CN118055575A - Manufacturing method of circuit board assembly and circuit board assembly - Google Patents
Manufacturing method of circuit board assembly and circuit board assembly Download PDFInfo
- Publication number
- CN118055575A CN118055575A CN202211461036.0A CN202211461036A CN118055575A CN 118055575 A CN118055575 A CN 118055575A CN 202211461036 A CN202211461036 A CN 202211461036A CN 118055575 A CN118055575 A CN 118055575A
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- circuit
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- layer
- insulating layer
- conductive paste
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 176
- 229910000679 solder Inorganic materials 0.000 claims abstract description 29
- 238000003825 pressing Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 58
- 229910052802 copper Inorganic materials 0.000 claims description 58
- 239000010949 copper Substances 0.000 claims description 58
- 238000007747 plating Methods 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 20
- 230000004308 accommodation Effects 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 description 17
- 238000003475 lamination Methods 0.000 description 11
- 229920000106 Liquid crystal polymer Polymers 0.000 description 6
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- -1 Polypropylene Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A method of making a circuit board assembly, comprising: providing a first circuit substrate and a second circuit substrate, wherein the first circuit substrate is provided with a first accommodating hole, and the second circuit substrate is provided with a second accommodating hole; providing an intermediate substrate, wherein the intermediate substrate comprises an intermediate insulating layer and intermediate conductive paste, and the intermediate conductive paste penetrates through the intermediate insulating layer; placing the intermediate substrate between the first circuit substrate and the second circuit substrate, and pressing, wherein the intermediate conductive paste is accommodated in the first accommodating hole and the second accommodating hole; arranging a solder mask layer on the surface of the first circuit substrate, which is away from the middle substrate, forming blind holes on the solder mask layer, wherein the projection of the blind holes on the middle substrate is at least partially overlapped with the middle conductive paste; and filling the blind holes with conductive objects, and electrically connecting an electronic element with the first circuit board through the conductive objects to obtain the circuit board assembly. The application also provides a circuit board assembly.
Description
Technical Field
The present application relates to the field of circuit boards, and in particular, to a method for manufacturing a circuit board assembly and a circuit board assembly.
Background
With the development of electronic technology, the miniaturization demands of users for electronic products are increasing. The circuit board is one of the components that fulfill the above requirements, and thus, there is a need to increase the mounting density of electronic components on the circuit board.
In the existing circuit board process, an electronic element is connected to a circuit board through a bonding pad, and a connection area can avoid a via hole, so that the mounting density of the electronic element on the circuit board is low; if the connection area does not avoid the via hole, the electronic component is not reliably electrically connected with the circuit board.
Disclosure of Invention
A method of making a circuit board assembly, comprising: providing a first circuit substrate, wherein the first circuit substrate comprises a first insulating layer and first circuit layers positioned on two opposite surfaces of the first insulating layer, the first circuit substrate is provided with first accommodating holes, the first circuit layers are surrounded to form the first accommodating holes, and the first accommodating holes are blind holes; providing a second circuit substrate, wherein the second circuit substrate comprises a second insulating layer and a second circuit layer positioned on at least one surface of the second insulating layer, the second circuit substrate is provided with a second accommodating hole, and the second circuit layer is surrounded to form the second accommodating hole; providing an intermediate substrate, wherein the intermediate substrate comprises an intermediate insulating layer and intermediate conductive paste, and the intermediate conductive paste penetrates through the intermediate insulating layer; placing the intermediate substrate between the first circuit substrate and the second circuit substrate and pressing, wherein the intermediate conductive paste is accommodated in the first accommodating hole and connected with the first circuit layer, and is accommodated in the second accommodating hole and connected with the second circuit layer; arranging a solder mask layer on the surface of the first circuit substrate, which is away from the middle substrate, forming blind holes on the solder mask layer, wherein the projection of the blind holes on the middle substrate is at least partially overlapped with the middle conductive paste, and part of the first circuit layer is exposed to the solder mask layer; and filling the blind hole with a conductive material, and electrically connecting an electronic element with the first circuit layer through the conductive material to obtain the circuit board assembly.
In some embodiments of the present application, the step of forming the first wiring substrate includes: providing a double-sided copper-clad plate, wherein the double-sided copper-clad plate comprises a first insulating layer and copper layers positioned on two opposite surfaces of the first insulating layer; forming a through hole penetrating the copper layer and the first insulating layer; electroplating to fill holes, forming copper plating layers on the surface of one copper layer and in the through holes, wherein the copper plating layers in the through holes are sunken relative to the copper plating layers on the surface of the copper layer so as to form first accommodating holes; and carrying out circuit manufacture on the copper layer and the copper plating layer so as to form a first circuit layer on two opposite surfaces of the first insulating layer, thereby obtaining the first circuit substrate.
In some embodiments of the present application, the method further comprises the step of filling the first receiving hole and/or the second receiving hole with a conductive paste prior to the pressing step.
In some embodiments of the present application, the intermediate conductive paste is copper paste.
In some embodiments of the application, the conductive material includes tin, bismuth, and silver.
A method of making a circuit board assembly, comprising: providing a first circuit substrate, wherein the first circuit substrate comprises a first insulating layer and first circuit layers positioned on two opposite surfaces of the first insulating layer, the first circuit substrate is provided with first accommodating holes, the first circuit layers are surrounded to form the first accommodating holes, and the first accommodating holes are through holes; providing a second circuit substrate, wherein the second circuit substrate comprises a second insulating layer and a second circuit layer positioned on at least one surface of the second insulating layer, the second circuit substrate is provided with a second accommodating hole, and the second circuit layer is surrounded to form the second accommodating hole; providing an intermediate substrate, wherein the intermediate substrate comprises an intermediate insulating layer and intermediate conductive paste, and the intermediate conductive paste penetrates through the intermediate insulating layer; placing the intermediate substrate between the first circuit substrate and the second circuit substrate and pressing, wherein the intermediate conductive paste is accommodated in the first accommodating hole and connected with the first circuit layer, and is accommodated in the second accommodating hole and connected with the second circuit layer, and the intermediate conductive paste penetrates through the first circuit substrate; arranging a solder mask layer on the surface of the first circuit substrate, which is away from the middle substrate, forming blind holes on the solder mask layer, wherein the projection of the blind holes on the middle substrate is at least partially overlapped with the middle conductive paste, and the middle conductive paste is exposed to the solder mask layer; and filling the blind hole with a conductive material, and electrically connecting an electronic element with the middle conductive paste through the conductive material to obtain the circuit board assembly.
In some embodiments of the present application, the step of forming the first wiring substrate includes: providing a double-sided copper-clad plate, wherein the double-sided copper-clad plate comprises a first insulating layer and copper layers positioned on two opposite surfaces of the first insulating layer; forming a through hole penetrating the copper layer and the first insulating layer; electroplating to fill holes, forming copper plating layers on the surface of the copper layer and in the through holes, wherein the copper plating layers in the through holes are annular and are connected with the two copper layers to form first accommodating holes; and carrying out circuit manufacture on the copper layer and the copper plating layer so as to form a first circuit layer on two opposite surfaces of the first insulating layer, thereby obtaining the first circuit substrate.
A circuit board assembly comprises a first circuit substrate, a second circuit substrate, an intermediate substrate, an electronic element and a conductive object. The first circuit substrate comprises a first insulating layer and first circuit layers positioned on two opposite surfaces of the first insulating layer; the middle substrate comprises a middle insulating layer and middle conductive paste, the middle conductive paste penetrates through the middle insulating layer, and part of the middle conductive paste is accommodated in the first circuit substrate and the second circuit substrate; the electronic element is positioned on one side of the first circuit substrate away from the middle substrate; the projection of the conductive object on the intermediate substrate is at least partially overlapped with the intermediate conductive paste, and the conductive object is connected with the first circuit layer and the electronic element.
In some embodiments of the present application, the intermediate conductive paste is copper paste.
A circuit board assembly comprises a first circuit substrate, a second circuit substrate, an intermediate substrate, an electronic element and a conductive object. The first circuit substrate comprises a first insulating layer and first circuit layers positioned on two opposite surfaces of the first insulating layer; the middle substrate comprises a middle insulating layer and middle conductive paste, the middle conductive paste penetrates through the middle insulating layer, part of the middle conductive paste is accommodated in the first circuit substrate and the second circuit substrate, and the middle conductive paste penetrates through the first circuit substrate; the electronic element is positioned on one side of the first circuit substrate away from the middle substrate; the projection of the conductive object on the intermediate substrate is at least partially overlapped with the intermediate conductive paste, and the conductive object is connected with the intermediate conductive paste and the electronic element.
The circuit board assembly manufactured by the manufacturing method provided by the embodiment of the application adopts the middle conductive paste to fill the first accommodating hole and the second accommodating hole so as to improve the flatness of the circuit board, and then the electronic element is welded above the first accommodating hole and the second accommodating hole, so that the installation of the electronic element is not limited by a via hole area in the related technology, the installation density of the electronic element can be improved, and the miniaturization of the circuit board assembly is realized; in addition, the middle conductive paste is filled with holes to connect circuit layers of different layers, so that the transmission path of the signal layer can be effectively shortened, and the signal loss in high-frequency transmission is greatly reduced.
Drawings
Fig. 1 is a schematic perspective view of a circuit board assembly according to the related art of the present application.
Fig. 2 is a schematic cross-sectional view of a double-sided copper-clad plate according to an embodiment of the present application.
Fig. 3 is a schematic cross-sectional view of the double-sided copper-clad plate shown in fig. 2 after forming a through hole.
Fig. 4 is a schematic cross-sectional view of the structure shown in fig. 3 after electroplating of the via.
Fig. 5 is a schematic cross-sectional view of a first circuit board obtained after the circuit fabrication of the structure shown in fig. 4.
Fig. 6 is a schematic cross-sectional view of a first circuit substrate, an intermediate substrate, and a second circuit substrate according to the present embodiment.
Fig. 7 is a schematic cross-sectional view of the first circuit substrate, the intermediate substrate and the second circuit substrate shown in fig. 6 after lamination.
Fig. 8 is a schematic cross-sectional view of the circuit board obtained after forming solder masks on the surfaces of the first circuit substrate and the second circuit substrate shown in fig. 7.
Fig. 9 is a schematic cross-sectional view of the circuit board assembly obtained after connecting the electronic components to the circuit board shown in fig. 8.
Fig. 10 is a schematic perspective view of a circuit board assembly according to an embodiment of the present application.
Fig. 11 is a schematic cross-sectional view of a first circuit substrate, an intermediate substrate, and a second circuit substrate according to another embodiment of the present application.
Fig. 12 is a schematic cross-sectional view of the first circuit substrate, the intermediate substrate, and the second circuit substrate shown in fig. 11 after lamination.
Fig. 13 is a schematic cross-sectional view of the circuit board assembly obtained by forming solder resist layers on the surfaces of the first circuit substrate and the second circuit substrate shown in fig. 12 and electrically connecting the electronic components.
Fig. 14 is a schematic perspective view of a circuit board assembly according to another embodiment of the application.
Description of the main reference signs
Detailed Description
In order that the above-recited objects, features and advantages of the present application will be more clearly understood, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description. The embodiments of the present application and the features in the embodiments may be combined with each other without collision. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, and the described embodiments are merely some, rather than all, embodiments of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes all and any combination of one or more of the associated listed items.
In various embodiments of the present application, for convenience of description and not limitation, the term "coupled" as used in the specification and claims of the present application is not limited to physical or mechanical coupling, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which change accordingly when the absolute position of the object to be described changes.
Referring to fig. 1, the related art provides a circuit board assembly 100 'including a circuit board 60' and an electronic component 80', wherein the circuit board 60' and the electronic component 80 'are electrically connected through a pad 70'. The circuit board 60 'is provided with a plurality of vias 90', the vias 90 'being used to conduct wiring layers of different layers in the circuit board 60'. Due to process limitations, the via 90 'typically has a recess therein and the overall flatness of the circuit board 60' is low. If the electronic component 80 'is attached to the via 90', a solder empty problem may occur, resulting in failure of the electrical connection between the electronic component 80 'and the circuit board 60'; if the electronic component 80 'is avoided from the via hole 90', the area of the circuit board 60 'needs to be enlarged, and the circuit board assembly 100' cannot be miniaturized.
Referring to fig. 2 to 10, an embodiment of the present application provides a method for manufacturing a circuit board assembly 100, which includes the following steps:
Step S1: referring to fig. 5, a first circuit substrate 10 is provided, the first circuit substrate 10 includes a first insulating layer 11 and first circuit layers 13 disposed on opposite surfaces of the first insulating layer 11, the first circuit substrate 10 has a first receiving hole 15 thereon, and the first circuit layers 13 define the first receiving hole 15.
Referring to fig. 2 to 5, in some embodiments, the method for manufacturing the first circuit substrate 10 may include the following steps:
step S11: referring to fig. 2, a double-sided copper-clad plate 20 is provided, and the double-sided copper-clad plate 20 includes a first insulating layer 11 and copper layers 21 disposed on opposite surfaces of the first insulating layer 11.
The material of the first insulating layer 11 may be a flexible material or a hard material, the flexible material may be one selected from Polyimide (PI), liquid crystal polymer (liquid crystal polymer, LCP), modified polyimide (modified polyimide, MPI), and the like, and the hard material may be one selected from Polypropylene (PP), polytetrafluoroethylene (PTFE), and the like. In this embodiment, the material of the first insulating layer 11 is a liquid crystal polymer.
Step S12: referring to fig. 3, a via 23 is formed through the copper layer 21 and the first insulating layer 11.
The number of vias 23 may be set according to the conductive requirements and the layout of the circuit.
Step S13: referring to fig. 4, via filling is performed to conduct the copper layers 21 on the opposite surfaces of the first insulating layer 11.
The copper plating layer 131 may be formed by electroplating. In the present embodiment, the copper plating layer 131 is located on the surface of one of the copper layers 21, the copper plating layer 131 also fills part of the through-hole 23 and is connected to both copper layers 21, and the copper plating layer 131 located on the surface of the through-hole 23 is recessed with respect to the copper plating layer 131 located on the surface of the copper layer 21, thereby forming the first accommodation hole 15. This is because ion migration is affected by various factors during electroplating, resulting in a difference in the rate at which copper plated layer 131 is formed in different areas. In the present embodiment, the first accommodation hole 15 is a conductive blind hole.
Step S14: referring to fig. 5, the copper layer 21 and the copper layer 131 are patterned to form the first circuit layer 13 on opposite surfaces of the first insulating layer 11, thereby obtaining the first circuit substrate 10, wherein the first circuit layers 13 on opposite surfaces of the first insulating layer 11 are electrically connected to each other.
The specific steps of making the circuit can include the steps of attaching a dry film, exposing, developing, etching, stripping, etc., to form the desired circuit pattern. The first wiring layers 13 located at opposite surfaces of the first insulating layer 11 are electrically connected by copper plating layers 131 located in the through holes 23.
In other embodiments, the structure of the first circuit substrate 10 is not limited to the above-mentioned structure with two first circuit layers 13, the number of layers of the first circuit layers 13 may be multiple, and the manufacturing steps may be adjusted accordingly.
Step S2: referring to fig. 6, a second circuit substrate 30 is provided, the second circuit substrate 30 includes a second insulating layer 31 and a second circuit layer 33 disposed on at least one surface of the second insulating layer 31, the second circuit substrate 30 has a second accommodating hole 35, and the second circuit layer 33 encloses the second accommodating hole 35.
The second circuit substrate 30 may be manufactured in the same manner as the first circuit substrate 10. The number of the second circuit layer 33 may be one or more. The material of the second insulating layer 31 may be a flexible material or a hard material. The material of the second insulating layer 31 is a liquid crystal polymer.
Step S3: referring to fig. 6, an intermediate substrate 40 is provided, the intermediate substrate 40 includes an intermediate insulating layer 41 and an intermediate conductive paste 43, and the intermediate conductive paste 43 penetrates and protrudes from opposite surfaces of the intermediate insulating layer 41.
The material of the intermediate insulating layer 41 may be a flexible material or a hard material. In this embodiment, the material of the intermediate insulating layer 41 is a liquid crystal polymer.
In this embodiment, both ends of the intermediate conductive paste 43 protrude from the intermediate insulating layer 41.
The material of the intermediate conductive paste 43 is a conductive material, including but not limited to copper paste, tin paste, silver paste, and the like. In the present embodiment, the material of the middle conductive paste 43 is copper paste, and the copper paste and the circuit layer are the same in material on the basis of realizing electrical connection, so that electrical consistency can be maintained.
Step S4: referring to fig. 6 and 7, the intermediate substrate 40 is disposed between the first circuit substrate 10 and the second circuit substrate 30 and pressed, and the intermediate conductive paste 43 is accommodated in the first accommodating hole 15 and connected to the first circuit layer 13, and is accommodated in the second accommodating hole 35 and connected to the second circuit layer 33.
Before the lamination step, the side of the first circuit substrate 10 having the first receiving hole 15 and the side of the second circuit substrate 30 having the second receiving hole 35 are disposed toward the intermediate substrate 40, and the intermediate conductive paste 43 protruding from the intermediate insulating layer 41 is respectively received in the first receiving hole 15 and the second receiving hole 35. After the lamination step, the intermediate conductive paste 43 accommodated in the first accommodating hole 15 is connected to the first circuit layer 13, and the intermediate conductive paste 43 accommodated in the second accommodating hole 35 is connected to the second circuit layer 33. The middle conductive paste 43 fills the first accommodating hole 15 and the second accommodating hole 35, which is beneficial to improving the flatness of the circuit substrate after lamination.
After the lamination step, the first insulating layer 11, the second insulating layer 31, and the intermediate insulating layer 41 also fill the gaps between the wiring layers.
In some embodiments, before the lamination step, the step of pre-filling the first accommodating hole 15 and the second accommodating hole 35 with a conductive paste (not shown) is further included, and after the lamination step, the flatness of the circuit substrate can be further improved.
Step S5: referring to fig. 8, a solder mask layer 50 is disposed on a surface of the first circuit substrate 10 facing away from the intermediate substrate 40, a blind hole 51 is formed on the solder mask layer 50, a projection of the blind hole 51 on the intermediate substrate 40 at least partially coincides with the intermediate conductive paste 43, and a portion of the first circuit layer 13 is exposed to the solder mask layer 50.
Blind holes 51 may be formed on the surface of the solder mask layer 50 by laser etching or mechanical drilling to expose portions of the first circuit layer 13, resulting in a circuit board 60.
Step S6: referring to fig. 9 and 10, the blind hole 51 is filled with the conductive material 70, and an electronic component 80 is electrically connected to the first circuit layer 13 through the conductive material 70, so as to obtain the circuit board assembly 100.
The electronic component 80 may be a resistor, capacitor, inductor, diode, transistor, integrated circuit, or the like.
Specifically, the blind hole 51 is filled with the conductive material 70, the conductive material 70 is connected to the first circuit board 13, the surface of the electronic component 80 is connected to the conductive material 70, and the conductive material 70 is melted by hot air reflow, so that the electronic component 80 is electrically connected to the first circuit board 10 through the conductive material 70. Wherein the projection of the conductive object 70 on the intermediate substrate 40 is at least partially overlapped with the intermediate conductive paste 43, i.e. the mounting of the electronic component 80 is not limited by the region of the via hole 90' in the related art.
The melting point of the conductive material 70 is less than or near the glass transition temperature Tg of the first insulating layer 11, and the bonding temperature and the temperature at which the electronic component 80 is mounted are less than the glass transition temperature of the first insulating layer 11.
In this embodiment, the conductive material 70 is made of a SnBiAg alloy, which is low Wen Xigao, so that electrical connection can be realized at a lower temperature, the expansion tolerance caused by lamination can be reduced, and the effects of energy saving and carbon reduction can be realized. The melting point of the SnBiAg alloy is 140-145 ℃, and the SnBiAg alloy can comprise 40% +/-0.5% of tin, 48% +/-0.5% of bismuth, 2% +/-0.5% of silver and 10% +/-0.5% of soldering flux. Wherein, tin shows the weldability and welding strength of the conductive object 70, bismuth is used for reducing the melting point of the conductive object 70, silver can improve the wettability of the conductive object 70, strengthen the connection strength of the conductive object 70, the electronic element 80 and the first circuit layer 13, and improve the fatigue resistance, and the soldering flux is used for protecting the metal powder in the conductive object 70 from being oxidized, thereby facilitating the processing of the conductive object 70.
According to the manufacturing method of the circuit board assembly 100 provided by the embodiment of the application, the space in the first accommodating hole 15 and the second accommodating hole 35 is filled with the middle conductive paste 43 in advance so as to improve the flatness of the formed circuit board 60, so that the installation of the electronic element 80 is not limited by the area of the through hole 90 'in the related art, the air-contained welding at the through hole 90' in the related art is effectively reduced, the installation density of the electronic element 80 is improved, and the miniaturization of the circuit board assembly 100 is realized; in addition, the middle conductive paste 43 is filled with holes to connect the circuit layers of different layers, so that the transmission path of the signal layer can be effectively shortened, and the signal loss in high-frequency transmission can be greatly reduced.
Referring to fig. 11 to 14, in other embodiments, a method for manufacturing a circuit board assembly 100a is further provided, which is different from the above method for manufacturing a circuit board assembly 100: referring to fig. 11, in the electroplating filling process of step S13, a copper plating layer 131a formed in the through hole 23 is formed in a ring shape on the surface of the through hole 23 and connected to both copper layers 21, thereby forming a first receiving hole 15a. The structure of the second accommodation hole 35a is the same as or similar to that of the first accommodation hole 15a, and in this embodiment, the first accommodation hole 15a and the second accommodation hole 35a are both conductive through holes.
Referring to fig. 12, in the lamination step, the intermediate conductive paste 43a of the intermediate substrate 40a is accommodated in the first accommodation hole 15a and the second accommodation hole 35 a; after the lamination step, the intermediate conductive paste 43a penetrates the first circuit substrate 10a and the second circuit substrate 30a.
Referring to fig. 13 and 14, in the circuit board 60a obtained after the blind hole 51 is formed on the solder mask layer 50, the intermediate conductive paste 43a is exposed to the solder mask layer 50, and then the intermediate conductive paste 43a and the electronic component 80 are connected by the conductive object 70a, so as to electrically connect the electronic component 80.
Referring to fig. 9 and 10, the present application further provides a circuit board assembly 100, which includes a circuit board 60, an electronic component 80, and a conductive object 70, wherein the conductive object 70 connects the circuit board 60 and the electronic component 80.
The circuit board 60 includes a first circuit substrate 10, an intermediate substrate 40, a second circuit substrate 30, and a solder mask layer 50, wherein the intermediate substrate 40 is located between the first circuit substrate 10 and the second circuit substrate 30, and the solder mask layer 50 is located on a surface of the first circuit substrate 10 facing away from the intermediate substrate 40 and a surface of the second circuit substrate 30 facing away from the intermediate substrate 40.
The first circuit board 10 includes a first insulating layer 11 and a first circuit layer 13 disposed on opposite surfaces of the first insulating layer 11, the first circuit board has a first accommodating hole 15 thereon, and the first circuit layer 13 encloses the first accommodating hole 15. In the present embodiment, the first accommodation hole 15 is a conductive blind hole.
The second circuit substrate 30 includes a second insulating layer 31 and a second circuit layer 33 disposed on at least one surface of the second insulating layer 31, the second circuit substrate 30 has a second accommodating hole 35 thereon, and the second circuit layer 33 encloses the second accommodating hole 35. In the present embodiment, the second accommodation hole 35 is a conductive blind hole.
The intermediate substrate 40 includes an intermediate insulating layer 41 and an intermediate conductive paste 43, and the intermediate conductive paste 43 penetrates and protrudes from the intermediate insulating layer 41. The intermediate conductive paste 43 protruding from the intermediate insulating layer 41 is accommodated in the first accommodating hole 15 and the second accommodating hole 35, and the intermediate conductive paste 43 is connected to the first wiring layer 13 and the second wiring layer 33.
The conductive object 70 penetrates the solder mask layer 50 and is connected to the first circuit layer 13 exposed to the solder mask layer 50, and the other side of the conductive object 70 is connected to the electronic component 80. Wherein the projection of the conductive object 70 on the intermediate substrate 40 is at least partially overlapped with the intermediate conductive paste 43.
Referring to fig. 13 and 14, another embodiment of the present application provides a circuit board assembly 100a, in which the first accommodating hole 15a and the second accommodating hole 35a are conductive through holes, and the middle conductive paste 43a protruding from the middle insulating layer 41 is accommodated in the first accommodating hole 15a and the second accommodating hole 35a, and the middle conductive paste 43a penetrates through the first circuit substrate 10a and the second circuit substrate 30a. The conductive object 70a penetrates the solder mask layer 50 and is connected to the intermediate conductive paste 43a exposed to the solder mask layer 50, and the other side of the conductive object 70a is connected to the electronic component 80.
It will be appreciated that in other embodiments, one of the first receiving hole 15a and the second receiving hole 35a may be a conductive blind hole, and the other may be a conductive through hole.
According to the circuit board assembly 100 provided by the embodiment of the application, the first accommodating hole 15 and the second accommodating hole 35 are filled with the middle conductive paste 43 so as to improve the flatness of the circuit board, and the electronic element 80 is welded above the first accommodating hole 15 and the second accommodating hole 35, so that the installation of the electronic element 80 is not limited by the region of the through hole 90' in the related art, the installation density of the electronic element 80 can be improved, and the miniaturization of the circuit board assembly 100 is realized; in addition, the middle conductive paste 43 is filled with holes to connect the circuit layers of different layers, so that the transmission path of the signal layer can be effectively shortened, and the signal loss in high-frequency transmission can be greatly reduced.
The above embodiments are only for illustrating the technical solution of the present application and not for limiting the same, and although the present application has been described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solution of the present application.
Claims (10)
1. A method of making a circuit board assembly, comprising:
Providing a first circuit substrate, wherein the first circuit substrate comprises a first insulating layer and first circuit layers positioned on two opposite surfaces of the first insulating layer, the first circuit substrate is provided with a first accommodating hole, the first circuit layers are surrounded to form the first accommodating hole, and the first accommodating hole is a blind hole;
Providing a second circuit substrate, wherein the second circuit substrate comprises a second insulating layer and a second circuit layer positioned on at least one surface of the second insulating layer, the second circuit substrate is provided with a second accommodating hole, and the second circuit layer is surrounded to form the second accommodating hole;
providing an intermediate substrate, wherein the intermediate substrate comprises an intermediate insulating layer and intermediate conductive paste, and the intermediate conductive paste penetrates through the intermediate insulating layer;
The intermediate substrate is arranged between the first circuit substrate and the second circuit substrate and pressed, and the intermediate conductive paste is accommodated in the first accommodating hole and connected with the first circuit layer, and is accommodated in the second accommodating hole and connected with the second circuit layer;
Arranging a solder mask layer on the surface of the first circuit substrate, which is away from the middle substrate, forming a blind hole on the solder mask layer, wherein the projection of the blind hole on the middle substrate is at least partially overlapped with the middle conductive paste, and the part of the first circuit layer is exposed to the solder mask layer; and
And filling the blind hole with a conductive material, and electrically connecting an electronic element with the first circuit layer through the conductive material to obtain the circuit board assembly.
2. The method of manufacturing a circuit board assembly of claim 1, wherein the step of forming the first wiring substrate comprises:
providing a double-sided copper-clad plate, wherein the double-sided copper-clad plate comprises a first insulating layer and copper layers positioned on two opposite surfaces of the first insulating layer;
Forming a through hole penetrating the copper layer and the first insulating layer;
electroplating to fill holes, wherein a copper plating layer is formed on the surface of one copper layer and in the through hole, and the copper plating layer in the through hole is sunken relative to the copper plating layer on the surface of the copper layer so as to form the first accommodating hole; and
And carrying out circuit manufacture on the copper layer and the copper plating layer so as to form the first circuit layer on two opposite surfaces of the first insulating layer, thereby obtaining the first circuit substrate.
3. The method of manufacturing a circuit board assembly according to claim 1, further comprising the step of filling the first accommodation hole and/or the second accommodation hole with a conductive paste before the pressing step.
4. The method of claim 1, wherein the intermediate conductive paste is copper paste.
5. The method of claim 1, wherein the conductive material comprises tin, bismuth, and silver.
6. A method of making a circuit board assembly, comprising:
Providing a first circuit substrate, wherein the first circuit substrate comprises a first insulating layer and first circuit layers positioned on two opposite surfaces of the first insulating layer, the first circuit substrate is provided with a first accommodating hole, the first circuit layers are surrounded to form the first accommodating hole, and the first accommodating hole is a through hole;
Providing a second circuit substrate, wherein the second circuit substrate comprises a second insulating layer and a second circuit layer positioned on at least one surface of the second insulating layer, the second circuit substrate is provided with a second accommodating hole, and the second circuit layer is surrounded to form the second accommodating hole;
providing an intermediate substrate, wherein the intermediate substrate comprises an intermediate insulating layer and intermediate conductive paste, and the intermediate conductive paste penetrates through the intermediate insulating layer;
The intermediate substrate is arranged between the first circuit substrate and the second circuit substrate and pressed, the intermediate conductive paste is accommodated in a first accommodating hole and connected with the first circuit layer, and is accommodated in a second accommodating hole and connected with the second circuit layer, and the intermediate conductive paste penetrates through the first circuit substrate;
Arranging a solder mask layer on the surface of the first circuit substrate, which is away from the middle substrate, forming a blind hole on the solder mask layer, wherein the projection of the blind hole on the middle substrate is at least partially overlapped with the middle conductive paste, and the middle conductive paste is exposed to the solder mask layer; and
And filling the blind hole with a conductive material, and electrically connecting an electronic element with the middle conductive paste through the conductive material to obtain the circuit board assembly.
7. The method of manufacturing a circuit board assembly of claim 6, wherein the step of forming the first wiring substrate comprises:
providing a double-sided copper-clad plate, wherein the double-sided copper-clad plate comprises a first insulating layer and copper layers positioned on two opposite surfaces of the first insulating layer;
Forming a through hole penetrating the copper layer and the first insulating layer;
Electroplating to fill holes, forming copper plating layers on the surface of the copper layer and in the through holes, wherein the copper plating layers in the through holes are annular and are connected with two layers of copper layers to form the first accommodating holes; and
And carrying out circuit manufacture on the copper layer and the copper plating layer so as to form the first circuit layer on two opposite surfaces of the first insulating layer, thereby obtaining the first circuit substrate.
8. A circuit board assembly, comprising:
The first circuit substrate comprises a first insulating layer and first circuit layers positioned on two opposite surfaces of the first insulating layer;
A second circuit substrate;
the middle substrate comprises a middle insulating layer and middle conductive paste, the middle conductive paste penetrates through the middle insulating layer, and part of the middle conductive paste is accommodated in the first circuit substrate and the second circuit substrate;
the electronic element is positioned at one side of the first circuit substrate, which is away from the middle substrate; and
And the projection of the conductive object on the intermediate substrate is at least partially overlapped with the intermediate conductive paste, and the conductive object is connected with the first circuit layer and the electronic element.
9. The circuit board assembly of claim 8, wherein the intermediate conductive paste is copper paste.
10. A circuit board assembly, comprising:
The first circuit substrate comprises a first insulating layer and first circuit layers positioned on two opposite surfaces of the first insulating layer;
A second circuit substrate;
the middle substrate comprises a middle insulating layer and middle conductive paste, the middle conductive paste penetrates through the middle insulating layer, part of the middle conductive paste is accommodated in the first circuit substrate and the second circuit substrate, and the middle conductive paste penetrates through the first circuit substrate;
the electronic element is positioned at one side of the first circuit substrate, which is away from the middle substrate; and
And the projection of the conductive object on the middle substrate is at least partially overlapped with the middle conductive paste, and the conductive object is connected with the middle conductive paste and the electronic element.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211461036.0A CN118055575A (en) | 2022-11-17 | 2022-11-17 | Manufacturing method of circuit board assembly and circuit board assembly |
| TW112118207A TWI849915B (en) | 2022-11-17 | 2023-05-16 | Circuit board component and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211461036.0A CN118055575A (en) | 2022-11-17 | 2022-11-17 | Manufacturing method of circuit board assembly and circuit board assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118055575A true CN118055575A (en) | 2024-05-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211461036.0A Pending CN118055575A (en) | 2022-11-17 | 2022-11-17 | Manufacturing method of circuit board assembly and circuit board assembly |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN118055575A (en) |
| TW (1) | TWI849915B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1819174A (en) * | 2005-02-09 | 2006-08-16 | 日本特殊陶业株式会社 | Wiring board and capacitor to be built into wiring board |
| WO2013108890A1 (en) * | 2012-01-20 | 2013-07-25 | 旭化成イーマテリアルズ株式会社 | Resin composition, layered product, multilayered printed wiring board, multilayered flexible wiring board, and process for producing same |
| TWI736421B (en) * | 2020-09-17 | 2021-08-11 | 欣興電子股份有限公司 | Circuitboard and manufacture method thereof |
| CN115379669A (en) * | 2021-05-20 | 2022-11-22 | 鹏鼎控股(深圳)股份有限公司 | Multilayer wiring board and method for manufacturing the same |
-
2022
- 2022-11-17 CN CN202211461036.0A patent/CN118055575A/en active Pending
-
2023
- 2023-05-16 TW TW112118207A patent/TWI849915B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202423201A (en) | 2024-06-01 |
| TWI849915B (en) | 2024-07-21 |
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