CN116451643B - Method and system for integrated circuit power supply network diagnosis and positioning - Google Patents
Method and system for integrated circuit power supply network diagnosis and positioning Download PDFInfo
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- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/40—Testing power supplies
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Abstract
The application provides a method and a system for diagnosing and positioning an integrated circuit power supply network, which relate to the technical field of integrated circuits and comprise the following steps: calculating voltage distribution in a power supply network by adopting a finite element method, and further calculating an evaluation index; when the integrated circuit power supply system is judged to be unreliable based on the evaluation index, calculating the pin voltage change duty ratio and/or the plane voltage change duty ratio of the SINK based on the voltage distribution; judging that the SINK of the current power-ground network has unreasonable pin distribution when the pin voltage change duty ratio is larger than the threshold value of the pin voltage change duty ratio, and/or judging that the direct current resistance between the VRM and the SINK of the current power-ground network is overlarge when the plane voltage change duty ratio is larger than the threshold value of the plane voltage change duty ratio. By comparing the voltage change ratio of the substandard power supply network with the threshold value, whether SINK exists or not can be accurately judged, and/or whether the pin distribution of the SINK is unreasonable and/or the direct current resistance between the VRM and the SINK is overlarge or not.
Description
Technical Field
The application relates to the technical field of integrated circuits, in particular to a method and a system for diagnosing and positioning an integrated circuit power supply network.
Background
With the development of communication technology, research and development of very large scale integrated circuits have been gradually developed. In order to improve the performance of electronic devices, reduce the volume and cost, power supplies, transistors, electronic components, circuits, etc. are integrated on a small 2D and 3D integrated circuit package. In order to realize more functions, very large scale integrated circuits are often designed with several layers to hundreds of layers, each layer is extremely complex, tens of millions and even hundreds of millions of transistors are integrated, the very large scale integrated circuits have a multi-scale structure, from a centimeter level to the current latest nanometer level, and hundreds of millions of components form tens of thousands of power supply and signal networks on an integrated circuit package so as to realize simultaneous concurrent operation of multiple signals and multiple functions. Because tens of thousands of power supplies and signal networks work simultaneously, a plurality of power supply systems (or voltage regulation modules, VRMs) with the same or different voltages are needed to supply power to the whole integrated circuit packaging system simultaneously, and because the number of components contained by different power supplies and signal networks is very different, the power consumption is also very different, and therefore, the power supply modes for different networks are also different. Under different power supply modes, the design of a power supply system of an integrated circuit is particularly important, and the unreasonable design of the power supply system can cause insufficient power supply of a part of a network of the integrated circuit or too large voltage drop of the part of the network, which can cause the integrated circuit to work abnormally. Therefore, it is necessary to detect whether the multi-power supply system of the designed integrated circuit layout is qualified or not through the later simulation and diagnosis, diagnose the position of the design defect through the simulation means for the integrated circuit layout with the design defect, and optimize the multi-power supply system of the designed integrated circuit layout by adopting the systematic method.
However, in the prior art, in a digital custom integrated circuit back-end layout design evaluation method for a spacecraft, for example, CN104331546a, by aiming at the voltage drop of a load (SINK) under the same process condition, the power supply condition of the whole power supply network is mastered, whether the power supply network is reasonable or not is judged, and whether the power supply is reliable or not is evaluated by ensuring that the chip function is not influenced by the power supply problem. However, the prior art only macroscopically determines whether the integrated circuit power supply system is reasonable, and does not further diagnose the specific cause of the integrated circuit power supply system being unreasonable. The specific reason how to diagnose and locate the unreliability of the integrated circuit power supply system is a technical problem to be solved by the person skilled in the art.
Disclosure of Invention
Purpose of (one) application
In view of the above, the present application is directed to a method and a system for diagnosing and positioning an integrated circuit power supply network, which are used for solving the technical problem of how to diagnose and position the specific cause of the unreliability of the integrated circuit power supply system.
(II) technical scheme
The application discloses a method for diagnosing and positioning an integrated circuit power supply network, which comprises the following steps:
s1, calculating voltage distribution of any unprocessed power supply-ground network of the integrated circuit by adopting a finite element method;
S2, calculating evaluation indexes based on voltage distribution, and setting thresholds of different evaluation indexes based on design requirements, wherein the evaluation indexes comprise one or more of worst voltage drop of an integrated circuit load, average voltage drop of the load, power supply voltage drop of a power supply network, ground voltage drop of a ground network, voltage fluctuation of a power supply system and current density, and the current density comprises plane current density distribution and current density of a via hole; the evaluation index and the threshold are used for constructing a plurality of reliability evaluation rules, the plurality of reliability evaluation rules are used for selecting different reliability evaluation rules based on the design requirement to construct a reliability evaluation rule combination, and the reliability evaluation rule combination is used for evaluating the reliability of the integrated circuit power supply system;
s3, when any reliability evaluation rule in the reliability evaluation rule combination is not satisfied, judging that the integrated circuit power supply system is unreliable, otherwise, judging that the integrated circuit power supply system is reliable;
s4, when the integrated circuit power supply system is unreliable, judging whether the current power supply-ground network in the integrated circuit power supply system meets the standard, and if the current power supply-ground network does not meet the standard, calculating the pin voltage change duty ratio and/or the plane voltage change duty ratio of the SINK of the current power supply-ground network; when the pin voltage change duty ratio is larger than the threshold value of the pin voltage change duty ratio, judging that the SINK of the current power-ground network has unreasonable pin distribution, and/or when the plane voltage change duty ratio is larger than the threshold value of the plane voltage change duty ratio, judging that the direct current resistance between the VRM and the SINK of the current power-ground network is overlarge.
In one possible implementation manner, the worst voltage drop of the load is defined as the difference of the maximum voltage value of the VRM positive pin minus the minimum voltage value of the SINK positive pin, the average voltage drop of the load is defined as the difference of the average voltage value of the VRM positive pin minus the average voltage value of the SINK positive pin, the power supply voltage drop of the power supply network is defined as the difference of the output voltage of the VRM minus the lowest voltage of the power supply network plane, the ground voltage drop of the ground network is defined as the difference of the highest voltage of the ground network plane minus the lowest voltage of the ground network plane, and the voltage fluctuation of the power supply network is defined as the absolute value of the power supply network voltage drop plus the absolute value of the ground network voltage drop;
the calculating the evaluation index based on the voltage distribution includes: based on voltage distribution, respectively finding out the position of the VRM positive pin corresponding to a power supply network and the position of the SINK positive pin corresponding to a ground network, wherein the voltages at the positions are the voltage of the VRM positive pin and the voltage of the SINK positive pin; the minimum voltage of the power plane is the minimum value of the voltage distribution on the power plane, which is obtained by a finite element method; the highest voltage of the ground network plane is the maximum value of voltage distribution on the ground network plane, which is obtained by a finite element method; the lowest voltage of the ground network plane is the minimum value of voltage distribution on the ground network plane, which is obtained by a finite element method;
Calculating a distribution of planar current density based on the voltage distributionAnd current density of via->：
In the method, in the process of the invention,for the conductivity of the conductor in which the plane is located, < >>Coordinates of any point on the plane of the plane power supply or ground network, +.>For the voltage distribution obtained by the finite element method, < >>Is a gradient operator;
the current density of the via hole is obtained by a finite element methodThe resulting voltage distribution is calculated according to the following formula:
in the method, in the process of the invention,is->Current density of individual vias, +.>Is->Voltage at the position of the top layer of each via hole, +.>Is->Voltage at the location of the via bottom layer +.>Is->Resistance of individual vias->Is the firstCross-sectional area of the individual vias.
In one possible implementation, the plurality of reliability evaluation rules includes: rule 1: for evaluating whether the voltage of the SINK meets the standard, it is defined as: the calculated worst voltage drop for the load is below the worst voltage drop threshold for the load, rule 2: for evaluating whether the voltage of the SINK meets the standard, it is defined as: the calculated average pressure drop across the load is below the threshold value for the average pressure drop across the load, rule 3: a method for evaluating whether a power plane of an integrated circuit power supply system meets a standard, defined as: the calculated power supply voltage of the power supply network falls below the threshold of the power supply voltage drop of the power supply network, rule 4: a network plane for evaluating an integrated circuit power supply system for compliance, defined as: the calculated ground network ground pressure drops below the ground network ground pressure drop threshold, rule 5: the method is used for evaluating whether the power supply system of the integrated circuit meets the standard, and is defined as: the calculated voltage fluctuation of the power supply network is lower than the threshold value of the voltage fluctuation of the power supply network, and the current density of any position of the calculated power supply network is lower than the threshold value of the current density;
The judging whether the current power-ground network in the integrated circuit power supply system meets the standard comprises the following steps: judging whether any rule of the rule 1 and the rule 2 meets the standard, if any rule of the rule 1 and the rule 2 does not meet the standard, judging that the power-ground network in the integrated circuit power supply system does not meet the standard, otherwise, judging that the power-ground network in the integrated circuit power supply system meets the standard.
In one possible implementation, the calculating the pin voltage change ratio of the SINK of the current power-ground network includes: collecting the highest voltage of the positive electrode pin of the SINK and the lowest voltage of the positive electrode pin of the SINK, calculating the difference value between the highest voltage of the positive electrode pin of the SINK and the lowest voltage of the positive electrode pin of the SINK, obtaining the voltage variation of the pin of the SINK, calculating the worst voltage drop based on the difference value between the maximum voltage value of the VRM positive electrode pin and the minimum voltage value of the positive electrode pin of the SINK, or calculating the average voltage drop based on the difference value between the average voltage value of the VRM positive electrode pin and the average voltage value of the positive electrode pin of the SINK, and calculating the pin voltage variation ratio of the SINK based on the ratio of the pin voltage variation of the SINK to the worst voltage drop, or calculating the pin voltage variation ratio of the SINK based on the ratio of the pin voltage variation of the SINK to the average voltage drop.
In one possible implementation, calculating the planar voltage change duty cycle of the current power-ground network includes: calculating the network plane voltage change duty ratio based on the SINK pin voltage change duty ratio, wherein the network plane voltage change duty ratio is 1-SINK pin voltage change duty ratio.
As a second aspect of the present application, a system for diagnostic positioning of an integrated circuit power supply network is also disclosed, a voltage-current distribution calculation module, an evaluation index calculation module, a reliability evaluation module, and a diagnostic module; the voltage and current distribution calculation module is used for calculating the voltage distribution of any unprocessed power supply-ground network of the integrated circuit by adopting a finite element method; the evaluation index calculation module is used for calculating evaluation indexes based on voltage distribution and setting thresholds of different evaluation indexes based on design requirements, wherein the evaluation indexes comprise one or more of worst voltage drop of an integrated circuit load, average voltage drop of the load, power supply voltage drop of a power supply network, ground voltage drop of a ground network, voltage fluctuation of a power supply system and current density, and the current density comprises plane current density distribution and current density of a via hole; the evaluation index and the threshold are used for constructing a plurality of reliability evaluation rules, the plurality of reliability evaluation rules are used for selecting different reliability evaluation rules based on the design requirement to construct a reliability evaluation rule combination, and the reliability evaluation rule combination is used for evaluating the reliability of the integrated circuit power supply system; the reliability evaluation module is used for judging that the integrated circuit power supply system is unreliable when any reliability evaluation rule in the reliability evaluation rule combination is not satisfied, otherwise, judging that the integrated circuit power supply system is reliable; the diagnosis module is used for judging whether the current power supply-ground network in the integrated circuit power supply system meets the standard or not when the integrated circuit power supply system is unreliable, and if the current power supply-ground network does not meet the standard, calculating the pin voltage change duty ratio and/or the plane voltage change duty ratio of the SINK of the current power supply-ground network; when the pin voltage change duty ratio is larger than the threshold value of the pin voltage change duty ratio, judging that the SINK of the current power-ground network has unreasonable pin distribution, and/or when the plane voltage change duty ratio is larger than the threshold value of the plane voltage change duty ratio, judging that the direct current resistance between the VRM and the SINK of the current power-ground network is overlarge.
In one possible implementation manner, the worst voltage drop of the load is defined as the difference of the maximum voltage value of the VRM positive pin minus the minimum voltage value of the SINK positive pin, the average voltage drop of the load is defined as the difference of the average voltage value of the VRM positive pin minus the average voltage value of the SINK positive pin, the power supply voltage drop of the power supply network is defined as the difference of the output voltage of the VRM minus the lowest voltage of the power supply network plane, the ground voltage drop of the ground network is defined as the difference of the highest voltage of the ground network plane minus the lowest voltage of the ground network plane, and the voltage fluctuation of the power supply network is defined as the absolute value of the power supply network voltage drop plus the absolute value of the ground network voltage drop;
the calculating the evaluation index based on the voltage distribution includes: based on voltage distribution, respectively finding out the position of the VRM positive pin corresponding to a power supply network and the position of the SINK positive pin corresponding to a ground network, wherein the voltages at the positions are the voltage of the VRM positive pin and the voltage of the SINK positive pin; the minimum voltage of the power plane is the minimum value of the voltage distribution on the power plane, which is obtained by a finite element method; the highest voltage of the ground network plane is the maximum value of voltage distribution on the ground network plane, which is obtained by a finite element method; the lowest voltage of the ground network plane is the minimum value of voltage distribution on the ground network plane, which is obtained by a finite element method;
Calculating a distribution of planar current density based on the voltage distributionAnd current density of via->：
In the method, in the process of the invention,for the conductivity of the conductor in which the plane is located, < >>Coordinates of any point on the plane of the plane power supply or ground network, +.>For the voltage distribution obtained by the finite element method, < >>Is a gradient operator;
current density of viaThe voltage distribution obtained by the finite element method is calculated according to the following formula:
in the method, in the process of the invention,is->Current density of individual vias, +.>Is->Voltage at the position of the top layer of each via hole, +.>Is->Voltage at the location of the via bottom layer +.>Is->Resistance of individual vias->Is the firstCross-sectional area of the individual vias.
In one possible implementation, the plurality of reliability evaluation rules includes: rule 1: for evaluating whether the voltage of the SINK meets the standard, it is defined as: the calculated worst voltage drop of the load is lower than the worst voltage drop threshold of the load; rule 2: for evaluating whether the voltage of the SINK meets the standard, it is defined as: the calculated average pressure drop of the load is below a threshold value of the average pressure drop of the load; rule 3: a method for evaluating whether a power plane of an integrated circuit power supply system meets a standard, defined as: the calculated power supply voltage of the power supply network is reduced below a threshold value of the power supply voltage drop of the power supply network; rule 4: a network plane for evaluating an integrated circuit power supply system for compliance, defined as: the calculated ground pressure of the ground network is below a threshold value of the ground pressure drop of the ground network; rule 5: the method is used for evaluating whether the power supply system of the integrated circuit meets the standard, and is defined as: the calculated voltage fluctuation of the power supply network is lower than the threshold value of the voltage fluctuation of the power supply network, and the current density of any position of the calculated power supply network is lower than the threshold value of the current density;
The judging whether the current power-ground network in the integrated circuit power supply system meets the standard comprises the following steps: judging whether any rule of the rule 1 and the rule 2 meets the standard, if any rule of the rule 1 and the rule 2 does not meet the standard, judging that the power-ground network in the integrated circuit power supply system does not meet the standard, otherwise, judging that the power-ground network in the integrated circuit power supply system meets the standard.
In one possible implementation, the calculating the pin voltage change ratio of the SINK of the current power-ground network includes: collecting the highest voltage of the positive electrode pin of the SINK and the lowest voltage of the positive electrode pin of the SINK, calculating the difference value between the highest voltage of the positive electrode pin of the SINK and the lowest voltage of the positive electrode pin of the SINK, obtaining the voltage variation of the pin of the SINK, calculating the worst voltage drop based on the difference value between the maximum voltage value of the VRM positive electrode pin and the minimum voltage value of the positive electrode pin of the SINK, or calculating the average voltage drop based on the difference value between the average voltage value of the VRM positive electrode pin and the average voltage value of the positive electrode pin of the SINK, and calculating the pin voltage variation ratio of the SINK based on the ratio of the pin voltage variation of the SINK to the worst voltage drop, or calculating the pin voltage variation ratio of the SINK based on the ratio of the pin voltage variation of the SINK to the average voltage drop.
In one possible implementation, calculating the planar voltage change duty cycle of the current power-ground network includes: calculating the network plane voltage change duty ratio based on the SINK pin voltage change duty ratio, wherein the network plane voltage change duty ratio is 1-SINK pin voltage change duty ratio.
(III) beneficial effects
The application can accurately judge whether SINK exists with unreasonable pin distribution and/or overlarge direct current resistance between VRM and SINK by comparing the voltage change duty ratio of the substandard power supply network with the threshold value thereof.
Additional advantages, objects, and features of the application will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the application. The objects and other advantages of the application may be realized and obtained by means of the instrumentalities and combinations particularly pointed out in the specification.
Drawings
The embodiments described below with reference to the drawings are exemplary and intended to illustrate and describe the application and should not be construed as limiting the scope of the application.
FIG. 1 is a system flow diagram of the present application;
FIG. 2 is a system block diagram of the present application;
The device comprises a voltage and current distribution calculation module, a voltage and current distribution calculation module and a voltage and current distribution calculation module, wherein 1; 2. an evaluation index calculation module; 3. a reliability evaluation module; 4. a diagnostic module.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the above description of the present application, the terms "first," "second," and the like are used merely to distinguish between descriptions and are not to be construed as indicating or implying relative importance.
As shown in fig. 1, the present embodiment provides a method for diagnosing and positioning an integrated circuit power supply network, which includes the following steps:
s1, calculating the voltage distribution of any unprocessed power-ground network of the integrated circuit by adopting a finite element method. Based on the power supply mode of the voltage regulation module designed by the integrated circuit, a corresponding direct current voltage drop calculation model is set for the power supply mode of each voltage regulation module. The setting up the corresponding direct current voltage drop calculation model comprises the following steps: for each set of power and ground networks, voltage regulation module(s) in the power network are designated, load(s) are designated, supply voltage (output voltage) of the voltage regulation module of each set of power and ground networks is set, and operating current of the load of each set of power and ground networks is set.
In order to realize more functions, very large scale integrated circuits are often designed with several layers to hundreds of layers, each layer is extremely complex, tens of millions and even hundreds of millions of transistors are integrated, the very large scale integrated circuits have a multi-scale structure, from a centimeter level to the current latest nanometer level, and hundreds of millions of components form tens of thousands of power supply and signal networks on an integrated circuit package so as to realize simultaneous concurrent operation of multiple signals and multiple functions. Because tens of thousands of power supplies and signal networks work simultaneously, a plurality of power supply systems (or voltage regulation modules, VRMs) with the same or different voltages are needed to supply power to the whole integrated circuit packaging system simultaneously, and because the number of components contained by different power supplies and signal networks is very different, the power consumption is also very different, so that the power supply modes for different networks are also different, and four power supply modes are generally adopted: the first mode may be a mode in which one VRM supplies power to a plurality of loads for a network with small power consumption, the second mode may be a mode in which a plurality of VRMs supply power to the same load at different positions for a network with large power consumption, the third mode may be a single power supply mode, i.e., a single VRM supplies power to a single load, and the fourth mode may be a mode in which a plurality of VRMs supply power to a plurality of loads. And setting corresponding direct current voltage drop calculation models based on different power supply modes.
In one embodiment, a finite element method is used to calculate a voltage distribution of any unprocessed power-ground network of an integrated circuit, comprising:
simplifying the three-dimensional electric field model of the integrated circuit into a multi-layer two-dimensional electric field model in direct current voltage drop calculation models corresponding to different power supply modes, and carrying out grid division on each layer of integrated circuit layout of the multi-layer two-dimensional electric field model; dispersing functional corresponding to differential equations formed by the multi-layer two-dimensional electric field model on a mesh subdivision unit, taking extremum and enabling the extremum to be zero to obtain a finite element stiffness matrix equation set, and solving the finite element stiffness matrix equation set to obtain voltage distribution on each layer of flat plate of the integrated circuit; and calculating the current density distribution of the field, namely the current density distribution of the grid subdivision units in each layer of layout according to the voltage distribution on each layer of flat plate of the integrated circuit.
The three-dimensional electric field model of the integrated circuit is simplified into a multi-layer two-dimensional electric field model, and the method is specifically calculated as follows:
the three-dimensional model of the direct-current electric field of the multilayer integrated circuit means that the distribution of electric conductivity and electric potential in the direct-current electric field model is three-dimensional space coordinatesIs a function of (1), namely: />，/>Which satisfies equation 1 and boundary condition equation 2:
Equation 1:；
equation 2:；
in the equation 2 of the present application,for boundary of the first category->Normal to the boundary of the second class>For the potential->At the boundary of the first kindThe values of>Indicating (I)>Bulk current density for external circuitry;
aiming at the three-dimensional model of the multi-layer integrated circuit direct current electric field, establishing a functional equation 3 of the two-dimensional model of the integrated circuit direct current electric field of each layer:
equation 3:；
in equation 3, whereIs functional (functional)>Is the thickness of the metal layer->For grid cells->Is a conductive material;for grid cells->Is a potential vector of the node of (a); />For grid cells->Is a surface of (2); />Representing grid cell->Is a side of (2);is the surface current density, which is an unknown quantity generated by an external circuit; />Is a first boundary; />For the potential->At a first boundaryThe values of>A representation; />Bulk current density for external circuitry; />At a potential of/>The abscissa of distribution, ++>At a potential ofThe ordinate of the distribution.
And (3) dispersing the functional on the mesh subdivision unit, taking the extremum and enabling the extremum to be zero, thus obtaining a finite element equation set, and solving the finite element equation set to obtain the voltage distribution on each layer of flat plate of the integrated circuit.
The VRM positive pin is a VRM pin connected to the power network, and the VRM negative pin is a VRM pin connected to the ground network.
S2, calculating evaluation indexes based on voltage distribution, and setting thresholds of different evaluation indexes based on design requirements, wherein the evaluation indexes comprise one or more of worst voltage drop of an integrated circuit load, average voltage drop of the load, power supply voltage drop of a power supply network, ground voltage drop of a ground network, voltage fluctuation of a power supply system and current density, and the current density comprises plane current density distribution and current density of a via hole; the evaluation index and the threshold are used for constructing a plurality of reliability evaluation rules, the plurality of reliability evaluation rules are used for selecting different reliability evaluation rules based on the design requirement to construct a reliability evaluation rule combination, and the reliability evaluation rule combination is used for evaluating the reliability of the integrated circuit power supply system. The worst voltage drop of the load is defined as the difference value of the maximum voltage of the VRM positive electrode pin minus the minimum voltage of the SINK positive electrode pin, the average voltage drop of the load is defined as the difference value of the average voltage of the VRM positive electrode pin minus the average voltage of the SINK positive electrode pin, the power supply voltage drop of the power supply network is defined as the difference value of the output voltage of the VRM minus the lowest voltage of the power supply network plane, the ground network ground voltage drop is defined as the difference value of the highest voltage of the ground network plane minus the lowest voltage of the ground network plane, and the voltage fluctuation of the power supply network is defined as the absolute value of the power supply network voltage drop plus the absolute value of the ground network voltage drop.
The calculating the evaluation index based on the voltage distribution includes: based on voltage distribution, respectively finding out the position of the VRM positive pin corresponding to a power network and the position of the SINK positive pin corresponding to a ground network, wherein the voltage at the position is the voltage of the VRM positive pin and the voltage of the SINK positive pin, the voltage maximum value of the VRM positive pin, the voltage minimum value of the SINK positive pin, the voltage average value of the VRM positive pin, the voltage average value of the SINK positive pin and the output voltage of the VRM are calculated based on the voltage of the VRM positive pin and the voltage of the SINK positive pin, the voltage maximum value of the VRM positive pin is the maximum value of the voltages of all calculated VRM positive pins, for example, 16 positive pins are taken as a certain VRM, the voltage maximum value of the SINK positive pin is the maximum value of the voltages of all calculated SINK positive pins; the minimum voltage of the power plane is the minimum value of the voltage distribution on the power plane, which is obtained by a finite element method; the highest voltage of the ground network plane is the maximum value of voltage distribution on the ground network plane, which is obtained by a finite element method; the lowest voltage of the ground network plane is the minimum value of the voltage distribution obtained by the finite element method on the ground network plane.
Calculating a distribution of planar current density based on the voltage distributionAnd current density of via->：
In the method, in the process of the invention,for the conductivity of the conductor in which the plane is located, < >>Coordinates of any point on the plane of the plane power supply or ground network, +.>For the voltage distribution obtained by the finite element method, < >>Is a gradient operator;
the current density of the via is obtained from the voltage distribution obtained by the finite element method according to the following equation:
in the method, in the process of the invention,is->Current density of individual vias, +.>Is->Voltage at the position of the top layer of each via hole, +.>Is->Voltage at the location of the via bottom layer +.>Is->Resistance of individual vias->Is the firstCross-sectional area of the individual vias.
In some embodiments, the plurality of reliability evaluation rules comprises:
rule 1: for evaluating whether the voltage of the SINK meets the standard, it is defined as: the calculated worst voltage drop of the load is lower than the worst voltage drop threshold of the load;
rule 2: for evaluating whether the voltage of the SINK meets the standard, it is defined as: the calculated average pressure drop of the load is below a threshold value of the average pressure drop of the load;
rule 3: a method for evaluating whether a power plane of an integrated circuit power supply system meets a standard, defined as: the calculated power supply voltage of the power supply network is reduced below a threshold value of the power supply voltage drop of the power supply network;
Rule 4: a network plane for evaluating an integrated circuit power supply system for compliance, defined as: the calculated ground pressure of the ground network is below a threshold value of the ground pressure drop of the ground network;
rule 5: the method is used for evaluating whether the power supply system of the integrated circuit meets the standard, and is defined as: the calculated voltage fluctuation of the power supply network is lower than the threshold value of the voltage fluctuation of the power supply network, and the calculated current density of any position of the power supply network is lower than the threshold value of the current density.
In some embodiments, the plurality of reliability evaluation rules for selecting different reliability evaluation rules based on the design requirements to construct a reliability evaluation rule combination includes: the design requirements include any one of conservative design, allowance design, and economic design; when the design requirement is a conservative design or a margin design, the reliability evaluation rule combination comprises a rule 1, a rule 3, a rule 4 and a rule 5; when the design requirement is an economic design, the reliability evaluation rule combination includes rule 2, rule 3, rule 4, and rule 5.
S3, when any reliability evaluation rule in the reliability evaluation rule combination is not satisfied, judging that the integrated circuit power supply system is unreliable, otherwise, judging that the integrated circuit power supply system is reliable.
As described in the above, the reliability evaluation rule combination is constituted by different reliability evaluation rules, and the reliability evaluation rule is constituted by different evaluation indexes and thresholds thereof, when the design requirement includes any one of a conservative design, a margin design, and an economic design; when the design requirement is a conservative design or a allowance design, the reliability evaluation rule combination comprises a rule 1, a rule 3, a rule 4 and a rule 5, and when any one of the reliability evaluation rules of the rule 1, the rule 3, the rule 4 and the rule 5 is not satisfied, the power supply system of the integrated circuit power supply is judged to be unreliable, and when all the reliability evaluation rules are satisfied, the power supply system of the integrated circuit power supply is judged to be reliable; and when the design requirement is economic design, the reliability evaluation rule combination comprises a rule 2, a rule 3, a rule 4 and a rule 5, and when any one of the rule 2, the rule 3, the rule 4 and the rule 5 is not satisfied, the integrated circuit power supply system is judged to be unreliable, and when all the reliability evaluation rules are satisfied, the integrated circuit power supply system is judged to be reliable.
S4, when the integrated circuit power supply system is unreliable, judging whether the current power supply-ground network in the integrated circuit power supply system meets the standard, and if the current power supply-ground network does not meet the standard, calculating the pin voltage change duty ratio and/or the plane voltage change duty ratio of the SINK of the current power supply-ground network; when the pin voltage change duty ratio is larger than the threshold value of the pin voltage change duty ratio, judging that the SINK of the current power-ground network has unreasonable pin distribution, and/or when the plane voltage change duty ratio is larger than the threshold value of the plane voltage change duty ratio, judging that the direct current resistance between the VRM and the SINK of the current power-ground network is overlarge.
In one embodiment, the plurality of reliability evaluation rules include rule 1, rule 2, rule 3, rule 4, and rule 5 as described above, and determining whether the current power-ground network in the integrated circuit power supply system meets the criteria comprises: judging whether any rule of the rule 1 and the rule 2 meets the standard, if any rule of the rule 1 and the rule 2 does not meet the standard, judging that the power-ground network in the integrated circuit power supply system does not meet the standard, otherwise, judging that the power-ground network in the integrated circuit power supply system meets the standard.
In one embodiment, the calculating the pin voltage variation ratio of the SINK of the current power-ground network includes: collecting the highest voltage of the positive electrode pin of the SINK and the lowest voltage of the positive electrode pin of the SINK, calculating the difference value between the highest voltage of the positive electrode pin of the SINK and the lowest voltage of the positive electrode pin of the SINK, obtaining the voltage variation of the pin of the SINK, calculating the worst voltage drop based on the difference value between the maximum voltage value of the VRM positive electrode pin and the minimum voltage value of the positive electrode pin of the SINK, or calculating the average voltage drop based on the difference value between the average voltage value of the VRM positive electrode pin and the average voltage value of the positive electrode pin of the SINK, and calculating the pin voltage variation ratio of the SINK based on the ratio of the pin voltage variation of the SINK to the worst voltage drop, or calculating the pin voltage variation ratio of the SINK based on the ratio of the pin voltage variation of the SINK to the average voltage drop. In one embodiment, calculating the planar voltage change duty cycle of the current power-ground network includes: calculating the network plane voltage change duty ratio based on the SINK pin voltage change duty ratio, wherein the network plane voltage change duty ratio is 1-SINK pin voltage change duty ratio. The power supply system is powered by the VRM to the SINK, and the voltage obtained by the SINK is lower than the power supply voltage of the VRM, and the voltage is lower than a certain threshold value to consider that the power supply is failed. The reason why the SINK voltage is lower than the supply voltage of the VRM is the voltage drop of the supply network, which causes a supply network plane voltage variation comprising two parts: firstly, the voltage drop on the plane of the power supply network, secondly, the pin voltage difference of the SINK pins caused by the position difference, and the sum of the variation ratio of the SINK pins and the voltage difference of the SINK pins is 1.
In a specific embodiment, the integrated circuit power supply system evaluated based on rule 1/rule 2 is unreliable, that is, it is determined that the power-ground network does not reach the standard, the maximum voltage of the positive pin of the VRM is calculated to be 0.995V, the highest voltage of the positive pin of the SINK is 0.953V, the lowest voltage is 0.905V, the worst voltage drop is calculated to be 0.995-0.905=0.09V, the pin voltage change ratio of the SINK calculated by adopting the worst voltage drop is (0.995-0.953)/0.09=46.7%, the plane voltage change ratio calculated based on the pin voltage change ratio of the SINK is 1-46.7% =53.3%, and the set SINK pin voltage change ratio threshold is assumed to be 30%, the plane voltage change ratio threshold is 30%, so that the distribution of the SINK pins of the VRM and the SINK is unreasonable, and the direct current resistance between the SINK is excessively large.
Working principle: firstly, aiming at the provided integrated circuit layout, adopting a finite element method to simulate each group of power-ground networks of a power supply system, calculating the voltage distribution of each group of power-ground networks, and constructing a plurality of reliability evaluation rules 1 to 5 to evaluate each group of power-ground networks based on the voltage distribution, evaluation indexes and threshold values; when any reliability evaluation rule in the reliability evaluation rule combination of each group of power supply-ground networks is not satisfied, judging that the integrated circuit power supply system is unreliable based on the integrated circuit power supply system being a set of the power supply-ground networks, otherwise judging that the integrated circuit power supply system is reliable; when the integrated circuit power supply system is unreliable, judging whether rule 1/rule 2 is not satisfied, if rule 1/rule 2 is not satisfied, further judging whether the SINK is caused by unreasonable pin distribution of SINK or overlarge direct current resistance between VRM and SINK, and judging whether the SINK is caused by unreasonable pin distribution of SINK or overlarge direct current resistance between VRM and SINK, wherein the SINK voltage change duty ratio and/or plane voltage change duty ratio of the SINK of the current power-ground network need to be calculated; when the pin voltage change duty ratio is larger than the threshold value of the pin voltage change duty ratio, judging that the power supply system of the integrated circuit is unreliable because the SINK of the current power-ground network has unreasonable pin distribution, and/or when the plane voltage change duty ratio is larger than the threshold value of the plane voltage change duty ratio, judging that the direct current resistance between the VRM and the SINK of the current power-ground network is overlarge.
As shown in fig. 2, as a second aspect of the present embodiment, there is also provided a system for integrated circuit power supply network diagnostic positioning, including: a voltage and current distribution calculation module 1, an evaluation index calculation module 2, a reliability evaluation module 3 and a diagnosis module 4; the voltage and current distribution calculation module 1 is used for calculating the voltage distribution of any unprocessed power-ground network of the integrated circuit by adopting a finite element method; the evaluation index calculation module 2 is configured to calculate an evaluation index based on a voltage distribution, and set thresholds of different evaluation indexes based on design requirements, where the evaluation index includes one or more of a worst voltage drop of an integrated circuit load, an average voltage drop of the load, a power supply voltage drop of a power supply network, a ground voltage drop of a ground network, a voltage fluctuation of a power supply system, and a current density, and the current density includes a planar current density distribution and a current density of a via hole; the evaluation index and the threshold are used for constructing a plurality of reliability evaluation rules, the plurality of reliability evaluation rules are used for selecting different reliability evaluation rules based on the design requirement to construct a reliability evaluation rule combination, and the reliability evaluation rule combination is used for evaluating the reliability of the integrated circuit power supply system; the reliability evaluation module 3 is configured to determine that the integrated circuit power supply system is unreliable when any reliability evaluation rule in the reliability evaluation rule combination is not satisfied, otherwise, determine that the integrated circuit power supply system is reliable; the diagnosis module 4 is used for judging whether the current power-ground network in the integrated circuit power supply system meets the standard or not when the integrated circuit power supply system is unreliable, and if the current power-ground network does not meet the standard, calculating the pin voltage change duty ratio and/or the plane voltage change duty ratio of the SINK of the current power-ground network; when the pin voltage change duty ratio is larger than the threshold value of the pin voltage change duty ratio, judging that the SINK of the current power-ground network has unreasonable pin distribution, and/or when the plane voltage change duty ratio is larger than the threshold value of the plane voltage change duty ratio, judging that the direct current resistance between the VRM and the SINK of the current power-ground network is overlarge.
In one embodiment, the worst voltage drop of the load is defined as the difference of the maximum voltage value of the VRM positive pin minus the minimum voltage value of the SINK positive pin, the average voltage drop of the load is defined as the difference of the average voltage value of the VRM positive pin minus the average voltage value of the SINK positive pin, the power supply voltage drop of the power supply network is defined as the difference of the output voltage of the VRM minus the minimum voltage of the power supply network plane, the ground network voltage drop is defined as the difference of the maximum voltage of the ground network plane minus the minimum voltage of the ground network plane, and the voltage fluctuation of the power supply network is defined as the absolute value of the power supply network voltage drop plus the absolute value of the ground network voltage drop;
the calculating the evaluation index based on the voltage distribution includes: based on voltage distribution, respectively finding out the position of the VRM positive pin corresponding to a power supply network and the position of the SINK positive pin corresponding to a ground network, wherein the voltages at the positions are the voltage of the VRM positive pin and the voltage of the SINK positive pin; the minimum voltage of the power plane is the minimum value of the voltage distribution on the power plane, which is obtained by a finite element method; the highest voltage of the ground network plane is the maximum value of voltage distribution on the ground network plane, which is obtained by a finite element method; the lowest voltage of the ground network plane is the minimum value of voltage distribution on the ground network plane, which is obtained by a finite element method;
Calculating a distribution of planar current density based on the voltage distributionAnd current density of via->：
In the method, in the process of the invention,for the conductivity of the conductor in which the plane is located, < >>Coordinates of any point on the plane of the plane power supply or ground network, +.>For the voltage distribution obtained by the finite element method, < >>Is a gradient operator;
the current density of the via is obtained from the voltage distribution obtained by the finite element method according to the following equation:
in the method, in the process of the invention,is->Current density of individual vias, +.>Is->Voltage at the position of the top layer of each via hole, +.>Is->Voltage at the location of the via bottom layer +.>Is->Resistance of individual vias->Is the firstCross-sectional area of the individual vias.
In one embodiment, the plurality of reliability evaluation rules includes:
rule 1: for evaluating whether the voltage of the SINK meets the standard, it is defined as: the calculated worst voltage drop of the load is lower than the worst voltage drop threshold of the load;
rule 2: for evaluating whether the voltage of the SINK meets the standard, it is defined as: the calculated average pressure drop of the load is below a threshold value of the average pressure drop of the load;
rule 3: a method for evaluating whether a power plane of an integrated circuit power supply system meets a standard, defined as: the calculated power supply voltage of the power supply network is reduced below a threshold value of the power supply voltage drop of the power supply network;
Rule 4: a network plane for evaluating an integrated circuit power supply system for compliance, defined as: the calculated ground pressure of the ground network is below a threshold value of the ground pressure drop of the ground network;
rule 5: the method is used for evaluating whether the power supply system of the integrated circuit meets the standard, and is defined as: the calculated voltage fluctuation of the power supply network is lower than the threshold value of the voltage fluctuation of the power supply network, and the current density of any position of the calculated power supply network is lower than the threshold value of the current density;
the judging whether the current power-ground network in the integrated circuit power supply system meets the standard comprises the following steps: judging whether any rule of the rule 1 and the rule 2 meets the standard, if any rule of the rule 1 and the rule 2 does not meet the standard, judging that the power-ground network in the integrated circuit power supply system does not meet the standard, otherwise, judging that the power-ground network in the integrated circuit power supply system meets the standard.
In one embodiment, the calculating the pin voltage variation ratio of the SINK of the current power-ground network includes: collecting the highest voltage of the positive electrode pin of the SINK and the lowest voltage of the positive electrode pin of the SINK, calculating the difference value between the highest voltage of the positive electrode pin of the SINK and the lowest voltage of the positive electrode pin of the SINK, obtaining the voltage variation of the pin of the SINK, calculating the worst voltage drop based on the difference value between the maximum voltage value of the VRM positive electrode pin and the minimum voltage value of the positive electrode pin of the SINK, or calculating the average voltage drop based on the difference value between the average voltage value of the VRM positive electrode pin and the average voltage value of the positive electrode pin of the SINK, and calculating the pin voltage variation ratio of the SINK based on the ratio of the pin voltage variation of the SINK to the worst voltage drop, or calculating the pin voltage variation ratio of the SINK based on the ratio of the pin voltage variation of the SINK to the average voltage drop.
In one embodiment, calculating the planar voltage change duty cycle of the current power-ground network includes: calculating the network plane voltage change duty ratio based on the SINK pin voltage change duty ratio, wherein the network plane voltage change duty ratio is 1-SINK pin voltage change duty ratio.
Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present application and not for limiting the same, and although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalent coverage of the technical solution of the present application can be made without departing from the spirit and scope of the technical solution of the present application, which shall be covered by the scope of the claims of the present application.
Claims (6)
1. A method for diagnostic positioning of an integrated circuit power supply network, comprising the steps of: s1, calculating voltage distribution of any unprocessed power supply-ground network of the integrated circuit by adopting a finite element method; s2, calculating evaluation indexes based on voltage distribution, and setting thresholds of different evaluation indexes based on design requirements, wherein the evaluation indexes comprise one or more of worst voltage drop of an integrated circuit load, average voltage drop of the load, power supply voltage drop of a power supply network, ground voltage drop of a ground network, voltage fluctuation of a power supply system and current density, and the current density comprises plane current density distribution and current density of a via hole; the evaluation index and the threshold are used for constructing a plurality of reliability evaluation rules, the plurality of reliability evaluation rules are used for selecting different reliability evaluation rules based on the design requirement to construct a reliability evaluation rule combination, and the reliability evaluation rule combination is used for evaluating the reliability of the integrated circuit power supply system;
S3, when any reliability evaluation rule in the reliability evaluation rule combination is not satisfied, the integrated circuit power supply system is judged to be unreliable, otherwise, the integrated circuit power supply system is judged to be reliable;
s4, when the integrated circuit power supply system is unreliable, judging whether the current power supply-ground network in the integrated circuit power supply system meets the standard, and if the current power supply-ground network does not meet the standard, calculating the pin voltage change duty ratio and/or the plane voltage change duty ratio of the SINK of the current power supply-ground network; judging that the SINK of the current power-ground network has unreasonable pin distribution when the pin voltage change duty ratio is larger than a threshold value of the pin voltage change duty ratio and/or judging that the direct current resistance between the VRM and the SINK of the current power-ground network is overlarge when the plane voltage change duty ratio is larger than the threshold value of the plane voltage change duty ratio;
calculating the pin voltage variation duty ratio of the SINK of the current power-ground network comprises: collecting the highest voltage of the positive electrode pin of the SINK and the lowest voltage of the positive electrode pin of the SINK, calculating the difference value between the highest voltage of the positive electrode pin of the SINK and the lowest voltage of the positive electrode pin of the SINK, obtaining the voltage variation of the pin of the SINK, calculating the worst voltage drop based on the difference value between the maximum voltage value of the VRM positive electrode pin and the minimum voltage value of the positive electrode pin of the SINK or calculating the average voltage drop based on the difference value between the average voltage value of the VRM positive electrode pin and the average voltage value of the positive electrode pin of the SINK, calculating the pin voltage variation ratio of the SINK based on the ratio of the pin voltage variation of the SINK to the worst voltage drop, or calculating the pin voltage variation ratio of the SINK based on the ratio of the pin voltage variation of the SINK to the average voltage drop;
Calculating the planar voltage change duty cycle of the current power-ground network includes: calculating the network plane voltage change duty ratio based on the SINK pin voltage change duty ratio, wherein the network plane voltage change duty ratio is 1-SINK pin voltage change duty ratio.
2. A method for diagnostic positioning of an integrated circuit power supply network according to claim 1, characterized in that the worst voltage drop of the load is defined as the difference of the maximum voltage of the VRM positive pin minus the minimum voltage of the SINK positive pin, the average voltage drop of the load is defined as the difference of the average voltage of the VRM positive pin minus the average voltage of the SINK positive pin, the power supply voltage drop of the power supply network is defined as the difference of the output voltage of the VRM minus the minimum voltage of the power supply network plane, the ground voltage drop of the ground network is defined as the difference of the maximum voltage of the ground network plane minus the minimum voltage of the ground network plane, and the voltage fluctuation of the power supply network is defined as the absolute value of the power supply network voltage drop plus the absolute value of the ground network voltage drop;
the calculating the evaluation index based on the voltage distribution includes: based on voltage distribution, respectively finding out the position of the VRM positive pin corresponding to a power supply network and the position of the SINK positive pin corresponding to a ground network, wherein the voltages at the positions are the voltage of the VRM positive pin and the voltage of the SINK positive pin; the minimum voltage of the power plane is the minimum value of the voltage distribution on the power plane, which is obtained by a finite element method; the highest voltage of the ground network plane is the maximum value of voltage distribution on the ground network plane, which is obtained by a finite element method; the lowest voltage of the ground network plane is the minimum value of voltage distribution on the ground network plane, which is obtained by a finite element method;
Calculating a distribution of planar current density based on the voltage distributionAnd current density of via->：
In (1) the->For the conductivity of the conductor in which the plane is located, < >>Coordinates of any point on the plane of the plane power supply or ground network, +.>For the voltage distribution obtained by the finite element method, < >>Is a gradient operator;
the current density of the via is obtained from the voltage distribution obtained by the finite element method according to the following equation:
in (1) the->Is->Current density of individual vias, +.>Is->Voltage at the position of the top layer of each via hole, +.>Is->Voltage at the location of the via bottom layer +.>Is->Resistance of individual vias->Is->Cross-sectional area of the individual vias.
3. A method for integrated circuit power supply network diagnostic positioning according to claim 1, wherein the plurality of reliability evaluation rules comprises: rule 1: for evaluating whether the voltage of the SINK meets the standard, it is defined as: the calculated worst voltage drop of the load is lower than the worst voltage drop threshold of the load; rule 2: for evaluating whether the voltage of the SINK meets the standard, it is defined as: the calculated average pressure drop of the load is below a threshold value of the average pressure drop of the load; rule 3: a method for evaluating whether a power plane of an integrated circuit power supply system meets a standard, defined as: the calculated power supply voltage of the power supply network is reduced below a threshold value of the power supply voltage drop of the power supply network; rule 4: a network plane for evaluating an integrated circuit power supply system for compliance, defined as: the calculated ground pressure of the ground network is below a threshold value of the ground pressure drop of the ground network; rule 5: the method is used for evaluating whether the power supply system of the integrated circuit meets the standard, and is defined as: the calculated voltage fluctuation of the power supply network is lower than the threshold value of the voltage fluctuation of the power supply network, and the current density of any position of the calculated power supply network is lower than the threshold value of the current density;
The judging whether the current power-ground network in the integrated circuit power supply system meets the standard comprises the following steps: judging whether any rule of the rule 1 and the rule 2 meets the standard, if any rule of the rule 1 and the rule 2 does not meet the standard, judging that the power-ground network in the integrated circuit power supply system does not meet the standard, otherwise, judging that the power-ground network in the integrated circuit power supply system meets the standard.
4. A system for integrated circuit power network diagnostic positioning, comprising: the system comprises a voltage and current distribution calculation module, an evaluation index calculation module, a reliability evaluation module and a diagnosis module; the voltage and current distribution calculation module is used for calculating the voltage distribution of any unprocessed power supply-ground network of the integrated circuit by adopting a finite element method; the evaluation index calculation module is used for calculating evaluation indexes based on voltage distribution and setting thresholds of different evaluation indexes based on design requirements, wherein the evaluation indexes comprise one or more of worst voltage drop of an integrated circuit load, average voltage drop of the load, power supply voltage drop of a power supply network, ground voltage drop of a ground network, voltage fluctuation of a power supply system and current density, and the current density comprises plane current density distribution and current density of a via hole; the evaluation index and the threshold are used for constructing a plurality of reliability evaluation rules, the plurality of reliability evaluation rules are used for selecting different reliability evaluation rules based on the design requirement to construct a reliability evaluation rule combination, and the reliability evaluation rule combination is used for evaluating the reliability of the integrated circuit power supply system; the reliability evaluation module is used for judging that the integrated circuit power supply system is unreliable when any reliability evaluation rule in the reliability evaluation rule combination is not satisfied, otherwise, judging that the integrated circuit power supply system is reliable; the diagnosis module is used for judging whether the current power supply-ground network in the integrated circuit power supply system meets the standard or not when the integrated circuit power supply system is unreliable, and if the current power supply-ground network does not meet the standard, calculating the pin voltage change duty ratio and/or the plane voltage change duty ratio of the SINK of the current power supply-ground network; judging that the SINK of the current power-ground network has unreasonable pin distribution when the pin voltage change duty ratio is larger than a threshold value of the pin voltage change duty ratio and/or judging that the direct current resistance between the VRM and the SINK of the current power-ground network is overlarge when the plane voltage change duty ratio is larger than the threshold value of the plane voltage change duty ratio;
The calculating the pin voltage variation ratio of the SINK of the current power-ground network comprises the following steps: collecting the highest voltage of the positive electrode pin of the SINK and the lowest voltage of the positive electrode pin of the SINK, calculating the difference value between the highest voltage of the positive electrode pin of the SINK and the lowest voltage of the positive electrode pin of the SINK, obtaining the voltage variation of the pin of the SINK, calculating the worst voltage drop based on the difference value between the maximum voltage value of the VRM positive electrode pin and the minimum voltage value of the positive electrode pin of the SINK or calculating the average voltage drop based on the difference value between the average voltage value of the VRM positive electrode pin and the average voltage value of the positive electrode pin of the SINK, calculating the pin voltage variation ratio of the SINK based on the ratio of the pin voltage variation of the SINK to the worst voltage drop, or calculating the pin voltage variation ratio of the SINK based on the ratio of the pin voltage variation of the SINK to the average voltage drop;
calculating the planar voltage change duty cycle of the current power-ground network includes: calculating the network plane voltage change duty ratio based on the SINK pin voltage change duty ratio, wherein the network plane voltage change duty ratio is 1-SINK pin voltage change duty ratio.
5. The system for diagnostic positioning of an integrated circuit power supply network of claim 4, wherein the worst voltage drop of the load is defined as the difference of the maximum voltage of the VRM positive pin minus the minimum voltage of the SINK positive pin, the average voltage drop of the load is defined as the difference of the average voltage of the VRM positive pin minus the average voltage of the SINK positive pin, the power supply voltage drop of the power supply network is defined as the difference of the output voltage of the VRM minus the minimum voltage of the power supply network plane, the ground voltage drop of the ground network is defined as the difference of the maximum voltage of the ground network plane minus the minimum voltage of the ground network plane, and the voltage fluctuation of the power supply network is defined as the absolute value of the power supply network voltage drop plus the absolute value of the ground network voltage drop;
The calculating the evaluation index based on the voltage distribution includes: based on voltage distribution, respectively finding out the position of the VRM positive pin corresponding to a power supply network and the position of the SINK positive pin corresponding to a ground network, wherein the voltages at the positions are the voltage of the VRM positive pin and the voltage of the SINK positive pin; the minimum voltage of the power plane is the minimum value of the voltage distribution on the power plane, which is obtained by a finite element method; the highest voltage of the ground network plane is the maximum value of voltage distribution on the ground network plane, which is obtained by a finite element method; the lowest voltage of the ground network plane is the minimum value of voltage distribution on the ground network plane, which is obtained by a finite element method;
based on the voltage distribution, calculate the levelDistribution of areal current densityAnd current density of via->：
In (1) the->For the conductivity of the conductor in which the plane is located, < >>Coordinates of any point on the plane of the plane power supply or ground network, +.>For the voltage distribution obtained by the finite element method, < >>Is a gradient operator;
the current density of the via is obtained from the voltage distribution obtained by the finite element method according to the following equation:
in (1) the->Is->Current density of individual vias, +.>Is->Voltage at the position of the top layer of each via hole, +.>Is->Voltage at the location of the via bottom layer +. >Is->Resistance of individual vias->Is->Cross-sectional area of the individual vias.
6. The system for integrated circuit power supply network diagnostic positioning of claim 4, wherein the plurality of reliability evaluation rules comprises: rule 1: for evaluating whether the voltage of the SINK meets the standard, it is defined as: the calculated worst voltage drop of the load is lower than the worst voltage drop threshold of the load; rule 2: for evaluating whether the voltage of the SINK meets the standard, it is defined as: the calculated average pressure drop of the load is below a threshold value of the average pressure drop of the load; rule 3: a method for evaluating whether a power plane of an integrated circuit power supply system meets a standard, defined as: the calculated power supply voltage of the power supply network is reduced below a threshold value of the power supply voltage drop of the power supply network; rule 4: a network plane for evaluating an integrated circuit power supply system for compliance, defined as: the calculated ground pressure of the ground network is below a threshold value of the ground pressure drop of the ground network; rule 5: the method is used for evaluating whether the power supply system of the integrated circuit meets the standard, and is defined as: the calculated voltage fluctuation of the power supply network is lower than the threshold value of the voltage fluctuation of the power supply network, and the current density of any position of the calculated power supply network is lower than the threshold value of the current density;
The judging whether the current power-ground network in the integrated circuit power supply system meets the standard comprises the following steps: judging whether any rule of the rule 1 and the rule 2 meets the standard, if any rule of the rule 1 and the rule 2 does not meet the standard, judging that the power-ground network in the integrated circuit power supply system does not meet the standard, otherwise, judging that the power-ground network in the integrated circuit power supply system meets the standard.
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