CN116183973A - Microwave integrated circuit scattering parameter rapid test evaluation circuit and evaluation method - Google Patents
Microwave integrated circuit scattering parameter rapid test evaluation circuit and evaluation method Download PDFInfo
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Abstract
Description
技术领域technical field
本发明涉及属于微波测试技术领域,特别涉及一种微波集成电路散射参数快速测试评估电路及评估方法。The invention relates to the technical field of microwave testing, in particular to a microwave integrated circuit scattering parameter rapid testing and evaluation circuit and evaluation method.
背景技术Background technique
随着微波集成电路及其技术的快速发展,微波集成电路生产制造及应用的品类、数量和规模均呈现快速增长的态势。因此,在其量产制造过程中的测试工作量也越来越大,为其关键特性如散射参数的测试评估效能带来巨大挑战。With the rapid development of microwave integrated circuits and their technologies, the categories, quantities and scales of microwave integrated circuits manufacturing and applications are showing a trend of rapid growth. Therefore, the testing workload in its mass production manufacturing process is also increasing, which brings great challenges to the testing and evaluation performance of its key characteristics such as scattering parameters.
应用传统方法,在进行微波集成电路关键特性如散射参数的测试时,通常采取两种方式:(1)使用矢量网络分析仪并配置定制适配测试夹具的校准件进行相应的测试校准,使得矢量网络分析仪的校准端面和测试端面为同一端面,且为待测微波集成电路相关管脚的测试端面,以此得到待测微波集成电路较为准确的散射参数技术特性指标;(2)在没有定制适配测试夹具的校准件的情况下,需要通过测试得到测试夹具的散射参数特性,然后通过去嵌入的误差修正运算将矢量网络分析仪的校准端面延伸至测试端面,即待测微波集成电路相关管脚的测试端面,以达成与方法(1)相同的效果,并以此得到待测微波集成电路较为准确的散射参数技术特性指标。Using the traditional method, two methods are usually adopted when testing the key characteristics of microwave integrated circuits such as scattering parameters: (1) Use a vector network analyzer and configure a custom-fit calibration piece for the test fixture to perform corresponding test calibration, so that the vector The calibration end face and the test end face of the network analyzer are the same end face, and it is the test end face of the relevant pins of the microwave integrated circuit to be tested, so as to obtain a relatively accurate technical characteristic index of the scattering parameters of the microwave integrated circuit to be tested; (2) without customization In the case of a calibration piece that fits the test fixture, it is necessary to obtain the scattering parameter characteristics of the test fixture through testing, and then extend the calibration end face of the vector network analyzer to the test end face through the error correction operation of de-embedding, that is, the microwave integrated circuit to be tested. The test end face of the pin is used to achieve the same effect as the method (1), and to obtain a relatively accurate technical characteristic index of the scattering parameter of the microwave integrated circuit to be tested.
对于品类繁多的待测微波集成电路及其庞大的量产数量而言,量产产线的应用需求最为关注的是测试时间短、测试效率高以及批次性测试的一致性和稳定性,而非单个待测微波集成电路的关键特性如散射参数的测试结果精确度。基于传统方法,无论是定制适配测试夹具的校准件(含每个校准件差异化的自身指标特性参数数据),还是定制测试夹具并逐一测试其散射参数(大部分测试夹具散射参数的精确获取也依赖于相应适配校准件的定制化实现),在测试成本、测试时间以及相应仪器资源等方面均无法有效满足量产产线的实际应用需求以及微波集成电路生产制造综合能力实现持续提升的相关技术要求。For a wide variety of microwave integrated circuits to be tested and their huge mass production quantities, the application requirements of mass production lines are most concerned with short test time, high test efficiency, and consistency and stability of batch tests. The accuracy of the test results of the key characteristics of non-single microwave integrated circuits to be tested, such as scattering parameters. Based on the traditional method, whether it is customizing the calibration piece that fits the test fixture (including the characteristic parameter data of each calibration piece’s differentiation), or customizing the test fixture and testing its scattering parameters one by one (accurate acquisition of the scattering parameters of most test fixtures It also depends on the customized implementation of the corresponding adaptive calibration parts), which cannot effectively meet the actual application requirements of the mass production line in terms of test cost, test time and corresponding instrument resources, and the continuous improvement of the comprehensive production and manufacturing capabilities of microwave integrated circuits. Relevant technical requirements.
因此,为有效降低由于大量定制适配测试夹具的校准件及其相应操作复杂和大运算量的校准与误差修正等所引入的成本、时间、仪器资源方面的资源无效占用率,同时通过批次性测试评估为生产制造工艺质量和状态的管控提供改进参考,协同支撑微波集成电路生产制造综合能力的持续提升,需要创新提出或形成与实际应用需求相适应的快速测试评估方法与技术。Therefore, in order to effectively reduce the cost, time, and resource invalid occupancy rate of instrument resources introduced by a large number of custom-fit calibration parts for test fixtures and the corresponding complex operation and large-scale calibration and error correction, at the same time, through batch Permanent test evaluation provides reference for improvement in the management and control of manufacturing process quality and status, and supports the continuous improvement of microwave integrated circuit production and manufacturing comprehensive capabilities. It is necessary to innovate or form rapid test evaluation methods and technologies that are suitable for actual application requirements.
发明内容Contents of the invention
为解决上述技术问题,本发明提供了一种微波集成电路散射参数快速测试评估电路及评估方法,以实现对微波集成电路散射参数的快速检测,满足量产应用的需求,并且具有很强的通用性。In order to solve the above technical problems, the present invention provides a microwave integrated circuit scattering parameter rapid test evaluation circuit and evaluation method to realize the rapid detection of microwave integrated circuit scattering parameters, meet the needs of mass production applications, and has a strong universal sex.
为达到上述目的,本发明的技术方案如下:To achieve the above object, the technical scheme of the present invention is as follows:
一种微波集成电路散射参数快速测试评估电路,包括主控计算机、自动化辅助设备、矢量网络分析仪、测试夹具A、测试夹具B和标准微波集成电路;A microwave integrated circuit scattering parameter rapid test evaluation circuit, including a main control computer, automation auxiliary equipment, vector network analyzer, test fixture A, test fixture B and standard microwave integrated circuit;
所述测试夹具A和测试夹具B以组合的方式形成适配单元,分别实现与标准微波集成电路和待测微波集成电路的适配连接,所述测试夹具A和测试夹具B与矢量网络分析仪连接的端面为校准端面,与标准微波集成电路和待测微波集成电路连接的端面为测试端面;The test fixture A and the test fixture B are combined to form an adapter unit, respectively realizing the adaptive connection with the standard microwave integrated circuit and the microwave integrated circuit to be tested, and the test fixture A and the test fixture B are connected with the vector network analyzer The connected end face is the calibration end face, and the end face connected with the standard microwave integrated circuit and the microwave integrated circuit to be tested is the test end face;
所述矢量网络分析仪用于在校准端面进行相应的校准,在测试端面完成在此状态下对标准微波集成电路和待测微波集成电路的散射参数测试和数据获取;The vector network analyzer is used to perform corresponding calibration on the calibration end face, and complete the scattering parameter test and data acquisition of the standard microwave integrated circuit and the microwave integrated circuit to be tested in this state on the test end face;
所述标准微波集成电路与待测微波集成电路型号相同但散射参数已知,为测试评估电路提供散射参数标准数据,并为消除电路自身系统误差和迭代优化获得测试评估的阈值限提供支撑;The model of the standard microwave integrated circuit is the same as that of the microwave integrated circuit to be tested but the scattering parameters are known, which provides standard data of scattering parameters for the test evaluation circuit, and provides support for eliminating the circuit's own system error and iterative optimization to obtain the threshold limit of the test evaluation;
所述自动化辅助设备为标准微波集成电路和待测微波集成电路提供夹持与装载,以满足量产产线的快速高效的测试应用需求;The automation auxiliary equipment provides clamping and loading for the standard microwave integrated circuit and the microwave integrated circuit to be tested, so as to meet the fast and efficient test application requirements of the mass production line;
所述主控计算机,内含软件,是电路的核心和控制中心,根据产线量产应用的测试评估需求,对矢量网络分析仪、适配单元、自动化辅助设备进行一体协同控制,在测试评估前通过测试以及导入标准微波集成电路的标准数据进行计算以消除电路自身系统误差,并迭代优化获得测试评估的阈值限,以在产线量产应用的测试评估时满足待测微波集成电路散射参数的快速获得需求。The main control computer, which contains software, is the core and control center of the circuit. According to the test and evaluation requirements of mass production applications on the production line, it performs integrated coordinated control of the vector network analyzer, adaptation unit, and automation auxiliary equipment. During the test and evaluation Pre-test and import the standard data of standard microwave integrated circuits for calculation to eliminate the system error of the circuit itself, and iterative optimization to obtain the threshold limit of test evaluation, so as to meet the scattering parameters of microwave integrated circuits to be tested in the test evaluation of production line mass production applications quick access to demand.
一种微波集成电路散射参数快速测试评估方法,包括如下过程:A method for quickly testing and evaluating scattering parameters of microwave integrated circuits, including the following process:
(1)在实际应用的测试评估前,主控计算机对矢量网络分析仪、适配单元、自动化辅助设备进行一体协同测控,在矢量网络分析仪和适配单元之间的标准类型接口端面完成相应校准,在此端面形成校准端面;(1) Before the test and evaluation of the actual application, the main control computer conducts an integrated coordinated measurement and control of the vector network analyzer, the adaptation unit, and the automation auxiliary equipment, and completes the corresponding Calibration, forming a calibration end face on this end face;
(2)主控计算机对矢量网络分析仪、适配单元、自动化辅助设备进行一体协同测控,依次逐个将若干标准微波集成电路自动装载于适配单元的测试夹具A和测试夹具B之间进行测试,通过理论分析得到测试评估电路自身的相关影响因子,并通过运算获取测试评估的阈值限;(2) The main control computer conducts an integrated coordinated measurement and control of the vector network analyzer, the adaptation unit, and the automation auxiliary equipment, and automatically loads several standard microwave integrated circuits one by one between the test fixture A and the test fixture B of the adaptation unit for testing , through theoretical analysis to obtain the relevant influencing factors of the test evaluation circuit itself, and obtain the threshold limit of the test evaluation through calculation;
(3)在实际应用的测试评估时,主控计算机对矢量网络分析仪、适配单元、自动化辅助设备进行一体协同测控,依次逐个将待测微波集成电路自动装载于适配单元的测试夹具A和测试夹具B之间进行测试,通过测试结果与阈值限的关系得到实时测试评估结果。(3) During the test and evaluation of practical applications, the main control computer conducts integrated coordinated measurement and control of the vector network analyzer, adaptation unit, and automation auxiliary equipment, and automatically loads the microwave integrated circuits to be tested on the test fixture A of the adaptation unit one by one. The test is performed with the test fixture B, and the real-time test evaluation result is obtained through the relationship between the test result and the threshold limit.
通过上述技术方案,本发明提供的一种微波集成电路散射参数快速测试评估电路及评估方法具有如下有益效果:Through the above technical solution, a microwave integrated circuit scattering parameter rapid test and evaluation circuit and evaluation method provided by the present invention have the following beneficial effects:
1、采用本发明提供的评估电路及评估方法,在进行量产应用的微波集成电路散射参数快速测试评估时,既不需要专门研制并大量生产适配待测微波集成电路测试夹具的校准件,也无需进行基于测试夹具及其附带散射参数特性数据的去嵌入校准及其大运算量校准误差修正,只需要在测试评估前通过测试以及导入标准微波集成电路的标准数据进行计算以消除电路自身系统误差影响,并迭代优化获得测试评估的阈值限(即合格判据),就可以在测试评估时实现“即测即得”的待测微波集成电路散射参数快速检测,有效解决由于大量定制适配测试夹具的校准件及其相应操作复杂和大运算量的校准与误差修正等所引入的成本、时间、仪器资源方面的资源无效占用率问题。本发明提供的方法简便、经济,测试及资源应用效能较高,通用性较强;1. By adopting the evaluation circuit and evaluation method provided by the present invention, when performing rapid test and evaluation of microwave integrated circuit scattering parameters for mass production applications, it is not necessary to specially develop and mass-produce calibration parts suitable for microwave integrated circuit test fixtures to be tested. There is also no need for de-embedded calibration based on the test fixture and its accompanying scattering parameter characteristic data and its large-scale calibration error correction. It only needs to be calculated by testing and importing standard data of standard microwave integrated circuits before the test evaluation to eliminate the circuit itself. Error influence, and iterative optimization to obtain the threshold limit of the test evaluation (i.e. the qualification criterion), can realize the rapid detection of the scattering parameters of the microwave integrated circuit under test "instantly measured and obtained" during the test evaluation, effectively solving the problem caused by a large number of customized adaptations. The cost, time, and resource invalid occupancy rate of instrument resources introduced by the calibration parts of the test fixture and the corresponding complex and computationally intensive calibration and error correction. The method provided by the invention is simple and economical, has high test and resource application efficiency, and strong versatility;
2、采用本发明提供的评估电路及评估方法,能够将微波集成电路散射参数的快速测试评估功能整合融入微波集成电路生产制造的产线综合能力中,实现适应微波集成电路低成本、高效能批量生产制造应用需求和技术要求的集成测控应用,满足微波集成电路的实际量产应用需求对测试工程领域的现实技术要求。2. By adopting the evaluation circuit and evaluation method provided by the present invention, the rapid test and evaluation function of microwave integrated circuit scattering parameters can be integrated into the comprehensive production line capability of microwave integrated circuit manufacturing, and the low-cost, high-efficiency batch of microwave integrated circuits can be realized. The integrated measurement and control application of manufacturing application requirements and technical requirements meets the actual technical requirements of the actual mass production application requirements of microwave integrated circuits in the field of test engineering.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍。In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings that are required in the description of the embodiments or the prior art.
图1为本发明实施例所公开的一种微波集成电路散射参数快速测试评估电路示意图;FIG. 1 is a schematic diagram of a rapid test and evaluation circuit for scattering parameters of a microwave integrated circuit disclosed in an embodiment of the present invention;
图2为适配单元和标准微波集成电路的连接关系图。Fig. 2 is a connection diagram of the adapter unit and the standard microwave integrated circuit.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.
本发明提供了一种微波集成电路散射参数快速测试评估电路,如图1所示,包括主控计算机、自动化辅助设备、矢量网络分析仪、测试夹具A、测试夹具B和标准微波集成电路。The present invention provides a microwave integrated circuit scattering parameter rapid test and evaluation circuit, as shown in Figure 1, including a main control computer, automation auxiliary equipment, vector network analyzer, test fixture A, test fixture B and standard microwave integrated circuits.
测试夹具A和测试夹具B以组合的方式形成适配单元,分别实现与标准微波集成电路和待测微波集成电路的适配连接,只需确保其具有作为测试夹具低反射的良好匹配特性,并与标准微波集成电路和待测微波集成电路可实现良好重复性和可靠性的适配连接即可,而无需通过测试获取其准确的散射参数特性数据。测试夹具A和测试夹具B与矢量网络分析仪连接的端面为校准端面,与标准微波集成电路和待测微波集成电路连接的端面为测试端面。The test fixture A and the test fixture B are combined to form an adapter unit to respectively realize the adaptive connection with the standard microwave integrated circuit and the microwave integrated circuit to be tested. It only needs to ensure that it has good matching characteristics as a test fixture with low reflection, and It only needs to be connected with the standard microwave integrated circuit and the microwave integrated circuit to be tested to achieve good repeatability and reliability, and it is not necessary to obtain its accurate scattering parameter characteristic data through testing. The end faces of test fixture A and test fixture B connected to the vector network analyzer are calibration end faces, and the end faces connected to the standard microwave integrated circuit and the microwave integrated circuit to be tested are test end faces.
矢量网络分析仪用于实现在标准类型接口端面进行相应的校准,在此端面形成校准端面,同时,在测试端面完成在此状态下对标准微波集成电路和待测微波集成电路的散射参数测试和数据获取。The vector network analyzer is used to carry out corresponding calibration on the end face of the standard type interface, and form a calibration end face on this end face. At the same time, the scattering parameter test and measurement of the standard microwave integrated circuit and the microwave integrated circuit to be tested are completed on the test end face in this state. data collection.
标准微波集成电路与待测微波集成电路型号相同但散射参数已知(其散射参数可通过现有的方法精确测得),用作标准件,为快速测试评估电路提供散射参数标准数据,是需要进行产线量产测试评估的待测微波集成电路的技术与指标特性固化的实物载体和对照标准,主要为快速测试评估电路提供标准数据,并为消除快速测试评估电路自身系统误差和迭代优化获得快速测试评估的阈值限(即合格判据)提供支撑。The model of the standard microwave integrated circuit is the same as that of the microwave integrated circuit to be tested, but the scattering parameters are known (the scattering parameters can be accurately measured by existing methods), which are used as standard parts to provide standard data of scattering parameters for the rapid test and evaluation circuit. The solidified physical carrier and reference standard of the technology and index characteristics of the microwave integrated circuit to be tested for production line mass production test and evaluation mainly provide standard data for the rapid test and evaluation circuit, and obtain Threshold limits (i.e. eligibility criteria) for rapid test assessment provide support.
自动化辅助设备为标准微波集成电路和待测微波集成电路提供自动化夹持与装载,以满足量产产线的快速高效的测试应用需求。The automation auxiliary equipment provides automatic clamping and loading for standard microwave integrated circuits and microwave integrated circuits to be tested, so as to meet the fast and efficient test application requirements of mass production lines.
主控计算机,内含软件,是电路的核心和控制中心,根据产线量产应用的测试评估需求,对矢量网络分析仪、适配单元、自动化辅助设备进行一体协同控制,在测试评估前通过测试以及导入标准微波集成电路的标准数据进行计算以消除电路自身系统误差,并迭代优化获得快速测试评估的阈值限,以在产线量产应用的测试评估时满足待测微波集成电路散射参数“即测即得”的快速高效和稳定一致的测试应用需求。The main control computer, which contains software, is the core and control center of the circuit. According to the test and evaluation requirements of mass production applications on the production line, it conducts integrated coordinated control of the vector network analyzer, adaptation unit, and automation auxiliary equipment, and passes the test before the evaluation. Test and import the standard data of standard microwave integrated circuits for calculation to eliminate the system error of the circuit itself, and iteratively optimize the threshold limit for rapid test evaluation to meet the scattering parameters of microwave integrated circuits to be tested during the test evaluation of mass production applications on the production line" Fast, efficient and stable and consistent test application requirements.
一种微波集成电路散射参数快速测试评估方法,包括如下过程:A method for quickly testing and evaluating scattering parameters of microwave integrated circuits, including the following process:
(1)在实际应用的测试评估前,主控计算机对矢量网络分析仪、适配单元、自动化辅助设备进行一体协同测控,在矢量网络分析仪和适配单元之间的标准类型接口端面完成相应校准,在此端面形成校准端面,以便进行后续测试;(1) Before the test and evaluation of the actual application, the main control computer conducts an integrated coordinated measurement and control of the vector network analyzer, the adaptation unit, and the automation auxiliary equipment, and completes the corresponding Calibration, forming a calibration end face on this end face for subsequent testing;
(2)主控计算机对矢量网络分析仪、适配单元、自动化辅助设备进行一体协同测控,依次逐个将若干标准微波集成电路自动装载于适配单元的测试夹具A和测试夹具B之间进行测试,通过理论分析得到测试评估电路自身的相关影响因子(即后面的A、B、C因子),并通过运算获取快速测试评估的阈值限(即合格判据);(2) The main control computer conducts an integrated coordinated measurement and control of the vector network analyzer, the adaptation unit, and the automation auxiliary equipment, and automatically loads several standard microwave integrated circuits one by one between the test fixture A and the test fixture B of the adaptation unit for testing , through theoretical analysis to obtain the relevant influencing factors of the test evaluation circuit itself (ie, the following A, B, C factors), and obtain the threshold limit of the rapid test evaluation (ie, the eligibility criterion) through calculation;
(3)在实际应用的测试评估时,主控计算机对矢量网络分析仪、适配单元、自动化辅助设备进行一体协同测控,依次逐个将待测微波集成电路自动装载于适配单元的测试夹具A和测试夹具B之间进行测试,通过测试结果(此结果并非通过去嵌入等校准与误差修正进行大数据量运算得到的精确数值)与阈值限的关系得到实时测试评估结果。(3) During the test and evaluation of practical applications, the main control computer conducts integrated coordinated measurement and control of the vector network analyzer, adaptation unit, and automation auxiliary equipment, and automatically loads the microwave integrated circuits to be tested on the test fixture A of the adaptation unit one by one. The test is carried out with the test fixture B, and the real-time test evaluation result is obtained through the relationship between the test result (this result is not an accurate value obtained through large data volume calculations such as de-embedding and error correction) and the threshold limit.
如图2所示,本发明对待测微波集成电路(下述待测件)测试时,使用标准微波集成电路(下述标准件)消除测试评估电路自身系统误差和迭代优化获得快速测试评估阈值限(即合格判据)的理论分析如下:As shown in Figure 2, when the microwave integrated circuit to be tested (the following DUT) is tested in the present invention, the standard microwave integrated circuit (the following standard part) is used to eliminate the system error of the test evaluation circuit itself and iterative optimization to obtain the fast test evaluation threshold limit (i.e. the eligibility criteria) theoretical analysis is as follows:
测试夹具A四个散射参数(自身特性)分别为: The four scattering parameters (self-characteristics) of test fixture A are:
测试夹具B四个散射参数(自身特性)分别为: The four scattering parameters (self-characteristics) of test fixture B are:
以上两项为适配单元(测试夹具A、测试夹具B)的自身散射参数特性数据,无需提前获取。The above two items are characteristic data of the self-scattering parameters of the adapter unit (test fixture A, test fixture B), and do not need to be obtained in advance.
待测件四个散射参数(自身特性)分别为: The four scattering parameters (properties) of the DUT are:
标准件四个散射参数(自身特性)分别为: The four scattering parameters (self-characteristics) of standard parts are:
以上两项为标准件和待测件的自身散射参数特性数据,一个为提前已知,一个为测试评估后得到。The above two items are the characteristic data of the scattering parameters of the standard part and the test part, one is known in advance, and the other is obtained after the test evaluation.
测试夹具A和标准件级联组合的等效二端口网络的四个散射参数分别为:The four scattering parameters of the equivalent two-port network of the cascaded combination of test fixture A and standard components are:
测试夹具A和待测件级联组合的等效二端口网络的四个散射参数分别为:The four scattering parameters of the equivalent two-port network of the cascaded combination of test fixture A and the DUT are:
测试夹具A、标准件和测试夹具B级联组合的等效二端口网络的四个散射参数分别为:The four scattering parameters of the equivalent two-port network of the cascaded combination of test fixture A, standard parts and test fixture B are:
测试夹具A、待测件和测试夹具B级联组合的等效二端口网络的四个散射参数分别为:The four scattering parameters of the equivalent two-port network of the cascaded combination of test fixture A, DUT and test fixture B are:
以上四项为中间过程的等效推导所需,无需提前获取。The above four items are required for the equivalent derivation of the intermediate process and do not need to be obtained in advance.
将标准件装载于测试夹具A和测试夹具B中进行测试得到的四个散射参数(测试结果)分别为: The four scattering parameters (test results) obtained by loading the standard parts in the test fixture A and test fixture B for testing are respectively:
将待测件装载于测试夹具A和测试夹具B中进行测试得到的四个散射参数(测试结果)分别为: The four scattering parameters (test results) obtained by loading the test piece in the test fixture A and the test fixture B for testing are respectively:
以上两项为测试评估过程中的两次测试结果,需要在测试评估时获取,并以此实时得到待测件的测试评估结果。The above two items are the two test results in the test evaluation process, which need to be obtained during the test evaluation, and the test evaluation results of the DUT can be obtained in real time.
将标准件或待测件和测试夹具A等效为一个二端口网络,根据网络级联公式可以得到等效二端口网络的散射参数如下:The standard or DUT and test fixture A are equivalent to a two-port network, and the scattering parameters of the equivalent two-port network can be obtained according to the network cascading formula as follows:
再将测试夹具B接入进行散射参数测试,根据网络级联公式可以得到包含测试夹具A、标准件和测试夹具B在内的等效二端口网络的散射参数如下:Then connect the test fixture B to test the scattering parameters. According to the network cascading formula, the scattering parameters of the equivalent two-port network including test fixture A, standard parts and test fixture B can be obtained as follows:
而/> And />
而/> And />
而/> And />
同理,将待测件替换标准件进行散射参数的测试,根据网络级联公式可以得到包含测试夹具A、待测件和测试夹具B在内的等效二端口网络的散射参数如下:Similarly, replace the standard part with the DUT to test the scattering parameters. According to the network cascading formula, the scattering parameters of the equivalent two-port network including the test fixture A, the DUT and the test fixture B can be obtained as follows:
而/> And />
而/> And />
而/> And />
由于在测试评估过程中保持使用测试夹具A和测试夹具B不变,因此其散射参数(如)可视为不变的常量。Since the use of test fixture A and test fixture B remains unchanged during the test evaluation process, its scattering parameters (such as ) can be regarded as an immutable constant.
因此,采用比照标准件的归一化数据处理,我们可以得到:Therefore, using the normalized data processing compared with the standard parts, we can get:
其中, in,
通过运算可以得到正向和反向传输散射参数的归一化处理结果分别如下:The normalized processing results of the forward and reverse transmission scattering parameters can be obtained by operation as follows:
令则有/> make then there />
而 and
采用上述测试标准件和待测件的方法,分别对多个标准件(含散射参数特性数据)进行测试,根据上述公式将得到的测试结果和各标准件散射参数特性数据代入进行计算并进行数据拟合,即可得到包含测试评估电路自身影响在内的A因子。Using the above-mentioned method of testing standard parts and parts to be tested, test multiple standard parts (including scattering parameter characteristic data) respectively, and substitute the obtained test results and scattering parameter characteristic data of each standard part into calculation and data processing according to the above formula Fitting, the A factor including the influence of the test and evaluation circuit itself can be obtained.
由此,在实际应用的测试评估时,我们根据标准件的散射参数测试结果和待测件的散射参数测试结果/>和/>标准件的散射参数特性数据/>和标准件散射参数特性的上下限Δ以及包含测试评估电路自身影响在内的A因子,即可以得到待测微波集成电路(待测件)快速测试评估的阈值限(即合格判据)为和/>只要正向和反向传输散射参数在此阈值限内就是合格品,其去除测试影响的测试结果也可以根据标准件的散射参数特性数据加以运算得到。Therefore, in the actual application test evaluation, we test the results according to the scattering parameters of the standard parts and Scattering parameter test results of the DUT/> and /> Scattering parameter characteristic data of standard parts/> and The upper and lower limits Δ of the scattering parameter characteristics of the standard part and the A factor including the influence of the test evaluation circuit itself, that is, the threshold limit (i.e. the qualification criterion) for the rapid test evaluation of the microwave integrated circuit (DUT) to be tested can be obtained as and /> As long as the forward and reverse transmission scattering parameters are within this threshold limit, it is a qualified product, and the test results of removing the test influence can also be calculated according to the characteristic data of the scattering parameters of the standard parts.
同时,我们可以对正向和反向反射散射参数进行归一化处理如下:At the same time, we can normalize the forward and back reflection scattering parameters as follows:
其中,in,
略去相对影响较小因素项,可以得到正向和反向反射散射参数的归一化近似结果为:By ignoring the relatively small influencing factors, the normalized approximation results of the forward and reverse reflective scattering parameters can be obtained as follows:
令/>则有 order /> then there is
令/>则有 order /> then there is
采用上述测试标准件和待测件的方法,分别对多个标准件(含散射参数特性数据)进行测试,根据上述公式将得到的测试结果和各标准件散射参数特性数据代入进行计算并进行数据拟合,即可得到包含测试评估电路自身影响在内的B因子和C因子。Using the above-mentioned method of testing standard parts and parts to be tested, test multiple standard parts (including scattering parameter characteristic data) respectively, and substitute the obtained test results and scattering parameter characteristic data of each standard part into calculation and data processing according to the above formula Fitting, the B factor and C factor including the influence of the test and evaluation circuit itself can be obtained.
由此,在实际应用的测试评估时,我们根据标准件的散射参数测试结果和待测件的散射参数测试结果/>和/>标准件的散射参数特性数据/>和标准件散射参数特性的上下限Δ以及包含测试评估电路自身影响在内的B因子和C因子,即可以得到待测微波集成电路(待测件)快速测试评估的阈值限(即合格判据)分别为以及/>只要正向和反向反射散射参数在此阈值限内就是合格品,其去除测试影响的测试结果也可以根据标准件的散射参数特性数据加以运算得到。Therefore, in the actual application test evaluation, we test the results according to the scattering parameters of the standard parts and Scattering parameter test results of the DUT/> and /> Scattering parameter characteristic data of standard parts/> and The upper and lower limits Δ of the scattering parameter characteristics of the standard part and the B factor and C factor including the influence of the test and evaluation circuit itself, that is, the threshold limit for the rapid test evaluation of the microwave integrated circuit (device under test) to be tested (that is, the qualification criterion) can be obtained respectively and /> As long as the forward and reverse reflective scattering parameters are within the threshold limit, it is a qualified product, and the test results of removing the test influence can also be calculated according to the characteristic data of the scattering parameters of the standard parts.
由于本发明适用于量产应用的微波集成电路散射参数快速测试评估方法及电路可以在测试评估前通过对若干标准件(即产线量产测试评估的待测微波集成电路技术与指标特性固化的实物载体和对照标准)的测试,并结合其散射参数特性数据,能够获取测试评估电路自身的相关影响因子(如上述A、B、C因子)以及阈值限(即合格判据)。因此,只要本发明散射参数快速测试评估电路在实际测试评估时控制主控计算机对矢量网络分析仪、适配单元、自动化辅助设备进行一体协同测控,即能够通过获取的待测件测试结果(此结果并非通过去嵌入等校准与误差修正进行大运算量得到的精确数值)实时判定其散射参数的合格性,以满足待测微波集成电路散射参数“即测即得”的快速高效和稳定一致的测试应用需求,并有效解决由于大量定制适配测试夹具的校准件及其相应操作复杂和大运算量的校准与误差修正等所引入的成本、时间、仪器资源方面的资源无效占用率问题,以通用化的方式提供适应快速高效和稳定一致量产产线制造需求的微波集成电路散射参数快速测试评估的解决方案。Because the microwave integrated circuit scattering parameter rapid test and evaluation method and circuit suitable for mass production applications of the present invention can pass the solidification of the microwave integrated circuit technology and index characteristics of several standard parts (that is, the microwave integrated circuit technology and index characteristics of the mass production test evaluation of the production line) before the test evaluation Physical carrier and reference standard) test, combined with its scattering parameter characteristic data, can obtain the relevant influence factors of the test evaluation circuit itself (such as the above-mentioned A, B, C factors) and the threshold limit (that is, the qualification criterion). Therefore, as long as the scattering parameter rapid test evaluation circuit of the present invention controls the main control computer to carry out integrated coordinated measurement and control of the vector network analyzer, the adaptation unit, and the automation auxiliary equipment during the actual test evaluation, the obtained test results of the DUT (this The result is not an accurate value obtained by a large amount of calculations such as de-embedding calibration and error correction) to determine the qualification of its scattering parameters in real time, so as to meet the fast, efficient, stable and consistent requirements of "instant measurement" of the scattering parameters of the microwave integrated circuit to be tested. Test application requirements, and effectively solve the problem of cost, time, and resource invalid occupancy of instrument resources introduced by a large number of custom-fit calibration parts for test fixtures and their corresponding complex operations and large-scale calibration and error correction. The generalized method provides a solution for rapid testing and evaluation of microwave integrated circuit scattering parameters that meet the requirements of fast, efficient and stable mass production line manufacturing.
对所公开的实施例的上述说明,使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的,本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下,在其它实施例中实现。因此,本发明将不会被限制于本文所示的这些实施例,而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050046435A1 (en) * | 2003-08-26 | 2005-03-03 | Mitsubishi Denki Kabushiki Kaisha | Method and apparatus for evaluating and adjusting microwave integrated circuit |
| CN101479614A (en) * | 2006-07-03 | 2009-07-08 | 罗森伯格高频技术有限及两合公司 | High-frequency measuring device, method for calibrating such a device and method for determining a scattering parameter using such a high-frequency measuring device |
| CN107861050A (en) * | 2017-11-13 | 2018-03-30 | 中国电子科技集团公司第四十研究所 | A kind of method that On-wafer measurement is carried out using vector network analyzer |
| KR20180042044A (en) * | 2016-10-17 | 2018-04-25 | 한국표준과학연구원 | Electromagnetic Wave Impedance Measuring Apparatus and Calibration Method of Impedance |
| CN108333469A (en) * | 2017-01-17 | 2018-07-27 | 弗兰克公司 | The master unit and remote unit of the phase coherence of Network Analyzer |
| CN112710977A (en) * | 2020-12-11 | 2021-04-27 | 西安电子科技大学 | Surface-mounted passive device S parameter measuring device and method based on TRM calibration |
| CN113376505A (en) * | 2021-05-12 | 2021-09-10 | 中电科思仪科技股份有限公司 | Detection circuit and method suitable for rapid screening of microwave integrated circuit electrical performance |
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050046435A1 (en) * | 2003-08-26 | 2005-03-03 | Mitsubishi Denki Kabushiki Kaisha | Method and apparatus for evaluating and adjusting microwave integrated circuit |
| CN101479614A (en) * | 2006-07-03 | 2009-07-08 | 罗森伯格高频技术有限及两合公司 | High-frequency measuring device, method for calibrating such a device and method for determining a scattering parameter using such a high-frequency measuring device |
| KR20180042044A (en) * | 2016-10-17 | 2018-04-25 | 한국표준과학연구원 | Electromagnetic Wave Impedance Measuring Apparatus and Calibration Method of Impedance |
| CN108333469A (en) * | 2017-01-17 | 2018-07-27 | 弗兰克公司 | The master unit and remote unit of the phase coherence of Network Analyzer |
| CN107861050A (en) * | 2017-11-13 | 2018-03-30 | 中国电子科技集团公司第四十研究所 | A kind of method that On-wafer measurement is carried out using vector network analyzer |
| CN112710977A (en) * | 2020-12-11 | 2021-04-27 | 西安电子科技大学 | Surface-mounted passive device S parameter measuring device and method based on TRM calibration |
| CN113376505A (en) * | 2021-05-12 | 2021-09-10 | 中电科思仪科技股份有限公司 | Detection circuit and method suitable for rapid screening of microwave integrated circuit electrical performance |
Non-Patent Citations (2)
| Title |
|---|
| 孙晓颖;孙静;栾鹏;吴爱华;韩利华;梁法国;: "在片矢量网络分析仪测试系统量值比对方案的探讨", 计算机与数字工程, no. 01, 20 January 2015 (2015-01-20) * |
| 曹刚;: "射频同轴转接器的S参数测试方法", 科技风, no. 26, 26 December 2017 (2017-12-26) * |
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