CN116500940A - A domain controller applied to a vehicle and a vehicle - Google Patents

Abstract

The present application provides a domain controller applied to a vehicle and the vehicle. The domain controller includes: a first system-on-chip, a second system-on-chip, and a third system-on-chip; the first system-on-chip is connected to the second system-on-chip through a PCIe bus; the first system-on-chip, the second system-on-chip The chips are respectively connected to the third system-on-chip through the PCIe bus; any one of the first system-on-chip, the second system-on-chip, and the third system-on-chip is used to receive the first system-on-chip, the second system-on-chip level chip and the information transmitted by the other two SoCs in the third SoC, and process the information. The domain controller of the present application can expand the functions that the domain controller can realize without increasing the structural complexity of the domain controller, which not only reduces the complexity of the overall electrical architecture of the vehicle, saves costs, but also improves user experience.

Description

A domain controller applied to a vehicle and a vehicle

technical field

The present application relates to vehicle technology, in particular to a domain controller applied to a vehicle and the vehicle.

Background technique

Under the development trend of vehicle electrification, intelligence and networking, the number of vehicle functions defined by software is increasing, requiring the system to support rapid development and iteration of software.

Due to the continuous increase of vehicle functions, the complexity of automotive electronic control systems has increased rapidly, and the demand for collaborative control and information interaction has also increased significantly.

However, for the various functions in the current vehicle, it is usually realized by a plurality of discrete electronic control units, for example, an independent electronic control unit is used to realize one or more functions, which will lead to changes in the overall electrical structure of the vehicle. It is very complicated, which greatly increases the cost of electrical components and wiring harnesses in the vehicle.

Contents of the invention

The present application provides a domain controller applied to a vehicle and the vehicle, which are used to solve the current problems of complex electrical structure and high cost of the entire vehicle.

In a first aspect, the present application provides a domain controller applied to a vehicle, the domain controller includes a first system-on-chip, a second system-on-chip, and a third system-on-chip; wherein the first system-on-chip It is a system-on-a-chip for realizing the function of the smart cockpit, the second system-on-chip is a system-on-chip for realizing the function of the intelligent driving system, and the third system-on-chip is a system-on-chip for realizing the function of the vehicle gateway SoC; the first SoC is connected to the second SoC through the PCIe bus, and the first SoC and the second SoC are respectively connected to the third SoC through the PCIe bus;

Any one of the first SoC, the second SoC and the third SoC is configured to receive the first SoC, the second SoC and the The information transmitted by the other two SoCs in the third SoC is processed.

In a second aspect, the present application provides a vehicle, the vehicle includes a vehicle body and the domain controller applied to the vehicle according to the first aspect, and the domain controller applied to the vehicle is arranged in the vehicle body.

The domain controller applied to vehicles provided by this application includes a first system-on-chip, a second system-on-chip and a third system-on-chip; wherein, the first system-on-chip is used to realize the smart cockpit Functional system-on-chip, the second system-on-chip is the system-on-chip used to realize the function of the smart driving system, the third system-on-chip is the system-on-chip used to realize the function of the vehicle gateway; the first system-on-chip through PCIe The bus is connected to the second system-on-chip, and the first system-on-chip and the second system-on-chip are respectively connected to the third system-on-chip through the PCIe bus; thus an integrated system with the first system-on-chip, the second system-on-chip and the second system-on-chip is obtained. Three SoC domain controllers. Wherein, any one of the first SoC, the second SoC and the third SoC is used to receive the other two of the first SoC, the second SoC and the third SoC The information transmitted by each SoC and process the information. That is to say, the high-speed interconnection between the first SoC, the second SoC and the third SoC can be realized through the PCIe bus, so that any one of the three SoCs can share the other two SoCs. Chip information, to realize the functions that the system chip does not have originally, so that the functions that the domain controller can realize are expanded without increasing the structural complexity of the domain controller, which not only reduces the overall electrical structure of the vehicle. Complexity, cost savings, and improved user experience.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description serve to explain the principles of the application.

Fig. 1 is a schematic structural diagram of an automobile domain controller in a related art according to an exemplary embodiment;

Fig. 2 is a schematic structural diagram of a domain controller applied to a vehicle according to an exemplary embodiment;

Fig. 3 is a schematic structural diagram of a more specific domain controller applied to a vehicle according to an exemplary embodiment;

Fig. 4 is a data flow diagram showing the converted surround-view mosaic image displayed on the central control display screen according to an exemplary embodiment.

By means of the above drawings, specific embodiments of the present application have been shown, which will be described in more detail hereinafter. These drawings and text descriptions are not intended to limit the scope of the concept of the application in any way, but to illustrate the concept of the application for those skilled in the art by referring to specific embodiments.

Detailed ways

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present application as recited in the appended claims.

First, the nouns involved in this application are explained:

SoC: System-on-Chip, English full name: System on Chip, is an integrated circuit with a dedicated target, which contains a complete system and all the content of embedded software.

With the development of vehicle intelligence, more and more functions are to be realized by the vehicle, which leads to more and more controllers on the vehicle to realize these functions.

However, the current controllers used in vehicles are composed of multiple independent controllers. The increase in the functional requirements of vehicles will lead to a substantial increase in the number of controllers and the amount of network information interaction. The complexity of the system is difficult to control and the bus bandwidth is insufficient. At the same time, software development and iteration speeds are constrained because functions are spread across multiple controllers. Moreover, vehicle controllers need to communicate with each other to realize coordinated control of vehicles. If the number of controllers continues to increase, coordinated control of vehicles will also become very difficult.

Exemplarily, FIG. 1 shows an automobile domain controller in the related art. As shown in FIG. 1 , the automobile domain controller is a non-integrated domain controller, which mainly consists of a The driving domain controller (hereinafter referred to as the smart driving domain controller) and the gateway domain controller are composed of three domain controllers.

However, in this vehicle domain controller, the cockpit domain controller, the smart driving domain controller and the gateway domain controller are three independent products, which are interconnected through various vehicle-mounted buses in the car to meet the transmission requirements of data at different rates. Such as CAN bus, LIN bus, Flexray bus and vehicle Ethernet bus 100Base-T1 or 1000Base-T1. Some special video signal data transmission requires point-to-point input and output module interconnection. And it is prone to duplicate resource allocation, which cannot be shared. For example, each domain controller must have a vehicle body bus module to send and receive vehicle body signal data; another example, the cockpit domain controller and gateway domain controller are equipped with wireless network modules and GPS modules, resulting in repeated configuration of some modules; The configuration of some cameras on the controller and the smart driving domain controller is repeated, and if it is required to be configured on the smart driving domain controller and displayed on the display screen of the cockpit domain controller, an additional point-to-point video transmission module is required for interconnection. . As a result, the overall complexity of the vehicle increases, as well as the cost.

In view of the above problems, the domain controller and the vehicle provided by the present application aim to solve the above technical problems in the prior art.

The technical solution of the present application and how the technical solution of the present application solves the above technical problems will be described in detail below with specific embodiments. The following specific embodiments may be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. Embodiments of the present application will be described below in conjunction with the accompanying drawings.

Fig. 2 shows a domain controller applied to a vehicle according to an exemplary embodiment. As shown in Fig. level chip 13; wherein, the above-mentioned first system-on-chip 11 is a system-on-chip for realizing the function of the smart cockpit, the above-mentioned second system-on-chip 12 is a system-on-chip for realizing the function of the intelligent driving system, and the above-mentioned third The system-on-chip 13 is a system-on-chip for realizing the function of the vehicle-mounted gateway; the above-mentioned first system-on-chip 11 is connected with the second system-on-chip 12 through the PCIe bus, and the above-mentioned first system-on-chip 11 and the above-mentioned second system-on-chip 12 are respectively connected to the third system-on-a-chip 13 through the PCIe bus.

Any one of the above-mentioned first SoC 11, the above-mentioned second SoC 12 and the above-mentioned third SoC 13 is used to receive the first SoC 11, the above-mentioned second SoC 12 and the above-mentioned The information transmitted by the other two SoCs in the third SoC 13 is processed.

Among them, it can be understood that since the first SoC 11 is a SoC for realizing the functions of the smart cockpit, the first SoC 11 is used to connect to the first peripheral circuit corresponding to it, and can be loaded by The corresponding first peripheral circuit device realizes the functions of the smart cockpit. Optionally, the functions of the smart cockpit include but not limited to: car infotainment function, central control screen display, car instrument display, head-up display and other functions. Exemplarily, the first peripheral circuit may include a video output module, an audio module, various display screens connected to the video output module, a speaker connected to the audio module, a microphone, and the like.

Wherein, it can be understood that, since the second SoC 12 is a SoC for realizing the functions of the intelligent driving system, the second SoC 12 is used to connect to the second peripheral circuit corresponding to it, and can pass through Load its corresponding second peripheral circuit device to realize advanced assisted driving functions, including but not limited to full-speed adaptive cruise, automatic parking, automatic lane keeping, active braking, etc. Exemplarily, the second peripheral circuit may include a video input module, a radar processing module, various cameras connected to the video input module for measuring road conditions, various radar detectors connected to the radar processing module, and the like.

Wherein, it can be understood that, since the third system-on-chip 13 is a system-on-chip for realizing the function of the vehicle gateway, the third system-on-chip 13 is used to connect to the third peripheral circuit corresponding to it, and can be loaded by Its corresponding third peripheral circuit device implements the vehicle central gateway function, realizes the information interaction between the vehicle cross-domain controllers 10, realizes the information interaction between the intra-domain controllers and various actuators and sensors, realizes external network access and interconnection, and realizes GPS reception and other functions. Exemplarily, the third peripheral circuit may include various communication modules (such as a 4G communication module, a 5G communication module, etc.), a satellite positioning module, and the like.

Exemplarily, in practical applications, each of the first SoC 11, the second SoC 12 and the third SoC 13 can not only realize its own corresponding function, but also be able to cooperate with the other two The combination of chips realizes the fusion function.

As an example, when the second system-on-a-chip 12 (hereinafter also referred to as the intelligent driving system SoC) obtains the road condition information of the vehicle by loading the second peripheral, on the one hand, the intelligent assisted driving strategy can be determined through the road condition information, and Control the vehicle to drive according to the intelligent assisted driving strategy. Optionally, the road condition information may include 360-degree surround-view images, high-definition images, obstacle information detected by radar, and the like. On the other hand, the intelligent driving system SoC can also transmit the obtained road condition information to the first system-level chip 11 (hereinafter also referred to as the smart cockpit SoC) through the PCIe bus. After the smart cockpit SoC receives the road condition information, it can send the road condition information Process it into a format that can be displayed by the central control panel in the first peripheral circuit, and then display the road condition information through the central control panel in the first peripheral circuit. In this way, the smart cockpit SoC can display the road conditions around the vehicle without connecting additional cameras and radar detectors, so that users can monitor the road conditions around the vehicle in real time.

As another example, for example, when the first system-on-a-chip 11 needs to be upgraded, the third peripheral circuit can be loaded through the third system-on-chip 13 (hereinafter also referred to as vehicle gateway SoC) to obtain the information of the first system-on-chip 11. The required upgrade file, specifically, the vehicle-mounted gateway SoC can receive the upgrade file from the Internet through the communication module in the third peripheral circuit, and then transmit the upgrade file to the first system-on-chip 11 through the PCIe bus, and then the first The SoC 11 is upgraded according to the upgrade file, so that the upgrade file is obtained and the upgrade is completed without connecting the first SoC 11 to an additional communication module. It can be understood that the above-mentioned second SoC 12 can also complete its own upgrade through the above-mentioned manner.

It can be seen that the domain controller 10 of this embodiment includes a first SoC 11, a second SoC 12, and a third SoC 13; wherein, the first SoC 11 is used to realize the functions of the smart cockpit System-on-chip, the second system-on-chip 12 is a system-on-chip for realizing the function of the intelligent driving system, and the third system-on-chip 13 is a system-on-chip for realizing the function of the vehicle-mounted gateway; the first system-on-chip 11 passes The PCIe bus is connected to the second SoC 12, and the first SoC 11 and the second SoC 12 are respectively connected to the third SoC 13 through the PCIe bus; The domain controller 10 of the second SoC 12 and the third SoC 13 . Wherein, any one of the first SoC 11, the second SoC 12 and the third SoC 13 is used to receive the first SoC 11, the second SoC 12 and the third SoC information transmitted by the other two SoCs in the SOC 13, and process the information. That is to say, the high-speed interconnection between the first SoC 11, the second SoC 12 and the third SoC 13 can be realized through the PCIe bus, so that any one of the three SoCs can share the other SoCs. The information of the two system chips is used to realize the functions that the system chip does not have originally, thereby expanding the functions that the domain controller 10 can realize without increasing the structural complexity of the domain controller 10, not only reducing the The complexity of the overall electrical architecture of the vehicle saves costs and improves user experience.

In some embodiments, the above-mentioned controller further includes at least one first module 111 corresponding to the above-mentioned first SoC 11, at least one second module 12 corresponding to the above-mentioned second SoC 12, and the above-mentioned third SoC 13 corresponds to at least one third module 131;

Wherein, the above-mentioned first module 111 is connected with the above-mentioned first SoC 11, the above-mentioned second module 12 is connected with the above-mentioned second SoC 12, and the above-mentioned third module 131 is connected with the above-mentioned third SoC 13; the above-mentioned first The module 111 is connected to the first external device 112 , the second module 12 is connected to the second external device 122 , and the third module 131 is connected to the third external device 132 .

Exemplarily, as shown in FIG. 3 , at least the first module 111 may include a video output module, an audio module, an interface module, etc., and the above-mentioned first SoC 11 may be respectively connected to the video output module, audio module, and interface module. As an example, for example, the first external device 112 may include a central control display screen, a co-pilot display screen, an instrument display screen, and a head-up display screen respectively connected to a video output module, and the first system-on-a-chip 11 may communicate with the video output module and The first external device 112 connected to the video output module implements functions such as video display in the vehicle. For another example, the first external device 112 may also include a microphone array connected to the audio module, a power amplifier speaker, a TUNER antenna, etc., and the first system-on-a-chip 11 may implement the vehicle through the audio module and the first external device 112 connected to the audio module. Audio input and output functions in . For another example, the first external device 112 may also include a USB (Universal Serial Bus, Universal Serial Bus) interface connected to the interface module, and the first SoC 11 may implement data transmission with other external devices through the interface module and the USB interface.

It can be understood that the video output module can perform format conversion and other processing on image data to realize image output, the audio module can perform format conversion and other processing on audio data, and the interface module can perform format conversion and other processing on interface data. , audio module and interface module are commonly used modules in the vehicle field, so they will not be described here.

In practical applications, the first system-on-chip 11, the first module 111, and the first external device 112 can form a smart cockpit system. The smart cockpit system takes the smart cockpit SoC as the core and loads peripheral circuit devices to realize vehicle infotainment functions. and head-up display. Optionally, the first SoC 11 can be ECARX's E04 chip. The E04 chip has high comprehensive computing power, high functional safety and information security performance, and rich peripheral expansion resources, which can fully meet the requirements of the smart cockpit domain. The video output module is mainly a video serialization circuit solution, which can be the mainstream TI FPD-LINK solution and MAXIM GMSL solution on the market, combined with the video deserialization circuit on the display side, to realize the complete transmission and display of video streams. As shown in Figure 3, the DP interface of E04 is output to the video serialization circuit, and then output to the central control display screen after serialization. After deserialization, the video deserialization circuit in the screen converts the video interface required by the output display screen, which can be a DP interface. The eDP interface can also be an OLDI interface, and the display screen displays video content.

Optionally, the central control display in this example can display a maximum capacity of 4K@60fps. The DSI1 interface of E04 is output to the video serialization circuit, and after serialization, it is output to the passenger display screen, which can display a maximum capacity of 2K@60fps. The DSI0 interface of E04 outputs to the video serialization circuit in the form of a super frame, and the video serialization circuit can decompose the super frame into two independent video streams, and output them to the instrument display screen and the HUD head-up display after serialization. Based on the internal hardware isolation scheme of E04, the functional safety ASIL-B requirements of the instrument function can be realized. The audio module is mainly a DSP audio acceleration processing circuit solution and interface circuit to realize the audio input and output functions of the cockpit domain. Specifically, E04 has a total of 7 sets of TDM interfaces, which can realize uplink and downlink data transmission of various audio channels, such as voice collection input by microphone array; The amplifier speakers play the radio sound. The USB interface has a USB2.0 and a USB3.0 interface, both of which can be connected to interconnected devices such as U disks and mobile phones. Audio and video files can be played through the audio module and video output module.

Please refer to FIG. 3 again, at least one second module 12 may include a video input module, a radar processing module, etc., as an example, for example, the second external device 122 may include an AVM camera, a DVR camera, a DMS connected to the video input module, respectively. camera, etc., the second SoC 12 can obtain various image information around the vehicle through the video input module and the second external device 122 connected to the video input module, so as to analyze the road conditions according to various image information to realize the intelligent assistance of the vehicle drive. For another example, the second external device 122 may include a lidar, a millimeter wave radar, etc. connected to a radar processing module. The second system-on-a-chip 12 can obtain radar data around the vehicle through the radar processing module and the second external device 122 connected to the radar processing module, and analyze the shelters and obstacles around the vehicle according to the radar data, so as to realize the intelligent assisted driving. It can be understood that the video input module can perform format conversion and other processing on the image data to realize the input of the image data, and the radar processing module can perform format conversion and other processing on the radar data. The radar processing module and the video input module are commonly used modules in the vehicle field, so they will not be described here.

In practical applications, the second system-on-chip 12, the second module 12, and the second external device 122 can form a smart driving system. The smart driving system takes the self-driving SoC as the core and loads peripheral circuit devices to realize advanced assisted driving functions, including But not limited to full-speed adaptive cruise, automatic parking, automatic lane keeping, active braking, etc.

Optionally, the second system-on-a-chip 12 in this example can use BST’s A1000 chip. A1000 supports seamless access to multiple sensors such as cameras, lidars, and millimeter-wave radars, and has a built-in high-performance computer vision acceleration engine and 4K video codec. The engine can process 1.2Gpps high-dynamic image processing in real time, and can support L2+ automatic driving applications. As shown in the figure, the video input acquisition module receives data from 4 AVM cameras, processed by the acceleration engine of the A1000 chip, and at the same time realizes single camera data output and 360 surround view image splicing output, which can be mainly used in automatic parking and automatic lane keeping Such as L2+ automatic driving applications. At the same time, the processed data is sent to the smart cockpit system through the PCIe bus, and the AVM surround view image can be placed on the cockpit display. Similarly, the DVR camera and DMS camera both borrow the powerful high-dynamic image processing capability of the A1000 autopilot chip, and together with the E04 smart cockpit chip, realize the DVR driving recorder function and the DMS driving monitoring function on the cockpit system. The radar processing module is used to process the data of lidar and millimeter-wave radar to serve the application of automatic driving.

Please refer to FIG. 3 again. At least one third module 131 may include a wireless module, a positioning module, a communication module, a vehicle body bus module, and a vehicle body signal module. As an example, for example, the third external device 132 may include a wireless module. Wireless transmission antenna, optionally, the wireless module may include a BT (Bluetooth) module and a WiFi (Wireless Fidelity) module, and the wireless transmission antenna may include a BT antenna connected to the BT module, and a WiFi antenna connected to the WiFi module. For another example, the third external device 132 may include a positioning antenna connected to the positioning module. Optionally, the positioning module may include a GPS (Global Positioning System) module and/or a Beidou positioning module, and the positioning antenna may include a GPS module connected to the GPS module. Antenna, the Beidou positioning antenna connected to the Beidou positioning module. For another example, the communication module may include a 4G communication module, a 5G communication module, etc., and the third external device 132 may include a 4G antenna connected to the 4G communication module, and a 5G antenna connected to the 5G communication module.

In practical applications, the third system-on-chip 13 , the third module 131 and the third external device 132 can form a vehicle gateway system. The vehicle gateway system takes the vehicle gateway SoC as the core and loads peripheral circuit devices to realize the vehicle central gateway function. Optionally, the third SoC 13 of this example can be the S32G274A chip of NXP. The S32G274A has rich interconnection interfaces and can well perform the vehicle gateway function. As shown in Figure 3, the vehicle body bus module is externally connected to multiple CAN buses, LIN bus, Flexray bus and vehicle Ethernet 1000base-T1/100base-T1 bus through the bus PHY transceiver, which is used to realize the communication between the vehicle cross-domain controllers 10 Information interaction, realize the information interaction between the controller in the domain and each actuator, sensor, etc. The body signal module sends and receives vehicle IO signals, such as ACC key signals, steering wheel button signals, alarm indicator signals, etc., which can be shared by the gateway system, smart cockpit system and smart driving system. The vehicle-mounted gateway SoC chip has a natural advantage in realizing external network access and interconnection. Therefore, the 4G communication module, BT/WIFI module and GPS module traditionally configured in the smart cockpit are all mounted on the S32G274A chip and realized through PCIe bus bridging.

As one embodiment, the above-mentioned at least one second module 12 includes a video input module, the above-mentioned at least one first module 111 includes a video output module, the above-mentioned first external device 112 includes a cockpit display screen, and the above-mentioned second external device 122 includes Surround camera.

The second system-on-a-chip 12 is used to obtain the surround-view image collected by the above-mentioned video input module from the above-mentioned surround-view camera, and after splicing the above-mentioned surround-view image, obtain a surround-view stitching image, and transmit the above-mentioned surround-view stitching image to the above-mentioned first A SoC 11 .

The above-mentioned first system-on-a-chip 11 is used to convert the format of the above-mentioned surround-view stitching image to obtain the converted surround-view stitching image, and transmit the above-mentioned converted surround-view stitching image to the above-mentioned cockpit display screen through the above-mentioned video output module. display, the cockpit display includes at least one of a central control display, a co-pilot display, an instrument display and a head-up display.

Exemplarily, in a practical application, taking the display of the converted surround-view mosaic image on the central control display screen as an example, the above-mentioned first SoC 11 may be an E04 chip, and the above-mentioned second SoC 12 may be an A1000 chip, as shown in Figure 4. Four AVM cameras may be arranged on the vehicle, namely the above-mentioned surround view camera. First, the four AVM cameras can collect video data of the vehicle in four directions to obtain four video data, that is, the above-mentioned surround view image. Then, the above four video data are converted into the format corresponding to the CSI interface through the video input acquisition module (namely the above video input module), and sent to the A1000 chip. The A1000 chip converts these 4 video data into RGB format through its A1000 internal acceleration engine, and stitches a 360-degree surround-view video data (that is, the above-mentioned surround-view stitching image), and then transmits the 360-degree surround-view video data to the E04 chip. The E04 chip can convert the 360-degree surround-view video data into a format corresponding to the DSI interface to obtain the above-mentioned converted surround-view stitching image, and finally drive the central control display through the video output module to display the converted surround-view stitching image.

Optionally, please refer to Figure 4 again. After the A1000 chip converts the 4 video data into RGB format through its A1000 internal acceleration engine, and stitches a 360-degree surround-view video data, the A1000 chip can also convert the 360-degree The surround-view video data is applied to L2+ automatic driving applications such as automatic parking and automatic lane keeping, and the display output video data of the automatic driving application is sent to the E04 chip through the PCIe bus, so that the E04 chip drives the central control display to the The display of the automatic driving application outputs video data for display. Wherein, the display output video data of the automatic driving application may be a simulated image between the vehicle and the surrounding environment during automatic parking or automatic lane keeping.

Compared with the related technology in FIG. 1, in this embodiment, the first SoC 11 multiplexes the four AVM cameras corresponding to the second SoC 12, and reduces the cost of one video output module and one video input module. configuration, thereby reducing the overall complexity and cost of the vehicle. In addition, with the help of the high-performance computer vision acceleration engine and 4K video codec engine of the A1000 chip, it can efficiently process the video data of 4 cameras and stitch together a 360-degree surround view video data. In addition, the A1000 chip is based on 4 camera video data and a 360 surround-view video data spliced at the same time, which is applied to the L2+ level of automatic driving applications, and pushed to the E04 chip to display and output the video data of the automatic driving application, which is convenient for users to drive vehicles. Real-time monitoring of surrounding conditions. In addition, compared to assigning 4 AVM cameras on the side of the E04 chip as the video input module, the original data stream collected by the 4 AVM cameras must first flow from the E04 chip to the A1000 chip, and then flow back to the A1000 chip acceleration engine for processing. For the E04 chip, the complexity of data flow processing will obviously increase. The domain controller 10 in this embodiment can reduce the data processing flow and improve the data processing efficiency.

As an implementation mode, the functions of the above-mentioned smart cockpit system and the above-mentioned smart driving system can be integrated to realize the 360-degree surround view function of the vehicle, the driving recorder function and the driver monitoring function.

As an implementation mode, the functions of the above-mentioned smart cockpit system and the above-mentioned vehicle-mounted gateway system can be integrated to realize the function of interacting with vehicle body information, realizing the functions of cockpit Internet access, OTA upgrade, and the like.

As an implementation mode, the above-mentioned intelligent driving system is integrated with the above-mentioned vehicle gateway system, which can realize the function of interacting with vehicle body information, realize the functions of Internet access of the intelligent driving system, OTA upgrade and other functions.

As an implementation, the above-mentioned at least one second module 12 includes a radar processing module, the above-mentioned at least one first module 111 includes a video output module and an audio module, and the above-mentioned first external device 112 includes a power amplifier speaker and a cockpit display screen, the above-mentioned The second external device 122 includes a radar device.

The second system level chip 12 is used to obtain the radar signal collected by the radar processing module from the radar device, calculate the distance information between the vehicle and the obstacle according to the radar signal, and transmit the distance information to the above-mentioned The first system-on-a-chip 11 ; wherein, the aforementioned radar device includes lidar and/or millimeter wave radar.

The first system-on-a-chip 11 is configured to transmit the distance information to the cockpit display screen for display through the video output module, and/or transmit the distance information to the power amplifier speaker for output through the audio module.

Exemplarily, for example, the radar signal can be the time difference between the radar emission pulse and the echo pulse, and the second system-on-a-chip 12 can be converted into the precise distance of the target according to the propagation of the electromagnetic wave at the speed of light, so as to obtain the distance between the vehicle and the target. distance information between obstacles, and transmit the distance information to the above-mentioned first SoC 11 . The first system-on-a-chip 11, on the one hand, can drive the power amplifier speaker through the audio module to play according to the distance information. The video output module drives the central control display to display the distance between the obstacle and the vehicle.

In this embodiment, multiplexing the radar device corresponding to the second SoC 12 by the first SoC 11 can facilitate the driver to monitor obstacles around the vehicle while reducing the overall cost of the vehicle.

As an implementation manner, the third module 131 includes a communication module, and the third external device 132 includes a communication antenna;

The third SoC 13 is configured to obtain the first upgrade data received by the communication antenna through the communication module, and transmit the first upgrade data to the first SoC 11; the first SoC 11 It is used for performing OTA upgrade based on the above-mentioned first upgrade data.

Exemplarily, the third system chip can detect whether the first upgrade data is issued through the communication module according to a specified cycle, and if so, receive the first upgrade data through the communication module, and then send the first upgrade data to the first system SoC 11, the first SoC 11 can perform OTA upgrade based on the first upgrade data, wherein OTA (over the air technology) upgrade includes FOTA (firmware upgrade over the air) and SOTA (software upgrade over the air).

In this embodiment, the first SoC 11 multiplexes the communication module corresponding to the third SoC 13 to receive the first upgrade data and perform OTA upgrade based on the first upgrade data, avoiding the increase of the first SoC 11. An additional communication module is used to complete the upgrade, which reduces the cost, simplifies the OTA upgrade data flow architecture in the vehicle's smart cockpit system, and facilitates the continuous upgrade and iteration of the first system-level chip 11 .

As an implementation manner, the third module 131 includes a communication module, and the third external device 132 includes a communication antenna;

The third SoC 13 is used to obtain the second upgrade data received by the communication antenna through the communication module, and transmit the second upgrade data to the second SoC 12; the first SoC 11 It is used for performing OTA upgrade based on the above-mentioned second upgrade data.

Wherein, the OTA upgrade method of the second SoC 12 can refer to the above-mentioned OTA upgrade method of the first SoC 11 , so it will not be repeated here.

In this embodiment, the second SoC 12 multiplexes the communication module corresponding to the third SoC 13 to receive the second upgrade data and perform OTA upgrade based on the second upgrade data, avoiding the increase of the second SoC 12. An additional communication module is used to complete the upgrade, which reduces the cost, simplifies the OTA upgrade data flow architecture in the intelligent driving system of the vehicle, and facilitates the continuous upgrade and iteration of the second system-level chip 12 .

In some embodiments, the above-mentioned third SoC 13 is also connected to the above-mentioned first SoC 11 through the RGMII bus, the above-mentioned at least one first module 111 includes a video output module and an audio module, and the above-mentioned first external device 112 includes a power amplifier speaker and cockpit display, the at least one third module 131 includes a vehicle body signal module, and the third external device 132 includes a vehicle body signal sensor,

The third system-on-chip 13 is configured to receive the vehicle body signal collected by the vehicle body signal sensor through the vehicle body signal module, and transmit the vehicle body signal to the first system-on-chip 11 through the RGMII bus, wherein the vehicle body signal includes the vehicle body signal At least one of the key door switch signal, the steering wheel button signal and the alarm indicator signal.

The first system-on-a-chip 11 is used to transmit the above-mentioned vehicle body signal to the cockpit display screen for display through the above-mentioned video output module, and/or transmit the above-mentioned vehicle body signal to the above-mentioned power amplifier speaker for output through the above-mentioned audio module.

Exemplarily, the third SoC 13 can receive the vehicle body signal collected by the vehicle body signal sensor through the vehicle body signal module in real time, and after receiving the vehicle body signal, can transmit the vehicle body signal to the first SoC 11 through the RGMII bus, and the first The system-on-a-chip 11 can output the vehicle body signal through its corresponding various display screens and/or power amplifier speakers, so as to remind the user of the vehicle body condition in real time.

In this embodiment, the first SoC 11 multiplexes the vehicle body signal sensor corresponding to the third SoC 13, so that the first SoC 11 does not need to connect an additional vehicle body signal sensor to realize the vehicle body signal sensor. output so that users can check and monitor the condition of the vehicle body, which reduces the cost of the vehicle and improves the user experience.

As an implementation, the third SoC 13 is also connected to the second SoC 12 through the RGMII bus, the second module 12 includes a brake module, and the second external device 122 includes a brake;

The third system-on-chip 13 is also used to receive the vehicle body signal collected by the vehicle body signal sensor through the vehicle body signal module, and transmit the vehicle body signal to the second system-on-chip 12 through the RGMII bus. Wherein, the vehicle body signal sensor can be connected with the vehicle body signal module through the I/O signal module.

The second system-on-a-chip 12 is configured to drive the brake to perform a braking action through the braking module when it is determined that the warning indicator signal in the vehicle body signal indicates that the warning indicator light is on.

Exemplarily, the third SoC 13 can receive the vehicle body signal collected by the vehicle body signal sensor through the vehicle body signal module in real time, and after receiving the vehicle body signal, can transmit the vehicle body signal to the second system level chip 12 through the RGMII bus, and the second The system-on-a-chip 12 can determine whether the warning light signal indicates that the warning light is on. When it is determined that the alarm indicator signal in the vehicle body signal indicates that the alarm indicator light is on, the brake module is used to drive the brake to perform a braking action, so that the vehicle decelerates or stops, and automatically avoids dangerous situations.

In this embodiment, the second system-on-chip 12 multiplexes the vehicle body signal sensor corresponding to the third system-on-chip 13 , so that the second system-on-chip 12 can be implemented according to the vehicle body signal sensor without externally connecting an additional vehicle body signal sensor. The intelligent driving of the vehicle reduces the overall complexity of the vehicle and the cost of the vehicle.

In some embodiments, the at least one third module 131 further includes a vehicle body bus module, and the third external device 132 further includes at least one of a CAN bus, a LIN bus, a FlexRay bus and an ETH bus.

Exemplarily, please refer to FIG. 3 again, the body bus module can be respectively connected with the CAN bus, the LIN bus, the FlexRay bus and the ETH bus, and the body bus module can also be connected with the third SoC 13 . It can be understood that the vehicle body bus module is used to manage the data of various buses in the vehicle, and is a common module in the vehicle, so it will not be repeated here.

To sum up, the domain controller 10 applied to vehicles provided by this embodiment integrates the functions of the peripheral components of the first SoC 11, the second SoC 12, and the third SoC 13, reducing the corresponding ECU control Devices, cameras, etc., directly reduce costs. A domain controller 10 is used to undertake the work of multiple ECU units, thereby reducing the complexity of the system, improving the quality of the system platform and the consistent perception of user experience. Multiple SoCs in the domain controller 10 form system-level multi-core heterogeneity through the high-speed interconnection bus PCIe, which guarantees the realization of functional integration, rather than simply installing multiple systems in one controller. It supports the realization of software-defined cars to the greatest extent, ensuring that the cockpit and travel modules in the car can be continuously upgraded and iterated with the help of FOTA (firmware upgrade over the air) and SOTA (software upgrade over the air).

In some embodiments, a vehicle is further provided. The vehicle includes a vehicle body and the domain controller applied to the vehicle in any one of the above embodiments, wherein the domain controller applied to the vehicle is set in the vehicle body.

Other embodiments of the present application will be readily apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the application, these modifications, uses or adaptations follow the general principles of the application and include common knowledge or conventional technical means in the technical field not disclosed in the application . The specification and examples are to be considered exemplary only, with a true scope and spirit of the application indicated by the following claims.

It should be understood that the present application is not limited to the precise constructions which have been described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims (10)

1. A domain controller for a vehicle, the domain controller comprising a first system-on-chip, a second system-on-chip, and a third system-on-chip; the first system-level chip is a system-level chip for realizing the function of the intelligent cabin, the second system-level chip is a system-level chip for realizing the function of the intelligent driving system, and the third system-level chip is a system-level chip for realizing the function of the vehicle-mounted gateway; the first system-level chip is connected with the second system-level chip through a PCIe bus, and the first system-level chip and the second system-level chip are respectively connected with the third system-level chip through the PCIe bus;

Any one of the first system-level chip, the second system-level chip and the third system-level chip is used for receiving information transmitted by the other two of the first system-level chip, the second system-level chip and the third system-level chip and processing the information.

2. The domain controller of claim 1, wherein the controller further comprises at least one first module corresponding to the first system-on-chip, at least one second module corresponding to the second system-on-chip, and at least one third module corresponding to the third system-on-chip;

the first module is connected with the first system-level chip, the second module is connected with the second system-level chip, and the third module is connected with the third system-level chip; the first module is connected with first external equipment, the second module is connected with second external equipment, and the third module is connected with third external equipment.

3. The domain controller of claim 2, wherein the at least one second module comprises a video input module, the at least one first module comprises a video output module, the first external device comprises a cockpit display, and the second external device comprises a pan around camera;

The second system-in-chip is used for acquiring the looking-around image acquired by the video input module from the looking-around camera, performing stitching processing on the looking-around image to obtain a looking-around stitching image, and transmitting the looking-around stitching image to the first system-in-chip;

the first system-in-chip is used for obtaining a converted all-around spliced image after format conversion processing is carried out on the all-around spliced image, the converted all-around spliced image is transmitted to the cabin display screen for display through the video output module, and the cabin display screen comprises at least one of a central control display screen, a secondary driving display screen, an instrument display screen and a head-up display screen.

4. The domain controller of claim 2, wherein the at least one second module comprises a radar processing module, the at least one first module comprises a video output module and an audio module, the first external device comprises a power amplifier speaker and a cockpit display, and the second external device comprises a radar device;

the second system-in-chip is used for acquiring radar signals acquired by the radar processing module from the radar equipment, calculating distance information between the vehicle and the obstacle according to the radar signals, and transmitting the distance information to the first system-in-chip; wherein the radar apparatus comprises a lidar and/or a millimeter wave radar;

The first system-in-chip is used for transmitting the distance information to a cabin display screen for display through the video output module and/or transmitting the distance information to the power amplifier loudspeaker for output through the audio module.

5. The domain controller of claim 2, wherein the third module comprises a communication module and the third external device comprises a communication antenna;

the third system-on-chip is configured to obtain, through the communication module, first upgrade data received by the communication antenna, and transmit the first upgrade data to the first system-on-chip;

the first system-on-chip is used for performing OTA upgrade based on the first upgrade data.

6. The domain controller of claim 2, wherein the third module comprises a communication module and the third external device comprises a communication antenna;

the third system-in-chip is configured to obtain, by using the communication module, second upgrade data received by the communication antenna, and transmit the second upgrade data to the second system-in-chip;

the first system-on-chip is used for carrying out OTA upgrading based on the second upgrading data.

7. The domain controller of any of claims 2-6, wherein the third system-on-chip is further coupled to the first system-on-chip via an RGMII bus, wherein the at least one first module comprises a video output module and an audio module, wherein the first external device comprises a power amplifier speaker and a cockpit display, wherein the at least one third module comprises a body signal module, wherein the third external device comprises a body signal sensor,

the third system-level chip is used for receiving a vehicle body signal acquired by a vehicle body signal sensor through the vehicle body signal module and transmitting the vehicle body signal to the first system-level chip through an RGMII bus, wherein the vehicle body signal comprises at least one of a key door switch signal, a steering wheel key signal and an alarm indicator signal of the vehicle;

the first system-in-chip is used for transmitting the vehicle body signal to a cabin display screen for display through the video output module and/or transmitting the vehicle body signal to the power amplifier loudspeaker for output through the audio module.

8. The domain controller of claim 7, wherein the third system-on-chip is further connected to the second system-on-chip via an RGMII bus, the second module comprising a brake module, the second external device comprising a brake;

The third system-in-chip is further used for receiving the vehicle body signals acquired by the vehicle body signal sensor through the vehicle body signal module and transmitting the vehicle body signals to the second system-in-chip through the RGMII bus respectively;

and the second system-in-chip is used for driving the brake to execute braking action through the braking module when the alarm indicator lamp signal in the vehicle body signal is determined to represent that the alarm indicator lamp is on.

9. The domain controller of any of claims 2 to 6, wherein the at least one third module further comprises a body bus module, and the third external device further comprises at least one of a CAN bus, a LIN bus, a FlexRay bus, and an ETH bus.

10. A vehicle comprising a vehicle body and the domain controller for vehicle according to any one of claims 1 to 9, the domain controller for vehicle being provided in the vehicle body.