using a pre-grooved copper plate according to claim 1, wherein the method for producing the ceramic copper-clad substrate with pins by using the pre-grooved copper plate further comprises the step S5, of forming an easy-to-break groove on the surface of an aluminum nitride substrate or an aluminum oxide substrate, wherein the horizontal section projection of the easy-to-break groove is positioned in the horizontal section projection of a pin hole.
3. The method for producing a ceramic copper-clad substrate with pins by using a pre-grooved copper plate as set forth in claim 1, wherein the number of the pin holes in the step S2 is plural, and the plural pin holes are arranged at equal intervals along the length direction of the copper sheet.
4. The method for producing a ceramic copper-clad substrate with pins by using a pre-grooved copper plate according to claim 1, wherein the barrier in the step S2 is a magnesium oxide solid.
5. The method for producing a ceramic copper-clad substrate with pins by using a pre-grooved copper plate as set forth in claim 2, wherein the step S5 is characterized in that an easy-breaking groove is formed in the aluminum nitride substrate or the aluminum oxide substrate by means of laser cutting.
6. The method for producing a ceramic copper-clad substrate with pins by using the pre-grooved copper plate as set forth in claim 1, wherein the step S4 is characterized in that copper with the projection of the horizontal section of the removed copper sheet coincident with the projection of the horizontal section of the removed area is removed by using a developing etching process.
7. The method for producing a ceramic copper-clad substrate with pins by using the pre-grooved copper plate as set forth in claim 1, wherein the oxidation temperature in the step S1 is 450-600 ℃.
8. The method for producing a ceramic copper-clad substrate with pins by using the pre-grooved copper plate as set forth in claim 1, wherein the sintering temperature in the step S3 is 1065-1085 ℃.
9. The method for producing a ceramic copper-clad substrate with pins by using the pre-grooved copper plate as set forth in claim 1, wherein the projection of the horizontal cross section of the aluminum nitride substrate or the aluminum oxide substrate in the step S1 covers the projection of the horizontal cross section of the copper sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310124262.8A CN116141808B (en) | 2023-02-16 | 2023-02-16 | Method for producing ceramic copper-clad substrate with pins by using pre-grooved copper plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310124262.8A CN116141808B (en) | 2023-02-16 | 2023-02-16 | Method for producing ceramic copper-clad substrate with pins by using pre-grooved copper plate |
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| Publication Number | Publication Date |
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| CN116141808A CN116141808A (en) | 2023-05-23 |
| CN116141808B true CN116141808B (en) | 2025-05-16 |
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| CN117939794B (en) * | 2024-03-20 | 2024-05-28 | 大连保税区金宝至电子有限公司 | A processing method for distributed external pin copper-clad ceramic substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103762181A (en) * | 2014-01-02 | 2014-04-30 | 上海申和热磁电子有限公司 | Method for preparing aluminium nitride copper-coated ceramic substrate |
| CN108966382A (en) * | 2018-08-02 | 2018-12-07 | 东莞市东思电子技术有限公司 | Yttrium-doped zirconia heating element for heating non-combustible low-temperature cigarette and manufacturing method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU803053A1 (en) * | 1979-01-11 | 1981-02-07 | Предприятие П/Я М-5921 | Contact couple |
| JP2614171B2 (en) * | 1993-04-30 | 1997-05-28 | フレッシュクエストコーポレーション | Multi-row contact pin and method of manufacturing the same |
| JPH08236938A (en) * | 1995-02-28 | 1996-09-13 | Hitachi Ltd | Copper glass ceramic multilayer wiring board with input / output pins, manufacturing method of copper glass ceramic multilayer wiring board with input / output pins, and copper glass ceramic multilayer wiring board mounting structure with input / output pins |
| DE10017746B4 (en) * | 2000-04-10 | 2005-10-13 | Infineon Technologies Ag | Method for producing an electronic component with microscopically small contact surfaces |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103762181A (en) * | 2014-01-02 | 2014-04-30 | 上海申和热磁电子有限公司 | Method for preparing aluminium nitride copper-coated ceramic substrate |
| CN108966382A (en) * | 2018-08-02 | 2018-12-07 | 东莞市东思电子技术有限公司 | Yttrium-doped zirconia heating element for heating non-combustible low-temperature cigarette and manufacturing method thereof |
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