CN116864466B - A chip radiator - Google Patents
A chip radiator Download PDFInfo
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- CN116864466B CN116864466B CN202310959787.3A CN202310959787A CN116864466B CN 116864466 B CN116864466 B CN 116864466B CN 202310959787 A CN202310959787 A CN 202310959787A CN 116864466 B CN116864466 B CN 116864466B
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- heat sink
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- groove
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
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- Chemical & Material Sciences (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明提供一种芯片散热器，芯片散热器包括：第一散热板，第一散热板的中部上凸形成为槽体，槽体内形成有条状隔块，隔块将槽体的顶壁分割成不包括隔块的第一区板和第二区域，其顶壁形成有第一通孔和第二通孔；第二散热板，第二散热板连接第一散热板且覆盖槽体的开口，第二散热板的第一表面上形成有间隔排列的多个第一针翅和多个第二针翅，第一针翅的顶端连接顶壁的第一区域，第二针翅的顶端连接顶壁的第二区域，隔块连接第一表面，第二散热板的第二表面用于与芯片连接，以对芯片进行散热；进液管，进液管连接第一通孔；出液管，出液管连接第二通孔。本发明的芯片散热器能够增加换热面积，减少热交换后冷却液的滞留，提高散热效率。
The present invention provides a chip heat sink, which includes: a first heat sink, the middle part of the first heat sink is convex upward to form a trough body, a strip spacer is formed in the trough body, the spacer divides the top wall of the trough body into a first zone plate and a second zone excluding the spacer, and the top wall is formed with a first through hole and a second through hole; a second heat sink, the second heat sink is connected to the first heat sink and covers the opening of the trough body, a plurality of first pin fins and a plurality of second pin fins arranged at intervals are formed on the first surface of the second heat sink, the top of the first pin fin is connected to the first zone of the top wall, the top of the second pin fin is connected to the second zone of the top wall, the spacer is connected to the first surface, and the second surface of the second heat sink is used to connect with the chip to dissipate heat for the chip; a liquid inlet pipe, the liquid inlet pipe is connected to the first through hole; a liquid outlet pipe, the liquid outlet pipe is connected to the second through hole. The chip heat sink of the present invention can increase the heat exchange area, reduce the retention of coolant after heat exchange, and improve the heat dissipation efficiency.
Description
Technical Field
The invention relates to the field of chips, in particular to a chip radiator.
Background
Chips (central processing unit chips, graphic processor chips, memory chips, etc.) generate heat during operation, especially server chips, and the heat is greater, so that the operation efficiency of the chips is easily reduced, and the service life is reduced.
The existing chip heat dissipation mainly adopts air cooling or water cooling, the air cooling adopts a fan to blow to the chip, the heat dissipation efficiency is lower, the water cooling adopts a cavity to contain water, the chip is subjected to heat dissipation through the cavity, and after a period of use, the water temperature is too high, and the heat dissipation efficiency is low.
Disclosure of Invention
The present invention is directed to a chip radiator, which can increase heat exchange area, reduce retention of cooling liquid after heat exchange, and improve heat dissipation efficiency.
In order to solve the above problems, the present invention provides a chip heat sink including:
The heat dissipation device comprises a first heat dissipation plate, wherein the middle part of the first heat dissipation plate is upwards convex to form a groove body, an opening of the groove body is downwards, strip-shaped partition blocks are formed in the groove body, the two ends of each partition block are at a preset distance from the side wall of the groove body, a straight line is formed along the extending direction of each partition block, the top wall of the groove body is divided into a first area plate and a second area which do not comprise the partition block, a first through hole is formed in the middle part of the first area of the top wall, and a second through hole is formed in the middle part of the first area of the top wall;
The second heat dissipation plate is connected with the first heat dissipation plate and covers the opening of the groove body, the groove body and the second heat dissipation plate are matched to form a cavity, a plurality of first pin fins and a plurality of second pin fins which are arranged at intervals are formed on the first surface of the second heat dissipation plate, which is close to the first heat dissipation plate, the top ends of the first pin fins are connected with the first area of the top wall, the top ends of the second pin fins are connected with the second area of the top wall, the spacer blocks are connected with the first surface, and the second surface of the second heat dissipation plate, which is far away from the first heat dissipation plate, is used for being connected with a chip so as to dissipate heat of the chip;
The liquid inlet pipe is connected with the first through hole so as to inject cooling liquid into the cavity;
And the liquid outlet pipe is connected with the second through hole so as to discharge the cooling liquid entering the cavity.
Further, the top wall of the first heat dissipation plate is formed with a first groove and a second groove connecting the first region and the second region, the first groove is located between the first end of the spacer block and the first side wall adjacent to the first end and extends along the length direction of the first side wall, the second groove is located between the second end of the spacer block and the second side wall adjacent to the second end and extends along the length direction of the second side wall, and the region of the first surface facing the first groove and the second groove of the second heat dissipation plate is formed at least partially into a plane.
Further, an annular clamping groove is formed in the outer edge of the first surface of the second heat dissipation plate, an annular protruding block which can be accommodated in the annular clamping groove and is connected with the annular clamping groove is formed in the outer edge of the first heat dissipation plate, a connecting groove is formed in the position, corresponding to the spacer block, of the second heat dissipation plate, the bottom end of the spacer block can be accommodated in the connecting groove, and the first surface of the second heat dissipation plate is connected with the spacer block through the connecting groove.
Further, the outer edge of the first heat dissipation plate is aligned with the outer edge of the second heat dissipation plate, and the chip heat sink further includes:
The cover plate comprises a hollowed-out part positioned in the middle and a main body part positioned at the periphery of the hollowed-out part, the outer wall of the groove body can protrude out of the hollowed-out part, one side, close to the hollowed-out part, of the main body part is recessed towards the inside to form a step, the step can enclose the outer edge of the second heat dissipation plate, the height of the step is lower than the heat dissipation thickness, and the heat dissipation thickness is the total thickness of the first heat dissipation plate and the second heat dissipation after the first heat dissipation plate is overlapped with the second heat dissipation plate;
And the fastener penetrates through the main body part and is connected with the chip or the fixing mechanism of the chip.
Further, the fastener includes a plurality of the fasteners disposed in spaced relation around the outer edge of the body portion, each of the fasteners including:
The rod part of the bolt penetrates through the cover plate and is in threaded connection with the chip or the fixing mechanism of the chip;
And the spring is sleeved on the rod part of the bolt and is positioned between the head part of the bolt and the cover plate.
Further, the chip radiator includes two heat dissipation joints, the feed liquor pipe with the drain pipe is respectively through two the heat dissipation joint is connected first through-hole with the second through-hole, the heat dissipation joint includes:
The heat dissipation joint is connected with the first through hole or the second through hole through the first end of the metal block, and a first channel which is in butt joint with the first through hole or the second channel is formed in the metal block;
The tower joint is connected with the second end of the metal block, a second through passage is formed in the middle of the tower joint, the first passage is communicated with the second through passage, the tower joint comprises a tower head and a base connected with the bottom of the tower head, the base is provided with external threads, the liquid inlet pipe and the liquid outlet pipe are hoses, and the heat dissipation joint is connected with the hoses through the tower head of the tower joint;
the connecting nut is sleeved on the pagoda joint and is in threaded connection with the base of the pagoda joint.
Further, the end surface of the top of the pin fin is formed in a polygonal shape, a circular shape or an elliptical shape.
Further, the top wall of the groove body is formed into a rectangle, the spacer blocks are arranged along the length direction or the width direction of the rectangle, the two ends of the spacer blocks are equal to a first distance between the side walls of the groove body, the end face of the top of the pin fin is formed into a square, and the direction of the diagonal line of the square is the length direction or the width direction of the rectangle.
Further, the second heat dissipation plate is formed with a plurality of concave holes recessed inward along a portion of the second surface thereof corresponding to the pin fin, the concave holes extending into the inside of the pin fin and extending to a vertically middle portion of the pin fin, the chip heat sink further comprising:
The heat conduction elastic pieces are in one-to-one correspondence with the concave holes, the heat conduction elastic pieces are arranged in the concave holes and can protrude out of openings of the concave holes, and when the second radiating fins are connected with the chip, the bottom ends of the heat conduction elastic pieces can be contracted to the positions flush with the second surface.
Further, the heat conduction elastic piece is a graphene column body or a heat conduction silica gel column body.
Due to the technical scheme, the invention has the following beneficial effects:
According to the chip radiator, the chip radiator comprises a first radiating plate, a second radiating plate, a liquid inlet pipe and a liquid outlet pipe, wherein the first radiating plate is connected with the second radiating plate, namely, the outer edge of the first radiating plate and the outer edge of the second radiating plate are closed, a groove body is formed to divide the cavity into a first divided cavity and a first divided cavity through a partition block, the first divided cavity and the first divided cavity are communicated through a first flow channel and a second flow channel, a plurality of first pin fins and a plurality of second pin fins are respectively arranged in the first divided cavity and the second divided cavity, the heat exchange area can be increased, the cooling liquid from the liquid inlet pipe is injected into the first divided cavity from a first through hole to the upper part, the downward impact force can be formed on the second radiating plate, the cooling liquid can quickly impact the bottom of the second radiating plate, the bottom of the cooling liquid (the bottom of the cooling liquid is closest to the chip and fully heat-exchanged with the chip) is upwards punched, so that the cooling liquid can be conveniently and quickly flowed to the second through holes and discharged from the middle part of the first divided cavity to the periphery of the first divided cavity, the cooling liquid can flow through a plurality of first pin fins and a plurality of second pin fins can flow into the second divided cavities, the cooling liquid can flow through the second flow channels and the second through the first pin fins and the second flow channels and the second split cavity, the cooling liquid can be simultaneously flow through the second split cavity and the second split cavity, the cooling cavity can be drained through the second split cavity and the second cooling cavity can be simultaneously, the cooling liquid can flow through the cooling cavity and the second flow channel and the cooling cavity can be formed through the second flow channel and the cooling cavity through the second split through the second heat channels and the second heat channels can be filled into the cooling cavity and the cooling cavity can be cooled through the heat flow through the chip and the heat can be cooled through the chip and the chip, avoid detaining to be convenient for receive new coolant liquid), improve the radiating efficiency to the chip, avoid not having the spacer block but under the condition of forming whole cavity, and have and carry out the heat exchange with the chip after the hot coolant liquid be difficult to in time discharge, cause the condition that chip radiating efficiency is low easily.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the following description will make a brief introduction to the drawings used in the description of the embodiments or the prior art. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a block diagram of a chip heatsink according to one embodiment of the invention;
fig. 2 is a structural view of a cover plate, a first heat dissipation plate, and a second heat dissipation plate according to an embodiment of the present invention;
fig. 3 is a structural view of a second heat dissipating plate according to an embodiment of the present invention;
Fig. 4 is a structural view of a first heat dissipating plate according to an embodiment of the present invention;
fig. 5 is a view of the back side of the first heat dissipating plate of the embodiment of fig. 4;
FIG. 6 is a block diagram of a metal block, pagoda fitting and coupling nut according to one embodiment of the invention;
Fig. 7 is a structural view of a second heat dissipating plate according to another embodiment of the present invention.
100. Cover plate 200, first heat dissipation plate 210, groove body 211a, first through hole 211b, second through hole 212a, first groove 212b, second groove 220, spacer block 230, annular convex block 300, second heat dissipation plate 311, first pin fin 312, second pin fin 320, connecting groove 330, annular clamping groove 340, concave hole 410, liquid inlet pipe 420, liquid outlet pipe 431, metal block 432a, tower head 432b, base 433, connecting nut 500 and heat conduction elastic piece.
Description of the embodiments
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
Next, a chip heat sink according to an embodiment of the present invention is described.
As shown in fig. 1 to 5, the heat sink according to the embodiment of the invention includes a first heat dissipation plate 200, a second heat dissipation plate 300, a liquid inlet pipe 410 and a liquid outlet pipe 420.
First, the first heat sink 200 is explained. The middle part of the first heat dissipation plate 200 is convex upward to form a groove body 210, the opening of the groove body 210 faces downward, a strip-shaped spacer 220 is formed in the groove body 210, two ends of the spacer 220 are at a preset distance from the side wall of the groove body 210, a straight line is formed along the extending direction of the spacer 220, the top wall of the groove body 210 is divided into a first area plate and a second area which do not comprise the spacer 220, a first through hole 211a is formed in the middle part of the first area of the top wall, and a second through hole 211b is formed in the middle part of the first area of the top wall.
The groove body 210 can be divided into a first division groove and a second division groove by the spacer 220, and the first division groove and the second division groove communicate with a gap between the side walls of the groove body 210 by the spacer 220. The first and second through holes 211a and 211b can facilitate inflow and outflow of the cooling liquid.
Next, the second heat sink 300 is described. The second heat dissipation plate 300 is connected to the first heat dissipation plate 200 and covers the opening of the slot body 210, the slot body 210 and the second heat dissipation plate 300 cooperate to form a cavity, a plurality of first PIN FINs (PIN-FIN) 311 and a plurality of second PIN FINs (PIN-FIN) 312 are formed on a first surface of the second heat dissipation plate 300, which is close to the first heat dissipation plate 200, and are arranged at intervals, the top ends of the first PIN FINs 311 are connected to a first area of the top wall, the top ends of the second PIN FINs 312 are connected to a second area of the top wall, the spacer 220 is connected to the first surface, and a second surface of the second heat dissipation plate 300, which is far away from the first heat dissipation plate 200, is used for being connected to a chip to dissipate heat of the chip.
The first heat dissipation plate 200 and the second heat dissipation plate 300 may be connected by vacuum brazing, laser welding, or fastening. The first heat dissipation plate 200 is connected with the second heat dissipation plate 300, that is, the second heat dissipation plate 300 is connected with the bottom end of the groove body 210 and the bottom end of the partition block 220, so that a first partition cavity and a second partition cavity are formed, and a first gap and a second gap between the two ends of the partition block 220 and the side wall of the groove body 210 form a first runner and a second runner which are communicated with the first partition cavity and the second partition cavity.
The plurality of first pin fins 311 on the second surface of the second heat dissipation plate 300 are disposed in the first division chamber at intervals, the tips of the first pin fins 311 are connected to the top wall of the inside of the tank 210, and the plurality of second pin fins 312 on the second surface of the second heat dissipation plate 300 are disposed in the second division chamber at intervals, the tips of the second pin fins 312 are connected to the top wall of the inside of the tank 210. The heat exchange area between the cooling liquid and the second heat dissipation plate can be increased through the first pin fins 311 and the second pin fins 312, so that the heat exchange amount is increased, and the heat dissipation amount of the second heat dissipation plate is further increased. In addition, the cooling liquid passes through the first needling 311 and the second needling 312 areas, so that turbulence is easy to form, the heat exchange capacity is improved, more heat can be taken away, and the heat dissipation requirement of a customer is met.
And the second radiating plate with the pin fin structure can be manufactured by a sampling cold forging process, and has the advantages of low processing difficulty, high strength and good cleanliness. The top area of needle wing is great, can be connected with first heating panel better, and stable in structure is difficult to lodge.
Finally, the inlet pipe 410 and the outlet pipe 420 are described. The liquid inlet pipe 410 is connected to the first through hole 211a to inject the cooling liquid into the chamber. The liquid outlet pipe 420 is connected to the second through hole 211b to discharge the cooling liquid into the chamber.
The liquid inlet pipe 410 and the liquid outlet pipe 420 can be connected with a water chiller, the liquid inlet pipe 410 injects cooling liquid from the water chiller into the chip radiator from the first through hole 211a, and after the cooling liquid dissipates heat of the chip, the liquid outlet pipe 420 returns the cooling liquid to the water chiller, so that the circulating cooling of the chip is realized.
The above chip radiator comprises a first heat radiation plate 200, a second heat radiation plate 300, a liquid inlet pipe 410 and a liquid outlet pipe 420, wherein the first heat radiation plate 200 is connected with the second heat radiation plate 300, namely, the outer edge of the first heat radiation plate 200 and the outer edge of the second heat radiation plate 300 are closed, a groove 210 is formed into a cavity, the cavity is divided into a first divided cavity and a first divided cavity by a partition block 220, the first divided cavity and the first divided cavity are communicated through a first runner and a second runner, a plurality of first pin fins 311 and a plurality of second pin fins 312 are respectively arranged in the first divided cavity and the second divided cavity, the heat exchange area can be increased, the cooling liquid from the liquid inlet pipe 410 is injected into the first divided cavity from the first through hole 211a to the upper part, the downward impact force can be formed on the second heat radiation plate 300, the cooling liquid can quickly impact to the bottom of the second heat radiation plate 300, the bottom part is the hottest cooling liquid (the bottom is closest to the chip, heat exchange with the chip) is carried out, thereby being capable of facilitating the rapid flow of the part of the cooling liquid to the second through holes 211b for discharging, being easy to form turbulence in the process of undershoot of the cooling liquid, being capable of improving the heat exchange coefficient, increasing the heat exchange quantity of the cooling liquid and the second heat dissipation plate, improving the cooling amplitude of the chip, enabling the cooling liquid to enter the first division cavity through the first through holes, flow from the middle part of the first division cavity to the periphery, flow into the first runner and the second runner through gaps among the plurality of first pin fins 311, enter the second division cavity, flow from the periphery of the second division cavity to the middle part, flow into the liquid outlet pipe 420 through gaps among the plurality of second pin fins 312, and leave the chip heat sink, being capable of forming the first division cavity, the second division cavity and the first runner and the second runner which are communicated with the first division cavity and the second division gun through the partition blocks 220, the distance that the increase coolant liquid flows increases the velocity of flow of coolant liquid to increase radiating homogeneity and improve the heat dissipation capacity to the chip, avoid the partial coolant liquid that gets into from first through-hole directly to follow the second through-hole discharge through heat transfer not, the coolant liquid through heat transfer is detained in the inside condition of chip radiator for a long time.
It should be noted that the pin fin described below includes a first pin fin and a second pin fin.
In some embodiments of the present invention, the top wall of the first heat dissipation plate 200 is formed with a first groove 212a and a second groove 212b connecting the first region and the second region, the first groove 212a is located between the first end of the spacer 220 and the first sidewall adjacent to the first end and extends along the length direction of the first sidewall, the second groove 212b is located between the second end of the spacer 220 and the second sidewall adjacent to the second end and extends along the length direction of the second sidewall, and the region of the first surface of the second heat dissipation facing the first groove 212a and the second groove 212b is formed at least partially as a plane.
As shown in fig. 3 and 5, the first and second grooves 212a and 212b are formed at both ends of the top wall of the first heat dissipation plate 200 in the length direction, the lengths of the first and second grooves 212a and 212b are equal to the width of the groove body 210, and a partial region of the second heat dissipation plate 300 facing the first and second grooves 212a and 212b is formed in a plane, i.e., no pin fin is provided. The volumes of the first runner and the second runner in the second split cavity can be increased through the first groove 212a and the second groove 212b, so that the cooling liquid in the first split cavity is rapidly discharged to the second split cavity, the flow resistance is reduced, the situation that the cooling liquid in the first split cavity is retained in the first split cavity due to the fact that the cooling liquid in the first runner and the second runner cannot timely discharge the cooling liquid subjected to heat exchange in the first split cavity is easy to rise in temperature is avoided, the first groove 212a and the second groove 212b are arranged on the inner side of the side wall of the groove body 210 and far away from the middle part of the side wall 210 of the groove body, the middle part corresponds to a region with larger heat quantity in the middle part of the chip, the region of the first groove and the second groove corresponds to the second heat dissipation plate at least partially forms a plane (no needle fin is arranged), the needle fin is concentrated in the middle part of the second heat dissipation plate, and the heat dissipation can be concentrated in the middle part of the chip while the flow resistance is reduced.
In some embodiments of the present invention, an annular groove 330 is formed at an outer edge of the first surface of the second heat dissipation plate 300, an annular protrusion 230 capable of being received in the annular groove 330 and connected to the annular groove 330 is formed at an outer edge of the first heat dissipation plate 200, a connection groove 320 is formed at a position of the second heat dissipation plate 300 corresponding to the spacer 220, the connection groove 320 is capable of receiving a bottom end of the spacer 220, and the first surface of the second heat dissipation plate 300 is connected to the spacer 220 through the connection groove 320.
The annular protrusion 230 of the first heat sink 200 is accommodated in the annular groove 330 of the second heat sink 300, so that the sealing between the tank 210 and the second heat sink 300 can be increased, and the coolant is prevented from flowing out of the chip heat sink. The connecting grooves 320 of the second heat dissipation plate 300 accommodate the bottom ends of the spacer particles 220, so that the cooling liquid is prevented from directly flowing through the gaps between the second heat dissipation plate 300 and the top of the spacer particles 220, and the blocking capability of the spacer particles 220 to the cooling liquid is increased.
In some embodiments of the present invention, the outer edges of the first heat dissipation plate 200 and the second heat dissipation plate 300 are aligned, and the chip heat sink further includes a cover plate 100 and a fastener. The cover plate 100 comprises a hollow part positioned in the middle and a main body part positioned at the periphery of the hollow part, the outer wall of the groove body 210 can protrude out of the hollow part, one side, close to the hollow part, of the main body part is recessed towards the inside to form a step, the step can enclose the outer edge of the second heat dissipation plate 300, the height of the step is lower than the heat dissipation thickness, and the heat dissipation thickness is the total thickness of the first heat dissipation plate 200 and the second heat dissipation first heat dissipation plate 200 after the second heat dissipation plate 300 is overlapped. The fastener passes through the main body part and is connected with the chip or the fixing mechanism of the chip.
As shown in fig. 2, in the process of mounting the chip radiator, the first heat dissipation plate 200 and the second heat dissipation plate 300 are covered on the surface of the chip, the cover plate 100 is covered on the upper surface of the first heat dissipation plate 200, the step of the cover plate 100 is attached to the edge of the first heat dissipation plate 200, the top of the groove 210 of the first heat dissipation plate 200 protrudes out of the hollowed-out portion of the first heat dissipation plate 200, the fastener penetrates through the main body portion of the cover plate 100 to be connected with the chip or the fixing mechanism of the chip, and the step is lower than the heat dissipation thickness, so that the lower surface of the second heat dissipation plate 300 protrudes downwards out of the lower surface of the cover plate 100, thereby enabling the lower surface of the second heat dissipation plate 300 to be sufficiently attached to the chip, and avoiding the situation that the chip and the second heat dissipation plate 300 have gaps, resulting in low heat dissipation efficiency. In addition, the chip radiator and the chip can be detachably connected, so that the chip radiator is convenient to maintain and replace.
Further, the fastener includes a plurality of fasteners spaced around the outer edge of the body portion, each fastener including a bolt and a spring. The shank of the bolt passes through the cover plate 100 and is screwed with the chip or the fixing mechanism of the chip. The spring encloses the shank of the bolt and is located between the head of the bolt and the cover plate 100.
As shown in fig. 1, the rod portion threads of the bolt sleeved with the spring penetrate through the edge threads of the cover plate 100 to be connected with the chip or the fixing mechanism of the chip, the head portion of the bolt is tightly pressed against the cover plate 100 through the spring, friction force between the cover plate 100 and the spring can be increased, loosening of the bolt in the using process is avoided, time and force required by installing and detaching of the bolt can be reduced, and workload is reduced.
In some embodiments of the present invention, the chip radiator includes two heat dissipation connectors, and the liquid inlet pipe 410 and the liquid outlet pipe 420 are respectively connected to the first through hole 211a and the second through hole 211b through the two heat dissipation connectors, where the heat dissipation connectors include a metal block 431, a pagoda connector and a connection nut 433. The heat dissipation joint is connected to the first through hole 211a or the second through hole 211b through a first end of the metal block 431, and a first channel which is in butt joint with the first through hole 211a or the second channel is formed in the metal block 431. The tower joint is connected with the second end of the metal block 431, a second through passage is formed in the middle of the tower joint, the first passage is communicated with the second through passage, the tower joint comprises a tower head 432a and a base 432b connected with the bottom of the tower head 432a, the base 432b is provided with external threads, the liquid inlet pipe 410 and the liquid outlet pipe 420 are hoses, and the heat dissipation joint is connected with the hoses through the tower head 432a of the tower joint. The connection nut 433 encloses the pagoda joint and is screwed with the base 432b of the pagoda joint.
As shown in fig. 1 and 6, the heat dissipation joint includes a first heat dissipation joint and a second heat dissipation joint. The liquid inlet pipe 410 is connected with the first through hole 211a through a first heat dissipation joint, the liquid outlet pipe 420 is connected with the second through hole 211b through a second heat dissipation joint, and the structures of the first heat dissipation joint and the second heat dissipation joint are identical. Taking the second heat dissipation joint as an example, the metal block 431 is connected with the second through hole 211b, the cooling liquid flows into the first channel of the metal block 431 from the second through hole 211b, the metal block 431 is connected with the tower joint, the cooling liquid flows into the second channel of the tower joint from the first channel, the port of the liquid outlet pipe 420 surrounds the tower head 432a of the tower joint, the cooling liquid flows into the liquid outlet pipe 420 from the second channel, and therefore the cooling liquid can be discharged, the connecting nut 433 is in threaded connection with the base 432b of the tower joint, the liquid outlet pipe 420 can be tightly pressed, gaps between the liquid outlet pipe 420 and the tower head 432a are avoided, and the tightness of the liquid outlet pipe 420 and the heat dissipation joint is improved. Therefore, the liquid inlet pipe 410 and the liquid outlet pipe 420 can be respectively and smoothly butted with the first through hole 211a and the second through hole 211b through the heat dissipation joint, so that the tightness is improved, and the outflow of the cooling liquid is avoided.
Moreover, the liquid inlet pipe 410 and the liquid outlet pipe 420 are hoses, so that the bending resistance of the liquid inlet pipe 410 and the liquid outlet pipe 420 can be increased, the arrangement simplicity of the liquid inlet pipe 410 and the liquid outlet pipe 420 is improved, and the cost is lower.
In some embodiments of the present invention, the end face of the top of the pin fin is formed as a polygon, a circle, or an ellipse.
That is, the pin fin is formed as a cylinder, and the end face of the top is polygonal (triangle, rectangle, pentagon, octagon, etc.). It should be noted that the above is only an alternative example, and any end-face-shaped pin fin should be understood to be within the scope of the present invention.
Further, the top wall of the slot 210 is rectangular, the spacer 220 is disposed along the length direction or the width direction of the rectangle, the first distance between the two ends of the spacer and the side wall of the slot 210 is equal, the end face of the top of the pin fin is square, the diagonal direction of the square is the length direction or the width direction of the rectangle, and the length of the side length of the square is equal to the second distance between the adjacent pin fins.
As shown in fig. 3, the top wall of the groove 210 forms a rectangle, the spacer 220 is arranged along the length direction of the rectangle, the top of the pin fin forms a square, the square at the top end of the pin fin is convenient to be connected with the first heat dissipation plate 200, and the rectangular pin fin bears the consistent impact capability of the cooling liquid with four surfaces, and has higher strength and longer service life. One of the two diagonal lines of the square is consistent with the rectangular length direction of the tank body 210, and the other diagonal line is perpendicular to the rectangular length direction of the tank body 210.
The main flow direction of the cooling liquid is from the middle part of the first dividing cavity to the first flow channel and the second flow channel along the length direction of the groove body 210, and then flows from the first flow channel and the second flow channel to the middle part of the second dividing cavity along the length direction of the groove body 210, and the cooling liquid passes through the inclined plane forming an angle of 45 degrees with the main flow direction from the edge along the side surface of the cuboid-shaped pin fin.
Optionally, the length of the side length of the square is equal to the second distance between adjacent pin fins.
This can uniformly increase the heat exchange area and reduce the flow resistance of the coolant.
In some embodiments of the present invention, the second heat dissipation plate 300 is formed with a plurality of concave holes 340 recessed inward along portions of the second surface thereof corresponding to the pin fins, and the concave holes 340 extend into the inside of the pin fins and extend to the vertically middle portions of the pin fins. The chip radiator further comprises a plurality of heat conduction elastic pieces 500, the heat conduction elastic pieces 500 are in one-to-one correspondence with the concave holes 340, the heat conduction elastic pieces 500 are arranged in the concave holes 340 and can protrude out of openings of the concave holes 340, and when the second radiating fin is connected with the chip, the bottom ends of the heat conduction elastic pieces 500 can be contracted to the position flush with the second surface.
As shown in fig. 7, in the process of attaching the second surface of the second heat sink 300 to the chip, particularly, the larger chip and the larger chip heat sink, there are more or less minute gaps in a partial region between the second heat sink 300 and the chip, and the effect of these minute gaps on heat dissipation is also relatively large, and also minute looseness that easily occurs after the fastener is used for a long time is easily caused by the fastener connecting the second heat sink 300 and the chip.
The concave hole 340 is formed on the second surface of the second heat dissipation plate 300, and the heat conduction elastic member 500 is arranged in the concave hole 340, before the second heat dissipation plate 300 contacts with the chip, the heat conduction elastic member 500 can protrude out of the opening of the concave hole 340, after the second heat dissipation plate 300 contacts with the chip, the heat conduction elastic member 500 can shrink, at the position where the second heat dissipation plate 300 fully contacts with the chip, the heat conduction elastic member 500 shrinks to the position where the first surface is flush, and at the position where the second heat dissipation plate 300 has a gap with the chip, the heat conduction elastic member can directly contact with the chip through the gap.
The heat conductive elastic member 500 can conduct heat, so that the low temperature of the second surface of the chip radiator can be transferred to the chip to radiate the chip, and even if a gap exists between the chip and the second heat radiation plate 300, the chip can be radiated, so that the stability of radiating the chip is improved.
Moreover, the top end of the concave hole 340 passes through the second surface and the first surface of the second heat dissipation plate 300 to the middle part of the pin fin, so that the concave hole 340 has a deeper depth, and the length of the heat conduction elastic member 500 is increased, and the telescopic length of the heat conduction elastic member 500 is increased, so that the heat conduction elastic member 500 can be in contact with the chip under the gap between the larger chip and the second heat dissipation plate 300. The concave-convex is arranged at the position corresponding to the pin fin (the thickness of the position is thicker), compared with other positions (the thickness of the position is thinner), the influence on the strength of the second heat dissipation plate 300 can be reduced, and the processing difficulty is reduced.
Further, the heat conductive elastic member 500 is a graphene column or a heat conductive silica gel column.
Graphene and heat conduction silica gel have higher heat conduction ability, especially graphene, and heat conduction ability can be higher than the metal, and have better elasticity, and the graphene cylinder is extruded shrink in-process by length direction, then expands in its radial, can fully contact with shrinkage pool 340 to increase heat conduction efficiency.
It should be noted that the above is only an alternative example, and the heat conductive elastic member 500 may be a metal column with a spring, which is understood to be within the scope of the present invention.
The foregoing is only illustrative of the present invention and is not to be construed as limiting thereof, but rather as various modifications, equivalent arrangements, improvements, etc., within the spirit and principles of the present invention.
Claims (9)
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| CN202310959787.3A CN116864466B (en) | 2023-08-02 | 2023-08-02 | A chip radiator |
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| CN111918520A (en) * | 2019-05-08 | 2020-11-10 | 华为技术有限公司 | Heat sink and heat radiator |
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| US6525420B2 (en) * | 2001-01-30 | 2003-02-25 | Thermal Corp. | Semiconductor package with lid heat spreader |
| CN104201158A (en) * | 2014-08-28 | 2014-12-10 | 中国电子科技集团公司第二十九研究所 | Integrated cooling device of silicon-based micro-channel radiator |
| CN106252309B (en) * | 2016-09-26 | 2020-06-26 | 北京无线电测量研究所 | Micro-channel liquid cooling radiator and cold conducting plug-in unit for high heat flux chip |
| JP7091103B2 (en) * | 2018-03-23 | 2022-06-27 | 昭和電工株式会社 | Cooling system |
| CN115437481A (en) * | 2022-08-29 | 2022-12-06 | 苏州浪潮智能科技有限公司 | A heat dissipation cold plate and a flexible cold plate heat dissipation device |
| CN219372920U (en) * | 2022-11-16 | 2023-07-18 | 深圳市英维克科技股份有限公司 | Microchannel phase-change cooling radiator |
| CN219322866U (en) * | 2022-12-30 | 2023-07-07 | 福思(杭州)智能科技有限公司 | Liquid cooling heat radiator |
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