CN116263420B - A multi-parameter controllable thermal conductivity test system and method - Google Patents
A multi-parameter controllable thermal conductivity test system and method Download PDFInfo
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Abstract
本发明涉及一种多参数可控导热系数测试系统和方法，属于导热系数测试技术领域，解决现有的测试系统测得的导热系数误差大以及无法控制样品变形量的问题。该测试系统包括加热系统、加载系统、测量系统和真空系统；加热系统包括上加热板和下加热板，加载系统包括加载头和加载柱，测量系统包括压力传感器和位移传感装置，真空系统包括真空腔；上加热板与下加热板设置在真空腔中，上加热板位于下加热板的上方，加载头位于所述真空腔的上方，加载柱穿透所述真空腔的上壁将加载头与上加热板连接，压力传感器位于加载头上，位移传感装置包括顶杆和位移传感器，位移传感器位于真空腔的上方，顶杆穿透所述真空腔的上壁将所述位移传感器与上加热板连接。实现灵活控制样品变形量和准确测量导热系数。
The present invention relates to a multi-parameter controllable thermal conductivity test system and method, which belongs to the field of thermal conductivity test technology, and solves the problem that the thermal conductivity measured by the existing test system has a large error and cannot control the deformation of the sample. The test system includes a heating system, a loading system, a measuring system and a vacuum system; the heating system includes an upper heating plate and a lower heating plate, the loading system includes a loading head and a loading column, the measuring system includes a pressure sensor and a displacement sensing device, and the vacuum system includes a vacuum chamber; the upper heating plate and the lower heating plate are arranged in the vacuum chamber, the upper heating plate is located above the lower heating plate, the loading head is located above the vacuum chamber, the loading column penetrates the upper wall of the vacuum chamber to connect the loading head with the upper heating plate, the pressure sensor is located on the loading head, the displacement sensing device includes a push rod and a displacement sensor, the displacement sensor is located above the vacuum chamber, and the push rod penetrates the upper wall of the vacuum chamber to connect the displacement sensor with the upper heating plate. Flexible control of sample deformation and accurate measurement of thermal conductivity are achieved.
Description
Technical Field
The invention relates to the technical field of heat conductivity coefficient testing, in particular to a multi-parameter controllable heat conductivity coefficient testing system and method.
Background
The flexible heat insulation material has good high-temperature heat insulation performance and low density, has wide application prospect, and has wide use temperature range and large use environment temperature gradient.
The existing heat-insulating material heat conductivity coefficient testing method (for example, GB/T10295 heat flow meter method, the typical equipment of which is FOX series heat conduction instrument of TA company; GB/T10294 protection hot plate method, the typical equipment of which is GHP456 heat conduction instrument of anti-relaxation company; YB/T4130 water flow flat plate method, the typical equipment of which is PBD series heat conduction instrument of Luoyang refractory material institute, etc.) is different in equipment and principle, and the testing accuracy and the measuring temperature range are different. In the prior art, in order to ensure that a sample and a heating body are fully contacted, a heating plate generally applies certain pressure to the sample, and different methods and even different devices apply different pressures to the sample, so that different deformation amounts of the sample can be caused, and larger thickness change is generated, thereby generating larger error on a measurement result of the heat conductivity coefficient.
Disclosure of Invention
In view of the above analysis, the embodiments of the present invention aim to provide a system and a method for testing a thermal conductivity coefficient with controllable parameters, which are used for solving the problems that the thermal conductivity coefficient measured by the existing testing system has large error and the deformation of a sample cannot be controlled.
In one aspect, the embodiment of the invention provides a multi-parameter controllable heat conductivity coefficient testing system, which comprises a heating system, a loading system, a measuring system and a vacuum system;
The heating system comprises an upper heating plate and a lower heating plate, the loading system comprises a loading head and a loading column which are sequentially connected from top to bottom, the measuring system comprises a pressure sensor and a displacement sensing device, and the vacuum system comprises a vacuum cavity;
the upper heating plate and the lower heating plate are arranged in the vacuum cavity, the upper heating plate is located above the lower heating plate, the loading head is located above the vacuum cavity, one end of the loading column penetrates through the upper wall of the vacuum cavity to be connected with the upper heating plate, the pressure sensor is located on the loading head, the displacement sensing device comprises a displacement sensor and an ejector rod which are sequentially connected from top to bottom, the displacement sensor is located above the vacuum cavity, and one end of the ejector rod penetrates through the upper wall of the vacuum cavity to be connected with the upper heating plate.
Preferably, the loading system further comprises a spring, the loading column comprises an upper loading column and a lower loading column, the upper end of the upper loading column is connected with the loading head, the lower end of the lower loading column penetrates through the upper wall of the vacuum cavity to be connected with the upper heating plate, the lower end of the upper loading column and the upper end of the lower loading column are sleeved with the spring, the upper end of the spring is connected with the periphery of the lower end of the upper loading column, and the lower end of the spring is connected with the periphery of the upper end of the lower loading column.
Preferably, the loading system further comprises a loading device lifting mechanism, and the loading device lifting mechanism is arranged above the loading head and connected with the loading head.
Preferably, the measurement system further comprises a thermocouple penetrating the upper heating plate into contact with the upper surface of the sample, and penetrating the lower heating plate into contact with the lower surface of the sample.
Preferably, the measuring system further comprises a heat flow measuring device provided at an upper surface of the lower heating plate.
Preferably, the measurement system further comprises a vacuum gauge located outside the vacuum chamber and communicating with the interior of the vacuum chamber.
Preferably, a heat insulation layer is arranged in the vacuum cavity, the heat insulation layer encloses a heat insulation cavity, and the upper heating plate and the lower heating plate are positioned in the heat insulation cavity.
Preferably, the vacuum system further comprises a mechanical pump and/or a molecular pump, which communicates with the interior of the vacuum chamber.
Preferably, the multi-parameter controllable heat conductivity coefficient testing system further comprises a lifting system, the lifting system comprises a motor, a cross rod, two right-angle conversion heads, two screw rods and two vacuum cavity lifting mechanisms, the vacuum cavity lifting mechanisms are respectively arranged on two sides of the vacuum cavity and connected with the vacuum cavity, two ends of the cross rod are respectively connected with the screw rods through the right-angle conversion heads, and the screw rods are respectively connected with the vacuum cavity lifting mechanisms.
On the other hand, the invention also provides a multi-parameter controllable heat conductivity coefficient testing method, which comprises the following steps:
(a) The state of the sample is regulated, the initial thickness is recorded, and the numerical value of a displacement sensor when the upper heating plate is contacted with the lower heating plate is set to be zero;
(b) Lifting the vacuum cavity through a vacuum cavity lifting mechanism, and simultaneously lifting the upper heating plate through a loading device lifting mechanism to place a sample on the lower heating plate;
(c) The vacuum cavity and the upper heating plate are lowered, the vacuum degree of the vacuum cavity and the temperature of the upper heating plate are set, the loading system is used for loading pressure on the sample, the thickness of the sample under different pressures is measured through the pressure sensor and the displacement sensing device, and the curve of the pressure and the thickness of the sample is recorded;
(d) Setting a thickness or pressure value, setting a thermal conductivity test heating curve, controlling heating, and recording temperature, thickness and heat flow information;
(e) And after the temperature of the upper surface and the lower surface of the sample is stable, taking a section of average temperature difference, thickness and heat flow of stable values, and calculating the heat conductivity coefficient.
Compared with the prior art, the invention has at least one of the following beneficial effects:
1. The system can in-situ measure and monitor the thickness and the deformation of the sample through the displacement sensing device, is provided with a loading system, can pressurize and depressurize the sample through the loading system, can adjust the pressure loaded on the surface of the sample at any time, can monitor the pressure change through the pressure sensor, and can simultaneously measure the relation between the pressure and the displacement of the flexible material.
2. The upper heating plate and the lower heating plate can control the temperature, so that the compression deformation measurement of a sample at a certain constant temperature can be realized, the compression deformation measurement of the sample at a certain temperature gradient, vacuum degree and atmosphere can be realized, and the compression deformation and the change condition of the heat conductivity coefficient along with the temperature, the pressure, the air pressure and the like of the material under the actual working condition can be simulated through program control. And one parameter can be fixed while other parameters are changed, and the property change of the material (such as fixed air pressure, loading pressure and temperature are changed at the same time according to actual working conditions, and the thickness change of a sample is recorded) can be observed.
In the invention, the technical schemes can be mutually combined to realize more preferable combination schemes. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
The drawings are only for purposes of illustrating particular embodiments and are not to be construed as limiting the invention, like reference numerals being used to refer to like parts throughout the several views.
FIG. 1 is a schematic diagram of a multi-parameter controllable thermal conductivity testing system according to the present invention.
Fig. 2 is a schematic view of an upper heating plate and its subsidiary structure according to the present invention.
FIG. 3 is a schematic diagram of a loading system according to the present invention.
FIG. 4 is a schematic view of the lower heating plate and its auxiliary structure
FIG. 5 is a graph of temperature versus time for example 2.
FIG. 6 is a graph of thermal conductivity versus time for example 2.
Reference numerals:
1-upper heating plate, 2-lower heating plate, 3-loading head, 4-loading column, 401-upper loading column, 402-lower loading column, 5-pressure sensor, 6-displacement sensing device, 601-ejector rod, 602-displacement sensor, 603-low expansion ceramic plate, 7-vacuum cavity, 8-spring, 9-thermocouple, 10-heat flow measuring device, 11-vacuum gauge, 12-heat insulation layer, 13-mechanical pump, 14-molecular pump, 15-motor, 16-cross bar, 17-right angle conversion head, 18-screw rod, 19-vacuum cavity lifting mechanism, 20-loading device lifting mechanism, 21-flange, 22-sample, 23-corrugated pipe, 24-heating body, 25-vapor chamber and 26-water cooling pipeline.
Detailed Description
The following detailed description of preferred embodiments of the application is made in connection with the accompanying drawings, which form a part hereof, and together with the description of the embodiments of the application, are used to explain the principles of the application and are not intended to limit the scope of the application.
The existing heat-insulating material heat conductivity coefficient testing method is different in equipment and principle, and testing accuracy and measuring temperature range are different. In the prior art, in order to ensure that a sample and a heating body are fully contacted, a heating plate usually applies certain pressure to the sample, and different methods and even different devices apply different pressures to the sample, so that the deformation of the sample is different, and larger thickness variation is generated.
According to the Fourier one-dimensional heat conduction model, the calculation formula of the heat conduction coefficient is as follows:
wherein:
q is the heat flux density, the unit is W/m 2;
d, the thickness of the sample is in unit of m;
delta T is the temperature difference between the upper plate and the lower plate, and the unit is DEG C or K;
lambda is the thermal conductivity of the sample in W/(mK).
It can be seen from the above formula that under the same heat flow, the measured thermal conductivity is in direct proportion to the thickness d value involved in calculation, and in the test, the thickness measured by the thickness meter is generally more than 10% of the thickness measured after being loaded by the existing thermal conductivity testing instrument, and the existing testing method for the thermal conductivity of the flexible heat insulation material also does not have uniform requirements on loading pressure, so that the thickness measured by different methods and devices cannot be evaluated, larger errors are generated on the measurement result, and larger uncertainty is caused on the subsequent use of the material and the structural calculation of the heat insulation layer.
Thus, the invention provides a multi-parameter controllable heat conductivity coefficient testing system, which is shown in figures 1-3, and comprises a heating system, a loading system, a measuring system and a vacuum system;
the heating system comprises an upper heating plate 1 and a lower heating plate 2, the loading system comprises a loading head 3 and a loading column 4 which are sequentially connected from top to bottom, the measuring system comprises a pressure sensor 5 and a displacement sensing device 6, and the vacuum system comprises a vacuum cavity 7;
The upper heating plate 1 and the lower heating plate 2 are arranged in the vacuum cavity 7, the upper heating plate 1 is located above the lower heating plate 2, the loading head 3 is located above the vacuum cavity 7, one end of the loading column 4 penetrates through the upper wall of the vacuum cavity 7 to be connected with the upper heating plate 1, the pressure sensor 5 is located on the loading head 3, the displacement sensing device 6 comprises a displacement sensor 602 and a push rod 601 which are sequentially connected from top to bottom, the displacement sensor 602 is located above the vacuum cavity 7, and one end of the push rod 601 penetrates through the upper wall of the vacuum cavity 7 to be connected with the upper heating plate 1.
In the implementation, the value of the displacement sensor 602 when the upper heating plate 1 and the lower heating plate 2 are contacted is set to be zero, after a sample is placed, the thickness of the sample is transmitted to the displacement sensor 602 through the ejector rod 601, the thickness of the sample can be measured, and the thickness (deformation) of the sample under different pressures can be measured by applying pressure or pulling force to the sample through the loading system, so that the corresponding heat conductivity coefficient is measured. Because the upper heating plate 1 has weight, when the pressure loaded on the surface of the sample needs to be reduced, the upper heating plate 1 is lifted by the loading system, at the moment, the pressure applied on the sample is the weight of the upper heating plate 1 minus the upward tension, and when the pressure loaded on the surface of the sample needs to be increased, the upper heating plate 1 is pressed down by the loading system, at the moment, the pressure applied on the sample is the weight of the upper heating plate 1 plus the downward tension, and both the tension and the downward tension are monitored by the pressure sensor 5.
The system can in-situ measure and monitor the thickness and the deformation of the sample through the displacement sensing device, is provided with a loading system, can pressurize and depressurize the sample through the loading system, can adjust the pressure loaded on the surface of the sample at any time, can monitor the pressure change through the pressure sensor, and can simultaneously measure the relation between the pressure and the displacement of the flexible material.
The system of the invention not only can measure the sample performance under the condition of multi-parameter change, but also can provide more reliable detection when the thermal conductivity of the sample is independently detected, for example, the thermal conductivity of a flexible standard sample is 0.035W/(m.K) under the condition of no load at room temperature and normal pressure, the test result of a GHP type thermal conductivity meter is 0.040W/(m.K), the load pressure of the GHP type is 70kgf after measurement, the sample is compressed, the thickness of the sample is smaller than the thickness of the sample before loading, namely the thickness participating in calculation is larger than the actual thickness, and the test result is larger. When the system of the invention is used for detecting the heat conductivity coefficient of a sample, the actual detection thickness is measured by a displacement sensing device when the loading pressure of the sample is 70kgf, and the obtained test result is 0.036W/(m.K), because the sample is compressed, the gap is reduced, the heat conductivity coefficient is increased, and after the sample is completely unloaded, the upper heating is controlled to be just contacted with the sample, and the measured heat conductivity coefficient is 0.035W/(m.K) at the moment, so that the consistency with the nominal value is better.
In the present invention, in order to ensure the air tightness of the connection between the displacement sensing device and the vacuum chamber 7, it is preferable to provide a bellows 23 between the displacement sensing device and the vacuum chamber 7. Similarly, a bellows 23 is also provided between the loading column 4 and the vacuum chamber 7.
The method can realize the compression deformation measurement of the sample at a certain constant temperature by controlling the temperature of the upper heating plate and the lower heating plate, can realize the compression deformation measurement of the sample at a certain temperature gradient, vacuum degree and atmosphere, can simulate the compression deformation of the material under the actual working condition and the change condition of the heat conductivity coefficient along with the temperature, the pressure, the air pressure and the like through program control, can also fix a certain parameter and change other parameters at the same time, and can observe the performance change of the material (such as fixed air pressure, and can change the loading pressure and the temperature at the same time according to the actual working condition, record the thickness change of the sample and the like).
The upper heating plate and the lower heating plate in the invention can be conventional choices in the field, for example, the heating plate comprises a heat insulation layer, a resistor and a soaking plate, the resistor is arranged between the heat insulation layer and the soaking plate, one surface of the soaking plate is a contact surface with a sample, and the sample is heated by resistance heating, and in the implementation process, only the upper heating plate 1 can be heated, and both the upper heating plate 1 and the lower heating plate 2 can be heated.
In the invention, the displacement sensing device 6 can also be arranged in the vacuum cavity 7, but cannot be arranged on the vacuum cavity 7, because deformation can occur after the vacuum cavity is vacuumized, and the displacement accuracy is affected.
In the present invention, the push rod 601 is preferably made of a material having a bottom linear expansion amount, so as to prevent errors in the measured displacement change caused by the expansion of the push rod 601 due to the high temperature effect. Further preferably, as shown in fig. 2, the push rod 601 is connected to the upper heating plate 1 through a low expansion ceramic plate 603.
In the present invention, the ejector 601 is used instead of the optical sensor, because the optical sensor is easily interfered by the air flow and the vacuum degree to generate larger deviation, and the ejector 601 and the displacement sensor 602 can be suitable for in-situ measurement of the thickness of the sample under various measurement conditions such as high temperature and vacuum.
In the present invention, the sensor may be an LVDT or a grating.
In the present invention, it is preferable to provide two displacement sensing devices 6, respectively provided at both ends of the upper heating plate, so as to obtain more accurate measurement.
In the present invention, in order to improve the loading precision of the loading system on the pulling force of the upper heating plate 1, preferably, as shown in fig. 3, the loading system further comprises a spring 8, the loading column 4 comprises an upper loading column 401 and a lower loading column 402, the upper end of the upper loading column 401 is connected with the loading head 3, the lower end of the lower loading column 402 passes through the upper wall of the vacuum chamber 7 to be connected with the upper heating plate 1, the lower end of the upper loading column 401 is sleeved with the upper end of the lower loading column 402, the upper end of the spring 8 is connected with the periphery of the lower end of the upper loading column 401, and the lower end of the spring 8 is connected with the periphery of the upper end of the lower loading column 402. In the preferred embodiment, the tension is transmitted through the spring 8 when the tension is applied to the upper heating plate 1, the tension accuracy is improved by extending the acting distance through the spring 8, and the loading is performed by directly contacting the upper loading post 401 and the lower loading post 402 when the compression is applied to the lower heating plate 1.
In the present invention, in order to conveniently control the loading system to lift and press the upper heating plate 1, it is preferable that the loading system further includes a loading device lifting mechanism 20, and the loading device lifting mechanism 20 is disposed above the loading head 3 and connected to the loading head 3.
In the present invention, the temperature measuring means of the upper and lower surfaces of the sample may be a conventional choice in the art, and preferably, the thermocouple 9 penetrates the upper heating plate 1 to be in contact with the upper surface of the sample, and the thermocouple 9 penetrates the lower heating plate 1 to be in contact with the lower surface of the sample.
In the present invention, the measuring system further includes a heat flow measuring device 10, and the heat flow measuring device 10 is disposed on the upper surface of the lower heating plate 2. When the lower heating plate 2 includes a soaking plate, the heat flow measuring device 10 is disposed between the soaking plate and the heating body. The heat flow measurement device 10 may be a conventional choice in the art, for example, the heat flow measurement device 10 is a heat flow meter or a water card meter.
Specifically, as shown in fig. 4, the lower heating plate 2 includes a heating body 24 (e.g., a resistor) and a soaking plate 25 in this order from bottom to top, and the heat flow measuring device 10 is disposed between the heating body 24 and the soaking plate 25.
In the present invention, the heat flow measuring device 10 may be provided in a replaceable structure so as to replace the heat flow meter or the water card meter as needed. For example, the lower part of the lower heating plate 2 is sealed and fixed through the flange 21 and the supporting component, and a sufficient vacuum interface is reserved on the flange, so that the circuit and the waterway can be replaced conveniently. The comparison analysis of different testing methods can be carried out, the reliability of different testing methods can be compared under the same loading pressure, and the influence of the loading pressure of the equipment on the measuring result can be judged by simulating the loading pressure of different equipment (such as relaxation-resistant HFM 436 equipment based on a heat flow meter method, relaxation-resistant GHP 456 equipment based on a protection hot plate method, self-grinding equipment based on the heat flow meter method and the like).
In the present invention, preferably, the measuring system further includes a vacuum gauge 11, and the vacuum gauge 11 is located outside the vacuum chamber 7 and communicates with the inside of the vacuum chamber 7. The vacuum gauge 11 is used for measuring the pressure in the vacuum chamber 7.
In the present invention, in order to ensure that the temperature is constant during the measurement of the sample, it is preferable that a heat insulation layer 12 is disposed in the vacuum chamber 7, the heat insulation layer 12 encloses a heat insulation chamber, and the upper heating plate 1 and the lower heating plate 2 are located in the heat insulation chamber.
In the present invention, the vacuum system further comprises a mechanical pump 13 and/or a molecular pump 14, and the mechanical pump 13 and/or the molecular pump 14 are/is communicated with the inside of the vacuum chamber 7. A mechanical pump 13 and/or a molecular pump 14 are used to control the pressure in the vacuum chamber 7. When both the mechanical pump 13 and the molecular pump 14 are provided, the molecular pump 14 is provided between the mechanical pump 13 and the vacuum chamber 7.
The vacuum system further comprises a gas backfilling mechanism, a vacuum gauge and the like, wherein the gas backfilling mechanism can perform atmosphere backfilling after vacuumizing. The set constant air pressure can be maintained in the vacuum chamber 7 by controlling the intake air amount and the exhaust air amount. The air inflow rate can be adjusted to reduce the micro-positive pressure environment to prevent air from mixing in the test under normal pressure.
In the invention, the multi-parameter controllable heat conductivity coefficient testing system further comprises a lifting system, the lifting system comprises a motor 15, a cross rod 16, two right-angle conversion heads 17, two screw rods 18 and two vacuum cavity lifting mechanisms 19, the vacuum cavity lifting mechanisms 19 are respectively arranged at two sides of the vacuum cavity 7 and connected with the vacuum cavity 7, two ends of the cross rod 16 are respectively connected with the screw rods 18 through the right-angle conversion heads 17, and the screw rods 18 are respectively connected with the vacuum cavity lifting mechanisms 19. The lifting system is used for lifting the vacuum chamber 7 when changing samples or maintaining equipment, and simultaneously the loading system and the upper heating plate 1 are lifted together through the loading device lifting mechanism 20.
The multi-parameter controllable heat conductivity coefficient testing system further comprises a circulating cooling system and a control system, wherein the circulating cooling system comprises a water cooling machine and a water cooling pipeline 26, the upper heating plate, the lower heating plate, the vacuum cavity and the vacuum cavity are cooled, overheat of the system is prevented, the control system is connected with the heating system, the loading system, the measuring system, the vacuum system, the lifting system and the circulating cooling system, the control system mainly has the functions of collecting and obtaining various parameters, setting, programming, controlling heating and loading curves, and calculating the collected quantity to obtain a heat conductivity measuring result curve.
On the other hand, the invention provides a multi-parameter controllable heat conductivity coefficient testing method, and the multi-parameter controllable heat conductivity coefficient testing system comprises the following steps:
(a) The state of the sample is regulated, the initial thickness is recorded, and the value of a displacement sensor when the upper heating plate 1 and the lower heating plate 2 are contacted is set to be zero;
(b) Lifting the vacuum cavity 7 through a vacuum cavity lifting mechanism 19, and simultaneously lifting the upper heating plate 1 through a loading device lifting mechanism 20, so as to place a sample on the lower heating plate 2;
(c) The vacuum chamber 7 and the upper heating plate 1 are lowered, the vacuum degree of the vacuum chamber 7 and the temperature of the upper heating plate 1 are set, the sample is loaded with pressure through a loading system, the thickness of the sample under different pressures is measured through the pressure sensor 5 and the displacement sensing device 6, and the curve of the pressure and the thickness of the sample is recorded;
(d) Setting a thickness or pressure value, setting a thermal conductivity test heating curve, controlling heating, and recording temperature, thickness and heat flow information;
(e) And after the temperature of the upper surface and the lower surface of the sample is stable, taking a section of average temperature difference, thickness and heat flow of stable values, and calculating the heat conductivity coefficient.
According to the common testing method, equipment and testing standard (GB/T10294 and 10295) of the heat insulation material, the size of a test sample of the heat insulation material is 300mm by 300mm, and the thickness of the test sample is less than 50mm.
The multi-parameter controllable thermal conductivity testing system and method of the present invention are further described below with reference to specific examples.
In examples 1-2 below, the sample was mullite cotton felt with an initial thickness of 25mm.
Example 1
The thermal conductivity was measured at a thickness of 5-50 mm.
(A) And the value of the displacement sensor when the upper heating plate 1 and the lower heating plate 2 are contacted is set to be zero;
(b) Lifting the vacuum cavity 7 through a vacuum cavity lifting mechanism 19, and simultaneously lifting the upper heating plate 1 through a loading device lifting mechanism 20, so as to place a sample on the lower heating plate 2;
(c) The vacuum chamber 7 and the upper heating plate 1 are lowered, the vacuum degree of the vacuum chamber 7 and the temperature of the upper heating plate 1 are set, a sample is loaded with pressure (such as 50 kgf) through a loading system, the thickness under different pressures is measured through the pressure sensor 5 and the displacement sensing device 6, and the curve of the pressure and the thickness is recorded;
(d) Adjusting the thickness value of a sample, setting a thermal conductivity test heating curve, controlling heating, and recording temperature, thickness and heat flow information;
(e) And after the temperature of the upper surface and the lower surface of the sample is stable, taking a section of average temperature difference, thickness and heat flow of stable values, and calculating the heat conductivity coefficient.
Example 2
The relationship between sample temperature and thermal conductivity is measured.
(A) And the value of the displacement sensor when the upper heating plate 1 and the lower heating plate 2 are contacted is set to be zero;
(b) Lifting the vacuum cavity 7 through a vacuum cavity lifting mechanism 19, and simultaneously lifting the upper heating plate 1 through a loading device lifting mechanism 20, so as to place a sample on the lower heating plate 2;
(c) The vacuum cavity 7 and the upper heating plate 1 are lowered, the air pressure is set to be 100kpa, the air is not loaded, the thickness is 25mm, the loading pressure is 60kgf, the thickness is 22mm, the temperature is 200-900 ℃, and the test temperature curve is shown in figure 5;
(d) The apparent thermal conductivity curves and results were tested as shown in fig. 6. The thermal conductivity at different temperatures is shown in table 1 (loaded and unloaded):
TABLE 1
| 200°C | 400°C | 600°C | 800°C | 900°C | |
| Lambda (not loaded) | 0.0283 | 0.0382 | 0.0616 | 0.1044 | 0.1334 |
| Lambda (Loading) | 0.0296 | 0.0443 | 0.0716 | 0.1134 | 0.1430 |
Examples 3 to 7
Different deformation pressures of mullite cotton mats of different initial thicknesses were tested using test system examples 3-7 of the present invention and the results are shown in table 2.
TABLE 2
| Sample numbering | 10% Deformation pressure/N | 30% Deformation pressure/N | 50% Deformation pressure/N | Initial thickness/mm |
| Example 3 | 86.49 | 718.2 | 4167 | 22.89 |
| Example 4 | 123.3 | 1044 | 5490 | 23.35 |
| Example 5 | 92.7 | 707.4 | 3951 | 22.55 |
| Example 6 | 103.5 | 927 | 5382 | 23.18 |
| Example 7 | 165.6 | 1404 | 7155 | 23.34 |
As can be seen from table 2, the measurement system of the present invention can measure the compression set of samples at different pressures.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention.
Claims (7)
1. The multi-parameter controllable heat conductivity coefficient testing system is characterized by comprising a heating system, a loading system, a measuring system and a vacuum system;
The heating system comprises an upper heating plate (1) and a lower heating plate (2), the loading system comprises a loading head (3) and a loading column (4) which are sequentially connected from top to bottom, the measuring system comprises a pressure sensor (5) and a displacement sensing device (6), and the vacuum system comprises a vacuum cavity (7);
The upper heating plate (1) and the lower heating plate (2) are arranged in the vacuum cavity (7), the upper heating plate (1) is positioned above the lower heating plate (2), the loading head (3) is positioned above the vacuum cavity (7), one end of the loading column (4) penetrates through the upper wall of the vacuum cavity (7) to be connected with the upper heating plate (1), the pressure sensor (5) is positioned on the loading head (3), the displacement sensing device (6) comprises a displacement sensor (602) and a push rod (601) which are sequentially connected from top to bottom, the displacement sensor (602) is positioned above the vacuum cavity (7), and one end of the push rod (601) penetrates through the upper wall of the vacuum cavity (7) to be connected with the upper heating plate (1);
The loading system further comprises a spring (8), the loading column (4) comprises an upper loading column (401) and a lower loading column (402), the upper end of the upper loading column (401) is connected with the loading head (3), the lower end of the lower loading column (402) penetrates through the upper wall of the vacuum cavity (7) to be connected with the upper heating plate (1), the spring (8) is sleeved at the lower end of the upper loading column (401) and the upper end of the lower loading column (402), the upper end of the spring (8) is connected with the periphery of the lower end of the upper loading column (401), and the lower end of the spring (8) is connected with the periphery of the upper end of the lower loading column (402);
The loading system further comprises a loading device lifting mechanism (20), and the loading device lifting mechanism (20) is arranged above the loading head (3) and is connected with the loading head (3);
The multi-parameter controllable heat conductivity coefficient testing system further comprises a lifting system, the lifting system comprises a motor (15), a cross rod (16), two right-angle conversion heads (17), two screw rods (18) and two vacuum cavity lifting mechanisms (19), the vacuum cavity lifting mechanisms (19) are respectively arranged on two sides of the vacuum cavity (7) and are connected with the vacuum cavity (7), two ends of the cross rod (16) are respectively connected with the screw rods (18) through the right-angle conversion heads (17), and the screw rods (18) are respectively connected with the vacuum cavity lifting mechanisms (19).
2. The multi-parameter controllable thermal conductivity testing system according to claim 1, wherein said measuring system further comprises a thermocouple (9), said thermocouple (9) penetrating the upper heating plate (1) into contact with the upper surface of the sample, said thermocouple (9) penetrating the lower heating plate (2) into contact with the lower surface of the sample.
3. The multi-parameter controllable thermal conductivity testing system according to claim 2, further comprising a heat flow measuring device (10), the heat flow measuring device (10) being arranged on an upper surface of the lower heating plate (2).
4. A multi-parameter controllable thermal conductivity testing system according to claim 3, wherein said measuring system further comprises a vacuum gauge (11), said vacuum gauge (11) being located outside said vacuum chamber (7) and communicating with the interior of said vacuum chamber (7).
5. The multi-parameter controllable thermal conductivity testing system according to claim 1, wherein a thermal insulation layer (12) is arranged in the vacuum cavity (7), the thermal insulation layer (12) encloses a thermal insulation cavity, and the upper heating plate (1) and the lower heating plate (2) are positioned in the thermal insulation cavity.
6. The multi-parameter controllable thermal conductivity testing system according to claim 1, further comprising a mechanical pump (13) and/or a molecular pump (14), the mechanical pump (13) and/or molecular pump (14) being in communication with the interior of the vacuum chamber (7).
7. A multi-parameter controllable thermal conductivity testing method, characterized in that the multi-parameter controllable thermal conductivity testing system according to any one of claims 1-6 is adopted, and the multi-parameter controllable thermal conductivity testing method comprises:
(a) The state of the sample is regulated, the initial thickness is recorded, and the value of a displacement sensor when the upper heating plate (1) and the lower heating plate (2) are contacted is set to be zero;
(b) Lifting the vacuum cavity (7) through a vacuum cavity lifting mechanism (19), and simultaneously lifting the upper heating plate (1) through a loading device lifting mechanism (20), and placing a sample on the lower heating plate (2);
(c) The vacuum cavity (7) and the upper heating plate (1) are lowered, the vacuum degree of the vacuum cavity (7) and the temperature of the upper heating plate (1) are set, the sample is loaded with pressure through a loading system, the thickness of the sample under different pressures is measured through the pressure sensor (5) and the displacement sensing device (6), and the curve of the pressure and the thickness of the sample is recorded;
(d) Setting a thickness or pressure value, setting a thermal conductivity test heating curve, controlling heating, and recording temperature, thickness and heat flow information;
(e) And after the temperature of the upper surface and the lower surface of the sample is stable, taking a section of temperature difference, thickness and heat flow with stable values, and calculating the average heat conductivity coefficient.
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| PL272596A1 (en) * | 1988-05-20 | 1989-11-27 | Polska Akad Nauk Centrum | Method for determining heat conduction coefficient and a device for measuring the heat conduction coefficient of materials |
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| US6923570B2 (en) * | 2003-09-11 | 2005-08-02 | Hewlett-Packard Development Company, L.P. | Thermal interface material characterizing system |
| DE102007039365A1 (en) * | 2007-08-21 | 2009-02-26 | GMF-Gesellschaft für Motoren- und Fahrzeugtechnik mbH | Thermal resistance determining device for determining thermal resistance of sample, has sample retainer retaining sample in test chamber in such manner that sample is isolated against thermal conduction |
| CN102645449A (en) * | 2012-04-18 | 2012-08-22 | 天津大学 | Protective heat flow meter method thermal conductivity coefficient measuring instrument for realizing vacuum insulation and thickness measurement function |
| WO2019050876A1 (en) * | 2017-09-05 | 2019-03-14 | University Of Connecticut | Instruments for measurement of multiple material properties |
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| PL272596A1 (en) * | 1988-05-20 | 1989-11-27 | Polska Akad Nauk Centrum | Method for determining heat conduction coefficient and a device for measuring the heat conduction coefficient of materials |
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