CN117135824A - Circuit board assembly and manufacturing method thereof - Google Patents

Abstract

A method of manufacturing a circuit board assembly includes forming a shield, and disposing a heat conductive paste and an electronic component in the shield such that the shield, the heat conductive paste, and the electronic component form a package module. The method further includes mounting the package module on the bonding pad of the first circuit substrate to electrically connect the electronic component to the bonding pad. The method further includes disposing a second circuit substrate on the first circuit substrate after mounting the package module on the pads of the first circuit substrate, wherein the second circuit substrate laterally surrounds the package module. Therefore, the protection of the electronic element is improved, and the heat dissipation efficiency of the electronic element is improved, so that the reliability and the efficiency of the circuit board assembly are improved. The application also provides a circuit board assembly.

Description

Circuit board assembly and manufacturing method thereof

Technical field

The present application relates to a circuit board assembly and its manufacturing method, especially a circuit board assembly with embedded electronic components and its manufacturing method.

Background technique

As the development trend of electronic products has tended to be fast, highly reliable, multi-functional, miniaturized and high-performance, the technology of circuit board assemblies with embedded electronic components is increasingly favored by the industry. Embedding electronic components in circuit boards can not only reduce the wiring area, but also shorten the wiring length to meet the above-mentioned development trends of electronic products.

Therefore, various industries strive to improve the reliability and performance of circuit board assemblies with embedded electronic components.

Contents of the invention

According to some embodiments of the present application, a method of manufacturing a circuit board assembly includes forming a shielding case, and disposing thermally conductive glue and electronic components in the shielding case, so that the shielding case, thermally conductive glue and electronic components form a package module. The method of manufacturing the circuit board assembly further includes installing the package module on the pads of the first circuit substrate, wherein the electronic components are electrically connected to the pads. The method of manufacturing the circuit board assembly further includes, after mounting the package module on the pads of the first circuit substrate, disposing a second circuit substrate on the first circuit substrate, wherein the second circuit substrate laterally surrounds the package module.

In some embodiments, after mounting the package module on the pads of the first circuit substrate and before arranging the second circuit substrate on the first circuit substrate, an opening is formed in the second circuit substrate, so that when the second circuit substrate is disposed During the process on the first circuit substrate, the package module is embedded in the second circuit substrate through the opening.

In some embodiments, the operation of disposing the thermally conductive adhesive and the electronic components in the shielding case includes distributing the thermally conductive adhesive in the shielding case and placing the electronic components in the shielding case. The thermally conductive adhesive is between the shielding cover and the electronic components, so that the thermally conductive adhesive electrically isolates the shielding cover and the electronic components.

In some embodiments, forming the shield includes providing a metal block and forming an opening in the metal block, wherein the opening extends from an outer surface to an interior of the metal block.

According to some embodiments of the present application, a circuit board assembly includes a first circuit substrate, a packaging module and a second circuit substrate. The first circuit substrate includes contact pads. The package module is configured on the first circuit substrate and includes electronic components, a shielding cover and thermally conductive glue. The electronic components are installed on the pads of the first circuit substrate. The shield surrounds the electronic components. The thermally conductive adhesive is sandwiched between the electronic components and the shielding cover. The second circuit substrate is disposed on the first circuit substrate and laterally surrounds the package module.

In some embodiments, the circuit board assembly further includes solder, which is disposed between the package module and the pads, and connects the package module and the pads.

In some embodiments, the circuit board assembly further includes an insulator disposed between and on the pads, and includes pattern openings, wherein the solder is distributed in the pattern openings.

In some embodiments, the electronic component has a first surface to which the pads are connected. Thermal paste does not cover the first surface, but completely covers the other surfaces of the electronic component. The shield does not surround the first surface, but completely surrounds the other surfaces of the electronic component.

In some embodiments, the shield has an outer surface and an inner surface. A portion of the outer surface directly contacts the second circuit substrate. The inner surface is in direct and complete contact with the thermal paste.

In some embodiments, the circuit board assembly further includes a metal layer disposed on the shield and directly contacting another portion of the outer surface.

Embodiments of the present application provide a circuit board assembly and a method of manufacturing the same. By embedding the shielding cover and the electronic components in the circuit board, the protection of the electronic components is improved and the heat dissipation efficiency of the electronic components is increased. This helps to improve the reliability and performance of circuit board assemblies with embedded electronic components.

Description of the drawings

When reading the following implementation methods, please refer to the accompanying drawings to clearly understand the concepts of this application. It should be noted that, consistent with standard industry practice, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily expanded or reduced for clarity of discussion. Again, the same reference numerals refer to the same elements.

1 , 2 , 3 and 4 are three-dimensional views of a circuit board assembly at various manufacturing stages in a method of manufacturing a circuit board assembly according to some embodiments of the present application.

5 , 6 and 7A are cross-sectional views of the circuit board assembly at various manufacturing stages in a method of manufacturing the circuit board assembly according to some embodiments of the present application.

7B is a top view of the circuit board assembly at various manufacturing stages in a method of manufacturing the circuit board assembly according to some embodiments of the present application.

8A is a cross-sectional view of the circuit board assembly at various manufacturing stages in a method of manufacturing the circuit board assembly according to some embodiments of the present application.

8B is a cross-sectional view of the circuit board assembly at various manufacturing stages in a method of manufacturing the circuit board assembly according to some embodiments of the present application.

8C is a top view of the circuit board assembly at various manufacturing stages in a method of manufacturing the circuit board assembly according to some embodiments of the present application.

9 and 10 are cross-sectional views of a circuit board assembly at various manufacturing stages in a method of manufacturing a circuit board assembly according to some embodiments of the present application.

Detailed ways

When an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or intervening elements Can and exist. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection. Furthermore, “electrical connection” or “coupling” may mean the presence of other components between two components.

Additionally, relative terms, such as "lower" or "bottom" and "upper" or "top" may be used herein to describe one element's relationship to another element as illustrated in the Figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation illustrated in the figures. For example, if the device in one of the figures is turned over, elements described as "lower" than other elements would then be oriented "upper" than the other elements. Thus, the exemplary term "lower" may include both "lower" and "upper" orientations, depending on the particular orientation of the drawing. Similarly, if the device in one of the figures is turned over, elements described as "below" or "above" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "below" or "upper" may include both upper and lower orientations.

As used herein, "about," "approximately," or "substantially" includes the stated value and an average within an acceptable range of deviations from the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the A specific amount of error associated with a measurement (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed to have meanings consistent with their meanings in the context of the relevant art and the present application, and will not be construed as idealistic or excessive Formal meaning, unless expressly defined as such herein.

As the development trend of electronic products has tended to be fast, highly reliable, multi-functional, miniaturized and high-performance, the technology of circuit board assemblies with embedded electronic components is increasingly favored by the industry. Embedding electronic components in the circuit board not only reduces the wiring area, but also shortens the wiring length, helping to reduce signal transmission losses. When electronic components are embedded in designated positions on the circuit board, if no additional processing is performed on the electronic components, the electronic components are usually exposed in the embedded area of the circuit board and are easily damaged by external forces or electromagnetic interference. , EMI) adverse phenomena. At the same time, the heat dissipation efficiency of circuit board assemblies with embedded electronic components also needs to be improved urgently. The present application provides a circuit board assembly with embedded electronic components and a manufacturing method thereof, which can improve the protection of electronic components and increase heat dissipation efficiency, thereby improving the reliability and performance of the circuit board assembly with embedded electronic components.

It should be noted that when the following embodiments are illustrated or described as a series of operations or events, the order of description of these operations or events should not be limited unless otherwise specified. For example, some operations or events may be performed in a different order than in this application, some operations or events may occur simultaneously, some operations or events may not be used, and/or some operations or events may be repeated. Furthermore, the actual process may require additional operations before, during, or after each step. Therefore, this application may briefly describe some of these additional operations.

Please refer to FIG. 1 , which is a perspective view of a circuit board assembly at one of the manufacturing stages in a method of manufacturing a circuit board assembly according to some embodiments of the present application. First, in operation S10, a metal block 100 is provided having a first surface S1 and a second surface S2 opposite to the first surface S1. The metal block 100 may include copper, nickel, iron, cobalt, tin, chromium, titanium, aluminum, manganese, zinc, lead, other metals, alloys of the foregoing, or combinations thereof. For example, the metal block 100 may include an alloy of copper and nickel. The shape and size of the metal block 100 can be adjusted according to product design and process conditions. In some embodiments, the metal block 100 may be a rectangular parallelepiped.

Please refer to FIG. 2 . FIG. 2 is a perspective view of a circuit board assembly in one of the manufacturing stages of a method of manufacturing a circuit board assembly according to some embodiments of the present application. Next, in operation S12 , an opening 200 is formed in the metal block 100 to form the shielding case 202 , wherein the opening 200 extends from the outer surface of the metal block 100 to the inside of the metal block 100 . For example, the opening 200 may extend from the first surface S1 to the interior of the metal block 100 in a direction toward the second surface S2. The shield 202 may have an outer surface 202ES and an inner surface 202IS, wherein a space surrounded by the inner surface 202IS is generally consistent with the opening 200 .

In some embodiments, the shield 202 is a one-piece structure. In other words, the shielding case 202 is not composed of different components. Therefore, the internal structure of the shielding case 202 has no connection interfaces or seams, thereby ensuring that the shielding case 202 provides electromagnetic shielding.

Methods of forming openings 200 may include routing, mechanical or laser drilling, etching, other suitable techniques, or combinations thereof. It should be noted that the aforementioned methods of forming the shielding cover 202 in FIGS. 1 and 2 are only examples and not limitations. Other methods of forming the shield 202, such as die casting, casting and other molding techniques, are also within the scope of this application.

Please refer to FIG. 3 . FIG. 3 is a perspective view of a circuit board assembly in one of the manufacturing stages of a method of manufacturing a circuit board assembly according to some embodiments of the present application. Next, in operation S14, the electronic component 300 is placed into the shielding case 202. In other words, the electronic component 300 is filled into the opening 200 . The electronic component 300 may have one or more pads 302 disposed on the active surface 300AS of the electronic component 300 . In some embodiments, when the electronic component 300 is placed on the shield case 202, the contact pad 302 (or the active surface 300AS) faces outward, that is, the direction of the contact pad 302 (or the active surface 300AS) is in line with the direction in which the electronic component 300 moves to the shield. The direction D1 of the cover 202 is opposite.

Since the size of the opening 200 in operation S12 (please refer to FIG. 2 ) is pre-designed to be larger than the size of the electronic component 300 , after the electronic component 300 is placed in the shielding case 202 , there is no gap between the electronic component 300 and the inner surface 202IS of the shielding case 202 . There may be gaps between them.

In some embodiments, in operation S14, the thermally conductive adhesive 304 may be distributed in the shielding case 202 first, and then the electronic component 300 may be placed in the shielding case 202, so that the bottom of the electronic component 300 is in contact with the shielding case 202 due to the thermally conductive adhesive 304. The inner surfaces 202IS are separated. Therefore, the thermally conductive adhesive 304 can prevent the electronic component 300 from contacting the shielding case 202 . In some embodiments, the thermally conductive glue 304 has the function of electrical isolation and may be called insulating thermally conductive glue.

The electronic component 300 may be a passive component, such as a capacitor, an inductor or a resistor. Electronic component 300 may be an active component, such as a transistor. Alternatively, the electronic component 300 may include active components and passive components, such as an integrated circuit (IC) having active components and passive components, but the application is not limited thereto.

The material of the thermally conductive adhesive 304 may include epoxy, polyimide (PI), polyamide-imide (PAI), other suitable materials, or combinations thereof. In some embodiments, the thermally conductive glue 304 has fluidity, and the thermally conductive glue 304 can be solidified and formed through subsequent processing (eg, heat treatment or light treatment).

Please refer to FIG. 4 , which is a perspective view of a circuit board assembly in one of the manufacturing stages of a method of manufacturing a circuit board assembly according to some embodiments of the present application. Next, in operation S16, the thermally conductive glue 304 and the electronic component 300 are arranged in the shielding case 202, so that the shielding case 202, the thermally conductive glue 304 and the electronic component 300 form a package module 400. In some embodiments, disposing the thermally conductive adhesive 304 and the electronic component 300 in the shielding case 202 may include performing a curing process so that the fluid thermally conductive adhesive 304 is cured and shaped.

In the package module 400 shown in FIG. 4 , the shielding case 202 surrounds the electronic component 300 , and the thermally conductive adhesive 304 is sandwiched between the electronic component 300 and the shielding case 202 . In some embodiments, the inner surface 202IS (please refer to FIG. 2 ) of the shielding case 202 can directly and completely contact the thermally conductive adhesive 304.

As mentioned above, during the aforementioned operation S12, the size of the opening 200 has been pre-designed to be larger than the size of the electronic component 300, so that there is an air gap (air gap) between the lateral periphery of the electronic component 300 and the inner surface 202IS of the shield case 202. In some embodiments using a fluid thermally conductive glue 304, after the electronic component 300 is placed in the shielding case 202, the thermally conductive glue 304 can be squeezed to flow, thereby filling the space between the electronic component 300 and the shielding case 202. (air gap), so the electronic component 300 does not directly contact the shielding case 202.

Since air is a poor conductor of heat, it may hinder the transfer of heat, for example, from the electronic component 300 to the shield 202 . Relatively speaking, the thermally conductive adhesive 304 has better thermal conductivity properties. Therefore, the thermally conductive adhesive 304 disposed between the electronic component 300 and the shielding case 202 can discharge the air, thereby increasing heat transfer and improving heat dissipation efficiency, thus contributing to the performance of the electronic component 300 .

In addition to thermal conductivity, in some embodiments where the thermally conductive adhesive 304 has a dielectric material, the thermally conductive adhesive 304 between the shielding case 202 and the electronic component 300 can also electrically isolate the shielding case 202 and the electronic component 300 to reduce short circuits. The phenomenon.

When the amount of thermally conductive adhesive 304 is insufficient, the thermally conductive adhesive 304 may not be able to completely fill the gap between the electronic component 300 and the shielding case 202 . In this embodiment, the material of the thermally conductive glue 304 can be filled again into the remaining gap between the electronic component 300 and the shielding case 202, so that the thermally conductive glue 304 can completely fill the gap (air) between the electronic component 300 and the shielding case 202. gap), and the thermally conductive adhesive 304 is completely sandwiched between the electronic component 300 and the shielding case 202, thereby ensuring that the heat dissipation efficiency is improved.

The operation of disposing the thermally conductive adhesive 304 in the shielding case 202 may also include removing excess adhesive. For example, the thermally conductive adhesive 304 may overflow on the active surface 300AS or the first surface S1. At this time, a cleaning process may be performed to remove the overflowing portion of the thermally conductive adhesive 304.

In the configuration of this embodiment, the active surface 300AS and the pads 302 of the electronic component 300 are exposed. In other words, the active surface 300AS and the pads 302 of the electronic component 300 are not covered by the shielding cover 202 or the thermally conductive adhesive 304 . In some embodiments, the thermally conductive adhesive 304 substantially completely covers other surfaces of the electronic component 300 without considering the active surface 300AS of the electronic component 300 . Likewise, without considering the active surface 300AS of the electronic component 300 , the shielding cover 202 substantially completely surrounds other surfaces of the electronic component 300 . In other words, in this embodiment, the shielding cover 202 can substantially completely shield other surfaces of the electronic component 300, thereby reducing electromagnetic interference between the electronic component 300 and other components (not shown), thereby improving signal quality.

Please refer to FIG. 5 , which is a cross-sectional view of the circuit board assembly at one of the manufacturing stages in a method of manufacturing the circuit board assembly according to some embodiments of the present application. Next, in operation S18, the first circuit substrate 500 is provided. The first circuit substrate 500 may include a first base material layer 502, a first circuit layer 504, and a second circuit layer 506. The first circuit layer 504 may include one or more first pads 508 and one or more second pads 510 , where the first pads 508 are spaced apart from each other, the second pads 510 are spaced apart from each other, and the A pad 508 and a second pad 510 are spaced apart from each other. The first circuit layer 504 also has trenches 512 .

In some embodiments, the first pad 508 may provide a function of transmitting electrical signals. In some embodiments, the second pad 510 may not provide the function of transmitting electrical signals.

The material of the first base material layer 502 may include a dielectric material, and the dielectric material may be formed of polymer (polymeric) or non-polymeric (non-polymeric). For example, liquid crystal polymer (LCP), bismaleimide-triazine (BT), prepreg, resin containing inorganic fillers (for example, Ajinomoto Build- up Film (ABF), epoxy resin (epoxy), polyimide (PI), or other resin materials, but this application is not limited to the above examples. Furthermore, the aforementioned materials may also contain fibers, such as glass fiber or Kevlar fiber, to enhance the strength of the first base material layer 502 . In some embodiments, the first substrate layer 502 may be formed of a photoimageable dielectric material or a photoactive dielectric material. The materials of the first circuit layer 504 and the second circuit layer 506 may include gold, silver, copper, nickel, tin, other suitable metals, or alloys of combinations of the above materials.

Please refer to FIG. 6 , which is a cross-sectional view of the circuit board assembly at one of the manufacturing stages in a method of manufacturing the circuit board assembly according to some embodiments of the present application. Next, in operation S20, the insulating member 600 is arranged on the first circuit substrate 500. Specifically, the insulator 600 is disposed between and on the first pads 508 and between the first pads 508 and the second pads 510 . In some embodiments, insulation 600 has patterned openings 602 .

The material of the insulator 600 may include epoxy, polyimide, or other suitable solder mask materials. Furthermore, additives, such as hardeners or photoinitiators, can be added to the aforementioned materials according to process requirements or product design, but the present application is not limited to the above examples. In some embodiments, the material of the insulating member 600 may be thermosetting solder mask ink. In other embodiments, the material of the insulating member 600 may be photocurable solder resist ink. The formation method of the insulating member 600 with the pattern opening 602 may include a deposition process, an exposure and development process, an etching process, a curing process, other suitable processes, or any combination of the above processes. In some embodiments, a method of forming the insulator 600 having the patterned openings 602 may include a screen print technology.

Please refer to FIGS. 7A and 7B . FIG. 7A is a cross-sectional view of the circuit board assembly at one of the manufacturing stages in a method of manufacturing a circuit board assembly according to some embodiments of the present application, and FIG. 7B is a cross-sectional view of the circuit board assembly according to some embodiments of the present application. A partial top view of Figure 7A is shown. Next, as shown in FIG. 7A , in operation S22 , the package module 400 is configured on the first circuit substrate 500 . For example, the package module 400 is mounted on the first pad 508 and the second pad 510 of the first circuit substrate 500 . In some embodiments, the package module 400 of FIG. 4 is turned upside down, and the electronic component 300 is installed on the first pad 508 of the first circuit substrate 500 so that the pads 302 on the active surface 300AS of the electronic component 300 are connected. First pad 508. After installation, the insulating member 600 may contact (eg, directly contact) the electronic component 300 and the thermally conductive adhesive 304 .

Operation S22 also includes disposing the solder 700 between the packaging module 400 and the first pad 508 to connect the packaging module 400 and the first pad 508 and fixing the packaging module 400 on the first circuit substrate 500 . In some embodiments, the solder 700 directly contacts the electronic component 300 (eg, the pad 302 ) and the first pad 508 , whereby the electronic component 300 can be electrically connected to the first pad 508 through the solder 700 .

To further describe, the solder 700 may be located in the space surrounded by the insulator 600 , the pad 302 and the first pad 508 . In operation S20 (please refer to FIG. 6 ), the configured insulating member 600 may define the position range of the solder 700 . In other words, the solder 700 may be distributed in the pattern openings 602 of the insulating member 600 . Therefore, the insulator 600 can electrically isolate adjacent solders 700, thereby reducing the possibility of short circuit.

The material of the solder 700 may include aluminum, gold, silver, copper, tin, bismuth, nickel, or other metals, or a combination thereof. In some embodiments, solder 700 is solder paste.

In some embodiments, operation S22 further includes disposing adhesive material 702 between the packaging module 400 and the second pad 510 to connect the packaging module 400 and the second pad 510, thereby strengthening the packaging module 400 in the first circuit. Firmness on substrate 500. The adhesive material 702 can directly contact the shielding case 202 and the second pad 510 . In some embodiments, the adhesive material 702 and the second pad 510 laterally surround the insulating member 600 .

The adhesive material 702 may include epoxy, PI, metallic materials, or other suitable materials. When the adhesive material 702 includes a metal material such as aluminum, gold, silver, copper, tin, bismuth, nickel, or other metals, or a combination thereof, the configured adhesive material 702 , the second pad 510 and the shield 202 can be provided together The function of electromagnetic shielding is to improve the electromagnetic shielding effect on the electronic component 300 . In some further embodiments, the adhesive material 702 uses the same material as the solder 700 .

In some embodiments where the second pad 510 does not transmit electrical signals and the adhesive material 702 includes a metal material, the trench 512 separates the second pad 510 from other circuits by a distance sufficient to serve as a receiving space when the adhesive material 702 overflows. , so that the overflowing adhesive material 702 does not contact other circuits, thereby reducing the possibility of short circuits. In some embodiments, trench 512 is located around package module 400 . For example, in the embodiment shown in FIG. 7B , trench 512 surrounds package module 400 .

Please refer to FIG. 8A, FIG. 8B and FIG. 8C. FIG. 8A is a cross-sectional view of the circuit board assembly in one of the manufacturing stages of the method of manufacturing the circuit board assembly according to some embodiments of the present application. FIG. 8B is a cross-sectional view of the circuit board assembly according to some embodiments of the present application. The embodiment shows a cross-sectional view of the circuit board assembly at one of the manufacturing stages in the method of manufacturing the circuit board assembly, and FIG. 8C is a partial top view of FIG. 8B according to some embodiments of the present application. Next, as shown in FIGS. 8A and 8B , in operation S24 , the second circuit substrate 800 is disposed on the first circuit substrate 500 , wherein the second circuit substrate 800 laterally surrounds the package module 400 . The second circuit substrate 800 may include a second base material layer 802, a prepreg 804 and a metal foil layer 806 that are pressed together.

Specifically, openings may be formed in the second circuit substrate 800 first, for example, openings may be formed in the second base material layer 802, openings may be formed in the prepreg 804, and openings may be formed in the metal foil layer 806, as shown in FIG. 8A. As shown, the aforementioned openings are larger than the size of the packaging module 400; then, the second base material layer 802, the prepreg 804 and the metal foil layer 806 are stacked on the first circuit substrate 500, wherein the packaging module 400 is configured due to the aforementioned openings. in the second base material layer 802, prepreg film 804 and metal foil layer 806; then, the second base material layer 802, prepreg film 804 and metal foil layer 806 are pressed together to form a third package surrounding the packaging module 400. The second circuit substrate 800 is shown in Figure 8B.

The materials in the second circuit substrate 800 can be combined or pressed together through the prepreg 804 to form the second circuit substrate 800 . The prepreg 804 may be disposed around the second base material layer 802 . In some embodiments, the prepreg 804 laterally surrounds the packaging module 400 . In a further embodiment, the prepreg 804 laterally surrounds and directly contacts the packaging module 400, as shown in FIG. 8C, thereby improving the bonding force between the packaging module 400 and the second circuit substrate 800.

In other words, a part of the outer surface 202ES (please refer to FIG. 2 ) of the shielding case 202 , such as a lateral part, may directly contact the second circuit substrate 800 . In contrast, another portion of the outer surface 202ES of the shielding case 202 may be exposed, such as the outer upper surface of the shielding case 202 in FIG. 8B .

The prepreg 804 may include a fluid glue material. Therefore, during the process of assembling or pressing the second circuit substrate 800, the fluid glue material is squeezed and may be distributed in the groove 512 (please refer to FIG. 7A). , the space between the packaging module 400 and the base material layer (such as the second base material layer 802), or other accommodation areas. For example, the prepreg 804 may be distributed between the packaging module 400 and the metal foil layer 806 . Alternatively, the prepreg 804 may be distributed between the packaging module 400 and the second substrate layer 802 . In some embodiments, as shown in FIG. 8B , the lateral outer surface of the packaging module 400 can completely and directly contact the prepreg 804 , thereby improving the bonding force between the packaging module 400 and the second circuit substrate 800 . In some further embodiments, the adhesive material 702 and the second pad 510 directly contact the prepreg 804 .

It should be noted that although the embodiments of FIGS. 8A and 8B only illustrate a single layer of the second base material layer 802 and the metal foil layer 806 , the number of layers can be adjusted according to the actual process or product design, which is also the case here. within the scope of application.

In some embodiments, after operation S22 (please refer to FIG. 7A ) is completed, operation S24 is performed. Because the package module 400 has been installed on the first circuit substrate 500, in the operation S24 after the operation S22, the opening is first formed in the second base material layer 802, the opening is formed in the prepreg 804, and the opening is formed in the metal In the foil layer 806, as shown in FIG. 8A, the size of each of the aforementioned openings may be equal to or larger than the size of the packaging module 400, so that when configuring the second base material layer 802, the prepreg 804 and the metal foil layer 806 on the first circuit During the process of placing on the substrate 500 , the package module 400 can be disposed in the second base material layer 802 , the prepreg 804 and the metal foil layer 806 through the aforementioned openings, and then be embedded in the second circuit substrate 800 .

When the aforementioned operation is adopted, since the electronic component 300 is designed to be embedded in the shielding case 202 first, in the subsequent process, the shielding case 202 can be used as a protective cover for the electronic component 300 to prevent the electronic component 300 from being squeezed or extruded by external forces. The reliability of the electronic component 300 can be improved by causing damage due to collision. Furthermore, the electronic component 300 is designed to be first embedded in the shielding case 202 and then combined into a single component (i.e., the package module 400 ), thereby simplifying operations in subsequent processes (for example, installing the package module 400 in the first operation of the circuit substrate 500).

In FIG. 8B , operation S24 may include performing a grinding process on the second circuit substrate 800 to remove excess portions of the prepreg 804 located on the top surface 400T of the package module 400 or on the top surface 806T of the metal foil layer 806 . After the grinding process, the top surface 400T of the package module 400 may be coplanar with the top surface 806T of the metal foil layer 806 . In some embodiments, the top surface 400T of the packaging module 400, the top surface 806T of the metal foil layer 806, and the top surface 804T of the prepreg 804 are coplanar with each other.

The material of the second substrate layer 802 may include a dielectric material, and the dielectric material may be formed of a polymer or a non-polymer. For example, it is formed of LCP, BT, film, resin containing inorganic fillers (eg, ABF), epoxy resin, PI, or other resin materials, but the present application is not limited to the above examples. In some embodiments, the second substrate layer 802 may be formed of a photoimageable dielectric material or a photosensitive dielectric material. The material of the metal foil layer 806 may include gold, silver, copper, nickel, tin, other suitable metals, or alloys of combinations of the above materials. In some embodiments, metal foil layer 806 may be a copper foil layer.

Please refer to FIG. 9 , which is a cross-sectional view of the circuit board assembly at one of the manufacturing stages in a method of manufacturing the circuit board assembly according to some embodiments of the present application. Next, in operation S26, the metal layer 900 is disposed on the packaging module 400. Specifically, the metal layer 900 is disposed on the shield case 202 . In some embodiments, metal layer 900 directly contacts shield 202 . For example, the metal layer 900 may directly contact a portion of the outer surface 202ES (please refer to FIG. 2 ) of the shielding case 202 , where this portion is the exposed portion in FIG. 8A , such as the outer upper surface of the shielding case 202 . Therefore, the heat generated by the electronic component 300 can be conducted to the metal layer 900 via the thermally conductive adhesive 304 and the shielding case 202 .

In some embodiments, metal layer 900 only connects shield 202 . Furthermore, the metal layer 900 may not provide the function of transmitting electrical signals. In some embodiments, trenches 902 are formed around the metal layer 900 to separate the metal layer 900, thereby electrically isolating the metal layer 900 from other circuits.

In operation S26, a conductive through hole 904 or a conductive blind hole 906 may also be formed in the first circuit substrate 500 or the second circuit substrate 800. The conductive blind hole 906 can be electrically connected to the first pad 508 .

The method of forming the conductive via 904 or the conductive blind hole 906 may include a mechanical or laser drilling process, an exposure and development process, an etching process, an electroplating process, an electroless plating process, or sputtering. process, evaporation process, other suitable processes, or a combination of the above processes. The conductive via 904 may be solid or hollow, and the hollow conductive via 904 may be filled with insulating material in subsequent processes.

Please refer to FIG. 10 , which is a cross-sectional view of the circuit board assembly at one of the manufacturing stages in a method of manufacturing the circuit board assembly according to some embodiments of the present application. Next, in operation S28, the solder mask layer 1000 is disposed on the first circuit substrate 500 or the second circuit substrate 800, where the solder mask layer 1000 does not cover the metal layer 900 on the package module 400 to facilitate heat dissipation. For example, the heat generated by the electronic component 300 can be conducted to the metal layer 900 through the thermally conductive adhesive 304 and the shielding cover 202. Then, the exposed metal layer 900 can discharge the heat to the outside through thermal radiation, thereby improving heat dissipation. efficiency.

The material of the solder mask 1000 may include epoxy resin, polyimide, or other suitable materials. Moreover, additives, such as hardeners or photoinitiators, can be added to the aforementioned materials according to process requirements or product design, but the application is not limited to the above examples. In some embodiments, the material of the solder mask layer 1000 may be thermosetting solder mask ink. In other embodiments, the material of the solder mask layer 1000 may be photocurable solder mask ink. The formation method of the solder mask layer 1000 may include a deposition process, an exposure and development process, an etching process, a curing process, other suitable processes, or any combination of the above processes. In some embodiments, solder mask 1000 may be formed using screen printing techniques.

At this point, a circuit board assembly with embedded electronic components 300 has basically been manufactured.

In summary, embodiments of the present application provide a circuit board assembly and a manufacturing method thereof. First, the electronic components are embedded in the shielding case, and then the combined structure of the electronic components and the shielding case is embedded in the circuit board, which helps to simplify the process of the circuit board assembly. Moreover, during the process, the shielding cover can protect the electronic components from damage caused by external forces, thereby improving the reliability of the electronic components and the subsequently formed circuit board assembly. Furthermore, the metal shielding cover can function as electromagnetic shielding and can also increase the heat dissipation efficiency of electronic components, thereby improving the performance of the circuit board assembly with embedded electronic components.

The above has briefly described the features of several embodiments of the present application, so that those skilled in the art can more easily understand the present application. Anyone skilled in the art should understand that this description can be easily used as a basis for modification or design of other structures or processes to achieve the same purposes and/or obtain the same advantages as the embodiments of the present application. Anyone skilled in the art can also understand that structures equivalent to the above do not deviate from the spirit and scope of the present application, and that changes, substitutions and modifications can be made without departing from the spirit and scope of the present application.

【Symbol Description】

100:Metal block

200:Open your mouth

202:Shielding cover

202ES:Outer surface

202IS:Inner surface

300: Electronic components

300AS: Active side

302: Pad

304: Thermal conductive adhesive

400:Package module

400T: Top surface

500: First circuit substrate

502: First base material layer

504: First circuit layer

506: Second circuit layer

508:First pad

510: Second pad

512:Trench

600:Insulation parts

602: Pattern opening

700:Solder

702:Adhesive material

800: Second circuit substrate

802: Second base material layer

804: Semi-cured film

804T: Top surface

806:Metal foil layer

806T: Top surface

900:Metal layer

902:Trench

904:Conductive via

906:Conductive blind hole

1000: solder mask

D1: direction

S10～S28: Operation.

Claims (10)

1. A method of manufacturing a circuit board assembly, comprising:

forming a shielding cover;

configuring heat-conducting glue and electronic elements in the shielding cover, so that the shielding cover, the heat-conducting glue and the electronic elements form a packaging module;

mounting the packaging module on a connecting pad of a first circuit substrate, wherein the electronic element is electrically connected with the connecting pad; and

after the packaging module is arranged on the connecting pad of the first circuit substrate, a second circuit substrate is arranged on the first circuit substrate, wherein the second circuit substrate transversely surrounds the packaging module.

2. The method of manufacturing a circuit board assembly according to claim 1, wherein an opening is formed in the second circuit substrate after the packaging module is mounted on the pads of the first circuit substrate and before the second circuit substrate is disposed on the first circuit substrate, such that the packaging module is embedded in the second circuit substrate through the opening during the disposing of the second circuit substrate on the first circuit substrate.

3. The method of manufacturing a circuit board assembly of claim 1, wherein disposing the thermally conductive paste and the electronic component in the shield comprises:

distributing the heat conducting glue in the shielding case; and

and placing the electronic component into the shielding cover, wherein the heat-conducting glue is arranged between the shielding cover and the electronic component, so that the heat-conducting glue electrically isolates the shielding cover and the electronic component.

4. The method of manufacturing a circuit board assembly of claim 1, wherein forming the shield comprises:

providing a metal block; and

an opening is formed in the metal block, wherein the opening extends from an outer surface of the metal block to an interior.

5. A circuit board assembly, comprising:

a first circuit substrate including a pad;

a package module disposed on the first circuit substrate, comprising:

an electronic element arranged on the connecting pad;

a shield case surrounding the electronic component; and

the heat-conducting glue is clamped between the electronic element and the shielding cover; and

the second circuit substrate is arranged on the first circuit substrate and transversely surrounds the packaging module.

6. The circuit board assembly of claim 5, further comprising:

solder disposed between the package module and the bonding pad and connecting the package module and the bonding pad.

7. The circuit board assembly of claim 6, further comprising:

and an insulating member disposed between and over the pads and including pattern openings, wherein the solder is distributed in the pattern openings.

8. The circuit board assembly of claim 5, wherein

The electronic element is provided with a first surface, and the first surface is connected with the connecting pad;

the heat-conducting glue does not cover the first surface, but completely covers other surfaces of the electronic component; and

the shield does not surround the first surface but completely surrounds other surfaces of the electronic component.

9. The circuit board assembly of claim 5, wherein the shield has an outer surface and an inner surface, a portion of the outer surface directly contacting the second circuit substrate and the inner surface directly and fully contacting the thermally conductive paste.

10. The circuit board assembly of claim 9, further comprising a metal layer disposed on the shield and directly contacting another portion of the outer surface.