CN116228649A - Method, device, computer equipment and medium for determining cutting path - Google Patents

Abstract

The present application discloses a method, device, computer equipment and medium for determining a dicing line, wherein the method includes: determining the first feature point and the second feature point based on the row of chips to be cut, the first feature point and the There is a first distance between the second feature points; based on the first feature point and the second feature point, a third feature point is determined, and a second distance is separated between the third feature point and the second feature point; based on the first feature point and the second feature point The straight line where the third feature point is located determines the cutting path. It is more accurate to use the straight line between the first feature point and the third feature point as the cutting line.

Description

A method, device, computer equipment and medium for determining a cutting line

technical field

The present application relates to the technical field of wafer dicing, in particular to a method, device, computer equipment and media for determining dicing lanes.

Background technique

In order to adapt to the trend of equipment miniaturization, the size of the chip is also reduced accordingly, so the precision of the direction of the dicing line for chip dicing is required to be higher.

The method of determining the dicing lane in the prior art is as follows: first, determine the row where the chip to be cut is located; secondly, determine the first feature point and the second feature point in the row; finally, based on the first feature point and the second feature point The connecting line determines the cutting line. Since the distribution of the chips on the wafer may deviate, this method cannot guarantee the accuracy of the dicing lines.

Contents of the invention

Based on the above problems, the present application provides a method, device, computer equipment and medium for determining a cutting line, so as to improve the accuracy of the direction of the cutting line.

In a first aspect, the present application provides a method for determining a cutting line, the method comprising:

Determining a first feature point and a second feature point based on the row of chips to be cut, and a first distance between the first feature point and the second feature point;

determining a third feature point based on the first feature point and the second feature point, and a second distance between the third feature point and the second feature point;

Based on the straight line where the first feature point and the third feature point are located, the cutting line is determined.

Optionally, the first feature point and the second feature point are geometric centers of the first chip and the second chip, respectively.

Optionally, the determining the first feature point and the second feature point based on the row of chips to be cut includes:

Determining a first reference point and a second reference point based on the row of chips to be cut, and a first distance between the first reference point and the second reference point;

Determining an initial cutting line based on the lower boundary line of the chip row to be cut and the upper boundary line of the adjacent chip row;

Determine the first feature point based on the intersection of the straight line where the ordinate of the first reference point is located and the initial cutting line; record the third distance between the first reference point and the cutting line;

The second feature point is determined based on the straight line where the ordinate of the second reference point is located and the third distance.

Optionally, the determining the third feature point based on the first feature point and the second feature point includes:

determining a third reference point based on the first reference point and the second reference point, and a second distance between the third reference point and the second reference point;

The third feature point is determined based on the straight line where the ordinate of the third reference point is located and the third distance.

Optionally, the second distance is greater than the first distance.

In a second aspect, the present application provides a device for determining a cutting line, the device comprising: a first determination module, a second determination module, and a third determination module;

The first determination module is configured to determine a first feature point and a second feature point based on the row of chips to be cut, and a first distance between the first feature point and the second feature point;

The second determination module is configured to determine a third feature point based on the first feature point and the second feature point, and the distance between the third feature point and the second feature point is a second distance;

The third determination module is configured to determine the cutting line based on the straight line where the first feature point and the third feature point are located.

Optionally, the first feature point and the second feature point are geometric centers of the first chip and the second chip, respectively.

Optionally, the first determination unit is specifically configured to:

Determining a first reference point and a second reference point based on the row of chips to be cut, and a first distance between the first reference point and the second reference point;

Determining an initial cutting line based on the lower boundary line of the chip row to be cut and the upper boundary line of the adjacent chip row;

Determine the first feature point based on the intersection of the straight line where the ordinate of the first reference point is located and the initial cutting line; record the third distance between the first reference point and the cutting line;

The second feature point is determined based on the straight line where the ordinate of the second reference point is located and the third distance.

Optionally, the second determining unit is specifically used for:

determining a third reference point based on the first reference point and the second reference point, and a second distance between the third reference point and the second reference point;

The third feature point is determined based on the straight line where the ordinate of the third reference point is located and the third distance.

In a third aspect, the present application provides a computer device, including: a memory, a processor, and a computer program stored on the memory and operable on the processor. When the processor executes the computer program, The method for determining a cutting line as described in any one of the first aspect is realized.

In a fourth aspect, the present application provides a computer-readable storage medium, where instructions are stored in the computer-readable storage medium, and when the instructions are run on a terminal device, the terminal device executes any one of the above aspects of the first aspect. The method of determining the cutting line described in the item.

First, based on the row of chips to be cut, determine the first feature point and the second feature point, and the first distance between the first feature point and the second feature point; then, based on the first feature point and the second feature point, determine the first feature point Three feature points, a second distance between the third feature point and the second feature point; finally, the cutting line is determined based on the straight line where the first feature point and the third feature point are located.

Compared with the traditional method of determining the cutting line, the first feature point and the second feature point are directly used to determine the cutting line. This application uses the first feature point and the second feature point to determine the third feature point, and then uses the connection direction between the first feature point and the third feature point as the method of the cutting line, which includes the adjustment process of the cutting line , that is, if the line determined by the first feature point and the third feature point has an included angle compared with the line determined by the first feature point and the second feature point, the line between the first feature point and the third feature point is used as the cut way is more accurate.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present application. Those skilled in the art can also obtain other drawings based on these drawings without any creative effort.

FIG. 1 is a flowchart of a method for determining a cutting line provided in an embodiment of the present application;

FIG. 2 is a schematic diagram corresponding to a method for determining a cutting line provided in an embodiment of the present application;

FIG. 3 is a schematic diagram corresponding to another method for determining a cutting line provided in the embodiment of the present application;

Fig. 4 is a schematic structural diagram of a device for determining a cutting line provided by an embodiment of the present application.

Detailed ways

The terms "first", "second" and "third" in the specification, claims and description of the drawings of this application are used to distinguish different objects, rather than to limit a specific order.

In the embodiments of the present application, words such as "exemplary" or "for example" are used as examples, illustrations or illustrations. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of the present application shall not be interpreted as being more preferred or more advantageous than other embodiments or design schemes. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete manner.

As described above, the current method for determining the dicing lane is to determine the dicing lane by directly using the first feature point and the second feature point on the row where the chip to be diced is located. However, there is a certain deviation in the layout of the chip on the wafer. If the straight line where the first feature point and the second feature point are located is directly determined as the dicing line, deviations in the dicing line will occur and the chip may be cut. After research, if there is a deviation in the arrangement of the chips on the wafer, the dicing lines can be adjusted to avoid chip damage caused by inaccurate dicing lines.

In view of this, the present application provides a method for determining a dicing line. First, based on the row of chips to be cut, determine a first feature point and a second feature point, and a first distance between the first feature point and the second feature point; Then, based on the first feature point and the second feature point, determine the third feature point, the second distance between the third feature point and the second feature point; finally, based on the straight line where the first feature point and the third feature point are located , to determine the cutting path.

The above method can be applied to the dicing machine, which uses strong grinding as a means

In order to enable those skilled in the art to better understand the solution of the application, the technical solution in the embodiment of the application will be clearly and completely described below in conjunction with the drawings in the embodiment of the application. Obviously, the described embodiment is only It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

Referring to FIG. 1 , this figure is a flow chart of a method for determining a cutting line provided by an embodiment of the present application.

As shown in Figure 1, the method includes:

S101: Determine a first feature point and a second feature point based on a row of chips to be cut, and a first distance between the first feature point and the second feature point.

The chips are regularly arranged on the wafer, and the chip row where the chip to be cut is located can be determined before cutting, such as the first chip row, the second chip row or the third chip row, etc.

As a possible implementation manner, the first feature point and the second feature point may be the geometric center of the first chip and the geometric center of the second chip on the row of chips to be cut. Wherein, the distance between the first feature point and the second feature point is the first distance.

Preferably, the first distance can be one or two times the chip width.

By determining the first feature point and the second feature point in the above implementation manner, the direction of the cutting line can be determined directly through the geometric center position of the chip, and the direction of the cutting line can be quickly determined, and this method is highly operable.

As a possible implementation manner, the first feature point and the second feature point may be points parallel to the geometric center of the first chip and the geometric center of the second chip on the row of chips to be cut. Specifically, based on the row of chips to be cut, the first reference point and the second reference point are determined, and the distance between the first reference point and the second reference point is a first distance; based on the lower boundary line of the row of chips to be cut and the Determine the initial cutting line on the upper boundary line; determine the first feature point based on the intersection of the straight line where the ordinate of the first reference point is located and the initial cutting line; record the third distance between the first reference point and the cutting line; Determine the second feature point from the straight line where the ordinate of the point is located and the third distance.

Through the above implementation, it is not limited to determining the direction of the cutting line, but it is a way to quickly determine the cutting line. In addition, this method does determine the cutting line directly through the feature points. Compared with the method of determining the cutting line through the direction of the cutting line, because the step of translation based on the direction of the cutting line is omitted, the determined line Cutting lanes are more accurate.

S102: Determine a third feature point based on the first feature point and the second feature point, where a second distance is between the third feature point and the second feature point.

As a possible implementation manner, the third feature point may be the geometric center of the third chip. Wherein, the third chip may be located in a row of chips to be cut together with the first chip and the second chip, wherein the distance between the first feature point and the second feature point is the second distance.

As a possible implementation manner, the third feature point may be a point parallel to the third chip on the row of chips to be cut. Specifically, based on the first reference point and the second reference point, determine the third reference point, and the second distance between the third reference point and the second reference point; distance to determine the third feature point.

It should be noted that the second distance is greater than the first distance. That is to say, the second distance is at least three times the width of the chip, and the specific value can be set according to the actual needs of the user.

S103: Determine the cutting line based on the straight line where the first feature point and the third feature point are located.

As a possible implementation manner, the straight line where the first feature point and the third feature point are located may be determined as the direction of the cutting line, and the cutting line is determined based on the direction.

As a possible implementation manner, the cutting line is located between the first feature point and the third feature point.

The method of using the direction of the line between the first feature point and the third feature point as the cutting line includes the adjustment process of the cutting line, that is, if the straight line determined by the first feature point and the third feature point is compared with the first There is an angle between the line defined by the feature point and the second feature point, and it is more accurate to use the line between the first feature point and the third feature point as the cutting line.

First, based on the row of chips to be cut, determine the first feature point and the second feature point, and the first distance between the first feature point and the second feature point; then, based on the first feature point and the second feature point, determine the first feature point Three feature points, a second distance between the third feature point and the second feature point; finally, the cutting line is determined based on the straight line where the first feature point and the third feature point are located.

Compared with the traditional method of determining the cutting line, the first feature point and the second feature point are directly used to determine the cutting line. This application uses the first feature point and the second feature point to determine the third feature point, and then uses the connection direction between the first feature point and the third feature point as the method of the cutting line, which includes the adjustment process of the cutting line , that is, if the line determined by the first feature point and the third feature point has an included angle compared with the line determined by the first feature point and the second feature point, the line between the first feature point and the third feature point is used as the cut way is more accurate.

Referring to FIG. 2 , this figure is a schematic diagram of a method for determining a cutting line provided by an embodiment of the present application.

In this figure, the first feature point, the second feature point and the third feature point are all located in the row where the chips to be cut are located. Wherein, there is a first distance between the first feature point and the second feature point, a second distance between the second feature point and the third feature point, and the second distance is greater than the first distance.

The line connecting the first feature point and the third feature point is the direction of the cutting line, and the cutting line is located on a straight line parallel to the direction.

Optionally, the straight line parallel to this direction may be the midline of the upper and lower rows of chip gaps, that is, the midline of the lower boundary line of the upper row of chips and the upper boundary line of the lower row of chips.

The method of determining the cutting line by using the above method mainly has the following beneficial effects: First, by using the first feature point and the second feature point to determine the third feature point, and then the connection between the first feature point and the third feature point The method of using the line direction as the cutting line includes the adjustment process of the cutting line, that is, if there is an angle between the straight line determined by the first feature point and the third feature point compared with the straight line determined by the first feature point and the second feature point, It is more accurate to use the straight line between the first feature point and the third feature point as the cutting line; secondly, it provides a method for quickly determining the direction of the cutting line, and the determined direction of the cutting line is highly accurate.

Referring to FIG. 3 , this figure is a schematic diagram of another method for determining a cutting line provided by an embodiment of the present application.

In this figure, the first feature point, the second feature point, and the third feature point are points parallel to the geometric center of the first chip, the geometric center of the second chip, and the geometric center of the third chip on the row of chips to be cut. Its specific implementation is as follows:

First, determine the geometric center (first reference point) of the first chip, the geometric center (second reference point) of the second chip and the geometric center (third reference point) of the third chip in the row of chips to be cut, wherein the first a first distance between the reference point and the second reference point, and a second distance between the second reference point and the third reference point;

Then, determine the intersection point of the extension line of the first reference point in the ordinate direction and the initial cutting line as the first feature point and record the third distance between the first feature point and the first reference point, and set the second reference point at The point on the extension line in the direction of the ordinate that is the third distance from the second reference point is used as the second feature point, and the point on the extension line in the direction of the ordinate that is the third distance from the third reference point is the point that is the second feature point. Three feature points;

Finally, the straight line between the first reference point and the third reference point is determined as the cutting line.

In this manner, the straight line where the first feature point and the third feature point are located can be directly determined as the cutting line. Compared with the method corresponding to FIG. 2 , this method can effectively avoid errors caused by translation.

It should be noted that the method given in Figure 2 and Figure 3 of this application specification is applicable to oval wafers, but the method for determining the scribe line proposed in this application is also applicable to strip-shaped wafers. The provided method for determining the scribe line is not limited by the shape of the wafer.

Referring to FIG. 4 , this figure is a schematic structural diagram of a device for determining a cutting line provided by an embodiment of the present application.

As shown in FIG. 4, the device includes: a first determination module 401, a second determination module 402, and a third determination module 403;

The first determination module 401 is configured to determine a first feature point and a second feature point based on the row of chips to be cut, and a first distance between the first feature point and the second feature point;

The second determination module 402 is configured to determine a third feature point based on the first feature point and the second feature point, and the second distance between the third feature point and the second feature point;

The third determining module 403 is configured to determine the cutting line based on the straight line where the first feature point and the third feature point are located.

Optionally, the first determining module 401 is specifically configured to:

Determining a first reference point and a second reference point based on the row of chips to be cut, and a first distance between the first reference point and the second reference point;

Determining an initial cutting line based on the lower boundary line of the chip row to be cut and the upper boundary line of the adjacent chip row;

Determine the first feature point based on the intersection of the straight line where the ordinate of the first reference point is located and the initial cutting line; record the third distance between the first reference point and the cutting line;

The second feature point is determined based on the straight line where the ordinate of the second reference point is located and the third distance.

Optionally, the first determining module 402 is specifically configured to:

determining a third reference point based on the first reference point and the second reference point, and a second distance between the third reference point and the second reference point;

The third feature point is determined based on the straight line where the ordinate of the third reference point is located and the third distance.

An embodiment of the present application provides a computer-readable storage medium, on which a computer program is stored, and when the program is executed by a processor, the method for determining a cutting line described in the embodiment of the present application is implemented.

In practical applications, the computer-readable storage medium may use any combination of one or more computer-readable media. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or device, or any combination thereof. More specific examples (non-exhaustive list) of computer readable storage media include: electrical connections with one or more leads, portable computer disks, hard disks, random access memory (RAM), read only memory (ROM), Erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination of the above. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program, and the program may be used by or in combination with an instruction execution system, apparatus or device.

A computer readable signal medium may include a data signal carrying computer readable program code in baseband or as part of a carrier wave. Such propagated data signals may take many forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the foregoing. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device. .

Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

Computer program code for carrying out the operations of the present invention may be written in one or more programming languages, or combinations thereof, including object-oriented programming languages—such as Java, Smalltalk, C++, and conventional Procedural Programming Language - such as "C" or a similar programming language. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In cases involving a remote computer, the remote computer can be connected to the user computer through any kind of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computer (such as through an Internet service provider). Internet connection).

It should be noted that each embodiment in this specification is described in a progressive manner, the same and similar parts of each embodiment can be referred to each other, and each embodiment focuses on the differences from other embodiments. place. In particular, as for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and for relevant parts, please refer to part of the description of the method embodiment. The device embodiments described above are only illustrative, and the units described as separate components may or may not be physically separated, and the components indicated as units may or may not be physical units, that is, they may be located in one place , or can also be distributed to multiple network elements. Part or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. It can be understood and implemented by those skilled in the art without creative effort.

The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person familiar with the technical field can easily think of changes or Replacement should be covered within the protection scope of this application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (10)

1. A method for determining a cutting path, characterized in that the method comprises: Determining a first feature point and a second feature point based on the row of chips to be cut, and a first distance between the first feature point and the second feature point; determining a third feature point based on the first feature point and the second feature point, and a second distance between the third feature point and the second feature point; Based on the straight line where the first feature point and the third feature point are located, the cutting line is determined. 2. The method according to claim 1, wherein the first feature point and the second feature point are geometric centers of the first chip and the second chip, respectively. 3. The method according to claim 1, wherein said determining the first feature point and the second feature point based on the row of chips to be cut comprises: Determining a first reference point and a second reference point based on the row of chips to be cut, and a first distance between the first reference point and the second reference point; Determining an initial cutting line based on the lower boundary line of the chip row to be cut and the upper boundary line of the adjacent chip row; Determine the first feature point based on the intersection of the straight line where the ordinate of the first reference point is located and the initial cutting line; record the third distance between the first reference point and the cutting line; The second feature point is determined based on the straight line where the ordinate of the second reference point is located and the third distance. 4. The method according to claim 3, wherein said determining a third feature point based on the first feature point and the second feature point comprises: determining a third reference point based on the first reference point and the second reference point, and a second distance between the third reference point and the second reference point; The third feature point is determined based on the straight line where the ordinate of the third reference point is located and the third distance. 5. The method according to any one of claims 1 to 4, wherein the second distance is greater than the first distance. 6. A device for determining a cutting line, characterized in that the device comprises: a first determining module, a second determining module and a third determining module; The first determination module is configured to determine a first feature point and a second feature point based on the row of chips to be cut, and a first distance between the first feature point and the second feature point; The second determination module is configured to determine a third feature point based on the first feature point and the second feature point, and the distance between the third feature point and the second feature point is a second distance; The third determination module is configured to determine the cutting line based on the straight line where the first feature point and the third feature point are located. 7. The device according to claim 6, wherein the first feature point and the second feature point are geometric centers of the first chip and the second chip, respectively. 8. The device according to claim 6, wherein the first determining unit is specifically configured to: Determining a first reference point and a second reference point based on the row of chips to be cut, and a first distance between the first reference point and the second reference point; Determining an initial cutting line based on the lower boundary line of the chip row to be cut and the upper boundary line of the adjacent chip row; Determine the first feature point based on the intersection of the straight line where the ordinate of the first reference point is located and the initial cutting line; record the third distance between the first reference point and the cutting line; The second feature point is determined based on the straight line where the ordinate of the second reference point is located and the third distance. 9. A computer device, characterized in that it comprises: a memory, a processor, and a computer program stored on the memory and operable on the processor, when the processor executes the computer program, the The method for determining a cutting line according to any one of claims 1 to 5. 10. A computer-readable storage medium, characterized in that instructions are stored in the computer-readable storage medium, and when the instructions are run on a terminal device, the terminal device is made to execute any of claims 1-5. A method of determining a cutting lane as described.

Images