CN117971604B - A static current prediction method, device, storage medium and electronic device - Google Patents
A static current prediction method, device, storage medium and electronic device Download PDFInfo
- Publication number
- CN117971604B CN117971604B CN202410371074.XA CN202410371074A CN117971604B CN 117971604 B CN117971604 B CN 117971604B CN 202410371074 A CN202410371074 A CN 202410371074A CN 117971604 B CN117971604 B CN 117971604B
- Authority
- CN
- China
- Prior art keywords
- static current
- current prediction
- processor
- static
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3003—Monitoring arrangements specially adapted to the computing system or computing system component being monitored
- G06F11/3024—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system component is a central processing unit [CPU]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
- G06F11/3062—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations where the monitored property is the power consumption
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computing Systems (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Mathematical Physics (AREA)
- Biomedical Technology (AREA)
- Evolutionary Computation (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Data Mining & Analysis (AREA)
- Computational Linguistics (AREA)
- Biophysics (AREA)
- Artificial Intelligence (AREA)
- Software Systems (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Power Sources (AREA)
Abstract
The application provides a static current prediction method, a device, a storage medium and electronic equipment, wherein the method comprises the following steps: acquiring voltage and temperature corresponding to a target processor; and inputting the voltage and the temperature into a static current prediction model, and outputting the static current corresponding to the target processor by the static current prediction model. According to the scheme, through the static current prediction model, the static current corresponding to the target processor can be rapidly and accurately obtained based on the voltage and the temperature. In addition, the reference information (voltage and temperature) acquisition mode required by the static current prediction method provided by the scheme of the application is easy, the calculation complexity for acquiring the static current corresponding to the target processor is low, and the method is favorable for quickly and accurately acquiring the static current corresponding to the target processor.
Description
Technical Field
The present application relates to the field of electronic technologies, and in particular, to a static current prediction method, a static current prediction device, a storage medium, and an electronic device.
Background
A System on Chip (SoC) is a Chip integration of an information System core, which integrates key components of the System on a Chip, and is an important component in an electronic device. The system on a chip includes a processor, which may be a central processing unit (Central Processing Unit, abbreviated as CPU) or a graphics processor (Graphics Processing Unit, abbreviated as GPU) and the like. The static current of the processor can reflect the power efficiency, the energy efficiency and the heat dissipation performance of the chip during the operation of the processor, and is an important monitoring index of the processor.
Therefore, how to accurately and quickly acquire the quiescent current of the processor becomes a problem of concern to those skilled in the art.
Disclosure of Invention
The application aims to provide a static current prediction method, a static current prediction device, a storage medium and electronic equipment, so as to at least partially improve the problems.
In order to achieve the above object, the technical scheme adopted by the embodiment of the application is as follows:
In a first aspect, an embodiment of the present application provides a static current prediction method, applied to an electronic device, where the method includes:
acquiring voltage and temperature corresponding to a target processor;
and inputting the voltage and the temperature into a static current prediction model, and outputting the static current corresponding to the target processor by the static current prediction model.
Optionally, the expression of the static current prediction model is:
wherein, Representing the static current output by the static current prediction model, V representing the voltage corresponding to the target processor, T representing the temperature corresponding to the target processor,Model parameters representing the static current prediction model,，M and n are integers.
Optionally, the electronic device is deployed with a memory, and the memory is used for storing model parameters of a pre-trained static current prediction model, and after the electronic device is initialized, the method further comprises:
reading the model parameters from the memory;
And constructing the static current prediction model based on the model parameters.
Optionally, the static current prediction model is a neural network model or a deep learning model which is trained in advance.
Optionally, after the static current prediction model outputs the static current corresponding to the target processor, the method further includes:
And determining the static power consumption corresponding to the target processor based on the static current and the voltage.
Optionally, the electronic device is deployed with a memory, and after determining the static power consumption corresponding to the target processor based on the static current and the voltage, the method further includes:
writing the static current and/or the static power consumption into a target interval in the memory.
Optionally, the static current prediction model is a model trained by a sample data set, where the sample data set includes a sample voltage, a sample temperature and a sample static current corresponding to a preset number of collection time points, the sample voltage is a voltage of a sample processor at the collection time points, the sample temperature is a temperature of the sample processor at the collection time points, and the sample static current is a static current of the sample processor at the collection time points.
In a second aspect, an embodiment of the present application provides a static current prediction apparatus, applied to an electronic device, where the apparatus includes:
the processing unit is used for acquiring the voltage and the temperature corresponding to the target processor;
And the prediction unit is used for inputting the voltage and the temperature into a static current prediction model, and the static current prediction model outputs the static current corresponding to the target processor.
In a third aspect, an embodiment of the present application provides a storage medium having stored thereon a computer program which, when executed by a processor, implements the method described above.
In a fourth aspect, an embodiment of the present application provides an electronic device, including: a processor and a memory for storing one or more programs; the above-described method is implemented when the one or more programs are executed by the processor.
Compared with the prior art, the static current prediction method, the device, the storage medium and the electronic equipment provided by the embodiment of the application comprise the following steps: acquiring voltage and temperature corresponding to a target processor; and inputting the voltage and the temperature into a static current prediction model, and outputting the static current corresponding to the target processor by the static current prediction model. According to the scheme, through the static current prediction model, the static current corresponding to the target processor can be rapidly and accurately obtained based on the voltage and the temperature. In addition, the reference information (voltage and temperature) acquisition mode required by the static current prediction method provided by the scheme of the application is easy, the calculation complexity for acquiring the static current corresponding to the target processor is low, and the method is favorable for quickly and accurately acquiring the static current corresponding to the target processor.
In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 2 is a schematic flow chart of a static current prediction method according to an embodiment of the present application;
FIG. 3 is a second flowchart of a static current prediction method according to an embodiment of the present application;
FIG. 4 is a third flow chart of a static current prediction method according to an embodiment of the present application;
fig. 5 is a schematic diagram of a unit of a static current prediction device according to an embodiment of the present application.
In the figure: 10-a processor; 11-memory; 12-bus; 13-a power controller; 301-a processing unit; 302-prediction unit.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only to distinguish the description, and are not to be construed as indicating or implying relative importance.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the description of the present application, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or those conventionally put in use in the application, are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.
In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed", "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
Some embodiments of the present application are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
At present, the static current of a processor in a system on chip is monitored, and the static current of the processor in the system on chip needs to be estimated by means of data table look-up and data analysis. The method is influenced by various individual differences of experimental environment, experimental equipment, integrated circuits of the system-on-chip and the like, and various errors in data acquisition, processing, model training and the like, various accumulated errors can be caused on the static current estimation of a processor in the system-on-chip, the data accuracy can be greatly influenced, and great uncertainty can be brought to the heat dissipation and the temperature protection of the system-on-chip.
The embodiment of the application provides electronic equipment which can be a system on a chip or a mobile phone, a computer, a driving computer, a server device and the like comprising the system on a chip. Referring to fig. 1, a schematic structure of an electronic device is shown. The electronic device comprises a processor 10, a memory 11, a bus 12. The processor 10 and the memory 11 are connected by a bus 12, the processor 10 being adapted to execute executable modules, such as computer programs, stored in the memory 11.
The processor 10 may be an integrated circuit chip with signal processing capabilities. In implementation, the steps of the quiescent current prediction method may be accomplished by integrated logic circuitry of hardware or instructions in software form in the processor 10. The processor 10 may be a general-purpose processor, including a central processing unit (Central Processing Unit, CPU for short), a network processor (Network Processor, NP for short), etc.; but may also be a digital signal Processor (DIGITAL SIGNAL Processor, DSP), application Specific Integrated Circuit (ASIC), field-Programmable gate array (FPGA) or other Programmable logic device, discrete gate or transistor logic device, discrete hardware components.
The memory 11 may comprise a high-speed random access memory (RAM: random Access Memory) or may further comprise a non-volatile memory (non-volatile memory), such as at least one disk memory.
Bus 12 may be ISA (Industry Standard Architecture) bus, PCI (Peripheral Component Interconnect) bus, EISA (Extended Industry Standard Architecture) bus, or the like. Only one double-headed arrow is shown in fig. 1, but not only one bus 12 or one type of bus 12.
The memory 11 is used for storing programs, such as programs corresponding to the static current predicting device. The static current predicting means comprise at least one software function module which may be stored in the memory 11 in the form of software or firmware (firmware) or cured in an Operating System (OS) of the electronic device. The processor 10, upon receiving the execution instruction, executes the program to implement the quiescent current prediction method.
Optionally, the electronic device provided by the embodiment of the application further includes a power controller 13. The power controller 13 is connected to the processor 10 via a bus. The power controller 13 can monitor the voltage and temperature of the monitored object. The monitoring object may be each processor in the system on chip, including: a central processing unit (Central Processing Unit, CPU for short) or a graphics processor (Graphics Processing Unit, GPU for short), etc.
Optionally, the power controller 13 samples the monitored object in the system on chip at preset periodic intervals, acquires the voltage and temperature thereof, and transmits the acquired voltage and temperature to the processor 10.
It should be understood that the structure shown in fig. 1 is a schematic structural diagram of only a portion of an electronic device, which may also include more or fewer components than shown in fig. 1, or have a different configuration than shown in fig. 1. The components shown in fig. 1 may be implemented in hardware, software, or a combination thereof.
The static current prediction method provided by the embodiment of the application can be applied to the electronic device shown in fig. 1, and is particularly applicable to the flow, please refer to fig. 2, and the static current prediction method includes: s103 and S104 are specifically described below.
S103, acquiring the voltage and the temperature corresponding to the target processor.
Alternatively, the target processor may be any one of the processors in the system on chip. The electronic device may monitor the target processor through the power controller 13, so as to obtain the voltage and the temperature corresponding to the target processor.
In an alternative embodiment, the power controller 13 samples the target processor in the system-on-chip at preset periodic intervals, acquires the voltage and temperature of the target processor, and transmits the acquired voltage and temperature to the processor 10. The voltage and temperature of the target processor, which are continuously transmitted, constitute the data stream corresponding to the target processor.
S104, inputting the voltage and the temperature into a static current prediction model, and outputting the static current corresponding to the target processor by the static current prediction model.
The static current prediction model may be a pre-trained mathematical derivation model, a pre-trained neural network model, or a pre-trained deep learning model.
The processor 10 may invoke a static current prediction model and input the voltage and temperature into the static current prediction model, which outputs the static current corresponding to the target processor.
According to the scheme, through the static current prediction model, the static current corresponding to the target processor can be rapidly and accurately obtained based on the voltage and the temperature. In addition, the reference information (voltage and temperature) acquisition mode required by the static current prediction method provided by the scheme of the application is easy, the calculation complexity for acquiring the static current corresponding to the target processor is low, and the method is favorable for quickly and accurately acquiring the static current corresponding to the target processor.
Optionally, the static current prediction model is a mathematical derivation model which is trained in advance, and the expression of the static current prediction model is:
wherein, Representing the static current output by the static current prediction model, V representing the voltage corresponding to the target processor, T representing the temperature corresponding to the target processor,Model parameters representing a static current prediction model,，M and n are integers.
It should be noted that m and n need to take values from 0 to K in order, that is, m=1, 2, … K, n=1, 2, … K, and K are preset values.
Optionally, the electronic device is deployed with a memory 11, where the memory 11 is configured to store model parameters of a pre-trained static current prediction model, on the basis of which, with reference to fig. 3, the embodiment of the present application further provides an optional implementation manner regarding how to obtain the static current prediction model, and after the initialization of the electronic device is completed, the static current prediction method further includes: s101 and S102 are specifically described below.
S101, reading model parameters from a memory.
Optionally, the processor 10 reads from the memory 11Model parameters.
S102, constructing a static current prediction model based on model parameters.
Alternatively, the expression of the completed static current prediction model is as shown above.
On the basis of fig. 2, with respect to how to obtain the static power consumption of the target processor, the embodiment of the present application further provides an alternative implementation, referring to fig. 4, after the static current prediction model outputs the static current corresponding to the target processor, the static current prediction method further includes: s105 is specifically described below.
S105, determining the static power consumption corresponding to the target processor based on the static current and the voltage.
Alternatively, the static power consumption is calculated as:
P=V×I；
Wherein P represents the static power consumption corresponding to the target processor, V represents the voltage corresponding to the target processor, and I represents the static current corresponding to the target processor.
It should be noted that, when the power controller 13 samples at preset period intervals, the voltage and the temperature of the target processor that are continuously transmitted form a data stream corresponding to the target processor, and the obtained quiescent current and the quiescent power consumption corresponding to the target processor also form a corresponding data stream.
With continued reference to fig. 4, regarding how to utilize the obtained static power consumption and static current, the present application further provides an alternative embodiment, after determining the static power consumption corresponding to the target processor based on the static current and the voltage, the static current prediction method further includes: s106 is specifically described below.
S106, writing the static current and/or the static power consumption into a target interval in the memory.
Optionally, other modules or applications are deployed in the electronic device, and the other modules or applications can read the data in the target interval and write the static current and/or static power consumption into the target interval in the memory for reading by the other modules or applications for subsequent processing.
In an alternative embodiment, the static current prediction model is a model trained by a sample data set, where the sample data set includes a sample voltage, a sample temperature, and a sample static current corresponding to a preset number of collection time points, the sample voltage is a voltage of the sample processor at the collection time points, the sample temperature is a temperature of the sample processor at the collection time points, and the sample static current is a static current of the sample processor at the collection time points.
Optionally, the embodiment of the application also provides a static current prediction model training method, which is applied to an upper computer and comprises the following steps: s201, S202, and S203, refer to the following for specific steps.
S201, sampling a sample processor in a sample system-on-chip according to a preset period interval to obtain a sample data set.
The system on a sample is the same as the system on a chip deployed in the electronic equipment in the scheme of the application, and the sample processor is the same as the target processor.
Optionally, the power controller in the system on a sample chip is used for sampling the sample processor according to a preset period interval, so as to obtain the sample voltage and the sample temperature corresponding to each acquisition time point. Sampling the sample processor according to a preset periodic interval by using peripheral precise current measurement equipment so as to obtain sample quiescent current corresponding to each acquisition time point.
It should be noted that, in the off-line measurement, the static current sampling may be completed by the precise current measurement device, and when the precise current measurement device is not deployed in the actual electronic device, the corresponding static current cannot be directly obtained.
S202, training is conducted based on the sample data set to obtain a static current prediction model.
And S203, writing the trained static current prediction model into a memory of the electronic equipment.
Optionally, the static current prediction model is a mathematical derivation model which is trained in advance, and the expression of the static current prediction model is:
。
After training is completed, model parameters of the static current prediction model may be written into a memory of the electronic device, such as, but not limited to, by curing programming means The model parameters are permanently cured and stored in a memory of the electronic device.
Referring to fig. 5, fig. 5 is a schematic diagram illustrating an embodiment of a static current prediction apparatus according to the present application, and the static current prediction apparatus is optionally applied to the electronic device described above.
The static current prediction device includes: a processing unit 301 and a prediction unit 302.
A processing unit 301, configured to obtain a voltage and a temperature corresponding to the target processor;
The prediction unit 302 is configured to input the voltage and the temperature into a static current prediction model, where the static current prediction model outputs a static current corresponding to the target processor.
Alternatively, the processing unit 301 may perform S101, S102, S103, S105, and S106 described above, and the prediction unit 302 may perform S104 described above.
It should be noted that, the static current prediction apparatus provided in this embodiment may execute the method flow shown in the method flow embodiment to achieve the corresponding technical effects. For a brief description, reference is made to the corresponding parts of the above embodiments, where this embodiment is not mentioned.
The embodiment of the application also provides a storage medium, which stores computer instructions and programs, and the computer instructions and the programs execute the static current prediction method of the embodiment when being read and executed. The storage medium may include memory, flash memory, registers, combinations thereof, or the like.
The following provides an electronic device, which may be a system on a chip, or a mobile phone, a computer, a driving computer, a server device, etc. including a system on a chip, where the electronic device is shown in fig. 1, and may implement the above-mentioned static current prediction method; specifically, the electronic device includes: a processor 10, a memory 11, a bus 12. The processor 10 may be a CPU. The memory 11 is used to store one or more programs that, when executed by the processor 10, perform the quiescent current prediction method of the above-described embodiments.
In summary, the method, the device, the storage medium and the electronic device for predicting the quiescent current provided by the embodiment of the application include: acquiring voltage and temperature corresponding to a target processor; and inputting the voltage and the temperature into a static current prediction model, and outputting the static current corresponding to the target processor by the static current prediction model. According to the scheme, through the static current prediction model, the static current corresponding to the target processor can be rapidly and accurately obtained based on the voltage and the temperature. In addition, the reference information (voltage and temperature) acquisition mode required by the static current prediction method provided by the scheme of the application is easy, the calculation complexity for acquiring the static current corresponding to the target processor is low, and the method is favorable for quickly and accurately acquiring the static current corresponding to the target processor.
The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
It will be evident to those skilled in the art that the application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410371074.XA CN117971604B (en) | 2024-03-29 | 2024-03-29 | A static current prediction method, device, storage medium and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410371074.XA CN117971604B (en) | 2024-03-29 | 2024-03-29 | A static current prediction method, device, storage medium and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117971604A CN117971604A (en) | 2024-05-03 |
| CN117971604B true CN117971604B (en) | 2024-08-02 |
Family
ID=90858415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410371074.XA Active CN117971604B (en) | 2024-03-29 | 2024-03-29 | A static current prediction method, device, storage medium and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117971604B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106462465A (en) * | 2014-05-20 | 2017-02-22 | 高通股份有限公司 | Algorithm for preferred core sequencing to maximize performance and reduce chip temperature and power |
| CN112014617A (en) * | 2019-05-30 | 2020-12-01 | 北京新能源汽车股份有限公司 | Method, device and system for testing quiescent current of whole vehicle |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2285516B (en) * | 1994-01-05 | 1997-07-30 | Hewlett Packard Co | Quiescent current testing of dynamic logic systems |
| US6968287B2 (en) * | 2004-04-01 | 2005-11-22 | Texas Instrustments Incorporated | System and method for predicting burn-in conditions |
| US9117045B2 (en) * | 2008-02-14 | 2015-08-25 | International Business Machines Coporation | System and method to predict chip IDDQ and control leakage components |
| US10365702B2 (en) * | 2017-04-10 | 2019-07-30 | International Business Machines Corporation | Autonomic supply voltage compensation for degradation of circuits over circuit lifetime |
| CN113049866A (en) * | 2019-12-27 | 2021-06-29 | 北京新能源汽车股份有限公司 | Static current test system and static current test method of electric automobile |
| KR20220045358A (en) * | 2020-10-05 | 2022-04-12 | 주식회사 엘지에너지솔루션 | Battery apparatus and method for predicting battery output |
| CN115308562A (en) * | 2021-05-08 | 2022-11-08 | 腾讯科技（深圳）有限公司 | Chip testing method and related equipment |
| WO2023272615A1 (en) * | 2021-06-30 | 2023-01-05 | 华为技术有限公司 | Quiescent power dissipation estimation method and related apparatus |
| CN113988469B (en) * | 2021-11-17 | 2024-09-24 | 海光信息技术股份有限公司 | Method and device for predicting static power consumption of chip, electronic equipment and storage medium |
| CN117074925B (en) * | 2023-10-16 | 2023-12-29 | 中诚华隆计算机技术有限公司 | 3D chip test analysis method and system |
| CN117538754A (en) * | 2023-11-13 | 2024-02-09 | 广州三晶电气股份有限公司 | Dynamic fault prediction method and device for energy storage single battery |
-
2024
- 2024-03-29 CN CN202410371074.XA patent/CN117971604B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106462465A (en) * | 2014-05-20 | 2017-02-22 | 高通股份有限公司 | Algorithm for preferred core sequencing to maximize performance and reduce chip temperature and power |
| CN112014617A (en) * | 2019-05-30 | 2020-12-01 | 北京新能源汽车股份有限公司 | Method, device and system for testing quiescent current of whole vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117971604A (en) | 2024-05-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112560401A (en) | Verilog file conversion method, device, storage medium and equipment | |
| CN105550354A (en) | Configuration file management method and system | |
| CN110542474A (en) | Device vibration signal detection method, system, medium and device | |
| CN117971604B (en) | A static current prediction method, device, storage medium and electronic device | |
| CN114924119B (en) | Clock chip and frequency measuring method | |
| CN114416458B (en) | Test method, device, equipment and storage medium | |
| US9646252B2 (en) | Template clauses based SAT techniques | |
| US8627273B2 (en) | Model checking of liveness property in a phase abstracted model | |
| CN118032160A (en) | Transformer wireless temperature measurement method, system, electronic equipment and storage medium | |
| CN117033208A (en) | Interface contract checking method and device, electronic equipment and storage medium | |
| CN117093463A (en) | Test program scheduling strategy generation method and device, storage medium and electronic equipment | |
| CN115689061A (en) | Wind power ultra-short term power prediction method and related equipment | |
| Kulikov et al. | Power consumption meter for energy monitoring and debugging | |
| CN109522565A (en) | A kind of verification method, device and computer readable storage medium | |
| CN109829575B (en) | Energy data prediction processing method and device, readable medium and electronic equipment | |
| CN117724985B (en) | Memory access behavior monitoring method and device, storage medium and electronic equipment | |
| US9280622B2 (en) | Circuit verifying apparatus, circuit verifying method, and circuit verifying program | |
| CN119533750B (en) | A method and related equipment for detecting the peak-to-peak value of pressure pulsation of a hydropower station unit under transient conditions | |
| US20250004999A1 (en) | Remediating a change in a system of representation of information in data used by a data pipeline | |
| US20250005392A1 (en) | Managing data influenced by a stochastic element for use in a data pipeline | |
| CN113569884B (en) | Model training method, device, electronic equipment and computer readable storage medium | |
| US20250265250A1 (en) | Database management based on predicted retrieval of data | |
| CN101739321A (en) | Hardware device testing method and hardware device testing system | |
| KR102413753B1 (en) | Information processing apparatus, information processing method, and information processing program stored in a recording medium | |
| CN117873879A (en) | Automatic generation method of UI test script, electronic equipment and storage medium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 201000 Building C, No. 888 Huanhu West Second Road, Lingang New Area, Pudong New Area (Shanghai) Pilot Free Trade Zone, Shanghai Patentee after: This chip technology group Co.,Ltd. Country or region after: China Address before: 201000 Building C, No. 888 Huanhu West Second Road, Lingang New Area, Pudong New Area (Shanghai) Pilot Free Trade Zone, Shanghai Patentee before: This Core Technology (Shanghai) Co.,Ltd. Country or region before: China |