CN118198202B - Preparation method of solar cell photovoltaic module without main grid - Google Patents
Preparation method of solar cell photovoltaic module without main grid Download PDFInfo
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- CN118198202B CN118198202B CN202410598247.1A CN202410598247A CN118198202B CN 118198202 B CN118198202 B CN 118198202B CN 202410598247 A CN202410598247 A CN 202410598247A CN 118198202 B CN118198202 B CN 118198202B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 238000003466 welding Methods 0.000 claims abstract description 228
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052709 silver Inorganic materials 0.000 claims abstract description 15
- 239000004332 silver Substances 0.000 claims abstract description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 11
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims abstract description 11
- 230000009471 action Effects 0.000 claims abstract description 11
- 230000001678 irradiating effect Effects 0.000 claims abstract description 4
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 3
- 239000000956 alloy Substances 0.000 claims abstract description 3
- 229910000679 solder Inorganic materials 0.000 claims description 75
- 239000003292 glue Substances 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 45
- 238000005476 soldering Methods 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 230000004907 flux Effects 0.000 claims description 11
- 238000007650 screen-printing Methods 0.000 claims description 8
- 238000000016 photochemical curing Methods 0.000 claims description 6
- 238000001723 curing Methods 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 4
- 230000000996 additive effect Effects 0.000 claims description 4
- 239000012190 activator Substances 0.000 claims description 3
- 230000009191 jumping Effects 0.000 claims description 3
- 241000258920 Chilopoda Species 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 9
- 229910052718 tin Inorganic materials 0.000 abstract description 8
- 230000005496 eutectics Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 12
- 238000003475 lamination Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 239000011135 tin Substances 0.000 description 7
- 230000008018 melting Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- -1 diamine halide salt Chemical class 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 230000003213 activating effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000002270 dispersing agent Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- 241000761389 Copa Species 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005779 cell damage Effects 0.000 description 1
- 208000037887 cell injury Diseases 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000007524 organic acids Chemical group 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000131 polyvinylidene Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920002397 thermoplastic olefin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/137—Batch treatment of the devices
- H10F71/1375—Apparatus for automatic interconnection of photovoltaic cells in a module
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
无主栅太阳能电池光伏组件的制备方法，步骤为，S1.将无主栅太阳能电池和焊带按照版型铺设在背板上，S2.S1的背板放置在一焊接平台上，并将一柔性膜覆盖在背板上，使背板上铺设的无主栅太阳能电池和焊带位于一封闭空间，对封闭空间抽真空；S3.通过设置在柔性膜上方的激光照射在焊带上，并沿焊带长度方向扫描，完成焊接。无主栅太阳能电池栅线与焊带接触面的银含量大于80%或银锡含量大于80%；采用30W～200W的红外激光扫描，待焊接处作用时间10ms～300ms。采用柔性膜覆盖铺设在背板上的太阳能电池和焊带上，并抽真空的方法，使焊带金属和栅线表面的银或锡金属在激光高能集中产生金属反应形成合金层，焊带和栅线的共晶合晶层能提高焊接拉力至1.0N以上，满足拉力需求。
The preparation method of a photovoltaic module of a busbar-free solar cell comprises the following steps: S1. laying the busbar-free solar cell and the welding strip on the backboard according to the template; S2. placing the backboard of S1 on a welding platform, and covering the backboard with a flexible film, so that the busbar-free solar cell and the welding strip laid on the backboard are located in a closed space, and the closed space is evacuated; S3. irradiating the welding strip with a laser arranged above the flexible film, and scanning along the length direction of the welding strip to complete the welding. The silver content of the contact surface between the grid line of the busbar-free solar cell and the welding strip is greater than 80% or the silver-tin content is greater than 80%; a 30W to 200W infrared laser is used for scanning, and the action time of the welding site is 10ms to 300ms. A flexible film is used to cover the solar cell and the welding strip laid on the backboard, and a vacuum is drawn, so that the silver or tin metal on the surface of the welding strip and the grid line generates a metal reaction to form an alloy layer under the high energy concentration of the laser, and the eutectic layer of the welding strip and the grid line can increase the welding tensile force to more than 1.0N, meeting the tensile force requirement.
Description
Technical Field
The application belongs to the technical field of solar cell processing, and relates to a preparation method of a solar cell photovoltaic module without a main grid.
Background
The solar cell without main grid can increase the power of the component by reducing shielding and resistance loss, and can reduce the cost by using copper wires instead of silver main grid. Furthermore, no main gate is widely compatible with other technologies as a battery interconnect technology. There is increasing interest in the technology of solar cells without a main grid.
However, when the solar cell without the main grid is used for welding components, the thin grid is more and thinner, and the conventional welding is easy to cause cold joint or short circuit. In the prior art, a low-temperature welding strip is arranged on a solar cell without a main grid and is coated with solder paste at a position to be welded, and in the packaging process, the welding strip and the fine grid are welded by using the packaging temperature. The welding mode can lead to insufficient welding temperature to cause poor cold welding or poor tensile force, and on the other hand, the performance test and repair of the component are not easy to carry out.
Disclosure of Invention
The invention provides a preparation method of a solar cell photovoltaic module without a main grid, which can reduce the false soldering and ensure the soldering tension.
A method for preparing a solar cell photovoltaic module without a main grid comprises the following steps,
The method comprises the steps of S1, paving a solar cell without a main grid and a welding strip on a backboard according to a layout, S2, placing the backboard of S1 on a welding platform, covering a flexible film on the backboard, enabling the solar cell without the main grid and the welding strip paved on the backboard to be located in an enclosed space, vacuumizing the enclosed space, S3, irradiating the welding strip through laser arranged above the flexible film, and scanning along the length direction of the welding strip to finish welding, wherein the silver content of a contact surface of a grid line of the solar cell without the main grid and the welding strip is more than 80% or the silver tin content is more than 80%, correspondingly, adopting infrared laser scanning, wherein the laser power is 30-200W, and the laser action time is 10-300 ms at a position to be welded of the grid line of the solar cell without the main grid.
Further, in the preparation method of the solar cell photovoltaic module without the main grid, in S3, laser scans along the length direction of the welding strip, after single scanning is completed, the next welding strip is jumped, and continuous scanning is carried out along the length direction of the welding strip until the welding of all the welding strips is completed.
Further, in the preparation method of the solar cell photovoltaic module without the main grid, in the S3, a plurality of lasers are scanned along the length direction of a plurality of welding strips respectively, after the scanning is completed, the welding strips are jumped to another plurality of welding strips, and the welding strips are continuously scanned along the length direction of the welding strips until the welding of all the welding strips is completed.
Further, the preparation method of the solar cell photovoltaic module without the main grid comprises the step of enabling the solar cell without the main grid to be in a back contact mode.
Further, the preparation method of the solar cell photovoltaic module without the main grid further comprises the step S11 of coating and solidifying the solar cell without the main grid, wherein the coating width of the insulating glue is larger than the width of the grid line, extends in the length direction of the grid line and is disconnected at least at a to-be-welded position.
Further, the preparation method of the solar cell photovoltaic module without the main grid further comprises the step of S21 coating soldering flux on the soldering ribbon before the solar cell without the main grid and the soldering ribbon are paved on the backboard according to the model in S1.
Further, the soldering flux comprises a solvent, a film forming agent, an activating agent, a dispersing agent and an additive.
Further, the preparation method of the solar cell photovoltaic module without the main grid further comprises the step S31 of coating solder on the solar cell without the main grid before the step S1, wherein the solder coating position at least covers the position to be soldered of the grid line.
Furthermore, the solder is normal temperature solder paste or low temperature solder paste.
Further, the manufacturing method of the solar cell photovoltaic module without the main grid comprises the step of forming the welding strip into a flat welding strip or a round welding strip.
Further, in the preparation method of the solar cell photovoltaic module without the main grid, when the laser scans along the length direction of the welding strip, the width of the light spot is 0.5 times larger than the projection width of the welding strip on the solar cell without the main grid.
Further, in the preparation method of the solar cell photovoltaic module without the main grid, when laser scans along the length direction of the welding strip, the width of a light spot is 0.5-4 times of the projection width of the welding strip on the solar cell without the main grid.
Further, in the step S1, or between the steps S1 and S2, the method further includes S41, where the solder strip is pre-fixed on the solar cell without the main grid.
Furthermore, in the preparation method of the solar cell photovoltaic module without the main grid, before the step S1, fixing glue is coated on the solar cell without the main grid, in the step S1, the welding strip is placed on the solar cell without the main grid, and the welding strip is pre-fixed on the solar cell without the main grid through the fixing glue on the solar cell without the main grid.
Further, in the preparation method of the solar cell photovoltaic module without the main grid, after insulating glue is coated and cured on the solar cell without the main grid in the step S21, fixing glue is coated, and in the step S1, or between the step S1 and the step S2, the fixing glue is cured;
the method comprises the steps of coating insulating glue and fixing glue, wherein the insulating glue and the fixing glue are both photo-curing glue, and a screen printing method is adopted for the insulating glue and the fixing glue.
Further, in the preparation method of the solar cell photovoltaic module without the main grid, the fixing glue is coated above the insulating glue.
In the method for preparing the solar cell photovoltaic module without the main grid, in the step S2, the backboard of the step S1 is placed on a welding platform, a flexible film is covered on the backboard of the step S1, the edge of the flexible film is contacted with the welding platform and is pressed or adsorbed on the welding platform, a closed space is formed at the covering position of the flexible film, and vacuum is pumped to the closed space.
Further, the preparation method of the solar cell photovoltaic module without the main grid has the vacuum degree of minus 10KPa to minus 80KPa.
Further, in the preparation method of the solar cell photovoltaic module without the main grid, the width of the grid line at the position to be welded of the solar cell without the main grid is larger than the width of the rest positions of the grid line.
Furthermore, the preparation method of the solar cell photovoltaic module without the main grid comprises the step of forming a welding strip at normal temperature or a welding strip at low temperature.
By the technical scheme, the following technical effects are achieved.
According to the preparation method of the solar cell photovoltaic module without the main grid, provided by the invention, the silver content of the surface of the grid line, which is in contact with the welding strip, of the solar cell without the main grid is more than 80% or the silver tin content of the surface of the grid line is more than 80%, the solar cell without the main grid and the welding strip which are paved on the back plate are covered by the flexible film, and the method of vacuumizing is adopted, so that the tin-containing surface of the welding strip is closely contacted with the silver-containing surface or the silver-tin-containing surface of the grid line, infrared laser scanning is adopted, the infrared laser power is 30-200W, the laser action time is 10-300 ms at the part to be welded of the welding strip and the single grid line, and under the laser parameter condition, the metal reaction can be generated on the surface of the welding strip metal and the grid line in a concentrated mode by the laser energy, and the eutectic crystal layer of the welding strip and the grid line can be welded to more than 1.0N, and the requirement of the tensile force of the module is met.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are some embodiments of the application and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a solar cell without a main grid according to an embodiment of the present application.
Fig. 2 is a schematic diagram of a solder strip placed between two adjacent solar cells without a primary grid according to an embodiment of the present application.
Fig. 3 is a schematic diagram of a solar cell without a main grid after the insulating glue is coated in an embodiment of the application.
Fig. 4 is a schematic diagram of a solar cell without a main grid after the solder strips are placed on two adjacent coated insulating glue according to an embodiment of the present application.
Fig. 5 is a schematic diagram of a laser scanning solder strip according to an embodiment of the present application.
Fig. 6 to 8 are schematic views of a solar cell without a main grid after applying a fixing adhesive according to an embodiment of the present application.
Fig. 9 and 10 are surface topography diagrams after removal of the solder strips after tensile testing, respectively, using flat and round solder strips for soldering using the method of the present invention.
In the figure, 1-solar cell without main grid, 11-positive grid line, 12-negative grid line, 13-insulating glue, 14-fixing glue, 2-welding strip, 21-first welding strip, 22-second welding strip and 3-laser spot.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, but the present application may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present application is not limited to the specific embodiments disclosed below.
In the following detailed description of the embodiments of the present application, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration only, and in which is shown by way of illustration only, and in which the scope of the application is not limited for ease of illustration. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
Based on the general conventional welding form of solar cells with main grids or bonding pads and welding strips, the applicant has previously applied a laser welding method to the assembly preparation process of solar cells with main grids or bonding pads and welding circular welding strips or triangular welding strips. In order to solve the problem of poor welding tension of the general conventional welding mode of the solar cell module without the main grid in the prior art, the application further provides a laser welding method and a preferable welding material which are suitable for the solar cell without the main grid, so that the false welding can be reduced, and the welding tension is ensured.
The invention provides a preparation method of a solar cell photovoltaic module without a main grid, which comprises the following steps:
S1, paving the solar battery without the main grid and the welding strip on a backboard according to the model,
The backboard of the S2S 1 is placed on a welding platform, a flexible film is covered on the backboard of the S1, so that the solar cell without the main grid and the welding strip paved on the backboard of the S1 are positioned in a closed space, and the closed space is vacuumized;
S3, irradiating the welding strip by laser arranged above the flexible film, and scanning along the length direction of the welding strip to finish welding.
The silver content of the contact surface of the solar cell grid line without the main grid and the welding strip is more than 80% or the silver tin content is more than 80%, correspondingly, infrared laser scanning is adopted, the laser power is 30-200W, and the laser action time is 10-300 ms at the contact position (to-be-welded position) of the welding strip and the grid line.
In S3, for one solder strip, referring to fig. 5, the laser continuously scans along the length direction of the solder strip 2 to complete the welding. The welding time is the time when the laser acts on the contact position (to-be-welded position) of the welding strip and the grid line to be welded.
Specifically, referring to fig. 2, 4 and 5, the number of the welding strips 2 is generally plural, and when the welding of the plural welding strips is performed, after the welding of one welding strip is performed by the laser, the welding is performed by jumping to the other welding strip until the welding of all the welding strips is performed.
The continuous scanning along the direction of the welding strip means that at least a part of the welding strip is continuously scanned, and during actual processing, two lasers respectively continuously scan different positions of the same welding strip to jointly complete the scanning of the welding strip.
In some embodiments, a plurality of lasers can be used for simultaneously welding a plurality of welding strips, specifically, the plurality of lasers respectively scan continuously along the length direction of the plurality of welding strips, after the scanning is completed, the welding strips jump to other plurality of welding strips, and scan continuously along the length direction of the welding strips until the welding of all the welding strips is completed.
It should be noted that, the laser can be made to reach from one solder strip to another solder strip by moving the laser processing module, the galvanometer control, or the back plate.
The contact surface between the grid line and the welding strip of the solar cell without the main grid is usually referred to as the upper surface of the grid line. It will be appreciated by those skilled in the art that the gate lines may be single-layer gate lines, multi-layer gate lines, or wrap gate lines. In the application, the contact surface of the solar cell grid line without the main grid and the welding strip has silver content of more than 80 percent or silver-tin content of more than 80 percent.
It should be noted that the solder ribbon may be a tin Bao Tonghan ribbon, or a tin-clad aluminum solder ribbon, or the like, and at least the contact surface between the solder ribbon and the solar cell without the main grid is a tin layer.
According to the preparation method of the solar cell photovoltaic module without the main grid, provided by the invention, the silver content of the contact surface of the solar cell grid line without the main grid and the welding strip is more than 80% or the silver tin content is more than 80%, the solar cell without the main grid and the welding strip paved on the back plate are covered by adopting a flexible film, and the welding strip is vacuumized, so that the tin-containing surface of the welding strip is closely contacted with the silver-containing surface or the silver-tin-containing surface of the grid line, infrared laser scanning is adopted, the infrared laser power is 30-200W, the laser action time is 10-300 ms at the position to be welded of the welding strip and the single grid line, and under the laser parameter condition, the metal reaction can be generated on the silver or tin metal on the surface of the welding strip metal and the grid line in a concentrated mode by laser energy, and the eutectic crystal layer of the welding strip and the grid line can be welded to more than 1.0N, and the tensile force requirement of the module is met. In addition, after welding, the flexible film can be removed, so that assembly test and repair are very convenient. The technical problem that welding is finished and repairing cannot be carried out in the lamination process in the prior art is avoided.
In step S1, the solar cell without the main grid may be a whole solar cell without the main grid, or may be a half solar cell without the main grid as shown in fig. 1 to 4, and two half solar cells without the main grid are shown in fig. 1 to 4. The layout of the components depends on the circuit and the arrangement mode of the solar cells without main grids and the welding strips, the number of the solar cells without main grids and the circuit design are different, and the layout of the components can be corresponding to different standard layouts of the half-sheet 72, for example.
In general, referring to fig. 1 to 4, schematic views of a solar cell 1 without a main grid are shown, wherein adjacent grid lines of different polarities are shown with dotted lines and solid lines for clarity. The dashed lines in the figures are only for distinguishing polarities, and are continuous in nature, and the line widths in the figures are also for distinguishing polarities, not the actual widths of the gate lines. Referring to fig. 1, on a solar cell 1 without a main grid, a positive grid line 11 and a negative grid line 12 are arranged in parallel and alternately with a certain interval. The solder strips 2 are arranged along the length direction perpendicular to the grid lines and are welded with the grid lines of one polarity, such as the positive grid lines, on one solar cell 1 without the main grid, a plurality of solder strips are arranged at intervals along the extending direction of the grid lines, and adjacent solder strips are welded with the grid lines of different polarities of the solar cell without the main grid. As shown in fig. 2 and 4, the first bonding strip 21 and the second bonding strip 22 from top to bottom are respectively bonded to the positive electrode grid line 11 and the negative electrode grid line 12 of the right non-main grid solar cell 1, and the negative electrode grid line 12 and the positive electrode grid line 11 of the left non-main grid solar cell 1.
In the prior art, a low-temperature welding strip is used for connecting a solar cell without a main grid, the low-temperature welding strip is used for coating a low Wen Xigao at a part to be welded, and in the lamination process of the component, the welding strip and the solar cell without the main grid are connected by utilizing the lamination temperature. During lamination, most of welding completed in lamination belongs to physical change due to low lamination temperature, namely melting and resolidifying of solder paste, less formed metal compounds are generated, so that the problems of low tension load of welding spots, excessive desoldering and insufficient virtual welding, unqualified component reliability test and the like are caused.
The invention adopts a method that a flexible film is covered and paved on a solar cell without a main grid and a welding strip on a backboard, and vacuumizes to enable the welding strip to be in close contact with the grid line, and adopts a method that laser continuously scans on the welding strip, and a certain time acts on a part to be welded, so that the contact position of the welding strip and the grid line is effectively alloyed due to the large energy density and the concentrated energy effect of the laser, the welding tension is improved, the welding tension requirement of a component is met, and the contact resistance is reduced.
Therefore, the method has the greatest advantage that the welding can be performed by adopting the normal-temperature welding strip. For the low-temperature welding strip, due to the concentrated effect of laser, the contact position of the welding strip and the grid line can be effectively alloyed, so that the welding tension is improved.
Furthermore, in the welding method of the solar cell without the main grid, the welding is finished by adopting a mode of continuously scanning laser on the welding strip, and at the moment, the corresponding positions of grid lines with different polarities, which are in welding contact with the welding strip, are preferably subjected to insulation treatment. In the invention, before S1, the method further comprises S11, wherein the step of coating insulating glue on the solar cell without the main grid and curing the insulating glue. Specifically, the application position of the insulating glue at least covers the corresponding position of the grid line which is in contact with the welding belt but is not welded with the polarity, and generally, the application width of the insulating glue is larger than the width of the grid line, and the length direction of the insulating glue is the extending direction of the grid line. Referring to fig. 3 and 4, fig. 3 is a diagram of the solar cell 1 without the main grid after the insulating adhesive 13 is coated, and fig. 4 is a diagram of the solar cell 1 without the main grid after the solder strips 2 are placed on two adjacent solar cells 1 without the main grid, wherein the coating position of the insulating adhesive 13 has a width larger than the width of the grid line, extends in the length direction, and is broken at least at the position to be soldered.
In the invention, the insulating glue is an insulating glue for photovoltaic, and can be a photo-curing glue or a thermosetting glue. The coating mode can be spraying, screen printing and the like, and is preferably screen printing so as to improve the coating precision and the coating effect. Curing depending on the type of the insulating paste, it is preferable that the insulating paste uses a photo-curable paste.
According to the preparation method of the solar cell photovoltaic module without the main grid, provided by the invention, the laser is continuously scanned along the length direction of the welding strip, and the insulating glue is arranged at the contact position of the polar grid line which is in contact but not welded, so that the laser does not need to be turned on at the welding position, the light is turned off at other positions, the scanning speed is high, and the welding efficiency of the module is greatly improved. And laser is transmitted through the flexible film, so that the damage of the laser to the non-welding part is also effectively avoided.
The grid lines of the solar cell without the main grid are usually thinner, so as to achieve better welding effect, and as a preferred implementation mode, the invention further comprises the process of coating the soldering tape with soldering flux before the solar cell without the main grid and the soldering tape are paved on the backboard according to the model in S1.
Specifically, the solder tape may be immersed in the flux before the solder tape is laid, and then laid. The soldering flux is a photovoltaic soldering flux and comprises a solvent, a film forming agent, an activating agent, a dispersing agent and an additive. Specifically, the solvent is ethanol or isopropanol, etc., and the film forming agent comprises rosin, resin, etc. The activator is organic acid, etc., the dispersing agent comprises surfactant, etc., and the additive comprises matting agent, etc.
As another embodiment, in order to achieve a better soldering effect, the step of applying solder to the solar cell without the main grid, unlike applying flux, is included S31 before S1. Specifically, solder is applied to the soldering region. Typically, the solder is a solder paste. In the present invention, a normal temperature solder paste is preferable.
The normal temperature tin paste consists of soldering tin powder and soldering flux. Wherein the soldering powder comprises tin, silver and copper, and the soldering flux comprises an activator, a solvent, and one or more of a film forming agent, an adhesive and the like. In one embodiment, the soldering powder comprises tin powder, lead powder and silver powder, the activating agent comprises any one or more of amine, aniline, diamine halide salt and the like, the film forming agent comprises rosin, (at least one of C 3H4O2)n) and the adhesive comprises one or more of rosin and polybutene.
Typically, the solder is applied by means of coating, screen printing, or the like. And screen printing is preferably adopted, so that the coating precision and the coating effect are improved. And printing and coating solder on the welding point after printing the insulating adhesive, and particularly, coating solder paste on the position to be welded of the grid line.
As previously described, the soldering is accomplished using the lamination temperature during lamination, superior to the prior art using a low temperature solder strip and low Wen Xigao. In the prior art, due to low lamination temperature, most of welding is physical change, namely melting and resolidifying of solder paste, and less metal compound is formed, so that the welding tension cannot completely meet the requirement of component tension.
Therefore, the method has the advantages that the normal-temperature solder paste is coated, the normal-temperature welding strip is adopted for welding, and high-tension welding can be realized very easily. For the low-temperature welding strip and low Wen Xigao, due to the high energy density and the concentrated energy effect of the laser, the contact position of the welding strip and the grid line is effectively alloyed, the welding tension is improved, the component tension requirement is met, and the contact resistance is reduced.
The laser welding mode of the invention, the solder paste, especially the normal temperature solder paste, has better welding and bonding characteristics, high tensile force and easy formation of excellent welding contact.
Further, in the invention, the solder strip is preferably a flat solder strip with a width of 0.4 mm-2.0 mm and a thickness of 0.1 mm-0.3 mm. Specifically, the width-to-thickness ratio of the welding strip is more than 3.
In the invention, the flat and thin welding strip is adopted, which is more beneficial to the pick-up and laying of the welding strip, on one hand, the contact area with the grid line is enlarged, and on the other hand, the welding strip is more easily pressed down by the flexible film, so that good contact with the grid line is realized. Through tests, the tensile force can reach more than 1.2N for the situation that the silver content of the surface of the grid line, which is in contact with the welding strip, of the solar cell without the main grid is more than 80%, and can reach more than 2.3N for the situation that the silver tin content of the surface of the grid line, which is in contact with the welding strip, of the solar cell without the main grid is more than 80%. Of course, the present invention is not limited thereto, and a good welding effect can be achieved also for the circular welding strip. In some embodiments, the solder strip has a diameter of 0.2mm to 0.5mm. Through tests, the tensile force can reach more than 1.0N for the situation that the silver content of the surface of the grid line, which is in contact with the welding strip, of the solar cell without the main grid is more than 80%, and can also reach more than 1.1N for the situation that the silver tin content of the surface of the grid line, which is in contact with the welding strip, of the solar cell without the main grid is more than 80%.
Referring to fig. 2, 4 and 5, fig. 2 and 4 are schematic views of solder strips placed on two adjacent half-cells without a primary grid. Fig. 5 shows the laser spot 3, the solder strip 2 and the positive grid line 11, the negative grid line 12. When the laser scans along the length direction of the solder strip, the width of the laser spot is set to be not smaller than the projection width of the solder strip on the solar cell without the main grid, in other words, generally, the width of the laser spot is set to be 0.5-4 times, more preferably, 1.5-2.5 times the projection width of the solder strip on the solar cell without the main grid. The light spot continuously scans along the length direction of the welding strip at a certain speed, and acts on the position to be welded for a certain time to finish welding. Too large a spot can have light energy acting on a solar cell without a main grid, which can cause cell damage, and too small a spot can result in insufficient welding tension.
It will be appreciated that the projected width of the ribbon on a solar cell without a primary grid, the width of the ribbon for the ribbon, and the diameter for the ribbon, are all defined.
In the present invention, as a preferable scheme, the width of the grid line of the solar cell without the main grid is preferably set to be larger than the width of the rest positions at the positions to be welded. Typically, the grid lines have oval, rectangular, etc. shapes at the locations to be soldered. In one embodiment of the present invention, the rectangular shape is 50 μm wide and 170 μm long, wherein the length direction is the extending direction of the grid line, and in other embodiments, part of the to-be-welded parts are provided with pad points.
In the preferred embodiment, when the to-be-welded position corresponds to a conventional grid line or a thickened grid line, the laser action time is 10 ms-80 ms, preferably 20 ms-60 ms, and when the to-be-welded position corresponds to a pad point, the laser action time is slightly longer and is 100 ms-300 ms. When the laser is continuously scanned along the direction of the welding strip, the laser action time can be controlled by the scanning speed. When the pad point is set on the grid line, the action time can be ensured by slowing down the scanning speed or staying at the pad point. Under the condition that the preferable laser action time is 20 ms-60 ms, on one hand, the heat generated by laser can be fully transferred between the welding strip and the solar cell to be welded without the main grid through the welding strip, the metal compound is formed by welding, and the welding quality is ensured. On the other hand, referring to fig. 9 and 10, the surface topography of the solder strip is removed after the tensile test by using the flat solder strip and the round solder strip for welding, respectively, and it can be seen that an alloy layer similar to a centipede pin is formed between the solder strip and the grid line perpendicular to the extending direction of the solder strip by adopting the preferred parameters, so that the welding contact area is increased and the welding effect is effectively ensured.
When the grid line is prepared, the screen plate or the printed substrate or the mask pattern corresponding to the to-be-welded part is correspondingly thickened, sintered or solidified to obtain the shape of the grid line. The grid line can be prepared by screen printing, laser transfer printing, electroplating and the like.
According to the invention, the width of the grid line at the position to be welded is larger than that of other positions, so that the contact area between the welding strip and the grid line can be further increased, a better welding effect is realized, and the welding tension is ensured.
In the application, the solar cell without the main grid and the welding strip are paved on the backboard according to the preset model, and the whole solar cell without the main grid and the welding strip are paved on the backboard according to the preset model to be welded, so that the carrying times of the solar cell without the main grid can be reduced, and hidden cracks caused by carrying the solar cell without the main grid for many times are avoided.
As a preferred embodiment, the method further includes S41, the step of pre-fixing the solder ribbon on the solar cell without the main grid. In the invention, the pre-fixing method is to coat and put fixing glue on the solar cell without main grid in advance, and the fixing glue fixes the welding strip on the solar cell without main grid when the welding strip is put on the solar cell without main grid. Preferably, the fixing adhesive is a photo-curing adhesive, and the photo-curing adhesive is used for fixing the welding strip on the solar cell without the main grid. As a preferred embodiment, the fixing paste may be printed on the solar cell without the main grid by a screen printing method in advance, and then the step of laying the solar cell without the main grid and the solder ribbon on the back plate according to the pattern S1 is performed.
The solder strips are pre-fixed on the solar cell without the main grid, so that the solder strips are prevented from being deviated in the carrying process or other processes which can cause the deviation of the solar cell without the main grid and the solder strips.
As a more preferable scheme, the step of coating the fixing glue on the solar cell without the main grid is arranged after the step S11, the printing of the fixing glue is carried out after the curing of the insulating glue, then the step S1 is carried out, and the fixing glue is cured in the step S1 or between the step S1 and the step S2. In particular, the fixing glue is preferably a photo-curing glue. The coating position of the fixing glue is arranged at the welding position where the welding strip is arranged but is not welded. Preferably, referring to fig. 6 to 8, for the schematic illustration after the fixing glue 14 is applied on the solar cell without the main grid, the applying position of the fixing glue 14 may be set at the contact position of the solder strip and the solar cell without the main grid, for example, at two sides of the solar cell without the main grid, as shown in fig. 6, or may be set on the insulating glue 13, and may be the same as the insulating glue applying position, as shown in fig. 7, or may be a part of the insulating glue applying position, as shown in fig. 8. On the one hand, the screen plate which is the same as or similar to the insulating glue can be adopted for printing, the positioning during the printing of the fixing glue is also facilitated, and meanwhile, the consistency of the height of the solar cell without the main grid is better maintained, and the good welding effect is better maintained.
As a further illustration, in S2, the back plate of S1 is placed on a soldering platform, and a flexible film is covered on the back plate of S1, so that the solar cell and the solder ribbon without main grid laid on the back plate of S1 are located in a closed space, and the closed space is evacuated. Specifically, the flexible film covers the backboard, the edge of the flexible film contacts the welding platform and is pressed or adsorbed on the welding platform, a closed space is formed at the covering position of the flexible film, and vacuum is pumped to the closed space.
Wherein, the vacuum degree is-10 KPa to-80 KPa, and is preferably not lower than-30 KPa.
The flexible film is at least one of EVA, POE, polybutylene terephthalate, poly (hexamethylene terephthalamide) -co-hexamethylene sebacamide copolymer, COPA, silica gel, polyvinylidene chloride-polyolefin blend, polyamide, thermoplastic polyolefin elastomer, modified high-density polyethylene PE, epoxy resin with curing agent and composite resin, wherein the composite resin comprises polyvinylidene chloride, the thickness range of the flexible film is 0.2-3 mm, and/or the Shore hardness of the flexible film is 20-70.
In the present invention, in S3, the vacuum degree of S2 is maintained during laser welding for the laser welding of the solar cell module without the main grid. After the laser welding is completed, the negative pressure is released.
As will be appreciated by those skilled in the art, in general, the low temperature solder ribbon is typically a solder ribbon with a melting temperature of about 130 ℃ for metals such as bismuth and the like, and the normal temperature solder ribbon is typically a solder ribbon with a melting temperature of about 180 ℃. The low-temperature solder paste is usually a solder paste having a melting temperature of about 130 ℃ for metals such as bismuth, and the normal-temperature solder paste is usually a solder paste having a melting temperature of about 180 ℃.
In the present invention, the solar cell without the main grid is preferably a solar cell in a back contact form.
As will be appreciated by those skilled in the art, the back sheet may be photovoltaic glass, or a layer of EVA or POE isopiestic encapsulation material is laid on the photovoltaic glass, after the welding is completed, the flexible layer is removed, and then the laminated encapsulation material such as EVA or POE and the photovoltaic glass are covered, so that the laminated encapsulation process may be performed.
The foregoing is merely a preferred embodiment of the present application, and the present application has been disclosed in the above description of the preferred embodiment, but is not limited thereto. Any person skilled in the art can make many possible variations and modifications to the technical solution of the present application or modifications to equivalent embodiments using the methods and technical contents disclosed above, without departing from the scope of the technical solution of the present application. Therefore, any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present application still fall within the scope of the technical solution of the present application.
Claims (19)
1. The preparation method of the solar cell photovoltaic module without the main grid is characterized by comprising the following steps of,
S1, paving the solar cell without the main grid and the welding strip on a backboard according to the model,
S2, placing the backboard of the S1 on a welding platform, covering a flexible film on the backboard, enabling the solar cell without the main grid and the welding strip paved on the backboard to be located in a closed space, and vacuumizing the closed space;
S3, irradiating laser arranged above the flexible film on a welding strip, and scanning along the length direction of the welding strip to finish welding, wherein the positive grid lines and the negative grid lines of the solar cell without the main grid are arranged alternately in parallel with each other at intervals, and the welding strip is arranged along the length direction perpendicular to the grid lines;
the welding strip is arranged in such a way that at least the contact surface of the welding strip and the solar cell piece without the main grid is a tin layer, and the silver content of the contact surface of the solar cell grid line without the main grid and the welding strip is more than 80% or the silver-tin content is more than 80%;
correspondingly, infrared laser scanning is adopted, the laser power is 30-200W, the width of a laser spot is 1.5-2.5 times larger than the projection width of a welding strip on a solar cell without a main grid, the laser spot continuously scans along the length direction of the welding strip at a certain speed, the action of the laser spot on a position to be welded is 20-60 ms, and a centipede foot-shaped alloy layer is formed between the welding strip and a grid line and perpendicular to the extending direction of the welding strip.
2. The method for manufacturing a solar cell photovoltaic module without a main grid according to claim 1, wherein:
And S3, scanning the laser along the length direction of the welding strip, and after finishing single scanning, jumping to the next welding strip, and continuously scanning along the length direction of the welding strip until the welding of all the welding strips is finished.
3. The method for manufacturing a solar cell photovoltaic module without a main grid according to claim 2, wherein:
and S3, respectively scanning a plurality of lasers along the length direction of the welding strips, and after the scanning is completed, jumping to another plurality of welding strips, and continuously scanning along the length direction of the welding strips until the welding of all the welding strips is completed.
4. The method for manufacturing a photovoltaic module of a solar cell without a main grid according to any one of claims 1 to 3, wherein the solar cell without a main grid is a solar cell in a back contact form.
5. The method for manufacturing a photovoltaic module of a solar cell without a main grid according to any one of claims 1 to 3, further comprising the step of applying an insulating paste to the solar cell without a main grid and curing the insulating paste before S1, wherein the insulating paste is applied to a width larger than a width of the grid line, extends in a length direction of the grid line, and is broken at least at a portion to be soldered.
6. A method of manufacturing a solar cell photovoltaic module without a primary grid according to any one of claims 1 to 3, characterized by:
before the solar cell without the main grid and the welding strip are paved on the backboard according to the model in S1, the method further comprises the step of coating soldering flux on the welding strip in S21.
7. The method of claim 6, wherein the flux comprises a solvent, a film forming agent, an activator, a diffusing agent, and an additive.
8. A method of manufacturing a solar cell photovoltaic module without a primary grid according to any one of claims 1 to 3, characterized by:
Before the step S1, the method further includes a step S31 of applying solder to the solar cell without the main grid, wherein the solder applying position covers the position to be soldered of the grid line.
9. The method for preparing a solar cell photovoltaic module without a main grid according to claim 8, wherein the solder is normal temperature solder paste or low temperature solder paste.
10. The method for manufacturing the solar cell photovoltaic module without the main grid according to any one of claims 1 to 3, wherein the welding strip is a flat welding strip or a round welding strip.
11. The method for manufacturing the solar cell photovoltaic module without the main grid according to any one of claims 1 to 3, wherein the width of the light spot is 0.5-4 times of the projection width of the welding strip on the solar cell without the main grid when the laser scans along the length direction of the welding strip.
12. The method of claim 5, wherein the step S1, or the step between the steps S1 and S2, further comprises the step S41 of pre-fixing the solder strip on the solar cell without the main grid.
13. The method of manufacturing a solar cell module according to claim 12, wherein a fixing adhesive is applied to the solar cell without the main grid before the step S1, and the solder ribbon is placed on the solar cell without the main grid in the step S1, and the solder ribbon is pre-fixed on the solar cell without the main grid by the fixing adhesive on the solar cell without the main grid.
14. The method for manufacturing a photovoltaic module of a solar cell without a main grid according to claim 13, wherein after the insulating adhesive is applied and cured to the solar cell without a main grid in step S21, the fixing adhesive is applied to the solar cell without a main grid, and the fixing adhesive is cured in S1 or between S1 and S2;
the method comprises the steps of coating insulating glue and fixing glue, wherein the insulating glue and the fixing glue are both photo-curing glue, and a screen printing method is adopted for the insulating glue and the fixing glue.
15. The method of claim 14, wherein the fixing glue is coated on the insulating glue.
16. The method for manufacturing a solar cell module without a main grid according to any one of claims 1 to 3, wherein in S2, the back plate of S1 is placed on a soldering platform, a flexible film is covered on the back plate of S1, the edge of the flexible film contacts the soldering platform and is pressed or adsorbed on the soldering platform, a closed space is formed at the covered position of the flexible film, and vacuum is applied to the closed space.
17. The method for preparing the solar cell photovoltaic module without the main grid according to any one of claims 1 to 3, wherein the vacuum degree is-10 KPa to-80 KPa.
18. The method for manufacturing a photovoltaic module of a solar cell without a main grid according to any one of claims 1 to 3, wherein the width of the grid line at the position where the solar cell without a main grid is to be welded is larger than the width of the rest positions of the grid line.
19. The method for manufacturing the solar cell photovoltaic module without the main grid according to any one of claims 1 to 3, wherein the welding strip is a normal temperature welding strip or a low temperature welding strip.
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| CN117410387A (en) * | 2023-12-15 | 2024-01-16 | 晶澜光电科技(江苏)有限公司 | Thin grid structure of crystalline silicon solar cell and preparation method thereof |
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