CN116417782B - Wireless earphone and terminal antenna - Google Patents

Abstract

The embodiment of the present application discloses a wireless headset and a terminal antenna, and relates to the field of antenna technology. The present application can solve the problem of poor communication performance of wireless headsets caused by high head mold loss. The terminal antenna includes: a first radiator and a first reference ground arranged in the ear rod part. A feed source and a grounding point are arranged on the first radiator, and the first radiator is connected to the first reference ground through the grounding point. The grounding point is arranged in the lower half of the first radiator, and the lower half of the first radiator is the part of the first radiator away from the ear bag part. The terminal antenna and the metal dustproof net assembly are arranged in the wireless headset. The metal dustproof net assembly includes a metal dustproof net and a metal dustproof net gasket that are mutually conductive; by electrically connecting the metal dustproof net and the metal dustproof net gasket, the metal dustproof net gasket is elastically connected to the antenna through a conductive spring sheet, so that the electrostatic return of the metal dustproof net is realized, and the influence of the metal dustproof net on the antenna is avoided.

Description

Wireless earphone and terminal antenna

Technical Field

The present application relates to the field of antenna technology, and in particular to a wireless headset and a terminal antenna.

Background technique

In head-mounted electronic devices such as wireless headphones, wireless communication functions can be achieved through the antennas provided therein. Taking Bluetooth headphones as an example, the antennas provided therein cover the Bluetooth frequency band and can be wirelessly connected to electronic devices (such as mobile phones) to receive audio signals from the electronic devices for audio playback; or to send audio signals to the electronic devices for voice input, etc.

During the wearing process, the head model loss has a significant impact on the antenna performance, thereby affecting the communication quality of the wireless headset.

Summary of the invention

The embodiments of the present application provide a wireless headset and a terminal antenna, which can solve the problem of poor communication performance of the wireless headset caused by high head mode loss during the operation of the antenna set in the current wireless headset.

In order to achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

In a first aspect, a terminal antenna is provided, which is arranged in a wireless headset, and the wireless headset includes an ear bag portion and an ear rod portion. The terminal antenna includes: a first radiator arranged in the ear rod portion and a first reference ground. A feed source and a grounding point are arranged on the first radiator, and the first radiator is connected to the first reference ground through the grounding point. The grounding point is arranged in the lower half of the first radiator, and the lower half of the first radiator is the portion of the first radiator away from the ear bag portion.

Based on this solution, the terminal antenna set in the wireless headset can be set in the ear rod part, so that when the wireless headset is worn, the antenna will not be embedded in the human ear along with the ear bag part, thereby avoiding the serious impact of embedding in the human ear on the antenna performance, that is, reducing the head mode loss. In addition, by setting the grounding point in the lower half of the first radiator, the opening of the U-shaped structure formed by the antenna radiator and the reference ground through the grounding point is upward, thereby obtaining a lower electric field value in the radiator and the surrounding space, thereby reducing the head mode loss and improving the communication performance.

In a possible design, when the grounding point is set in the upper half of the first radiator, the electric field value of the first position on the first radiator is the first electric field value, and the upper half of the first radiator is the part of the first radiator close to the ear bag. When the grounding point is set in the lower half of the first radiator, the electric field value of the first position on the first radiator is the second electric field value. The second electric field value is less than the first electric field value, and the first position is any position on the first radiator. Based on this scheme, a comparative definition of the electric field values of the opening upward scheme and the opening downward scheme is provided. The grounding point is set in the upper half of the first radiator, corresponding to the opening downward. The grounding point is set in the lower half of the first radiator, corresponding to the opening upward. It should be noted that in the opening downward scheme, in addition to the lower electric field value at the same position on the radiator in this example, the electric field value distributed in the space around the radiator is also lower at the same position.

In a possible design, the operating frequency band of the terminal antenna includes a first frequency band, and the length of the first radiator is determined according to 1/4 wavelength of the first frequency band. When the terminal antenna is working, the 1/4 wavelength mode excited on the first radiator covers the first frequency band. Based on this scheme, a definition of the length of the first radiator is provided. In this example, the first radiator can excite the 1/4 wavelength mode to cover the operating frequency band. Therefore, the length of the first radiator can correspond to the size of 1/4 wavelength of the operating frequency band. The specific implementation can be adjusted near 1/4 wavelength.

In a possible design, the terminal antenna further includes a second reference ground provided in the ear bag portion, and the second reference ground is connected to an end of the first reference ground away from the grounding point. Based on this solution, another structural solution is provided. The flexible plate provided in the ear bag portion can be used as the second reference ground, and the second reference ground can be connected to the flexible plate and the hard plate in the ear rod portion.

In one possible design, the operating frequency band of the terminal antenna includes a first frequency band, and the sum of the lengths of the first reference ground and the second reference ground is determined according to 1/2 wavelength of the first frequency band. When the terminal antenna is working, the first reference ground and the second reference ground jointly excite the 1/2 wavelength mode, and the frequency band covered by the 1/2 wavelength mode overlaps at least partially with the first frequency band. Based on this scheme, the first reference ground and the second reference ground (also referred to as the reference ground extension part) can jointly excite the 1/2 wavelength mode, expand the bandwidth of the 1/4 wavelength mode, and improve the performance of the operating frequency band. In other implementations, the mode jointly excited by the first reference ground and the second reference ground can also be other multiples of the 1/4 wavelength mode, such as 3/4 mode, 1 multiple mode, etc., which are used to expand the bandwidth of 1/4 wavelength. Depending on the different excited modes, the total length of the first reference ground and the second reference ground can be flexibly adjusted corresponding to the excitation mode.

In a possible design, the first frequency band includes a Bluetooth frequency band. Based on this solution, a specific usage scenario is provided. For example, the terminal antenna can be used to cover the Bluetooth (2.4 GHz) frequency band.

In a possible design, the first reference ground is implemented by a printed circuit board PCB and/or a flexible circuit board FPC. Based on this solution, a specific implementation of the first reference ground is provided. For example, the bearing function of other components can be realized by combining a hard board (PCB) and a flexible board (FPC).

In a possible design, the first radiator is implemented by laser direct structuring (LDS) and/or FPC. Based on this solution, a specific implementation of an antenna is provided.

In a possible design, the second reference ground is implemented by FPC. Based on this solution, a specific implementation of the second reference ground is provided. For example, the FPC enables the second reference ground to obtain a larger board surface in a more complex space in the ear bag part.

In a possible design, a metal dust screen assembly is also provided in the wireless headset, and the first radiator of the terminal antenna is connected to the metal dust screen assembly. When the wireless headset is working, the static electricity on the metal dust screen assembly is returned to the ground through the grounding point of the terminal antenna. Based on this solution, an example of the relative relationship between the metal dust screen assembly and the antenna is provided. The metal dust screen can be returned to the ground through the grounding point of the antenna, so that the static electricity can be guided. When the antenna radiates, the metal dust screen can radiate as part of the antenna, thereby expanding the radiation area of the antenna, avoiding the influence of the metal dust screen on the antenna, and improving the antenna performance.

In a second aspect, a wireless headset is provided, wherein the wireless headset is provided with a terminal antenna as provided in the first aspect and any possible design thereof.

Based on this solution, a limitation of a product form is provided. The wireless earphone can be a pair of earphones symmetrically arranged for the left ear and the right ear. Each earphone can be provided with the above-mentioned terminal antenna, so that better communication quality can be obtained based on the setting of the above-mentioned terminal antenna.

In a possible design, a baseband module and a radio frequency module are arranged on the first reference ground of the wireless headset, and the terminal antenna is connected to the radio frequency module and the baseband module in sequence through the feed source. The terminal antenna is connected to the zero potential point on the first reference ground through the grounding point. Based on this solution, an example of link setting for realizing antenna radiation in a wireless headset is provided.

In a possible design, a first conductive member and a second conductive member are provided on the first reference ground, and the terminal antenna is connected to the RF module and the baseband module in sequence through the feed source, specifically: the terminal antenna is connected to the RF module and the baseband module in sequence through the first conductive member at a position corresponding to the feed source. The terminal antenna is connected to the zero potential point on the first reference ground through the grounding point, specifically: the terminal antenna is connected to the zero potential point on the first reference ground through the second conductive member at a position corresponding to the grounding point. Based on this scheme, an example of an electrical connection scheme for realizing the above-mentioned communication link is provided.

In a possible design, the first conductive member and/or the second conductive member is a conductive spring. Based on this solution, a specific electrical connection solution is provided.

In a possible design, a first antenna matching circuit is provided between the feed source of the terminal antenna and the radio frequency module, and the first antenna matching circuit includes at least one of the following: capacitance, inductance, resistance, variable capacitance, variable inductance, and variable resistance. The first antenna matching circuit is used to adjust the port impedance of the terminal antenna. Based on this solution, a solution for adjusting the antenna port impedance to obtain better radiation performance is provided.

In a possible design, the first reference ground includes a first PCB and a first FPC. The first conductive member is arranged on the first PCB, the first antenna matching module, the radio frequency module and the baseband module are arranged on the first FPC, and the first conductive member is connected to the first antenna matching module through a connecting cable. Alternatively, the first conductive member and the first antenna matching module are arranged on the first PCB, the radio frequency module and the baseband module are arranged on the first FPC, and the first antenna matching module is connected to the radio frequency module through a connecting cable. Alternatively, the first conductive member, the first antenna matching module and the radio frequency module are arranged on the first PCB, the baseband module is arranged on the first FPC, and the radio frequency module is connected to the baseband module through a connecting cable. Based on this solution, a setting based on a flexible connecting cable is provided, so that the various modules on the communication link can be arranged on a circuit board at different times, thereby realizing flexible setting of components.

In a possible design, a second antenna matching circuit is provided between the grounding point of the terminal antenna and the first reference ground, and the second antenna matching circuit includes at least one of the following: a microstrip line, a capacitor, an inductor, and a bandpass filter. The response frequency band of the bandpass filter includes the operating frequency band of the terminal antenna. Based on this solution, specific implementations of several grounding solutions are provided.

In a possible design, a metal dust screen assembly is provided in the wireless headset, and the metal dust screen assembly is used to be arranged near the sound pickup hole arranged on the ear rod portion. The metal dust screen assembly includes a metal dust screen and a metal dust screen gasket that are conductive to each other, and a conductive spring is provided on the metal dust screen gasket, and the metal dust screen gasket is electrically connected to the first radiator of the terminal antenna through the conductive spring. Based on this solution, by electrically connecting the metal dust screen to the metal dust screen gasket (such as electrically connected by conductive glue), and then spring-connecting the metal dust screen gasket to the antenna radiator through the conductive spring (such as a metal spring), the static electricity of the metal dust screen is returned to the ground while avoiding the influence of the metal dust screen on the antenna.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of a wireless headset usage scenario;

FIG2 is a schematic diagram of the composition of a wireless headset;

FIG3 is a schematic diagram of an antenna implementation in a wireless headset;

FIG4 is a schematic diagram of the location of an antenna in a wireless headset provided in an embodiment of the present application;

FIG5A is a schematic diagram of the composition of a wireless headset provided in an embodiment of the present application;

FIG5B is a schematic diagram of a metal dust screen assembly provided in an embodiment of the present application;

FIG6 is a schematic diagram of an antenna bracket and an antenna provided in an embodiment of the present application;

FIG7 is a schematic diagram of an antenna solution provided in an embodiment of the present application;

FIG8 is a schematic diagram of an antenna implementation provided in an embodiment of the present application;

FIG9 is a schematic diagram of an antenna-related communication link provided in an embodiment of the present application;

FIG10A is a schematic diagram of a communication link corresponding to an antenna feed point provided in an embodiment of the present application;

FIG10B is a schematic diagram of a communication link corresponding to an antenna ground point provided in an embodiment of the present application;

FIG10C is a schematic diagram of the antenna ground plane and feed point setting positions provided in an embodiment of the present application;

FIG11 is a schematic diagram showing a comparison of electric field values in different opening directions provided in an embodiment of the present application;

FIG12 is a schematic diagram showing a comparison of S parameter simulations for different opening directions provided in an embodiment of the present application;

FIG13 is a schematic diagram of another antenna solution provided in an embodiment of the present application;

FIG14 is a schematic diagram of electric field value distribution of an antenna solution provided in an embodiment of the present application;

FIG. 15 is a schematic diagram of an S parameter simulation comparison provided in an embodiment of the present application.

Detailed ways

At present, people have an increasing demand for the convenience of using electronic devices, which has led to more and more frequent use of wireless headsets (such as Bluetooth headsets).

Exemplarily, in conjunction with Figure 1, a schematic diagram of a wireless headset usage scenario is shown. When working, the wireless headset can be worn on the human ear, and communicate with other electronic devices through wireless signals to achieve audio playback. Among them, the wireless communication can be based on Bluetooth communication. Other electronic devices (such as mobile phones) can establish a wireless connection (such as a Bluetooth connection) with the wireless headset as an audio input/output device, so as to communicate with the wireless headset through the wireless connection. For example, the audio signal is transmitted to the wireless headset through a wireless connection to achieve music playback. For another example, an audio signal is received from the wireless headset to achieve functions such as voice input. In this way, unlike traditional wired headsets, the headset and the audio input/output device can be separated, which is more convenient to use.

It should be understood that an antenna whose working frequency band covers the Bluetooth frequency band (such as 2.4 GHz-2.483 GHz) can be set in the wireless headset for wireless communication with the audio output device.

Exemplarily, in conjunction with FIG2 , a schematic diagram of the composition of a wireless headset is shown. As shown in FIG2 , the wireless headset may include an ear bag portion that can be placed in a human ear, and an ear stem portion that is exposed when worn. Among them, the antenna of the wireless headset may be arranged in the ear bag portion. Correspondingly, a battery may be arranged in the ear stem portion to power the wireless headset. It should be understood that the arrangement of the battery in the ear stem portion is also one of the reasons why the antenna is arranged in the ear bag portion due to the influence of the battery on the working performance of the antenna.

In order to cover the operating frequency band, the antenna in the wireless headset can have different forms.

For example, in conjunction with Figure 3, an exemplary description of a commonly used antenna form in a wireless headset is provided. As shown in Figure 3, currently, the antenna commonly used in a wireless headset may be an IFA antenna or a PIFA antenna.

In some embodiments, an IFA antenna is used as an example. The IFA antenna may include a strip radiator, on which a feed source may be provided for feeding the IFA antenna, and a grounding point may also be provided on the radiator. Generally speaking, the feed source may be provided at one end of the radiator or near the end, and the grounding point may be provided at a portion of the radiator near the feed source.

In other embodiments, the PIFA antenna is taken as an example. Similar to the IFA antenna, a feed source and a grounding point may be provided on the radiator of the PIFA antenna. Unlike the IFA antenna, the radiator of the PIFA antenna is generally larger in area, and better radiation performance is obtained through surface radiation. For example, as shown in FIG3 , the radiator of the PIFA antenna may be rectangular. As an example, the length of the IFA antenna and/or the PIFA antenna may be determined based on 1/4 of the operating wavelength.

In an embodiment of the present application, the radiation performance of the antenna can be identified by the efficiency in free space (such as free space efficiency) and the efficiency in a head mold (such as head mold efficiency). Among them, the free space efficiency can be the efficiency of the antenna in free space (Freespace). The head mold efficiency can be the efficiency of the antenna system (such as the wireless headset with an antenna in the above example) when worn on a head mold. The head mold efficiency can be understood as the efficiency of the absorption and reflection of radiation by the human head on the basis of free space radiation. In the present application, the loss of the antenna radiation performance due to the absorption of radiation by the human head can be called head mold loss.

In addition, the efficiency in different scenarios can include radiation efficiency and system efficiency. Radiation efficiency can indicate the highest efficiency that the antenna system can achieve under the current environment (such as in free space, or under a head model, etc.) when the impedance is fully matched. System efficiency can indicate the efficiency of the antenna system under the current environment and the current port matching state. In other words, the radiation efficiency can indicate the maximum radiation capability of the antenna system, and the system efficiency can indicate the actual efficiency of the antenna in the current state. By improving the radiation efficiency, the system efficiency can generally be improved under the same circumstances. When the radiation efficiency remains unchanged, the purpose of improving the system efficiency can also be achieved by improving the port matching.

It is understandable that for wireless headphones, most of their working scenarios are worn in human ears. Therefore, head mold efficiency is one of the important communication indicators of wireless headphones. Therefore, by controlling the head mold loss, the head mold efficiency of the antenna in the wireless headphones can be improved. In addition, wireless headphones designed in pairs on the left and right also need to communicate with each other. During this communication process, the signal needs to bypass the head mold. Therefore, by reducing the head mold loss, the communication quality between wireless headphones can also be improved. In this example, the communication capability of wireless headphones to bypass the head mold can be identified by the antenna's head-wrap gain. The head-wrap gain can be the average gain value of the wireless headset near the ear on the non-wearing side. The higher the head-wrap gain, the stronger the communication capability of the wireless headphones to bypass the head mold.

At present, combined with the description of Figures 2 and 3 above, the average free space efficiency of earphone antennas is generally around -6dB, the head mold drop when worn is generally 6dB to 8dB, and the head mold efficiency average is -12dB to -14dB. In addition, in terms of head-wrap gain, due to the large head mold loss, this part of the gain is mainly formed by diffraction, and the reference industry is generally -28dBi to -32dBi. In other words, whether in terms of head mold efficiency or head-wrap gain, the current solutions are not ideal, which affects the communication quality of wireless headphones.

The antenna solution provided in the embodiment of the present application can be applied to portable mobile terminals such as wireless headphones, and can reduce head mode loss, thereby achieving the effect of improving head mode efficiency and head gain.

It should be noted that during the operation of the antenna, an electric field is distributed in the space around it. Under the same other conditions, the lower the electric field value of the antenna radiator and the surrounding of the antenna, the smaller the head mode loss. Then, the smaller the influence of the head mode on the antenna radiation, the higher the corresponding head mode efficiency and the gain around the head. The antenna scheme provided in the embodiment of the present application can generate a smaller electric field value during operation through the configuration of the antenna structure under the same conditions (such as the same environment, the same input power, etc.), thereby achieving the effect of reducing the head mode loss and thus improving the communication quality of the wireless headset. In the embodiment of the present application, the antenna scheme with a smaller electric field value can also be referred to as a low-field antenna.

The following first describes the application scenario of the solution provided in the embodiment of the present application with reference to the accompanying drawings.

The antenna solution provided in the embodiment of the present application can be applied to wireless headphones to support wireless connection between wireless headphones and other terminal devices, and can also be used to support mutual communication between paired wireless headphones. In other implementations of the present application, the low-field antenna can also be applied to other electronic devices with similar communication requirements, such as headphones, smart glasses, etc., which are not described here one by one.

For example, a Bluetooth headset (hereinafter referred to as a headset) is used as an example. FIG4 shows a schematic diagram of the composition of a headset 400 provided in an embodiment of the present application.

In this example, similar to the composition of FIG2 , the earphone 400 may also include an ear bag portion 402 and an ear stem portion 401. The ear bag portion 402 is the portion of the earphone 400 that is worn in the human ear. The ear stem portion 401 may be the portion that is exposed outside the human ear when the earphone 400 is worn. As shown in FIG4 , in this example, the ear stem portion 401 may also include a connecting portion and an ear post portion. Among them, the ear post portion may be a portion of the ear stem portion 401 that is arranged along the Y direction. Correspondingly, the connecting portion may be a portion of the ear stem portion 401 that connects the ear bag portion 402 and the ear post portion.

As shown in the example of Figure 4, in the headset 400 provided in this example, an antenna may be provided to support the wireless connection function between the headset 400 and other terminal devices (such as audio input and output devices such as mobile phones). In some scenarios, the antenna can also be used to support wireless interconnection between headsets 400 arranged in pairs. In addition, a battery may also be provided in the headset 400 for powering the headset 400. In some embodiments, the battery may also be provided in the connecting portion in the ear rod portion 401. Different from the composition of the headset 400 shown in Figure 2, in this example, the antenna may be provided in the ear rod portion 401. Correspondingly, the battery may be provided in the ear bag portion 402. As a result, when the headset 400 is worn for work, the antenna radiator will not be wrapped by the human ear, thereby reducing the influence of the human body (such as the human ear, head, etc.) on the antenna operation.

The earphone 400 shown in FIG. 4 may also be provided with a plurality of hardware components for realizing the functions of the earphone. Exemplarily, as shown in FIG. 5A , a composition diagram of another earphone provided in an embodiment of the present application is provided. The earphone 500 may be a specific composition of the earphone 400 shown in FIG. 4 . It should be understood that the composition of the earphone 500 shown in FIG. 5A does not constitute a specific limitation on the earphone, but is only a possible example. In other embodiments, the earphone 500 may also include more or fewer components. The embodiment of the present application does not limit the specific composition of the earphone.

Exemplarily, as shown in FIG5A , the earphone 500 may include a battery 501 , a speaker assembly 502 , a microphone (not shown in FIG5A ), a first circuit board 504 , a second circuit board 505 , a main chip 506 , a touch assembly 507 , a charging module (not shown in FIG5A ), an antenna bracket 508 , an antenna 509 and other components.

The appearance part of the ear bag part 402 of the earphone 500 may be an ear bag shell 515. Inside the ear bag shell 515, components such as a battery 501, a speaker assembly 502, and a second circuit board 505 may be provided. Among them, the speaker assembly 502 and the battery 501 are connected to the second circuit board 505. The second circuit board 505 may be a flexible circuit board, which is convenient for compact layout and routing in the irregular space inside the ear bag part 402. The speaker assembly 502 is used to amplify the audio signal processed by the main chip 506 and send it to the human ear. The battery 501 supplies power to the earphone 500 as a whole.

In the example shown in FIG. 5A , the periphery of the ear rod portion 401 of the headset 500 may include an ear rod outer shell 510 and an ear rod inner shell 511. The ear rod outer shell 510 and the ear rod inner shell 511 may be used to form the appearance surface of the ear rod portion 401, and other functional components may be provided in the appearance surface. In this example, the functional components included in the ear rod portion 401 may include a first circuit board 504 and an antenna bracket 508. The ear rod portion 401 may also include a main chip 506, a touch component 507, and an antenna 509 provided on the antenna bracket 508. In some implementations, a microphone (not shown in FIG. 5A ) may also be provided on the first circuit board 504. The microphone, as a pickup device, may be used to collect the user's voice signal. In different implementations, the number of microphones may be one or more. The microphone may convert the sound signal into an electrical signal and transmit it to the main chip 506. The main chip 506 can transmit the electrical signal corresponding to the sound signal to the terminal device through the wireless transmission link between the earphone 500 and the terminal device to achieve the voice function.

Correspondingly, one or more sound pickup holes may be provided on the outer shell 510 of the ear rod. Taking two sound pickup holes as an example, a first sound pickup hole 512 and a second sound pickup hole 513 may be provided on the outer shell 510 of the ear rod. In order to prevent dust from entering the cavity of the earphone 500, a dustproof net assembly may be provided at the corresponding position of the sound pickup hole. For example, corresponding dustproof net assemblies may be provided at the corresponding positions of the first sound pickup hole 512 and/or the second sound pickup hole 513, respectively. In this example, a dustproof net assembly 514 is provided at the corresponding position of the first sound pickup hole 512 as an example. In different implementations, the material constituting the dustproof net assembly 514 may be a conductive material or a non-conductive material. In this example, the dustproof net assembly 514 is made of metal material as an example. In order to coexist with the structure of the metal dustproof net assembly 514, the avoidance area of the antenna 509 on the antenna bracket 508 may be larger than the area of the first sound pickup hole 512.

Generally speaking, the key components of the metal dust screen assembly 514 may include a metal dust screen 514A and a metal dust screen gasket 514B. During the assembly process, the metal dust screen 514A can be fixed to the inner surface of the outer shell 510 of the ear rod by adhesive, and the metal dust screen 514A and the metal dust screen gasket 514B can be electrically connected by using a large area conductive glue or spot welding to make the two parts of metal conductive. As shown in (a) of Figure 5B, a top view of the metal dust screen 514A and the metal dust screen gasket 514B included in the metal dust screen assembly 514 is shown. Figure 5B (b) shows an oblique side view of the metal dust screen 514A and the metal dust screen gasket 514B included in the metal dust screen assembly 514. It should be understood that the metal dust screen assembly 514 generally needs to be grounded to protect nearby electronic devices from the static electricity on the metal dust screen assembly 514.

In this example, since the metal dust screen assembly 514 is very close to the antenna 509, if the metal dust screen assembly 514 alone realizes the diversion of static electricity to the ground, it will have a significant impact on the performance of the antenna 509. In this example, the metal dust screen gasket 514B can be directly electrically connected to the antenna 509 radiator. For example, by setting a conductive spring, the metal dust screen gasket 514B is elastically connected to the antenna 509 radiator. In this way, the metal dust screen assembly 514 can be used as a part of the antenna 509 radiator to assist in radiation during the operation of the antenna 509. By increasing the area of the antenna 509, the performance of the antenna 509 is improved. In addition, since the antenna 509 itself has a ground path, the electrostatic diversion of the metal dust screen assembly 514 to the ground is also realized, realizing the functional reuse of the same structural component.

In the embodiment of the present application, the first circuit board 504 can be implemented by a printed circuit board (PCB) and/or a flexible printed circuit (FPC). For example, the first circuit board 504 can be implemented by combining a PCB and an FPC. For another example, the first circuit board 504 can be implemented by a simple FPC or a PCB. In this example, the first circuit board 504 is taken as an example to implement its function by combining an FPC with a PCB. The function of the touch component 507 can be realized by relevant settings on the FPC. Exemplarily, the touch component 507 can realize the touch control function of the headset 500. For example, the headset 500 can receive the user's instructions through the touch component 507. The user's instructions can be implemented by touch, sliding and other operations to achieve corresponding input. In order to receive the user's input, a sensing part can be provided in the touch component 507, and the sensing part can be provided on the inner surface of the outer shell 510 of the ear rod. The control chip of the touch unit can be arranged on the first circuit board 504.

It should be noted that one or more circuits consisting of multiple electronic devices may also be provided on the first circuit board 504. The circuit can be used to cooperate with the main chip 506 to implement the processing of analog signals and/or digital signals. Some circuits on the first circuit board 504 may be connected to the antenna 509, and are used to feed the antenna 509 in a transmitting scenario and/or receive signals from the antenna 509 for processing in a receiving scenario. In some embodiments, the circuit coupling the antenna 509 and the main chip 506 may be a radio frequency circuit. One or more filter devices, signal amplifier devices, etc. may be provided on the radio frequency circuit. The radio frequency circuit can be used for signal processing in the radio frequency domain, wherein the radio frequency domain signal may be an analog signal. In some implementations, the various components and circuits provided on the radio frequency circuit may be collectively referred to as a radio frequency module.

The antenna 509 connected to the radio frequency module can be arranged on the antenna bracket 508. As shown in FIG5A , the antenna bracket 508 can be located between the outer shell 510 of the ear rod and the first circuit board 504. The antenna 509 correspondingly arranged on the antenna bracket 508 can be realized by any of the following: a ceramic antenna, a steel sheet antenna, a laser direct structuring (LDS) antenna, or an in-mold injection molding antenna, etc.

As an example, FIG6 shows a schematic diagram of an antenna bracket 508 and a corresponding antenna 509. Among them, (a) in FIG6 is a schematic diagram of the antenna bracket 508. The antenna 509 shown in (b) in FIG6 can be assembled or set on the antenna bracket 508. In this example, in combination with the example shown in FIG5A, the shape of the antenna bracket 508 can match the projection of the ear rod portion 401 on the XOY plane. This allows the antenna 509 set on the antenna bracket 508 to obtain the largest area. Due to the setting of the first sound pickup hole 512, the second sound pickup hole 513, and the touch component 507, the antenna bracket 508 can be routed at the corresponding positions of the first sound pickup hole 512, the second sound pickup hole 513, and the touch component 507. In addition, in some embodiments, the antenna bracket 508 may also include a partial Z-direction overlapping area with the touch component (such as the first routing overlapping area shown in (a) in FIG6). In the first routing overlap area, the antenna bracket 508 can be adjusted by Z-direction depression, and a height space is reserved for the touch component 507 while ensuring the integrity of the antenna bracket 508, so as to achieve coexistence between components. In addition, in order to realize its function, the touch component 507 needs to set up metal routing and the like to realize signal transmission. Since the metal routing is close to the antenna 509, it may affect the antenna radiation (such as introducing clutter, reducing efficiency, etc.). In some implementations of the present application, a filtering component can be set on the metal routing (and/or the routing path of the corresponding circuit board) to reduce or eliminate the influence of the metal routing on the antenna. Exemplarily, taking the working frequency band of the antenna 509 as the Bluetooth frequency band as an example, a filtering circuit corresponding to the Bluetooth frequency band can be set on the metal routing to prevent the clutter generated by the metal routing (such as the routing in the touch component 507) from falling into the Bluetooth frequency band, thereby achieving the effect of reducing or eliminating the influence of the touch component 507 on the antenna.

On the antenna support 508 shown in (a) of FIG. 6 , an antenna 509 as shown in (b) of FIG. 6 may be provided. In different implementations of the present application, the antenna 509 may correspond to the largest radiator area. In some implementations, the area of the antenna radiator may also be smaller than the area shown in (b) of FIG. 6 .

It should be understood that when the antenna 509 is implemented by different processes, the structural relationship between the antenna radiator and the antenna bracket 508 can be flexibly set. For example, when the antenna radiator is implemented by FPC, the FPC can be mounted on the antenna bracket 508. For another example, when the antenna radiator is implemented by LDS, the antenna radiator can be etched on the surface of the antenna bracket 508 by LDS process, etc.

The antenna 509 scheme provided in the embodiment of the present application can be applied to the composition shown in Figure 5A or Figure 6. For example, the low electric field antenna 509 provided in the embodiment of the present application can be implemented based on the antenna bracket 508 and the antenna 509 shown in Figure 6.

The antenna scheme provided in the embodiments of the present application is exemplarily described below.

Please refer to Figure 7, which is a schematic diagram of a low electric field antenna provided in an embodiment of the present application. In this example, the antenna can be set in the ear stem part.

Exemplarily, in an embodiment of the present application, a feed source (i.e., a feeding point) and a grounding point may be provided on the antenna. Exemplarily, please refer to FIG. 7, which is an example of an antenna solution provided in a wireless headset provided in an embodiment of the present application. As shown in FIG. 7, the antenna may include a radiator, which may be L-shaped. A grounding point G1 may be provided at one end of the radiator. A feed source F1 may be provided at the other end of the radiator. In other embodiments, the position of the grounding point may be different from that of one end of the radiator as shown in FIG. 7. For example, the grounding point G1 may be provided at any position on the lower half of the antenna radiator. In addition, the setting of the feed source F1 in FIG. 7 is only an example. In other implementations of the embodiment of the present application, the position of the feed source F1 on the radiator may be flexibly adjusted according to the position of the grounding point G1. For example, in order to be able to excite a 1/4 wavelength mode on the radiator, the length of the radiator may be 1/4 wavelength of the working frequency band (such as the Bluetooth frequency band). It should be noted that due to the limitation of boundary conditions, the grounding point G1 may be relatively fixed, and the corresponding position of the feed source F1 may be flexibly selected.

It should be noted that in the application, in the antenna solution shown in FIG. 7 , the opening of the U-shaped structure formed by the antenna radiator and the reference ground can be upward. That is to say, when the antenna is set in a wireless headset, when the user wears the wireless headset, the opening of the U-shaped structure can point to the top of the user's head instead of the user's chin. From another perspective, the antenna solution provided in the embodiment of the present application can have a grounding point set on the lower half of the radiator.

As a possible implementation, a specific implementation of the antenna solution shown in FIG7 is described in combination with the structural components shown in FIG5A and FIG6. Please refer to FIG8. Among them, (a) in FIG8 is a hard board part (such as a first hard board 801) in the first circuit board 504. For example, the hard board part can be a part composed of a PCB in the first circuit board 504. In addition to the hard board part, the first circuit board 504 can also include a part composed of a flexible board (such as an FPC). As shown in (a) in FIG8, a plurality of components can be arranged on the first hard board 801 (or referred to as the first PCB). Among them, a first conductive member 802 and a second conductive member 803 can be included. The first conductive member 802 and the second conductive member 803 can be used to realize the electrical connection between the antenna radiator on the antenna bracket and the corresponding circuit on the first hard board 801. For example, in different implementations, the first conductive member 802 and/or the second conductive member 803 can realize their functions through electrical connection components such as conductive foam, conductive springs, and conductive ejector pins. As an example, a conductive spring is arranged at the first conductive member 802. When the antenna bracket with the antenna mounted thereon and the first hard board 801 are assembled in the earphone, the spring sheet at the first conductive member 802 can realize the conduction between the corresponding circuit on the first hard board 801 and the antenna radiator by means of spring connection. Exemplarily, the first conductive member 802 can be connected to the first conductive point 804 on the antenna 509, thereby realizing the feeding point of the antenna. The second conductive member 803 can be connected to the second conductive point 805 on the antenna 509, thereby realizing the grounding of the antenna. In other implementations, the first conductive member 802 and/or the second conductive member 803 can also realize its electrical connection function through other conductive processes. For example, at the first conductive member 802, the corresponding pads on the first hard board 801 can be welded (such as spot welding) to the exposed pads at the corresponding positions on the antenna radiator, thereby realizing the electrical connection function of the first conductive member 802.

Corresponding to the electrical connection components (such as the first conductive member 802 and the second conductive member 803) provided on the first hard board 801 as shown in (a) of FIG8 , as shown in (b) of FIG8 , after the antenna 509 and the antenna bracket are assembled or arranged, the connection portion between the first conductive point 804 and the first conductive member 802 can correspond to the feed source F1 (or feeding point) of the antenna 509. The connection portion between the second conductive point 806 and the second conductive member 803 can correspond to the grounding point of the antenna 509.

It should be understood that the arrangement of the first conductive point 804 and the second conductive point 805 on the antenna 509 can correspond to the specific preparation method of the antenna 509. Take the antenna implemented by the LDS process as an example. In this example, the outer surface of the antenna bracket can be coated with LDS corresponding material, which can be converted from a non-conductor to a conductor after laser. In this way, by lasering along the preset antenna trace on the surface of the antenna bracket, the corresponding antenna radiator can be obtained. In other implementations, the antenna is mounted on the antenna bracket as an FPC as an example. It should be understood that the appearance surface of the antenna is generally coated with non-conductive ink to protect the internal traces. Then, in order to realize the feeding of the antenna (or feeding and grounding), the copper exposure treatment can be performed at the corresponding position on the appearance surface of the antenna, so as to realize the electrical connection with the antenna radiator through the copper exposure point. Exemplarily, as shown in (b) of Figure 8, a first conductive point 804 and a second conductive point 805 can be provided on the antenna. When the antenna is an FPC structure, the first conductive point 804 and the second conductive point 805 can be exposed copper points on the antenna FPC. The positions of the first conductive point 804 and the second conductive point 805 can correspond to the first conductive member 802 and the second conductive member 803, respectively. In other words, the antenna FPC can be mounted on the antenna bracket, and when the antenna bracket and the first hard board 801 are assembled in the earphone, the first conductive point 804 can be electrically connected to the first conductive member 802, and the second conductive point 805 can be electrically connected to the second conductive member 803.

Exemplarily, in combination with the antenna solution shown in FIG7 , in the example of (b) in FIG8 , the second conductive point 805 can be used for grounding through the second conductive member 803. The first conductive point 804 can be connected to the RF circuit corresponding to the feed source through the first conductive member 802. Thus, the effect of feeding through the first conductive point 804 and grounding through the second conductive point 805 is achieved. In this way, the U-shaped structure formed by the antenna and the first hard plate 801 as a reference ground can have a structural feature of opening upward, thereby obtaining the effect of low electric field distribution.

It should be noted that, in some embodiments of the present application, when the first conductive point 804 and/or the second conductive point 805 are connected to the circuit on the first hard board 801 through the corresponding conductive member, a matching circuit can also be set between the conductive point and the circuit. As shown in Figure 9, the antenna feed F1 can be connected to the RF module through the first matching module, and can be connected to the baseband module through the RF module. Among them, the baseband module can realize its functions through a baseband processor, or through other components with digital processing capabilities (such as a microprocessor (MCU), etc.). The antenna ground point G1 can be connected to the reference ground on the first hard board 801 through the second matching module. In the embodiment of the present application, the baseband module can also be called a communication module.

In this example, the matching circuit (such as the first matching circuit and/or the second matching circuit) may include at least one of the following components: capacitance, inductance, resistance, variable capacitance, variable inductance, variable resistance, etc. The components in the matching circuit may be connected in series or in parallel. The number of the components may be flexibly adjusted according to actual needs. It should be understood that, taking the first matching circuit provided between the first conductive point 804 (i.e., the feed source) and the radio frequency circuit as an example, by adjusting the type, quantity and/or value of the components on the first matching circuit, the antenna port can be matched, thereby achieving the effect of tuning the corresponding resonance of the antenna to the working frequency band. For example, the 1/4 wavelength resonance of the antenna can be tuned to the Bluetooth working frequency band through port matching. Similarly, in some embodiments, a second matching circuit may be provided between the second conductive point 805 (i.e., the grounding point) and the reference ground of the first hard board 801. By adjusting the type, quantity and/or value of the components on the second matching circuit, the grounding end can be matched, and the effect of tuning the corresponding resonance of the antenna to the working frequency band can also be obtained. In different implementations of the present application, the functions of the first matching circuit and/or the second matching circuit can also be implemented in other forms, such as a bandpass filter, a band-stop filter, etc. The embodiments of the present application do not limit the specific implementation of the first matching circuit and/or the second matching circuit. As an example, take the example that the working frequency band of the antenna includes the Bluetooth frequency band. The second matching circuit can be set to exhibit a bandpass characteristic on the Bluetooth frequency band, so that the current in the Bluetooth frequency band can be returned to the ground through the second matching circuit. Combined with the foregoing description, in some implementations, the second matching module can also achieve DC return to the ground by means of microstrip lines and the like.

In different environments, when the antenna is not matched, its excited 1/4 wavelength mode may partially or completely cover the working frequency band, or the 1/4 wavelength mode may be outside the working frequency band. Then, in different implementations of the present application, the first matching circuit and/or the second matching circuit can be set according to the specific situation. For example, the first matching circuit tuning port matching is set, and the second matching circuit tuning grounding is not set. For another example, the second matching circuit tuning grounding is set, and the first matching circuit tuning port matching is not set. For another example, the first matching circuit tuning port matching is set at the same time, and the second matching circuit tuning grounding is set. For another example, the first matching circuit tuning port matching is not set, and the second matching circuit tuning grounding is not set.

Combined with the connection relationship between the modules on the communication link shown in Figure 9, and the functions of the above modules. It should be understood that in different implementations, the connection relationship between the modules on the communication link can be flexibly set according to actual conditions. The number of each module can also be adjusted accordingly.

10A is an example of the configuration of various modules on several possible communication links provided in an embodiment of the present application. In this example, the communication link where the first conductive point 804 (ie, the feed source F1) is located is used as an example for description.

As shown in (a) of FIG. 10A , the antenna can be connected to the first conductive member 802, the first antenna matching module, the radio frequency module and the communication module in sequence through the first conductive point 804. Among them, the first antenna matching module can be a device set mainly based on inductors and capacitors to adjust the antenna input impedance or limit the antenna boundary conditions. For example, the first antenna matching module can adopt a high-impedance matching form (such as a large series inductor, a small series capacitor or a band-stop matching form). In some implementations, a parallel position can also be provided in the first antenna matching module for setting parallel inductors and capacitors when necessary to adjust the resonant position of the antenna.

In addition, in different implementations, the first antenna matching module may include one or more devices. The first conductive member 802 is a connecting device that connects the antenna matching module and the antenna conductive point, and may be a conductive device such as a spring, conductive foam, etc. Thus, when the antenna is working, the antenna can be fed through the link shown in (a) of FIG. 10A.

In the examples as shown in (b) to (d) in Figure 10A, a connecting cable may be further provided between the modules. Exemplarily, the connecting cable may include at least one of the following: a coaxial line, a microstrip line, a liquid crystal polymer (LCP), etc. The connecting cable can be used for the transmission of feeding signals between boards. For example, the connecting cable can be used for the transmission of feeding signals between the first circuit board 504 and the second circuit board 505 as shown in Figure 5A. For another example, the connecting cable can be used for the transmission of feeding signals between the first hard board 801 on the first circuit board 504 and other circuit boards (such as a flexible board). Thus, by providing the connecting cable, different modules may not be completely provided on the same circuit board, thereby improving the flexibility of module settings.

Exemplarily, as shown in (b) of FIG. 10A , the connection cable can be arranged between the first conductive member 802 and the first antenna matching module. Thus, the first conductive member 802 can be arranged on a circuit board (such as the first hard board 801), and correspondingly, the first antenna matching module, the radio frequency module and the communication module can be arranged on another circuit board (such as the flexible board part on the first circuit board, and/or the second circuit board). Thus, the module setting is separated and the design flexibility is improved.

As shown in (c) of FIG. 10A , the connection cable can be arranged between the RF module and the first antenna matching module. Thus, the first conductive member 802 and the first antenna matching module can be arranged on one circuit board (such as the first hard board 801), and correspondingly, the RF module and the communication module can be arranged on another circuit board (such as the flexible board part on the first circuit board, and/or the second circuit board). This realizes the separation of module settings and improves design flexibility.

As shown in (d) of FIG. 10A , the connection cable can be arranged between the RF module and the communication module. Thus, the first conductive member 802, the first antenna matching module and the RF module can be arranged on one circuit board (such as the first hard board 801), and correspondingly, the communication module can be arranged on another circuit board (such as the flexible board part on the first circuit board, and/or the second circuit board). This realizes the separation of module settings and improves design flexibility.

It should be understood that in other implementations, based on any possible implementation as shown in FIG. 10A , more connection cables may be provided to achieve a separation design of more modules. In addition, in conjunction with the foregoing description, in any possible implementation of the above examples, the specific implementation of the first matching module may be flexibly selected according to the actual port matching situation. For example, in some implementations, when the original port matches well, the first matching module may not be provided, thereby streamlining the module settings.

10B is an example of the configuration of various modules on several possible communication links provided in an embodiment of the present application. In this example, the communication link where the second conductive point 805 (ie, the grounding point G1) is located is used as an example for description.

As shown in (a) of Figure 10B, the antenna can be connected to the second conductive member 803, the second antenna matching module and the reference ground (such as the reference ground provided by the first circuit board) in sequence through the second conductive point 805. Among them, similar to the first conductive member 802, the second conductive member 803 is a connecting device connecting the antenna matching module and the antenna conductive point, which can be a conductive device such as a shrapnel, conductive foam, etc. The second antenna matching module may include a small inductor, a large capacitor, or a bandpass matching. As a result, the large electric field area of the antenna can be adjusted to the +Y direction of the ear rod part, that is, at the top of the ear rod part, and the large current area is located in the -Y direction of the ear rod part, that is, at the bottom of the ear rod part. In addition, it can also play the role of grounding the metal dustproof net component. In some implementations, the first and/or second matching modules may also include a transient voltage suppression diode (TVS) in parallel to prevent static electricity from intruding into the communication path and allowing static electricity to go to the ground as soon as possible. In some other implementations of the present application, the TVS can be arranged in the first antenna matching module corresponding to the first conductive member 802, and static electricity is introduced into the floor by being grounded in parallel.

In other embodiments, the antenna may also adopt a DC grounding solution. For example, as shown in (b) of FIG. 10B , the antenna may be connected to the second conductive member 803 and the reference ground (such as the reference ground provided by the first circuit board) in sequence through the second conductive point 805. In this scenario, by DC grounding, the setup overhead of the second matching module is saved.

Continuing with the scheme description shown in FIG. 7 , it should be understood that the arrangement of the first conductive member 802 and the second conductive member 803 shown in (a) of FIG. 8 , and the arrangement positions of the first conductive point 804 and the second conductive point 805 shown in (b) of FIG. 8 , are all examples. In other embodiments of the present application, the electrical connection positions on the antenna and the first hard board 801 may also be different from the example shown in FIG. 8 . Exemplarily, referring to FIG. 10C , several examples of the arrangement positions of the first conductive point 804 and the second conductive point 805 on the antenna provided in the embodiment of the present application are shown. Among them, the first conductive point 804 is the feed source F1, and the second conductive point 805 is the grounding point G1 as an example. The positions of the first conductive point 804 and the second conductive point 805 on the first hard board 801 correspond to them, and will not be repeated here. In the example shown in FIG. 10C , in 10-1 and 10-9, the positions of the first conductive point 804 and the second conductive point 805 may be similar to the positions shown in (b) of FIG. 8 .

In the examples of 10-1 to 10-8, the position of the grounding point G1 (i.e., the second conductive point 805) can remain unchanged, such as being set on the lower half of the radiator of the antenna, and the position of the feed source F1 can be flexibly adjusted. Exemplarily, as shown in 10-1, the feed source F1 can be set on the left radiator of the antenna radiator close to the first pickup hole (i.e., the upper pickup hole). As shown in 10-2, the feed source F1 can be set on the top of the antenna radiator. As shown in 10-3, the feed source F1 can be set on the right radiator of the antenna radiator close to the first pickup hole. As shown in 10-4, the feed source F1 can be set on the right side of the antenna radiator close to the middle. As shown in 10-5, the feed source F1 can be set on the antenna radiator close to the upper side of the grounding point G1. As shown in 10-6, the feed source F1 can be set at the bottom of the antenna radiator. As shown in 10-7, the feed source F1 can be set on the left radiator of the antenna radiator close to the second pickup hole (i.e., the lower pickup hole). As shown in 10-8, the feed source F1 can be set on the left side near the middle of the antenna radiator.

In the examples of 10-9 to 10-13, the position of the grounding point G1 can also be flexibly adjusted, such as being set on the lower part of the antenna radiator. Take the example of feed source F1 being set on the left radiator of the antenna radiator close to the first pickup hole (i.e., the upper pickup hole). As shown in 10-10, the grounding point G1 can be set at the bottom of the antenna radiator. As shown in 10-11, the grounding point G1 can be set on the left radiator of the antenna radiator close to the second pickup hole (i.e., the lower pickup hole). As shown in 10-12, the grounding point G1 can be set on the right radiator of the antenna radiator close to the second pickup hole (i.e., the lower pickup hole).

It should be understood that the positions of the first conductive point 804 and the second conductive point 805 shown in FIG. 10C are only some examples. In other implementations, the positions of the first conductive point 804 and the second conductive point 805 in the above different examples may also be alternated. In different implementations, by setting the first conductive point 804 and the second conductive point 805, the antenna radiator and the reference ground, and the U-shaped structure formed by the grounding point can be opened upward, so that when the antenna is working, the large electric field area is located in the +Y direction of the ear rod, that is, at the top of the ear rod. The large current area is located in the -Y direction of the ear rod, that is, at the bottom of the ear rod. In this way, a lower electric field distribution is obtained, and the head mode loss is reduced.

In the above examples, it is clear that when the antenna is opened upward, a lower electric field distribution can be achieved, thereby significantly reducing the head mode loss. The following compares the solutions of opening upward and opening downward to demonstrate the above effect.

Exemplarily, the description is given with reference to the scheme comparison shown in FIG11 .

As shown in Figure 11, the field value distribution of the two antenna solutions with the opening upward and the opening downward is compared through simulation. In the electric field simulation, the darker the color of the electric field distribution (that is, the higher the gray value), the greater the corresponding electric field value.

(a) in Figure 11 shows an antenna setting scheme with the opening facing upward and the distribution of the corresponding electric field. Exemplarily, in the scheme with the opening facing upward, the grounding point G1 can be set at one end of the radiator away from the ear bag portion. In this example, the grounding point G1 can achieve its grounding function by connecting to the floor (such as a printed circuit board as a reference ground). The feed source F1 can be set at one end of the radiator close to the ear bag portion.

(b) in FIG11 shows the antenna setting scheme with the opening downward and the distribution of the corresponding electric field. Exemplarily, in the scheme with the opening downward, the grounding point G2 can be set at one end of the radiator close to the ear bag. In this example, the grounding point G2 can also achieve its grounding function by connecting to the floor. The feed source F2 can be set at one end of the radiator away from the ear bag.

By comparing the electric field simulation results of the opening upward scheme and the opening downward scheme, it can be seen that in the opening upward scheme, the electric field value is smaller, the distribution area is smaller, and it is mainly concentrated near the ear bag. Correspondingly, in the opening downward scheme, the electric field value is larger, the distribution area is larger, and it is mainly concentrated near the end of the ear rod. In this way, under the same input power conditions, the opening upward scheme with a larger electric field distribution area (i.e., the scheme provided by the present application) also has relatively low electric field values in various parts in space. As shown in the comparison of the electric field simulation in Figure 11, the scheme provided in the embodiment of the present application (i.e., the opening upward scheme) not only has a lower spatial electric field value distribution, but also a lower electric field distribution on the radiator.

Thus, based on the above description, the antenna solution provided by the embodiment of the present application with a lower electric field value distribution has a corresponding lower head mode loss. The following is an explanation in conjunction with the S parameter simulation in the head mode scenario shown in FIG.

As shown in (a) of Figure 12, the S11 of the open-up scheme is compared with that of the open-down scheme. The resonance centers of the two schemes are both around 2.48 GHz. The bandwidth of the open-up scheme is significantly higher than that of the open-down scheme. As shown in (b) of Figure 12, the radiation efficiency of the open-up scheme and the open-down scheme is compared. At the resonance center, although the resonance depth of the open-up scheme is not as good as that of the open-down scheme, the radiation efficiency is higher than that of the open-down scheme. In other words, the deeper S11 in the open-down scheme is caused by the larger loss (such as head mode loss), and the deeper S11 does not correspond to better radiation efficiency. As shown in (c) of Figure 12, the system efficiency of the open-up scheme and the open-down scheme is compared. It can be seen that the system efficiency peak of the open-up scheme is still higher than that of the open-down scheme. In addition, corresponding to the higher bandwidth in S11, in terms of system efficiency, the efficiency bandwidth of the open-up scheme is significantly better than that of the open-down scheme.

In this way, it can be proved that among the two antenna schemes shown in Figure 11, the open-up scheme has better radiation performance. Corresponding to the electric field simulation shown in Figure 11, it can be proved that in the above example, under the same other conditions, the low electric field type antenna with a lower electric field value distribution can have better head mode radiation performance.

It should be noted that in the description of the antenna solution provided in the above-mentioned Figures 7 to 12 for the embodiment of the present application, the composition of the antenna solution is described from the perspective of the setting of the feed source and the grounding point. The antenna solution with the above-mentioned feed source and grounding point setting characteristics may specifically be an IFA, PIFA, left-handed (CRLH), T-type antenna, etc. The embodiment of the present application does not limit the specific implementation of the low electric field antenna with an opening facing upward.

In the examples of Figures 7 to 12 above, the resonance covering the working frequency band can be obtained by exciting the antenna radiator working at 1/4 wavelength. The embodiment of the present application also provides an antenna solution that can reuse the reference ground to obtain dual resonance near the working frequency band. This can further increase the distribution area of the electric field during the operation of the antenna, thereby reducing the electric field value at each point. This further reduces the head model loss, allowing the wireless headset to obtain better communication quality.

Exemplarily, as shown in FIG13. The portion of the reference ground away from the grounding point can also be connected to the reference ground extension portion. The reference ground extension portion can also be a zero potential reference similar to the reference ground. As an example, as shown in FIG14, when the antenna scheme is set in the earphone, the reference ground extension portion can be formed by the flexible board portion in the first circuit board of the ear rod portion and the second circuit board (such as the flexible board corresponding to the second circuit board) set in the ear bag portion.

In this way, during the operation of the antenna as shown in FIG. 13 , in addition to being able to excite the 1/4 wavelength mode on the antenna radiator, the reference ground extension portion and the reference ground can jointly excite the 1/2 wavelength mode, thereby forming a dual resonance effect. It should be understood that in other embodiments, the reference ground extension portion and the reference ground can also jointly excite the frequency doubling of the 1/2 wavelength mode, such as the 1-times wavelength mode, the 3/2 wavelength mode, etc., to form a dual resonance covering the working frequency band together with the 1/4 wavelength mode. In this example, the reference ground extension portion and the reference ground jointly excite the 1/2 wavelength mode as an example.

As a possible implementation, the length of the antenna radiator can be determined according to 1/4 wavelength of the working frequency band, so as to excite the 1/4 wavelength mode to cover the working frequency band. In other implementations, the total length of the reference ground extension part and the reference ground can be determined according to 1/2 wavelength of the working frequency band, so as to excite the 1/2 wavelength mode to cover the working frequency band. In the specific implementation process, the total length of the first circuit board and the second circuit board can be controlled so as to meet the above-mentioned size requirements and excite the 1/2 wavelength mode to cover the working frequency band. For example, when the first circuit board and the second circuit board constitute the reference ground, the sum of the lengths of the first circuit board and the second circuit board can correspond to 1/2 wavelength. In other embodiments, when the total length of the first circuit board and the second circuit board is small, components such as inductors can be set at appropriate positions to increase the electrical length of the reference ground. In other embodiments, when the total length of the first circuit board and the second circuit board is small, a band-stop network based on the working frequency band can be set at an appropriate position to adjust the electrical length of the reference ground to a suitable position.

In this example, since the antenna opening is set upward, it can have the effect of low electric field distribution, so that the entire antenna system has lower head mode loss. At the same time, due to the coverage of the dual resonance described in the above example, the antenna working performance is further improved.

Exemplarily, as shown in the electric field simulation results in FIG13, combined with the electric field simulation effects of the solution with the opening upward and the solution with the opening downward shown in FIG11, it can be seen that after adding the reference ground extension part (the solution example shown in FIG14), the electric field distribution is extended from the ear rod part to the ear bag part, so that under the same input power, the electric field distribution range is larger and the local electric field value is lower. In addition, it can be seen from the electric field simulation that at the antenna opening (that is, the end of the antenna radiator close to the ear bag), both the field values on the radiator and in the surrounding space have also decreased significantly compared to the solution with the opening upward before the reference ground extension part was added. Combined with the effect description of the aforementioned opening upward solution, the solution provided in this example has smaller head mode loss and better antenna performance. The following is explained in conjunction with the S parameter simulation results shown in FIG15.

As shown in (a) of FIG. 15 , it is a schematic comparison of S11 between the open-up scheme (referred to as single wave) before adding the reference ground extension part as shown in FIG. 7 and the open-up scheme (referred to as double wave) after adding the reference ground extension part as shown in FIG. 14 . It can be seen that in the double-wave scheme, the resonance near 2.4 GHz can correspond to the 1/4 wavelength mode of the antenna radiator. There is an obvious depression near 2.7 GHz, which can be understood here as the resonance corresponding to the 1/2 wavelength mode. Although this resonance does not completely cover the working frequency band near 2.48 GHz, it can also play a significant role in expanding the bandwidth and optimizing the input impedance. Therefore, in some other embodiments of the present application, the length corresponding to at least part of the antenna radiator and the first circuit board and the second circuit board (such as referred to as the first length) may also have a certain difference from the 1/2 wavelength of the working frequency band. For example, when the first length is slightly larger than the 1/2 wavelength of the working frequency band, the excited 1/2 wavelength mode can be located in the low-frequency direction of the working frequency band. This can be used to expand the bandwidth in the low-frequency direction of the working frequency band and improve the performance in the low-frequency direction. Correspondingly, the 1/4 wavelength mode excited on the antenna radiator can be offset to the high frequency direction of the working frequency band, so as to improve the high frequency performance of the working frequency band through the 1/4 wavelength mode. For another example, when the first length is slightly smaller than 1/2 wavelength of the working frequency band, the excited 1/2 wavelength mode can be located in the high frequency direction of the working frequency band. This can be used to expand the bandwidth in the high frequency direction of the working frequency band and improve the high frequency direction performance. Correspondingly, the 1/4 wavelength mode excited on the antenna radiator can be offset to the low frequency direction of the working frequency band, so as to improve the low frequency performance of the working frequency band through the 1/4 wavelength mode.

As shown in (b) of Figure 15, the radiation efficiency of the single-wave scheme and the dual-wave scheme is compared. It can be seen that when the working frequency band is covered by dual resonance, the radiation efficiency is significantly improved. For example, the peak radiation efficiency is improved by more than 3dB. As shown in (c) of Figure 15, the system efficiency of the single-wave scheme and the dual-wave scheme is compared. It can be seen that when the working frequency band is covered by dual resonance, the peak system efficiency is improved by more than 4dB, and the bandwidth is also significantly expanded. For example, in the single-wave scheme, the -15dB bandwidth does not exceed 200MHz. In the dual-wave scheme, the system efficiency exceeds -14dB in the range from 2.4GHz to 3GHz. For example, in this example, taking the working frequency band including the Bluetooth band as an example, within the Bluetooth band, the system efficiency of the dual-wave scheme is improved to within -10dB, which is significantly higher than the system efficiency of the single-wave scheme. Correspondingly, the radiation efficiency has also been significantly improved (such as within -10dB).

It can be proved that the upward opening solution provided by the embodiment of the present application, whether single-wave or dual-wave, has been significantly improved compared with the existing solution. By setting up the low-field antenna, the head model loss can be reduced, and then when it is used in an electronic device (such as a headset) in a head model scenario, the communication quality of the electronic device can be significantly improved.

Although the present application has been described in conjunction with specific features and embodiments thereof, it is obvious that various modifications and combinations may be made thereto without departing from the spirit and scope of the present application. Accordingly, this specification and the drawings are merely exemplary illustrations of the present application as defined by the appended claims, and are deemed to have covered any and all modifications, variations, combinations or equivalents within the scope of the present application. Obviously, those skilled in the art may make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims (17)

1. A terminal antenna, characterized in that the terminal antenna is arranged in a wireless earphone, the wireless earphone comprises an ear-bag part and an ear-rod part; the terminal antenna includes:

a first radiator disposed in the ear stem portion and a first reference ground;

the first radiator is provided with a feed source and a grounding point, the first radiator is connected with the first reference ground through the grounding point, the grounding point is arranged on the lower half part of the first radiator, and the lower half part of the first radiator is a part, far away from the ear bag part, of the first radiator;

the first radiator and the first reference ground form a U-shaped structure through the grounding point, and an opening of the U-shaped structure faces one end of the ear rod part connected with the ear bag part;

The grounding point is arranged on the upper half part of the first radiator, the electric field value of the first position on the first radiator is a first electric field value, and the upper half part of the first radiator is a part, close to the ear bag part, of the first radiator;

The grounding point is arranged on the lower half part of the first radiator, and the electric field value of the first position on the first radiator is a second electric field value;

The second electric field value is smaller than the first electric field value, and the first position is any position on the first radiator.

2. The terminal antenna of claim 1, wherein the operating frequency band of the terminal antenna comprises a first frequency band, the length of the first radiator being determined from 1/4 wavelength of the first frequency band;

When the terminal antenna works, the first radiator excites a 1/4 wavelength mode to cover the first frequency band.

3. A terminal antenna according to claim 1 or 2, further comprising a second reference ground provided at the ear cup, the second reference ground being connected to an end of the first reference ground remote from the ground point.

4. A terminal antenna according to claim 3, wherein the operating frequency band of the terminal antenna comprises a first frequency band, the sum of the lengths of the first reference ground and the second reference ground being determined from 1/2 wavelength of the first frequency band;

When the terminal antenna works, the first reference ground and the second reference ground jointly excite a 1/2 wavelength mode, and a frequency band covered by the 1/2 wavelength mode is at least partially overlapped with the first frequency band.

5. A terminal antenna according to claim 2 or 4, wherein the first frequency band comprises a bluetooth frequency band.

6. A terminal antenna according to claim 1 or2 or 4, characterized in that the first reference ground is realized by means of a printed wiring board PCB and/or a flexible circuit board FPC.

7. A terminal antenna according to claim 1 or2 or 4, characterized in that the first radiator is realized by laser direct structuring LDS and/or FPC.

8. The terminal antenna of claim 4, wherein the second ground reference is implemented through an FPC.

9. A terminal antenna according to claim 1, 2 or 4, wherein a metal dust screen assembly is further provided in the wireless headset, the first radiator of the terminal antenna is connected to the metal dust screen assembly, and when the wireless headset is in operation, static electricity on the metal dust screen assembly returns to ground through a grounding point of the terminal antenna.

10. A wireless headset, characterized in that the wireless headset is provided with a terminal antenna according to any of claims 1-9.

11. The wireless earphone according to claim 10, wherein a baseband module and a radio frequency module are arranged on a first reference ground of the wireless earphone, and the terminal antenna is sequentially connected with the radio frequency module and the baseband module through the feed source; the terminal antenna is connected with a zero potential point on the first reference ground through the grounding point.

12. The wireless headset of claim 11, wherein the first reference ground is provided with a first conductive member and a second conductive member,

The terminal antenna is sequentially connected with the radio frequency module and the baseband module through the feed source, and specifically comprises:

the terminal antenna is sequentially connected with the radio frequency module and the baseband module through a first conductive piece at a position corresponding to the feed source;

The terminal antenna is connected with the zero potential point on the first reference ground through the grounding point, specifically:

and the terminal antenna is connected with the zero potential point on the first reference ground through a second conductive piece at a position corresponding to the grounding point.

13. The wireless headset of claim 12, wherein the first conductive member and/or the second conductive member is a conductive dome.

14. The wireless earphone according to claim 12 or 13, wherein a first antenna matching circuit is provided between the feed of the terminal antenna and the radio frequency module, the first antenna matching circuit comprising at least one of: capacitance, inductance, resistance, variable capacitance, variable inductance, variable resistance;

The first antenna matching circuit is used for adjusting the port impedance of the terminal antenna.

15. The wireless headset of claim 14, wherein the first reference ground comprises a first PCB and a first FPC;

the first conductive piece is arranged on the first PCB, the first antenna matching circuit, the radio frequency module and the baseband module are arranged on the first FPC, and the first conductive piece is connected with the first antenna matching circuit through a connecting cable; or alternatively

The first conductive piece and the first antenna matching circuit are arranged on the first PCB, the radio frequency module and the baseband module are arranged on the first FPC, and the first antenna matching module is connected with the radio frequency module through a connecting cable; or alternatively

The first conductive piece, the first antenna matching circuit and the radio frequency module are arranged on the first PCB, the baseband module is arranged on the first FPC, and the radio frequency module is connected with the baseband module through a connecting cable.

16. The wireless headset of claim 12 or 13, wherein a second antenna matching circuit is provided between the ground point of the terminal antenna and the first reference ground, the second antenna matching circuit comprising at least one of: microstrip line, capacitor, inductor, band-pass filter; the response frequency band of the band-pass filter comprises the working frequency band of the terminal antenna.

17. The wireless headset of any one of claims 10-13 or 15, wherein a metal dust screen assembly is provided in the wireless headset for positioning adjacent a sound pick-up aperture provided on the ear stem portion;

The metal dust screen assembly comprises a metal dust screen and a metal dust screen gasket which are mutually communicated, a conductive elastic sheet is arranged on the metal dust screen gasket, and the metal dust screen gasket is electrically connected with a first radiator of the terminal antenna through the conductive elastic sheet.