Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a modular backscatter imager, which is used for solving the problems that in the prior art, the backscatter imager is miniaturized, meanwhile, the detection area of the backscatter detector is greatly reduced, the receiving intensity of the backscatter signal is reduced, so that the imaging resolution and the signal-to-noise ratio of the backscatter imager are limited, and the accuracy of the backscatter imaging inspection is affected.
To achieve the above and other related objects, the present invention provides a modular backscatter imager comprising a handheld backscatter imager and a plurality of modular detectors;
the handheld back scattering imager comprises a first shell, an X-ray machine, a chopper mechanism, a back scattering detector, a power module, a first power panel, a central control panel and a display screen, wherein the X-ray machine, the chopper mechanism, the back scattering detector, the power module, the first power panel, the central control panel and the display screen are arranged in the first shell;
wherein the X-ray machine is used for generating a ray beam; the chopper mechanism is arranged in front of the X-ray machine; the back scattering detector is positioned in front of the chopping mechanism and is used for receiving scattering signals of the surface of the measured object; the power supply module is connected with the first power supply board and provides power for the X-ray machine, the chopper mechanism, the back scattering detector and the central control board through the first power supply board; the central control board is respectively connected with the X-ray machine, the chopper mechanism and the back scattering detector; the display screen is used for providing a human-computer interaction interface, is connected with the central control panel and is used for receiving and displaying images reconstructed by the central control panel.
The plurality of modularized detectors are respectively installed outside the first shell through a fixed installation structure, a hardware interface is further arranged between the modularized detectors and the first shell, and the modularized detectors are in communication connection with the central control board through the hardware interface.
Preferably, the back scattering detector comprises a plurality of first scintillators, a plurality of first photoelectric conversion device pieces, a first amplifying conditioning circuit and a first sampling ADC circuit which are sequentially arranged;
the first photoelectric conversion devices are correspondingly connected with the first scintillators respectively, the first amplifying conditioning circuit and the first sampling ADC circuit are connected with the power supply module through the first power supply board, the first sampling ADC circuit is in communication connection with the central control board, and the central control board is used for carrying out data preprocessing and graph reconstruction on digital signals subjected to analog-to-digital conversion by the first sampling ADC circuit.
Preferably, the power module comprises a first power supply battery and a charge and discharge management circuit, wherein the charge and discharge management circuit is connected with the first power supply battery and is used for protecting overvoltage and overcurrent protection in the charge and discharge process of the first power supply battery.
Preferably, the modularized detector comprises a second shell, and a second scintillator, a second photoelectric conversion device, a second amplification conditioning circuit, a second sampling ADC circuit, a second power panel and a second power supply battery which are sequentially arranged in the second shell;
the second power supply battery is connected with the second power supply board and provides power for the second photoelectric conversion device, the second amplification conditioning circuit and the second sampling ADC circuit through the second power supply board; the second sampling ADC circuit is in communication connection with the central controller through the hardware interface and transmits the digital signals after analog-to-digital conversion to the central controller.
Preferably, the modular detector further comprises a status indication circuit, wherein the status indication circuit is used for indicating the working status of the modular detector and the communication status of the modular detector and the central control board.
Preferably, the handheld backscatter imager further comprises a motion sensor, a camera shooting assembly and a contour indicator lamp, wherein the motion sensor, the camera shooting assembly and the contour indicator lamp are connected with the first power panel and the central control panel;
the motion sensor comprises an acceleration sensor and a gyroscope, wherein the acceleration sensor is used for measuring the speed and the acceleration of the handheld back-scattering imager in the scanning process, and the gyroscope is used for measuring the angle and the direction of the handheld back-scattering imager when moving in a three-dimensional space;
the camera shooting assembly comprises a camera and a flash lamp and is used for shooting and evidence obtaining of the measured object;
the contour indicator lamps are distributed on two sides of the back scattering detector and are used for displaying or assisting in judging the area information of the measured object.
Preferably, the chopping mechanism comprises a sector collimator, a driving motor and a chopping collimator which are sequentially arranged, wherein a collimating slit is arranged on the sector collimator, a plurality of chopping slits are arranged on the chopping collimator, the driving motor is used for driving the chopping collimator, and a ray beam sequentially passes through the collimating slit and the chopping collimator to form flying spots;
the fan-shaped collimator and the chopping collimator are made of Pb, cu or W, and the widths of the collimating slit and the chopping slit are 0.1-0.5 mm.
Preferably, the hardware interface is an LVDS signal transmission interface.
Preferably, an included angle between a plane in which the modularized detector is located and a plane in which the back scattering detector is located is 0-90 degrees.
Preferably, the handheld backscatter imager further comprises a WiFi module and a Bluetooth transmission module.
As described above, the modular backscatter imager of the present invention has the following beneficial effects:
the invention provides a modularized back scattering imager, which comprises a handheld back scattering imager and a plurality of modularized detectors, wherein the modularized detectors are respectively arranged on the periphery of the handheld back scattering imager through a fixed mounting structure, the modularized detectors are in communication connection with a central control board in the handheld back scattering imager through a hardware interface, and the modularized detector arrays are spliced on the handheld back scattering imager through the fixed mounting structure and a communication interface, so that the imaging area of the back scattering detector is expanded, the receiving rate of scattering signals is improved, the sensitivity and the imaging resolution of the back scattering imager are improved, and the accuracy of back scattering imaging detection is greatly improved.
The power supply module in the handheld back scattering imaging instrument is connected with the first power supply board, and the first power supply board is arranged to orderly and controllably provide corresponding working voltages for all elements; the speed sensor, the camera component and the outline indicator lamp are arranged to further assist and correct the inspection image; a plurality of modularized detectors are expanded on the handheld back scattering imager, signals generated by the modularized detectors are rapidly transmitted to the central control board in real time in a lossless manner through the LVDS signal transmission interface and are overlapped with the signals of the back scattering detectors, and then the central control board carries out preprocessing and pattern reconstruction on the signals, so that the inspection accuracy of the imager is improved; the fan-shaped collimator and the chopper collimator are made of Pb, cu or W, so that the X-rays can be effectively shielded at a lower thickness, and a higher image resolution and a low radiation dose rate can be obtained; the included angle between the plane where the modularized detector is located and the plane where the back scattering detector is located can be freely adjusted, so that the detection range of the modularized back scattering imager is greatly improved; in addition, the WiFi module and the Bluetooth transmission module are arranged, so that uploading and interaction of detection images of the detected object are facilitated.
Detailed Description
Further advantages and effects of the present invention will become apparent to those skilled in the art from the disclosure of the present invention, which is described by the following specific examples.
Please refer to fig. 1 to 7. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the invention to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the invention, are not intended to be critical to the essential characteristics of the invention, but are intended to fall within the spirit and scope of the invention. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the invention, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the invention may be practiced.
It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of each component in actual implementation may be changed at will, and the layout of the components may be more complex.
The invention provides a modularized back scattering imager, which comprises a handheld back scattering imager and a plurality of modularized detectors, wherein the plurality of modularized detectors are respectively arranged around the handheld back scattering imager through a fixed mounting structure, the modularized detectors are in communication connection with a central control board in the handheld back scattering imager through a hardware interface, and the modularized detector arrays are spliced on the handheld back scattering imager through the fixed mounting structure and the hardware interface, so that the imaging area of the back scattering detector is expanded, the receiving rate of scattering signals is improved, the sensitivity and the imaging resolution of the back scattering imager are improved, and the accuracy of back scattering imaging detection is greatly improved; the power supply module in the handheld back scattering imaging instrument is connected with the first power supply board, and the first power supply board is arranged to orderly and controllably provide corresponding working voltages for all elements; the speed sensor, the camera component and the outline indicator lamp are arranged to further assist and correct the inspection image; a plurality of modularized detectors are expanded on the handheld back scattering imager, signals generated by the modularized detectors are rapidly transmitted to the central control board in real time in a lossless manner through the LVDS signal transmission interface and are overlapped with the signals of the back scattering detectors, and then the central control board carries out preprocessing and pattern reconstruction on the signals, so that the inspection accuracy of the imager is improved; the fan-shaped collimator and the chopper collimator are made of Pb, cu or W, so that the X-rays can be effectively shielded at a lower thickness, and a higher image resolution and a low radiation dose rate can be obtained; the included angle between the plane where the modularized detector is located and the plane where the back scattering detector is located can be freely adjusted, so that the detection range of the modularized back scattering imager is greatly improved; in addition, the WiFi module and the Bluetooth transmission module are arranged, so that uploading and interaction of detection images of the detected object are facilitated.
Referring to fig. 1-7, the present invention provides a modular backscatter imager comprising a handheld backscatter imager 200 and a plurality of modular detectors 100; the handheld back-scatter imager 200 comprises a first housing 208 and an X-ray machine 201, a chopper mechanism 202, a back-scatter detector 203, a power module 204, a first power supply board 206, a central control board 205, a display screen 207 disposed within the first housing 208; wherein the X-ray machine 201 is used for generating a ray beam; the chopper mechanism 202 is arranged in front of the X-ray machine 201; the back scattering detector 203 is located in front of the chopper mechanism 202 and is used for receiving scattering signals of the surface of the measured object; the power supply module 204 is connected with the first power supply board 206, and provides power for the X-ray machine 201, the chopper mechanism 202, the backscatter detector 203 and the central control board 205 through the first power supply board 206; the central control board 205 is respectively connected with the X-ray machine 201, the chopper mechanism 202 and the back scattering detector 203; the display screen 207 is used for providing a man-machine interaction interface, and the display screen 207 is connected with the central control board 205 and is used for receiving and displaying images reconstructed by the central control board 205.
The plurality of modularized detectors 100 are respectively installed outside the first housing 208 through a fixed installation structure, and a hardware interface is further arranged between the modularized detectors 100 and the first housing 208, and the modularized detectors 100 are in communication connection with the central control board 205 through the hardware interface.
Specifically, the central control board 205 controls the X-ray machine 201 to generate a cone-shaped or fan-shaped X-ray beam, and controls the chopper mechanism 202 to rotate or reciprocate at a high speed, the X-ray beam forms a continuous flying spot after passing through the chopper mechanism 202, when the flying spot is projected onto the surface of the measured object, compton backscattering is generated with electrons in the measured object, scattered photons are received by the backscattering detector 203, and photon signals are converted into voltage signals, and the voltage signals are transmitted to the central control board 205 after signal processing.
In this embodiment, the receiving surface of the backscatter detector 203 is located at the foremost end of the handheld backscatter imager 200, and is used for receiving the scattered signal of the surface of the measured object; the central control board 205 is used for controlling and executing data communication, data preprocessing and image reconstruction of the X-ray machine 201, the chopper motor and the back scatter detector 203.
Specifically, the conventional size of the backscatter detectors 203 is generally within 20cm×20cm, but for the deficiency of the detection space, the resolution and detection sensitivity of Compton imaging performed by the conventional size backscatter detectors 203 cannot achieve a good detection effect, and in order to improve the imaging index of the handheld backscatter imager 200, this is achieved by increasing the area of the Compton scatter detectors, that is, in this embodiment, by expanding a plurality of modularized detectors 100 on the handheld backscatter imager 200, the signals generated by the modularized detectors 100 need to be quickly transmitted to the central control board 205 in real time, and the signals of the backscatter detectors 203 are superimposed, and then preprocessed and graphically reconstructed, and the final image is presented on the display screen 207.
Specifically, the first housing 208 and the modular detector 100 are provided with a fixed mounting structure for mutually mounting and fixing, and a hardware interface for transmitting data and signals between the data of the modular detector 100 and the central control board 205 is further provided, and specifically, the number and the mounting positions of the modular detector 100 mounted on the first housing 208 can be adjusted according to practical applications, so that the method is not excessively limited; preferably, the first housing 208 is constructed of plastic bonded sheet metal that facilitates the installation of the fixed modular detector 100 and the mounting of the various components fixedly disposed within the first housing 208.
As an example, the backscatter detector 203 includes a plurality of first scintillators 2031, a plurality of first photoelectric conversion devices 2032, a first amplification conditioning circuit 2033, and a first sampling ADC circuit 2034, which are arranged in this order; the plurality of first photoelectric conversion devices 2032 are respectively connected with the plurality of first scintillators 2031, the first amplifying and conditioning circuit 2033 and the first sampling ADC circuit 2034 are both connected with the power module 204 through the first power panel 206, the first sampling ADC circuit 2034 is in communication connection with the central control board 205, and the central control board 205 is used for performing data preprocessing and graphic reconstruction on the digital signal after analog-to-digital conversion by the first sampling ADC circuit 2034.
Specifically, the pen-shaped ray beam striking the object to be measured and the out-of-core electrons inside the object to be measured generate a reverse Compton scattering effect, so that the photon motion direction and the original incidence direction generate deflection of more than 90 degrees, the deflected scattered photons are received by the first scintillator 2031 in the back scattering detector 203 to generate fluorescence or phosphorescence, the generated fluorescence or phosphorescence is reflected by the reflecting layer and then is received by the first photoelectric conversion device 2032 to be converted into a current signal, and then is subjected to filtering, shaping and method by the first amplifying conditioning circuit 2033 connected with the first photoelectric conversion device 2032, and then is subjected to analog-to-digital conversion by the first sampling ADC circuit 2034 and then is transmitted to the central control board 205, corresponding data preprocessing and graphic reconstruction are performed in the central control board 205, and finally, an image is displayed on the display screen 207.
Preferably, the first scintillator 2031 is CaWO 4 One or a combination of GOS, csI, the first photo-conversion device 2032 is a photomultiplier tube (PMT) or a silicon photomultiplier tube (SiPM); the first amplifying and conditioning circuit 2033 is configured to shape, filter and amplify the voltage signal output by the photoelectric conversion device; ADC is a common Analog-to-digital converter or Analog-to-digital converter, i.e., analog-to-Digital Converter (ADC), a device capable of converting a continuous variable Analog signal into a discrete digital signal, such as temperature, pressure, sound or image, to be more easily stored, handled or sentA transmitted digital signal.
As an example, the power module 204 includes a first power supply battery 2041 and a charge/discharge management circuit 2042, the charge/discharge management circuit 2042 is connected to the first power supply battery 2041, and the charge/discharge management circuit 2042 is used for protecting overvoltage/overcurrent protection during charging/discharging of the first power supply battery 2041.
Specifically, a charging port is provided at a charging input end of the charging/discharging management circuit 2042, a charging output end of the charging/discharging management circuit 2042 is connected to the first power supply battery 2041, the charging port is connected to a power supply, and the first power supply battery 2041 is charged through the charging/discharging management circuit 2042; the discharging output end of the first power supply battery 2041 is connected with the discharging input end of the charging and discharging management circuit 2042, the discharging output end of the charging and discharging management circuit 2042 is connected with the first power panel 206, and corresponding working voltages are provided for the X-ray machine 201, the chopper mechanism 202, the back scattering detector 203 and the central control panel 205 in a orderly controlled manner through the first power panel 206; in the present embodiment, the first power supply battery 2041 is preferably a lithium battery.
As an example, referring to fig. 1, the modular detector 100 includes a second housing 107 and a second scintillator 101, a second photoelectric conversion device 102, a second amplification conditioning circuit 103, a second sampling ADC circuit 104, a second power supply board 105, and a second power supply battery 106, which are sequentially disposed within the second housing 107; the second power supply battery 106 is connected with the second power panel 105, and provides power for the second photoelectric conversion device 102, the second amplifying and conditioning circuit 103 and the second sampling ADC circuit 104 through the second power panel 105; the second sampling ADC circuit 104 is communicatively connected to the central controller through a hardware interface, and transmits the analog-to-digital converted digital signal to the central controller.
Specifically, the pen-shaped ray beam striking the object to be measured and the out-of-nuclear electrons inside the object to be measured generate a reverse Compton scattering effect, so that the photon movement direction and the original incidence direction generate deflection of more than 90 degrees, the deflected scattered photons are received by the second scintillator 101 to generate fluorescence or phosphorescence, the generated fluorescence or phosphorescence is reflected by the reflecting layer, received by the second photoelectric conversion device 102 and converted into a current signal, and then is converted into a second photoelectric conversion signalThe second amplifying and conditioning circuit 103 connected to the switching device 102 performs filtering, shaping and method, performs analog-to-digital conversion by the second sampling ADC circuit 104, transmits the signal to the central control board 205, superimposes the signal transmitted to the central control board 205 by the backscatter detector 203, and performs preprocessing and pattern reconstruction. Preferably, the second scintillator 101 is CaWO 4 One or a combination of GOS, csI, the second photo-conversion device 102 is a photomultiplier tube (PMT) or a silicon photomultiplier tube (SiPM).
As an example, the modular detector 100 further includes a status indication circuit for indicating the operating status of the modular detector 100 and the communication status of the modular detector 100 with the central control board 205.
As an example, referring to fig. 2, the handheld backscatter imager 200 further includes a motion sensor 209, a camera assembly 210, a contour indicator light 211, and a display screen 207, where the motion sensor 209, the camera assembly 210, and the contour indicator light 211 are all connected to the first power panel 206, the central control panel 205; the motion sensor 209 includes an acceleration sensor for measuring the speed and the acceleration of the handheld backscatter imager 200 during scanning, and a gyroscope for measuring the angle and the direction of the handheld backscatter imager 200 when moving in three-dimensional space; the camera assembly 210 comprises a camera and a flash lamp, and is used for shooting and evidence obtaining for the measured object; the contour indicator lamps 211 are distributed on two sides of the back scattering detector 203, and are used for displaying or assisting in judging the area information of the measured object.
Specifically, the position of the handheld backscatter imager 200 in the three-dimensional space at any moment in the scanning process and the motion track information can be obtained through the cooperative recording of the acceleration sensor and the gyroscope, so that the scanning angle of the receiving surface of the scatter detector facing the surface of the object to be measured at each moment is determined, meanwhile, the scanning acceleration and the angle direction recorded by the acceleration sensor and the gyroscope are utilized to correct the finally presented inspection image, and the specific model and structure of the acceleration sensor and the gyroscope adopted in the embodiment can meet the actual use requirement without being excessively limited.
Specifically, the image capturing assembly 210 captures a photograph of the object to be measured and obtains evidence, and transmits the photograph to the central control board 205, and correlates with the reconstructed image checked by the handheld backscatter imager 200, but the specific structure and the number of the arrangements of the image capturing assembly 210 are not limited herein, and the image capturing assembly 210 is preferably disposed in front of the backscatter detector 203.
As an example, the chopper mechanism 202 includes a fan collimator 2021, a driving motor 2022, and a chopper collimator 2023, which are disposed in this order; the fan-shaped collimator 2021 is provided with a collimating slit, the chopping collimator 2023 is provided with a plurality of chopping slits, the driving motor 2022 is used for driving the chopping collimator 2023, and the ray beams sequentially pass through the collimating slit and the chopping slits to form flying spots; the fan-shaped collimator 2021 and the chopper collimator 2023 are made of Pb, cu or W, and the widths of the collimator slit and the chopper slit are 0.1 to 0.5mm, such as 0.1mm, 0.2mm, 0.3mm, 0.4mm, and 0.5mm.
Specifically, a conical X-ray beam generated by the X-ray machine 201 passes through a fan-shaped collimator 2021 to form a sheet-shaped fan-shaped X-ray beam with the thickness of 0.1-0.5 mm, and for obtaining periodically scanned pen-shaped beam X-rays, a chopper collimator 2023 is arranged right in front of the fan-shaped X-ray beam, and the movement mode of the chopper collimator 2023 can be a flywheel structure with a plurality of chopper slits arranged at equal angles on the circumference, or a shielding plate structure with the chopper slits arranged at equal intervals driven by a high-speed electric cylinder; the chopper collimator 2023 forms a periodically reciprocating intersection point between the chopper slit and the collimator slit in the process of periodic movement, and transmits a periodically moving pen-shaped ray beam; however, the number of chopper slits is not excessively limited herein; preferably, the driving motor 2022 in this embodiment is a brushless dc motor, and is used to uniformly drive the chopper collimator 2023.
Specifically, the fan-shaped collimator 2021 and the chopper collimator 2023 are made of Pb, cu or W, so that the X-rays can be effectively shielded at a lower thickness; preferably, the collimator slit of the fan collimator 2021 is arranged right in front of the focal spot of the radiation source, so as to obtain a higher image resolution and a low radiation dose rate, however, in other embodiments, the collimator slit of the fan collimator 2021 may be arranged at other positions, but the image resolution and the radiation dose rate may be affected, and the positional relationship between the collimator slit and the radiation source is not limited excessively.
Specifically, the pen-shaped ray beam striking the object to be measured and the out-of-core electrons inside the object to be measured generate a reverse Compton scattering effect, so that the photon motion direction and the original incidence direction generate deflection of more than 90 degrees, the deflected X-rays are received by the first scintillator 2031 in the back scattering detector 203 to generate fluorescence or phosphorescence, the generated fluorescence or phosphorescence is reflected by the reflecting layer and then is received by the first photoelectric conversion device 2032 to be converted into a current signal, and then is subjected to filtering, shaping and method by the first amplifying conditioning circuit 2033 connected with the first photoelectric conversion device 2032, and then is subjected to analog-to-digital conversion by the first sampling ADC circuit 2034 and then is transmitted to the central control board 205, corresponding data preprocessing and graphic reconstruction are performed in the central control board 205, and finally, an image is displayed on the display screen 207.
As an example, the hardware interface is an LVDS signaling interface.
Specifically, signal transmission is performed between the modular detector 100 and the central control board 205 through the LVDS signal transmission interface, so that the signal generated by the extended modular detector 100 can be quickly and real-timely transmitted to the central control board 205 in a lossless manner, and is overlapped with the signal output by the backscatter detector 203.
By way of example, the angle between the plane in which modular detector 100 lies and the plane in which backscatter detector 203 lies is 0 deg. to 90 deg., such as 0 deg., 30 deg., 45 deg., 60 deg..
As an example, the handheld backscatter imager 200 also includes a WiFi module and a bluetooth transmission module.
Specifically, the WiFi module and the Bluetooth transmission module are arranged, so that uploading and interaction of detection images of the detected object are facilitated.
In summary, the invention provides a modularized back scattering imager, which comprises a handheld back scattering imager and a plurality of modularized detectors, wherein the plurality of modularized detectors are respectively arranged around the handheld back scattering imager through a fixed mounting structure, the modularized detectors are in communication connection with a central control board in the handheld back scattering imager through a hardware interface, and the modularized detector arrays are spliced on the handheld back scattering imager through the fixed mounting structure and a communication interface, so that the imaging area of the back scattering detector is expanded, the receiving rate of scattering signals is improved, the sensitivity and the imaging resolution of the back scattering imager are improved, and the accuracy of back scattering imaging detection is greatly improved; the power supply module in the handheld back scattering imaging instrument is connected with the first power supply board, and the first power supply board is arranged to orderly and controllably provide corresponding working voltages for all elements; the speed sensor, the camera component and the outline indicator lamp are arranged to further assist and correct the inspection image; a plurality of modularized detectors are expanded on the handheld back scattering imager, signals generated by the modularized detectors are rapidly transmitted to the central control board in real time in a lossless manner through the LVDS signal transmission interface and are overlapped with the signals of the back scattering detectors, and then the central control board carries out preprocessing and pattern reconstruction on the signals, so that the inspection accuracy of the imager is improved; the fan-shaped collimator and the chopper collimator are made of Pb, cu or W, so that the X-rays can be effectively shielded at a lower thickness, and a higher image resolution and a low radiation dose rate can be obtained; the included angle between the plane where the modularized detector is located and the plane where the back scattering detector is located can be freely adjusted, so that the detection range of the modularized back scattering imager is greatly improved; in addition, the WiFi module and the Bluetooth transmission module are arranged, so that uploading and interaction of detection images of the detected object are facilitated. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.