CN116860091A - High-density server and wind-liquid comprehensive heat dissipation framework thereof - Google Patents

Abstract

The invention discloses a wind-liquid integrated heat dissipation framework, which comprises a fan arranged in a server case, a main board, a processor mounting groove arranged on the back surface of the main board, a plurality of accessory mounting grooves arranged on the surface of the main board, and a liquid cooling plate arranged in the server case, wherein the main board is arranged on the liquid cooling plate, and the processor mounting groove is kept in contact with the liquid cooling plate. So, central processing unit and appurtenance are located the mainboard both sides respectively, and the fan is exclusively used in carrying out forced air cooling heat dissipation to each appurtenance, and the liquid cooling board is direct to keep contacting with the processor mounting groove simultaneously, is exclusively used in carrying out the liquid cooling heat dissipation to central processing unit, need not additionally to set up the heat conduction pipeline, ensures heat dispersion and calorific capacity assorted, can be on the basis that satisfies the heat dissipation demand of server subassembly, and the occupation to the machine case space is reduced as far as possible, improves server system integration simultaneously. The invention also discloses a high-density server, which has the beneficial effects as described above.

Description

A high-density server and its integrated air-liquid cooling architecture

Technical field

The invention relates to the technical field of servers, and in particular to a wind-liquid integrated heat dissipation architecture. The invention also relates to a high-density server.

Background technique

With the development of China's electronic technology, more and more electronic devices have been widely used.

Servers are an important part of electronic equipment and are devices that provide computing services. Since the server needs to respond to service requests and process them, the server should have the ability to undertake services and guarantee services. According to the different types of services provided by the server, it is divided into file server, database server, application server, web server, etc. The main components of the server include processor, hard disk, memory, system bus, etc., which are similar to general computer architecture.

At present, the configuration and performance of electronic equipment such as servers are becoming more and more powerful, and the demand for heat dissipation performance is also getting higher and higher. Taking servers as an example, conventional heat dissipation measures are usually to install multiple cooling fans side by side at the front or rear end of the server chassis. Each cooling fan operates simultaneously to provide air cooling for each heating component in the server. Among them, the amount of heat generated is relatively high. The largest component is the CPU, while other ancillary components of the CPU, such as memory, hard drives, PCIE boards, etc., generate less heat. As the air-cooling efficiency of servers has reached its limit and is gradually unable to meet the heat dissipation needs of servers, liquid cooling technology with higher heat dissipation efficiency must be used, such as the popular cold plate liquid cooling technology.

In the existing technology, some servers use liquid cooling plates to dissipate heat from various heating components on the motherboard. Directly replacing the traditional air-cooling radiator system architecture with liquid cooling plates can not only improve heat dissipation performance, but also eliminate the need for air cooling. radiator, thus also saving some space in the chassis. However, as the demand for high-density servers increases, although the air-cooling radiator is omitted, the heat-conducting pipelines between the liquid cooling plate and each heating component are still retained. The heat-conducting pipelines need to be used to connect the CPU and its accessories. The heat of the components is transferred to the liquid cooling plate, and these heat pipes occupy part of the vertical space in the chassis, which is not conducive to the planning and layout of server components on the motherboard, and is not conducive to improving system integration.

Therefore, how to minimize the occupation of chassis space while improving the integration of server systems on the basis of meeting the heat dissipation requirements of server components is a technical problem faced by those skilled in the art.

Contents of the invention

The purpose of the present invention is to provide an integrated air-liquid heat dissipation architecture that can minimize the occupation of chassis space and improve the integration of server systems on the basis of meeting the heat dissipation requirements of server components. Another object of the present invention is to provide a high-density server.

In order to solve the above technical problems, the present invention provides a wind-liquid integrated heat dissipation architecture, which includes a fan installed in a server chassis, a motherboard, a processor installation slot provided on the back of the motherboard, and multiple heat sinks provided on the surface of the motherboard. An accessory installation slot and a liquid cooling plate installed in the server chassis, the motherboard is installed on the liquid cooling plate, and the processor installation slot remains in contact with the liquid cooling plate.

Preferably, a relief groove is provided on the liquid cooling plate to accommodate the processor installation slot and the central processor installed in the processor installation slot.

Preferably, the bottom surface of the relief groove is in close contact with the top surface of the CPU, and the side wall of the relief groove is in close contact with the side surface of the CPU.

Preferably, at least two escape grooves are provided on the liquid cooling plate, each escape groove is distributed along the length direction of the liquid cooling plate, and there is a gap between two adjacent escape grooves. Create a predetermined space to install the motherboard.

Preferably, a meandering flow channel is provided in the liquid cooling plate, and the portions of the meandering flow channel corresponding to each of the relief grooves are more tortuous.

Preferably, a water inlet and a water outlet are connected to the side wall of the liquid cooling plate. The water inlet is connected to one end of the meandering flow channel, and the water outlet is connected to the other end of the meandering flow channel.

Preferably, it also includes a water collector, and both the water inlet and the water outlet are connected to the water collector.

Preferably, the notches of each accessory mounting slot are oriented in the vertical direction.

Preferably, the back side of the mainboard is detachably connected to the surface of the liquid cooling plate.

The present invention also provides a high-density server, including a server chassis and a wind-liquid comprehensive heat dissipation architecture installed in the server chassis, wherein the wind-liquid comprehensive heat dissipation architecture is specifically the wind-liquid comprehensive heat dissipation architecture described in any one of the above. architecture.

The wind-liquid integrated heat dissipation architecture provided by the present invention mainly includes a fan, a motherboard, a processor mounting slot, an accessory mounting slot and a liquid cooling plate. Among them, the fan is installed in the server chassis, usually on one side of the server chassis, and is mainly used to dissipate heat of related server components through air cooling. The motherboard is also installed in the server chassis and is mainly used to install the central processor and its ancillary components. The processor installation slot is provided on the motherboard and is specifically located on the back of the motherboard. It is mainly used to install the central processor and form a signal connection between the central processor and the motherboard. Accessory installation slots are also provided on the motherboard, and there are multiple accessory installation slots at the same time. They are mainly used to install various accessory components of the central processor, such as hard drives, memory, PCIE cards, etc. Different from the processor installation slots, each accessory installation slot The slots are all set on the surface of the motherboard, that is, the processor installation slot and the accessory installation slots are respectively set on both sides of the motherboard to separate the central processor that generates more heat from the other accessory components that generate less heat on the motherboard. Come on. The liquid cooling plate is installed in the server chassis, with coolant circulating in it, and the motherboard is installed on the liquid cooling plate, and the back of the motherboard faces the liquid cooling plate so that the processor installation slot provided on the back of the motherboard remains in contact with the liquid cooling plate. , so that the liquid cooling plate can directly cool the central processor installed in the processor installation slot, so that the liquid cooling method with better heat dissipation performance can be applied to the central processor with larger heat dissipation; accordingly, For accessory components that generate less heat, since the liquid cooling plate does not maintain contact with the accessory installation slots provided on the surface of the motherboard (nor is it connected through heat conduction pipelines), the liquid cooling capacity of the liquid cooling plate is not distributed to each accessory. Instead, the accessory components installed in these accessory mounting slots are air-cooled and dissipated by fans. In this way, the wind-liquid integrated heat dissipation architecture provided by the present invention separates the central processor and the heat sink that generate a large amount of heat by arranging the processor mounting slot on the back of the motherboard and retaining each accessory mounting slot on the surface of the motherboard. Accessory components with low heat are spaced apart on both sides of the motherboard, so that the fan is dedicated to air cooling and dissipating each accessory component, while the liquid cooling plate is dedicated to liquid cooling the central processor to ensure heat dissipation performance and heat generation. Matching; compared with the existing technology, since the liquid cooling plate is in direct contact with the processor installation slot, there is no need to set up additional heat conduction pipelines, and the liquid cooling plate only liquid-cools the central processor, and other ancillary components naturally also There is no need to set up additional heat pipes to connect to the liquid cooling plate; and because the processor installation slot is set to the back of the motherboard, there is more installation space on the front of the motherboard, which is more conducive to the installation and planning of various ancillary components. More conducive to integrated installation of multiple components. To sum up, the wind-liquid integrated heat dissipation architecture provided by the present invention can minimize the occupation of chassis space and improve the integration of server systems on the basis of meeting the heat dissipation requirements of server components.

Description of the drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only These are embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on the provided drawings without exerting creative efforts.

Figure 1 is a schematic diagram of the overall structure of a specific embodiment provided by the present invention.

Figure 2 is a schematic structural diagram of the central processing unit and the relief slot in close contact.

Figure 3 is a schematic diagram of the surface structure of the main board.

Figure 4 is a schematic diagram of the back structure of the mainboard.

Figure 5 is a schematic diagram of the bottom structure of the liquid cooling plate.

Figure 6 is a schematic structural diagram of the meandering flow channel inside the liquid cooling plate.

Among them, in Figures 1 to 6:

Motherboard - 1, processor installation slot - 2, accessory installation slot - 3, liquid cooling plate - 4, CPU - 5, water distributor - 6, connector - 7;

Avoidance groove - 41, zigzag flow channel - 42, water inlet - 43, water outlet - 44.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

Please refer to FIG. 1 , which is a schematic diagram of the overall structure of a specific embodiment provided by the present invention.

In a specific implementation provided by the present invention, the air-liquid integrated heat dissipation architecture mainly includes a fan, a motherboard 1, a processor mounting slot 2, an accessory mounting slot 3 and a liquid cooling plate 4.

Among them, the fan is installed in the server chassis, usually on one side of the server chassis, and is mainly used to dissipate heat of related server components through air cooling.

As shown in Figure 4, Figure 4 is a schematic structural diagram of the back side of the main board 1.

The motherboard 1 is also installed in the server chassis and is mainly used to install the central processor 5 and its accessory components. The processor installation slot 2 is provided on the motherboard 1 , and is specifically located on the back of the motherboard 1 . It is mainly used to install the central processor 5 and form a signal connection between the central processor 5 and the motherboard 1 .

Accessory installation slots 3 are also provided on the motherboard 1, and there are multiple accessory installation slots 3 at the same time. They are mainly used to install various accessory components of the central processor 5, such as hard drives, memory, PCIE cards, etc., which are different from the processor installation slot 2. , each accessory installation slot 3 is provided on the surface of the motherboard 1, that is, the processor installation slot 2 and each accessory installation slot 3 are respectively provided on both sides of the motherboard 1, so as to separate the central processor 5, which generates a large amount of heat, from the heat-generating central processor 5. The smaller remaining ancillary components are spaced apart on the motherboard 1 .

The liquid cooling plate 4 is installed in the server chassis, with coolant circulating in it, and the motherboard 1 is installed on the liquid cooling plate 4, and the back of the motherboard 1 faces the liquid cooling plate 4, so that the processor installation slot provided on the back of the motherboard 1 2 remains in contact with the liquid cooling plate 4, so that the liquid cooling plate 4 can directly perform liquid cooling on the central processor 5 installed in the processor installation slot 2, so as to apply the liquid cooling method with better heat dissipation performance to the heat generation On the larger central processing unit 5; correspondingly, for the accessory components that generate less heat, the liquid cooling plate 4 does not maintain contact with the accessory mounting slots 3 provided on the surface of the motherboard 1 (nor is it connected through heat conduction pipes) , therefore, the liquid cooling capacity of the liquid cooling plate 4 is not distributed to each accessory component, but the accessory components installed in the accessory mounting groove 3 are air-cooled and dissipated by fans.

In this way, the wind-liquid integrated heat dissipation architecture provided by this embodiment disposes the processor mounting slot 2 on the back of the motherboard 1 while retaining each accessory mounting slot 3 on the surface of the motherboard 1, thereby dissipating large amounts of heat. The central processing unit 5 and the accessory components that generate less heat are spaced apart from each other on both sides of the motherboard 1, so that the fans are dedicated to air cooling and dissipating heat from each accessory component, and the liquid cooling plate 4 is dedicated to cooling the central processor 5. Cold heat dissipation ensures that the heat dissipation performance matches the heat generation.

Compared with the existing technology, since the liquid cooling plate 4 is directly in contact with the processor installation slot 2, there is no need to set up additional heat conduction pipelines, and the liquid cooling plate 4 only liquid-cools the central processor 5, and the other ancillary components are naturally There is no need to set up additional heat pipes to connect to the liquid cooling plate 4; and since the processor installation slot 2 is set to the back of the motherboard 1, there is more installation space on the front of the motherboard 1, which is more conducive to the installation of various accessory components. and planning, and is also more conducive to the integrated installation of multiple components, thereby making the server components on the motherboard 1 more compact, and the size of the motherboard 1 can also become smaller, which is conducive to the miniaturization and lightweight design of the motherboard 1, and can also Reduce material costs.

To sum up, the wind-liquid integrated heat dissipation architecture provided by this embodiment can minimize the occupation of chassis space and improve the integration of server systems on the basis of meeting the heat dissipation requirements of server components.

Considering that when the central processor 5 is installed in the processor installation slot 2, the top surface (or bottom surface) of the central processor 5 will protrude from the back of the motherboard 1, in order to ensure that the back of the motherboard 1 can be stably supported on the liquid cooling plate On the surface of the liquid cooling plate 4, a relief groove 41 is provided on the liquid cooling plate 4 in this embodiment. Specifically, the opening position of the escape groove 41 corresponds to the installation position of the processor installation slot 2 on the back of the motherboard 1, and the relief groove 41 has an appropriate depth and opening size to fully accommodate the processor mounting slot 2 on the back of the motherboard 1. The processor mounting slot 2 and the central processor 5 installed in the processor mounting slot 2 enable the back side of the motherboard 1 to be stably mounted on the surface of the liquid cooling plate 4 .

As shown in FIG. 2 , FIG. 2 is a schematic structural diagram of the central processing unit 5 and the relief slot 41 in close contact.

Furthermore, in order to ensure the liquid cooling efficiency of the central processor 5, in this embodiment, the depth of the escape groove 41 is equivalent to the height of the central processor 5 protruding from the back of the motherboard 1 after being installed in the processor installation groove 2. With this arrangement, after the central processor 5 is installed in the processor installation slot 2, the top surface (or bottom surface) of the central processor 5 will be in close contact with the bottom surface of the escape groove 41, so that the top surface of the central processor 5 Keep in direct contact with the surface of the liquid cooling plate 4.

Similarly, in this embodiment, not only the bottom surface of the escape groove 41 is in close contact with the top surface of the CPU 5, but the side walls of each groove of the relief groove 41 are also in close contact with the side surfaces of the CPU 5. , thereby increasing the contact area between the central processor 5 and the liquid cooling plate 4 and improving the heat dissipation efficiency.

In order to improve system integration, in this embodiment, one liquid cooling plate 4 can be installed with multiple motherboards 1 or accommodate multiple central processors 5 at the same time. For example, one liquid cooling plate 4 can be installed with two motherboards 1 at the same time, which is equivalent to two Integrated installation of two nodes, the liquid cooling plate 4 dissipates heat for the central processors 5 on the two nodes at the same time; or one liquid cooling plate 4 is installed with a mainboard 1, but the mainboard 1 is an expansion board, and two central processors are installed at the same time 5. Equivalent to two CPU nodes, the liquid cooling plate 4 dissipates heat for the two central processors 5 at the same time. Correspondingly, at least two escape grooves 41 are provided on the liquid cooling plate 4 to accommodate each central processor 5 respectively.

As shown in Figure 5, Figure 5 is a schematic diagram of the bottom structure of the liquid cooling plate 4.

Furthermore, in order to reasonably lay out the installation plan of multiple motherboards 1 or multiple central processors 5 on the liquid cooling plate 4, in this embodiment, the liquid cooling plate 4 is specifically a rectangular plate with an enhanced length and size, and at the same time, each space is The slots 41 are evenly or non-uniformly distributed along the length direction of the liquid cooling plate 4 to accommodate multiple CPUs 5 at the same time. Moreover, a preset space needs to be left between two adjacent avoidance slots 41. On the one hand, for multiple motherboards 1, it can avoid interference between two adjacent motherboards 1; on the other hand, for a single motherboard 1 with multiple CPUs, Specifically, the distance between two adjacent escape grooves 41 needs to be equal to the distance between two adjacent processor installation slots 2 to ensure that each central processor 5 can be accurately accommodated in the corresponding relief groove 41 .

As shown in FIG. 6 , FIG. 6 is a schematic structural diagram of the meandering flow channel 42 inside the liquid cooling plate 4 .

In order to improve the heat dissipation effect of the liquid cooling plate 4 on the central processor 5, in this embodiment, a meandering flow channel 42 is provided in the liquid cooling plate 4 to extend the flow of the cooling liquid in the liquid cooling plate 4 through the meandering flow channel 42. Flow paths and flow times. Specifically, considering that the liquid cooling plate 4 only liquid-cools and dissipates heat for the central processor 5, in order to avoid wasting cooling energy, in this embodiment, the meandering flow channel 42 is not consistent in its degree of twists and turns, and is not consistent with each escape groove. The degree of tortuosity at the corresponding parts of 41 is relatively high, so that during the flow of the coolant, most of the cooling energy is concentrated at the positions corresponding to each escapement groove 41, so as to concentrate heat dissipation on each central processor 5 .

In order to facilitate the circulation of the cooling liquid in the liquid cooling plate 4 , in this embodiment, a water inlet 43 and a water outlet 44 are provided on the side wall of the liquid cooling plate 4 . The water inlet 43 is connected to one end of the meandering flow channel 42 , and the water outlet 44 is connected to the other end of the meandering flow channel 42 . With this arrangement, the external coolant can enter the meandering flow channel 42 through the water inlet 43, absorb heat, then flow out from the water outlet 44, enter the radiator for cooling, and then flow back to the liquid cooling plate 4 to form coolant. circular flow.

Furthermore, multiple liquid cooling plates 4 can be installed in the server chassis at the same time, so that multiple motherboards 1 and multiple central processors 5 can be installed at the same time. In order to achieve liquid cooling of each central processor 5 at the same time, it is necessary to simultaneously Each liquid cooling plate 4 provides a sufficient amount of cooling liquid. To this end, a water collector 6 is added in this embodiment. The water distributor 6 is mainly used to provide cooling liquid in a centralized manner and to control the flow of the cooling liquid at the same time. Specifically, the water distributor 6 is divided into a liquid inlet controller and a liquid return controller, and multiple through holes are provided on both the liquid inlet controller and the liquid return controller. Among them, the water inlet 43 of each liquid cooling plate 4 is connected with each through hole on the liquid inlet controller, so that the cooling liquid is diverted through the liquid inlet controller and then flows to each liquid cooling plate 4 at the same time; the outlet of each liquid cooling plate 4 The water port 44 is connected to each through hole on the liquid return controller, so that the cooling liquid that has absorbed heat in each liquid cooling plate 4 can flow back to the liquid return controller respectively, and be uniformly sent to the radiator for heat dissipation.

As shown in Figure 3, Figure 3 is a schematic diagram of the surface structure of the main board 1.

In an optional embodiment of the accessory installation slot 3, considering that after the air-cooling radiator of the central processor 5 is eliminated, there is more vertical installation space in the server chassis. In order to rationally utilize this part of the space, this In the embodiment, the notches of each accessory mounting slot 3 are upward in the vertical direction. With this arrangement, each accessory component will be vertically inserted into each accessory installation slot 3, so that accessory components such as hard disk, memory, PCIE card, etc. are all installed in a vertical state, thereby reducing the occupation of the surface of the motherboard 1. Further improve system integration.

Of course, in addition to the accessory mounting slots 3, various connectors 7 are generally provided on both sides of the surface of the motherboard 1. The sockets of the connectors 7 also face upward in the vertical direction, so that various accessories can be inserted vertically. Kind of cable.

In order to facilitate the disassembly and assembly operations of the mainboard 1 and the liquid cooling plate 4, in this embodiment, a detachable connection is formed between the back side of the mainboard 1 and the surface of the liquid cooling plate 4. For example, the mainboard 1 and the liquid cooling plate 4 can be detachably connected. Threaded connection is achieved through several bolts and other fasteners, or a snap-on connection is formed with the mainboard 1 through snap-in slots on the liquid cooling plate 4 .

This embodiment also provides a high-density server, which mainly includes a server chassis and a wind-liquid comprehensive heat dissipation architecture installed in the server chassis. The wind-liquid comprehensive heat dissipation architecture is the same as the above-mentioned related content and will not be described again here.

The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be practiced in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A wind-liquid integrated heat dissipation architecture, which includes a fan installed in a server chassis, and is characterized in that it also includes a motherboard (1), a processor installation slot (2) provided on the back of the motherboard (1), A plurality of accessory mounting slots (3) on the surface of the mainboard (1), a liquid cooling plate (4) installed in the server chassis, the mainboard (1) is installed on the liquid cooling plate (4), And the processor installation groove (2) is kept in contact with the liquid cooling plate (4). 2. The air-liquid integrated heat dissipation architecture according to claim 1, characterized in that a relief groove (41) is provided on the liquid cooling plate (4) to accommodate the processor installation groove (2) and the installation space. The central processor (5) in the processor installation slot (2). 3. The wind-liquid integrated heat dissipation architecture according to claim 2, characterized in that the bottom surface of the escape groove (41) is in close contact with the top surface of the central processing unit (5), and the escape groove (41) is in close contact with the top surface of the central processing unit (5), and the escape groove (41) is The side wall of the groove (41) is in close contact with the side surface of the central processing unit (5). 4. The air-liquid integrated heat dissipation architecture according to claim 3, characterized in that at least two escape grooves (41) are provided on the liquid cooling plate (4), and each escape groove (41) ) are distributed along the length direction of the liquid cooling plate (4), and a preset space is left between two adjacent escape grooves (41) for installing the mainboard (1). 5. The air-liquid integrated heat dissipation architecture according to claim 4, characterized in that a meandering flow channel (42) is provided in the liquid cooling plate (4), and the meandering flow channel (42) is connected to each location. The parts corresponding to the escape grooves (41) are more tortuous. 6. The air-liquid integrated heat dissipation architecture according to claim 5, characterized in that a water inlet (43) and a water outlet (44) are connected on the side wall of the liquid cooling plate (4), and the water inlet (44) 43) is connected with one end of the meandering flow channel (42), and the water outlet (44) is connected with the other end of the meandering flow channel (42). 7. The wind-liquid integrated heat dissipation architecture according to claim 6, further comprising a water collector (6), the water inlet (43) and the water outlet (44) are connected with the water collector (6). Water vessel (6) is connected. 8. The wind-liquid integrated heat dissipation structure according to claim 1, characterized in that the slots of each accessory mounting slot (3) are all oriented in the vertical direction. 9. The air-liquid integrated heat dissipation architecture according to claim 1, characterized in that the back surface of the mainboard (1) and the surface of the liquid cooling plate (4) form a detachable connection. 10. A high-density server, including a server chassis and a wind-liquid comprehensive heat dissipation architecture installed in the server chassis, characterized in that the wind-liquid comprehensive heat dissipation architecture is specifically described in any one of claims 1-9 Fengliu integrated cooling architecture.