CN116528516A - Manufacturing method of depth-controlled milling product for designated layer - Google Patents

Abstract

The invention belongs to the technical field of electronic communication, in particular to a method for manufacturing a designated layer depth-controlling milling product, which comprises the steps of silk-screen printing a layer of printing ink on the edge of a depth-controlling milling area of a designated layer depth-controlling milling on a plate, performing post curing after development, then attaching a non-glue PI film and rapidly pressing, removing the PI film of a non-depth-controlling milling area by UV cutting, performing depth-controlling milling along the edge of the depth-controlling milling area of two layers of plates after pressing, reserving a dielectric layer thickness of 4+/-2 mil in the residual thickness of the depth-controlling milling, and finally using laser to beat off the residual dielectric layer at the bottom of a depth-controlling groove, and performing processing by beating the PI film. According to the invention, the process is not required to be just milled to the target level, only the edge of the depth-controlled milling area is required to be subjected to depth-controlled milling, the middle part is not required to be subjected to depth-controlled milling, and the production time during large-area depth-controlled milling is shortened, so that the target layer can be ensured not to be damaged by milling, the requirement on equipment precision is low, the production is facilitated, and meanwhile, the method can be used for replacing the sandwich process in the current mobile phone design, reducing the assembly flow and improving the assembly alignment degree.

Description

A manufacturing method of specified layer-controlled deep milling products

technical field

The invention relates to the technical field of electronic communication, in particular to a method for manufacturing specified layer-controlled deep milling products.

Background technique

Since the conventional single-layer motherboard of mobile phones is difficult to meet the complex functional modules and shape design of 5G, it is necessary to expand the layout space in the vertical direction. Therefore, the "sandwich" process is used for production.

In the process of the existing "sandwich" process, it is necessary to combine three PCB boards together. During the processing of this process, it is necessary to carry out specified layer-controlled deep milling on the PCB board. Through fixed-depth milling, it is just milled to a specific layer. The process requires high equipment precision. It is almost impossible to ensure that the specific layer is milled exactly, which will damage the specific target layer, and the copper surface of the target layer will have residual glue that is difficult to remove, resulting in difficult processing and high cost.

Contents of the invention

(1) Solved technical problems

Aiming at the deficiencies of the prior art, the present invention provides a production method of specified layer-controlled deep-milling products. Silk-screen ink is printed at the specified layer-controlled deep-milling place, and the ink is slightly viscous to stick to the non-adhesive PI film, and then UV cuts. The area that does not need PI film protection is removed, and then pressed, and the outer layer is burned to the designated layer through machine-controlled deep milling + laser, and the waste in the controlled deep-milling area will fall off automatically after laser control. The controlled deep-milling has high precision and does not damage copper. And there is no glue residue, which shortens the production time of large-area controlled deep-milling. Only the edge of the controlled deep-milling area needs to be controlled deep-milled, and the middle part does not need controlled deep-milling. The residual glue on the copper surface is difficult to deal with, resulting in difficult processing and high cost.

(2) Technical solutions

The present invention specifically adopts the following technical solutions in order to achieve the above object:

A method for manufacturing specified layer-controlled deep milling products, comprising the following steps:

S1. Set the circuit on the plate, and print a layer of ink on the edge of the specified layer control deep milling area of the control depth milling, and do not post-cure after development;

S2. After the specified layer of screen printing ink is controlled for deep milling, paste the glue-free PI film on the whole board, and perform fast pressing. After the fast pressing, use UV cutting to remove the PI film in the non-controlled deep-milling area, and leave the PI film in the controlled deep-milling area. Then do the pressing process to press the two layers of plates together;

S3. Perform controlled depth milling along the edge of the controlled depth milling area of the laminated two-layer board, and reserve a thickness of 4±2mil for the residual thickness of the controlled depth milling. Controlled depth milling can be done along the edge of the controlled depth milling area, which can ensure that the target layer will not be milled, and does not require high equipment accuracy, which is conducive to production, avoids the difficulty of milling to a specific layer, and requires high equipment accuracy. And it takes a long time to control the deep milling production in the whole area;

S4. Use a laser to remove the remaining interlayer at the bottom of the depth-controlled groove, and then pat the board surface, the PI film will automatically fall off from the copper surface, and complete the specified layer-controlled deep milling process. This method can remove the remaining interlayer and The ink printed before the bottom is removed. This method will not damage the bottom copper, and there is no residual glue. The other parts of the depth control milling area are pasted with a non-adhesive PI film on the bottom. The PI film and the copper surface are bonded without glue, and the laser After burning off the ink on the edge, the PI film in the waste area in the middle of the controlled depth milling will not stick to the copper surface, and it will fall off automatically as long as you tap the board surface after the laser.

Further, the screen printing ink is developed with a developing solution.

Further, the UV cutting PI film step is as follows:

First, use the vacuum adsorption table for vacuum adsorption and fixation, and use the positioning system of the vacuum adsorption table for precise positioning;

Secondly, the laser pulse energy density is adjusted, the laser pulse is generated by the all-solid-state ultraviolet laser, and the laser pulse is transformed and adjusted by the beam conversion system, and then the energy density adjustment of the laser pulse is realized, and the processed laser pulse is obtained;

Finally, laser pulse scanning, according to the size of the processing, set the scanning path information, the processing laser pulse obtained by the galvanometer scanning system scans and cuts the PI film to be processed according to the preset scanning path, and obtains the PI cover film cutting artifact.

(3) Beneficial effects

Compared with the prior art, the present invention provides a method for manufacturing specified layer-controlled deep milling products, which has the following beneficial effects:

In the present invention, the ink is slightly viscous to stick to the non-adhesive PI film at the specified layer-controlled deep milling place, and then UV cuts to remove the area that does not need the protection of the PI film, and then presses it, and the outer layer passes through the gong Machine-controlled deep milling + laser burning to the specified layer, the waste in the controlled deep-milling area will automatically fall off after the laser, this process does not need to be milled exactly to the target layer, just do controlled deep-milling along the edge of the controlled deep-milling area, the middle part does not need Controlled depth milling can shorten the production time of large-area controlled depth milling, which can ensure that the target layer will not be milled, and does not require high equipment accuracy, which is conducive to production. At the same time, it can be used to replace the sandwich process in the current mobile phone design. The original process requires three PCB boards to be combined together. After adopting this process, only two PCB boards are required, which can reduce the assembly process and improve assembly alignment.

Description of drawings

Fig. 1 is a process flow diagram of the present invention.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Example

As shown in Figure 1, an embodiment of the present invention proposes: a method for manufacturing specified layer-controlled deep milling products, including the following steps:

S1. Set the circuit on the plate, and print a layer of ink on the edge of the specified layer control deep milling area of the control depth milling, and do not post-cure after development;

S2. After the specified layer of screen printing ink is controlled for deep milling, paste the glue-free PI film on the whole board, and perform fast pressing. After the fast pressing, use UV cutting to remove the PI film in the non-controlled deep-milling area, and leave the PI film in the controlled deep-milling area. Then do the pressing process to press the two layers of plates together;

S3. Perform controlled depth milling along the edge of the controlled depth milling area of the laminated two-layer board, and reserve a thickness of 4±2mil for the residual thickness of the controlled depth milling. Controlled depth milling can be done along the edge of the controlled depth milling area, and the middle part does not need controlled depth milling, which shortens the production time of large-area controlled depth milling, which can ensure that the target layer will not be milled, and does not require high equipment accuracy, which is beneficial Production, avoiding the difficulty of milling to a specific layer, high requirements for equipment accuracy, and the long time-consuming production of controlled deep milling in the entire area;

S4. Use a laser to remove the remaining interlayer at the bottom of the depth-controlled groove, and then pat the board surface, the PI film will automatically fall off from the copper surface, and complete the specified layer-controlled deep milling process. This method can remove the remaining interlayer and The ink printed before the bottom is removed. This method will not damage the bottom copper, and there is no residual glue. The other parts of the depth control milling area are pasted with a non-adhesive PI film on the bottom. The PI film and the copper surface are bonded without glue, and the laser After burning off the ink on the edge, the PI film and the copper surface in the waste area in the middle of the deep-controlled milling will not be bonded. After the laser, just tap the board surface and it will automatically fall off. It can be used to replace the sandwich process in the current mobile phone design. , The original process requires three PCB boards to be combined together. After adopting this process, only two PCB boards are required, which can reduce the assembly process and improve the assembly alignment.

Among them, the screen printing ink is developed with a developer, and the ink is slightly viscous to stick to the non-adhesive PI film, so that it can be pasted on the board, which is convenient for subsequent UV cutting, and the area that does not need the protection of the PI film can be removed.

Among them, the steps of UV cutting PI film are as follows:

First, use the vacuum adsorption table for vacuum adsorption and fixation, and use the positioning system of the vacuum adsorption table for precise positioning;

Secondly, the laser pulse energy density is adjusted, the laser pulse is generated by the all-solid-state ultraviolet laser, and the laser pulse is transformed and adjusted by the beam conversion system, and then the energy density adjustment of the laser pulse is realized, and the processed laser pulse is obtained;

Finally, laser pulse scanning, according to the size of the processing, set the scanning path information, the processing laser pulse obtained by the galvanometer scanning system scans and cuts the PI film to be processed according to the preset scanning path, and obtains the PI cover film cutting workpiece;

The laser pulse energy density parameter of laser cutting is preferably 10-12w, and the laser pulse scanning speed parameter is preferably 300-500mm/s.

Finally, it should be noted that: the above is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it still The technical solutions recorded in the foregoing embodiments may be modified, or some technical features thereof may be equivalently replaced. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (3)

1. The manufacturing method of the depth-controlled milling product of the designated layer is characterized by comprising the following steps of:

s1, setting a circuit on a plate, silk-screen printing a layer of ink on the edge of a depth-control milling area of a depth-control milling designated layer, and performing development without post-curing;

s2, attaching a glue-free PI film to the whole plate after silk-screen printing ink on the depth-controlled milling appointed layer, performing quick pressing, cutting by using UV after quick pressing, removing the PI film in the non-depth-controlled milling area, leaving the PI film in the depth-controlled milling area, and performing a pressing process to press the two plates together;

s3, performing depth control milling along the edge of the depth control milling area of the two layers of pressed plates, wherein the depth control milling residual thickness is reserved for 4+/-2 mil of dielectric layer thickness;

s4, removing the residual dielectric layer at the bottom of the deep control groove by using laser, then tapping the plate surface, and automatically removing the PI film from the copper surface to finish the deep control milling of the appointed layer.

2. The method for manufacturing the depth-controlled milling product of the designated layer according to claim 1, wherein the method comprises the following steps: the silk-screen printing ink is developed by adopting a developing solution.

3. The method for manufacturing the depth-controlled milling product of the designated layer according to claim 1, wherein the method comprises the following steps: the UV cut PI film steps are as follows:

firstly, vacuum adsorption fixing is carried out by utilizing a vacuum adsorption table, and accurate positioning is carried out by a positioning system of the vacuum adsorption table;

secondly, adjusting the energy density of laser pulse, generating laser pulse by an all-solid-state ultraviolet laser, and performing conversion adjustment on the laser pulse by a beam conversion system, thereby realizing the energy density adjustment of the laser pulse and obtaining processing laser pulse;

and finally, scanning laser pulse, setting scanning path information according to the machining size, and scanning and cutting the PI film to be machined by using the machining laser pulse obtained through the galvanometer scanning system according to a preset scanning path to obtain a PI cover film cut workpiece.