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CN116339054B - Light source assembly and projection equipment - Google Patents

Light source assembly and projection equipment

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Publication number
CN116339054B
CN116339054B CN202111601436.2A CN202111601436A CN116339054B CN 116339054 B CN116339054 B CN 116339054B CN 202111601436 A CN202111601436 A CN 202111601436A CN 116339054 B CN116339054 B CN 116339054B
Authority
CN
China
Prior art keywords
light source
heat
laser
heat sink
source assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202111601436.2A
Other languages
Chinese (zh)
Other versions
CN116339054A (en
Inventor
张琰
田新团
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Hisense Laser Display Co Ltd
Original Assignee
Qingdao Hisense Laser Display Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Hisense Laser Display Co Ltd filed Critical Qingdao Hisense Laser Display Co Ltd
Priority to CN202111601436.2A priority Critical patent/CN116339054B/en
Publication of CN116339054A publication Critical patent/CN116339054A/en
Application granted granted Critical
Publication of CN116339054B publication Critical patent/CN116339054B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/14Details
    • G03B21/20Lamp housings
    • G03B21/2006Lamp housings characterised by the light source
    • G03B21/2033LED or laser light sources
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/14Details
    • G03B21/16Cooling; Preventing overheating
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/14Details
    • G03B21/20Lamp housings
    • G03B21/2006Lamp housings characterised by the light source
    • G03B21/2013Plural light sources

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

本申请公开了一种光源组件以及投影设备,属于投影技术领域。所述光源组件包括散热器、激光器以及光源壳体;所述散热器包括散热器主体以及与所述散热器主体连接的散热板;所述激光器包括衬底基板以及发光单元,所述衬底基板的一面与所述散热板贴合,另一面设置有所述发光单元,所述衬底基板与所述光源壳体或者所述散热板固定连接。本申请通过将激光器的衬底基板的一面与散热器中的散热板贴合,以使散热板能够对激光器进行散热,并将该衬底基板与光源壳体或者散热板固定连接,从而无需在光源中设置激光器支架,解决了相关技术中光源组件的结构较为复杂的问题,实现了简化光源组件的结构的效果。

The present application discloses a light source assembly and a projection device, belonging to the field of projection technology. The light source assembly includes a radiator, a laser, and a light source housing; the radiator includes a radiator body and a heat sink connected to the radiator body; the laser includes a substrate and a light-emitting unit, one side of the substrate is bonded to the heat sink, and the other side is provided with the light-emitting unit, and the substrate is fixedly connected to the light source housing or the heat sink. The present application bonds one side of the laser substrate to the heat sink in the radiator so that the heat sink can dissipate heat from the laser, and fixes the substrate to the light source housing or the heat sink, thereby eliminating the need for a laser bracket in the light source. This solves the problem of the relatively complex structure of the light source assembly in the related art and achieves the effect of simplifying the structure of the light source assembly.

Description

Light source assembly and projection device
Technical Field
The present disclosure relates to projection technology, and more particularly, to a light source assembly and a projection apparatus.
Background
A projection apparatus is an apparatus capable of projecting an image beam, and generally includes a light source assembly, an illumination assembly, a projection lens, and the like.
A light source assembly comprises a radiator, a laser support and a light source shell, wherein the laser is arranged on the laser support, and the laser support is respectively connected with the radiator and the light source shell and used for enabling the radiator to radiate the laser and enabling light beams emitted by the laser to be emitted into the light source shell.
But the structure of the above-described light source assembly is relatively complicated.
Disclosure of Invention
The embodiment of the application provides a light source assembly and projection equipment. The technical scheme is as follows:
According to an aspect of the present application, there is provided a light source assembly including a heat sink, a laser, and a light source housing;
The radiator comprises a radiator main body and a radiating plate connected with the radiator main body;
the laser comprises a substrate and a light-emitting unit, wherein one surface of the substrate is attached to the heat-radiating plate, the light-emitting unit is arranged on the other surface of the substrate, and the substrate is fixedly connected with the light source shell or the heat-radiating plate.
Optionally, when the substrate is fixedly connected with the light source housing, the light source housing is provided with a screw hole, the substrate is provided with an opening, the light source assembly further comprises a first screw, and the first screw passes through the opening and is in threaded connection with the screw hole on the light source housing so as to fix the substrate.
Optionally, the heat dissipation plate is provided with a relief groove, the first screw comprises a screw rod and a screw head located at one end of the screw rod, the screw rod penetrates through the opening and is in threaded connection with a screw hole on the light source shell, and the screw head is located in the relief groove.
Optionally, when the substrate is fixedly connected with the heat dissipation plate, the heat dissipation plate is provided with a screw hole, the substrate is provided with an opening, the light source assembly further comprises a second screw, and the second screw passes through the opening and is in threaded connection with the screw hole on the heat dissipation plate so as to fix the substrate.
Optionally, when the substrate is fixedly connected with the heat dissipation plate, the heat dissipation plate is provided with a stud, the substrate is provided with an opening, the light source assembly further comprises a nut, and the stud passes through the opening and is in threaded connection with the nut so as to fix the substrate.
Optionally, the light source assembly includes at least two lasers, and the substrate base plate of two lasers is all laminated with the heating panel.
Optionally, the heat dissipation plate is provided with a fixing boss, and the substrate base plate is attached to the boss.
Optionally, the radiator further comprises a heat pipe, one end of the heat pipe is connected with the radiator main body, the heat dissipation plate is attached to the outer wall of the heat pipe, and the heat pipe is a grooved composite heat pipe.
Optionally, the heat dissipation plate is fixedly connected with the light source housing.
According to another aspect of the present application, there is provided a projection apparatus including the above-described light source assembly.
The technical scheme provided by the embodiment of the application has the beneficial effects that at least:
One side of a substrate of the laser is attached to the radiating plate in the radiator, so that the radiating plate can radiate heat of the laser, and the substrate is fixedly connected with the light source shell or the radiating plate, namely, the light source assembly is fixed on other functional structures, so that a laser bracket is not required to be arranged for the laser independently. The problem that the structure of the light source component is complex in the related art is solved, and the effect of simplifying the structure of the light source component is achieved.
In addition, as the light source component does not need to be provided with a laser bracket, the assembly difficulty of the light source component is further reduced, and the light source component and the projection equipment are miniaturized.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a light source assembly according to an embodiment of the present application;
FIG. 2 is a schematic view of an exploded view of another light source assembly according to an embodiment of the present application;
FIG. 3 is a schematic view of the light source assembly of FIG. 2 at another angle;
FIG. 4 is a schematic view of another angle of the light source assembly shown in FIG. 2;
FIG. 5 is a schematic view of another light source module according to an embodiment of the present application;
FIG. 6 is a schematic view of the light source assembly of FIG. 5 at another angle;
FIG. 7 is another structural schematic view of the light source assembly shown in FIG. 5;
Fig. 8 is a schematic structural diagram of a projection device according to an embodiment of the present application.
Specific embodiments of the present application have been shown by way of the above drawings and will be described in more detail below. The drawings and the written description are not intended to limit the scope of the inventive concepts in any way, but rather to illustrate the inventive concepts to those skilled in the art by reference to the specific embodiments.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the embodiments of the present application will be described in further detail with reference to the accompanying drawings.
Currently, light source assemblies typically include a heat sink, a laser mount, and a light source housing. The laser can generate a large amount of heat during operation, and the radiator is used for radiating the laser so as to avoid overheat damage of the laser.
The laser is arranged on the laser bracket, the laser is fixed between the light source shell and the radiator by the laser bracket, and the laser is attached to the light source shell on the radiating plate. The light source shell is provided with an opening, the lasers can be fixed at the opening between the lasers, so that light rays emitted by the lasers can be emitted into the light source shell, and a plurality of optical components (such as lenses, reflectors and the like) for adjusting the light rays emitted by the lasers can be arranged in the light source shell.
Wherein, the radiator can include radiator main part, heat pipe and heating panel, and the one end and the radiator main part of heat pipe are connected, and the other end is fixed on the heating panel, and the heating panel is laminated with the laser instrument to the heat that produces when absorbing the laser instrument operation, the heat pipe is used for giving off the heat that the heating panel department absorbed to the radiator main part, and the radiator main part can be through forced air cooling or the heat dissipation that the liquid cooling mode passed the heat pipe, so in order to realize the heat dissipation to the laser instrument duration.
The light source component has a complex structure and is difficult to assemble. In addition, for a small-sized laser, the packaging appearance structure is very compact, and the space for assembling and fixing the laser is very small. Because space is insufficient, many times the laser support can only adopt the mode of point contact to support fixedly, and this kind of mode precision is relatively poor, this just leads to the light-emitting direction of laser to appear probably the deviation, even for single laser, even have the deviation also can compensate the deviation through adjusting optical lens, but if have a plurality of lasers in the light source subassembly, just be difficult to compensate a plurality of lasers respectively, lead to the depth of parallelism of the light-emitting direction of a plurality of lasers relatively poor, and then the performance of light source subassembly also can be relatively poor.
Embodiments of the present application provide a light source assembly and a projection apparatus, which can solve some of the problems in the related art.
Fig. 1 is a schematic structural view of a light source assembly according to an embodiment of the present application. The light source assembly 10 includes:
a heat sink 11, a laser 12, and a light source housing 13.
The heat sink 11 includes a heat sink main body 111 and a heat dissipation plate 112 connected to the heat sink main body 111.
The laser 12 includes a substrate 121 and a light emitting unit 122, one surface of the substrate 121 is attached to the heat dissipating plate 112, and the other surface is provided with the light emitting unit 122, and the substrate 121 is fixedly connected to the light source housing 13 or the heat dissipating plate 112.
The light emitting unit 122 may include at least one laser chip, and the substrate 121 may include connection lines for connection with the laser chip to drive the laser chip to emit light.
In summary, in the light source assembly provided by the embodiment of the application, one surface of the substrate of the laser is attached to the heat dissipation plate in the heat sink, so that the heat dissipation plate can dissipate heat of the laser, and the substrate is fixedly connected with the light source housing or the heat dissipation plate, that is, the light source assembly is in a manner of fixing the laser on other functional structures, so that a laser bracket is not required to be separately arranged for the laser. The problem that the structure of the light source component is complex in the related art is solved, and the effect of simplifying the structure of the light source component is achieved.
In addition, as the light source component does not need to be provided with a laser bracket, the assembly difficulty of the light source component is further reduced, and the light source component and the projection equipment are miniaturized.
As can be seen from the above, in the light source assembly provided by the embodiment of the application, the heat dissipation plate and the laser have two structures, one structure is that the substrate in the laser is fixedly connected with the light source housing, and the other structure is that the substrate in the laser is fixedly connected with the heat dissipation plate. These two structures are described below, respectively.
Fig. 2 is an exploded view of another light source assembly according to an embodiment of the present application. Fig. 3 is a schematic view of the light source assembly shown in fig. 2 at another angle. Fig. 3 shows a schematic view of the structure of the laser 12 when mounted on the heat sink.
Referring to fig. 2 and 3, the heat dissipation plate 112 has a screw hole k1, the substrate 121 has an opening k2, and the light source assembly further includes a second screw 14, wherein the second screw 14 passes through the opening k2 and is screwed with the screw hole k1 of the heat dissipation plate 112 to fix the substrate 121. The fixing mode can firmly fix the laser on the radiating plate. The substrate 121 of the laser and the heat dissipation plate 112 can be in surface contact, so that the accuracy is high, and the light emitting direction of the laser can be controlled conveniently.
In addition, a thermal interface material (English: THERMAL INTERFACE MATERIAL) such as a thermal paste may be coated between the heat spreader plate 112 and the substrate 121 of the laser 12 to enhance the heat dissipation effect on the laser.
The heat conductive paste is an organic grease for heat transfer of electronic components, and can be formed by compounding metal oxide with good heat conductivity and insulation with organosiloxane, and has good heat conductivity, electrical insulation, shock absorption and impact resistance.
In an exemplary embodiment, the light source assembly includes at least two lasers 12, and the substrate 121 of both lasers 12 is attached to the heat sink 112. The heat dissipation plate 112 may have a surface with a higher flatness, and the substrate 121 of the two lasers 12 may be attached to the plane with the higher flatness, so that the parallelism of the light emitting directions of the at least two lasers 12 may be higher, and further, the performance of the light source assembly may be stronger. Fig. 2 shows the case where the number of lasers 12 is 2, but the light source assembly provided in the embodiment of the present application may further include more lasers, for example, 3, 4, 5, 6, 7, 8, etc.
In an exemplary embodiment, the substrate 121 may have a rectangular shape, the number of the openings k2 may be 2, and two openings k2 may be respectively located at edges of opposite sides of the substrate 121. Fig. 2 and 3 show the case where the number of lasers 12 is 2, and correspondingly, four second screws 14 fix the two lasers 12 to the heat dissipation plate 112, respectively.
Optionally, the heat dissipation plate 112 has a fixing boss t, and the substrate 121 is attached to the boss t. The boss t is a raised platform on the heat dissipating plate 112, and may be formed by a stamping process, where the boss may have a mesa with a high flatness, and the substrate 121 may be attached to the mesa with a high flatness. Compared with manufacturing a heat dissipation plate with higher overall flatness, manufacturing a boss with higher flatness is less difficult. Therefore, a boss is arranged on the heat radiation plate, and the substrate base plate of the laser is attached to the table top of the boss, so that the manufacturing difficulty of the heat radiation plate can be reduced, and the parallelism of emergent light of a plurality of lasers is improved.
Optionally, the heat sink 11 further includes a heat pipe 113, one end of the heat pipe 113 is connected to the heat sink body 111, and the heat dissipating plate 112 is attached to an outer wall of the heat pipe 113 to absorb heat on the heat dissipating plate 112.
A heat pipe (heat pipe) is a heat transfer element that relies on a phase change of an operating liquid within itself to effect heat transfer. In the embodiment of the present application, the heat pipe 113 may absorb heat on the heat dissipating plate 112 at the heat dissipating plate 112, and transfer the heat to the heat sink body 111, and be dissipated by the heat sink body 111.
The heat pipe 113 may be a grooved composite heat pipe, and the heat transfer effect of the heat pipe is strong, so that the heat dissipation effect of the laser can be improved. In addition, the groove type composite heat pipe can improve the raw material body Mao Xili by increasing the number of groove teeth and improving the stacking capillary structure, so that the groove type composite heat pipe has higher pores and higher fluid reflux speed, the efficiency of the heat pipe is improved, and the maximum heat transfer capacity of the low-tooth composite heat pipe can be broken through from 40-45W to 55W.
Of course, the heat pipe 113 may be a powder sintering heat pipe or other type of composite heat pipe, which is not limited in this embodiment of the present application.
Alternatively, the heat dissipation plate 112 is fixedly connected with the light source housing 13. The heat sink 112 may be fixedly connected to the light source housing 13 in various manners, and for example, fig. 4 is a schematic view illustrating another angle of the light source assembly shown in fig. 2, and referring to fig. 2 and 4, the light source assembly further includes a fixing screw d having a through hole k3 formed therein, the light source housing 13 having a protrusion g having a screw hole therein, and the fixing screw d may pass through the through hole k3 in the heat sink and form a screw connection with the screw hole in the protrusion g to fix the heat sink 112 to the light source housing 13. Of course, the heat dissipating plate 112 may be connected to the light source housing in other manners, which are not limited by the embodiment of the present application.
Referring to fig. 2 and 3, in an exemplary embodiment, the heat dissipation plate 121 further has a limiting protrusion x1, the substrate 121 of the laser has a limiting through hole k4 corresponding to the limiting protrusion x1, and when the substrate 121 of the laser is fixed on the heat dissipation plate 121, the limiting protrusion x1 on the heat dissipation plate 121 may penetrate into the limiting through hole k4 on the substrate 121 of the laser. The limiting bulge x1 and the limiting through hole k4 are used for playing a limiting role when the laser is installed, so that the installation difficulty of the laser can be reduced, the installation precision of the laser is improved, and the light emitting quality of the light source assembly is further improved. Fig. 2 and fig. 3 show that the substrate 121 of each laser has two limiting through holes k4, and the heat dissipation plate 121 has four limiting protrusions x1 corresponding to the substrate of the two lasers, respectively, however, the number of the limiting protrusions and the number of the limiting through holes may be other, which is not limited in the embodiment of the present application. In the light source assembly shown in fig. 2 and 3, the substrate 121 of the laser may have a rectangular shape, and the limit through holes k4 may be located at edges of opposite sides of the substrate 121 to provide a large arrangement space for the light emitting units.
For the heat dissipating plate 112 provided with the boss t, the limit projection x1 may be located on the boss t.
It should be noted that fig. 2 and fig. 3 show the case where two light emitting units 122 are disposed on the substrate 121 in each laser 12, but each laser 12 may further include more light emitting units 122, which is not described in detail in the embodiment of the present application.
Fig. 2 and 3 illustrate a structure in which a laser is fixed to a heat sink, and the laser may be fixed to the heat sink in other manners, and in an exemplary embodiment, the heat sink may have a stud thereon, and a substrate of the laser may have an opening thereon, and the light source assembly further includes a nut, where the stud passes through the opening and is screwed with the nut to fix the substrate.
In an exemplary embodiment, referring to fig. 4, the heat sink 11 in the light source assembly further includes a heat dissipating cover 114, one end of the heat pipe 113 is located in the heat sink body 111, and the other end passes between the heat dissipating cover 114 and the heat dissipating plate 112 and is exposed outside the heat dissipating cover 114 and the heat dissipating plate 112. The heat dissipation cover plate 114 and the heat dissipation plate 112 are respectively located at two sides of the heat pipe 113 to clamp the heat pipe 113, and the heat dissipation cover plate 114 can be fixedly connected with the heat dissipation plate 112 for protecting the heat pipe 113 from being damaged by other structures. Of course, the light source assembly provided in the embodiment of the application may not include the heat dissipation cover plate 114, so that the structures of the heat sink and the light source assembly can be further simplified, and the costs of the heat sink and the light source assembly can be reduced.
It should be noted that, in the light source assembly provided in the embodiment of the present application, the number of heat pipes in the heat sink may be at least one, and in the light source assembly shown in fig. 4, the number of heat pipes is 4, but the number of heat pipes may also be other, such as 2,3, 5, 6 or more, which is not limited in the embodiment of the present application.
In an exemplary embodiment, referring to fig. 2, the heat dissipating body 111 of the heat sink may include an air-cooled heat sink, which may include a fan (not shown in fig. 2) and a fin structure p, which may include a plurality of sheet structures disposed at intervals for increasing a heat exchanging surface area. The heat of the heat pipe 113 can be dissipated into the fin structure p to heat the air contained in the fin structure p, and the air outlet or the air inlet of the fan can face the fin structure p to blow or suck the heated hot air contained in the fin structure, so as to realize continuous heat dissipation of the heat pipe 113.
Of course, the heat dissipating body 111 of the heat sink may also include other types of heat sinks, such as a water-cooled heat sink, and the embodiment of the present application is not limited thereto.
In summary, in the light source assembly provided by the embodiment of the application, one surface of the substrate of the laser is attached to the heat dissipation plate in the heat sink, so that the heat dissipation plate can dissipate heat of the laser, and the substrate is fixedly connected with the light source housing or the heat dissipation plate, that is, the light source assembly is in a manner of fixing the laser on other functional structures, so that a laser bracket is not required to be separately arranged for the laser. The problem that the structure of the light source component is complex in the related art is solved, and the effect of simplifying the structure of the light source component is achieved.
In addition, the light source component does not need to be provided with a laser bracket, so that the assembly difficulty of the light source component is reduced, and the structure in the light source component is simplified, so that the light source component and the projection equipment are miniaturized.
In addition, the substrate base plates of the lasers in the light source assembly are fixed on the boss with higher flatness on the heat dissipation plate, so that the parallelism of emergent light of the lasers is higher, and the light-emitting quality of the light source assembly is improved.
Fig. 5 is a schematic structural diagram of another light source assembly according to an embodiment of the present application. Fig. 6 is a schematic view of the light source assembly of fig. 5 at another angle. Fig. 5 shows a schematic view of a structure in which a laser is mounted on a light source housing. Wherein the light source housing 13 has a screw hole (not shown in fig. 5 and 6) thereon, and the substrate 121 has an opening (not shown in fig. 5 and 6), the light source assembly further includes a first screw 15, and the first screw 15 passes through the opening and is screwed with the screw hole of the light source housing to fix the substrate 121 in the laser. The first screw 15 includes a shaft (not shown in fig. 5 and 6) and a screw head 151 at one end of the shaft, and the shaft passes through the opening and is screwed to a screw hole in the light source housing 13. The substrate 121 of the laser and the heat dissipation plate 112 can be in surface contact, so that the accuracy is high, and the light emitting direction of the laser can be controlled conveniently.
As can be seen from fig. 5, the screw head 151 of the first screw 15 has a certain protrusion on the back side of the substrate 121, and the protrusion may have a certain influence on the adhesion of the substrate 121 to the heat dissipation plate 112, for example, it may be difficult to adhere the substrate 121 to the heat dissipation plate 112, or the adhesion area of the substrate 121 to the heat dissipation plate may be reduced, which is not beneficial to heat dissipation of the laser. In this regard, in an exemplary embodiment, as shown in fig. 6, the heat dissipating plate 112 has a relief groove c therein, and the screw portion may be located in the relief groove c. The abdication groove c can be used as an abdication structure, so that the substrate 121 of the laser can be more tightly attached to the heat dissipation plate 112, and the contact area between the substrate 121 of the laser and the heat dissipation plate 112 can be hardly reduced, thereby avoiding the influence on the heat dissipation effect of the laser.
Fig. 5 and 6 show the case where the light source assembly includes two lasers, and four first screws fix the two lasers to the light source housing 13, respectively, and the number of the relief grooves c is also four, so as to avoid the four first screws 15.
In addition, a thermal interface material, such as a thermal paste, may be coated between the heat spreader plate 112 and the substrate 121 of the laser 12 to enhance the heat dissipation effect for the laser.
The heat conductive paste is an organic grease for heat transfer of electronic components, and can be formed by compounding metal oxide with good heat conductivity and insulation with organosiloxane, and has good heat conductivity, electrical insulation, shock absorption and impact resistance.
In an exemplary embodiment, the light source assembly includes at least two lasers 12, and the substrate 121 of both lasers 12 is attached to the heat sink 112. The heat dissipation plate 112 may have a surface with a higher flatness, and the substrate 121 of the two lasers 12 may be attached to the plane with the higher flatness, so that the parallelism of the light emitting directions of the at least two lasers 12 may be higher, and further, the performance of the light source assembly may be stronger. Fig. 5 shows the case where the number of lasers 12 is 2, but the light source assembly provided in the embodiment of the present application may further include more lasers, for example, 3, 4, 5, 6, 7, 8, etc.
As shown in fig. 6, the heat sink 112 has a fixing boss t, and the substrate 121 is bonded to the boss t. The boss t is a raised platform on the heat dissipating plate 112, and may be formed by a stamping process, where the boss may have a mesa with a higher flatness, and the substrate may be attached to the mesa with a higher flatness. Compared with manufacturing a heat dissipation plate with higher overall flatness, manufacturing a boss with higher flatness is less difficult. Therefore, a boss is arranged on the heat radiation plate, and the substrate base plate of the laser is attached to the table top of the boss, so that the manufacturing difficulty of the heat radiation plate can be reduced, and the parallelism of emergent light of a plurality of lasers is improved. Alternatively, the relief groove c on the heat dissipation plate 112 may be located on the boss t.
Optionally, the heat sink 11 further includes a heat pipe 113, one end of the heat pipe 113 is connected to the heat sink body 111, and the heat dissipating plate 112 is attached to an outer wall of the heat pipe 113 to absorb heat on the heat dissipating plate 112.
A heat pipe (heat pipe) is a heat transfer element that relies on a phase change of an operating liquid within itself to effect heat transfer. In the embodiment of the present application, the heat pipe 113 may absorb heat on the heat dissipating plate 112 at the heat dissipating plate 112, and transfer the heat to the heat sink body 111, and be dissipated by the heat sink body 111.
The heat pipe 113 may be a low-tooth composite heat pipe, and the heat transfer effect of the heat pipe is strong, so that the heat dissipation effect of the laser can be improved. In addition, the heat transfer effect of the heat pipe can be adjusted by adjusting the number of teeth in the low-tooth composite heat pipe. Of course, the heat pipe 113 may be a powder sintering heat pipe or a composite heat pipe, which is not limited in the embodiment of the present application.
Alternatively, the heat dissipation plate 112 is fixedly connected with the light source housing 13. The heat sink 112 may be fixedly connected to the light source housing 13 in various manners, and illustratively, the light source assembly further includes a fixing screw d having a through hole k3 therein, and the light source housing 13 has a protrusion g having a screw hole therein, and the fixing screw d may pass through the through hole k3 in the heat sink and form a screw connection with the screw hole in the protrusion g to fix the heat sink 112 to the light source housing 13. Of course, the heat dissipating plate 112 may be connected to the light source housing in other manners, which are not limited by the embodiment of the present application.
In an exemplary embodiment, as shown in fig. 5, the light source housing 13 further has a limiting protrusion x2, the substrate 121 of the laser has a limiting through hole corresponding to the limiting protrusion x2, and when the laser is fixed on the light source housing, the limiting protrusion x2 on the light source housing 13 may penetrate into the limiting through hole on the substrate 121 of the laser. The limiting protrusion x2 and the limiting through hole are used for playing a limiting role when the laser is installed, so that the installation difficulty of the laser can be reduced, the installation accuracy of the laser is improved, and the light emitting quality of the light source assembly is improved.
In an exemplary embodiment, referring to fig. 5, the heat sink 11 in the light source assembly further includes a heat dissipating cover 114, one end of the heat pipe 113 is located in the heat sink body 111, and the other end passes between the heat dissipating cover 114 and the heat dissipating plate 112 and is exposed outside the heat dissipating cover 114 and the heat dissipating plate 112. The heat dissipation cover plate 114 and the heat dissipation plate 112 are respectively located at two sides of the heat pipe 113 to clamp the heat pipe 113, and the heat dissipation cover plate 114 can be fixedly connected with the heat dissipation plate 112 for protecting the heat pipe 113 from being damaged by other structures. Of course, the light source assembly provided in the embodiment of the application may not include the heat dissipation cover plate 114, so that the structures of the heat sink and the light source assembly can be further simplified, and the costs of the heat sink and the light source assembly can be reduced.
It should be noted that, in the light source assembly provided in the embodiment of the present application, the number of heat pipes in the heat sink may be at least one, and in the light source assembly shown in fig. 5, the number of heat pipes is 4, but the number of heat pipes may also be other, such as 2,3, 5, 6 or more, which is not limited in the embodiment of the present application.
In an exemplary embodiment, referring to fig. 5, the heat dissipating body 111 of the heat sink may include an air-cooled heat sink, which may include a fan (not shown in fig. 5) and a fin structure p, which may include a plurality of sheet structures disposed at intervals for increasing a heat exchanging surface area. The heat of the heat pipe 113 can be dissipated into the fin structure p to heat the air contained in the fin structure p, and the air outlet or the air inlet of the fan can face the fin structure p to blow or suck the heated hot air contained in the fin structure, so as to realize continuous heat dissipation of the heat pipe 113.
Of course, the heat dissipating body 111 of the heat sink may also include other types of heat sinks, such as a water-cooled heat sink, and the embodiment of the present application is not limited thereto.
Fig. 7 is another schematic structural view of the light source assembly shown in fig. 5, fig. 7 is a schematic structural view showing the heat dissipation plate 112, the laser 12 and the light source housing 13 when they are assembled together, the laser 12 is located between the heat dissipation plate 112 and the light source housing 13, and the heat dissipation plate 112 is fixedly connected with the light source housing 13.
In summary, in the light source assembly provided by the embodiment of the application, one surface of the substrate of the laser is attached to the heat dissipation plate in the heat sink, so that the heat dissipation plate can dissipate heat of the laser, and the substrate is fixedly connected with the light source housing or the heat dissipation plate, that is, the light source assembly is in a manner of fixing the laser on other functional structures, so that a laser bracket is not required to be separately arranged for the laser. The problem that the structure of the light source component is complex in the related art is solved, and the effect of simplifying the structure of the light source component is achieved.
In addition, the light source component does not need to be provided with a laser bracket, so that the assembly difficulty of the light source component is reduced, and the structure in the light source component is simplified, so that the light source component and the projection equipment are miniaturized.
In addition, the substrate base plates of the lasers in the light source assembly are fixed on the boss with higher flatness on the heat dissipation plate, so that the parallelism of emergent light of the lasers is higher, and the light-emitting quality of the light source assembly is improved.
Fig. 7 is a block diagram showing a structure of a projection apparatus according to an embodiment of the present application. The projection device comprises a light source assembly 10, an illumination assembly 20 and a projection lens 30.
The light source assembly 10 is used to provide various colors of light to the light engine 20. The light source assembly 10 may be any of the light source assemblies provided in the above embodiments.
The illumination assembly 20 is used for processing the color light to obtain an image beam. The illumination assembly may include some drive circuitry, control components, light valve components, etc. in the projection device. The driving circuit may include a laser driving circuit, a fluorescent wheel driving circuit, etc., and the control assembly may include a display panel. The light valve assembly may include a digital micromirror device (Digital Micromirror Devices, DMD), galvanometer, or the like.
The projection lens 30 is used for adjusting the image beam and projecting the adjusted image beam out of the projection device.
The projection lens 30 may include any one of the projection lenses provided in the above embodiments.
In summary, in the projection device provided by the embodiment of the application, one surface of the substrate of the laser in the light source assembly is attached to the heat dissipation plate in the heat sink, so that the heat dissipation plate can dissipate heat of the laser, and the substrate is fixedly connected with the light source housing or the heat dissipation plate, that is, the light source assembly is in a manner of fixing the laser on other functional structures, so that a laser bracket is not required to be separately arranged for the laser. The problem that the structure of the light source component is complex in the related art is solved, and the effect of simplifying the structure of the light source component is achieved.
In addition, the light source component does not need to be provided with a laser bracket, so that the assembly difficulty of the light source component is reduced, and the structure in the light source component is simplified, so that the miniaturization of the projection equipment is facilitated.
In addition, the substrate base plates of the lasers in the light source assembly are fixed on the boss with higher flatness on the radiating plate, so that the parallelism of emergent light of the lasers is higher, and the projection quality of the projection equipment is improved.
In the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "plurality" refers to two or more, unless explicitly defined otherwise.
The foregoing description of the preferred embodiments of the present application is not intended to limit the application, but rather, the application is to be construed as limited to the appended claims.

Claims (4)

1.一种光源组件,其特征在于,所述光源组件包括散热器、激光器以及光源壳体;1. A light source assembly, characterized in that the light source assembly includes a heat sink, a laser and a light source housing; 所述散热器包括散热器主体以及与所述散热器主体连接的散热板;The radiator comprises a radiator body and a heat dissipation plate connected to the radiator body; 所述激光器包括衬底基板以及发光单元,所述衬底基板的一面与所述散热板贴合,另一面设置有所述发光单元,所述衬底基板与所述光源壳体或者所述散热板固定连接;The laser comprises a base substrate and a light emitting unit, one side of the base substrate is attached to the heat sink, and the other side is provided with the light emitting unit, and the base substrate is fixedly connected to the light source housing or the heat sink; 所述光源组件包括至少两个所述激光器,两个所述激光器的衬底基板均与所述散热板贴合;The light source assembly includes at least two lasers, and the substrates of the two lasers are both attached to the heat dissipation plate; 所述散热板上还具有限位凸起,所述激光器的衬底基板上具有与所述限位凸起对应的限位通孔,所述激光器的衬底基板固定于所述散热板上时,所述散热板上的限位凸起可以穿入所述激光器的衬底基板上的所述限位通孔中;The heat sink further has a limiting protrusion, and the base substrate of the laser has a limiting through hole corresponding to the limiting protrusion. When the base substrate of the laser is fixed to the heat sink, the limiting protrusion on the heat sink can penetrate into the limiting through hole on the base substrate of the laser. 所述光源组件还包括:固定螺钉,所述散热板上具有通孔,所述光源壳体上具有凸起,所述凸起中具有螺孔,所述固定螺钉穿过所述散热板上的所述通孔,并与所述凸起中的所述螺孔形成螺纹连接,以将所述散热板与所述光源壳体固定;The light source assembly further includes: a fixing screw, the heat sink having a through hole, the light source housing having a protrusion, the protrusion having a screw hole, the fixing screw passing through the through hole on the heat sink and forming a threaded connection with the screw hole in the protrusion to fix the heat sink to the light source housing; 在所述衬底基板与所述光源壳体固定连接时,所述光源壳体上具有螺孔,所述衬底基板上具有开孔,所述光源组件还包括第一螺钉,所述第一螺钉穿过所述开孔并与所述光源壳体上的螺孔螺纹连接,以将所述衬底基板固定;所述散热板上具有让位凹槽,所述第一螺钉包括螺杆以及位于所述螺杆一端的螺头,所述螺杆穿过所述开孔并与所述光源壳体上的螺孔螺纹连接,所述螺头部分位于所述让位凹槽中;或者,When the substrate base is fixedly connected to the light source housing, the light source housing has a screw hole, the substrate base has an opening, and the light source assembly further includes a first screw, which passes through the opening and is threadedly connected to the screw hole on the light source housing to fix the substrate base; the heat dissipation plate has a recess, the first screw includes a screw rod and a screw head located at one end of the screw rod, the screw passes through the opening and is threadedly connected to the screw hole on the light source housing, and the screw head portion is located in the recess; or, 在所述衬底基板与所述散热板固定连接时,所述散热板上具有螺孔,所述衬底基板上具有开孔,所述光源组件还包括第二螺钉,所述第二螺钉穿过所述开孔并与所述散热板上的螺孔螺纹连接,以将所述衬底基板固定;或,所述散热板上具有螺柱,所述衬底基板上具有开孔,所述光源组件还包括螺母,所述螺柱穿过所述开孔并与所述螺母螺纹连接,以将所述衬底基板固定。When the base substrate is fixedly connected to the heat sink, the heat sink has a screw hole, the base substrate has an opening, and the light source assembly further includes a second screw, which passes through the opening and is threadedly connected to the screw hole on the heat sink to fix the base substrate; or, the heat sink has a stud, the base substrate has an opening, and the light source assembly further includes a nut, which passes through the opening and is threadedly connected to the nut to fix the base substrate. 2.根据权利要求1所述的光源组件,其特征在于,所述散热板具有固定凸台,所述衬底基板与所述凸台贴合。2 . The light source assembly according to claim 1 , wherein the heat dissipation plate has a fixing boss, and the base substrate is attached to the boss. 3.根据权利要求1所述的光源组件,其特征在于,所述散热器还包括热管,所述热管的一端与所述散热器主体连接,所述散热板与所述热管的外壁贴合,所述热管为沟槽式复合热管。3. The light source assembly according to claim 1, characterized in that the radiator further comprises a heat pipe, one end of the heat pipe is connected to the radiator body, the heat dissipation plate is in contact with the outer wall of the heat pipe, and the heat pipe is a grooved composite heat pipe. 4.一种投影设备,其特征在于,所述投影设备包括权利要求1-3任一所述的光源组件。4. A projection device, characterized in that the projection device comprises the light source assembly according to any one of claims 1-3.
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