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CN118295496A - A computing device and a control method - Google Patents

A computing device and a control method Download PDF

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Publication number
CN118295496A
CN118295496A CN202410437270.2A CN202410437270A CN118295496A CN 118295496 A CN118295496 A CN 118295496A CN 202410437270 A CN202410437270 A CN 202410437270A CN 118295496 A CN118295496 A CN 118295496A
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ssd
pin
circuit board
connector
place
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赵洪涛
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XFusion Digital Technologies Co Ltd
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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/186Securing of expansion boards in correspondence to slots provided at the computer enclosure
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/07Responding to the occurrence of a fault, e.g. fault tolerance
    • G06F11/16Error detection or correction of the data by redundancy in hardware
    • G06F11/1608Error detection by comparing the output signals of redundant hardware
    • G06F11/1616Error detection by comparing the output signals of redundant hardware where the redundant component is an I/O device or an adapter therefor
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/22Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/2205Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested
    • G06F11/221Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested to test buses, lines or interfaces, e.g. stuck-at or open line faults
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/22Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/2273Test methods
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/10Program control for peripheral devices
    • G06F13/102Program control for peripheral devices where the programme performs an interfacing function, e.g. device driver

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Quality & Reliability (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Debugging And Monitoring (AREA)

Abstract

本申请实施例提供一种计算设备及方法,计算设备包括:第一卡槽、第一电路板和主板;第一卡槽用于插接第一电路板;第一电路板包括:M.2连接器器;M.2连接器用于连接固态硬盘SSD;主板包括基板管理控制器BMC;第一电路板的在位管脚连接BMC;M.2连接器的在位管脚和SSD类型管脚连接BMC的串行总线接口;BMC,用于检测第一电路板的在位管脚的状态判断第一电路板是否在位;在第一电路板在位时的情况下,根据M.2连接器的在位管脚的电平判断SSD是否在位,在SSD在位的情况下,通过SSD类型管脚的电平确定SSD的类型,能够节省机箱内部空间,维护方便,而且能够兼容SATA M.2接口和NVMe M.2接口。

The embodiment of the present application provides a computing device and method, the computing device comprising: a first card slot, a first circuit board and a mainboard; the first card slot is used to plug the first circuit board; the first circuit board comprises: an M.2 connector; the M.2 connector is used to connect a solid-state drive (SSD); the mainboard comprises a baseboard management controller (BMC); the presence pin of the first circuit board is connected to the BMC; the presence pin of the M.2 connector and the SSD type pin are connected to the serial bus interface of the BMC; the BMC is used to detect the state of the presence pin of the first circuit board to determine whether the first circuit board is in place; when the first circuit board is in place, whether the SSD is in place is determined according to the level of the presence pin of the M.2 connector; when the SSD is in place, the type of the SSD is determined according to the level of the SSD type pin, which can save space inside the chassis, facilitate maintenance, and is compatible with the SATA M.2 interface and the NVMe M.2 interface.

Description

一种计算设备及控制方法A computing device and a control method

技术领域Technical Field

本申请实施例涉及服务器技术领域,特别涉及一种计算设备及控制方法。The embodiments of the present application relate to the field of server technology, and in particular to a computing device and a control method.

背景技术Background technique

目前,服务器中需要固态硬盘(Solid State Drives,SSD)存储文档或视频等文件,SSD通过M.2接口(Next Generation Form Factor,NGFF)连接服务器的主板,主板对SSD中的数据进行读写。M.2接口是一种替代迷你版串行高级技术附加装置接口(mini-SerialAdvanced Technology Attachment,mSATA)的新型接口规范,可以兼容SATA和高速串行计算机扩展总线标准(peripheral component interconnect express,PCIE)。At present, servers need solid state drives (SSDs) to store documents, videos and other files. SSDs are connected to the server's motherboard through the M.2 interface (Next Generation Form Factor, NGFF), and the motherboard reads and writes data in the SSD. The M.2 interface is a new interface specification that replaces the mini-Serial Advanced Technology Attachment (mSATA) interface and is compatible with SATA and the high-speed serial computer expansion bus standard (peripheral component interconnect express, PCIE).

M.2接口主要适配Socket 2插槽和Socket 3插槽。Socket 2插槽可以支持兼容SATA及PCIe x2通道接口的M.2 SSD,对应的键位为B Key,而Socket 3插槽则支持兼容PCIex4通道接口的M.2 SSD,对应的键位为M Key。目前,SSD的接口包括SATA M.2接口和非易失性内存主机控制器接口(Non-Volatile Memory express,NVMe)M.2接口。SATA M.2接口可以插M Key和B Key两种类型的SSD,但是NVMe M.2接口仅可以插M Key类型的SSD。The M.2 interface is mainly compatible with Socket 2 and Socket 3. Socket 2 can support M.2 SSDs compatible with SATA and PCIe x2 channel interfaces, and the corresponding key is B Key, while Socket 3 supports M.2 SSDs compatible with PCIex4 channel interfaces, and the corresponding key is M Key. Currently, SSD interfaces include SATA M.2 and Non-Volatile Memory express (NVMe) M.2. SATA M.2 can be plugged with both M Key and B Key SSDs, but NVMe M.2 can only be plugged with M Key SSDs.

现有技术中,M.2接口和SSD均设置在载板上,载板设置在服务器的机箱内部,占用机箱内部的空间,而且载板在SSD出现问题时,必须拆开机箱,维护比较困难,而且,目前的M.2接口无法兼容SATA M.2接口和NVMe M.2接口。In the prior art, the M.2 interface and the SSD are both set on a carrier board, and the carrier board is set inside the chassis of the server, occupying the space inside the chassis. When the SSD has a problem, the chassis must be disassembled, which makes maintenance difficult. Moreover, the current M.2 interface is not compatible with the SATA M.2 interface and the NVMe M.2 interface.

发明内容Summary of the invention

本申请实施例提供一种计算设备及控制方法,能够节省机箱内部空间,维护方便,而且能够兼容SATA M.2接口和NVMe M.2接口。The embodiments of the present application provide a computing device and a control method, which can save space inside a chassis, facilitate maintenance, and be compatible with a SATA M.2 interface and an NVMe M.2 interface.

本申请实施例提供一种计算设备,包括:第一卡槽、第一电路板和主板;所述第一卡槽用于插接所述第一电路板;所述第一电路板包括:M.2连接器器;所述M.2连接器用于连接固态硬盘SSD;所述主板包括基板管理控制器BMC;所述第一电路板的在位管脚连接所述BMC;所述M.2连接器的在位管脚和SSD类型管脚连接所述BMC的串行总线接口;所述BMC,用于检测所述第一电路板的在位管脚的状态判断所述第一电路板是否在位;在所述第一电路板在位时的情况下,根据所述M.2连接器的在位管脚的电平判断所述SSD是否在位,在所述SSD在位的情况下,通过所述SSD类型管脚的电平确定所述SSD的类型。An embodiment of the present application provides a computing device, including: a first card slot, a first circuit board and a mainboard; the first card slot is used to plug in the first circuit board; the first circuit board includes: an M.2 connector; the M.2 connector is used to connect a solid-state drive (SSD); the mainboard includes a baseboard management controller (BMC); the presence pin of the first circuit board is connected to the BMC; the presence pin and the SSD type pin of the M.2 connector are connected to the serial bus interface of the BMC; the BMC is used to detect the state of the presence pin of the first circuit board to determine whether the first circuit board is in place; when the first circuit board is in place, whether the SSD is in place is determined according to the level of the presence pin of the M.2 connector, and when the SSD is in place, the type of the SSD is determined according to the level of the SSD type pin.

本申请实施例为了解决节省机箱内部空间,便于维护SSD和M.2连接器,并且M.2连接器可以兼容SATA还是NVMe两种类型的接口,在第一卡槽插接新设计的第一电路板,在第一电路板上设计了M.2连接器和串行总线扩展设备,第一电路板的在位管脚连接服务器主板上的BMC;所述M.2连接器的在位管脚和SSD类型管脚均通过所述串行总线扩展设备连接所述BMC的串行总线接口;BMC通过检测在位管脚的状态来判断第一电路板上的SSD是否在位,当SSD在位时,继续判断SSD的类型是SATA还是NVMe,可以兼容两种类型的SSD,扩大了应用场景,使用更加灵活。In order to save the internal space of the chassis and facilitate the maintenance of the SSD and the M.2 connector, and the M.2 connector can be compatible with both SATA and NVMe types of interfaces, the embodiment of the present application inserts a newly designed first circuit board into the first card slot, and an M.2 connector and a serial bus expansion device are designed on the first circuit board. The in-position pin of the first circuit board is connected to the BMC on the server motherboard; the in-position pin and the SSD type pin of the M.2 connector are connected to the serial bus interface of the BMC through the serial bus expansion device; the BMC determines whether the SSD on the first circuit board is in place by detecting the state of the in-position pin, and when the SSD is in place, continues to determine whether the type of the SSD is SATA or NVMe, and can be compatible with two types of SSDs, thereby expanding the application scenarios and being more flexible to use.

一种可能的实现方式,所述主板还包括:中央处理器;所述M.2连接器连接所述中央处理器;所述BMC,还用于将所述SSD类型告知所述中央处理器;所述中央处理器,用于根据所述SSD类型确定与所述SSD类型匹配的协议,所述协议包括串行高级技术附加装置接口SATA协议和非易失性内存主机控制器接口NVMe协议。In a possible implementation, the mainboard further includes: a central processing unit; the M.2 connector is connected to the central processing unit; the BMC is further used to inform the central processing unit of the SSD type; the central processing unit is used to determine a protocol matching the SSD type according to the SSD type, the protocol including a Serial Advanced Technology Attachment Interface (SATA) protocol and a Non-Volatile Memory Host Controller Interface (NVMe) protocol.

由于第一电路板在结构上可以进行不开箱更换,因此,如果有M.2 SSD出现故障时,可以在整机断开电源的情况下不开机箱,便可以拆下第一电路板对M.2 SSD进行更换,免去插拔线缆和把整个计算设备搬下机柜并进行拆机的工作,尤其是在计算设备整机很重的情况下,本申请可插拔式地维护方式,为运维带来很大便利。本申请实施例提供的OCP卡形态的M.2 SSD载板,在尺寸上只占用一个OCP卡的空间,不用预先在计算设备的机箱内为M.2 SSD载板预留专用的空间,同时,可以在不打开计算设备的机箱的情况下,方便拆下M.2SSD载板,实现不开箱对M.2 SSD进行维护。Since the first circuit board can be replaced without unpacking the box, if an M.2 SSD fails, the first circuit board can be removed to replace the M.2 SSD without opening the chassis when the power of the entire machine is disconnected, eliminating the need to plug and unplug cables and move the entire computing device out of the cabinet and disassemble the machine. Especially when the computing device is very heavy, the pluggable maintenance method of the present application brings great convenience to operation and maintenance. The M.2 SSD carrier board in the form of an OCP card provided in the embodiment of the present application only occupies the space of an OCP card in size, and there is no need to reserve a dedicated space for the M.2 SSD carrier board in the chassis of the computing device in advance. At the same time, the M.2 SSD carrier board can be easily removed without opening the chassis of the computing device, so that the M.2 SSD can be maintained without unpacking the box.

一种可能的实现方式,所述M.2连接器包括第一M.2连接器和第二M.2连接器,所述第一电路板还包括串行总线扩展器;所述第一M.2连接器用于连接第一SSD,所述第二M.2连接器用于连接第二SSD;所述第一SSD和所述第二SSD互为备份;所述第一M.2连接器的在位管脚和SSD类型管脚均通过所述串行总线扩展器连接所述BMC的串行总线接口;所述第二M.2连接器的在位管脚和SSD类型管脚均通过所述串行总线扩展器连接所述BMC的串行总线接口;所述第一M.2连接器包括PCIE X4管脚,所述第一M.2连接器的PCIE X3管脚连接所述中央处理器,所述第一M.2连接器剩余的PCIE X1管脚作为SATA管脚连接所述中央处理器;所述第二M.2连接器包括PCIE X4管脚,所述第二M.2连接器的PCIE X3管脚连接所述中央处理器,所述第二M.2连接器剩余的PCIE X1管脚作为SATA管脚连接所述中央处理器。In a possible implementation, the M.2 connector includes a first M.2 connector and a second M.2 connector, and the first circuit board also includes a serial bus expander; the first M.2 connector is used to connect a first SSD, and the second M.2 connector is used to connect a second SSD; the first SSD and the second SSD are backed up for each other; the in-position pin and the SSD type pin of the first M.2 connector are both connected to the serial bus interface of the BMC through the serial bus expander; the in-position pin and the SSD type pin of the second M.2 connector are both connected to the serial bus interface of the BMC through the serial bus expander; the first M.2 connector includes a PCIE X4 pin, the PCIE X3 pin of the first M.2 connector is connected to the central processor, and the remaining PCIE X1 pin of the first M.2 connector is connected to the central processor as a SATA pin; the second M.2 connector includes a PCIE X4 pin, the PCIE X3 pin of the second M.2 connector is connected to the central processor, and the remaining PCIE X1 pin of the second M.2 connector is connected to the central processor as a SATA pin.

一般情况下,为了实现数据备份,OCP卡上会设置两个M.2连接器,对应连接两个SSD,下面介绍OCP卡可以连接两个SSD的实现方式。本申请实施例提供的M.2连接器可以兼容SATA类型的SSD和NVMe类型的SSD,扩大了应用场景,给实际的使用带来了较大便利。Generally, in order to achieve data backup, two M.2 connectors are set on the OCP card to connect two SSDs. The following describes how the OCP card can connect two SSDs. The M.2 connector provided in the embodiment of the present application is compatible with SATA type SSDs and NVMe type SSDs, which expands the application scenarios and brings great convenience to actual use.

一种可能的实现方式,所述第一电路板的第一在位管脚和第二在位管脚分别连接所述BMC的两个IO管脚,所述第一在位管脚和所述第二在位管脚在所述第一电路板上均接地;所述第一电路板的第三在位管脚和第四在位管脚分别连接所述BMC的另外两个IO管脚;所述第一电路板的第三在位管脚和第四在位管脚在所述第一电路板上均悬空;所述BMC,用于在检测到与所述第一在位管脚和所述第二在位管脚连接的两个IO管脚的电平为低时,确定所述第一电路板在位。In a possible implementation, a first on-position pin and a second on-position pin of the first circuit board are respectively connected to two IO pins of the BMC, and the first on-position pin and the second on-position pin are both grounded on the first circuit board; a third on-position pin and a fourth on-position pin of the first circuit board are respectively connected to another two IO pins of the BMC; the third on-position pin and the fourth on-position pin of the first circuit board are both suspended on the first circuit board; and the BMC is used to determine that the first circuit board is in place when it is detected that the levels of the two IO pins connected to the first on-position pin and the second on-position pin are low.

本申请实施例不具体限定在位管脚的高低电平状态,例如一种可能的实现方式,在位管脚的电平为高电平时,判断SSD在位;反之在位管脚的电平为低电平时,判断SSD不在位。同理,本申请实施例也不具体限定SSD类型管脚的高低电平状态,例如一种可能的实现方式,SSD类型管脚的电平为低电平时,判断SSD类型为SATA类型;反之,SSD类型管脚的电平为高电平时,判断SSD类型为NVMe类型。The embodiments of the present application do not specifically limit the high and low level states of the in-position pin. For example, in one possible implementation, when the level of the in-position pin is high, the SSD is judged to be in position; otherwise, when the level of the in-position pin is low, the SSD is judged to be not in position. Similarly, the embodiments of the present application do not specifically limit the high and low level states of the SSD type pin. For example, in one possible implementation, when the level of the SSD type pin is low, the SSD type is judged to be a SATA type; otherwise, when the level of the SSD type pin is high, the SSD type is judged to be an NVMe type.

一种可能的实现方式,所述第一电路板上还存储有板ID;所述BMC,还用于读取所述板ID,通过所述板ID判断所述第一电路板是否为M.2载板,如果不是所述M.2载板,则按照标准OCP卡的带宽要求,使所述中央处理器对所述第一电路板进行配置。In a possible implementation, a board ID is also stored on the first circuit board; the BMC is also used to read the board ID, and determine whether the first circuit board is an M.2 carrier board through the board ID. If it is not the M.2 carrier board, the central processor configures the first circuit board according to the bandwidth requirements of the standard OCP card.

BMC通过读取Board ID信息可以判断所插的OCP卡的功能。具体地,BMC通过BoardID判断第一电路板100是否为M.2载板,如果不是M.2载板,则按照标准OCP卡进行配置。The BMC can determine the function of the inserted OCP card by reading the Board ID information. Specifically, the BMC determines whether the first circuit board 100 is an M.2 carrier board through the Board ID, and if it is not an M.2 carrier board, it is configured according to the standard OCP card.

一种可能的实现方式,所述BMC,具体用于,在检测到所述SSD类型管脚的电平为高电平时,确定所述SSD类型为NVMe;在检测到所述SSD类型管脚的电平为低电平时,确定所述SSD类型为SATA。In a possible implementation, the BMC is specifically used to determine that the SSD type is NVMe when it is detected that the level of the SSD type pin is high; and to determine that the SSD type is SATA when it is detected that the level of the SSD type pin is low.

本申请实施例对于SSD类型管脚的高低电平不做具体限定,可以根据实际需要来设置。The embodiment of the present application does not specifically limit the high and low levels of the SSD type pins and can be set according to actual needs.

基于以上实施例提供的一种计算设备,本申请实施例还提供一种计算设备的控制方法,所述计算设备包括:第一卡槽、第一电路板和主板;所述第一卡槽用于插接所述第一电路板;所述第一电路板包括:M.2连接器;所述M.2连接器用于连接固态硬盘SSD;所述主板包括基板管理控制器BMC;所述第一电路板的在位管脚连接所述BMC;所述M.2连接器的在位管脚和所述M.2连接器的SSD类型管脚均连接所述BMC的串行总线接口;该方法包括:根据所述第一电路板的在位管脚的电平判断所述第一电路板是否在位;在所述第一电路板在位的情况下,根据所述M.2连接器的在位管脚的电平判断所述SSD是否在位;在所述SSD在位的情况下,通过所述SSD类型管脚的电平确定所述SSD的类型。Based on a computing device provided in the above embodiment, an embodiment of the present application further provides a control method for a computing device, wherein the computing device comprises: a first card slot, a first circuit board and a mainboard; the first card slot is used to plug in the first circuit board; the first circuit board comprises: an M.2 connector; the M.2 connector is used to connect a solid-state drive SSD; the mainboard comprises a baseboard management controller BMC; the presence pin of the first circuit board is connected to the BMC; the presence pin of the M.2 connector and the SSD type pin of the M.2 connector are both connected to a serial bus interface of the BMC; the method comprises: judging whether the first circuit board is in place according to the level of the presence pin of the first circuit board; if the first circuit board is in place, judging whether the SSD is in place according to the level of the presence pin of the M.2 connector; if the SSD is in place, determining the type of the SSD according to the level of the SSD type pin.

一种可能的实现方式,本申请实施例提供的方法,还包括:根据所述SSD类型确定与所述SSD类型匹配的协议;所述协议包括串行高级技术附加装置接口SATA协议和非易失性内存主机控制器接口NVMe协议。In a possible implementation manner, the method provided in an embodiment of the present application further includes: determining a protocol matching the SSD type according to the SSD type; the protocol includes a Serial Advanced Technology Attachment interface SATA protocol and a Non-Volatile Memory Host Controller Interface NVMe protocol.

一种可能的实现方式,本申请实施例提供的方法,所述第一电路板上还存储有板ID,所述方法还包括:读取所述板ID,通过所述板ID判断所述第一电路板是否为M.2载板,如果不是所述M.2载板,则按照标准OCP卡的带宽要求,使所述中央处理器对所述第一电路板进行配置。A possible implementation method is provided in an embodiment of the present application, wherein a board ID is also stored on the first circuit board, and the method further includes: reading the board ID, determining whether the first circuit board is an M.2 carrier board through the board ID, and if it is not the M.2 carrier board, causing the central processor to configure the first circuit board according to the bandwidth requirements of the standard OCP card.

一种可能的实现方式,本申请实施例提供的方法,所述通过所述SSD类型管脚的电平确定所述SSD的类型,具体包括:在检测到所述SSD类型管脚的电平为高电平时,确定所述SSD类型为NVMe;在检测所述SSD类型管脚的电平为低电平时,确定所述SSD类型为SATA。A possible implementation method is the method provided in an embodiment of the present application, wherein the type of the SSD is determined by the level of the SSD type pin, specifically including: when the level of the SSD type pin is detected to be a high level, determining that the SSD type is NVMe; when the level of the SSD type pin is detected to be a low level, determining that the SSD type is SATA.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

图1A本申请实施例提供的一种计算设备的示意图;FIG1A is a schematic diagram of a computing device provided in an embodiment of the present application;

图1B本申请实施例提供的另一种计算设备的示意图;FIG1B is a schematic diagram of another computing device provided in an embodiment of the present application;

图1C为本申请实施例提供的再一种计算设备的示意图;FIG1C is a schematic diagram of another computing device provided in an embodiment of the present application;

图2为本申请实施例提供的一种SATA M.2的示意图;FIG2 is a schematic diagram of a SATA M.2 provided in an embodiment of the present application;

图3为本申请实施例提供的一种NVMe M.2的示意图;FIG3 is a schematic diagram of an NVMe M.2 provided in an embodiment of the present application;

图4为本申请实施例提供的又一种计算设备的示意图;FIG4 is a schematic diagram of another computing device provided in an embodiment of the present application;

图5为本申请实施例提供的一种计算设备的控制方法的流程图;FIG5 is a flow chart of a method for controlling a computing device provided in an embodiment of the present application;

图6为本申请实施例提供的又一种计算设备的控制方法的流程图。FIG6 is a flowchart of another method for controlling a computing device provided in an embodiment of the present application.

具体实施方式Detailed ways

本申请实施例提供的计算设备不具体限定应用的场景,例如,计算设备以服务器为例进行介绍,具体也不限定服务器的类型,例如计算设备可以为服务器。服务器可以位于数据中心,也可以位于其他区域,本申请实施例不做具体限定。The computing device provided in the embodiment of the present application does not specifically limit the application scenario. For example, the computing device is introduced by taking a server as an example, and the type of the server is not specifically limited. For example, the computing device can be a server. The server can be located in a data center or in other areas, and the embodiment of the present application does not make specific limitations.

服务器,属于一种计算设备,服务器比普通计算机运行更快、负载更高。服务器在网络中为其它客户机(如PC机、智能手机等设备)提供计算或者应用服务。服务器具有高速的CPU运算能力、长时间的可靠运行、强大的外部数据吞吐能力以及更好的扩展性。服务器从外形分为机架式、刀片式、塔式和机柜式;服务器从功能上还可以包括AI服务器,例如GPU服务器等。A server is a computing device that runs faster and has a higher load than an ordinary computer. A server provides computing or application services to other clients (such as PCs, smartphones and other devices) in the network. The server has high-speed CPU computing power, long-term reliable operation, strong external data throughput and better scalability. Servers are divided into rack-mounted, blade-mounted, tower-mounted and cabinet-mounted in appearance; servers can also include AI servers, such as GPU servers, etc. in terms of function.

单板,服务器中的常用部件,单板可以理解为是一个对电路板的统称,可以为主板、电源管理板、网络数据交换板等多种形式。单板上可以设置有其他元器件,例如控制器,处理器,或者其他芯片,以实现服务器的运算功能。单板上还可以设置有电连接器,单板可以通过电连接器插接其他电器元件,或者通过电连接器与另一块单板电连接。Single board is a common component in servers. Single board can be understood as a general term for circuit boards, which can be in various forms such as main board, power management board, network data exchange board, etc. Single board can be provided with other components, such as controller, processor, or other chips, to realize the computing function of the server. Single board can also be provided with electrical connector, through which single board can be plugged into other electrical components, or electrically connected to another single board through the electrical connector.

服务器可以包括单板和供电电源,供电电源用于给单板上的各个负载进行供电;负载可以是设置在单板上的中央处理器、内存、基板管理控制器等。The server may include a single board and a power supply, wherein the power supply is used to supply power to various loads on the single board; the loads may be a central processing unit, a memory, a baseboard management controller, etc., which are arranged on the single board.

本申请实施例不具体限定单板的种类,单板可以为主板,也可以为其他单板。The embodiment of the present application does not specifically limit the type of single board, and the single board may be a main board or other single board.

主板,服务器中的一种电路板,主板上可以设置控制器、内存条、电连接器等部件。控制器可以包括中央处理器(central processing unit,CPU)、南桥芯片PCH、微控制单元(micro controller unit,MCU)、复杂可编程逻辑器件(complex programming logicdevice,CPLD)、现场可编程逻辑门阵列(field programmable gate array,FPGA)等。其中,CPU可以通过主板上的内部走线以及电连接器来电连接外围设备,例如CPU通过电连接器电连接网卡、显卡等设备。一般服务器的主板上可设置CPU、PCH和CPLD,其中,CPU可以为一个或多个。The motherboard is a circuit board in the server. The motherboard can be equipped with controllers, memory sticks, electrical connectors and other components. The controller may include a central processing unit (CPU), a south bridge chip PCH, a microcontroller unit (MCU), a complex programming logic device (CPLD), a field programmable gate array (FPGA), etc. Among them, the CPU can be electrically connected to peripheral devices through the internal wiring and electrical connectors on the motherboard. For example, the CPU is electrically connected to network cards, graphics cards and other devices through electrical connectors. The CPU, PCH and CPLD can be set on the motherboard of a general server, and the CPU can be one or more.

本申请实施例不具体限定内存条的具体类型,例如内存条包括但不限定以下类型:双列直插式存储模块(dual-inline-memory-modules,DIMM)、单列直插存储器模块(single inline memory module,SIMM)。其中DIMM上的内存芯片可以是同步动态随机存储器(Synchronous Dynamic Random Access Memory,SDRAM)、第四代双倍速率同步动态随机存储器(Double Data Rate Synchronous Dynamic Random Access Memory4,DDR4)、第五代双倍速率同步动态随机存储器(Double Data Rate Synchronous Dynamic RandomAccess Memory5,DDR5)。The embodiments of the present application do not specifically limit the specific types of memory sticks. For example, memory sticks include but are not limited to the following types: dual-inline-memory-modules (DIMMs) and single inline memory modules (SIMMs). The memory chips on the DIMMs may be synchronous dynamic random access memory (SDRAM), fourth-generation double data rate synchronous dynamic random access memory (DDR4), and fifth-generation double data rate synchronous dynamic random access memory (DDR5).

基板管理控制器(Baseboard Manager Controller,BMC)可以设置在主板上。A baseboard management controller (BMC) may be disposed on the mainboard.

BMC是服务器必不可少的组件,用于监控该服务器的运作状况,如温度、风扇转速、供电状况、作业系统状态等等。BMC独立于服务器运作,不受服务器影响,可以在服务器未开机的待机状态下,对服务器进行固件升级、查看机器设备、远程控制机器开机等一些操作,可以在服务器宕机时记录关键日志。BMC is an essential component of the server, used to monitor the operating status of the server, such as temperature, fan speed, power supply status, operating system status, etc. BMC operates independently of the server and is not affected by the server. It can perform some operations such as upgrading the server firmware, checking machine equipment, and remotely controlling the machine startup when the server is not turned on in the standby state. It can also record key logs when the server is down.

SSD,固态硬盘又称固态驱动器,是用固态电子存储芯片阵列制成的硬盘。SSD, solid-state drive, also known as solid-state drive, is a hard disk made of an array of solid-state electronic storage chips.

开源计算项目(Open Compute Project,OCP)卡,针对数据中心定制的硬件设计规范,包括机房、机柜、服务器、存储、网络设备的定制设计规范,以及云端硬件的管理规范。OCP卡是一种开放式计算项目的网络接口卡。服务器机箱的侧面一般包括多个第一卡槽,但是一般的部分第一卡槽空缺,没有插入OCP卡。The Open Compute Project (OCP) card is a hardware design specification customized for data centers, including customized design specifications for computer rooms, cabinets, servers, storage, network equipment, and management specifications for cloud hardware. The OCP card is a network interface card for the Open Compute Project. The side of the server chassis generally includes multiple first card slots, but generally some of the first card slots are vacant and no OCP card is inserted.

本申请实施例为了解决节省机箱内部空间,便于维护SSD和M.2连接器,并且M.2连接器可以兼容SATA还是NVMe两种类型的接口,在第一卡槽插接新设计的第一电路板,第一电路板跟现有的OCP卡的尺寸大小以及接口形状一样,还可以是M.2载板。在第一电路板上设计了M.2连接器和串行总线扩展器,第一电路板的在位管脚连接服务器主板上的BMC;所述M.2连接器的在位管脚和SSD类型管脚均通过所述串行总线扩展器连接所述BMC的串行总线接口;BMC通过检测在位管脚的状态来判断第一电路板上的SSD是否在位,当SSD在位时,继续判断SSD的类型是SATA还是NVMe。In order to save the internal space of the chassis and facilitate the maintenance of the SSD and M.2 connector, the embodiment of the present application is compatible with both SATA and NVMe interfaces. A newly designed first circuit board is inserted into the first card slot. The first circuit board has the same size and interface shape as the existing OCP card, and can also be an M.2 carrier board. An M.2 connector and a serial bus expander are designed on the first circuit board. The in-position pin of the first circuit board is connected to the BMC on the server motherboard; the in-position pin and the SSD type pin of the M.2 connector are connected to the serial bus interface of the BMC through the serial bus expander; the BMC determines whether the SSD on the first circuit board is in place by detecting the state of the in-position pin. When the SSD is in place, it continues to determine whether the type of the SSD is SATA or NVMe.

为了使本领域技术人员更好地理解本申请实施例提供的技术方案,下面结合附图进行详细介绍。In order to enable those skilled in the art to better understand the technical solution provided by the embodiments of the present application, a detailed description is given below in conjunction with the accompanying drawings.

参见图1A,该图为本申请实施例提供的一种计算设备的示意图。Refer to Figure 1A, which is a schematic diagram of a computing device provided in an embodiment of the present application.

服务器1000机箱的侧面一般包括多个第一卡槽,例如,第一卡槽可以用来插接OCP卡,但是一般服务器1000的第一卡槽存在空缺,没有插入OCP卡。本申请可以使用空缺的第一卡槽来插接本申请实施例提供的第一电路板100。第一电路板100与现有的OCP卡的尺寸大小以及接口形状都一样,还可以是M.2载板。The side of the server 1000 chassis generally includes a plurality of first card slots. For example, the first card slot can be used to insert an OCP card. However, the first card slot of the server 1000 is generally vacant and no OCP card is inserted. The present application can use the vacant first card slot to insert the first circuit board 100 provided in the embodiment of the present application. The first circuit board 100 has the same size and interface shape as the existing OCP card, and can also be an M.2 carrier board.

参见图1B,该图为本申请实施例提供的另一种计算设备的示意图。See FIG. 1B , which is a schematic diagram of another computing device provided in an embodiment of the present application.

本申请实施例提供的计算设备,包括第一电路板100和主板200,主板200设有第一卡槽300,例如第一卡槽可以为OCP槽位,可以插接OCP卡,也可以插接本申请实施例中的第一电路板100。本申请实施例提供的第一电路板100可以作为M.2的载板,本申请实施例不具体限定上设置的M.2连接器的数量,可以设置一个M.2连接器,也可以设置多个M.2连接器。M.2连接器可以插入SATA,也可以插入NVMe。参见图1C,该图为本申请实施例提供的再一种计算设备的示意图。The computing device provided in the embodiment of the present application includes a first circuit board 100 and a mainboard 200. The mainboard 200 is provided with a first card slot 300. For example, the first card slot can be an OCP slot, which can be plugged with an OCP card or the first circuit board 100 in the embodiment of the present application. The first circuit board 100 provided in the embodiment of the present application can be used as an M.2 carrier board. The embodiment of the present application does not specifically limit the number of M.2 connectors provided thereon. One M.2 connector can be provided, or multiple M.2 connectors can be provided. The M.2 connector can be inserted into SATA or NVMe. See Figure 1C, which is a schematic diagram of another computing device provided in the embodiment of the present application.

本申请实施例提供的计算设备,包括:第一卡槽(未示出)、第一电路板100和主板(Mainboard,MB)200;下面以计算设备为服务器为例进行介绍。The computing device provided in the embodiment of the present application includes: a first card slot (not shown), a first circuit board 100 and a mainboard (MB) 200; the computing device is described below by taking a server as an example.

OCP卡槽位用于插接第一电路板100;应该理解,第一卡槽位于服务器的机箱的侧面,图1C未示出,第一电路板第一电路板100可以直接插入第一卡槽。一般机箱设置多个第一卡槽,会有闲置的第一卡槽,因此,本申请实施例就是利用闲置的第一卡槽,插接本申请实施例设计的OCP卡,应该理解,本申请实施例涉及的第一电路板100区别于传统的OCP卡。本申请实施例提供的第一电路板100是作为M.2载板,M.2载板上设置M.2连接器,M.2载板可以连接主板,用来扩展存储设备。例如,M.2载板上可以安装至少一个M.2 SSD,例如可以安装一个M.2 SSD,也可以安装多个M.2 SSD。载板上可以安装SATA类型的SSD和NVMe类型的SSD。The OCP card slot is used to plug in the first circuit board 100; it should be understood that the first card slot is located on the side of the chassis of the server, which is not shown in Figure 1C. The first circuit board 100 can be directly inserted into the first card slot. Generally, a chassis is provided with multiple first card slots, and there will be idle first card slots. Therefore, the embodiment of the present application utilizes the idle first card slot to plug in the OCP card designed in the embodiment of the present application. It should be understood that the first circuit board 100 involved in the embodiment of the present application is different from the traditional OCP card. The first circuit board 100 provided in the embodiment of the present application is used as an M.2 carrier board, and an M.2 connector is provided on the M.2 carrier board. The M.2 carrier board can be connected to the motherboard to expand the storage device. For example, at least one M.2 SSD can be installed on the M.2 carrier board, for example, one M.2 SSD can be installed, or multiple M.2 SSDs can be installed. SATA type SSDs and NVMe type SSDs can be installed on the carrier board.

如图1C所示,本申请实施例提供的OCP卡包括:第一M.2连接器101和串行总线扩展器103;第一M.2连接器101用于连接固态硬盘SSD(图中未示出);本申请实施例提供的第一M.2连接器101可以连接SATA类型的SSD,又可以连接NVMe类型的SSD,即可以兼容SATA类型的SSD和NVMe类型的SSD。As shown in FIG1C , the OCP card provided in the embodiment of the present application includes: a first M.2 connector 101 and a serial bus expander 103; the first M.2 connector 101 is used to connect a solid-state drive SSD (not shown in the figure); the first M.2 connector 101 provided in the embodiment of the present application can be connected to a SATA type SSD, and can also be connected to an NVMe type SSD, that is, it is compatible with a SATA type SSD and an NVMe type SSD.

主板200包括BMC202。The main board 200 includes a BMC 202 .

第一电路板100的在位管脚连接BMC202;应该理解,本申请实施例提供的第一电路板100的在位管脚遵从OCP卡的标准协议,第一电路板100包括四个在位管脚,分别为第一在位管脚PRSNTB3#,第二在位管脚PRSNTB2#,第三在位管脚PRSNTB1#和第四在位管脚PRSNTB0#。The on-position pin of the first circuit board 100 is connected to BMC202; it should be understood that the on-position pin of the first circuit board 100 provided in the embodiment of the present application complies with the standard protocol of the OCP card, and the first circuit board 100 includes four on-position pins, namely the first on-position pin PRSNTB3#, the second on-position pin PRSNTB2#, the third on-position pin PRSNTB1# and the fourth on-position pin PRSNTB0#.

一种可能的实现方式,第一在位管脚PRSNTB3#和第二在位管脚PRSNTB2#分别连接所述BMC202的两个IO管脚,第一在位管脚PRSNTB3#和第二在位管脚PRSNTB2#在第一电路板100上均接地;第一电路板100的第三在位管脚PRSNTB1#和第四在位管脚PRSNTB0#分别连接BMC202的另外两个IO管脚,即在BMC内部另外两个IO管脚通过电阻连接高电位,或直接连接高电位。第一电路板100的第三在位管脚PRSNTB1#和第四在位管脚PRSNTB0#在第一电路板100上均悬空。In a possible implementation, the first in-position pin PRSNTB3# and the second in-position pin PRSNTB2# are respectively connected to the two IO pins of the BMC 202, and the first in-position pin PRSNTB3# and the second in-position pin PRSNTB2# are both grounded on the first circuit board 100; the third in-position pin PRSNTB1# and the fourth in-position pin PRSNTB0# of the first circuit board 100 are respectively connected to the other two IO pins of the BMC 202, that is, the other two IO pins inside the BMC are connected to a high potential through a resistor, or directly connected to a high potential. The third in-position pin PRSNTB1# and the fourth in-position pin PRSNTB0# of the first circuit board 100 are both suspended on the first circuit board 100.

串行总线扩展器器103一般为集成电路总线(Inter-Integrated Circuit,I2C)的扩展接口,用于第一电路板100与BMC202的串行通信。I2C是一种串行通信总线,使用多主从架构。I2C串行通信总线一般包括两根信号线,一根是双向的数据线SDA,另一根是时钟线SCL。所有接到I2C总线设备上的串行数据SDA都接到总线的SDA上,各设备的时钟线SCL接到总线的SCL上。The serial bus expander 103 is generally an expansion interface of an integrated circuit bus (Inter-Integrated Circuit, I2C), which is used for serial communication between the first circuit board 100 and the BMC202. I2C is a serial communication bus that uses a multi-master-slave architecture. The I2C serial communication bus generally includes two signal lines, one is a bidirectional data line SDA, and the other is a clock line SCL. All serial data SDA connected to the I2C bus device is connected to the SDA of the bus, and the clock line SCL of each device is connected to the SCL of the bus.

第一M.2连接器101的在位管脚M2_PRSNT1#和SSD类型管脚PEDET1均通过串行总线扩展器103连接BMC的串行总线接口Searial Bus。The position pin M2_PRSNT1# and the SSD type pin PEDET1 of the first M.2 connector 101 are both connected to the serial bus interface Searial Bus of the BMC through the serial bus expander 103 .

BMC202,用于通过检测第一电路板100的在位管脚的状态来判断第一电路板100是否在位,当第一电路板100在位时,检测M.2连接器的在位管脚的状态判断SSD是否在位,当SSD在位时,通过SSD类型管脚获得SSD的类型。BMC202 is used to determine whether the first circuit board 100 is in place by detecting the state of the in-place pin of the first circuit board 100. When the first circuit board 100 is in place, the state of the in-place pin of the M.2 connector is detected to determine whether the SSD is in place. When the SSD is in place, the type of the SSD is obtained through the SSD type pin.

BMC202,用于检测两个IO管脚的电平为低时,即,检测连接第一在位管脚PRSNTB3#和第二在位管脚PRSNTB2#的两个IO管脚均为低电平时,判断第一电路板100在位。因为,在第一电路板100上第一在位管脚PRSNTB3#和第二在位管脚PRSNTB2#均接地,BMC202识别的两个IO管脚的电平状态均为低电平。BMC202 is used to determine that the first circuit board 100 is in place when the levels of the two IO pins are low, that is, when the two IO pins connected to the first in-position pin PRSNTB3# and the second in-position pin PRSNTB2# are both low. Because the first in-position pin PRSNTB3# and the second in-position pin PRSNTB2# are both grounded on the first circuit board 100, the level states of the two IO pins identified by BMC202 are both low.

以上四个在位管脚兼容标准OCP卡的在位检测。并且BMC根据四个在位管脚的检测,可以为第一电路板100分配PCIE带宽。The above four in-position pins are compatible with the in-position detection of the standard OCP card. And the BMC can allocate PCIE bandwidth to the first circuit board 100 according to the detection of the four in-position pins.

以上介绍的是BMC判断第一电路板100在位的情况,下面介绍,当第一电路板100在位时,继续判断SSD在位的情况。由于本申请实施例提供的第一电路板100包括用于连接SSD的M.2连接器,因此,当第一电路板100在位时,就包括M.2连接器,仅是需要进一步判断M.2连接器上是否连接有SSD。The above describes the situation where the BMC determines that the first circuit board 100 is in place. The following describes the situation where the SSD is still in place when the first circuit board 100 is in place. Since the first circuit board 100 provided in the embodiment of the present application includes an M.2 connector for connecting an SSD, when the first circuit board 100 is in place, it includes an M.2 connector, and it is only necessary to further determine whether an SSD is connected to the M.2 connector.

主板上的BMC202可以自动识别第一电路板100上的第一M.2连接器101连接的是SATA SSD还是NVMe SSD盘,并对接口进行配置,以此实现服务器对两种类型的SSD进行兼容。The BMC 202 on the mainboard can automatically identify whether the first M.2 connector 101 on the first circuit board 100 is connected to a SATA SSD or an NVMe SSD disk, and configure the interface to enable the server to be compatible with the two types of SSDs.

具体地,在判断第一M.2连接器101上是否插接有SSD以及插接的SSD的类型时,BMC202通过串行总线扩展器103读取第一M.2连接器101的在位管脚M2_PRSNT1#的电平,判断SSD在位。并且,BMC202通过串行总线扩展器103读取SSD类型管脚PEDET1,判断SSD的类型为SATA还是NVMe。本申请实施例不具体限定在位管脚的高低电平状态,例如一种可能的实现方式,在位管脚M2_PRSNT1#的电平为高电平时,判断SSD在位;反之在位管脚M2_PRSNT1#的电平为低电平时,判断SSD不在位。同理,本申请实施例也不具体限定SSD类型管脚PEDET1的高低电平状态,例如一种可能的实现方式,SSD类型管脚PEDET1的电平为低电平时,判断SSD类型为SATA类型;反之,SSD类型管脚PEDET1的电平为高电平时,判断SSD类型为NVMe类型。Specifically, when determining whether an SSD is plugged into the first M.2 connector 101 and the type of the plugged SSD, BMC202 reads the level of the in-position pin M2_PRSNT1# of the first M.2 connector 101 through the serial bus expander 103 to determine whether the SSD is in position. In addition, BMC202 reads the SSD type pin PEDET1 through the serial bus expander 103 to determine whether the type of the SSD is SATA or NVMe. The embodiment of the present application does not specifically limit the high and low level states of the in-position pin. For example, in one possible implementation, when the level of the in-position pin M2_PRSNT1# is high, it is determined that the SSD is in position; conversely, when the level of the in-position pin M2_PRSNT1# is low, it is determined that the SSD is not in position. Similarly, the embodiments of the present application do not specifically limit the high and low level states of the SSD type pin PEDET1. For example, in one possible implementation, when the level of the SSD type pin PEDET1 is low, the SSD type is judged to be a SATA type; conversely, when the level of the SSD type pin PEDET1 is high, the SSD type is judged to be an NVMe type.

由于第一电路板100在结构上可以进行不开箱更换,因此,如果有M.2 SSD出现故障时,可以在整机断开电源的情况下不开机箱,便可以拆下第一电路板100对M.2 SSD进行更换,免去插拔线缆和把整个计算设备搬下机柜并进行拆机的工作,尤其是在计算设备整机很重的情况下,本申请可插拔式地维护方式,为运维带来很大便利。Since the first circuit board 100 is structurally replaceable without opening the case, if an M.2 SSD fails, the first circuit board 100 can be removed and the M.2 SSD can be replaced without opening the case when the power of the entire machine is disconnected, eliminating the need to plug and unplug cables and move the entire computing device out of the cabinet and disassemble the machine. Especially when the computing device is heavy, the pluggable maintenance method of the present application brings great convenience to operation and maintenance.

本申请实施例提供的OCP卡形态的M.2 SSD载板,在尺寸上只占用一个OCP卡的空间,不用预先在计算设备的机箱内为M.2 SSD载板预留专用的空间,同时,可以在不打开计算设备的机箱的情况下,方便拆下M.2 SSD载板,实现不开箱对M.2 SSD进行维护。The M.2 SSD carrier board in the form of an OCP card provided in the embodiment of the present application only occupies the space of an OCP card in size, and there is no need to reserve a dedicated space for the M.2 SSD carrier board in the chassis of the computing device in advance. At the same time, the M.2 SSD carrier board can be easily removed without opening the chassis of the computing device, thereby realizing maintenance of the M.2 SSD without opening the box.

另外,主板200还包括处理器CPU和集成南桥(Platform Controller Hub,PCH)201。本申请实施例中以第一M.2连接器101连接处理器CPU201为例进行介绍。CPU201具有IO扩展能力,通常这些IO扩展端口可以兼容多种协议,例如,在同一个IO端口上可以同时支持PCIE和SATA两种协议,可以根据实际需要进行配置来实现不同的功能。In addition, the motherboard 200 also includes a processor CPU and an integrated south bridge (Platform Controller Hub, PCH) 201. In the embodiment of the present application, the first M.2 connector 101 is connected to the processor CPU 201 as an example. The CPU 201 has IO expansion capabilities, and these IO expansion ports are usually compatible with multiple protocols. For example, the same IO port can support both PCIE and SATA protocols at the same time, and can be configured according to actual needs to implement different functions.

CPU201上还运行基本输入输出系统(Basic Input Output System,BIOS),在计算设备业务系统启动过程中负责自检和参数配置。在启动过程中,BIOS也可以从BMC202获取信息,根据所获取的信息对业务系统中的参数做灵活配置。The CPU 201 also runs a Basic Input Output System (BIOS), which is responsible for self-checking and parameter configuration during the startup of the computing device business system. During the startup process, the BIOS can also obtain information from the BMC 202 and flexibly configure the parameters in the business system based on the information obtained.

第一M.2连接器101的PCIE接口连接CPU201。The PCIE interface of the first M.2 connector 101 is connected to the CPU 201 .

BMC202,还用于将SSD类型告知CPU201。BMC 202 is also used to inform CPU 201 of the SSD type.

CPU201,用于根据SSD类型确定与SSD类型匹配的协议,SSD类型包括SATA和NVMe。SATA类型的SSD仅用一个管脚的PCIE即可,如图1所示的PCIE X1/SATA0。NVMe用4个管脚的PCIE,因此,CPU201配置4个管脚的PCIE接口连接第一M.2连接器101,一般情况下,SATA类型的SSD和NVMe类型的SSD不会同时存在,因此,CPU201共配置4个PCIE管脚即可,如图1C所示,其中SATA用一个管脚PCIE X1/SATA0,NVMe使用四个管脚,即NVMe除了使用PCIE X3以外,还与SATA共用PCIE X1/SATA0。CPU201 is used to determine the protocol that matches the SSD type according to the SSD type, and the SSD types include SATA and NVMe. SATA type SSD only needs one pin of PCIE, such as PCIE X1/SATA0 as shown in FIG1 . NVMe uses 4 pins of PCIE, so CPU201 configures a 4-pin PCIE interface to connect the first M.2 connector 101. Generally, SATA type SSD and NVMe type SSD will not exist at the same time, so CPU201 only needs to configure 4 PCIE pins in total, as shown in FIG1C , where SATA uses one pin PCIE X1/SATA0, and NVMe uses four pins, that is, in addition to using PCIE X3, NVMe also shares PCIE X1/SATA0 with SATA.

本申请实施例提供的计算设备,利用OCP卡作为M.2的载板,OCP卡上设有M.2连接器,M.2连接器可以用来插接SSD。由于OCP卡位于计算设备的机箱侧面,可以直接插拔,在SSD或者M.2连接器出现故障时,可以直接插拔进行维护,不需要拆开机箱。而且本申请实施例提供的计算设备,由于利用了OCP卡闲置的槽位,不必在计算设备的机箱内部专门预留空间设置M.2载板,从而可以节省机箱的内部空间。而且本申请实施例提供的OCP卡上的M.2连接器可以兼容SATA类型的SSD和NVMe类型的SSD,具有普适性。The computing device provided in the embodiment of the present application utilizes an OCP card as a carrier board of M.2. An M.2 connector is provided on the OCP card, and the M.2 connector can be used to plug in an SSD. Since the OCP card is located on the side of the chassis of the computing device, it can be directly plugged in and out. When the SSD or the M.2 connector fails, it can be directly plugged in and out for maintenance without disassembling the chassis. Moreover, the computing device provided in the embodiment of the present application utilizes the idle slot of the OCP card, so there is no need to reserve space inside the chassis of the computing device to set up an M.2 carrier board, thereby saving the internal space of the chassis. Moreover, the M.2 connector on the OCP card provided in the embodiment of the present application is compatible with SATA type SSDs and NVMe type SSDs, and has universal applicability.

如果M.2连接器只能兼容NVMe SSD,不兼容SATA SSD,则实际应用场景受到限制。由于M.2在业界多用于系统盘,SATA SSD因为软件兼容性强,易使用,得到广泛的应用,如果只能兼容NVMe SSD,应用上有较大的局限性。本申请实施例提供的M.2连接器可以兼容SATA类型的SSD和NVMe类型的SSD,扩大了应用场景,给实际的使用带来了较大便利。If the M.2 connector is only compatible with NVMe SSDs and not SATA SSDs, the actual application scenarios will be limited. Since M.2 is mostly used for system disks in the industry, SATA SSDs are widely used because of their strong software compatibility and ease of use. If it is only compatible with NVMe SSDs, there will be great limitations in its application. The M.2 connector provided in the embodiment of the present application is compatible with SATA type SSDs and NVMe type SSDs, which expands the application scenarios and brings great convenience to actual use.

另外,本申请实施例提供的OCP卡与传统的PCIE的M.2转接卡相比,由于PCIE插槽是通过PCIE的M.2转接卡从主板上扩展出来,而OCP卡是直接插在主板上,相比较来说,本申请实施例提供的OCP卡形态的M.2载板少使用一个PCIE的M.2转接卡,可以节省成本。In addition, compared with the traditional PCIE M.2 adapter card, the OCP card provided in the embodiment of the present application is different from the traditional PCIE M.2 adapter card. Since the PCIE slot is expanded from the motherboard through the PCIE M.2 adapter card, and the OCP card is directly inserted into the motherboard, in comparison, the M.2 carrier board in the form of an OCP card provided in the embodiment of the present application uses one less PCIE M.2 adapter card, which can save costs.

为了方便理解,下面结合附图介绍SATA的键位和NVMe的键位的区别。For ease of understanding, the following describes the differences between SATA key positions and NVMe key positions with reference to the accompanying drawings.

参见图2,该图为本申请实施例提供的一种SATA M.2的示意图。See FIG. 2 , which is a schematic diagram of a SATA M.2 provided in an embodiment of the present application.

SATA M.2包括两种键位,即包括B Key和M Key。SATA M.2可以适用于Socket 2、Socket 3两种插槽。SATA M.2 includes two key positions, namely B Key and M Key. SATA M.2 can be applied to both Socket 2 and Socket 3 slots.

参见图3,该图为本申请实施例提供的一种NVMe M.2的示意图。See Figure 3, which is a schematic diagram of an NVMe M.2 provided in an embodiment of the present application.

NVMe M.2包括一种键位,即斤包括M Key。NVMe M.2仅适用于Socket 3插槽。NVMe M.2 includes a key position, namely, M Key. NVMe M.2 is only applicable to Socket 3 slots.

本申请实施例提供的OCP卡上的M.2连接器既可以连接SATA的键位,又可以连接NVMe的键位。The M.2 connector on the OCP card provided in the embodiment of the present application can be connected to both the SATA key position and the NVMe key position.

一般情况下,为了实现数据备份,OCP卡上会设置两个M.2连接器,对应连接两个SSD,下面介绍OCP卡可以连接两个SSD的实现方式。Generally, in order to achieve data backup, two M.2 connectors are set on the OCP card to connect two SSDs. The following describes how to connect two SSDs to the OCP card.

参见图4,该图为本申请实施例提供的又一种计算设备的示意图。See FIG. 4 , which is a schematic diagram of another computing device provided in an embodiment of the present application.

对比图4和图1可以发现,图4所示的第一电路板100相比图1所示的第一电路板100还多设置了第二M.2连接器102,第二M.2连接器102包括在位管脚M2_PRSNT2#和SSD类型管脚PEDET2。By comparing FIG. 4 with FIG. 1 , it can be found that the first circuit board 100 shown in FIG. 4 is further provided with a second M.2 connector 102 compared with the first circuit board 100 shown in FIG. 1 . The second M.2 connector 102 includes a position pin M2_PRSNT2# and an SSD type pin PEDET2.

本申请实施例提供的计算设备,OCP卡包括第一M.2连接器101和第二M.2连接器102;第一M.2连接器101用于连接第一SSD,第二M.2连接器102用于连接第二SSD;第一SSD和所述第二SSD互为备份;第一M.2连接器的在位管脚M2_PRSNT2#和SSD类型管脚PEDET1均通过串行总线扩展器103连接BMC202的串行总线接口Searial Bus。第二M.2连接器102的在位管脚M2_PRSNT2#和SSD类型管脚PEDET2均通过串行总线扩展器103连接BMC的串行总线接口Searial Bus;The computing device provided in the embodiment of the present application, the OCP card includes a first M.2 connector 101 and a second M.2 connector 102; the first M.2 connector 101 is used to connect the first SSD, and the second M.2 connector 102 is used to connect the second SSD; the first SSD and the second SSD are backed up for each other; the in-position pin M2_PRSNT2# and the SSD type pin PEDET1 of the first M.2 connector are both connected to the serial bus interface Searial Bus of the BMC202 through the serial bus expander 103. The in-position pin M2_PRSNT2# and the SSD type pin PEDET2 of the second M.2 connector 102 are both connected to the serial bus interface Searial Bus of the BMC through the serial bus expander 103;

第一M.2连接器101包括PCIE X4管脚,第一M.2连接器101的PCIE X3管脚连接CPU201,第一M.2连接器101剩余的PCIE X1管脚作为SATA管脚0连接CPU201;第二M.2连接102器包括PCIE X4管脚,第二M.2连接器102的PCIE X3管脚连接CPU201,第二M.2连接器102剩余的PCIE X1管脚作为SATA管脚1连接CPU201。The first M.2 connector 101 includes a PCIE X4 pin, a PCIE X3 pin of the first M.2 connector 101 is connected to CPU201, and the remaining PCIE X1 pin of the first M.2 connector 101 is used as SATA pin 0 to connect to CPU201; the second M.2 connector 102 includes a PCIE X4 pin, a PCIE X3 pin of the second M.2 connector 102 is connected to CPU201, and the remaining PCIE X1 pin of the second M.2 connector 102 is used as SATA pin 1 to connect to CPU201.

BMC202通过串行总线扩展器103读取第二M.2连接器101的在位管脚M2_PRSNT2#的电平,判断SSD在位。并且,BMC202通过串行总线扩展器103读取SSD类型管脚PEDET2,判断SSD的类型为SATA还是NVMe。BMC202 reads the level of the in-position pin M2_PRSNT2# of the second M.2 connector 101 through the serial bus expander 103 to determine whether the SSD is in position. In addition, BMC202 reads the SSD type pin PEDET2 through the serial bus expander 103 to determine whether the type of the SSD is SATA or NVMe.

本申请实施例不具体限定在位管脚的高低电平状态,例如一种可能的实现方式,在位管脚M2_PRSNT2#的电平为高电平时,判断SSD在位;反之在位管脚M2_PRSNT2#的电平为低电平时,判断SSD不在位。同理,本申请实施例也不具体限定SSD类型管脚PEDET2的高低电平状态,例如一种可能的实现方式,SSD类型管脚PEDET2的电平为低电平时,判断SSD类型为SATA类型;反之,SSD类型管脚PEDET2的电平为高电平时,判断SSD类型为NVMe类型。The embodiment of the present application does not specifically limit the high and low level states of the in-position pin. For example, in one possible implementation, when the level of the in-position pin M2_PRSNT2# is high, it is judged that the SSD is in position; otherwise, when the level of the in-position pin M2_PRSNT2# is low, it is judged that the SSD is not in position. Similarly, the embodiment of the present application does not specifically limit the high and low level states of the SSD type pin PEDET2. For example, in one possible implementation, when the level of the SSD type pin PEDET2 is low, it is judged that the SSD type is SATA type; otherwise, when the level of the SSD type pin PEDET2 is high, it is judged that the SSD type is NVMe type.

另外,第二M.2连接器102还通过PCIE接口连接CPU201。In addition, the second M.2 connector 102 is also connected to the CPU 201 via a PCIE interface.

CPU201,用于根据SSD类型确定与SSD类型匹配的协议,SSD类型包括SATA和NVMe。SATA类型的SSD仅用一个管脚的PCIE即可,如图4所示的PCIE X1/SATA1。NVMe用4个管脚的PCIE,因此,CPU201配置4个管脚的PCIE接口连接第二M.2连接器102,一般情况下,SATA类型的SSD和NVMe类型的SSD不会同时存在,因此,CPU201共配置4个PCIE管脚即可,如图4所示,其中SATA用一个管脚PCIE X1/SATA1,NVMe除了使用PCIE X3以外,还共用PCIE X1/SATA1。CPU201 is used to determine the protocol that matches the SSD type according to the SSD type, and the SSD types include SATA and NVMe. SATA type SSD only needs one pin of PCIE, such as PCIE X1/SATA1 as shown in FIG4. NVMe uses 4 pins of PCIE, so CPU201 configures a 4-pin PCIE interface to connect the second M.2 connector 102. Generally, SATA type SSD and NVMe type SSD will not exist at the same time, so CPU201 only needs to configure 4 PCIE pins, as shown in FIG4, where SATA uses one pin PCIE X1/SATA1, and NVMe uses PCIE X1/SATA1 in addition to PCIE X3.

本申请实施例提供的计算设备,第一电路板100上存储包括板标识(BoardIdentity,Board ID)。例如,第一电路板100包括存储芯片,存储芯片中存有Board ID。In the computing device provided in the embodiment of the present application, the first circuit board 100 stores a board identification (Board Identity, Board ID). For example, the first circuit board 100 includes a memory chip, and the memory chip stores the Board ID.

BMC202,还用于通过串行总线扩展器103读取Board ID,BMC202通过读取Board ID信息可以判断所插的OCP卡的功能。具体地,BMC202通过Board ID判断第一电路板100是否为M.2载板,如果不是M.2载板,则按照标准OCP卡进行配置。BMC202 is also used to read the Board ID through the serial bus expander 103. BMC202 can determine the function of the inserted OCP card by reading the Board ID information. Specifically, BMC202 determines whether the first circuit board 100 is an M.2 carrier board through the Board ID. If it is not an M.2 carrier board, it is configured according to the standard OCP card.

BMC202通过第一电路板100的四个在位信号PRSNTB0#-PRSNTB3#信号,判断OCP插槽上是否有OCP卡安装上去,再根据OCP卡上的Board ID来判断安装的OCP卡的类型,如果OCP卡是标准通用的OCP卡,可以根据PRSNTB0#-PRSNTB3#的信号组合对PCIE带宽进行分配。BMC202 determines whether an OCP card is installed in the OCP slot through the four in-place signals PRSNTB0#-PRSNTB3# of the first circuit board 100, and then determines the type of the installed OCP card according to the Board ID on the OCP card. If the OCP card is a standard universal OCP card, the PCIE bandwidth can be allocated according to the signal combination of PRSNTB0#-PRSNTB3#.

如果BMC202根据Board ID判断安装的是M.2载板,则BMC202会继续根据上述M2_PRSNT#和PEDET信号判断M.2 SSD卡是否安装在M.2载板上,安装的是SATA M.2SSD还是NVMeM.2 SSD。如果M.2载板上安装的是SATA M.2 SSD,BMC202需要通知CPU201中的BIOS将M.2连接器配置为SATA接口,如果M.2载板上安装的是NVMe M.2SSD,则BMC202通知CPU201中的BIOS把M.2连接器配置成PCIE接口,从而实现对不同类型M.2 SSD的兼容。If BMC202 determines that an M.2 carrier board is installed based on the Board ID, BMC202 will continue to determine whether an M.2 SSD card is installed on the M.2 carrier board, and whether a SATA M.2 SSD or an NVMe M.2 SSD is installed based on the above M2_PRSNT# and PEDET signals. If a SATA M.2 SSD is installed on the M.2 carrier board, BMC202 needs to notify the BIOS in CPU201 to configure the M.2 connector as a SATA interface. If an NVMe M.2 SSD is installed on the M.2 carrier board, BMC202 notifies the BIOS in CPU201 to configure the M.2 connector as a PCIE interface, thereby achieving compatibility with different types of M.2 SSDs.

本申请实施例提供的计算设备,OCP卡上可以设置两个M.2连接器,而且BMC可以自动识别OCP卡的M.2连接器上连接的是SATA SSD还是NVMe SSD盘,并对CPU的PCIE接口进行对应的配置,实现主板对两种类型的SSD的兼容。In the computing device provided in the embodiment of the present application, two M.2 connectors can be set on the OCP card, and the BMC can automatically identify whether the M.2 connector of the OCP card is connected to a SATA SSD or an NVMe SSD disk, and configure the PCIE interface of the CPU accordingly, thereby achieving the motherboard's compatibility with the two types of SSDs.

应该理解,本申请实施例不具体限定OCP卡上设置的M.2连接器的数量,可以为一个,也可以为两个,也可以为更多个,以上仅是分别以一个M.2连接器和两个M.2连接器为例进行了介绍,当包括更多个时的工作原理类似,在此不再赘述。It should be understood that the embodiment of the present application does not specifically limit the number of M.2 connectors provided on the OCP card, and may be one, two, or more. The above only introduces one M.2 connector and two M.2 connectors as examples. The working principle is similar when more connectors are included, and will not be repeated here.

基于以上实施例提供的一种计算设备,本申请实施例还提供一种计算设备的时钟配置方法,下面结合附图进行详细介绍。Based on a computing device provided in the above embodiment, an embodiment of the present application further provides a clock configuration method for a computing device, which is described in detail below in conjunction with the accompanying drawings.

参见图5,该图为本申请实施例提供的一种计算设备的控制方法的流程图。Refer to FIG. 5 , which is a flow chart of a method for controlling a computing device provided in an embodiment of the present application.

本申请实施例提供的计算设备的控制方法,计算设备包括:第一卡槽、第一电路板和主板;第一卡槽用于插接OCP卡;OCP卡包括:M.2连接器;M.2连接器用于连接固态硬盘SSD;主板包括基板管理控制器BMC;OCP卡的在位管脚连接BMC;M.2连接器的在位管脚和SSD类型管脚均连接BMC的串行总线接口;The control method of a computing device provided in an embodiment of the present application, the computing device comprises: a first card slot, a first circuit board and a mainboard; the first card slot is used to plug an OCP card; the OCP card comprises: an M.2 connector; the M.2 connector is used to connect a solid-state hard disk SSD; the mainboard comprises a baseboard management controller BMC; the in-position pin of the OCP card is connected to the BMC; the in-position pin and the SSD type pin of the M.2 connector are both connected to the serial bus interface of the BMC;

该方法包括:The method includes:

S501:BMC根据第一电路板的在位管脚的状态判断第一电路板是否在位;S501: The BMC determines whether the first circuit board is in place according to the state of the in-place pin of the first circuit board;

OCP卡100的在位管脚连接BMC;应该理解,本申请实施例提供的OCP卡的在位管脚遵从OCP卡的标准协议,OCP卡100包括四个在位管脚。有两个在位管脚在OCP卡上均接地;管脚在OCP卡上悬空。BMC检测两个IO管脚的电平为低时,判断OCP卡在位。The in-position pin of the OCP card 100 is connected to the BMC; it should be understood that the in-position pin of the OCP card provided in the embodiment of the present application complies with the standard protocol of the OCP card, and the OCP card 100 includes four in-position pins. Two in-position pins are both grounded on the OCP card; the pins are suspended on the OCP card. When the BMC detects that the level of the two IO pins is low, it determines that the OCP card is in position.

S502:在第一电路板在位的情况下,BMC根据M.2连接器的在位管脚的状态判断SSD是否在位;S502: When the first circuit board is in place, the BMC determines whether the SSD is in place according to the state of the in-place pin of the M.2 connector;

BMC通过串行总线扩展器读取M.2连接器的在位管脚的电平,判断SSD是否在位。The BMC reads the level of the presence pin of the M.2 connector through the serial bus expander to determine whether the SSD is in place.

S503:在SSD在位的情况下,BMC通过SSD类型管脚获得SSD的类型。S503: When the SSD is in place, the BMC obtains the type of the SSD through the SSD type pin.

例如,BMC通过串行总线扩展器读取SSD类型管脚的电平为低电平时,判断SSD类型为SATA类型;反之,SSD类型管脚PEDET1的电平为高电平时,判断SSD类型为NVMe类型。For example, when the level of the SSD type pin read by the BMC through the serial bus expander is low, the SSD type is determined to be a SATA type; conversely, when the level of the SSD type pin PEDET1 is high, the SSD type is determined to be an NVMe type.

本申请实施例提供的计算设备的控制方法,BMC可以通过在位管脚判断OCP卡是否在位,当OCP卡在位时,通过检测M.2连接器的在位管脚的状态判断SSD是否在位;当SSD在位时,BMC通过SSD类型管脚获得SSD的类型。OCP卡上的M.2连接器可以兼容SATA类型的SSD和NVMe类型的SSD,具有普适性,扩大了SSD的应用场景,给实际的使用带来了较大便利。The control method of the computing device provided in the embodiment of the present application can determine whether the OCP card is in place through the in-place pin of the BMC. When the OCP card is in place, it can determine whether the SSD is in place by detecting the state of the in-place pin of the M.2 connector; when the SSD is in place, the BMC obtains the type of the SSD through the SSD type pin. The M.2 connector on the OCP card is compatible with SATA type SSDs and NVMe type SSDs, has universality, expands the application scenarios of SSDs, and brings great convenience to actual use.

中央处理器CPU可以根据SSD类型确定与SSD类型匹配的协议;例如,SSD类型包括SATA和NVMe。The central processing unit CPU may determine a protocol matching the SSD type according to the SSD type; for example, the SSD types include SATA and NVMe.

一种可能的实现方式,本申请实施例提供的控制方法,在上述步骤S501之后,上述控制方法还包括:In a possible implementation manner, the control method provided in the embodiment of the present application, after the above step S501, the above control method further includes:

通过串行总线扩展器器读取板ID,通过板ID判断OCP卡是否为M.2载板,如果不是M.2载板,则按照标准OCP卡进行配置。The board ID is read through the serial bus expander, and the board ID is used to determine whether the OCP card is an M.2 carrier board. If it is not an M.2 carrier board, it is configured according to the standard OCP card.

为了本领域技术人员更好地理解和实施本申请实施例提供的技术方案,下面结合附图介绍一种BMC识别OCP卡完整的流程。In order for those skilled in the art to better understand and implement the technical solution provided in the embodiments of the present application, a complete process of BMC identifying OCP card is introduced below in conjunction with the accompanying drawings.

参见图6,该图为本申请实施例提供的又一种计算设备的控制方法的流程图。Refer to FIG. 6 , which is a flow chart of another method for controlling a computing device provided in an embodiment of the present application.

本申请实施例提供的计算设备的控制方法,包括:The control method of a computing device provided in an embodiment of the present application includes:

S601:BMC根据第一电路板的在位管脚信号,判断第一电路板是否在位。S601: The BMC determines whether the first circuit board is in place according to the in-place pin signal of the first circuit board.

计算设备的硬件系统部署完成后接通电源,交流上电启动,BMC启动。应该理解,服务器的机箱的侧面设有第一卡槽,判断第一电路板是否在位即判断第一卡槽是否插有第一电路板。After the hardware system of the computing device is deployed, the power is turned on, the AC is powered on and the BMC is started. It should be understood that the side of the server chassis is provided with a first card slot, and judging whether the first circuit board is in place means judging whether the first card slot has the first circuit board inserted.

如果没有第一电路板,服务器将按照默认逻辑启动,忽略第一卡槽上的PCIE带宽配置。第一卡槽可以为位于服务器后侧面的OCP卡槽位。If there is no first circuit board, the server will start according to the default logic, ignoring the PCIE bandwidth configuration on the first card slot. The first card slot can be an OCP card slot located on the rear side of the server.

例如,串行总线扩展器扩展的为I2C总线。For example, a serial bus expander expands the I2C bus.

S602:在第一电路板在位的情况下,则BMC通过串行总线扩展器读取第一电路板的Board ID,判断第一电路板是否为M.2转接卡。S602: When the first circuit board is in place, the BMC reads the Board ID of the first circuit board through the serial bus expander to determine whether the first circuit board is an M.2 adapter card.

S603:在第一电路板为M.2转接卡的情况下,BMC通过串行总线扩展器读取M.2连接器的在位管脚,判断SSD是否在位。S603: When the first circuit board is an M.2 adapter card, the BMC reads the in-position pin of the M.2 connector through the serial bus expander to determine whether the SSD is in position.

S604:在SSD在位的情况下,BMC通过串行总线扩展器读取SSD的类型管脚,判断SSD类型是SATA还是NVMe。如果SSD不在位,则CPU中的BIOS按照两个X4 PCIE接口进行配置带宽。S604: When the SSD is in place, the BMC reads the SSD type pin through the serial bus expander to determine whether the SSD type is SATA or NVMe. If the SSD is not in place, the BIOS in the CPU configures the bandwidth according to the two X4 PCIE interfaces.

如果BMC判断M.2连接器没有插SSD,则BMC将SSD未在位的信息传递给CPU的BIOS。If the BMC determines that the SSD is not inserted into the M.2 connector, the BMC transmits the information that the SSD is not in place to the BIOS of the CPU.

S605:当判断SSD是SATA M.2 SSD时,CPU中的BIOS按照两个SATA接口进行配置带宽,保障SATA M.2 SSD可用。S605: When it is determined that the SSD is a SATA M.2 SSD, the BIOS in the CPU configures bandwidth according to the two SATA interfaces to ensure that the SATA M.2 SSD is available.

S606:当判断SSD是NVMe M.2 SSD时,CPU中的BIOS按照两个X4 PCIE接口进行配置带宽,保障NVMe M.2 SSD可用。S606: When it is determined that the SSD is an NVMe M.2 SSD, the BIOS in the CPU configures the bandwidth according to the two X4 PCIE interfaces to ensure that the NVMe M.2 SSD is available.

本申请实施例提供的计算设备的控制方法,第一电路板上可以设置多个M.2连接器,而且BMC可以自动识别第一电路板的M.2连接器上连接的是SATA SSD还是NVMe SSD盘,并对CPU的PCIE接口进行对应的配置,实现主板对两种类型的SSD的兼容。In the control method of the computing device provided in the embodiment of the present application, multiple M.2 connectors can be set on the first circuit board, and the BMC can automatically identify whether the M.2 connector of the first circuit board is connected to a SATA SSD or an NVMe SSD disk, and configure the PCIE interface of the CPU accordingly, so as to achieve the compatibility of the motherboard with the two types of SSDs.

本申请实施例提供的计算设备的控制方法,设计与OCP卡形态相同(包括尺寸大小以及与主板连接的金手指/连接器的物理尺寸与OCP卡相同)的M.2的载板,并且该M.2载板上设有M.2连接器,M.2连接器可以用来插接SSD。由于OCP卡槽位于计算设备的机箱侧面,可以直接插拔,在SSD或者M.2连接器出现故障时,可以直接插拔进行维护,不需要拆开机箱。而且本申请实施例提供的计算设备,由于利用了OCP卡闲置的槽位,不必在计算设备的机箱内部专门预留空间设置M.2载板,从而可以节省机箱的内部空间。而且本申请实施例提供的OCP卡上的M.2连接器可以兼容SATA类型的SSD和NVMe类型的SSD,具有普适性。The control method of the computing device provided in the embodiment of the present application is designed to have an M.2 carrier board that is the same as the OCP card (including the size and the physical size of the gold finger/connector connected to the motherboard is the same as the OCP card), and the M.2 carrier board is provided with an M.2 connector, and the M.2 connector can be used to plug in the SSD. Since the OCP card slot is located on the side of the chassis of the computing device, it can be directly plugged in and out. When the SSD or the M.2 connector fails, it can be directly plugged in and out for maintenance without disassembling the chassis. Moreover, the computing device provided in the embodiment of the present application utilizes the idle slot of the OCP card, so there is no need to reserve space inside the chassis of the computing device to set up the M.2 carrier board, thereby saving the internal space of the chassis. Moreover, the M.2 connector on the OCP card provided in the embodiment of the present application is compatible with SATA type SSDs and NVMe type SSDs, and has universal applicability.

由于M.2在业界多用于系统盘,SATA SSD因为软件兼容性强,易使用,得到广泛的应用,如果只能兼容NVMe SSD,应用上有较大的局限性。本申请实施例提供的M.2连接器可以兼容SATA类型的SSD和NVMe类型的SSD,扩大了应用场景,给实际的使用带来了较大便利。Since M.2 is mostly used for system disks in the industry, SATA SSDs are widely used due to their strong software compatibility and ease of use. If they are only compatible with NVMe SSDs, there will be great limitations in their application. The M.2 connector provided in the embodiment of the present application is compatible with SATA type SSDs and NVMe type SSDs, which expands the application scenarios and brings great convenience to actual use.

另外,本申请实施例提供的第一电路板与传统的PCIE的M.2转接卡相比,由于PCIE插槽是通过PCIE的M.2转接卡从主板上扩展出来,而OCP卡是直接插在主板上,相比较来说,本申请实施例提供的OCP卡形态的M.2载板少使用一个PCIE的M.2转接卡,可以节省成本。In addition, compared with the traditional PCIE M.2 adapter card, the first circuit board provided in the embodiment of the present application has a PCIE slot that is extended from the motherboard through the PCIE M.2 adapter card, while the OCP card is directly inserted into the motherboard. In comparison, the OCP card-shaped M.2 carrier board provided in the embodiment of the present application uses one less PCIE M.2 adapter card, which can save costs.

以上所述,仅是本申请的较佳实施例而已,并非对本申请作任何形式上的限制。虽然本申请已以较佳实施例揭露如上,然而并非用以限定本申请。任何熟悉本领域的技术人员,在不脱离本申请技术方案范围情况下,都可利用上述揭示的方法和技术内容对本申请技术方案做出许多可能的变动和修饰,或修改为等同变化的等效实施例。因此,凡是未脱离本申请技术方案的内容,依据本申请的技术实质对以上实施例所做的任何简单修改、等同变化及修饰,均仍属于本申请技术方案保护的范围内。The above is only a preferred embodiment of the present application and does not constitute any formal limitation to the present application. Although the present application has been disclosed as above with a preferred embodiment, it is not intended to limit the present application. Any technician familiar with the art can make many possible changes and modifications to the technical solution of the present application using the methods and technical contents disclosed above without departing from the scope of the technical solution of the present application, or modify it into an equivalent embodiment of equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application still falls within the scope of protection of the technical solution of the present application.

Claims (10)

1. A computing device, comprising: the first clamping groove, the first circuit board and the main board;
the first clamping groove is used for being inserted into the first circuit board;
the first circuit board includes: an M.2 connector; the M.2 connector is used for connecting a solid state disk SSD;
The main board comprises a baseboard management controller BMC;
the in-place pin of the first circuit board is connected with the BMC;
the in-place pin of the M.2 connector and the SSD type pin of the M.2 connector are connected with a serial bus interface of the BMC;
The BMC is used for detecting the state of the in-place pin of the first circuit board and judging whether the first circuit board is in place or not; and judging whether the SSD is in place according to the level of an in-place pin of the M.2 connector under the condition that the first circuit board is in place, and determining the type of the SSD according to the level of the SSD type pin under the condition that the SSD is in place.
2. The computing device of claim 1, wherein the motherboard further comprises: a central processing unit;
the M.2 connector is connected with the central processing unit;
The BMC is also used for informing the CPU of the SSD type;
The central processing unit is configured to determine, according to the SSD type, a protocol that matches the SSD type, where the protocol includes a serial advanced technology attachment interface SATA protocol and a nonvolatile memory host controller interface NVMe protocol.
3. The computing device of claim 1, wherein the m.2 connector comprises a first m.2 connector and a second m.2 connector, the first circuit board further comprising a serial bus extender;
The first M.2 connector is used for connecting a first SSD, and the second M.2 connector is used for connecting a second SSD;
The first SSD and the second SSD are mutually backed up;
The bit pin and the SSD type pin of the first M.2 connector are connected with a serial bus interface of the BMC through the serial bus expander;
The bit pin and the SSD type pin of the second M.2 connector are connected with a serial bus interface of the BMC through the serial bus expander;
The first m.2 connector comprises a PCIE X4 pin, a PCIE X3 pin of the first m.2 connector is connected to the central processor, and the remaining PCIE X1 pin of the first m.2 connector is used as a SATA pin to be connected to the central processor;
the second m.2 connector includes a PCIE X4 pin, a PCIE X3 pin of the second m.2 connector is connected to the central processor, and a remaining PCIE X1 pin of the second m.2 connector is connected to the central processor as a SATA pin.
4. The computing device of claim 1, wherein a first in-place pin and a second in-place pin of the first circuit board are respectively connected to two IO pins of the BMC, the first in-place pin and the second in-place pin being both grounded on the first circuit board; the third in-place pin and the fourth in-place pin of the first circuit board are respectively connected with the other two IO pins of the BMC; the third in-place pin and the fourth in-place pin of the first circuit board are suspended on the first circuit board;
And the BMC is used for determining that the first circuit board is in place when the level of the two IO pins connected with the first in-place pin and the second in-place pin is detected to be low.
5. The computing device of any of claims 1-4, wherein the first circuit board further has a board ID stored thereon;
And the BMC is also used for reading the board ID, judging whether the first circuit board is an M.2 carrier board or not through the board ID, and if the first circuit board is not the M.2 carrier board, configuring the first circuit board by the central processing unit according to the bandwidth requirement of a standard OCP card.
6. The computing device of any of claims 1-4, wherein the BMC is specifically configured to determine that the SSD type is NVMe when the level of the SSD type pin is detected to be high; and when the level of the SSD type pin is detected to be low, determining that the SSD type is SATA.
7. A control method of a computing device, the computing device comprising: the first clamping groove, the first circuit board and the main board; the first clamping groove is used for being inserted into the first circuit board; the first circuit board includes: an M.2 connector; the M.2 connector is used for connecting a solid state disk SSD; the main board comprises a baseboard management controller BMC; the in-place pin of the first circuit board is connected with the BMC; the in-place pin of the M.2 connector and the SSD type pin of the M.2 connector are both connected with a serial bus interface of the BMC;
The method comprises the following steps:
Judging whether the first circuit board is in place or not according to the level of the in-place pin of the first circuit board;
Judging whether the SSD is in place or not according to the level of an in-place pin of the M.2 connector under the condition that the first circuit board is in place;
And determining the type of the SSD through the level of the SSD type pin under the condition that the SSD is in place.
8. The control method according to claim 7, characterized by further comprising:
Determining a protocol matched with the SSD type according to the SSD type; the protocol includes a serial advanced technology attachment interface SATA protocol and a non-volatile memory host controller interface NVMe protocol.
9. The control method of claim 7, wherein the first circuit board further has a board ID stored thereon, the method further comprising:
And reading the board ID, judging whether the first circuit board is an M.2 carrier board or not through the board ID, and if the first circuit board is not the M.2 carrier board, configuring the first circuit board by the central processing unit according to the bandwidth requirement of a standard OCP card.
10. The computing device of claim 1, wherein the determining the type of the SSD by the level of the SSD type pin, in particular comprises:
when the level of the SSD type pin is detected to be high, determining that the SSD type is NVMe; and when the level of the SSD type pin is detected to be low, determining that the SSD type is SATA.
CN202410437270.2A 2024-04-11 2024-04-11 A computing device and a control method Pending CN118295496A (en)

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