Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the embodiments of the present application will be described in further detail with reference to the accompanying drawings.
Currently, light source assemblies typically include a heat sink, a laser mount, and a light source housing. The laser can generate a large amount of heat during operation, and the radiator is used for radiating the laser so as to avoid overheat damage of the laser.
The laser is arranged on the laser bracket, the laser is fixed between the light source shell and the radiator by the laser bracket, and the laser is attached to the light source shell on the radiating plate. The light source shell is provided with an opening, the lasers can be fixed at the opening between the lasers, so that light rays emitted by the lasers can be emitted into the light source shell, and a plurality of optical components (such as lenses, reflectors and the like) for adjusting the light rays emitted by the lasers can be arranged in the light source shell.
Wherein, the radiator can include radiator main part, heat pipe and heating panel, and the one end and the radiator main part of heat pipe are connected, and the other end is fixed on the heating panel, and the heating panel is laminated with the laser instrument to the heat that produces when absorbing the laser instrument operation, the heat pipe is used for giving off the heat that the heating panel department absorbed to the radiator main part, and the radiator main part can be through forced air cooling or the heat dissipation that the liquid cooling mode passed the heat pipe, so in order to realize the heat dissipation to the laser instrument duration.
The light source component has a complex structure and is difficult to assemble. In addition, for a small-sized laser, the packaging appearance structure is very compact, and the space for assembling and fixing the laser is very small. Because space is insufficient, many times the laser support can only adopt the mode of point contact to support fixedly, and this kind of mode precision is relatively poor, this just leads to the light-emitting direction of laser to appear probably the deviation, even for single laser, even have the deviation also can compensate the deviation through adjusting optical lens, but if have a plurality of lasers in the light source subassembly, just be difficult to compensate a plurality of lasers respectively, lead to the depth of parallelism of the light-emitting direction of a plurality of lasers relatively poor, and then the performance of light source subassembly also can be relatively poor.
Embodiments of the present application provide a light source assembly and a projection apparatus, which can solve some of the problems in the related art.
Fig. 1 is a schematic structural view of a light source assembly according to an embodiment of the present application. The light source assembly 10 includes:
a heat sink 11, a laser 12, and a light source housing 13.
The heat sink 11 includes a heat sink main body 111 and a heat dissipation plate 112 connected to the heat sink main body 111.
The laser 12 includes a substrate 121 and a light emitting unit 122, one surface of the substrate 121 is attached to the heat dissipating plate 112, and the other surface is provided with the light emitting unit 122, and the substrate 121 is fixedly connected to the light source housing 13 or the heat dissipating plate 112.
The light emitting unit 122 may include at least one laser chip, and the substrate 121 may include connection lines for connection with the laser chip to drive the laser chip to emit light.
In summary, in the light source assembly provided by the embodiment of the application, one surface of the substrate of the laser is attached to the heat dissipation plate in the heat sink, so that the heat dissipation plate can dissipate heat of the laser, and the substrate is fixedly connected with the light source housing or the heat dissipation plate, that is, the light source assembly is in a manner of fixing the laser on other functional structures, so that a laser bracket is not required to be separately arranged for the laser. The problem that the structure of the light source component is complex in the related art is solved, and the effect of simplifying the structure of the light source component is achieved.
In addition, as the light source component does not need to be provided with a laser bracket, the assembly difficulty of the light source component is further reduced, and the light source component and the projection equipment are miniaturized.
As can be seen from the above, in the light source assembly provided by the embodiment of the application, the heat dissipation plate and the laser have two structures, one structure is that the substrate in the laser is fixedly connected with the light source housing, and the other structure is that the substrate in the laser is fixedly connected with the heat dissipation plate. These two structures are described below, respectively.
Fig. 2 is an exploded view of another light source assembly according to an embodiment of the present application. Fig. 3 is a schematic view of the light source assembly shown in fig. 2 at another angle. Fig. 3 shows a schematic view of the structure of the laser 12 when mounted on the heat sink.
Referring to fig. 2 and 3, the heat dissipation plate 112 has a screw hole k1, the substrate 121 has an opening k2, and the light source assembly further includes a second screw 14, wherein the second screw 14 passes through the opening k2 and is screwed with the screw hole k1 of the heat dissipation plate 112 to fix the substrate 121. The fixing mode can firmly fix the laser on the radiating plate. The substrate 121 of the laser and the heat dissipation plate 112 can be in surface contact, so that the accuracy is high, and the light emitting direction of the laser can be controlled conveniently.
In addition, a thermal interface material (English: THERMAL INTERFACE MATERIAL) such as a thermal paste may be coated between the heat spreader plate 112 and the substrate 121 of the laser 12 to enhance the heat dissipation effect on the laser.
The heat conductive paste is an organic grease for heat transfer of electronic components, and can be formed by compounding metal oxide with good heat conductivity and insulation with organosiloxane, and has good heat conductivity, electrical insulation, shock absorption and impact resistance.
In an exemplary embodiment, the light source assembly includes at least two lasers 12, and the substrate 121 of both lasers 12 is attached to the heat sink 112. The heat dissipation plate 112 may have a surface with a higher flatness, and the substrate 121 of the two lasers 12 may be attached to the plane with the higher flatness, so that the parallelism of the light emitting directions of the at least two lasers 12 may be higher, and further, the performance of the light source assembly may be stronger. Fig. 2 shows the case where the number of lasers 12 is 2, but the light source assembly provided in the embodiment of the present application may further include more lasers, for example, 3, 4, 5, 6, 7, 8, etc.
In an exemplary embodiment, the substrate 121 may have a rectangular shape, the number of the openings k2 may be 2, and two openings k2 may be respectively located at edges of opposite sides of the substrate 121. Fig. 2 and 3 show the case where the number of lasers 12 is 2, and correspondingly, four second screws 14 fix the two lasers 12 to the heat dissipation plate 112, respectively.
Optionally, the heat dissipation plate 112 has a fixing boss t, and the substrate 121 is attached to the boss t. The boss t is a raised platform on the heat dissipating plate 112, and may be formed by a stamping process, where the boss may have a mesa with a high flatness, and the substrate 121 may be attached to the mesa with a high flatness. Compared with manufacturing a heat dissipation plate with higher overall flatness, manufacturing a boss with higher flatness is less difficult. Therefore, a boss is arranged on the heat radiation plate, and the substrate base plate of the laser is attached to the table top of the boss, so that the manufacturing difficulty of the heat radiation plate can be reduced, and the parallelism of emergent light of a plurality of lasers is improved.
Optionally, the heat sink 11 further includes a heat pipe 113, one end of the heat pipe 113 is connected to the heat sink body 111, and the heat dissipating plate 112 is attached to an outer wall of the heat pipe 113 to absorb heat on the heat dissipating plate 112.
A heat pipe (heat pipe) is a heat transfer element that relies on a phase change of an operating liquid within itself to effect heat transfer. In the embodiment of the present application, the heat pipe 113 may absorb heat on the heat dissipating plate 112 at the heat dissipating plate 112, and transfer the heat to the heat sink body 111, and be dissipated by the heat sink body 111.
The heat pipe 113 may be a grooved composite heat pipe, and the heat transfer effect of the heat pipe is strong, so that the heat dissipation effect of the laser can be improved. In addition, the groove type composite heat pipe can improve the raw material body Mao Xili by increasing the number of groove teeth and improving the stacking capillary structure, so that the groove type composite heat pipe has higher pores and higher fluid reflux speed, the efficiency of the heat pipe is improved, and the maximum heat transfer capacity of the low-tooth composite heat pipe can be broken through from 40-45W to 55W.
Of course, the heat pipe 113 may be a powder sintering heat pipe or other type of composite heat pipe, which is not limited in this embodiment of the present application.
Alternatively, the heat dissipation plate 112 is fixedly connected with the light source housing 13. The heat sink 112 may be fixedly connected to the light source housing 13 in various manners, and for example, fig. 4 is a schematic view illustrating another angle of the light source assembly shown in fig. 2, and referring to fig. 2 and 4, the light source assembly further includes a fixing screw d having a through hole k3 formed therein, the light source housing 13 having a protrusion g having a screw hole therein, and the fixing screw d may pass through the through hole k3 in the heat sink and form a screw connection with the screw hole in the protrusion g to fix the heat sink 112 to the light source housing 13. Of course, the heat dissipating plate 112 may be connected to the light source housing in other manners, which are not limited by the embodiment of the present application.
Referring to fig. 2 and 3, in an exemplary embodiment, the heat dissipation plate 121 further has a limiting protrusion x1, the substrate 121 of the laser has a limiting through hole k4 corresponding to the limiting protrusion x1, and when the substrate 121 of the laser is fixed on the heat dissipation plate 121, the limiting protrusion x1 on the heat dissipation plate 121 may penetrate into the limiting through hole k4 on the substrate 121 of the laser. The limiting bulge x1 and the limiting through hole k4 are used for playing a limiting role when the laser is installed, so that the installation difficulty of the laser can be reduced, the installation precision of the laser is improved, and the light emitting quality of the light source assembly is further improved. Fig. 2 and fig. 3 show that the substrate 121 of each laser has two limiting through holes k4, and the heat dissipation plate 121 has four limiting protrusions x1 corresponding to the substrate of the two lasers, respectively, however, the number of the limiting protrusions and the number of the limiting through holes may be other, which is not limited in the embodiment of the present application. In the light source assembly shown in fig. 2 and 3, the substrate 121 of the laser may have a rectangular shape, and the limit through holes k4 may be located at edges of opposite sides of the substrate 121 to provide a large arrangement space for the light emitting units.
For the heat dissipating plate 112 provided with the boss t, the limit projection x1 may be located on the boss t.
It should be noted that fig. 2 and fig. 3 show the case where two light emitting units 122 are disposed on the substrate 121 in each laser 12, but each laser 12 may further include more light emitting units 122, which is not described in detail in the embodiment of the present application.
Fig. 2 and 3 illustrate a structure in which a laser is fixed to a heat sink, and the laser may be fixed to the heat sink in other manners, and in an exemplary embodiment, the heat sink may have a stud thereon, and a substrate of the laser may have an opening thereon, and the light source assembly further includes a nut, where the stud passes through the opening and is screwed with the nut to fix the substrate.
In an exemplary embodiment, referring to fig. 4, the heat sink 11 in the light source assembly further includes a heat dissipating cover 114, one end of the heat pipe 113 is located in the heat sink body 111, and the other end passes between the heat dissipating cover 114 and the heat dissipating plate 112 and is exposed outside the heat dissipating cover 114 and the heat dissipating plate 112. The heat dissipation cover plate 114 and the heat dissipation plate 112 are respectively located at two sides of the heat pipe 113 to clamp the heat pipe 113, and the heat dissipation cover plate 114 can be fixedly connected with the heat dissipation plate 112 for protecting the heat pipe 113 from being damaged by other structures. Of course, the light source assembly provided in the embodiment of the application may not include the heat dissipation cover plate 114, so that the structures of the heat sink and the light source assembly can be further simplified, and the costs of the heat sink and the light source assembly can be reduced.
It should be noted that, in the light source assembly provided in the embodiment of the present application, the number of heat pipes in the heat sink may be at least one, and in the light source assembly shown in fig. 4, the number of heat pipes is 4, but the number of heat pipes may also be other, such as 2,3, 5, 6 or more, which is not limited in the embodiment of the present application.
In an exemplary embodiment, referring to fig. 2, the heat dissipating body 111 of the heat sink may include an air-cooled heat sink, which may include a fan (not shown in fig. 2) and a fin structure p, which may include a plurality of sheet structures disposed at intervals for increasing a heat exchanging surface area. The heat of the heat pipe 113 can be dissipated into the fin structure p to heat the air contained in the fin structure p, and the air outlet or the air inlet of the fan can face the fin structure p to blow or suck the heated hot air contained in the fin structure, so as to realize continuous heat dissipation of the heat pipe 113.
Of course, the heat dissipating body 111 of the heat sink may also include other types of heat sinks, such as a water-cooled heat sink, and the embodiment of the present application is not limited thereto.
In summary, in the light source assembly provided by the embodiment of the application, one surface of the substrate of the laser is attached to the heat dissipation plate in the heat sink, so that the heat dissipation plate can dissipate heat of the laser, and the substrate is fixedly connected with the light source housing or the heat dissipation plate, that is, the light source assembly is in a manner of fixing the laser on other functional structures, so that a laser bracket is not required to be separately arranged for the laser. The problem that the structure of the light source component is complex in the related art is solved, and the effect of simplifying the structure of the light source component is achieved.
In addition, the light source component does not need to be provided with a laser bracket, so that the assembly difficulty of the light source component is reduced, and the structure in the light source component is simplified, so that the light source component and the projection equipment are miniaturized.
In addition, the substrate base plates of the lasers in the light source assembly are fixed on the boss with higher flatness on the heat dissipation plate, so that the parallelism of emergent light of the lasers is higher, and the light-emitting quality of the light source assembly is improved.
Fig. 5 is a schematic structural diagram of another light source assembly according to an embodiment of the present application. Fig. 6 is a schematic view of the light source assembly of fig. 5 at another angle. Fig. 5 shows a schematic view of a structure in which a laser is mounted on a light source housing. Wherein the light source housing 13 has a screw hole (not shown in fig. 5 and 6) thereon, and the substrate 121 has an opening (not shown in fig. 5 and 6), the light source assembly further includes a first screw 15, and the first screw 15 passes through the opening and is screwed with the screw hole of the light source housing to fix the substrate 121 in the laser. The first screw 15 includes a shaft (not shown in fig. 5 and 6) and a screw head 151 at one end of the shaft, and the shaft passes through the opening and is screwed to a screw hole in the light source housing 13. The substrate 121 of the laser and the heat dissipation plate 112 can be in surface contact, so that the accuracy is high, and the light emitting direction of the laser can be controlled conveniently.
As can be seen from fig. 5, the screw head 151 of the first screw 15 has a certain protrusion on the back side of the substrate 121, and the protrusion may have a certain influence on the adhesion of the substrate 121 to the heat dissipation plate 112, for example, it may be difficult to adhere the substrate 121 to the heat dissipation plate 112, or the adhesion area of the substrate 121 to the heat dissipation plate may be reduced, which is not beneficial to heat dissipation of the laser. In this regard, in an exemplary embodiment, as shown in fig. 6, the heat dissipating plate 112 has a relief groove c therein, and the screw portion may be located in the relief groove c. The abdication groove c can be used as an abdication structure, so that the substrate 121 of the laser can be more tightly attached to the heat dissipation plate 112, and the contact area between the substrate 121 of the laser and the heat dissipation plate 112 can be hardly reduced, thereby avoiding the influence on the heat dissipation effect of the laser.
Fig. 5 and 6 show the case where the light source assembly includes two lasers, and four first screws fix the two lasers to the light source housing 13, respectively, and the number of the relief grooves c is also four, so as to avoid the four first screws 15.
In addition, a thermal interface material, such as a thermal paste, may be coated between the heat spreader plate 112 and the substrate 121 of the laser 12 to enhance the heat dissipation effect for the laser.
The heat conductive paste is an organic grease for heat transfer of electronic components, and can be formed by compounding metal oxide with good heat conductivity and insulation with organosiloxane, and has good heat conductivity, electrical insulation, shock absorption and impact resistance.
In an exemplary embodiment, the light source assembly includes at least two lasers 12, and the substrate 121 of both lasers 12 is attached to the heat sink 112. The heat dissipation plate 112 may have a surface with a higher flatness, and the substrate 121 of the two lasers 12 may be attached to the plane with the higher flatness, so that the parallelism of the light emitting directions of the at least two lasers 12 may be higher, and further, the performance of the light source assembly may be stronger. Fig. 5 shows the case where the number of lasers 12 is 2, but the light source assembly provided in the embodiment of the present application may further include more lasers, for example, 3, 4, 5, 6, 7, 8, etc.
As shown in fig. 6, the heat sink 112 has a fixing boss t, and the substrate 121 is bonded to the boss t. The boss t is a raised platform on the heat dissipating plate 112, and may be formed by a stamping process, where the boss may have a mesa with a higher flatness, and the substrate may be attached to the mesa with a higher flatness. Compared with manufacturing a heat dissipation plate with higher overall flatness, manufacturing a boss with higher flatness is less difficult. Therefore, a boss is arranged on the heat radiation plate, and the substrate base plate of the laser is attached to the table top of the boss, so that the manufacturing difficulty of the heat radiation plate can be reduced, and the parallelism of emergent light of a plurality of lasers is improved. Alternatively, the relief groove c on the heat dissipation plate 112 may be located on the boss t.
Optionally, the heat sink 11 further includes a heat pipe 113, one end of the heat pipe 113 is connected to the heat sink body 111, and the heat dissipating plate 112 is attached to an outer wall of the heat pipe 113 to absorb heat on the heat dissipating plate 112.
A heat pipe (heat pipe) is a heat transfer element that relies on a phase change of an operating liquid within itself to effect heat transfer. In the embodiment of the present application, the heat pipe 113 may absorb heat on the heat dissipating plate 112 at the heat dissipating plate 112, and transfer the heat to the heat sink body 111, and be dissipated by the heat sink body 111.
The heat pipe 113 may be a low-tooth composite heat pipe, and the heat transfer effect of the heat pipe is strong, so that the heat dissipation effect of the laser can be improved. In addition, the heat transfer effect of the heat pipe can be adjusted by adjusting the number of teeth in the low-tooth composite heat pipe. Of course, the heat pipe 113 may be a powder sintering heat pipe or a composite heat pipe, which is not limited in the embodiment of the present application.
Alternatively, the heat dissipation plate 112 is fixedly connected with the light source housing 13. The heat sink 112 may be fixedly connected to the light source housing 13 in various manners, and illustratively, the light source assembly further includes a fixing screw d having a through hole k3 therein, and the light source housing 13 has a protrusion g having a screw hole therein, and the fixing screw d may pass through the through hole k3 in the heat sink and form a screw connection with the screw hole in the protrusion g to fix the heat sink 112 to the light source housing 13. Of course, the heat dissipating plate 112 may be connected to the light source housing in other manners, which are not limited by the embodiment of the present application.
In an exemplary embodiment, as shown in fig. 5, the light source housing 13 further has a limiting protrusion x2, the substrate 121 of the laser has a limiting through hole corresponding to the limiting protrusion x2, and when the laser is fixed on the light source housing, the limiting protrusion x2 on the light source housing 13 may penetrate into the limiting through hole on the substrate 121 of the laser. The limiting protrusion x2 and the limiting through hole are used for playing a limiting role when the laser is installed, so that the installation difficulty of the laser can be reduced, the installation accuracy of the laser is improved, and the light emitting quality of the light source assembly is improved.
In an exemplary embodiment, referring to fig. 5, the heat sink 11 in the light source assembly further includes a heat dissipating cover 114, one end of the heat pipe 113 is located in the heat sink body 111, and the other end passes between the heat dissipating cover 114 and the heat dissipating plate 112 and is exposed outside the heat dissipating cover 114 and the heat dissipating plate 112. The heat dissipation cover plate 114 and the heat dissipation plate 112 are respectively located at two sides of the heat pipe 113 to clamp the heat pipe 113, and the heat dissipation cover plate 114 can be fixedly connected with the heat dissipation plate 112 for protecting the heat pipe 113 from being damaged by other structures. Of course, the light source assembly provided in the embodiment of the application may not include the heat dissipation cover plate 114, so that the structures of the heat sink and the light source assembly can be further simplified, and the costs of the heat sink and the light source assembly can be reduced.
It should be noted that, in the light source assembly provided in the embodiment of the present application, the number of heat pipes in the heat sink may be at least one, and in the light source assembly shown in fig. 5, the number of heat pipes is 4, but the number of heat pipes may also be other, such as 2,3, 5, 6 or more, which is not limited in the embodiment of the present application.
In an exemplary embodiment, referring to fig. 5, the heat dissipating body 111 of the heat sink may include an air-cooled heat sink, which may include a fan (not shown in fig. 5) and a fin structure p, which may include a plurality of sheet structures disposed at intervals for increasing a heat exchanging surface area. The heat of the heat pipe 113 can be dissipated into the fin structure p to heat the air contained in the fin structure p, and the air outlet or the air inlet of the fan can face the fin structure p to blow or suck the heated hot air contained in the fin structure, so as to realize continuous heat dissipation of the heat pipe 113.
Of course, the heat dissipating body 111 of the heat sink may also include other types of heat sinks, such as a water-cooled heat sink, and the embodiment of the present application is not limited thereto.
Fig. 7 is another schematic structural view of the light source assembly shown in fig. 5, fig. 7 is a schematic structural view showing the heat dissipation plate 112, the laser 12 and the light source housing 13 when they are assembled together, the laser 12 is located between the heat dissipation plate 112 and the light source housing 13, and the heat dissipation plate 112 is fixedly connected with the light source housing 13.
In summary, in the light source assembly provided by the embodiment of the application, one surface of the substrate of the laser is attached to the heat dissipation plate in the heat sink, so that the heat dissipation plate can dissipate heat of the laser, and the substrate is fixedly connected with the light source housing or the heat dissipation plate, that is, the light source assembly is in a manner of fixing the laser on other functional structures, so that a laser bracket is not required to be separately arranged for the laser. The problem that the structure of the light source component is complex in the related art is solved, and the effect of simplifying the structure of the light source component is achieved.
In addition, the light source component does not need to be provided with a laser bracket, so that the assembly difficulty of the light source component is reduced, and the structure in the light source component is simplified, so that the light source component and the projection equipment are miniaturized.
In addition, the substrate base plates of the lasers in the light source assembly are fixed on the boss with higher flatness on the heat dissipation plate, so that the parallelism of emergent light of the lasers is higher, and the light-emitting quality of the light source assembly is improved.
Fig. 7 is a block diagram showing a structure of a projection apparatus according to an embodiment of the present application. The projection device comprises a light source assembly 10, an illumination assembly 20 and a projection lens 30.
The light source assembly 10 is used to provide various colors of light to the light engine 20. The light source assembly 10 may be any of the light source assemblies provided in the above embodiments.
The illumination assembly 20 is used for processing the color light to obtain an image beam. The illumination assembly may include some drive circuitry, control components, light valve components, etc. in the projection device. The driving circuit may include a laser driving circuit, a fluorescent wheel driving circuit, etc., and the control assembly may include a display panel. The light valve assembly may include a digital micromirror device (Digital Micromirror Devices, DMD), galvanometer, or the like.
The projection lens 30 is used for adjusting the image beam and projecting the adjusted image beam out of the projection device.
The projection lens 30 may include any one of the projection lenses provided in the above embodiments.
In summary, in the projection device provided by the embodiment of the application, one surface of the substrate of the laser in the light source assembly is attached to the heat dissipation plate in the heat sink, so that the heat dissipation plate can dissipate heat of the laser, and the substrate is fixedly connected with the light source housing or the heat dissipation plate, that is, the light source assembly is in a manner of fixing the laser on other functional structures, so that a laser bracket is not required to be separately arranged for the laser. The problem that the structure of the light source component is complex in the related art is solved, and the effect of simplifying the structure of the light source component is achieved.
In addition, the light source component does not need to be provided with a laser bracket, so that the assembly difficulty of the light source component is reduced, and the structure in the light source component is simplified, so that the miniaturization of the projection equipment is facilitated.
In addition, the substrate base plates of the lasers in the light source assembly are fixed on the boss with higher flatness on the radiating plate, so that the parallelism of emergent light of the lasers is higher, and the projection quality of the projection equipment is improved.
In the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "plurality" refers to two or more, unless explicitly defined otherwise.
The foregoing description of the preferred embodiments of the present application is not intended to limit the application, but rather, the application is to be construed as limited to the appended claims.