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CN117260545A - Feedback dressing device and method for detecting CMP (chemical mechanical polishing) dresser pressure and CMP dresser - Google Patents

Feedback dressing device and method for detecting CMP (chemical mechanical polishing) dresser pressure and CMP dresser Download PDF

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Publication number
CN117260545A
CN117260545A CN202311444652.XA CN202311444652A CN117260545A CN 117260545 A CN117260545 A CN 117260545A CN 202311444652 A CN202311444652 A CN 202311444652A CN 117260545 A CN117260545 A CN 117260545A
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China
Prior art keywords
pressure
dresser
detection
disc
dressing
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CN202311444652.XA
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Chinese (zh)
Inventor
樊荣
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Shanghai IC Equipment Material Industry Innovation Center Co Ltd
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Shanghai IC Equipment Material Industry Innovation Center Co Ltd
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Priority to CN202311444652.XA priority Critical patent/CN117260545A/en
Publication of CN117260545A publication Critical patent/CN117260545A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007Cleaning of grinding wheels
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

本发明提供了一种侦测CMP修整器压力的反馈修整装置、方法及CMP修整器,包括压力侦测装置;修整器处于空闲状态时修整盘与压力侦测装置的侦测部位对应设置,处于空闲状态的修整器用于带动修整盘压接到侦测部位上,将修整器压力通过修整盘传递到侦测部位上;压力侦测装置通过侦测部位侦测通过修整盘传递的修整器压力;修整器处于工作状态时修整盘与置于研磨盘上的研磨垫对应设置,处于工作状态的修整器用于带动修整盘压接到研磨垫的研磨面上,将修整器压力通过修整盘传递到研磨垫上。本发明通过压力侦测装置,可以清楚侦测修整器压力,方便根据侦测的修整器压力调整修整器压力,进而降低因修整器压力过大或过小对晶圆研磨速率的影响。

The invention provides a feedback trimming device and method for detecting the pressure of a CMP trimmer, and a CMP trimmer, which includes a pressure detection device; when the trimmer is in an idle state, the trimming disk is set correspondingly to the detection part of the pressure detection device. The dresser in the idle state is used to drive the dressing disc to be pressed against the detection part, and transmit the dresser pressure to the detection part through the dressing disc; the pressure detection device detects the dresser pressure transmitted through the dressing disc through the detection part; When the dresser is in the working state, the dressing disc is set correspondingly with the grinding pad placed on the grinding disc. The dresser in the working state is used to drive the dressing disc to be pressed against the grinding surface of the grinding pad, and transmit the dresser pressure to the grinding surface through the dressing disc. Pad. The present invention can clearly detect the dresser pressure through the pressure detection device, so as to facilitate the adjustment of the dresser pressure according to the detected dresser pressure, thereby reducing the impact on the wafer grinding rate due to excessive or too low dresser pressure.

Description

侦测CMP修整器压力的反馈修整装置、方法及CMP修整器Feedback dressing device and method for detecting pressure of CMP dresser and CMP dresser

技术领域Technical field

本发明涉及CMP修整器压力修整的技术领域,尤其涉及一种侦测CMP修整器压力的反馈修整装置、方法及CMP修整器。The present invention relates to the technical field of CMP dresser pressure trimming, and in particular to a feedback trimming device and method for detecting CMP dresser pressure and a CMP dresser.

背景技术Background technique

如图1所示,在芯片制造工艺中,修整器1上安装有修整盘2,该修整器为CMP修整器(Chemical-Mechanical Planarization Pad conditioner,化学机械研磨修整器)。修整器的修整盘(Disk)与置于研磨盘上的研磨垫(Pad)对应设置,修整器带动修整盘下压到对应的研磨垫的上表面,修整器将修整器压力通过修整盘传递到研磨垫上,并通过修整盘打磨研磨垫的上表面。打磨新的研磨垫的上表面有打开表面微孔暖机的作用,使用修整盘在新的研磨垫的上表面打磨把研磨垫表面微孔打开后,在晶圆研磨过程中化学机械抛光研磨液可以充分进入到研磨垫微孔中,这样可以达到晶圆的研磨速率。另外,打磨研磨垫能够去除研磨垫表面残留的颗粒物和保持研磨垫表面活化状态,确保研磨速率的稳定。晶圆在研磨过程中产生的颗粒物会进入到研磨垫微孔中,这时修整盘在研磨垫上打磨可以去除颗粒物,使研磨液可以进入到研磨垫微孔中继续保持研磨速率。As shown in Figure 1, in the chip manufacturing process, a dressing disk 2 is installed on the dresser 1, which is a CMP dresser (Chemical-Mechanical Planarization Pad conditioner, chemical mechanical polishing dresser). The dressing disc (Disk) of the dresser is set correspondingly with the grinding pad (Pad) placed on the grinding disc. The dresser drives the dressing disc to press down to the upper surface of the corresponding grinding pad. The dresser transmits the dresser pressure through the dressing disc to the grinding pad. onto the polishing pad and sand the upper surface of the polishing pad with the dressing disc. Grinding the upper surface of the new polishing pad has the effect of opening the micropores on the surface to warm up the machine. Use a dressing disk to polish the upper surface of the new polishing pad to open the micropores on the surface of the polishing pad, and then chemically and mechanically polish the abrasive liquid during the wafer grinding process. It can fully enter the micropores of the polishing pad, so that the polishing rate of the wafer can be achieved. In addition, polishing the polishing pad can remove residual particles on the surface of the polishing pad and maintain the activated state of the polishing pad surface to ensure the stability of the polishing rate. The particles generated during the grinding process of the wafer will enter the micropores of the polishing pad. At this time, the dressing disc can be polished on the polishing pad to remove the particles, so that the grinding fluid can enter the micropores of the polishing pad to continue to maintain the polishing rate.

针对上述相关技术,申请人认为现有的工艺中如果修整器压力过大修整盘会对研磨垫上表面产生过度消耗,如果修整器压力过小修整盘会对研磨垫上表面颗粒物去除力不足,修整器压力过大或过小也都会对晶圆的研磨速率产生影响。发生以上情况一般需要停机检查,需要使用特定工具进行检测修整器压力,不能及时的发现解决问题。特定工具为一种特制的治具,用于检查修整器压力,治具分两个部件,一个部件是修整器压力盘,需要拆除修整盘后装在修整器上,另一部件是侦测装置放置于研磨垫上,研磨垫位于研磨盘上;安装好后修整器带动修整器压力盘下压到侦测装置上,修整器将修整器压力通过修整器压力盘传递到侦测装置上,根据侦测装置得到的结果对修整器压力进行校准。Regarding the above related technologies, the applicant believes that in the existing process, if the dresser pressure is too high, the dressing disc will cause excessive consumption of the upper surface of the polishing pad; if the dresser pressure is too small, the dressing disc will have insufficient removal power of particles on the upper surface of the polishing pad, and the dresser will Too much or too little pressure will also affect the polishing rate of the wafer. When the above situation occurs, it generally requires shutdown and inspection, and specific tools need to be used to detect the dresser pressure. The problem cannot be found and solved in time. The specific tool is a special jig used to check the dresser pressure. The jig is divided into two parts. One part is the dresser pressure plate, which needs to be removed and installed on the dresser. The other part is the detection device. Place it on the grinding pad, which is located on the grinding disc; after installation, the dresser drives the dresser pressure plate to press down on the detection device, and the dresser transmits the dresser pressure to the detection device through the dresser pressure plate. Calibrate the dresser pressure using the results obtained from the measuring device.

发明内容Contents of the invention

针对现有技术中的缺陷,本发明的目的在于提供一种侦测CMP修整器压力的反馈修整装置、方法及CMP修整器。In view of the deficiencies in the prior art, the purpose of the present invention is to provide a feedback trimming device and method for detecting the pressure of a CMP trimmer, and a CMP trimmer.

为实现上述目的,第一方面,本发明提供了一种侦测CMP修整器压力的反馈修整装置,包括用于侦测修整器压力的压力侦测装置;In order to achieve the above object, in the first aspect, the present invention provides a feedback trimming device for detecting the pressure of a CMP trimmer, including a pressure detection device for detecting the pressure of the trimmer;

所述修整器上安装有修整盘;A dressing disk is installed on the dresser;

所述修整器处于空闲状态时修整盘与压力侦测装置的侦测部位对应设置,且处于空闲状态的修整器用于带动修整盘压接到对应的侦测部位上,将修整器压力通过修整盘传递到侦测部位上;When the dresser is in an idle state, the dressing disc is set correspondingly to the detection part of the pressure detection device, and the dresser in the idle state is used to drive the dressing disc to be pressed to the corresponding detection part, and the dresser pressure passes through the dressing disc. passed to the detection site;

所述压力侦测装置通过侦测部位侦测通过修整盘传递的修整器压力;The pressure detection device detects the dresser pressure transmitted through the dressing disc through the detection part;

所述修整器处于工作状态时修整盘与置于研磨盘上的研磨垫对应设置,且处于工作状态的修整器用于带动修整盘压接到对应的研磨垫的研磨面上,将修整器压力通过修整盘传递到研磨垫上,并通过修整盘打磨研磨垫的研磨面。When the dresser is in the working state, the dressing disc is set correspondingly with the grinding pad placed on the grinding disc, and the dresser in the working state is used to drive the dressing disc to be pressed against the grinding surface of the corresponding grinding pad, and the dresser pressure is passed through The dressing disc is transferred to the polishing pad and the polishing surface of the polishing pad is polished by the dressing disc.

优选的,所述侦测部位与研磨垫的研磨面在同一平面上。Preferably, the detection part and the polishing surface of the polishing pad are on the same plane.

优选的,所述压力侦测装置包括侦测盘和侦测传感器;Preferably, the pressure detection device includes a detection disk and a detection sensor;

所述侦测部位位于侦测盘的盘正面上;The detection location is located on the front side of the detection disk;

所述侦测传感器位于侦测盘的盘背面上。The detection sensor is located on the back of the detection disk.

优选的,所述侦测盘的盘正面内嵌设有用于清洗修整盘的清洗装置。Preferably, a cleaning device for cleaning the trimming disk is embedded in the front surface of the detection disk.

优选的,所述侦测盘的盘正面内开设有用于排出清洗装置废水的排水口;Preferably, a drain outlet for discharging waste water from the cleaning device is provided in the front surface of the detection disk;

所述侦测盘的盘正面呈漏斗状设置,且排水口位于侦测盘的盘正面底部位置。The front surface of the detection disk is arranged in a funnel shape, and the drain outlet is located at the bottom of the front surface of the detection disk.

优选的,所述侦测传感器包括多个压力传感器,且多个压力传感器在侦测盘的盘背面呈三角形排列分布。Preferably, the detection sensor includes a plurality of pressure sensors, and the plurality of pressure sensors are arranged in a triangular arrangement on the back of the detection disk.

优选的,该反馈修整装置还包括反馈处理装置;Preferably, the feedback trimming device further includes a feedback processing device;

所述反馈处理装置根据压力侦测装置侦测的修整器压力调整修整器压力。The feedback processing device adjusts the dresser pressure according to the dresser pressure detected by the pressure detection device.

优选的,所述反馈处理装置设定压力预设值,并将压力预设值传输给处于空闲状态的修整器;Preferably, the feedback processing device sets the pressure preset value and transmits the pressure preset value to the dresser in the idle state;

处于空闲状态的修整器根据压力预设值带动修整盘压接在侦测部位上,将修整器压力通过修整盘传递到侦测部位上;The dresser in the idle state drives the dressing disc to be pressed against the detection part according to the preset pressure value, and the dresser pressure is transmitted to the detection part through the dressing disc;

所述压力侦测装置通过侦测部位侦测通过修整盘传递的修整器压力,得到实际压力值,并将实际压力值传输给反馈处理装置;The pressure detection device detects the dresser pressure transmitted through the dressing plate through the detection part, obtains the actual pressure value, and transmits the actual pressure value to the feedback processing device;

所述反馈处理装置接收实际压力值,将实际压力值和压力预设值进行比对,得到处理结果,根据处理结果调整修整器压力。The feedback processing device receives the actual pressure value, compares the actual pressure value with the preset pressure value, obtains the processing result, and adjusts the dresser pressure according to the processing result.

第二方面,本发明提供了一种侦测CMP修整器压力的反馈修整方法,应用第一方面任一所述的侦测CMP修整器压力的反馈修整装置,包括如下步骤:In a second aspect, the present invention provides a feedback trimming method for detecting CMP dresser pressure. The feedback trimming device for detecting CMP dresser pressure as described in any one of the first aspects is applied, including the following steps:

压力设定步骤:设定压力预设值,并将压力预设值传输给处于空闲状态的修整器;Pressure setting step: Set the pressure preset value and transmit the pressure preset value to the dresser in idle state;

压力侦测步骤:处于空闲状态的修整器根据压力预设值带动修整盘压接在侦测部位上,将修整器压力通过修整盘传递到侦测部位上;压力侦测装置通过侦测部位侦测通过修整盘传递的修整器压力,得到实际压力值;Pressure detection step: The dresser in idle state drives the dressing plate to be pressed against the detection part according to the preset pressure value, and transmits the pressure of the dresser to the detection part through the dressing plate; the pressure detection device detects the pressure through the detection part. Measure the dresser pressure transmitted through the dressing disc to obtain the actual pressure value;

压力调整步骤:将实际压力值和压力预设值进行比对,得到处理结果,根据处理结果调整修整器压力。Pressure adjustment step: Compare the actual pressure value and the preset pressure value to obtain the processing result, and adjust the dresser pressure according to the processing result.

第三方面,本发明提供了一种CMP修整器,包括修整器本体以及第一方面任一所述的侦测CMP修整器压力的反馈修整装置。In a third aspect, the present invention provides a CMP dresser, including a dresser body and any feedback trimming device for detecting the pressure of the CMP dresser described in the first aspect.

与现有技术相比,本发明包括如下有益效果:Compared with the prior art, the present invention includes the following beneficial effects:

本发明修整器处于空闲状态时,可以带动修整盘压接到侦测部位上,将修整器压力通过修整盘传递到侦测部位上,压力侦测装置通过侦测部位侦测通过修整盘传递的修整器压力,根据侦测的修整器压力调整修整器压力,进而修整器处于工作状态时,带动修整盘压接到研磨垫的研磨面上,将调整后的修整器压力通过修整盘传递到研磨垫上,并通过修整盘打磨研磨垫的研磨面。本发明通过压力侦测装置,可以清楚侦测修整器压力,方便根据侦测的修整器压力调整修整器压力,进而降低因修整器压力过大或过小对晶圆研磨速率的影响,从而确保研磨速率的稳定,有效的去除研磨垫表面残留的颗粒物,另外,无需拆卸修整盘,也无需把压力侦测装置放置在研磨垫上侦测,降低压力侦测装置污染研磨垫的风险,节省了更换研磨垫和修整盘的时间,不用定期停机检查修整器压力,可以提高修整器的使用率。When the dresser of the present invention is in an idle state, it can drive the dressing plate to be pressed against the detection part, and the pressure of the dresser is transmitted to the detection part through the dressing plate. The pressure detection device detects the pressure transmitted through the dressing plate through the detection part. The dresser pressure is adjusted according to the detected dresser pressure. When the dresser is in working condition, it drives the dresser disc to be pressed against the grinding surface of the grinding pad, and the adjusted dresser pressure is transmitted to the grinder through the dresser disc. Pad and polish the abrasive surface of the abrasive pad with the dressing disc. The present invention can clearly detect the dresser pressure through the pressure detection device, so as to facilitate the adjustment of the dresser pressure according to the detected dresser pressure, thereby reducing the impact of the dresser pressure being too high or too low on the wafer grinding rate, thereby ensuring The stable polishing rate effectively removes residual particles on the surface of the polishing pad. In addition, there is no need to disassemble the dressing disk, and there is no need to place the pressure detection device on the polishing pad for detection, which reduces the risk of the pressure detection device contaminating the polishing pad and saves replacement. Grinding pad and dressing disc time, no need to shut down regularly to check the dresser pressure, which can improve the use rate of the dresser.

附图说明Description of the drawings

图1为现有技术的修整器结构示意图;Figure 1 is a schematic structural diagram of a dresser in the prior art;

图2为本发明实施例一带有反馈修整装置的修整器结构示意图;Figure 2 is a schematic structural diagram of a dresser with a feedback dressing device according to Embodiment 1 of the present invention;

图3为本发明实施例一修整器处于空闲状态时的示意图;Figure 3 is a schematic diagram of the dresser in an idle state according to Embodiment 1 of the present invention;

图4为本发明实施例一修整器处于工作状态时的示意图;Figure 4 is a schematic diagram of the dresser in a working state according to Embodiment 1 of the present invention;

图5为本发明实施例一的压力侦测装置的示意图;Figure 5 is a schematic diagram of the pressure detection device according to Embodiment 1 of the present invention;

图6为本发明实施例一的反馈处理装置和压力侦测装置分布示意图。Figure 6 is a schematic diagram showing the distribution of the feedback processing device and the pressure detection device according to Embodiment 1 of the present invention.

附图标记:Reference signs:

1、修整器;2、修整盘;3、第一清洗喷嘴;4、压力侦测装置;5、排水口;6、侦测盘;7、压力传感器;8、第二清洗喷嘴。1. Dresser; 2. Dressing disc; 3. First cleaning nozzle; 4. Pressure detection device; 5. Drainage outlet; 6. Detection disc; 7. Pressure sensor; 8. Second cleaning nozzle.

具体实施方式Detailed ways

为使本发明的目的、技术方案和优点更加清楚,下面将结合本发明的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。除非另外定义,此处使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本文中使用的“包括”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同,而不排除其他元件或者物件。In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are part of the present invention. Examples, not all examples. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present invention. Unless otherwise defined, technical or scientific terms used herein shall have their ordinary meaning understood by one of ordinary skill in the art to which this invention belongs. The use of "comprising" and similar words herein means that the elements or things appearing before the word include the elements or things listed after the word and their equivalents, without excluding other elements or things.

本发明实施例一公开了一种侦测CMP修整器压力的反馈修整装置,如图2所示,包括用于侦测修整器1压力的压力侦测装置4,修整器1上安装有修整盘2。Embodiment 1 of the present invention discloses a feedback trimming device for detecting the pressure of a CMP trimmer. As shown in Figure 2, it includes a pressure detection device 4 for detecting the pressure of the trimmer 1. The trimmer 1 is equipped with a trimming disk. 2.

如图3和图4所示,修整器1能够进行空闲状态和工作状态的位置转换,修整器1处于空闲状态时修整盘2与压力侦测装置4的侦测部位对应设置,且处于空闲状态的修整器1用于带动修整盘2压接到对应的侦测部位上,将修整器1压力通过修整盘2传递到侦测部位上。压力侦测装置4通过侦测部位侦测通过修整盘2传递的修整器1压力。其中,侦测部位为压力侦测装置4接触修整盘2的部位。修整器1处于空闲状态时,修整器1位于初始位置处。As shown in Figures 3 and 4, the dresser 1 can perform position conversion between the idle state and the working state. When the dresser 1 is in the idle state, the dressing disc 2 is set correspondingly to the detection part of the pressure detection device 4, and is in the idle state. The dresser 1 is used to drive the dressing disc 2 to be pressed to the corresponding detection part, and transmit the pressure of the dresser 1 to the detection part through the dressing disc 2. The pressure detection device 4 detects the pressure of the dresser 1 transmitted through the dressing disc 2 through the detection part. Among them, the detection part is the part where the pressure detection device 4 contacts the trimming disc 2 . When the dresser 1 is in the idle state, the dresser 1 is at the initial position.

修整器1处于工作状态时修整盘2与置于研磨盘上的研磨垫对应设置,且处于工作状态的修整器1用于带动修整盘2压接到对应的研磨垫的研磨面上,将修整器1压力通过修整盘2传递到研磨垫上,并通过修整盘2打磨研磨垫的研磨面。其中,研磨垫的研磨面为研磨垫的上表面。When the dresser 1 is in the working state, the dressing disc 2 is arranged corresponding to the grinding pad placed on the grinding disc, and the dresser 1 in the working state is used to drive the dressing disc 2 to be pressed against the grinding surface of the corresponding grinding pad, and the dressing disc 2 is pressed against the grinding surface of the corresponding grinding pad. The pressure of the device 1 is transmitted to the polishing pad through the dressing disc 2, and the polishing surface of the polishing pad is polished through the dressing disc 2. Wherein, the polishing surface of the polishing pad is the upper surface of the polishing pad.

压力侦测装置4的侦测部位与研磨垫的研磨面在同一水平面上。The detection part of the pressure detection device 4 is on the same horizontal plane as the polishing surface of the polishing pad.

如图3和图5所示,压力侦测装置4包括侦测盘6和侦测传感器;压力侦测装置4的侦测部位位于侦测盘6的盘正面上;侦测传感器位于侦测盘6的盘背面上。修整器1处于空闲状态时,修整盘2与侦测传感器的位置均是固定的,且修整盘2与侦测盘6为同心上下位关系。As shown in Figures 3 and 5, the pressure detection device 4 includes a detection disk 6 and a detection sensor; the detection part of the pressure detection device 4 is located on the front of the detection disk 6; the detection sensor is located on the detection disk 6 6 on the back of the plate. When the dresser 1 is in an idle state, the positions of the dressing disc 2 and the detection sensor are fixed, and the dressing disc 2 and the detection disc 6 are in a concentric upper-lower relationship.

侦测盘6的盘正面内嵌设有用于清洗修整盘2的清洗装置,清洗装置嵌入侦测盘6内。清洗装置用于清洗修整盘2表面上残留的研磨垫颗粒物及研磨液。A cleaning device for cleaning the trimming disk 2 is embedded in the front of the detection disk 6 , and the cleaning device is embedded in the detection disk 6 . The cleaning device is used to clean the remaining grinding pad particles and grinding fluid on the surface of the dressing disc 2 .

侦测盘6的盘正面内开设有用于排出清洗装置废水的排水口5;侦测盘6的盘正面呈漏斗状设置,且排水口5位于侦测盘6的盘正面底部位置。侦测盘6为漏斗状方便排水,排水后使用修整盘2接触侦测盘6不会对侦测产生误差。A drain outlet 5 for discharging waste water from the cleaning device is provided in the front of the detection pan 6; the front of the detection pan 6 is arranged in a funnel shape, and the drain outlet 5 is located at the bottom of the front of the detection pan 6. The detection disk 6 is funnel-shaped to facilitate drainage. After drainage, using the trimming disk 2 to contact the detection disk 6 will not cause errors in detection.

由于侦测盘6的盘正面为漏斗状,修整盘2接触侦测盘6的侦测部位为线接触。例如修整盘2为圆形,侦测盘6的外径大于修整盘2的外径,侦测盘6内的侦测部位接触修整盘2的边缘部分。Since the front surface of the detection disk 6 is funnel-shaped, the trimming disk 2 contacts the detection part of the detection disk 6 in line contact. For example, the dressing disc 2 is circular, the outer diameter of the detection disc 6 is larger than the outer diameter of the dressing disc 2 , and the detection part in the detection disc 6 contacts the edge of the dressing disc 2 .

清洗装置位于漏斗内壁,高于排水口5的位置。清洗装置为一个或多个第一清洗喷嘴3,第一清洗喷嘴3设置为多个时,清洗喷嘴3围绕排水口5设置。例如第一清洗喷嘴3设置为三个,用于清洗修整盘2表面残留的研磨垫颗粒物。The cleaning device is located on the inner wall of the funnel, higher than the drain outlet 5. The cleaning device is one or more first cleaning nozzles 3 . When there are multiple first cleaning nozzles 3 , the cleaning nozzles 3 are arranged around the drain outlet 5 . For example, three first cleaning nozzles 3 are provided for cleaning the remaining polishing pad particles on the surface of the dressing disc 2 .

侦测传感器包括多个压力传感器7,且多个压力传感器7在侦测盘6的盘背面呈三角形排列分布。例如压力传感器7设置为三个,分别位于等边三角形的三个顶点处,能够使侦测盘平衡。The detection sensor includes a plurality of pressure sensors 7 , and the plurality of pressure sensors 7 are arranged in a triangular arrangement on the back of the detection disk 6 . For example, three pressure sensors 7 are provided, each located at the three vertices of an equilateral triangle, so that the detection disk can be balanced.

如图2所示,修整器1的周围还设置有多个第二清洗喷嘴8,用于清洗修整器1表面上残留的研磨垫颗粒物及研磨液。As shown in FIG. 2 , a plurality of second cleaning nozzles 8 are provided around the dresser 1 for cleaning the remaining polishing pad particles and polishing fluid on the surface of the dresser 1 .

如图2和图5所示,第一清洗喷嘴3和第二清洗喷嘴8均使用开关阀进行开关控制,第一清洗喷嘴3和第二清洗喷嘴8使用的清洗液为去离子水。As shown in Figures 2 and 5, both the first cleaning nozzle 3 and the second cleaning nozzle 8 use on-off valves for switching control, and the cleaning liquid used by the first cleaning nozzle 3 and the second cleaning nozzle 8 is deionized water.

该反馈修整装置还包括反馈处理装置。反馈处理装置根据压力侦测装置4侦测的修整器1压力调整修整器1压力。The feedback trimming device also includes a feedback processing device. The feedback processing device adjusts the pressure of the dresser 1 according to the pressure of the dresser 1 detected by the pressure detection device 4 .

反馈处理装置设定压力预设值,并将压力预设值传输给处于空闲状态的修整器1;处于空闲状态的修整器1根据压力预设值带动修整盘2压接在侦测部位上,将修整器1压力通过修整盘2传递到侦测部位上;压力侦测装置4通过侦测部位侦测通过修整盘2传递的修整器1压力,得到实际压力值,并将实际压力值传输给反馈处理装置;反馈处理装置接收实际压力值,将实际压力值和压力预设值进行比对,得到处理结果,根据处理结果调整修整器1压力。将调整后的修整器1压力作为处于工作状态的修整器1所使用的修整器1压力。The feedback processing device sets the pressure preset value and transmits the pressure preset value to the dresser 1 in the idle state; the dresser 1 in the idle state drives the dressing disc 2 to be pressed against the detection part according to the pressure preset value. The pressure of the dresser 1 is transmitted to the detection part through the dressing disc 2; the pressure detection device 4 detects the pressure of the dresser 1 transmitted through the dressing disc 2 through the detection part, obtains the actual pressure value, and transmits the actual pressure value to Feedback processing device; the feedback processing device receives the actual pressure value, compares the actual pressure value with the preset pressure value, obtains the processing result, and adjusts the pressure of the dresser 1 according to the processing result. The adjusted dresser 1 pressure is used as the dresser 1 pressure used by the dresser 1 in working condition.

具体为,如图6所示,反馈处理装置包括集成模块,指令模块和压力控制器。集成模块例如是HMIPC集成模块,HMIPC为人机接口计算机。指令模块为设备PLC。User为使用者,I/O模块为输入输出模块。集成模块设定压力预设值,并将压力预设值传输给处于空闲状态的修整器1。处于空闲状态的修整器1根据压力预设值带动修整盘2压接在侦测部位上,将修整器1压力通过修整盘2传递到侦测部位上;压力侦测装置4通过侦测部位侦测通过修整盘2传递的修整器1压力,得到实际压力值,并将实际压力值传输给集成模块。集成模块接收实际压力值,将实际压力值和压力预设值进行比对,得到处理结果,将处理结果发送给指令模块。指令模块根据处理结果发送控制指令给压力控制器。压力控制器接收控制指令,并根据控制指令调整修整器1压力。Specifically, as shown in Figure 6, the feedback processing device includes an integration module, a command module and a pressure controller. The integrated module is, for example, an HMIPC integrated module, and HMIPC is a human-machine interface computer. The command module is the equipment PLC. User is the user, and the I/O module is the input and output module. The integrated module sets the pressure preset value and transmits the pressure preset value to the dresser 1 in the idle state. The dresser 1 in the idle state drives the dressing disc 2 to be pressed against the detection part according to the preset pressure value, and the pressure of the dresser 1 is transmitted to the detection part through the dressing disc 2; the pressure detection device 4 detects the pressure through the detection part. Measure the pressure of the dresser 1 transmitted through the dressing disc 2, obtain the actual pressure value, and transmit the actual pressure value to the integrated module. The integrated module receives the actual pressure value, compares the actual pressure value with the preset pressure value, obtains the processing result, and sends the processing result to the instruction module. The instruction module sends control instructions to the pressure controller according to the processing results. The pressure controller receives the control instruction and adjusts the pressure of the dresser 1 according to the control instruction.

现有技术中侦测装置得到的结果手动输入到系统中从而进行校准,一般需要检查0~12lbf的修整器1的压力值,通过现有的修整器压力盘和侦测装置一般需要花费3小时;因为做这项检查需要在研磨垫上操作有污染研磨垫的风险,所以做完校准后需要更换研磨垫和修整盘2需要花费5小时。本发明通过压力侦测装置4及反馈处理装置来精准调节修整器1压力的大小,提高研磨速率的稳定,有效的去除研磨垫表面残留的颗粒物,保持研磨垫表面活化状态,不用定期停机检查修整器1压力,可以提高修整器1的使用率。In the prior art, the results obtained by the detection device are manually input into the system for calibration. Generally, it is necessary to check the pressure value of the dresser 1 from 0 to 12 lbf. It usually takes 3 hours to pass the existing dresser pressure plate and detection device. ; Because this inspection requires operating on the polishing pad and there is a risk of contaminating the polishing pad, it takes 5 hours to replace the polishing pad and dressing disc 2 after the calibration. The present invention accurately adjusts the pressure of the dresser 1 through the pressure detection device 4 and the feedback processing device, improves the stability of the grinding rate, effectively removes residual particles on the surface of the polishing pad, maintains the activated state of the surface of the polishing pad, and eliminates the need for regular shutdowns for inspection and dressing. The pressure of the dresser 1 can improve the usage rate of the dresser 1.

本发明实施例二还公开了一种侦测CMP修整器压力的反馈修整装置,与实施例一的不同之处在于,修整盘2接触侦测盘6的侦测部位为面接触,例如侦测盘6的盘正面为水平面。Embodiment 2 of the present invention also discloses a feedback trimming device for detecting the pressure of a CMP trimmer. The difference from Embodiment 1 is that the detection part where the trimming disc 2 contacts the detection disc 6 is in surface contact. For example, the detection part The front surface of the disk 6 is a horizontal plane.

本发明实施例三还公开了一种侦测CMP修整器压力的反馈修整方法,应用上述实施例的侦测CMP修整器压力的反馈修整装置,包括如下步骤:压力设定步骤:设定压力预设值,并将压力预设值传输给处于空闲状态的修整器1。压力侦测步骤:处于空闲状态的修整器1根据压力预设值带动修整盘2压接在侦测部位上,将修整器1压力通过修整盘2传递到侦测部位上;压力侦测装置4通过侦测部位侦测通过修整盘2传递的修整器1压力,得到实际压力值;压力调整步骤:将实际压力值和压力预设值进行比对,得到处理结果,根据处理结果调整修整器1压力。Embodiment 3 of the present invention also discloses a feedback trimming method for detecting CMP dresser pressure. The feedback trimming device for detecting CMP dresser pressure of the above embodiment includes the following steps: pressure setting step: setting pressure preset Set the value and transmit the pressure preset value to the dresser 1 in idle state. Pressure detection step: The dresser 1 in the idle state drives the dressing disc 2 to be pressed against the detection part according to the preset pressure value, and transmits the pressure of the dresser 1 to the detection part through the dressing disc 2; pressure detection device 4 The pressure of the dresser 1 transmitted through the dressing disc 2 is detected through the detection part to obtain the actual pressure value; the pressure adjustment step: compare the actual pressure value with the preset pressure value to obtain the processing result, and adjust the dresser 1 according to the processing result. pressure.

该反馈修整方法中压力侦测装置4的启用条件可以根据用户需求自定义,例如根据设定的时间或晶圆片数来定义。The activation conditions of the pressure detection device 4 in the feedback trimming method can be customized according to user needs, for example, based on the set time or the number of wafers.

该反馈修整方法具体包括如下步骤:The feedback trimming method specifically includes the following steps:

步骤1:待修整器1处于空闲状态时,根据用户需求定义启用压力侦测装置4,启用时修整器1在初始位置停止旋转,通过开关阀控制关闭第一清洗喷嘴3和第二清洗喷嘴8后通过集成模块设定修整器1的压力预设值,例如设定5lbf,下压到压力侦测装置4上,保持5s得到一个稳定压力。处于空闲状态的修整器1根据压力预设值带动修整盘2压接在侦测部位上,将修整器1压力通过修整盘2传递到侦测部位上;压力侦测装置4通过侦测部位侦测通过修整盘2传递的修整器1压力,得到实际压力值,并将实际压力值传输给集成模块。其中,压力在集成模块软件参数中设定:比如修整器1压力在修整器1的工艺菜单中使用的是5lbf,那集成模块软件参数也设定5lbf,Step 1: When the dresser 1 is in an idle state, enable the pressure detection device 4 according to user requirements. When enabled, the dresser 1 stops rotating at the initial position, and the first cleaning nozzle 3 and the second cleaning nozzle 8 are closed through the switch valve control. Then set the preset pressure value of the dresser 1 through the integrated module, for example, set it to 5lbf, press down on the pressure detection device 4, and maintain it for 5 seconds to obtain a stable pressure. The dresser 1 in the idle state drives the dressing disc 2 to be pressed against the detection part according to the preset pressure value, and the pressure of the dresser 1 is transmitted to the detection part through the dressing disc 2; the pressure detection device 4 detects the pressure through the detection part. Measure the pressure of the dresser 1 transmitted through the dressing disc 2, obtain the actual pressure value, and transmit the actual pressure value to the integrated module. Among them, the pressure is set in the integrated module software parameters: for example, the dresser 1 pressure is 5lbf in the process menu of dresser 1, then the integrated module software parameters are also set to 5lbf.

步骤2:完成步骤1后,集成模块接收实际压力值算与压力设定值比较,若实际压力值和压力设定值误差大于0.2lbf时,由指令模块发送指令给压力控制器,压力控制器通过控制压力调节阀来调节修整器1压力,反之不调整修整器1的压力。例如压力侦测装置4得到实际压力值如果是4lbf,反馈给集成模块进行计算需要补偿1lbf,通过压力控制器来调节到所需的5lbf。Step 2: After completing step 1, the integrated module receives the actual pressure value and compares it with the pressure set value. If the error between the actual pressure value and the pressure set value is greater than 0.2lbf, the instruction module sends an instruction to the pressure controller. The pressure controller The pressure of the dresser 1 is adjusted by controlling the pressure regulating valve, otherwise the pressure of the dresser 1 is not adjusted. For example, if the actual pressure value obtained by the pressure detection device 4 is 4lbf, it is fed back to the integrated module for calculation and needs to be compensated by 1lbf, and the pressure controller is used to adjust to the required 5lbf.

步骤3:调节完以后重复步骤1和步骤2,再次检查修整器1压力是否达到设定值标准,如果调节两次仍没有达到设定值标准时修整器1发出报警,需要宕机检查,如果修整器压力调整完成,修整盘2上升,通过开关阀控制打开第一清洗喷嘴3和第二清洗喷嘴8继续对修整器1和修整盘2进行清洗。Step 3: After adjustment, repeat steps 1 and 2, and check again whether the pressure of dresser 1 reaches the set value standard. If the pressure of dresser 1 still does not reach the set value standard after two adjustments, dresser 1 will sound an alarm and need to be shut down for inspection. After the pressure adjustment is completed, the dressing disc 2 rises, and the first cleaning nozzle 3 and the second cleaning nozzle 8 are opened through the switch valve control to continue cleaning the dresser 1 and the dressing disc 2.

本发明实施例四还公开了一种CMP修整器,包括修整器本体以及上述实施例的侦测CMP修整器压力的反馈修整装置。Embodiment 4 of the present invention also discloses a CMP dresser, which includes a dresser body and a feedback trimming device for detecting the pressure of the CMP dresser of the above embodiment.

虽然在上文中详细说明了本发明的实施方式,但是对于本领域的技术人员来说显而易见的是,能够对这些实施方式进行各种修改和变化。但是,应理解,这种修改和变化都属于权利要求书中所述的本发明的范围和精神之内。而且,在此说明的本发明可有其它的实施方式,并且可通过多种方式实施或实现。Although the embodiments of the present invention have been described in detail above, it will be obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the invention as described in the claims. Furthermore, the invention described herein is capable of other embodiments and of being practiced or carried out in various ways.

Claims (10)

1.一种侦测CMP修整器压力的反馈修整装置,其特征在于,包括用于侦测修整器(1)压力的压力侦测装置(4);1. A feedback trimming device for detecting the pressure of a CMP trimmer, characterized in that it includes a pressure detection device (4) for detecting the pressure of the trimmer (1); 所述修整器(1)上安装有修整盘(2);A dressing disk (2) is installed on the dresser (1); 所述修整器(1)处于空闲状态时修整盘(2)与压力侦测装置(4)的侦测部位对应设置,且处于空闲状态的修整器(1)用于带动修整盘(2)压接到对应的侦测部位上,将修整器(1)压力通过修整盘(2)传递到侦测部位上;When the dresser (1) is in an idle state, the dressing disc (2) is arranged corresponding to the detection part of the pressure detection device (4), and the dresser (1) in the idle state is used to drive the dressing disc (2) to press. Connect it to the corresponding detection part, and transfer the pressure of the dresser (1) to the detection part through the dressing disc (2); 所述压力侦测装置(4)通过侦测部位侦测通过修整盘(2)传递的修整器(1)压力;The pressure detection device (4) detects the pressure of the dresser (1) transmitted through the dressing disk (2) through the detection part; 所述修整器(1)处于工作状态时修整盘(2)与置于研磨盘上的研磨垫对应设置,且处于工作状态的修整器(1)用于带动修整盘(2)压接到对应的研磨垫的研磨面上,将修整器(1)压力通过修整盘(2)传递到研磨垫上,并通过修整盘(2)打磨研磨垫的研磨面。When the dresser (1) is in the working state, the dressing disc (2) is arranged corresponding to the grinding pad placed on the grinding disc, and the dresser (1) in the working state is used to drive the dressing disc (2) to be pressed to the corresponding grinding pad. On the polishing surface of the polishing pad, the pressure of the dresser (1) is transferred to the polishing pad through the dressing disc (2), and the polishing surface of the polishing pad is polished through the dressing disc (2). 2.根据权利要求1所述的侦测CMP修整器压力的反馈修整装置,其特征在于,所述侦测部位与研磨垫的研磨面在同一平面上。2. The feedback dressing device for detecting pressure of a CMP dresser according to claim 1, wherein the detection part is on the same plane as the polishing surface of the polishing pad. 3.根据权利要求1所述的侦测CMP修整器压力的反馈修整装置,其特征在于,所述压力侦测装置(4)包括侦测盘(6)和侦测传感器;3. The feedback trimming device for detecting CMP trimmer pressure according to claim 1, characterized in that the pressure detection device (4) includes a detection disk (6) and a detection sensor; 所述侦测部位位于侦测盘(6)的盘正面上;The detection location is located on the front of the detection disk (6); 所述侦测传感器位于侦测盘(6)的盘背面上。The detection sensor is located on the back of the detection disk (6). 4.根据权利要求3所述的侦测CMP修整器压力的反馈修整装置,其特征在于,所述侦测盘(6)的盘正面内嵌设有用于清洗修整盘(2)的清洗装置。4. The feedback trimming device for detecting CMP trimmer pressure according to claim 3, characterized in that a cleaning device for cleaning the trimming disc (2) is embedded in the front of the detection disc (6). 5.根据权利要求4所述的侦测CMP修整器压力的反馈修整装置,其特征在于,所述侦测盘(6)的盘正面内开设有用于排出清洗装置废水的排水口(5);5. The feedback trimming device for detecting CMP trimmer pressure according to claim 4, characterized in that a drain outlet (5) for discharging waste water from the cleaning device is provided in the front of the detection tray (6); 所述侦测盘(6)的盘正面呈漏斗状设置,且排水口(5)位于侦测盘(6)的盘正面底部位置。The front surface of the detection disk (6) is arranged in a funnel shape, and the drain outlet (5) is located at the bottom of the front surface of the detection disk (6). 6.根据权利要求3所述的侦测CMP修整器压力的反馈修整装置,其特征在于,所述侦测传感器包括多个压力传感器(7),且多个压力传感器(7)在侦测盘(6)的盘背面呈三角形排列分布。6. The feedback trimming device for detecting CMP trimmer pressure according to claim 3, characterized in that the detection sensor includes a plurality of pressure sensors (7), and the plurality of pressure sensors (7) are on the detection disk. (6) The back of the disk is arranged in a triangular arrangement. 7.根据权利要求1所述的侦测CMP修整器压力的反馈修整装置,其特征在于,该反馈修整装置还包括反馈处理装置;7. The feedback trimming device for detecting CMP trimmer pressure according to claim 1, wherein the feedback trimming device further includes a feedback processing device; 所述反馈处理装置根据压力侦测装置(4)侦测的修整器(1)压力调整修整器(1)压力。The feedback processing device adjusts the pressure of the dresser (1) according to the pressure of the dresser (1) detected by the pressure detection device (4). 8.根据权利要求7所述的侦测CMP修整器压力的反馈修整装置,其特征在于,所述反馈处理装置设定压力预设值,并将压力预设值传输给处于空闲状态的修整器(1);8. The feedback trimming device for detecting CMP trimmer pressure according to claim 7, characterized in that the feedback processing device sets a pressure preset value and transmits the pressure preset value to the trimmer in an idle state. (1); 处于空闲状态的修整器(1)根据压力预设值带动修整盘(2)压接在侦测部位上,将修整器(1)压力通过修整盘(2)传递到侦测部位上;The dresser (1) in the idle state drives the dresser disc (2) to be pressed against the detection part according to the preset pressure value, and transmits the pressure of the dresser (1) to the detection part through the dresser disc (2); 所述压力侦测装置(4)通过侦测部位侦测通过修整盘(2)传递的修整器(1)压力,得到实际压力值,并将实际压力值传输给反馈处理装置;The pressure detection device (4) detects the pressure of the dresser (1) transmitted through the dressing disk (2) through the detection part, obtains the actual pressure value, and transmits the actual pressure value to the feedback processing device; 所述反馈处理装置接收实际压力值,将实际压力值和压力预设值进行比对,得到处理结果,根据处理结果调整修整器(1)压力。The feedback processing device receives the actual pressure value, compares the actual pressure value with the preset pressure value, obtains the processing result, and adjusts the dresser (1) pressure according to the processing result. 9.一种侦测CMP修整器压力的反馈修整方法,其特征在于,应用权利要求1-8任一所述的侦测CMP修整器压力的反馈修整装置,包括如下步骤:9. A feedback trimming method for detecting CMP trimmer pressure, characterized in that applying the feedback trimming device for detecting CMP trimmer pressure according to any one of claims 1 to 8 includes the following steps: 压力设定步骤:设定压力预设值,并将压力预设值传输给处于空闲状态的修整器(1);Pressure setting step: set the pressure preset value and transmit the pressure preset value to the dresser in idle state (1); 压力侦测步骤:处于空闲状态的修整器(1)根据压力预设值带动修整盘(2)压接在侦测部位上,将修整器(1)压力通过修整盘(2)传递到侦测部位上;压力侦测装置(4)通过侦测部位侦测通过修整盘(2)传递的修整器(1)压力,得到实际压力值;Pressure detection step: The dresser (1) in idle state drives the dressing disc (2) to be pressed against the detection part according to the preset pressure value, and the pressure of the dresser (1) is transmitted to the detection part through the dressing disc (2). position; the pressure detection device (4) detects the pressure of the dresser (1) transmitted through the dressing disc (2) through the detection position, and obtains the actual pressure value; 压力调整步骤:将实际压力值和压力预设值进行比对,得到处理结果,根据处理结果调整修整器(1)压力。Pressure adjustment step: Compare the actual pressure value and the preset pressure value to obtain the processing result, and adjust the dresser (1) pressure according to the processing result. 10.一种CMP修整器,其特征在于,包括修整器本体以及权利要求1-8任一所述的侦测CMP修整器压力的反馈修整装置。10. A CMP dresser, characterized in that it includes a dresser body and a feedback dressing device for detecting CMP dresser pressure according to any one of claims 1 to 8.
CN202311444652.XA 2023-11-01 2023-11-01 Feedback dressing device and method for detecting CMP (chemical mechanical polishing) dresser pressure and CMP dresser Pending CN117260545A (en)

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