CN116737488B - Parameter monitoring method and electronic equipment - Google Patents

Abstract

The application provides a parameter monitoring method and electronic equipment, which are applied to the electronic equipment, wherein the electronic equipment comprises a first graphic processor and a second graphic processor, and the electronic equipment is provided with a first application, and the method comprises the following steps: starting a first application at a first time point, wherein the first graphic processor is in a working state and the second graphic processor is in a sleep state at the first time point; after the first application is started, a first temperature value is obtained through the first application; displaying the first temperature value at a first interface of the first application at a second point in time, the first temperature value representing a temperature of the second graphics processor; wherein the second graphics processor is in a sleep state between the first point in time and a second point in time. According to the embodiment of the application, the temperature of the independent display card can be obtained when the independent display card sleeps, and the independent display card does not need to be awakened, so that the power consumption of the equipment is reduced.

Description

Parameter monitoring method and electronic equipment

Technical Field

The present application relates to the technical field of intelligent terminals, and in particular to a parameter monitoring method and electronic equipment.

Background technique

With the continuous development of electronic technology, electronic devices such as laptops have been widely developed as common devices in people's daily life and work. There are various configurations of laptops on the market. For example, many laptops are equipped with independent graphics cards to provide higher performance. The increase of independent graphics cards generally means an increase in device power consumption, and given the mobile nature of laptops, battery life has always been the focus of users. For notebooks equipped with independent graphics cards, in order to improve their battery life, the power of the independent graphics card will be turned off when the laptop is not running 3D programs (such as games), thereby reducing the power consumption of the device and improving battery life. However, even with this strategy, the battery life of the laptop in actual use by users is also far from the battery life in laboratory tests, which affects the user experience.

Summary of the invention

In order to solve the above technical problems, the present application provides a parameter monitoring method and an electronic device. In the parameter monitoring method, when the second graphics processor is asleep, the temperature of the second graphics processor is obtained through a first application without waking up the second graphics processor, thereby reducing the power consumption of the device and avoiding the increase of the power consumption of the device due to frequent waking up of the second graphics processor.

In a first aspect, the present application provides a parameter monitoring method, which is applied to an electronic device, wherein the electronic device includes a first graphics processor and a second graphics processor, and the electronic device is installed with a first application, and the method includes:

At a first time point, starting a first application, at the first time point, the first graphics processor is in a working state, and the second graphics processor is in a sleeping state;

After starting the first application, obtaining a first temperature value through the first application, where the first temperature value is a temperature outside the second graphics processor;

At a second time point, displaying the first temperature value on a first interface of the first application, the first temperature value indicating the temperature of the second graphics processor;

The second graphics processor is in a sleep state between the first time point and the second time point.

According to the first aspect, the parameter monitoring method of the present application obtains the temperature of the second graphics processor through the first application when the second graphics processor is asleep, without waking up the second graphics processor, thereby reducing the power consumption of the device and avoiding increased power consumption of the device due to frequent waking up of the second graphics processor.

According to the first aspect, or any implementation of the first aspect above, the electronic device is installed with a second application, and the method further includes:

At a third time point, starting a second application, at which the first graphics processor is in a working state and the second graphics processor is in a sleeping state;

After starting the second application, obtaining a second temperature value through the second application, where the second temperature value is an internal temperature or a core temperature of the second graphics processor;

At a fourth time point, displaying the second temperature value on the second interface of the second application, where the second temperature value indicates the temperature of the second graphics processor;

The second graphics processor is awakened between the third time point and the fourth time point, and the awakening of the second graphics processor indicates that the second graphics processor switches from a sleep state to a working state. The second application obtains the internal temperature of the second graphics processor, which will awaken the second graphics processor.

According to the first aspect, or any implementation of the first aspect above, at a fifth time point, the voltage of the second graphics processor is a first voltage value, the current of the second graphics processor is a first current value, and the fifth time is between the first time point and the second time;

At the sixth time, the voltage of the second graphics processor is the second voltage value, the current of the second graphics processor is the second current value, and the sixth time point is between the third time point and the fourth time point, the second voltage value is greater than the first voltage value, and/or the second current value is greater than the first current. That is, the power consumption of the second graphics processor after being awakened is greater than the power consumption when it is asleep. Therefore, when the second graphics processor is asleep, the temperature of the second graphics processor can be obtained without waking up the second graphics processor, which can reduce the power consumption of the device and avoid the increase of the power consumption of the device due to frequent waking up of the second graphics processor.

According to the first aspect, or any implementation of the first aspect above, the electronic device is installed with a third application, and the method further includes:

Before the first time point, a third application is started, the second graphics processor is in a working state, the voltage of the second graphics processor is a third voltage value, and the current of the second graphics processor is a third current value;

Closing the third application, and switching the second graphics processor to a sleep state;

Among them, the third voltage value is greater than the first voltage value, and/or the third current value is greater than the first current value. That is, the power consumption of the second graphics processor when working is greater than the power consumption when sleeping. Therefore, when the second graphics processor is sleeping, the temperature of the second graphics processor can be obtained without waking up the second graphics processor, which can reduce the power consumption of the device and avoid frequent waking up of the second graphics processor to increase the power consumption of the device.

According to the first aspect, or any implementation of the first aspect above, the electronic device includes a first internal memory and an SMBIOS table, and the obtaining the first temperature value through the first application includes:

The first application reads the SMBIOS table and obtains target address information from the SMBIOS table, wherein the target address information represents address information of a target storage area pre-allocated in the first internal memory;

The first application determines the location of the target storage area pre-allocated in the first internal memory according to the target address information, and reads the first temperature value from the target storage area.

By reading the first temperature value from the pre-allocated memory, it can be ensured that the temperature reading process does not bring security risks to other components of the device.

According to the first aspect, or any implementation of the first aspect above, the electronic device further includes a controller, a first temperature sensor, and a BIOS, and before reading the first temperature value from the target memory area, obtaining the first temperature value through the first application further includes:

The controller obtains the first temperature value through the first temperature sensor, and transmits the first temperature value to the BIOS;

The BIOS writes the first temperature value into the pre-allocated target storage area in the first internal memory. The first temperature value is obtained through the controller and the first temperature sensor, and the first temperature value is written into the pre-allocated memory for the first corresponding device to read, so that when the second graphics processor is asleep, the temperature of the second graphics processor can be obtained without waking up the second graphics processor, which can reduce the power consumption of the device and avoid the increase of the power consumption of the device due to frequent waking up of the second graphics processor.

According to the first aspect, or any implementation of the first aspect above, the electronic device further includes a BIOS, and before reading the SMBIOS table, the method further includes:

The BIOS is started, and during the BIOS startup process:

pre-allocating the target storage area in the first internal memory for storing the first parameter;

The SMBIOS table is created, and the target address information of the target storage area is written into the SMBIOS table.

By pre-allocating memory to store the first temperature value, the first application temperature reading process does not bring security risks to other components of the device.

According to the first aspect, or any implementation of the first aspect above, during the BIOS startup process, the method further includes:

The attribute of the target storage area is set to ACPI_NVS.

Setting the target storage area attribute to ACPI_NVS can ensure that the target storage area will not be occupied by the operating system and is only used to store the first temperature value.

According to the first aspect, or any implementation of the first aspect, the size of the pre-allocated storage area for storing the device parameters is 2-10K.

In a second aspect, an electronic device is provided, comprising: a memory and a processor, the memory and the processor being coupled; the memory storing program instructions, the program instructions when executed by the processor, causing the electronic device to execute the parameter monitoring method in the first aspect or any possible implementation of the first aspect. The technical effects corresponding to the second aspect and any implementation of the second aspect can refer to the technical effects corresponding to the above-mentioned first aspect and any implementation of the first aspect, which will not be repeated here.

In a third aspect, the present application provides a computer-readable medium for storing a computer program, wherein the computer program includes instructions for executing the method in the first aspect or any possible implementation of the first aspect.

In a fourth aspect, the present application provides a computer program, comprising instructions for executing the method in the first aspect or any possible implementation of the first aspect.

In a fifth aspect, the present application provides a chip, the chip comprising a processing circuit and a transceiver pin, wherein the transceiver pin and the processing circuit communicate with each other through an internal connection path, and the processing circuit executes the method in the first aspect or any possible implementation of the first aspect to control the receiving pin to receive a signal and control the sending pin to send a signal.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram showing an exemplary module interaction of a current temperature monitoring method;

FIG2 is a schematic diagram showing a hardware structure of an electronic device;

FIG3 is a schematic diagram showing an exemplary arrangement of temperature sensors of an electronic device;

FIG4 is a schematic diagram showing an exemplary software structure of an electronic device;

FIG5 is one of the schematic diagrams of module interactions for executing the parameter monitoring method;

FIG6 is a schematic diagram of a first interface of a first application shown as an example;

FIG. 7 is one of the schematic diagrams of module interactions for executing the parameter monitoring method;

FIG8 is a schematic diagram of a second interface of a second application shown as an example;

FIG9 is an exemplary flowchart for pre-allocating memory;

FIG. 10 shows a schematic block diagram of a device according to an embodiment of the present application.

Detailed ways

The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

The term "and/or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and/or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

The terms "first" and "second" in the description and claims of the embodiments of the present application are used to distinguish different objects rather than to describe a specific order of objects. For example, a first target object and a second target object are used to distinguish different target objects rather than to describe a specific order of target objects.

In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" refers to two or more than two. For example, multiple processing units refer to two or more processing units; multiple systems refer to two or more systems.

In order to make the description of the following embodiments clear and concise, a brief introduction to related concepts or technologies is first given:

Mainboard BIOS: Basic Input Output System. Mainboard BIOS is a set of programs that are fixed to a ROM chip or on the motherboard of the computer. It stores the most important basic input and output programs of the computer, system setting information, power-on self-test program and system boot program. The main function of BIOS is to provide the lowest-level and most direct hardware settings and control for the computer. The interfaces provided by the mainboard BIOS to the operating system include BS (Boot Services) and RT (Runtime Services).

UEFI: Unified Extensible Firmware Interface, a personal computer system specification that defines the software interface between the operating system and the system firmware as an alternative to BIOS. The Extensible Firmware Interface is responsible for the power-on self-test (POST), contacting the operating system, and providing an interface between the operating system and the hardware. The interfaces provided by UEFI to the operating system include BS (Boot Services) and RT (Runtime Services). UEFI drivers and services are provided to the operating system through BS in the form of Protocol. Boot services are the core data structure of UEFI and can be divided into the following categories: UEFI event services, memory management services, Protocol management services, Protocol usage services, driver management services, Image management services, ExitBootServices, and other services. Memory management services mainly provide memory allocation and release services and manage system memory mapping. Mainly include: AllocatePages, FreePages, AllocatePool, FreePool, GetMemoryMap.

SMBIOS: SMBIOS (System Management BIOS) is a set of structured tables about system information collected by BIOS/UEFI when initializing the system, and stored in memory for use by the operating system. If it is a non-UEFI system, you can find the EPS (Entry Point structure) of SMBIOS by searching for the anchor-string (_SM_) in the physical memory address range 000F0000h to 000FFFFFh. If it is a UEFI-based system, you can directly search for the GUID to find it (SMBIOS_TABLE_GUID, {EB9D2D31-2D88-11D3-9A16-0090273FC14D}). SMBIOSTable is composed of many SMBIOS structures (subtables). Each SMBIOS structure has a formatted part and an optional unformatted part. The formatted part of each structure starts with a 4-byte header. The remaining data in the formatted part is determined by the structure type, as is the total length of the formatted part. Different types of SMBIOS subtables are distinguished by the type value. For example, BIOS information (Type 0), system information (Type 1), system periphery or chassis (Type 3), processor information (Type 4), cache information (Type 7), system slots (Type 9), physical storage arrays (Type 16), storage devices (Type 17), and temperature sensors (Type 28).

NVAPI: NVAPI is an interface provided by NVIDIA for third-party calls to monitor the temperature, performance parameters, etc. of graphics cards.

ACPI: Advanced Configuration and Power Interface, which defines a new working interface between the computer operating system and BIOS (basic input output system) and computer hardware. ACPI defines four device power supply states from D0 to D3, where D0: the device is working normally; D1: some power consumption can be reduced, which is determined by the device itself, and some devices do not have the D1 state; D2: the device turns off some functions to save more power, which is determined by the device itself, and some devices do not have the D2 state; D3: the device power is completely turned off, and the device needs to be repowered and initialized to work again.

ACPI NVS: Indicates that it is mapped to the non-volatile storage space used to store ACPI data and cannot be used by the operating system.

SCI: System Control Interrupt, system control interrupt. An IRQ (interrupt request) specifically used for ACPI power management, which requires OS (operating system) support.

SMI: System Management Interrupt, a special interrupt used by the system to enter SMM (System Management Mode).

SMM: System Management Mode is a standard architecture feature that is unified for all Intel processors. System Management Mode (SMM) provides the same execution environment as the System Management Interrupt (SMI) handler in the traditional IA-32 architecture.

Address information: used to indicate the location information of the pre-applied memory. The CPU/program can obtain the specific location of the pre-applied memory through the address information, and store parameters such as GPU temperature, CPU temperature, motherboard temperature, fan speed, etc. in the memory. There are many ways to indicate the address information. The address information can be the starting position and length of the memory, or the starting position and end position of the memory. All address information that can be used to indicate the location of the memory is applicable to the embodiments of the present application.

Sleep state: The power supply of the independent graphics card/GPU is turned off and the graphics card is not working, such as the D3 state in ACPI.

Wake-up state/working state: The independent graphics card/GPU power supply is normal, and the graphics card is working normally, such as the D0 state in ACPI.

Third-party software: programs that are not included with the system or provided by the manufacturer.

As mentioned above, for notebooks equipped with independent graphics cards, in order to improve their battery life, the power of the independent graphics card will be turned off when the laptop is not running 3D programs (such as games), thereby reducing the power consumption of the device and improving the battery life. However, in the actual use of users, there is often a deviation between the actual experience of users and the battery life data of laboratory tests. After actual investigation, it was found that this is because there is a deviation between the laboratory environment and the environment actually used by users. In actual use, users often install third-party software (such as Master Lu or 360) to monitor system parameters, such as CPU temperature, graphics card temperature, fan speed, etc. Since the third-party monitoring software needs to collect the temperature of the graphics card every 1S, the graphics card frequently switches between the ON/OFF state (on/off), resulting in the graphics card being unable to be in a low power state for a long time even if the 3D program is not running, which leads to the deterioration of the power consumption of the device. After actual measurement, this reason can cause the power consumption of the machine to be configured with an independent graphics card to deteriorate to 10W, which greatly affects the battery life of the device.

Figure 1 is a schematic diagram of module interaction of a current temperature monitoring method. In the example shown in Figure 1, the process of third-party software monitoring the temperature of a graphics card is explained by taking the independent graphics card in a sleep state without a 3D program running as an example, and the third-party software obtains the temperature of the NV (i.e. NVIDIA) graphics card.

As shown in Figure 1, the current temperature monitoring process of third-party software includes: S101, the third-party software calls NVAPI to obtain the graphics card temperature; S102, NVAPI calls NV driver to obtain the graphics card temperature; S103, NV driver wakes up the NV graphics card to read the graphics card temperature; S104, NV graphics card reports the graphics card temperature to NV driver, and enters sleep state after reporting the graphics card temperature: S105, NV driver returns the graphics card temperature to NVAPI; S106, NVAPI returns the graphics card temperature to the third-party software.

It can be seen that in the scenario where no 3D program is running, the third-party software must wake up the independent graphics card every time it obtains the temperature of the independent graphics card. This causes the third-party software to frequently wake up the independent graphics card when monitoring the graphics card temperature, causing the graphics card to frequently switch between the ON/OFF state (on/off). As a result, even if the 3D program is not running, the graphics card cannot be in a low-power state for a long time, which leads to worsening of device power consumption. Table 1 shows the power consumption comparison of machines with independent graphics cards in the web browsing scenario with independent graphics cards enabled/disabled.

Table 1 Comparison of power consumption when independent graphics card is enabled/disabled between machine 1 and machine 2 when third-party software with graphics card temperature monitoring function is running in the background

As shown in Table 1, after the independent graphics card is enabled, the temperature monitoring of the third-party software frequently wakes up the independent graphics card, which makes the power consumption of the whole machine worse. When the independent graphics card is not enabled, the power consumption of the whole machine is reduced because the third-party software cannot wake up the independent graphics card.

It should be noted that in this article, the independent graphics card entering sleep mode refers to the state where the graphics card turns off its own power supply and enters low-power mode. Waking up the graphics card means that the independent graphics card enters the working state from the sleep state, and the power supply of the graphics card is started to power the graphics card. The independent graphics card is enabled when the independent graphics card of the device is in a state where it can run. The independent graphics card is disabled when the independent graphics card of the device cannot run. When the independent graphics card is enabled, third-party software can wake up the independent graphics card. When the independent graphics card is not enabled, third-party software cannot wake up the independent graphics card. The independent graphics card can obtain the graphics card temperature through its own temperature sensor.

Based on the above reasons, in order to avoid the deterioration of the power consumption of the whole machine due to the frequent waking up of the independent graphics card by the third-party software when monitoring the temperature of the independent graphics card, the embodiment of the present application provides a parameter monitoring method, which reads parameters such as the temperature of the graphics card through a sensor, and stores the parameters such as the temperature of the graphics card in a pre-allocated storage location in the memory. The third-party software directly reads the parameters from the storage location to perform parameter monitoring, so that there is no need to perform operations such as frequently waking up the graphics card, and the power consumption of the whole machine can be reduced in a scenario where no 3D program is running, so that the actual power consumption of the user is closer to the laboratory data, and the user experience is improved. The parameter monitoring method provided by the embodiment of the present application is described in detail below.

FIG2 is a schematic diagram of the hardware structure of an electronic device according to an embodiment of the present application. It should be understood that the electronic device 100 shown in FIG2 is only an example of an electronic device, and the electronic device 100 may have more or fewer components than those shown in the figure, may combine two or more components, or may have different component configurations. The various components shown in FIG2 may be implemented in hardware, software, or a combination of hardware and software including one or more signal processing and/or application specific integrated circuits.

The electronic device 100 may include: a processor 110, a first graphics processor 111, a first internal memory 120, an external memory 121, an embedded controller (EC) 130, a second internal memory 131, a second graphics processor 140, a second temperature sensor 141, a BIOS firmware flash memory 150, an antenna 1, a wireless communication module 160, a display screen 170, a fan 180, a keyboard 181, a first temperature sensor 190, etc.

The processor 110 is, for example, a central processing unit (CPU), which may include one or more processing cores. The processor 110 may also include: a controller, a memory controller, a first graphics processing unit (GPU) 111, etc. The first graphics processing unit (GPU) 111 is integrated with the central processing unit (CPU), also known as an integrated graphics card.

A memory may also be provided in the processor 110 for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory or a register.

In some embodiments, the processor 110 may include an interface bus, which may include one or more interfaces. The interface may include a universal asynchronous receiver/transmitter (UART) interface, a system management bus ("SMBus"), a low pin count (LPC) bus, a serial peripheral interface ("SPI"), a high-definition audio ("HDA") bus, a serial advanced technology attachment ("SATA") bus, a standardized interconnect (e.g., PCIe) and/or a universal serial bus (USB) interface, etc.

It is understandable that the interface connection relationship between the modules illustrated in the embodiment of the present application is only a schematic illustration and does not constitute a structural limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may also adopt different interface connection methods in the above embodiments, or a combination of multiple interface connection methods.

The antenna 1 is used to transmit and receive electromagnetic wave signals. The wireless communication module 160 can provide wireless communication solutions including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), etc. applied to the electronic device 100. In some embodiments, the antenna 1 of the electronic device 100 is coupled to the wireless communication module 160, so that the electronic device 100 can communicate with the network and other devices through wireless communication technology.

The electronic device 100 implements the display function through the first graphics processor 111 or the second graphics processor 140, the display screen 170 and the processor 110. The graphics processing unit (GPU) is used to perform mathematical and geometric calculations for graphics rendering. The electronic device 100 may include one or more GPUs that execute program instructions to generate or change display information.

The display screen 170 is used to display interfaces, images, videos, etc. The display screen 170 includes a display panel.

The first internal memory 120 may be used to store computer executable program codes, wherein the executable program codes include instructions. The processor 110 executes the instructions stored in the first internal memory 120 to execute various functional applications of the electronic device 100 and the parameter monitoring method of the embodiment of the present application.

The first internal memory (or main memory) 120 may include a program storage area and a data storage area. The program storage area may store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc. The data storage area may store data created during the use of the electronic device 100 (such as audio data, a phone book, etc.), etc. In addition, the first internal memory 120 may include a high-speed random access memory (RAM), such as a DDR (Double Data Rate) RAM, more specifically a DDR4 or DDR5 RAM. The internal memory (or main memory) 120 may be connected to the processor 110 through a memory bus.

The external memory 121 is, for example, a solid state disk (“SSD”) or a hard disk drive (“HDD”) or a flash memory device, a universal flash storage (UFS), etc. The external memory 121 can be communicatively connected to the processor 110 via a serial advanced technology attachment (“SATA”) bus or a standardized interconnect (e.g., PCIe).

The embedded controller (EC) 130 is used to implement functions such as keyboard control, touch pad, power management, fan control, etc. The controller 130 can sample the CPU or GPU temperature through the first temperature sensor 190, and then adjust the fan speed according to the algorithm based on the CPU or GPU temperature. The controller 130 may include independently running software stored in its own non-volatile medium. The temperature value of the first temperature sensor 190 read by the controller 130 is stored in the second internal memory 131. The second internal memory 131 may include a high-speed random access memory (RAM) that is integrated in the controller 130. The capacity of the second internal memory 131 is smaller than the first internal memory 120.

In some embodiments, the controller 130 may include one or more interfaces. The interface may include a general purpose input and output interface (GPIO), an eSPI (Enhanced Serial Peripheral) interface, an integrated circuit I2C interface, etc. The controller 120 may be connected and communicated with the processor 110 via, for example, an eSPI or LPC bus.

The second graphics processor 140 is used to perform mathematical and geometric calculations for graphics rendering. The second graphics processor 140 can enter a low-power sleep state when no 3D program is running. When running a 3D program, it is awakened by a graphics card driver (e.g., an NV driver) to perform 3D geometric calculations and graphics rendering. The second graphics processor 140 can also be disabled or enabled by the user. When the second graphics processor 140 is disabled, the graphics rendering work of the electronic device 100 is completed by the graphics processor (i.e., an integrated graphics card or an integrated GPU) in the processor 110. The second graphics processor 140 can be connected to the processor 110 through standardized interconnection (e.g., PCIe). The second graphics processor is also referred to as an independent graphics processor or an independent graphics card.

The second graphics processor 140 is internally integrated with a second temperature sensor 141, which can collect the operating temperature or core temperature of the second graphics processor 140. The second graphics processor 140 can adjust the performance/power consumption/frequency of the second graphics processor 140 according to the operating temperature or core temperature. The second temperature sensor 141 can be a sensor that can collect temperature, such as a resistor, a thermocouple, or a thermistor temperature sensor.

The BIOS firmware flash memory 150 is used to store the BIOS firmware, which may be a traditional BIOS firmware or a UEFI-based BIOS firmware. The BIOS firmware flash memory 150 may be a ROM (read-only memory) or a Flash memory (flash memory).

The fan 180 is used to dissipate heat for the processor 110, the second graphics processor 140, etc., to reduce the temperature of the components and ensure the operation of the device. The electronic device 100 may include one or more fans 180. Exemplarily, the electronic device 100 may arrange a fan near or on the processor 110 (i.e., above the motherboard processor 110), and arrange a fan near or on the second graphics processor 140.

The keyboard 181 is used for input by a user of the electronic device 100 .

The first temperature sensor 190 is used to collect the temperature of components of the electronic device 100, such as the mainboard, the processor 110, the first internal memory 120, the second graphics processor 140, etc. The electronic device 100 may include one or more first temperature sensors 190. Exemplarily, for example, one or more first temperature sensors 190 are arranged near the processor 110, one or more first temperature sensors 190 are arranged near the first internal memory 120, and one or more first temperature sensors 190 are arranged near the second graphics processor 140. The first temperature sensor 190 may be a sensor that can collect temperature, such as a resistor, a thermocouple, or a thermistor temperature sensor. The first temperature sensor 190 may be connected to the processor 110 and the embedded controller (EC) 130 through, for example, a system management bus ("SMBus"), so as to send the collected temperature to the processor 110 and the embedded controller (EC) 130.

In the embodiment of the present application, the embedded controller (EC) 130 can obtain the temperature value of the first temperature sensor 190 outside the second graphics processor 140 in real time, and this behavior will not affect the low power consumption state of the second graphics processor 140.

FIG3 is a schematic diagram of the arrangement of temperature sensors of an electronic device as shown in an exemplary embodiment. As shown in FIG3 , the electronic device 100 includes a mainboard 101, on which a processor 110, a second graphics processor 140 and a USB interface 191 are arranged, and a first temperature sensor 190 is arranged outside the processor 110, the second graphics processor 140 and the USB interface 191, adjacent to the processor 110, the second graphics processor 140 and the USB interface 191. The first temperature sensor 190 outside the processor 110 is used to collect the peripheral temperature of the processor 110. The first temperature sensor 190 outside the second graphics processor 140 is used to collect the peripheral temperature of the second graphics processor 140. The first temperature sensor 190 outside the USB interface 191 is used to collect the peripheral temperature of the USB interface 191. In the present application, the peripheral temperature of a device refers to the temperature of the periphery or periphery of the device relative to the operating temperature or core temperature inside the device.

The software system of the electronic device 100 may adopt a layered architecture, an event-driven architecture, a micro-kernel architecture, a micro-service architecture, or a cloud architecture. The embodiment of the present application takes the Windows system of the layered architecture as an example to exemplify the software structure of the electronic device 100.

FIG. 4 is a software structure block diagram of the electronic device 100 according to an embodiment of the present application.

The layered architecture of the electronic device 100 divides the software into several layers, each layer has a clear role and division of labor, and the layers communicate with each other through software interfaces.

In some embodiments, the Windows system is divided into user state and kernel state. The user state includes the application layer and the subsystem dynamic link library. The kernel state is divided from bottom to top into the firmware layer, the hardware abstraction layer (HAL), the kernel and the driver layer and the executive body.

As shown in Figure 4, the application layer includes applications such as music, video, games, office, and temperature monitoring software. The application layer also includes an environment subsystem, a scheduling engine, a system support process, a service process, etc. Among them, only some applications are shown in the figure, and the application layer can also include other applications, such as shopping applications, browsers, etc., which are not limited in this application.

The environment subsystem can present certain subsets of the basic executive system services to the application in a specific form, providing an execution environment for the application.

The scheduling engine can obtain the load condition of the electronic device 100, and determine the actual scheduling strategy that meets the actual operation condition of the electronic device 100 in combination with the load condition of the electronic device 100 and the above-mentioned basic scheduling strategy.

Temperature monitoring software can monitor the temperature of various hardware of electronic devices, such as CPU temperature, GPU temperature, etc. Temperature monitoring software can be an independent application or a software module integrated in other applications.

The subsystem dynamic link library includes an API module, which includes Windows API, Windows native API, NVAPI, etc. Among them, Windows API and Windows native API can provide system call entry and internal function support for applications. The difference is that Windows native API is an API native to the Windows system. For example, Windows API may include user.dll and kernel.dll, and Windows native API may include ntdll and dll.

The executive body includes the process manager, virtual memory manager, security reference monitor, I/O manager, Windows management instrumentation (WMI), power manager, operating system event driver (OsEventDriver) node, operating system to System on Chip (OS2SOC) node, etc.

The kernel and driver layer include the kernel and device drivers.

The kernel is an abstraction of the processor architecture, isolating the executive body from the differences in the processor architecture to ensure the portability of the system. The kernel can perform thread scheduling and dispatching, trap handling and exception dispatching, interrupt handling and dispatching, etc.

Device drivers run in kernel mode and are interfaces between the I/O system and related hardware. Device drivers may include graphics card drivers, Intel DTT drivers, mouse drivers, audio and video drivers, camera drivers, keyboard drivers, etc. For example, a graphics card driver can drive the GPU to run, and an Intel DTT driver can drive the CPU to run.

HAL is a kernel-state module that hides various hardware-related details, such as I/O interfaces, interrupt controllers, and multi-processor communication mechanisms, and provides a unified service interface for different hardware platforms running Windows, achieving portability on multiple hardware platforms.

The firmware layer can include the basic input output system (BIOS). The BIOS is a set of programs that are fixed to a read-only memory (ROM) chip on the computer motherboard. It stores the most important basic input and output programs of the computer, the self-test program after power-on, and the system self-starting program. It can read and write specific information of system settings from the complementary metal oxide semiconductor (CMOS). Its main function is to provide the lowest-level and most direct hardware settings and control for the computer.

The Intel DTT driver can send instructions to the CPU through the BIOS.

It should be noted that the embodiments of the present application are only illustrated using the Windows system as an example. In other operating systems (such as the Android system, the IOS system, etc.), as long as the functions implemented by each functional module are similar to those of the embodiments of the present application, the solutions of the present application can also be implemented.

It is understandable that the layers in the software structure shown in FIG4 and the components contained in each layer do not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may include more or fewer layers than shown in the figure, and each layer may include more or fewer components, which is not limited in the present application.

The parameter monitoring method provided by the embodiment of the present application is described below by taking the temperature of the second graphics processor 140 as an example. It should be understood that the parameters in the parameter monitoring method of the embodiment of the present application are not limited to the temperature of the second graphics processor 140, and may also be other parameters such as fan speed, CPU temperature, motherboard temperature, etc.

FIG. 5 is one of the schematic diagrams of module interactions of the parameter monitoring method according to an embodiment of the present application.

5 , the electronic device 100 executes the parameter monitoring method provided in the embodiment of the present application, and the modules involved at least include but are not limited to: a first internal memory 120 , a controller (EC) 130 , a first temperature sensor 190 , BIOS, and a first application.

As shown in FIG5 , the parameter monitoring method provided in the embodiment of the present application specifically includes:

Step S501: starting a first application in response to a user operation.

The user operation is, for example, a click operation of the user on the first application. The first application is, for example, a device management or test application, which has a temperature monitoring function. The first application is, for example, a third-party monitoring software.

At this time, the second graphics processor is in a sleep state, and the second graphics processor has a first operating voltage and a first operating current.

Step S502: obtaining a first temperature value through a first application.

For example, in the embodiment of the present application, step S502 may be implemented by the following steps:

Step S5021: A first temperature sensor outside the second graphics processor collects a first temperature value of the second graphics processor in real time.

Specifically, a first temperature value of the second graphics processor is collected by a first temperature sensor arranged outside the second graphics processor. The first temperature value represents the peripheral temperature of the second graphics processor.

Step S5022, at a first time point, the controller (EC) obtains the first temperature value from a first temperature sensor.

The controller (EC) is connected to the first temperature sensor outside the second graphics processor through, for example, a system management bus ("SMBus"), and polls the first temperature sensor or other devices through the system management bus ("SMBus") to read the first temperature value from the first temperature sensor outside the second graphics processor.

Further, the controller (EC) includes a second internal memory, such as a RAM, and after acquiring the first temperature value from the first temperature sensor outside the second graphics processor, the read first temperature value is stored/written into the second internal memory.

It should be understood that step S503 may be included in the temperature monitoring process of the controller (EC). After the controller starts the temperature monitoring process, step S503 may be repeatedly executed until the temperature monitoring process ends. The temperature monitoring process of the controller is used to monitor the temperature of the processor, the second processor graphics processor, the motherboard, etc., and it is not the same monitoring process as the temperature monitoring function of the first application.

Step S5023: BIOS reads the first temperature value from the controller (EC).

Exemplarily, the controller (EC) transmits data through the 62/66IO port. The BIOS and the controller (EC) predefine the SMI (System Management Interrupt) interrupt number, and the BIOS or more specifically the BIOS runtime service obtains the interrupt number from the controller (EC) through the 62/66IO port. After polling and reading the first temperature value of the first temperature sensor outside the second graphics processor, the controller (EC) generates an SCI interrupt, and the BIOS runtime service calls the interrupt service function corresponding to the interrupt number to read the first temperature value again through the 62/66IO port.

Step S5024: BIOS writes the first temperature value into a pre-allocated target storage area in the first internal memory.

After reading the first temperature value from the controller (EC), the BIOS runtime service writes (ie updates) the first temperature value to a pre-allocated target storage area in the first internal memory.

The principle and process of allocating a storage location for the first temperature value of the second graphic sensor in the first internal memory will be described later and will not be repeated here.

Step S5025: the first application reads the SMBIOS table and parses the target address information from the SMBIOS table. The target address information indicates the address information of the target storage area pre-allocated in the first internal memory.

Specifically, the SMBIOS table is stored in the first internal memory. For non-UEFI systems, the first application can find the EPS (Entry Point structure) of SMBIOS by searching for the anchor-string (_SM_) in the physical memory address range 000F0000h to 000FFFFFh. For UEFI-based systems, the first application can directly search for the GUID (SMBIOS_TABLE_GUID, {EB9D2D31-2D88-11D3-9A16-0090273FC14D}).

After the first application finds the SMBIOS table in the first internal memory, the temperature subtable is found or determined by the type value of the SMBIOS subtable. The temperature subtable stores the address information of the temperature storage location of each temperature detection point (that is, each first temperature sensor). According to the temperature subtable, the address information of the temperature storage location of the first temperature sensor outside the second graphics processor can be obtained.

For example, in the embodiment of the present application, type028 in the SMBIOS table represents a temperature sensor sub-table. In the temperature sensor sub-table, the description of the first temperature sensor of the second graphics processor can be found through a predefined description specification.

Exemplarily, the description specification in the temperature sensor subtable is as follows: Format: "HNABC", where "HN" is the identifier, which is fixedly written as "HN". "A" represents the temperature detection point type, and is defined in detail as follows: "1" represents the temperature detection point close to the CPU, "2" represents the temperature detection point close to the GPU, "3" represents the temperature detection point close to the hard disk, and "4" represents the temperature detection point close to the motherboard. "B" represents the temperature detection point number. When the A field is the same, the B field is used to distinguish them, starting from "1" and ending with "9". "C" represents the access method of the temperature detection point, "1" represents the EC internal RAM access method, "2" represents the physical memory address access method, "3" represents the EC RAM access method, and "4" represents the Index-Data access method.

The specific process of the first application reading the SMBIOS table and parsing the temperature storage location of the second graphics processor therefrom is, for example: the first application finds the SMBIOS table in the first internal memory, then finds the type028 subtable in the SMBIOS table, and then finds HN212 in the type028 subtable, which field indicates that it is a description of the first temperature sensor outside the second graphics processor, and the access method is the physical memory address access method. Then, the address information of the temperature storage location of the first temperature sensor outside the second graphics processor is found from the description of the HN212 field. The temperature storage location of the first temperature sensor outside the second graphics processor is a target storage area pre-allocated in the first internal memory, and the address information of the temperature storage location of the first temperature sensor outside the second graphics processor is the target address information.

It should be understood that step S5025 can be executed after step S501, or step S5025 and steps S5021 to S5024 can be executed simultaneously, or before step S5021.

Step S5026: The first application determines a pre-allocated target storage area in the first internal memory according to the target address information, and reads the first temperature value from the target storage area.

At this time, the second graphics processor is in a sleep state, and the second graphics processor has a first operating voltage and a first operating current.

Specifically, the first application finds the location of a pre-allocated target storage area in the first internal memory according to the target address information, and then reads the first temperature value from the target memory.

Step S508: at a second time point, the first application displays the first temperature value on the first interface.

The first temperature value is the temperature of the second graphics processor.

The first interface is, for example, a temperature monitoring interface or a parameter monitoring interface. The first interface may be located in the display interface of the first application, or may be displayed as a display interface independent of the first application.

The first temperature value is, for example, 46° C. For an example of the first interface, see FIG6 . In the first interface shown in FIG6 , it is shown that the temperature of the second graphics processor (ie, graphics card) is 46° C.

It should be understood that between the first time point and the second time point, the second graphics processor is in a sleep state/low power consumption state, the operating voltage and the operating current of the second graphics processor are the first operating voltage and the first operating current, and the second graphics processor has the first power consumption. Exemplarily, for example, the first operating voltage, the first operating current, and the first power consumption are all less than a preset value. The preset value is equal to the power supply parameter threshold when the second graphics processor is in a sleep state.

In summary, when obtaining the temperature of the second graphics processing, the parameter monitoring method provided in the embodiment of the present application first reads the first temperature value collected by the first temperature sensor through the controller, and then the BIOS/BIOS runtime service reads the first temperature value of the second graphics processing from the controller and writes it into the pre-allocated memory. When the first application monitors the temperature of the second graphics processing, it first obtains the temperature storage address from the SMBIOS table, and then reads the first temperature value from the memory according to the temperature storage address. In other words, during the operation of the EC, the data will be sent to the BIOS, and the BIOS is responsible for updating the temperature in real time. After reading the SMBIOS Table, the third-party software can find the address where the temperature data is stored, and then obtain the temperature. During the entire temperature acquisition process, there is no need to operate the second graphics processor, that is, when the second graphics processor is in a low-power sleep state, the peripheral temperature of the second graphics processor can be obtained without waking up the second graphics processor, which can avoid the increase in device power consumption due to frequent waking up of the second graphics processor.

In order to better understand the present invention, the detailed process of the current parameter monitoring method is described below by taking the temperature of the second graphics processor as an example in conjunction with FIG. 7 and FIG. 8 .

FIG. 7 is one of the schematic diagrams of module interactions for executing the parameter monitoring method.

As shown in FIG7 , current parameter monitoring methods include:

Step S701: starting a second application in response to a user operation.

The user operation is, for example, a click operation of the user on the second application. The second application is, for example, a device management or test application, which has a temperature monitoring function. The second application is, for example, a third-party monitoring software. The second application and the first application can be the same application or different applications.

At this time, the second graphics processor is in a sleep state, and the second graphics processor has a first operating voltage and a first operating current.

Step S702: Obtain a second temperature value through a second application

For example, in the embodiment of the present application, step S702 may be implemented by the following steps:

Step S7021: The second application starts the temperature monitoring program and calls NVAPI to issue a first instruction.

The first instruction is used to read a second temperature value of a second processor graphics. The second temperature value represents a core temperature or an operating temperature of the second processor. When the second graphics processor is running, the second temperature value of the second graphics processor is greater than the first temperature value of the second graphics processor.

The second temperature value of the second processor graphics may be acquired by a second temperature sensor of the second graphics processor.

It should be understood that in the embodiment of the present application, the second graphics processor is an NV graphics card as an example for explanation, so the second application calls the NVAPI. If the second graphics processor uses other graphics cards, the corresponding API can be called to send the first instruction.

Step S7022: NVAPI sends the first instruction to the graphics card driver.

Step S7023: the graphics card driver sends the first instruction to the graphics card.

In step S7023, the graphics card driver first determines the state of the second graphics processor, and if the second graphics processor is in a sleep state, the graphics card driver first wakes up the second graphics processor from the sleep state. If the second graphics processor is in a working state, the graphics card driver directly sends the first instruction to the graphics card.

Step S7024: The second graphics processor obtains a second temperature value of the second temperature sensor according to the first instruction.

The second graphics processor obtains a second temperature value of a second temperature sensor according to the first instruction. The second temperature sensor is disposed inside the second graphics processor. The second temperature value indicates a core temperature or an operating temperature of the second processor.

At this time, the second graphics processor is in a wake-up/working state, and the second graphics processor has a second working voltage and a second working current. The first working current is greater than the first working current, and the second working voltage is greater than the first working voltage.

Step S7025: The second graphics processor reports the second temperature value to the graphics card driver.

In step S7025, after the second graphics processor reports the second temperature value to the graphics card driver, if no new task or instruction is received, the second layer processor enters a sleep state.

Step S7026: The graphics card driver returns the second temperature value to NVAPI.

Step S7027: NVAPI returns the second temperature value to the second application.

Step S703: at a fourth time point, the second application displays a second temperature value on the second interface.

The second temperature value is the temperature of the second graphics processor.

The second interface is, for example, a temperature monitoring interface or a parameter monitoring interface. The second interface may be located in the display interface of the second application, or may be displayed as a display interface independent of the second application.

The second temperature value is, for example, 66° C. For an example of the second interface, see FIG8 . The second interface shown in FIG8 shows that the temperature of the second graphics processor (ie, graphics card) is 66° C.

It should be understood that, at a fifth time point between the third time point and the fourth time point when the second graphics processor is in the working state or is to be awakened from the awake state, the working voltage and the working current of the second graphics processor are the second working voltage and the second working current, and the second graphics processor has the second power consumption. Exemplarily, for example, the second working voltage, the second working current, and the second power consumption are all greater than the preset value.

It should also be understood that the second operating voltage is greater than the first operating voltage, the second operating current is greater than the first operating current, and the second power consumption is greater than the first power consumption.

It should also be understood that when the second graphics processor is in the working state, the working voltage and working current of the second graphics processor are the third working voltage and the third working current, the second graphics processor has a third power consumption, the third working voltage is greater than the first working voltage, the third working current is greater than the third working current, and the third power consumption is greater than the first power consumption. The third voltage is greater than or equal to the second working voltage, and the third working current is greater than or equal to the second working current.

FIG. 9 is an exemplary flowchart for pre-allocating memory.

It should be noted that in the embodiment of the present application, a target storage area is pre-allocated in the first internal memory during the startup process of the electronic device 100 for storing the first temperature value of the second graphics processor. The startup process of the electronic device 100 includes BIOS startup and operation startup. The allocation of the target storage area is completed during the BIOS startup process.

Exemplarily, in this application, a UEFI-based BIOS system is taken as an example for description.

As shown in FIG9 , the method for pre-allocating memory includes:

Step S901, start.

For example, the processor 110 reads and runs the BIOS firmware from the BIOS firmware flash memory.

Step S902, executing UEFI boot.

Step S903: pre-allocate a target storage area in the first internal memory for storing the first temperature value of the second graphics processor.

Specifically, AllocatePages in the bootservice provided by UEFI is called to allocate memory, and a portion of the memory is reserved from the first internal memory for storing the first temperature value of the second graphics processor. The attribute of the reserved target storage area is set to the ACPI_NVS type. The ACPI_NVS type indicates that the reserved memory will not be used by the operating system, and the reserved memory will be saved after the operating system enters the standby state. When exiting the standby state, the reserved memory will be automatically restored by the operating system.

Exemplarily, the size of the reserved target storage area is approximately 4K.

Step S904, creating an SMBIOS table.

An SMBIOS table is created according to the target storage area reserved in step S903 for storing the first temperature value of the second graphics processor, and address information of the reserved target storage area is written into a corresponding SMBIOS sub-table in the SMBIOS table.

For example, in the embodiment of the present application, type028 in the SMBIOS table represents a temperature sensor subtable. That is, after a target storage area for storing the first temperature value of the second graphics processor is allocated, the address information of the target storage area is written into the field of the temperature sensor subtable for describing the first temperature sensor of the second graphics processor.

Exemplarily, the description specification in the temperature sensor subtable is as follows: Format: "HNABC", where "HN" is the identifier, which is fixedly written as "HN". "A" represents the temperature detection point type, and is defined in detail as follows: "1" represents the temperature detection point close to the CPU, "2" represents the temperature detection point close to the GPU, "3" represents the temperature detection point close to the hard disk, and "4" represents the temperature detection point close to the motherboard. "B" represents the temperature detection point number. When the A field is the same, the B field is used to distinguish them, starting from "1" and ending with "9". "C" represents the access method of the temperature detection point, "1" represents the EC internal RAM access method, "2" represents the physical memory address access method, "3" represents the EC RAM access method, and "4" represents the Index-Data access method.

After the target storage area for storing the first temperature value of the second graphics processor is allocated, the SMBIOS table is created, and the HN212 field is created in the type028 subtable, which indicates that it is a description of the first temperature sensor of the second graphics processor, and the access method is the physical memory address access method. Then, the physical memory address information of the allocated target storage area for storing the first temperature value of the second graphics processor is written from the description of the HN212 field.

Step S905, continue the UEFI boot process.

The subsequent boot process of UEFI is similar to the commonly used process in the art, and reference may be made to the relevant public description, which will not be repeated here.

It should be noted that, in some embodiments of the present application, each time the electronic device performs BIOS startup, memory allocation is performed to reserve memory for storing the temperature of the second graphics processor.

It can be understood that, although in the above embodiments of the present application, the parameter monitoring method of the present application is illustrated by taking monitoring the temperature of the second graphics processor as an example, the parameter monitoring method of the present application is not limited to monitoring the temperature of the second graphics processor, and it can also be used to monitor parameters such as CPU temperature, fan speed, and motherboard temperature.

It is understandable that, in order to realize the above functions, the electronic device includes hardware and/or software modules corresponding to the execution of each function. In combination with the algorithm steps of each example described in the embodiments disclosed herein, the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is executed in the form of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application in combination with the embodiments, but such implementation should not be considered to be beyond the scope of the present application.

In one example, FIG10 shows a schematic block diagram of an apparatus 300 according to an embodiment of the present application. The apparatus 300 may include: a processor 301 and a transceiver/transceiver pin 302 , and optionally, a memory 303 .

The components of the device 300 are coupled together via a bus 304, wherein the bus 304 includes a power bus, a control bus, and a status signal bus in addition to a data bus. However, for the sake of clarity, all buses are referred to as bus 304 in the figure.

Optionally, the memory 303 may be used for the instructions in the aforementioned method embodiment. The processor 301 may be used to execute the instructions in the memory 303, and control the receiving pin to receive a signal, and control the sending pin to send a signal.

The apparatus 300 may be the electronic device or a chip of the electronic device in the above method embodiment.

Among them, all relevant contents of each step involved in the above method embodiment can be referred to the functional description of the corresponding functional module, and will not be repeated here.

The steps performed by the parameter monitoring method provided in the above embodiment of the present application may also be performed by a chip system included in the electronic device 100, wherein the chip system may include a processor and an EC. The chip system may be coupled to a memory so that when the chip system is running, the computer program stored in the memory is called to implement the steps performed by the above electronic device 100. The processor in the chip system may be an application processor or a processor other than an application processor.

As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A method for monitoring parameters, the method being applied to an electronic device, the electronic device including a first graphics processor and a second graphics processor, the electronic device having a first application installed therein, the method comprising:

starting a first application at a first time point, wherein the first graphic processor is in a working state and the second graphic processor is in a sleep state at the first time point;

After the first application is started, a first temperature value is obtained through the first application;

Displaying the first temperature value at a first interface of the first application at a second point in time, the first temperature value representing a temperature of the second graphics processor;

Wherein the second graphics processor is in a sleep state between the first point in time and a second point in time,

Starting a second application at a third time point, wherein the first graphic processor is in a working state and the second graphic processor is in a sleep state at the third time point;

after the second application is started, a second temperature value is obtained through the second application;

at a fourth point in time, displaying the second temperature value at a second interface of the second application, the second temperature value representing a temperature of the second graphics processor;

Wherein the second graphics processor wakes up between the third point in time and a fourth point in time.

2. The method for monitoring parameters according to claim 1, wherein,

At a fifth time point, the voltage of the second graphic processor is a first voltage value, the current of the second graphic processor is a first current value, and the fifth time is between the first time point and a second time;

At a sixth time, the voltage of the second graphics processor is a second voltage value, the current of the second graphics processor is a second current value, the sixth time point is between the third time point and a fourth time point, the second voltage value is greater than the first voltage value, and/or the second current value is greater than the first current.

3. The parameter monitoring method of claim 2, wherein the electronic device is installed with a third application, the method further comprising:

before a first time point, starting a third application, wherein the second graphic processor is in a working state, the voltage of the second graphic processor is a third voltage value, and the current of the second graphic processor is a third current value;

Closing the third application, and switching the second graphic processor to a sleep state;

Wherein the third voltage value is greater than the first voltage value and/or the third current value is greater than the first current value.

4. A method of monitoring parameters according to any of claims 1-3, wherein the electronic device comprises a first internal memory and an SMBIOS table, the obtaining, by the first application, a first temperature value comprising:

The first application reads the SMBIOS table and acquires target address information from the SMBIOS table, wherein the target address information represents address information of a target storage area which is pre-allocated in the first internal memory;

And the first application determines the position of the target storage area pre-allocated in the first internal memory according to the target address information, and reads the first temperature value from the target storage area.

5. The method of claim 4, wherein the electronic device further comprises a controller, a first temperature sensor, and a BIOS, wherein prior to reading the first temperature value from the target storage area, the obtaining, by the first application, the first temperature value further comprises:

The controller obtains the first temperature value through the first temperature sensor and transmits the first temperature value to the BIOS;

the BIOS writes the first temperature value into the target storage area pre-allocated in the first internal memory.

6. The method of claim 4, wherein the electronic device further comprises a BIOS, the method further comprising, prior to reading the SMBIOS table:

The BIOS is started, and during the BIOS start-up:

Pre-allocating the target storage area for storing the first temperature value in the first internal memory;

and creating the SMBIOS table, and writing the target address information of the target storage area into the SMBIOS table.

7. The method of claim 6, wherein during the BIOS boot process, the method further comprises:

and setting the attribute of the target storage area to be ACPI_NVS.

8. The parameter monitoring method of claim 6, wherein the size of the pre-allocated memory area for storing the first temperature value is 2-10K.

9. An electronic device, comprising: a memory and a processor, the memory and the processor coupled; the memory stores program instructions that, when executed by the processor, cause the electronic device to perform the parameter monitoring method of any one of claims 1-8.

10. A computer readable storage medium comprising a computer program, characterized in that the computer program, when run on an electronic device, causes the electronic device to perform the parameter monitoring method according to any one of claims 1-8.