CN116209215A - Heat dissipation module and data center - Google Patents

Abstract

The embodiment of the application discloses a heat dissipation module and a data center, relates to the technical field of equipment heat dissipation, and solves the problem of heat dissipation imbalance in related technologies. The heat radiation module comprises a circulation loop and a heat radiation module, wherein the circulation loop is used for guiding a heat radiation medium to flow and comprises at least two heat exchange units and a heat radiation assembly, the at least two heat exchange units are sequentially arranged in the circulation loop in series, and the heat exchange units are used for exchanging heat with electronic equipment; the heat dissipation assembly comprises at least two heat dissipation units, wherein the at least two heat dissipation units and the at least two heat exchange units are alternately arranged along the flowing direction of the heat dissipation medium, and the heat dissipation units are used for dissipating heat of the heat dissipation medium. The heat dissipation module is used for cooling electronic equipment.

Description

A cooling module and data center

technical field

The embodiments of the present application relate to, but are not limited to, the field of equipment heat dissipation, and in particular, relate to a heat dissipation module and a data center.

Background technique

In the related art, the temperature of each heat exchange unit in the heat dissipation module is unbalanced, and redundant design is required, which affects the heat dissipation effect.

Contents of the invention

The heat dissipation module and the data center provided by the embodiment of the present application have balanced temperature, no need for redundant design, and good heat dissipation effect.

In the first aspect, the embodiment of the present application provides a heat dissipation module, which includes a circulation loop for guiding the flow of heat dissipation medium. The circulation loop includes at least two heat exchange units and heat dissipation components. At least two heat exchange units are arranged in series on the In the circulation loop, the heat exchange unit is used to exchange heat with the electronic equipment; the heat dissipation assembly includes at least two heat dissipation units, at least two heat dissipation units and at least two heat exchange units are arranged alternately along the flow direction of the heat dissipation medium, and the heat dissipation unit is used for cooling The heat dissipation medium dissipates heat.

The heat dissipation module provided by the embodiment of the present application includes a circulation loop, and the circulation loop can guide the flow of heat dissipation medium, so that the heat dissipation medium can quickly transfer heat from one location to another along the circulation loop. Specifically, the circulation loop includes at least two heat exchange units, and the heat exchange units are used to exchange heat with the electronic equipment, thereby exchanging the heat generated by the electronic equipment to the heat dissipation medium in the circulation loop, so as to reduce heat accumulation at the electronic equipment, And at least two heat exchanging units are sequentially arranged in the circulation loop, that is, the cooling medium in the circulation loop will flow through each heat exchanging unit in turn to take away the heat from each heat exchanging unit. On this basis, the circulation loop also includes a heat dissipation component, which includes a heat dissipation unit, and the heat dissipation unit can transfer the heat in the heat dissipation medium to the outside, thereby cooling the heat dissipation medium, so that the heat dissipation medium can be uninterrupted in the circulation loop absorb heat. Specifically, the heat dissipation assembly includes at least two heat dissipation units, at least two heat dissipation units and at least two heat exchange units are arranged alternately along the flow direction of the heat dissipation medium, that is, a heat dissipation unit is arranged behind each heat exchange unit, and when the heat dissipation medium After absorbing heat from the heat exchange unit and raising the temperature, the heat dissipation unit will meet the heat dissipation unit when the flow continues. The heat at the heat unit is circulated in this way, the temperature difference of each heat exchange unit is small, and the heat dissipation efficiency is relatively balanced, which is convenient for standardization. The heat dissipation medium can obtain good heat dissipation after passing through each heat exchange unit, which reduces the possibility of poor subsequent heat exchange efficiency due to the high temperature of the heat dissipation medium. Moreover, the heat dissipation medium can be dissipated in time. The temperature difference is small when the thermal unit is used, so there is no need for redundant design, which can reduce costs. Compared with the solution in the related art, where the temperature of the heat dissipation medium flows through the next heat exchange unit, the temperature is relatively high and redundant heat dissipation design is required, the heat dissipation solution of the present application can effectively dissipate heat from the electronic equipment at each heat exchange unit in turn , and no redundant design is required, the cost is low, and the temperature of each heat exchange unit is relatively balanced.

In a possible implementation manner of the present application, at least two heat dissipation units are arranged in a heat dissipation space, at least two heat exchange units are arranged in a heat exchange space, and the heat dissipation space and the heat exchange space do not overlap. With this arrangement, the space where the heat dissipation unit is located and the space where the heat exchange unit is located are independent of each other, preventing the heat dissipation unit from affecting the heat exchange unit, and the heat dissipation units are relatively concentrated, which is more convenient for maintenance.

In a possible implementation manner of the present application, the extension directions of at least two heat dissipation units are arranged in parallel, and the heat dissipation medium in the heat dissipation units flows along the extension directions of the corresponding heat dissipation units. The heat dissipation units are extended along the same direction, which facilitates the arrangement of multiple heat dissipation units and reduces the occupied space.

In a possible implementation manner of the present application, at least two heat dissipation units are stacked and arranged along a preset direction, and the preset direction is arranged perpendicular to the extending direction of the heat dissipation unit. The heat dissipation units are stacked to avoid stacking of multiple heat dissipation units, so that the heat dissipation conditions of each heat dissipation unit are similar and the difference in heat dissipation capacity is small.

In a possible implementation of the present application, the heat dissipation unit includes two connection ports, the two connection ports communicate with the corresponding two heat exchange units respectively, and the two connection ports are arranged on the heat dissipation unit along the extending direction of the heat dissipation unit. both ends. The two connection ports are arranged at both ends of the heat dissipation unit. Compared with the two connection ports arranged at the same end, the flow direction of the heat dissipation medium in the heat dissipation unit is single, the heat dissipation effect is better, and the loss along the flow of the heat dissipation medium is smaller. .

In a possible implementation of the present application, the two connection ports of the heat dissipation units are respectively a first port and a second port, the first ports of at least two heat dissipation units are located in the first space, and the at least two connection ports of the two heat dissipation units are located in the first space. The second port is located in the second space, the first space and the second space do not overlap, the heat exchange unit is connected to the two first ports, or the heat exchange unit is connected to the two second ports. Such arrangement enables the heat exchange unit to be connected to the same side of the heat dissipation assembly, facilitates the arrangement of pipes between the heat exchange unit and the heat dissipation assembly, avoids interlacing of pipes of multiple heat exchange units, and makes the pipes more orderly and easy to maintain.

In a possible implementation manner of the present application, the heat dissipation unit includes at least two heat dissipation pipes, and a heat dissipation medium flows in the heat dissipation pipes. The heat dissipation unit is provided with a plurality of heat dissipation pipes, so that the contact area between the heat dissipation medium and the heat dissipation unit is increased, and the heat exchange efficiency of the two is effectively improved.

In a possible implementation manner of the present application, a heat dissipation channel is formed between two adjacent heat dissipation pipes, and the heat dissipation channel is filled with heat dissipation filler, or the heat dissipation channel is used for ventilation and heat dissipation. A heat dissipation channel is formed between the heat dissipation pipes to increase the contact area between the heat dissipation unit and the outside world and improve heat dissipation efficiency.

In a possible implementation of the present application, the two ends of the heat dissipation unit are respectively provided with a first communication part and a second communication part, the first ends of at least two heat dissipation pipes are connected to the first communication part, and the heat dissipation pipes The second ends of each communicate with the second communication part, and the first communication part and the second communication part respectively communicate with the corresponding heat exchange unit. By setting the connecting part, the heat dissipation medium in the plurality of heat dissipation pipes is confluenced, so that the pipe connection between the heat exchange unit and the heat dissipation unit is facilitated.

In a second aspect, an embodiment of the present application provides a data center, including electronic equipment and the heat dissipation module of the first aspect, and the heat dissipation module is used for heat dissipation of the electronic equipment.

The data center provided by the embodiment of the present application has the same technical effect because it includes the heat dissipation module of the first aspect, that is, it can effectively dissipate heat to the electronic equipment at each heat exchange unit in turn without redundant design, The cost is low, and the temperature of each heat exchange unit is relatively balanced.

Description of drawings

FIG. 1 is a schematic diagram of the principle of a heat dissipation module in the related art;

FIG. 2 is a schematic diagram of the principle of the heat dissipation module provided by the embodiment of the present application;

FIG. 3 is a schematic structural view (axonometric view) of the heat dissipation module provided by the embodiment of the present application;

4 is a schematic structural view (top view) of the heat dissipation module provided by the embodiment of the present application;

FIG. 5 is a structural schematic diagram (axonometric view) of the heat dissipation assembly in the heat dissipation module provided by the embodiment of the present application;

6 is a schematic structural view (front view) of the heat dissipation assembly in the heat dissipation module provided by the embodiment of the present application;

FIG. 7 is a schematic structural view (top view) of the heat dissipation assembly in the heat dissipation module provided by the embodiment of the present application;

FIG. 8 is a schematic structural view of the heat dissipation filler in the heat dissipation module provided by the embodiment of the present application;

FIG. 9 is a schematic diagram of the cross-sectional structure along A-A in FIG. 7 .

Reference signs:

1-heat exchange unit; 1a-first heat exchange unit; 1b-second heat exchange unit; 2-radiation component; 21-radiation unit; 21a-first heat dissipation unit; 21a1-first heat dissipation pipe; 21b-second Heat dissipation unit; 21b1-second heat dissipation pipe; 211-connection port; 2111-first port; 2112-second port; 212-radiation channel; 213-radiation filler; 22-housing; 221-first chamber; - second chamber; 223-first partition; 224-third chamber; 225-fourth chamber; 226-second partition; 23-connection; 24-avoidance; 3-first High-temperature drainage pipeline; 4-first low-temperature drainage pipeline; 5-second high-temperature drainage pipeline; 6-second low-temperature drainage pipeline.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the specific technical solutions of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following examples are used to illustrate the present application, but not to limit the scope of the present application.

In the embodiments of the present application, the terms "first" and "second" are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more.

In addition, in the embodiments of the present application, orientation terms such as "upper", "lower", "left" and "right" are defined relative to the schematic placement orientations of components in the drawings. It should be understood that these orientations The terminology is a relative concept, and they are used for description and clarification relative to each other, which may change correspondingly according to the change of orientation of parts placed in the drawings.

In this embodiment of the application, unless otherwise specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral body; it can be a direct connection , can also be indirectly connected through an intermediary.

In the embodiments of the present application, the term "comprising", "comprising" or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements, but also includes Including other elements not expressly listed, or also including elements inherent in such process, method, article or apparatus. Without further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising that element.

In the embodiments of the present application, words such as "exemplary" or "for example" are used as examples, illustrations or illustrations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application shall not be interpreted as being more preferred or more advantageous than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete manner.

The embodiment of the present application provides a data center. The data center is a network of specific equipment for global cooperation, and is used to transmit, accelerate, display, calculate, and store data information on the Internet infrastructure. A data center mostly puts a large number of servers together to provide running applications to process business and operational organizational data.

Specifically, the data center provided in the embodiment of the present application includes electronic equipment and a heat dissipation module. The heat dissipation module is used for heat dissipation and cooling of the electronic equipment. The electronic equipment can be a server, a switch, a memory, a power supply, etc., which is not limited in this application. These electronic devices will generate heat during operation, and the accumulation of heat will cause the operating environment of the electronic devices to rise steadily and affect the normal operation of the electronic devices. Therefore, it is necessary to cool and dissipate the electronic devices, and the heat dissipation module is used to cool the electronic devices. Heat dissipation, so that electronic equipment can work in a suitable ambient temperature.

Referring to Fig. 1, it is a schematic diagram of the principle of the heat dissipation module in the related art, wherein the arrow indicates the flow direction of the heat dissipation medium, including two heat exchange units 1 and a heat dissipation assembly 2, after the heat dissipation medium flows through the two heat exchange units 1 in sequence, and then Cooling and heat dissipation are carried out by the heat dissipation component 2 , so that when the heat dissipation medium flows through the first heat exchange unit 1 , the temperature will increase, thereby affecting the heat dissipation of the second heat dissipation unit 21 .

Therefore, the embodiment of the present application also provides a cooling module. Referring to FIG. 2, FIG. 3 and FIG. The flow direction of the heat dissipation medium, the circulation circuit includes at least two heat exchange units 1 and the heat dissipation assembly 2, at least two heat exchange units 1 are arranged in series in the circulation circuit in sequence, and the heat exchange unit 1 is used to exchange heat with electronic equipment; the heat dissipation assembly 2 includes at least two heat dissipation units 21, at least two heat dissipation units 21 and at least two heat exchange units 1 are arranged alternately along the flow direction of the heat dissipation medium, that is, one heat dissipation unit 21 is arranged between two adjacent heat exchange units 1, and the heat dissipation The unit 21 is used to dissipate heat from the heat dissipation medium.

The heat dissipation module provided by the embodiment of the present application includes a circulation loop, and the circulation loop can guide the flow of heat dissipation medium, so that the heat dissipation medium can quickly transfer heat from one location to another along the circulation loop.

Specifically, the circulation loop includes at least two heat exchange units 1, and the heat exchange units 1 are used to exchange heat with the electronic equipment, thereby exchanging the heat generated by the electronic equipment to the heat dissipation medium in the circulation loop, so as to reduce the heat at the electronic equipment Accumulated, and at least two heat exchange units 1 are sequentially arranged in a circulation loop, that is, the cooling medium in the circulation loop will flow through each heat exchange unit 1 in order to take away the heat at each heat exchange unit 1 .

On this basis, the circulation circuit also includes a heat dissipation assembly 2, and the heat dissipation assembly 2 includes a heat dissipation unit 21. The heat dissipation unit 21 can transfer the heat in the heat dissipation medium to the outside, thereby cooling the heat dissipation medium, so that the heat dissipation medium can flow in the circulation loop. Continuously absorb heat.

Specifically, the heat dissipation assembly 2 includes at least two heat dissipation units 21, at least two heat dissipation units 21 and at least two heat exchange units 1 are arranged alternately along the flow direction of the heat dissipation medium, that is, each heat exchange unit 1 is followed by a heat dissipation unit 1. Unit 21, when the heat dissipation medium absorbs heat from the heat exchange unit 1 and heats up, it continues to flow and encounters the heat dissipation unit 21, and the heat dissipation unit 21 cools down the heat dissipation medium, so that the temperature of the heat dissipation medium flows through the next heat exchange unit 1. Low, it can better absorb the heat at the next heat exchange unit 1, and in this way, the temperature difference of each heat exchange unit 1 is small, and the heat dissipation efficiency is relatively balanced, which is convenient for standardization.

The heat dissipation medium can obtain good heat dissipation after passing through each heat exchange unit 1, which reduces the possibility of poor subsequent heat exchange efficiency due to excessive temperature of the heat dissipation medium. The temperature difference of the heat exchange unit 1 is small, so redundant design is unnecessary, and the cost can be reduced.

Compared with the solution in the related art, where the heat dissipation medium flows through the next heat exchange unit 1, the temperature is relatively high and a redundant heat dissipation design is required, the heat dissipation solution of the present application can sequentially perform electronic equipment at each heat exchange unit 1 Effective heat dissipation without redundant design, low cost, and relatively balanced temperature of each heat exchange unit 1 .

Among them, the heat dissipation medium can be a liquid medium or a gaseous medium, and the heat dissipation medium can be water, oil or fluorinated liquid, etc., and can have the performance of insulating or freezing. This application does not limit this, only need to ensure that the heat dissipation medium can Flow and heat transfer in the circulation loop is sufficient.

It should be noted that the heat exchange unit 1 can perform heat exchange with the electronic device as a whole, or the heat exchange unit 1 can perform heat exchange with a certain heat-generating component on the electronic device, for example: a central processing unit (central processing unit, CPU), a hard disk , a power supply unit (power simply unit, PSU), etc., which are not limited in this application.

Wherein, there are at least two heat exchanging units 1, and there may be two, three or more than three heat exchanging units 1. Correspondingly, there are at least two heat exchanging units 21 of the two kinds of heat dissipating assemblies, and there may be two heat exchanging units 21. , three or more, it is only necessary to ensure that the heat exchange unit 1 and the heat dissipation unit 21 correspond one-to-one.

Referring to Fig. 3 and Fig. 4, in a possible embodiment of the present application, there are two heat exchange units 1, and each heat exchange unit 1 dissipates heat to a CPU, and the two heat exchange units 1 are respectively the first heat exchanger The heat unit 1a and the second heat exchange unit 1b. Correspondingly, the heat dissipation assembly 2 includes two heat dissipation units 21, and the two heat dissipation units 21 are respectively a first heat dissipation unit 21a and a second heat dissipation unit 21b. The first heat exchange unit 1a and the second heat exchange unit The first heat dissipation unit 21a communicates with the first high-temperature drainage pipe 3, the first heat dissipation unit 21a communicates with the second heat exchange unit 1b through the second low-temperature drainage pipe 6, and the second heat exchange unit 1b communicates with the second heat dissipation unit. The second heat dissipation unit 21b communicates with the first heat exchange unit 1a through the first low temperature drainage pipe 4 to form a circulation loop.

Specifically, the temperature of the heat dissipation medium in the first low-temperature drainage pipe 4 is relatively low. When the heat dissipation medium flows through the first heat exchange unit 1a along the first low-temperature drainage pipe 4, the heat dissipation medium absorbs the corresponding CPU through the first heat exchange unit 1a. Therefore, the temperature rises, and the temperature of the heat dissipation medium in the first high-temperature drainage pipe 3 is higher; when the heat dissipation medium flows through the first heat dissipation unit 21a along the first high-temperature drainage pipe 3, the first heat dissipation unit 21a conducts heat dissipation on the heat dissipation medium. Heat dissipation and cooling, the temperature of the heat dissipation medium is therefore reduced, so that the temperature of the heat dissipation medium in the second low temperature drainage pipe 6 is similar to that in the first low temperature drainage pipe 4; when the heat dissipation medium flows through the second heat exchange pipe 6 along the second low temperature In unit 1b, the heat dissipation medium absorbs the heat of the corresponding CPU through the second heat exchange unit 1b, so the temperature rises, and the temperature of the heat dissipation medium in the second high-temperature drainage pipe 5 is relatively high; when the heat dissipation medium flows along the second high-temperature drainage pipe 5 When passing through the second heat dissipation unit 21b, the second heat dissipation unit 21b radiates heat and cools down the heat dissipation medium, so that the temperature of the heat dissipation medium decreases, so that the temperature of the heat dissipation medium in the first low temperature drainage pipe 4 is similar to that in the second low temperature drainage pipe 6 .

Wherein, the heat exchange unit 1 can be a heat-conducting copper plate and other devices with good thermal conductivity, and the heat dissipation unit 21 can be a heat dissipation fin, a heat dissipation fan, etc., which is not limited in this application. It should be noted that the first heat exchange unit 1a and the second heat exchange unit 1a The performance parameters of the two heat exchange units 1b can be the same or different, and the performance parameters of the first heat dissipation unit 21a and the second heat dissipation unit 21b can be the same or different, as long as the performance parameters of the first heat exchange unit 1a and the first heat dissipation unit 21a are the same. It is only necessary to adapt so that the temperature of the heat dissipation medium in the first low-temperature drainage pipe 4 and the second low-temperature drainage pipe 6 is similar.

In addition, in order to drive the heat dissipation medium to flow in the circulation circuit, the circulation circuit also includes a driving part, which can be a pump body, and the driving part can be set at the position of the heat exchange unit 1 and the heat dissipation unit 21, or the driving part is set at the pipe Above; there can be one, two or more driving parts. When two or more driving parts are used, each driving part should ensure that the cooling medium flows in one direction in the circulation loop.

In order to prevent the heat at the heat exchange unit 1 from affecting the heat dissipation unit 21, optionally, in a possible embodiment of the present application, at least two heat dissipation units 21 are arranged in a heat dissipation space, and at least two heat exchange units 21 Unit 1 is arranged in a heat exchange space, and the heat dissipation space and the heat exchange space do not overlap. In this way, the heat dissipation space and the heat exchange space are independent of each other, and the heat at the heat exchange unit 1 in the heat exchange space is difficult to affect the heat dissipation unit 21 , so that the heat dissipation unit 21 in the heat dissipation space can transfer heat to the outside more efficiently, thereby realizing the cooling of the heat dissipation medium.

For example, if the electronic equipment is installed in the cabinet, the heat exchange unit 1 is also arranged inside the cabinet, and the heat dissipation unit 21 is arranged outside the cabinet. The heat exchange space where the heat exchange unit 1 is located and the heat dissipation space where the heat dissipation unit 21 is located isolated.

It should be noted that at least two heat dissipation units 21 can be arranged in a centralized manner or dispersedly. The centralized heat dissipation units 21 are convenient for management and maintenance, and are convenient for the arrangement of pipelines. The scattered heat dissipation units 21 have little influence on each other, and the heat dissipation The efficiency is higher. Referring to FIG. 3 and FIG. 5 , in a possible implementation manner of the present application, at least two heat dissipation units 21 are centrally arranged.

Specifically, the heat dissipation assembly 2 includes a housing 22 , and at least two heat dissipation units 21 are disposed in the housing 22 , and the at least two heat dissipation units 21 may extend in the same direction or in different directions in the housing 22 .

In order to save space, referring to FIG. 5 , in a possible embodiment of the present application, the extension directions of at least two heat dissipation units 21 are arranged in parallel, which is more convenient for the stacking of multiple heat dissipation units 21 and requires less space. This is beneficial to the miniaturization of the heat dissipation assembly 2 .

Wherein, the heat dissipation medium in the heat dissipation unit 21 flows along the extension direction of the corresponding heat dissipation unit 21. It should be noted that the heat dissipation medium in different heat dissipation units 21 can flow in the same direction or in the opposite direction, and this application does not make any comment on this. In order to facilitate pipe arrangement, optionally, the heat dissipation medium in the first heat dissipation unit 21a and the second heat dissipation unit 21b flows in opposite directions.

It should be noted that there are many possible arrangements of the at least two heat dissipation units 21 in the housing 22, for example, at least two heat dissipation units 21 are arranged in sequence along the extending direction; Arrangement in a circular array; for another example, at least two cooling units 21 are arranged in a square array, which is not limited in the present application.

In order to balance the heat dissipation capabilities of the heat dissipation units 21, referring to FIG. 5, in a possible embodiment of the present application, at least two heat dissipation units 21 are stacked along a preset direction, and the preset direction is perpendicular to the extending direction of the heat dissipation units 21. Setting, at least two heat dissipation units 21 are stacked so that each heat dissipation unit 21 can be in direct contact with the outside world, rather than indirectly contacting the outside world through adjacent heat dissipation units 21, so that the heat dissipation conditions of each heat dissipation unit 21 are more balanced .

In order to facilitate communication between the heat dissipation unit 21 and the heat exchange unit 1, referring to FIG. 6, in a possible embodiment of the present application, the heat dissipation unit 21 includes two connection ports 211, and the two connection ports 211 are respectively connected to the corresponding two heat exchange units. The unit 1 is connected, for example, one connection port 211 of the first cooling unit 21a is connected to the first heat exchange unit 1a through the first high-temperature drainage pipe 3, and the other connection port 211 of the first cooling unit 21a is connected to the second cooling unit through the second cooling water unit. Heat exchange unit 1b.

Wherein, the two connection ports 211 can be arranged on the same end of the heat dissipation unit 21, or at different ends, for example, the two connection ports 211 are arranged on the two ends of the heat dissipation unit 21 along the extension direction of the heat dissipation unit 21, so set, in the heat dissipation pipe The heat dissipation medium flows from one end to the other end, and the temperature gradually decreases, which is more conducive to heat dissipation.

On this basis, since the extension directions of at least two heat dissipation units 21 are parallel, and the two connection ports 211 of the heat dissipation units 21 are respectively arranged at both ends of the heat dissipation units 21, one connection port 211 of the heat dissipation unit 21 is located in the casing 22, another connection port 211 is located at the second end of the housing 22, and the heat exchange unit 1 communicates with the two heat dissipation units 21, then the connection port 211 of the two heat dissipation units 21 that the heat exchange unit 1 can communicate with can be They are located at the same end of the housing 22 , and may also be located at different ends of the housing 22 .

In order to facilitate the layout of pipelines, referring to FIG. 6 , in a possible embodiment of the present application, the two connection ports 211 of the heat dissipation unit 21 are respectively a first port 2111 and a second port 2112 , and the first port 2112 of at least two heat dissipation units 21 One port 2111 is located in the first space, that is, the first port 2111 is located at the first end of the housing 22, and the second ports 2112 of at least two cooling units 21 are located in the second space, that is, the second port 2112 is located at the second end of the housing 22 Two ends, the first space and the second space do not overlap, the heat exchange unit 1 communicates with the two first ports 2111, or the heat exchange unit 1 communicates with the two second ports 2112, that is, the two ports 2112 that the heat exchange unit 1 communicates with The two connection ports 211 are located on the same side of the housing 22.

In order to improve heat dissipation efficiency, referring to FIG. 5 and FIG. 6, in a possible embodiment of the present application, the heat dissipation unit 21 includes at least two heat dissipation pipes, that is, the first heat dissipation unit 21a includes two first heat dissipation pipes 21a1, and the second The heat dissipation unit 21b includes two second heat dissipation pipes 21b1, and the heat dissipation medium flows in the heat dissipation pipes. Since a plurality of heat dissipation pipes are provided, the contact area between the heat dissipation medium and the heat dissipation unit 21 is increased, which is beneficial to the heat transfer between the two , thereby improving the cooling efficiency.

Wherein, the radial section shape of the heat dissipation pipe has many possibilities, for example, the radial section of the heat dissipation pipe is circular; another example, the radial section of the heat dissipation pipe is square; optionally, the radial section of the heat dissipation pipe is The strip shape means that the heat dissipation pipes are flat pipes, which can reduce the space occupied along the stacking direction when the heat dissipation pipes are stacked.

In order to facilitate the heat dissipation pipes to dissipate heat to the outside, referring to Fig. 6 and Fig. 9, in a possible embodiment of the present application, a heat dissipation passage 212 is formed between two adjacent heat dissipation pipes, and the heat dissipation passage 212 is used for ventilation and heat dissipation. For example, a fan is provided at the heat dissipation pipe, so that the airflow generated by the fan flows in the heat dissipation channel 212, so as to improve the heat exchange efficiency between the heat dissipation channel 212 and the outside.

Referring to FIG. 8 , the heat dissipation channels 212 are filled with heat dissipation fillers 213 , which can absorb heat evenly, thereby making the heat in the heat dissipation pipes more uniform, avoiding heat concentration and affecting local heat dissipation efficiency.

In order to facilitate pipe layout, at least two heat dissipation pipes of the same heat dissipation unit 21 can be connected to the same drainage pipe. Optionally, in a possible embodiment of the present application, the two ends of the heat dissipation unit 21 are respectively provided with first The communication part and the second communication part, the first ends of the at least two heat dissipation pipes of the same heat dissipation unit 21 are all connected to the first communication part, and the second ends of the at least two heat dissipation pipes of the same heat dissipation unit 21 are all connected to the second communication part. part, the first communication part and the second communication part communicate with the corresponding heat exchange unit 1 respectively.

7 and 9, the first end of the housing 22 is provided with a first chamber 221 and a second chamber 222, the first chamber 221 and the second chamber 222 are separated by a first partition plate 223, the housing The second end of 22 is provided with the third chamber 224 and the fourth chamber 225, and the third chamber 224 and the fourth chamber 225 are isolated by the second partition plate 226, wherein, the first chamber 221 is the first heat sink The first communication part of the unit 21a, the third chamber 224 is the second communication part of the first heat dissipation unit 21a, and the first ends of the two first heat dissipation pipes 21a1 included in the first heat dissipation unit 21a are both connected to the first chamber 221, the second ends of the two first heat dissipation pipes 21a1 are connected to the second chamber 222, in addition, the first chamber 221 is connected to the first heat exchange unit 1a through the first high-temperature drainage pipe 3, and the third chamber 224 is connected to the first heat exchange unit 1a through the first high-temperature drainage pipe 3. The second low temperature drainage pipe 6 communicates with the second heat exchange unit 1b.

Correspondingly, the second chamber 222 is the first communicating portion of the second heat dissipation unit 21b, the fourth chamber 225 is the second communicating portion of the second heat dissipation unit 21b, and the second heat dissipation unit 21b includes two second heat dissipation pipes The first ends of 21b1 are connected to the second chamber 222, and the second ends of the two second heat dissipation pipes 21b1 are connected to the fourth chamber 225. In addition, the second chamber 222 is connected to the second chamber 222 through the second low temperature drainage pipe 6. A heat exchange unit 1a, the fourth chamber 225 communicates with the second heat exchange unit 1b through the second high temperature drainage pipe 5 .

In addition, in order to facilitate the installation of the heat dissipation assembly 2, referring to Fig. 5, Fig. 7 and Fig. 8, the heat dissipation assembly 2 is also provided with a connecting portion 23, the connection portion 23 may be a buckle, a connection hole, etc.; and the heat dissipation assembly 2 may also be provided with The escape portion 24 is, for example, provided with a bend in the middle of the housing 22 , which is not limited in the present application.

The serial numbers of the above embodiments of the present application are for description only, and do not represent the advantages and disadvantages of the embodiments. The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. All equivalent structures or equivalent process transformations made by using the description of the application and the accompanying drawings are directly or indirectly used in other related technical fields. , are all included in the patent protection scope of the present application in the same way.

Claims (10)

1. A heat dissipating module, comprising: a circulation loop for directing a flow of a heat-dissipating medium, the circulation loop comprising:

at least two heat exchange units are sequentially arranged in the circulation loop in series, and the heat exchange units are used for exchanging heat with electronic equipment;

the heat dissipation assembly comprises at least two heat dissipation units, wherein at least two heat dissipation units and at least two heat exchange units are alternately arranged along the flow direction of the heat dissipation medium, and the heat dissipation units are used for dissipating heat of the heat dissipation medium.

2. The heat dissipating module of claim 1, at least two of the heat dissipating units being disposed in a heat dissipating space, at least two of the heat exchanging units being disposed in a heat exchanging space, the heat dissipating space and the heat exchanging space not overlapping.

3. The heat dissipation module according to claim 2, wherein the extending directions of at least two of the heat dissipation units are arranged in parallel, and the heat dissipation medium in the heat dissipation unit flows along the extending direction of the corresponding heat dissipation unit.

4. The heat dissipation module according to claim 3, wherein at least two of the heat dissipation units are stacked along a predetermined direction, and the predetermined direction is perpendicular to an extending direction in the heat dissipation unit.

5. The heat dissipation module of claim 3, wherein the heat dissipation unit comprises two connection ports, the two connection ports are respectively communicated with the two corresponding heat exchange units, and the two connection ports are arranged at two ends of the heat dissipation unit along the extending direction of the heat dissipation unit.

6. The heat dissipation module of claim 5, wherein the two connection ports of the heat dissipation unit are a first port and a second port, the first ports of at least two heat dissipation units are located in a first space, the second ports of at least two heat dissipation units are located in a second space, the first space and the second space do not overlap, and the heat exchange unit is communicated with the two first ports, or the heat exchange unit is communicated with the two second ports.

7. The heat dissipation module of any one of claims 1 to 6, the heat dissipation unit comprising at least two heat dissipation pipes within which the heat dissipation medium flows.

8. The heat dissipation module according to claim 7, wherein a heat dissipation channel is formed between two adjacent heat dissipation pipes, the heat dissipation channel is filled with a heat dissipation filler, or the heat dissipation channel is used for ventilation and heat dissipation.

9. The heat dissipation module of claim 7, wherein a first communication portion and a second communication portion are respectively disposed at two ends of the heat dissipation unit, at least two first ends of the heat dissipation pipes are all communicated with the first communication portion, and second ends of the heat dissipation pipes are all communicated with the second communication portion, and the first communication portion and the second communication portion are respectively communicated with the corresponding heat exchange unit.

10. A data center, comprising:

an electronic device;

the heat dissipation module of any one of claims 1 to 9 for heat dissipation of the electronic device.

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