CN118269241A - Resin type semiconductor cutter - Google Patents
Resin type semiconductor cutter Download PDFInfo
- Publication number
- CN118269241A CN118269241A CN202211735271.2A CN202211735271A CN118269241A CN 118269241 A CN118269241 A CN 118269241A CN 202211735271 A CN202211735271 A CN 202211735271A CN 118269241 A CN118269241 A CN 118269241A
- Authority
- CN
- China
- Prior art keywords
- cooling water
- saw blade
- cutting area
- cutting
- circular saw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor with cooling provisions, e.g. with radial slots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention provides a resin type semiconductor cutting knife which comprises a circular saw blade body and a pressing plate, wherein the pressing plate is fixed on the end face of the circular saw blade body, one face of the pressing plate, facing the circular saw blade body, is provided with an annular water collecting area, and the inner annular side of the water collecting area or the axial side of the pressing plate is communicated with the outside; the circular saw blade body is formed by combining resin or ceramic serving as a binding agent and abrasive, the annular part of the edge of the circular saw blade body extending out of the pressing plate serves as a cutting area, cooling water tanks are arranged at two end surfaces of the cutting area along the circumferential direction of the circular saw blade body and radially towards the circular saw blade body, and one end of each cooling water tank extends to the water collecting area. The cooling water is driven by centrifugal force to form a beam flow to enter the cutting area, so that the full cooling is realized; the cooling water tank realizes chip containing and chip removal, and reduces the abrasion of the chip on the saw blade body; the strength required by the circular saw blade body is reduced; at least the cutting area of the circular saw blade body is also plated with a metal plating layer with increased strength, thereby prolonging the service life and adapting to the working linear speed.
Description
Technical Field
The invention relates to the technical field of semiconductor dicing cutters, in particular to a resin type semiconductor dicing cutter.
Background
Semiconductor dicing knives are one type of dicing blade, also known as dicing blade.
The dicing blade is high in precision generally, the adopted diamond is fine in granularity, the exposed diamond on the end face is small in height, and the thickness of the cutting seam is close to that of the dicing blade, so that a cooling water channel on the end face is extremely small, and the entering amount of cooling water is limited; when the dicing blade rotates at a high speed, an air flow barrier is formed on the surface of the entity of the dicing blade, and when water is sprayed and cooled on the air flow barrier, part of cooling water can be atomized prematurely, so that the cooling water quantity which can enter the edge cutting area of the dicing blade is greatly reduced, and the cutting area cannot be sufficiently cooled.
The resin type semiconductor dicing blade is formed by combining synthetic resin serving as a bonding agent with diamond, is suitable for processing chips of different types of materials and semiconductor related materials, and has the function of solidifying the diamond. The bonding agents with different hardness and types have larger influence on the service life of the blade, and the soft bonding agent of the resin bonding agent can accelerate the self-sharpening property of diamond particles, so that the dicing blade keeps sharpness, and the problems of front surface chipping, layering and burrs of the wafer are reduced. The disadvantage of soft binders is the relatively short life of the blade, and the diamond is most likely to fall off at the interface of the two end surfaces and the circumferential cutting surface when the blade is in use, which adversely affects the life.
The strength of the resin bond is sensitive to temperature, and the higher temperature can cause softening and carbonization of the resin, so that the diamond is quickly dropped off, and the service life is greatly reduced. The dicing blade is generally thin, and the resin type dicing blade has low rotation strength, and is not suitable for cutting at high linear speed. Under the traditional external cooling measure, the water tank is opened on the surface, so that the cutting area cannot be sufficiently cooled, and the strength is destroyed, so that the water tank is not suitable for being opened.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: how to cool the resin type semiconductor dicing blade sufficiently, reduce the falling-off of diamond, improve the life of the resin type semiconductor dicing blade and increase the line speed to be born.
The technical scheme for solving the technical problems is as follows:
The circular saw blade comprises a circular saw blade body and a pressing plate, wherein the pressing plate is fixed on the end face of the circular saw blade body, an annular water collecting area is arranged on one face of the pressing plate, and the inner annular side of the water collecting area or one axial side of the pressing plate is communicated with the outside; the circular saw blade body is formed by combining resin or ceramic serving as a binding agent and abrasive, the annular part of the edge of the circular saw blade body extending out of the pressing plate is a cutting area, a plurality of cooling water tanks are arranged on two end surfaces of the cutting area along the circumferential direction of the circular saw blade body, the cooling water tanks extend along the radial direction of the cutting area, and one end of each cooling water tank extends to a water collecting area; at least the cutting area part (including the cooling water tank) of the circular saw blade body is also plated with a metal plating layer.
The beneficial effects of the invention are as follows:
According to the invention, cooling water is driven by centrifugal force to form a beam flow to enter the cutting area, so that not only is the cooling water quantity effectively entering the cutting seam increased, but also the influence of an air flow barrier is reduced, and the full cooling is realized; the cooling water tank realizes chip containing and chip removal, and reduces the abrasion of the chip on the circular saw blade body; the required strength of the circular blade body is reduced and the life time and the line speed at which it can operate are improved. In addition, since the cooling water flows in the radial direction, the dicing blade is less swung by the water supply, and the processed slit width is smaller.
On the basis of the technical scheme, the invention can be improved as follows.
Further, the depth of the cooling water grooves on the two end surfaces of the cutting area is larger than or smaller than half of the thickness of the cutting area.
By adopting the scheme, when the depth of the cooling water tanks at the two end surfaces is larger than half of the thickness of the cutting area, the middle part of the cutting edge of the cutting area is more intermittent along the circumferential direction, and when one cooling water tank is intermittent once, the middle part of the cutting edge is promoted to be worn to form a concave cutting edge during use; otherwise, the two ends of the cutting edge are made to be worn to form a convex cutting edge; the concave cutting edge and the convex cutting edge can both play a role in limiting deflection deformation of a cutting area, and the generation amount of dust is reduced.
Furthermore, the depth of the cooling water grooves on the two end faces of the cutting area is larger than half of the thickness of the cutting area, and the cutting edge of the cutting area is provided with a concave structure along the ring shape.
Furthermore, the depth of the cooling water grooves on the two end faces of the cutting area is smaller than half of the thickness of the cutting area, and the edge of the cutting area is provided with a protruding structure along the ring shape.
Further, the cooling water tank on one end face of the cutting area is a triangular tank, and the cooling water tank on the other end face is a rectangular tank.
By adopting the scheme, the cutting edge is easy to keep a gradual convex shape, the anti-deformation capability of the cutting edge of the circular saw blade body is improved, deflection is limited, and the dust friction load of the circular saw blade body is reduced.
Furthermore, the shapes of the cooling water tanks at the two end surfaces of the cutting area are different.
Furthermore, the number of the cooling water tanks on the two end surfaces of the cutting area is different and the cooling water tanks are staggered from each other along the circumferential direction of the cutting area.
Further, at least the cutting area part (including the cooling water tank) of the circular saw blade body is also plated with a metal plating layer.
By adopting the scheme, the metal coating can adopt nickel, copper and the like, so that the rotation strength of the dicing blade and the bearable processing linear speed are improved, and the processing efficiency is improved.
Further, diamond particles are also dispersedly plated in the metal plating layer.
By adopting the scheme, the composite coating has cutting capability and reduces resistance. The diamond particles have a particle size on the order of microns.
The cooling water tank is formed by processing the cutting area through laser.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a cross-sectional view taken along A-A of fig. 1.
Fig. 3 is a schematic view of a concave cutting edge of the second embodiment in view B of fig. 2.
Fig. 4 is a schematic view of a convex cutting edge of the second embodiment in view B of fig. 2.
Fig. 5 is a schematic view of a third embodiment of a tapered convex cutting edge in view B of fig. 2.
Fig. 6 is a schematic view of the structure of the circular blade body.
In the drawings, the technical features represented by the reference numerals are as follows:
1-a circular saw blade body; 2-pressing plates; 3-a water collection area; 4-a cooling water tank; a 5-cutting zone; 6-a concave structure; 7-bump structure.
Detailed Description
The principles and features of the present invention are described below with examples given for the purpose of illustration only and are not intended to limit the scope of the invention.
Embodiment one, as shown in fig. 1-6:
The circular saw blade comprises a circular saw blade body 1 and a pressing plate 2, wherein the pressing plate 2 is fixed on the end face of the circular saw blade body 1, one face of the pressing plate 2, facing the circular saw blade body 1, is provided with an annular water collecting area 3, and the inner annular side of the water collecting area 3 or the axial side facing the pressing plate 2 is communicated with the outside; the circular saw blade body 1 is formed by combining resin or ceramic serving as a binding agent and abrasive, the annular part of the edge of the circular saw blade body 1 extending out of the pressing plate 2 is a cutting area 5, a plurality of cooling water tanks 4 are arranged on two end surfaces of the cutting area 5 along the circumferential direction of the circular saw blade body, the cooling water tanks 4 extend along the radial direction of the cutting area, and one end of each cooling water tank 4 extends to a water collecting area 3; at least the cutting zone 5 of the circular saw blade body 1, including the cooling water tank (4), is also coated with a metal coating.
Preferably, the abrasive is diamond particles.
Principle of: the invention can be used for cutting semiconductor materials with brittle and hard properties, and the pressing plate 2 can be arranged on a cutting machine and drives the circular saw blade body 1 to rotate. During cutting, the part, which is communicated with the outside, of the inner ring side of the water collecting area 3 or the axial side of the pressing plate 2 is used for entering cooling water, the cooling water is distributed in the annular water collecting area 3 under the action of centrifugal force and flows out along the cooling water tank 4, so that the cooling water flowing to the cutting area 5 is directly positioned at the inner side of an air flow barrier formed by high-speed rotation, and enters a cutting seam in a beam state in the cutting area 5; at the same time, the amount of cooling water flowing to the cutting zone 5 and the cutting slit is greatly increased by the driving of centrifugal force. So that the slit and the cutting zone 5 can be sufficiently cooled. The intensive cooling water tank 4 also has the functions of containing scraps and removing scraps, and the scraps generated by cutting enter the cooling water tank 4 and are thrown out at the moment when the cutting area 5 is screwed out of the cutting seam, so that the cooling water in the beam state also has the acceleration auxiliary function. Under the dual functions of full cooling and chip removal, the loads such as heat and friction during cutting of the circular saw blade body 1 are greatly reduced, and the effect of the load reduction is larger than that of the cooling water tank 4 on weakening strength, so that the required strength of the circular saw blade body 1 is reduced, and the service life and the working linear speed are improved.
In conclusion, the cooling water is driven by centrifugal force to form beam flow to enter the cutting area 5, so that the cooling water quantity effectively entering the cutting seam is increased, the influence of an air flow barrier is reduced, and full cooling is realized; the cooling water tank 4 realizes chip containing and chip removal, and reduces the abrasion of the chip to the circular saw blade body 1; the strength required for the circular blade body 1 is reduced and the lifetime and the line speed at which it can operate are improved. In addition, since the cooling water flows in the radial direction, the dicing blade is less swung by the water supply, and the processed slit width is smaller. The metal coating can be nickel, copper and the like, so that the rotation strength of the saw blade body 1 and the bearable processing linear speed are improved, and the processing efficiency is improved.
Embodiment two, as shown in FIGS. 3-4:
On the basis of the first embodiment, the depth of the cooling water grooves 4 on the two end surfaces of the cutting area 5 is larger than or smaller than half of the thickness of the cutting area 5.
By adopting the scheme, when the depth of the cooling water tanks 4 at the two end surfaces is larger than half of the thickness of the cutting area 5, the middle part of the cutting edge of the cutting area 5 is more intermittent along the circumferential direction, and when one cooling water tank 4 is intermittent once, the middle part of the cutting edge is promoted to be worn to form a concave cutting edge (the concave structure 6 is formed along the ring shape) during use; otherwise, the two ends of the cutting edge are made to wear to form a convex cutting edge (the convex structure 7 is formed along the ring shape); both the concave cutting edge and the convex cutting edge can play a role in limiting deflection deformation of the cutting area 5.
Preferably, the depth of the cooling water grooves 4 on the two end surfaces of the cutting area 5 is greater than half of the thickness of the cutting area 5, and the cutting edge of the cutting area 5 is provided with a concave structure 6 along the ring shape.
Preferably, the depth of the cooling water grooves 4 on the two end surfaces of the cutting area 5 is smaller than half of the thickness of the cutting area 5, and the edge of the cutting area 5 is provided with a convex structure 7 along the ring shape.
Embodiment three, as shown in fig. 5:
On the basis of any optional scheme of the second embodiment, the cooling water tank 4 on one end surface of the cutting area 5 is a triangular groove, and the cooling water tank 4 on the other end surface is a rectangular groove.
By adopting the scheme, the cutting edge is easy to keep a gradual convex shape, the anti-deformation capability of the cutting edge of the circular saw blade body 1 is improved, deflection is limited, and the dust friction load of the circular saw blade body 1 is reduced.
Preferably, the cooling water tanks 4 on both end surfaces of the cutting area 5 are not identical in shape.
Preferably, the cooling water tanks 4 on the two end surfaces of the cutting area 5 are different in number and are staggered from each other along the circumferential direction of the cutting area 5.
Embodiment four:
preferably, the metal plating layer is also dispersedly plated with diamond particles.
By adopting the scheme, the composite coating has cutting capability. The diamond particles have a particle size on the order of microns.
Preferably, the cooling water tank 4 is formed by machining in the cutting area 5 by laser.
In the description of the present invention, it is to be understood that if descriptive terms indicating orientation, direction or positional relationship are present, such as: the directions or positional relationships indicated in the present specification are directions or positional relationships based on the drawings for convenience of understanding of the present invention and for simplification of description, only, and do not indicate or imply that the parts, elements or integers referred to must have a specific direction, be constructed and operated in a specific direction, and thus are not to be construed as limiting the present invention.
Further, if an order description term occurs, for example: "first," "second," etc. are used in this specification for convenience in understanding or simplifying the description, for example, in order to distinguish between a plurality of technical features that have the same type or function, but may have to be individually referred to, and this specification may be referred to by a prefix or suffix sequence description term. Thus, no indication or implication of relative importance or an implication of the number of technical features indicated is to be understood. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, if structural relative action description terms are used, for example: "mounted," "connected," "secured," and the like are to be construed broadly, unless otherwise specifically indicated and limited. For example, "mounted," "connected," etc., may be fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be the communication between the two elements or the interaction relationship between the two elements; the fixing can be integrated fixing or detachable fixing through a fastener; can be directly fixed or fixed through an intermediate medium. The specific meaning of the above descriptive terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances, the context in which it is located, the consistency of the context, etc.
In the present invention, if a descriptive term containing an attached or connected meaning, e.g., a first feature "on" or "under" a second feature, is not to be interpreted in a limiting sense unless expressly stated or limited otherwise, e.g., the "on" or "under" can be either the direct contact of the first and second features or the indirect contact of the first and second features via an intermediary. The specific meaning of the above descriptive terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances, the context in which it is located, the consistency of the context, etc.
Further, a first feature "above," "over" and "on" a second feature may be that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily for the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments, examples, and features of various embodiments, examples described in this specification may be combined and combined by persons skilled in the art without contradiction, and such combination or combination is intended to fall within the broad scope of the invention.
While embodiments of the present application have been shown and described above, it should be understood that the above embodiments are illustrative and not to be construed as limiting the present application, and that variations, modifications, alternatives, and variations may be made to the above embodiments by one of ordinary skill in the art in light of the disclosure of the application as may be acquired within the scope of the disclosure.
Claims (10)
1. A resin type semiconductor cutting blade, characterized in that: the novel saw blade comprises a circular saw blade body (1) and a pressing plate (2), wherein the pressing plate (2) is fixed on the end face of the circular saw blade body (1), an annular water collecting area (3) is arranged on one face of the pressing plate (2) towards the circular saw blade body (1), and the inner annular side of the water collecting area (3) or one axial side of the pressing plate (2) is communicated with the outside; the circular saw blade body (1) is formed by combining resin or ceramic serving as a binding agent and abrasive, an annular part of the edge of the circular saw blade body (1) extending out of the pressing plate (2) is a cutting area (5), a plurality of cooling water tanks (4) are arranged at two end surfaces of the cutting area (5) along the circumferential direction of the circular saw blade body, the cooling water tanks (4) radially extend along the cutting area, and one end of each cooling water tank (4) extends to the water collecting area (3); at least the cutting area (5) of the circular saw blade body (1) is also plated with a metal plating layer.
2. The resin type semiconductor cutting blade according to claim 1, wherein: the depth of the cooling water grooves (4) on the two end faces of the cutting area (5) is larger than or smaller than half of the thickness of the cutting area (5).
3. The resin type semiconductor dicing blade according to claim 2, wherein: the depth of the cooling water grooves (4) on the two end faces of the cutting area (5) is larger than half of the thickness of the cutting area (5), and the cutting edge of the cutting area (5) is provided with a concave structure (6) along the ring shape.
4. The resin type semiconductor dicing blade according to claim 2, wherein: the depth of the cooling water tanks (4) on the two end faces of the cutting area (5) is smaller than half of the thickness of the cutting area (5), and the edge of the cutting area (5) is annularly provided with a protruding structure (7).
5. The resin type semiconductor dicing blade according to claim 2, wherein: the cooling water tank (4) at one end surface of the cutting area (5) is a trapezoid groove or an arc groove, and the cooling water tank (4) at the other end surface is a rectangular groove, a trapezoid groove or an arc groove.
6. The resin type semiconductor cutting blade according to claim 5, wherein: the cooling water tanks (4) at the two end surfaces of the cutting area (5) are different in shape.
7. The resin type semiconductor cutting blade according to claim 5, wherein: the cooling water tanks (4) on the two end surfaces of the cutting area (5) are different in number and are staggered with each other along the circumferential direction of the cutting area (5).
8. The resin type semiconductor cutting blade according to claim 1, wherein: the metal coating is also dispersedly coated with diamond particles.
9. The resin type semiconductor cutting blade according to claim 1, wherein: the abrasive is diamond particles.
10. The resin type semiconductor cutting blade according to claim 1, wherein: the cooling water tank (4) is formed by processing in the cutting area (5) through laser.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211735271.2A CN118269241A (en) | 2022-12-30 | 2022-12-30 | Resin type semiconductor cutter |
| PCT/CN2023/141560 WO2024140574A1 (en) | 2022-12-30 | 2023-12-25 | Resin semiconductor dicing saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211735271.2A CN118269241A (en) | 2022-12-30 | 2022-12-30 | Resin type semiconductor cutter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118269241A true CN118269241A (en) | 2024-07-02 |
Family
ID=91642901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211735271.2A Pending CN118269241A (en) | 2022-12-30 | 2022-12-30 | Resin type semiconductor cutter |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN118269241A (en) |
| WO (1) | WO2024140574A1 (en) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0724725A (en) * | 1993-07-07 | 1995-01-27 | Murata Mfg Co Ltd | Dicing saw and dicing blade |
| JP3135782B2 (en) * | 1994-04-07 | 2001-02-19 | クレノートン株式会社 | Flat segment type grinding wheel |
| JPH1110547A (en) * | 1997-06-26 | 1999-01-19 | Toto Ltd | Grinding wheel |
| JP2002210665A (en) * | 2001-01-19 | 2002-07-30 | Lobtex Co Ltd | Ultra-thin cutting blade |
| JP5380674B2 (en) * | 2009-05-11 | 2014-01-08 | 伊藤 幸男 | Grinding wheel retainer |
| JP5632215B2 (en) * | 2010-06-28 | 2014-11-26 | 株式会社ディスコ | Grinding tool |
| US9302369B2 (en) * | 2014-01-20 | 2016-04-05 | Pratt & Whitney Canada Corp. | Grinding wheel and method |
| JP7373938B2 (en) * | 2019-08-07 | 2023-11-06 | 株式会社ディスコ | Adjustment method |
| CN211565581U (en) * | 2019-12-19 | 2020-09-25 | 宋京新 | External-rotation internal-cooling electroplated peripheral grinding wheel |
| CN110977794B (en) * | 2019-12-31 | 2025-02-14 | 桂林创源金刚石有限公司 | A vitrified bond peripheral grinding wheel |
| CN111113285B (en) * | 2020-01-13 | 2024-07-23 | 宋京新 | Split type peripheral grinding wheel for electroplated steel wire teeth |
| CN213647221U (en) * | 2020-10-31 | 2021-07-09 | 湖北小蚂蚁金刚石工具有限公司 | A water-cooled diamond grinding wheel for polishing diamond composite sheets |
-
2022
- 2022-12-30 CN CN202211735271.2A patent/CN118269241A/en active Pending
-
2023
- 2023-12-25 WO PCT/CN2023/141560 patent/WO2024140574A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024140574A1 (en) | 2024-07-04 |
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