CN116924318A - Chip module, flow sensor packaging structure and preparation method of flow sensor packaging structure - Google Patents

Abstract

The invention provides a chip module, which is characterized by comprising: a substrate; the groove is positioned on the upper surface of the substrate; the chip is arranged in the groove and is bonded with the groove through a first colloid; wherein the first colloid comprises a biocompatible material. According to the invention, the chip and the bottom of the groove are bonded by adopting the first colloid with biocompatibility, and the first colloid with biocompatibility can be compatible with biological or medical liquid reagents, so that unnecessary biological or chemical reactions are reduced, and the measurement accuracy and stability of the flow sensor can be ensured.

Description

Chip module, flow sensor packaging structure and preparation method of flow sensor packaging structure

Technical Field

The disclosure relates to the technical field of semiconductors, in particular to a flow sensor packaging structure and a preparation method thereof.

Background

The flow sensor is used as a functional device, the flowing process can be mastered by measuring the flow, the automation of production is realized, the possible problems of control are solved, the production efficiency is improved, the energy loss is reduced, and the flow sensor has very important application in a plurality of fields. In recent years, the biological and medical fields are vigorously developed, and the requirements for liquid tests in the biological and medical fields are gradually increased. Because of the specificity of the test liquid in the medical field, biological and chemical reactions are easy to occur in the contact area of the traditional liquid flow sensor and the test liquid, so that the problems of inaccurate and unstable test results are easy to cause, and even the damage of the flow sensor can be caused. Therefore, the liquid flow sensor on the market at present can be used in the medical field rarely, and is difficult to meet the liquid test requirements in the biological and medical fields.

In order to solve the problems in the background art, the application provides a chip module, a flow sensor packaging structure and a preparation method thereof.

Disclosure of Invention

In view of the above, the embodiment of the application provides a chip module, a flow sensor package structure and a manufacturing method thereof.

According to a first aspect of an embodiment of the present application, there is provided a chip module including:

a substrate;

the groove is positioned on the upper surface of the substrate;

the chip is arranged in the groove and is bonded with the groove through a first colloid; wherein,

the first colloid comprises a biocompatible material.

In some embodiments, the first glue comprises glue or solid paste.

In some embodiments, the chip includes a substrate, an insulating film, and a heating resistor between the substrate and the insulating film, where a cavity is further disposed on the substrate, and the cavity is correspondingly located below the heating resistor.

In some embodiments, the chip module further comprises: and the glue overflow prevention grooves are arranged on the back surface of the chip and positioned on two sides of the cavity.

In some embodiments, the chip module further comprises:

At least one substrate welding spot arranged on the upper surface of the substrate;

at least one chip welding spot arranged on the chip, wherein the substrate welding spot is connected with the chip welding spot through a lead, and the lead is wrapped by a lead protection layer; wherein,

the lead includes a biocompatible metal material and the lead protection layer includes a biocompatible insulating material.

According to a second aspect of the embodiments of the present application, there is further provided a flow sensor package structure including the chip module set according to any one of the preceding embodiments, wherein the flow sensor package structure further includes: the runner shell comprises a main runner shell, a first runner shell and a second runner shell, wherein the first runner shell and the second runner shell are positioned on two sides of the main runner shell, and a window and a filling layer for filling the window are arranged on the main runner shell; the main runner shell and the substrate form a closed cavity as a main runner, and in the projection along the vertical direction, the projection of the main runner shell at least covers the projection of the groove along the vertical direction.

In some embodiments, the primary flowpath shell is bonded to the substrate by a second gel comprising a biocompatible material.

In some embodiments, the first gel, the second gel, and the lead finish have different viscosities and/or flowabilities.

In some embodiments, a surface of the substrate in contact with the main channel housing is provided with a substrate coating layer, the substrate coating layer comprising a first coating layer and a second coating layer, the second coating layer covering an inner surface of the groove, the first coating layer covering a surface outside the substrate groove region, wherein a projection of the coating layer in a vertical direction covers a projection of the main channel in a vertical direction, the substrate coating layer comprising a biocompatible metal material.

In some embodiments, the upper surface of the chip is further provided with a chip coating layer comprising a biocompatible metallic material.

According to a third aspect of an embodiment of the present application, there is provided a method for manufacturing a flow sensor package structure, the method including:

providing a chip and a substrate, wherein a groove is formed in the upper surface of the substrate;

bonding the chip in the groove through a first colloid; wherein,

the first colloid comprises a biocompatible material.

In some embodiments, when the first gel comprises glue; bonding the chip in the groove through a first colloid comprises the following steps:

The first colloid is dotted around the bottom of the groove;

the chip is placed above the first colloid by a mechanical arm;

and curing the first colloid.

In some embodiments, when the first gel comprises a solid state paste, the providing the chip comprises:

attaching a solid paste to the back of a wafer, the wafer comprising at least one chip;

cutting the wafer and the solid-state bonding to obtain a stack of at least one separated chip and the solid-state bonding;

bonding the chip in the groove through a first colloid comprises the following steps:

the laminated layers are stuck in the grooves by a manipulator with a heating device, and the heating device heats the solid sticking while sticking so as to temporarily melt the solid sticking;

and solidifying the melted solid paste.

In some embodiments, the substrate further comprises at least one substrate bond pad, the die comprises at least one die bond pad, and after bonding the die within the recess, the method further comprises:

bonding wires, namely electrically connecting the welding spots of the substrate with the welding spots of the chip one by one through leads;

spraying glue on the lead to form a lead protection layer wrapping the lead;

Filling gaps between the chips and the grooves by using filling colloid so that the upper surfaces of the chips are flush with the upper surfaces of the grooves;

solidifying the filling colloid;

providing a runner housing;

bonding the runner shell with the upper surface of the substrate through a second colloid, wherein the runner shell covers the groove and part of the upper surface of the substrate; wherein,

the material of the filling colloid, the second colloid and/or the lead protection layer comprises a biocompatible material.

In some embodiments, the runner housing comprises a main runner housing, and a first runner housing and a second runner housing which are positioned at two sides of the main runner housing, wherein a window is arranged on the main runner housing;

bonding the runner housing with the upper surface of the substrate through a second glue, wherein the runner housing covers the groove and part of the upper surface of the substrate, and the method comprises the following steps:

applying a second gel to a region of the primary flowpath shell to be bonded to the substrate;

passing the lead through the window;

attaching the flow channel housing to an upper surface of the substrate;

solidifying the second colloid;

coating and sealing the window by glue;

Glue is coated on the joint of the main runner shell and the substrate again by using glue;

and (5) heating and curing the glue.

In some embodiments, the second glue is a solid paste, and the area to be applied to the runner housing to be in contact with the upper surface of the substrate includes:

providing a rolled solid adhesive film, wherein the rolled solid adhesive film comprises a rolled base film, a plurality of solid adhesives which are separately arranged on the rolled base film and a protective film which is separately arranged on the solid adhesives, and the size of the protective film is larger than that of the solid adhesives;

separating the solid paste from the rolled bottom film by using a mechanical arm;

applying the solid paste to the main runner housing with a suction nozzle;

stripping the protective film by using a mechanical arm;

and applying the main runner housing with the solid state adhesive to the upper surface of the substrate.

In the embodiment of the application, the chip and the bottom of the groove are bonded by adopting the first colloid with biocompatibility, and the first colloid with biocompatibility can be compatible with biological or medical liquid reagents, so that unnecessary biological or chemical reactions are reduced, and the measurement accuracy and stability of the flow sensor can be ensured.

Drawings

FIG. 1 is a schematic vertical cross-section of a flow sensor package structure according to an embodiment of the present application;

fig. 2 is a schematic top view of a substrate and a chip in a package structure according to an embodiment of the present application;

FIG. 3 is an enlarged schematic diagram of a chip structure according to an embodiment of the present application;

FIG. 4 is a schematic vertical cross-section along the AA direction of a chip according to an embodiment of the present application;

FIG. 5 is a schematic vertical cross-section of the package structure in an embodiment in which the first encapsulant is glue;

FIG. 6 is a schematic vertical cross-section of a package structure in an embodiment in which the first encapsulant is applied by solid state bonding;

FIG. 7 is a schematic top view of a flow sensor package structure according to an embodiment of the present application;

FIG. 8 is a flowchart of a method for manufacturing a flow sensor package structure according to an embodiment of the present application;

fig. 9a-13 are block diagrams corresponding to each step in the preparation method of the flow sensor package structure according to the embodiment of the present application.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the application are shown in the drawings, it should be understood that the application may be embodied in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the application may be practiced without one or more of these details. In other instances, well-known features have not been described in detail so as not to obscure the application; that is, not all features of an actual implementation are described in detail herein, and well-known functions and constructions are not described in detail.

In the drawings, the size of layers, regions, elements and their relative sizes may be exaggerated for clarity. Like numbers refer to like elements throughout.

It will be understood that when an element or layer is referred to as being "on" … …, "" adjacent to "… …," "connected to" or "coupled to" another element or layer, it can be directly on, adjacent to, connected to or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on" … …, "" directly adjacent to "… …," "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application. When a second element, component, region, layer or section is discussed, it does not necessarily mean that the first element, component, region, layer or section is present.

Spatially relative terms, such as "under … …," "under … …," "below," "under … …," "above … …," "above," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "under … …" and "under … …" may include both an upper and a lower orientation. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.

In order to provide a thorough understanding of the present application, detailed steps and detailed structures will be presented in the following description in order to explain the technical solution of the present application. Preferred embodiments of the present application are described in detail below, however, the present application may have other embodiments in addition to these detailed descriptions.

The flow sensor is used as a functional device, the flowing process can be mastered by measuring the flow, the automation of production is realized, the possible problems of control are solved, the production efficiency is improved, the energy loss is reduced, and the flow sensor has very important application in a plurality of fields. However, the liquid flow sensors currently on the market are rarely available in the medical field. Therefore, how to optimize the flow sensor to improve its application effect in the biological field is an important research direction.

Based on this, an embodiment of the present application provides a chip module, referring to fig. 1 specifically, as shown in fig. 1, the module includes:

a substrate 101;

a groove 102, wherein the groove 102 is positioned on the upper surface of the substrate 101;

the chip 103 is arranged in the groove 102, and is adhered to the groove 102 through a first colloid 107; wherein,

The first colloid 107 comprises a biocompatible material.

According to the embodiment of the application, the chip 103 and the bottom of the groove 102 are bonded by adopting the biocompatible first colloid 107, and the biocompatible first colloid 107 can be compatible with biological or medical liquid reagents, so that unnecessary biological or chemical reactions are reduced, and the measurement accuracy and stability of the flow sensor can be ensured.

In actual operation, the substrate 101 includes, but is not limited to, a PCB substrate, a semiconductor substrate, a ceramic substrate, or the like; the chip 103 may be a sensor chip including, but not limited to, a MEMS flow sensor chip or the like. The recess 102 may be formed in the middle of the substrate 101 for mounting the chip 103, and the recess 102 may be in a regular shape, for example, including but not limited to a rectangle or square.

Here, the groove 102 may be formed by a plurality of machining processes such as drilling, milling, grinding, etc. The recess 102 is sized to fit the size of the chip 103. In some embodiments, the recess 102 is rectangular, the length of the recess 102 is 30-60 microns greater than the length of the die 103, the width of the recess 102 is 30-60 microns greater than the width of the die 103, and the depth of the recess 102 is 30-60 microns greater than the thickness of the die 103, e.g., the length, width, and depth of the recess 102 are 35 microns, 45 microns, 50 microns, or 55 microns greater than the length, width, and thickness of the die 103, respectively. In a specific embodiment, the length of the groove 102 is 9.12mm, the width is 5.52mm, the depth is 0.6mm, the length of the chip 103 is 8.065mm, the width is 4.984mm, and the thickness of the chip 103 is 0.5mm. By setting the size of the recess 102 to be slightly larger than the size of the chip 103, a certain gap is formed between the chip 103 and the bottom and the side walls of the recess 102, and the gap is used for accommodating the first glue 107 located at the bottom of the chip 103 and the filling glue located between the chip 103 and the side walls of the recess 102, so as to ensure that the upper surface of the finally packaged chip 103 is flush with the upper surface of the substrate 101.

Fig. 2 is a schematic top view of the substrate 101 and the chip 103 in the package structure, as shown in fig. 2, and in some embodiments, the chip module further includes:

at least one substrate pad 109 disposed on the upper surface of the substrate 101;

at least one die pad 108 disposed on the die 103, the substrate pad being connected to the die pad by a lead 110, the lead 110 being surrounded by a lead protection layer (not shown); wherein,

the lead 110 includes a biocompatible metal material and the lead protection layer includes a biocompatible insulating material.

In a practical process, the wire bonding machine is used to sequentially bond the wires 110 in the order corresponding to the solder joints, so as to connect and conduct the chip 103 and the substrate 101. Since the leads 110 are soft and have a certain curvature, and are easily contacted with each other to generate a short circuit, the leads 110 need to be coated with a lead protection layer to prevent the short circuit caused by flushing of a fluid medium. The lead 110 of the embodiment of the present application is made of a biocompatible metal material, and can be compatible with biological or medical liquid reagents, thereby reducing unnecessary biological or chemical reactions, and ensuring the measurement accuracy and stability of the flow sensor. In some embodiments, the leads 110 include, but are not limited to, gold and the lead finish includes, but is not limited to, one or more of epoxy, pharmaceutical grade polyvinyl alcohol, or silicon oxide.

Fig. 3 is a schematic top view of a chip 103 according to an embodiment of the present application, and fig. 4 is a schematic cross-sectional view of the chip 103 along AA direction.

In some embodiments, as shown in fig. 3-4, the chip 103 includes a substrate 111, an insulating film 112, and a heating resistor 115 disposed between the substrate 111 and the insulating film 112, where a cavity 113 is further disposed on the substrate 111, and the cavity 113 is correspondingly located below the heating resistor 115.

In this embodiment, the cavity 113 is disposed on the substrate 111 corresponding to the heating resistor 115, so that the heating resistor 115 can be insulated, and the measurement efficiency and stability of the flow sensor can be improved.

In actual operation, the insulating film 112 may cover an area other than the die pad 108 of the substrate 111, and a temperature measuring resistor 114 is further disposed between the substrate 111 and the insulating film 112.

Here, the base 111 may be a semiconductor material including, but not limited to, one or more materials of silicon, germanium, a group iii-v semiconductor, or an oxide semiconductor; the cavity 113 may be a rectangular enclosure; the insulating film 112 may be a single-layer film such as a silicon oxynitride film, or a multi-layer film such as a composite film composed of silicon oxide and silicon nitride. Here, the insulating film 112 may be grown at a high temperature of at least 800 degrees by a Low Pressure Chemical Vapor Deposition (LPCVD) apparatus, and the film grown by the above apparatus and process conditions may have a good compactness. The cavity 113 may be created by wet etching away a portion of the substrate 111 with potassium hydroxide. It should be appreciated that in some embodiments, the base 111 may not be provided with the cavity 113.

In some embodiments, the first gel 107 may include glue. In practice, the glue may include, but is not limited to, one or more of epoxy, pharmaceutical grade polyvinyl alcohol, or silicon oxide.

When the chip 103 is provided with the cavity 113, since the fluidity of the glue is strong, when the chip 103 is attached to the groove 102, the glue is easy to overflow into the cavity 113, so that the cavity 113 is filled or semi-filled, the heat insulation effect of the cavity 113 is reduced, and the performance of the sensor is damaged. Therefore, in the embodiment where the chip 103 is provided with the cavity 113, as shown in fig. 5, an anti-overflow groove 121 may be further provided on the area of the back surface of the chip 103 located at two sides of the cavity 113, so as to accommodate the excessive glue, and avoid the glue overflowing to the cavity 113 to affect the heat insulation effect.

It should be understood that the first glue 107 is not limited to include glue only, and in some other embodiments, as shown in fig. 6, the first glue 107 may also include solid state adhesive, for example, including but not limited to Die Attach Film (DAF Film).

The flow sensor has strict requirements on the flow field, the chip 103 is inclined up and down, the rotation angle can affect the performance, and the cavity 113 in the middle of the chip 103 can not be filled by other objects. When the first glue 107 is used, the chip 103 is adhered to the position of the groove 102 of the substrate 101 due to fluidity of the glue, the chip 103 is slowly deviated, the chip 103 is inclined and rotated, the glue amount is not well controlled in the adhering process, the glue is too little, the adhesion force between the chip 103 and the substrate 101 is insufficient, the glue is too much, the cavity 113 of the chip 103 is filled with the glue, and the cavity 113 cannot have a heat insulation effect. Also, when the liquid flows over the surface of the chip 103, the liquid cannot flow under the cavity 113 of the chip 103, which requires that there be no voids at the bottom of the chip 103 where it contacts the recess 102 of the substrate 101.

The first glue 107 is a solid-state adhesive instead of glue, and the position of the chip 103 is not easy to deviate and is not easy to have a cavity as long as the position of the Die Attach device is adjusted, and the chip 103 and the solid-state adhesive are adhered to the bottom surface of the groove 102. In addition, the chip 103 and the bottom of the groove 102 are bonded by solid state adhesion, and the glue can be prevented from entering the cavity 113 by utilizing the characteristic of weak solid state adhesion mobility, and meanwhile, the consistency of each chip 103 can be ensured.

According to a second aspect of the embodiments of the present application, there is also provided a flow sensor package structure including a chip module as in any one of the preceding embodiments. Fig. 1 is a schematic vertical cross-sectional view of a flow sensor package structure provided in an embodiment of the present application, and fig. 7 is a top view of the flow sensor package structure provided in the embodiment of the present application, as shown in fig. 1 and fig. 7, where the flow sensor package structure further includes:

the runner housing 105 comprises a main runner housing 116, a first runner housing 117 and a second runner housing 118 positioned at two sides of the main runner housing 116, wherein a window 119 and a filling layer 120 for filling the window 119 are arranged on the main runner housing 116; the main channel housing 116 and the substrate 101 form a closed cavity as a main channel 104, and in the projection along the vertical direction, the projection of the main channel housing 116 at least covers the projection of the groove 102 along the vertical direction; the runner housing 105 is bonded to the substrate 101 by a second adhesive (not shown), which includes a biocompatible material.

In practice, the second glue may be glue or a solid paste, such as one or more including but not limited to epoxy, pharmaceutical grade polyvinyl alcohol or silicon oxide, DAF film, etc.

In this embodiment, the second glue with biocompatibility is used to bond the flow channel housing 105 and the substrate 101, and the second glue with biocompatibility is compatible with biological or medical liquid reagents, so that unnecessary biological or chemical reactions are reduced, and thus measurement accuracy and stability of the flow sensor can be ensured.

In some embodiments, the first gel 107, the second gel, and the lead finish have different viscosities and/or flowabilities.

Since the surface of the chip 103 is inclined or rotated to affect the performance of the device, the first colloid 107 between the chip 103 and the groove 102 is not expected to have too high fluidity, the leads 110 are generally softer, the poor fluidity of the lead protection layer is difficult to completely wrap the bent leads 110, on the contrary, the chip 103 needs to be washed by the liquid to be tested, the first colloid 107 is not viscous enough to cause the problems of inclination, falling off and the like of the chip 103, and the viscosity of the lead protection layer is too large to possibly cause the problems of short circuit and the like caused by mutual contact of the leads 110. To this end, in some embodiments, the fluidity of the lead protective layer is greater than the fluidity of the second gel, which is greater than the fluidity of the first gel 107. Specifically, for example, the fluidity of the lead protective layer is 2 to 10 times, preferably 5 to 10 times, that of the second colloid, which is 1.5 to 5 times, preferably 2 to 3 times that of the first colloid 107. In some embodiments, the viscosity of the first gel 107 is greater than the viscosity of the second gel, which is greater than the viscosity of the lead finish. Specifically, for example, the viscosity of the first colloid 107 is 2 to 7 times, preferably 3 to 7 times, that of the second colloid, and the viscosity of the second colloid is 1.5 to 3 times, preferably 2 to 2.5 times, that of the first colloid 107.

In some embodiments, the surface of the substrate 101 facing the side of the flow channel housing 105 is provided with a substrate coating layer (not shown in the figure), the substrate coating layer includes a first coating layer and a second coating layer, the second coating layer covers the inner surface of the groove 102, the first coating layer covers the surface outside the area of the groove 102 of the substrate 101, wherein the projection of the coating layer along the vertical direction covers the projection of the main flow channel 104 along the vertical direction, and the material of the coating layer includes a biocompatible metal material, such as, but not limited to, gold. In this embodiment, by providing a biocompatible coating layer on the surface of the substrate 101 on the side facing the flow path housing 105, unnecessary biological or chemical reactions can be further reduced, so that measurement accuracy and stability of the flow sensor can be ensured.

In some other embodiments, the surface of the chip 103 is further provided with a chip coating layer (not shown in the figures) comprising a biocompatible metallic material, including, for example, but not limited to, gold. The chip coating layer is used for protecting the chip 103 from biological or chemical reaction with the liquid to be measured, so that the problems of reduced measurement accuracy, instability and the like are caused.

According to a third aspect of the embodiment of the present application, there is provided a method for manufacturing a flow sensor package structure, as shown in fig. 8, the method including:

step 801: providing a chip 103 and a substrate 101, wherein a groove 102 is formed in the upper surface of the substrate 101;

step 802: bonding the chip 103 into the groove 102 by a first glue 107; wherein,

the first colloid 107 comprises a biocompatible material.

According to the embodiment of the application, the chip 103 is bonded with the bottom of the groove 102 through the first colloid 107 with biocompatibility, and the first colloid 107 with biocompatibility can be compatible with biological or medical liquid reagents, so that unnecessary biological or chemical reactions are reduced, and the measurement accuracy and stability of the flow sensor can be ensured.

The following will describe in detail the method for manufacturing the flow sensor package structure according to the present application with reference to fig. 9 a-13.

First, step 801 is performed: a chip 103 and a substrate 101 are provided, and a groove 102 is provided on the upper surface of the substrate 101.

In particular, in actual operation, an initial substrate 101 may be provided first, the initial substrate 101 including, but not limited to, a PCB substrate, a semiconductor substrate, a ceramic substrate, or the like; then, a groove 102 is formed on the upper surface of the initial substrate 101 through a plurality of machining processes such as drilling, milling, grinding, etc.

Here, the size of the recess 102 is to be compatible with the size of the chip 103. In some embodiments, the recess 102 is rectangular, the recess 102 has a length that is 30-60 microns longer than the length of the die 103, the recess 102 has a width that is 30-60 microns longer than the width of the die 103, and the recess 102 has a depth that is 30-60 microns longer than the thickness of the die 103, e.g., the recess 102 has a length, width, and depth that are 35 microns, 45 microns, 50 microns, or 55 microns longer than the length, width, and thickness of the die 103, respectively. In a specific embodiment, the length of the groove 102 is 9.12mm, the width is 5.52mm, the depth is 0.6mm, the length of the chip 103 is 8.065mm, the width is 4.984mm, and the thickness of the chip 103 is 0.5mm. By setting the size of the recess 102 to be slightly larger than the size of the chip 103, a certain gap is formed between the chip 103 and the bottom and the side walls of the recess 102, and the gap is used for accommodating the first glue 107 located at the bottom of the chip 103 and the filling glue located between the chip 103 and the side walls of the recess 102, so as to ensure that the upper surface of the finally packaged chip 103 is flush with the upper surface of the substrate 101.

As shown in fig. 9a, the chip 103 provided herein may include a substrate 111, an insulating film 112, and a heating resistor 115 disposed between the substrate 111 and the insulating film 112, where a cavity 113 is further disposed on the substrate 111, and the cavity 113 is correspondingly disposed below the heating resistor 115. Referring to fig. 3, the insulating film 112 may cover an area other than the die pad 108 of the base 111, and a temperature measuring resistor 114 is further provided between the base 111 and the insulating film 112.

The specific preparation method of the chip 103 may include: first, a base 111 is provided, and then, a heating resistor 115 and a temperature measuring resistor 114 are formed on the base 111; then, an insulating film 112 is formed to cover the heating resistor 115 and the temperature measuring resistor 114; finally, at the position of the substrate 111 corresponding to the heating resistor 115, part of the substrate 111 is etched away by a potassium hydroxide wet method to obtain a cavity 113, and the preparation of the chip 103 is completed. Here, the base 111 is a semiconductor material including, but not limited to, one or more materials of silicon, germanium, a group iii-v semiconductor, or an oxide semiconductor; the cavity 113 may be a rectangular enclosure; the insulating film 112 may be a single-layer film such as a silicon oxynitride film, or a multi-layer film such as a composite film composed of silicon oxide and silicon nitride. Here, the insulating film 112 may be grown at a high temperature of at least 800 degrees by a Low Pressure Chemical Vapor Deposition (LPCVD) apparatus, and the film grown by the above apparatus and process conditions may have a good compactness. It should be appreciated that in some embodiments, the base 111 may not be provided with the cavity 113.

After providing the substrate 101 and the chip 103, as shown in fig. 10-13, step 802 is performed: bonding the chip 103 into the groove 102 by a first glue 107; wherein the first colloid 107 comprises a biocompatible material.

In some embodiments, the first gel 107 may include glue. Fig. 10 is a schematic vertical cross-sectional view of the chip 103 after being adhered to the bottom surface of the groove 102, and fig. 11 is a schematic top view of the chip 103 after being adhered to the bottom surface of the groove 102, as shown in fig. 10-11, wherein the chip 103 is adhered to the inside of the groove 102 by the first adhesive 107, as shown in fig. 10-11, specifically including:

a first colloid 107 is dotted around the bottom of the groove 102;

placing the chip 103 above the first colloid 107 by using a mechanical arm;

the first gel 107 is cured.

In actual operation, firstly, dispensing is performed around the inner ring of the groove 102 through Die bond equipment, then a chip 103 is sucked by a mechanical arm and other equipment to be stuck on the glue in the groove 102, and then the glue is cured by an oven.

Referring to fig. 2, the substrate 101 provided herein further comprises at least one substrate pad 109, and the die 103 provided further comprises at least one die pad 108.

Then, after bonding the chip 103 within the recess 102, as shown in fig. 12-13, the method further comprises:

bonding wires, wherein the substrate welding spots and the chip welding spots are electrically connected one by one through the lead wires 110;

Spraying glue on the lead 110 to form a lead protection layer (not shown in the figure) wrapping the lead 110;

filling a gap between the chip 103 and the groove 102 with a filling colloid so that the upper surface of the chip 103 is flush with the upper surface of the groove 102;

solidifying the filling colloid;

providing a runner housing;

bonding the runner housing to the upper surface of the substrate 101 through a second adhesive, wherein the runner housing covers the groove 102 and part of the upper surface of the substrate 101; wherein,

the material of the filling colloid, the second colloid and/or the lead protection layer comprises a biocompatible material.

Specifically, the lead 110 may be first sequentially bonded by a bonding machine of the lead 110 according to the sequence corresponding to the welding spots, the chip 103 is connected and conducted with the substrate 101, then the lead 110 is sprayed with glue by an automatic dispensing machine, the lead 110 is softer and has a certain radian, and the lead 110 needs to be coated and protected by biocompatible glue, so as to prevent short circuit caused by flushing of liquid to be tested. Meanwhile, the gap between the chip 103 and the groove 102 is filled with glue by using a thinner dispensing head through an automatic dispensing machine, so that the gap is filled, the surface of the chip 103 and the upper surface of the substrate 101 are kept on the same horizontal line as much as possible, and too many concave or convex areas are not formed in the middle of the chip, so that the stability of a flow field is ensured. The filled colloid is then cured by an oven.

Referring to fig. 7, the runner housing 105 used in the embodiment of the present invention includes a main runner housing 116, and a first runner housing 117 and a second runner housing 118 located at two sides of the main runner housing 116, where a window 119 is provided on the main runner housing 116.

In this embodiment, the runner housing is adhered to the upper surface of the substrate 101 by the second glue, and the runner housing covers the groove 102 and a part of the upper surface of the substrate 101, which may specifically include:

applying a second gel to the region of the main flow channel housing 116 to be bonded to the substrate 101;

passing the lead 110 through the window 119;

attaching the main flow path housing 116 to the upper surface of the base plate 101;

solidifying the second colloid;

sealing the window 119 with glue application;

glue is used for coating glue again at the joint of the main runner housing 116 and the substrate 101;

and heating and curing the glue to finish packaging.

Since the leads 110 are protruded after wrapping the lead cover, and the glue has slight fluidity and irregularity, the runner housing 105 and the substrate 101 cannot be tightly adhered. In this embodiment, by providing the window 119 slightly larger than the area of the lead 110 and the lead protection layer in the main runner housing 116, the lead 110 can be protruded from the window 119 in the step of bonding the runner housing 105 to the substrate 101, and after the runner housing 105 is completely fixed to the substrate 101, the window 119 is further sealed by glue application, so that the tightness between the runner housing 105 and the substrate 101 can be improved, the occurrence of void and void can be prevented, and the leakage can be prevented. Finally, the combined position of the main runner housing 116 and the substrate 101 is coated with glue once again through an automatic glue dispensing device, and the packaging is completed after high-temperature solidification.

In some other embodiments, the main flow channel housing 116 is further provided with a glue drainage channel on both sides of the middle main flow channel 104 to prevent excessive overflow of glue into the main flow channel 104.

It should be noted that the first glue 107, the lead protection layer and the second glue may be glue with different viscosities or different compositions. The glue comprises a combination of epoxy resin, medical grade polyvinyl alcohol or silicon oxide, the glue needs to have certain fluidity and viscosity, the enough fluidity can ensure that the bonding alloy wires playing a role in connection can be completely protected, and meanwhile, the soft lead wires 110 cannot be deformed due to the resistance of the glue; the glue also needs to have certain viscosity, the viscosity is 6000cps-40000cps, the bonding strength of the chip 103 and the substrate 101 can be met after the glue is solidified, the pushing force of the chip 103 is qualified, the bonding strength of the substrate 101 and the runner shell 105 can be met, the leakage is avoided, certain corrosion resistance is realized, and the corrosion damage of liquid medicine such as physiological saline is prevented.

Since the surface of the chip 103 is inclined or rotated to affect the performance of the device, the first colloid 107 between the chip 103 and the groove 102 is not expected to have too high fluidity, the leads 110 are generally softer, the poor fluidity of the lead protection layer is difficult to completely wrap the bent leads 110, on the contrary, the chip 103 needs to be washed by the liquid to be tested, the first colloid 107 is not viscous enough to cause the problems of inclination, falling off and the like of the chip 103, and the viscosity of the lead protection layer is too large to possibly cause the problems of short circuit and the like caused by mutual contact of the leads 110. To this end, in some embodiments, the fluidity of the lead protective layer is greater than the fluidity of the second gel, which is greater than the fluidity of the first gel 107. Specifically, for example, the fluidity of the lead protective layer is 2 to 10 times, preferably 5 to 10 times, that of the second colloid, which is 1.5 to 5 times, preferably 2 to 3 times that of the first colloid 107. In some embodiments, the viscosity of the first gel 107 is greater than the viscosity of the second gel, which is greater than the viscosity of the lead finish. Specifically, for example, the viscosity of the first colloid 107 is 2 to 7 times, preferably 3 to 7 times, that of the second colloid, and the viscosity of the second colloid is 1.5 to 3 times, preferably 2 to 2.5 times, that of the first colloid 107.

It should be appreciated that the use of glue as the material of the first gel 107 or the second gel is not the only limitation of the present invention, and in some embodiments, the first gel 107 and/or the second gel may be solid state bonded. The method of preparing the first colloid 107 and the second colloid by solid state pasting is similar to the main method steps of preparing the first colloid 107 and the second colloid by glue, but the following differences still exist.

First, in the embodiment where the first glue 107 is applied in a solid state, the manner of providing the chip 103 and the specific step of bonding the chip 103 into the groove 102 by the first glue 107 are different from the scheme where the first glue 107 is glue. In particular, with reference to fig. 9b,

the providing chip 103 includes:

attaching a solid state paste to the back side of a wafer comprising at least one die 103;

cutting the wafer and the solid state paste to obtain a stack of at least one separated chip 103 and the solid state paste;

the bonding of the chip 103 in the groove 102 by the first glue 107 includes:

applying the lamination in the groove 102 by a manipulator with a heating device, and heating the solid paste by the heating device while applying to temporarily melt the solid paste;

And solidifying the melted solid paste.

Here, the solid state paste includes, but is not limited to, a DAF film including a first adhesive side, a second adhesive side, and a high thermal conductive resin layer sandwiched between the first and second adhesive sides.

In actual operation, firstly, a DAF film is stuck on the back of a wafer, baked at a certain temperature and solidified on the back of the wafer, then a UV film or a blue film is stuck on the DAF film, and then the wafer is cut along a cutting path in a laser cutting or water cutting mode to form a laminated structure of a single chip 103, the DAF film and the UV film or the blue film; the laminate structure is then de-glued on a UV machine or a blue film machine so that the chip 103 and the DAF film can be separated better from the UV film.

After the chip 103 and the DAF film are separated from the UV film, a single chip 103 is stuck in the groove 102 through a suction nozzle on Die bond equipment, the DAF film can be quickly melted temporarily by a heating block on the equipment, so that the chip 103 and the PCB substrate 101 are bonded together through the DAF film, then the DAF film is cured at a high temperature through an oven, the DAF film is completely cured, the chip 103 is firmly attached to the bottom of the groove 102, and the adhesive strength meets the thrust of the chip 103.

Secondly, in the embodiment where the second glue is solid-state, the step of applying the second glue to the area of the runner housing to be contacted with the upper surface of the substrate 101 is different from the scheme where the second glue is glue, specifically:

The second glue is solid-state adhesive, and the area to be coated on the runner housing to be in contact with the upper surface of the substrate 101 includes:

providing a rolled solid adhesive film, wherein the rolled solid adhesive film comprises a rolled base film, a plurality of solid adhesives which are separately arranged on the rolled base film and a protective film which is separately arranged on the solid adhesives, and the size of the protective film is larger than that of the solid adhesives;

separating the solid paste from the rolled bottom film by using a mechanical arm;

applying the solid paste to the flow path housing 105 with a suction nozzle;

stripping the protective film by using a mechanical arm;

the flow path housing 105 to which the solid paste is applied to the upper surface of the substrate 101.

In practical operation, the solid adhesive films are rolled and can be arranged on film pasting equipment, each roll of solid adhesive film is cut into single small patches in advance according to the structural design of the runner housing 105, each small patch has certain viscosity, one side of the small patch is adhered to the rolled base film of the whole roll, the other side of the small patch is provided with a protective film slightly larger than the small patch solid adhesive film, the film pasting equipment firstly separates the small patch solid adhesive film from the whole roll of protective film, the small patch solid adhesive film is adhered with the runner housing 105 through a suction nozzle, the protective film on the other side is torn off through a mechanical handle, after high-temperature curing, the joint part of the main runner housing 116 and the substrate 101 and the square hole on the runner housing 105 are coated with glue for one time through a glue dispenser, and packaging is completed after high-temperature curing.

The foregoing description of the preferred embodiments of the present disclosure is not intended to limit the scope of the present disclosure, but is intended to cover any modifications, equivalents, and improvements within the spirit and principles of the present disclosure.

Claims (16)

1. A chip module, comprising:

a substrate;

the groove is positioned on the upper surface of the substrate;

the chip is arranged in the groove and is bonded with the groove through a first colloid; wherein,

the first colloid comprises a biocompatible material.

2. The module of claim 1, wherein the first glue comprises glue or solid paste.

3. The module of claim 1, wherein the chip comprises a substrate, an insulating film, and a heating resistor disposed between the substrate and the insulating film, and wherein a cavity is further disposed on the substrate and is correspondingly disposed below the heating resistor.

4. The module of claim 1, wherein the module further comprises: and the glue overflow prevention grooves are arranged on the back surface of the chip and positioned on two sides of the cavity.

5. The module of claim 1, comprising:

at least one substrate welding spot arranged on the upper surface of the substrate;

at least one chip welding spot arranged on the chip, wherein the substrate welding spot is connected with the chip welding spot through a lead, and the lead is wrapped by a lead protection layer; wherein,

the lead includes a biocompatible metal material and the lead protection layer includes a biocompatible insulating material.

6. A flow sensor package comprising the chip module of any one of claims 1-5, wherein the flow sensor package further comprises:

the runner shell comprises a main runner shell, a first runner shell and a second runner shell, wherein the first runner shell and the second runner shell are positioned on two sides of the main runner shell, and a window and a filling layer for filling the window are arranged on the main runner shell; the main runner shell and the substrate form a closed cavity as a main runner, and in the projection along the vertical direction, the projection of the main runner shell at least covers the projection of the groove along the vertical direction.

7. The package of claim 6, wherein the primary flowpath shell is bonded to the substrate by a second gel, the second gel comprising a biocompatible material.

8. The package structure of claim 7, wherein the first gel, the second gel, and the lead finish have different viscosities and/or flowabilities.

9. The package structure according to claim 6, wherein a surface of the substrate in contact with the main flow path housing is provided with a substrate coating layer including a first coating layer and a second coating layer, the second coating layer covering an inner surface of the groove, the first coating layer covering a surface other than the substrate groove region, wherein a projection of the coating layer in a vertical direction covers a projection of the main flow path in a vertical direction, and the substrate coating layer includes a biocompatible metal material.

10. The package structure of claim 6, wherein the upper surface of the chip is further provided with a chip coating layer, the chip coating layer comprising a biocompatible metal material.

11. The preparation method of the flow sensor packaging structure is characterized by comprising the following steps of:

providing a chip and a substrate, wherein a groove is formed in the upper surface of the substrate;

bonding the chip in the groove through a first colloid; wherein,

The first colloid comprises a biocompatible material.

12. The method of claim 11, wherein when the first gel comprises glue; bonding the chip in the groove through a first colloid comprises the following steps:

the first colloid is dotted around the bottom of the groove;

the chip is placed above the first colloid by a mechanical arm;

and curing the first colloid.

13. The method of claim 11, wherein when the first gel comprises a solid state paste, the providing the chip comprises:

attaching a solid paste to the back of a wafer, the wafer comprising at least one chip;

cutting the wafer and the solid-state bonding to obtain a stack of at least one separated chip and the solid-state bonding;

bonding the chip in the groove through a first colloid comprises the following steps:

the laminated layers are stuck in the grooves by a manipulator with a heating device, and the heating device heats the solid sticking while sticking so as to temporarily melt the solid sticking;

and solidifying the melted solid paste.

14. The method of claim 11, wherein the substrate further comprises at least one substrate bond pad, the die comprises at least one die bond pad, and after bonding the die within the recess, the method further comprises:

Bonding wires, namely electrically connecting the welding spots of the substrate with the welding spots of the chip one by one through leads;

spraying glue on the lead to form a lead protection layer wrapping the lead;

filling gaps between the chips and the grooves by using filling colloid so that the upper surfaces of the chips are flush with the upper surfaces of the grooves;

solidifying the filling colloid;

providing a runner housing;

bonding the runner shell with the upper surface of the substrate through a second colloid, wherein the runner shell covers the groove and part of the upper surface of the substrate; wherein,

the material of the filling colloid, the second colloid and/or the lead protection layer comprises a biocompatible material.

15. The method of claim 14, wherein the sprue housing comprises a sprue housing and first and second sprue housings on opposite sides of the sprue housing, the sprue housing having a window disposed therein;

bonding the runner housing with the upper surface of the substrate through a second glue, wherein the runner housing covers the groove and part of the upper surface of the substrate, and the method comprises the following steps:

applying a second gel to a region of the primary flowpath shell to be bonded to the substrate;

Passing the lead through the window;

attaching the flow channel housing to an upper surface of the substrate;

solidifying the second colloid;

coating and sealing the window by glue;

glue is coated on the joint of the main runner shell and the substrate again by using glue;

and (5) heating and curing the glue.

16. The method of claim 15, wherein the second glue is a solid paste, the area to be applied to the runner housing to be in contact with the upper surface of the substrate, comprising:

providing a rolled solid adhesive film, wherein the rolled solid adhesive film comprises a rolled base film, a plurality of solid adhesives which are separately arranged on the rolled base film and a protective film which is separately arranged on the solid adhesives, and the size of the protective film is larger than that of the solid adhesives;

separating the solid paste from the rolled bottom film by using a mechanical arm;

applying the solid paste to the main runner housing with a suction nozzle;

stripping the protective film by using a mechanical arm;

and applying the main runner housing with the solid state adhesive to the upper surface of the substrate.