CN118315511B - A highly weather-resistant SMD LED light-emitting tube and its packaging process - Google Patents
A highly weather-resistant SMD LED light-emitting tube and its packaging process Download PDFInfo
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- CN118315511B CN118315511B CN202410443331.6A CN202410443331A CN118315511B CN 118315511 B CN118315511 B CN 118315511B CN 202410443331 A CN202410443331 A CN 202410443331A CN 118315511 B CN118315511 B CN 118315511B
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- 238000012858 packaging process Methods 0.000 title claims description 7
- 239000003292 glue Substances 0.000 claims description 32
- 238000004806 packaging method and process Methods 0.000 claims description 25
- 238000001746 injection moulding Methods 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 description 17
- 239000007789 gas Substances 0.000 description 8
- 230000008859 change Effects 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
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- Led Device Packages (AREA)
Abstract
本发明公开一种强耐候SMD LED发光管，包括壳体结构和构成LED发光管芯片电极引线端的电极支架，所述壳体结构内部形成有相互贯通的第一腔体和第二腔体；所述电极支架固定设置于第一腔体的内壁，电极支架包括中间部分和两侧的端头部，中间部分固定在第一腔体的内壁，两侧的端头部至少有一侧的端头部沿第一腔体的内壁向外壁延伸，并抵接置于所述壳体结构对应第一腔体处的外壁处。本发明技术方案旨在增强发光管的耐候性能，降低发光管受恶劣环境冲击的影响。
The present invention discloses a highly weather-resistant SMD LED light-emitting tube, comprising a shell structure and an electrode support constituting the electrode lead end of the LED light-emitting tube chip, wherein a first cavity and a second cavity that are mutually interpenetrating are formed inside the shell structure; the electrode support is fixedly arranged on the inner wall of the first cavity, and the electrode support comprises a middle part and end heads on both sides, wherein the middle part is fixed on the inner wall of the first cavity, and at least one end head on one side of the end heads on both sides extends along the inner wall of the first cavity toward the outer wall, and is abutted against the outer wall of the shell structure corresponding to the first cavity. The technical solution of the present invention aims to enhance the weather resistance of the light-emitting tube and reduce the impact of the light-emitting tube on the harsh environment.
Description
Technical Field
The invention relates to the technical field of luminous tubes, in particular to a strong weather-proof SMD LED luminous tube and a packaging process thereof.
Background
The outdoor display screen of LED that adopts SMD packaging technology's LED luminotron to make has become the mainstream product of outdoor demonstration, because outdoor display screen is in sun for a long time, high low temperature difference change, weather erosion, harmful gas etc. adverse circumstances and is operated for the weatherability of the LED luminotron device of display screen can directly influence the display quality and the life-span of display screen.
The LED luminous tube used for the outdoor display screen is characterized in that a forward-mounted LED chip is commonly packaged in a bracket in the industry, electrode leads of the LED chip are welded on electrode brackets of the chips in a long line mode with a certain radian, as the space in the LED luminous tube is small, welding spots at the other end of each electrode lead are close to the side of an electrode in the luminous tube, when the LED luminous tube is subjected to expansion deformation of a shell due to impact of severe environment in use, the welding spots at the side of the electrode are subjected to maximum expansion stress deformation, the welding wires at the position are easy to break away from or damage, meanwhile wind, rain and harmful gas gradually permeate into the chip and the electrode lead welding spots of the chip close to the side of the luminous tube for a long time, and rust the welding spots are corroded, so that the connection performance of the electrode leads to the reduction of the electrode wires, and the quality of the display screen is seriously reduced.
In addition, because the red, green and blue chips are arranged in the traditional LED luminous tube, the positive electrode and the negative electrode of each chip respectively correspond to electrode welding pins of one electrode bracket, the total electrode welding pins are 6 at most, the welding thrust value with an external PCB (printed circuit board) is insufficient, and after the LED luminous tube is used for a period of time, if the LED luminous tube is impacted by the outside, the LED luminous tube is easily separated from the external PCB.
Disclosure of Invention
The invention aims to provide a strong weather-proof SMD LED luminous tube, which aims to enhance the weather resistance of the SMD LED luminous tube, reduce the influence of severe environment on the luminous tube and improve the quality of the SMD LED luminous tube.
In order to achieve the above object, the present invention provides a highly weather-resistant SMD LED light emitting tube, comprising:
The shell structure is internally provided with a first cavity and a second cavity which are mutually communicated;
The electrode support comprises a middle part and end parts at two sides, wherein the middle part is fixed on the inner wall of the first cavity, and the end parts at least at one side of the end parts at two sides extend to the outer wall along the inner wall of the first cavity and are abutted to the outer wall of the shell structure corresponding to the first cavity.
By adopting the technical scheme, the electrode plate is made of metal material, and the thermal expansion and contraction resistance of the electrode plate is stronger than that of the plastic shell, so that the severe environment impact resistance of the whole SMD LED luminous tube shell can be improved.
Preferably, the cross sections of the first cavity and the second cavity are trapezoid, and the cross section area of the second cavity is larger than that of the first cavity.
Through adopting above-mentioned technical scheme, can lengthen the route that gaseous or steam got into first cavity inside, do not influence the luminous radiation scope of LED light emitting chip simultaneously.
Preferably, the electrode support comprises a first electrode support, a second electrode support, a third electrode support, a fourth electrode support and a fifth electrode support;
The end heads at two sides of the first electrode bracket respectively extend along the inner wall of the first cavity to the outer wall and are abutted to the outer wall of the shell structure corresponding to the first cavity;
The end heads of one side of the second electrode support, the third electrode support and the fourth electrode support extend from the inner wall of the first cavity to the outer wall, and are abutted to the outer wall of the shell structure corresponding to the first cavity;
The end heads at two sides of the fifth electrode bracket respectively extend towards the outer wall along the inner wall of the first cavity and are abutted against the outer wall of the shell structure corresponding to the first cavity;
The anode and the cathode of the red LED flip chip are respectively fixedly connected with the first electrode bracket and the second electrode bracket;
The anode and the cathode of the green LED flip chip are respectively fixedly connected with a third electrode bracket and a first electrode bracket;
the anode and the cathode of the blue LED flip chip are respectively and fixedly connected with the fifth electrode bracket and the fourth electrode bracket.
By adopting the technical scheme, the LED flip chip with three colors of red, green and blue can be positioned at the bottom relative center of the first cavity, and when the outer shell structure is deformed due to external high-low temperature change or physical impact, the stress deformation of each flip chip positioned at the bottom center of the inner wall of the first cavity is minimum, so that the highest physical environment impact resistance is achieved;
The number of the electrode plates is increased, so that the welding area of the LED luminous tube and the PCB connected with the outside is increased, the number of welding points is increased, the welding strength is improved, and the welding thrust value of the LED luminous tube is also greatly increased.
Preferably, the side wall of the shell structure corresponding to the first cavity is provided with a side wall extension part for extending the path length of the gas entering the first cavity, and the shape of the electrode bracket at the side wall extension part is the same as that of the side wall extension part.
Through adopting above-mentioned technical scheme, the electrode holder can lengthen the route that gaseous or steam got into first cavity inside with the setting mode of shell structure, improves the gas tightness of LED luminotron to promote its anti corrosion ability.
Preferably, the first cavity is filled with first packaging glue, the electrode support is located at a joint part between the inner wall and the outer wall and is located at a transition part between the first cavity and the second cavity, and the surface formed after the first packaging glue is solidified covers the joint part of the electrode support between the inner wall and the outer wall;
And the second plastic shell is filled with second packaging glue.
By adopting the technical scheme, the solidification connection parts of the first packaging glue and the second packaging glue, the electrode bracket and the shell structure are increased, so that the stretching resistance of the connection part of the electrode bracket and the shell structure is enhanced.
The invention provides a packaging process of a high weather-resistant SMD LED, and aims to manufacture the LED with high weather resistance in a simple, convenient and low-cost mode.
A packaging process of a strong weather-proof SMD LED light-emitting tube, for preparing any one of the above strong weather-proof SMD LED light-emitting tubes, comprising:
S10, setting a support die for stamping the electrode support, wherein the shape of a cavity of the support die is the same as that of the electrode support to be formed;
Setting a plastic mould for injection molding of the shell structure, wherein the shape of a cavity of the plastic mould is the same as that of the shell structure to be molded;
S20, a punching machine is matched with a bracket die, a copper sheet or an iron sheet is punched into an electrode bracket, and silver plating is carried out on the surface of the electrode bracket;
S30, placing the electrode bracket in a plastic mold, and adopting an injection molding machine to perform injection molding on a shell structure with the electrode bracket;
s40, fixing the red LED flip chip, the green LED flip chip and the blue LED flip chip on the corresponding electrode brackets by using a die bonder;
S50, dripping first packaging glue into the first cavity by using a glue dispenser, dripping second packaging glue into the second cavity after the first packaging glue is primarily solidified, and solidifying the second packaging glue.
Preferably, the surface of the electrode plate is coated with conductive solder, and the red LED flip chip, the green LED flip chip and the blue LED flip chip are fixedly connected with the electrode plate through the conductive solder.
By adopting the technical scheme, the electrode support is stably and reliably produced in batches by the support die, the shell structure is stably and reliably produced in batches by the plastic die, the whole packaging process is simple and convenient, the cost is low, and the manufactured LED luminous tube has strong weather resistance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an embodiment of a high weatherability SMD LED light emitting tube of the present invention;
FIG. 2 is a schematic view of another view angle structure of an embodiment of the SMD LED light-emitting tube with strong weather resistance according to the present invention;
FIG. 3 is a cross-sectional view taken along line 2 A-A;
FIG. 4 is a cross-sectional view at FIG. 2B-B;
fig. 5 is a schematic view of another view angle structure of an embodiment of the SMD LED tube of the present invention.
Reference numerals illustrate:
10. The LED flip chip comprises a shell structure, a first cavity, a 111, an extension part, a 12, a second cavity, a 20, an electrode support, a 21, a first electrode support, a 22, a second electrode support, a 23, a third electrode support, a 24, a fourth electrode support, a 25, a fifth electrode support, a 26, a red LED flip chip, a 27, a green LED flip chip and a 28, blue LED flip chip.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
Referring to fig. 1 to 5, the invention provides a strong weather-proof SMD LED light-emitting tube, which comprises a shell structure 10 and an electrode support 20 forming an electrode lead end of an LED light-emitting tube chip, wherein a first cavity 11 and a second cavity 12 which are mutually communicated are formed inside the shell structure 10, the electrode support 20 is fixedly arranged on the inner wall of the first cavity 11, the electrode support 20 comprises a middle part and two end heads on two sides, the middle part is fixedly arranged on the inner wall of the first cavity 11, and at least one end head on one side of the end heads on two sides extends along the inner wall of the first cavity 11 to the outer wall and is abutted to the outer wall of the shell structure 10 corresponding to the first cavity 11.
The shell structure 10 can be formed by plastic injection molding, a first cavity 11 and a second cavity 12 which are mutually communicated are formed in the shell structure, the first cavity 11 can be a cup-shaped structure provided with a groove body, the longitudinal section of the first cavity 11 can be trapezoid, rectangle, hemisphere or other shapes, the second cavity 12 can be an inverted trapezoid cup-shaped structure which is vertically communicated, namely, the upper opening area is larger than the bottom opening area, and the first cavity 11 and the second cavity 12 can be integrally formed in an injection molding processing mode.
The bottom of first cavity 11 is provided with the electrode support, and the middle part of electrode support tiling is in the bottom of first cavity 11, and both sides end is the pin part, laminates respectively and upwards extends in the inner wall of first cavity 11, then outwards buckles in the edge of first cavity 11, and the outer wall face of laminating first cavity 11 extends to the bottom afterwards, and the last lock is in the bottom of first cavity 11. After the second cavity 12 is fixedly connected to the first cavity 11, the electrode support can be injection molded at the connection part of the first cavity 11 and the second cavity 12, so that the metal sheet support is fixed. By adopting the technical scheme, the electrode plate is made of metal material, and the thermal expansion and contraction resistance of the electrode plate is stronger than that of the plastic shell, so that the severe environment impact resistance of the plastic shell of the whole SMD LED luminotron can be improved.
Referring to fig. 3 and 4 in combination, in an embodiment of the present application, the cross sections of the first cavity 11 and the second cavity 12 are both trapezoidal, and the cross section area of the second cavity 12 is larger than the cross section area of the first cavity 11. The cross sections of the first cavity 11 and the second cavity 12 are arranged in a trapezoid shape, so that the light reflection capability can be enhanced, and the light efficiency can be improved. And the path of the gas or vapor entering the inside of the first cavity 11 can be increased without affecting the light emitting radiation range of the LED light emitting chip.
In an embodiment of the application, the electrode holders 20 include a first electrode holder 21, a second electrode holder 22, a third electrode holder 23, a fourth electrode holder 24, and a fifth electrode holder 25, wherein the ends at two sides of the first electrode holder 21 respectively extend along the inner wall of the first cavity 11 to the outer wall and are abutted to the outer wall of the housing structure 10 corresponding to the first cavity 11, the ends at one side of the second electrode holder 22, the third electrode holder 23, and the fourth electrode holder 24 respectively extend along the inner wall of the first cavity 11 to the outer wall and are abutted to the outer wall of the housing structure 10 corresponding to the first cavity 11, the ends at two sides of the fifth electrode holder 25 respectively extend along the inner wall of the first cavity 11 to the outer wall and are abutted to the outer wall of the housing structure 10 corresponding to the first cavity 11, the positive and negative poles of the red LED flip chip 26 are respectively and fixedly connected to the first electrode holder 21 and the second electrode holder 22, the positive and negative poles of the green LED flip chip 27 respectively fixedly connected to the third electrode holder 23 and the positive and negative electrode of the blue LED flip chip 24 respectively are fixedly connected to the positive and negative electrode of the fifth electrode holder 24 and the fifth electrode holder 25 respectively.
In this embodiment, the LED flip chips with three colors of red, green and blue are located at the bottom opposite center of the first cavity 11, and when the outer shell structure is deformed due to the change of the external temperature or physical impact, the flip chips located at the bottom center of the inner wall of the first cavity 11 are subjected to the minimum stress deformation, so as to achieve the strongest physical environment impact resistance, and the number of the electrode plates is increased, so that the welding area of the LED luminous tube and the PCB board connected with the outside is increased, the number of the welding points is increased, the welding strength is improved, and the welding thrust value of the LED luminous tube is also greatly increased.
Referring to fig. 3 in combination, in an embodiment of the present application, a sidewall extension 111 for extending the path length of the gas entering the first cavity 11 is provided on a sidewall of the housing structure 10 corresponding to the first cavity 11, and the shape of the electrode support at the sidewall extension 111 is the same as the shape of the sidewall extension 111. Through adopting above-mentioned technical scheme, the setting mode of electrode holder and shell structure 10 can increase the route that gaseous or steam got into first cavity 11 inside, improves the gas tightness of LED luminotron to promote its anti corrosion ability.
For example, a chamfer may be circumferentially disposed at an outer edge of the first cavity 11, and a portion of the electrode support is attached to the chamfer, when the electrode support is subjected to shrinkage deformation due to temperature change, most of stress, which is received by the electrode support and is shrunk toward the inside of the first cavity 11, is distributed in a direction perpendicular to the chamfer, so that the stress is transferred to an outer wall of the first cavity 11, and the outer wall of the first cavity 11 is sufficient to resist the force of the shrinkage deformation of the electrode support, so that the inward shrinkage deformation of the electrode support can be avoided, and the LED light-emitting chip of the electrode support falls off or cracks after being subjected to the deformation stress, thereby enhancing the capability of the light-emitting tube to resist cold and hot impact and enhancing the weather resistance thereof.
In an embodiment of the present application, a first encapsulation glue (not shown) is filled in the first cavity 11, the electrode holder is located at a junction between the inner wall and the outer wall and at a transition between the first cavity 11 and the second cavity 12, a surface formed by curing the first encapsulation glue covers the junction between the inner wall and the outer wall of the electrode holder, and a second encapsulation glue (not shown) is filled in the second plastic shell.
The first packaging glue filled in the first cavity 11 is mainly used for sealing the LED light-emitting chips on the electrode support and forming a closed space with the outer wall of the first cavity 11, the second packaging glue filled in the second cavity 12 is used for preventing ultraviolet corrosion and enhancing light-emitting performance, the LED light-emitting chips on the electrode support are required to pass through the second packaging glue and the first packaging glue, the overlapping and growing penetrating path can reduce the damage degree of the ultraviolet rays and the harmful gases to the LED light-emitting chips packaged on the electrode support, meanwhile, the length of the multi-section tortuous airtight path is far longer than the length from the welding point at the side of the electrode lead to the outer wall surface in the general flat bottom luminous tube, the air tightness is stronger, and the rust resistance is improved. And the solidification connection parts of the first packaging glue and the second packaging glue with the electrode support and the shell structure 10 are increased, so that the stretching resistance of the connection part of the electrode support and the shell structure 10 is enhanced.
The invention also provides a packaging process of the strong weather-proof SMD LED luminous tube, which is used for preparing the strong weather-proof SMD LED luminous tube according to any embodiment, and comprises the following steps:
S10, setting a support die for stamping the electrode support, wherein the shape of a cavity of the support die is the same as that of the electrode support to be formed;
Setting a plastic mould for injection molding of the shell structure, wherein the shape of a cavity of the plastic mould is the same as that of the shell structure to be molded;
S20, a punching machine is matched with a bracket die, a copper sheet or an iron sheet is punched into an electrode bracket, and silver plating is carried out on the surface of the electrode bracket;
S30, placing the electrode bracket in a plastic mold, and adopting an injection molding machine to perform injection molding on a shell structure with the electrode bracket;
s40, fixing the red LED flip chip, the green LED flip chip and the blue LED flip chip on the corresponding electrode brackets by using a die bonder;
S50, dripping first packaging glue into the first cavity by using a glue dispenser, dripping second packaging glue into the second cavity after the first packaging glue is primarily solidified, and solidifying the second packaging glue.
Preferably, the surface of the electrode plate is coated with solder, and the red LED flip chip, the green LED flip chip and the blue LED flip chip are fixedly connected with the electrode plate through the solder.
In the description of the present application, it should be understood that, if there is an orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is merely for convenience of describing the present application and simplifying the description, and it is not intended to indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus the terms describing the positional relationship in the drawings are merely for exemplary illustration and are not to be construed as limitations of the present patent, and that the specific meaning of the terms described above may be understood by those skilled in the art according to specific circumstances.
The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the application.
Claims (6)
1. A highly weatherable SMD LED light tube, comprising:
The shell structure is internally provided with a first cavity and a second cavity which are mutually communicated;
The electrode support is fixedly arranged on the inner wall of the first cavity and comprises a middle part and end heads at two sides, the middle part is fixed on the inner wall of the first cavity, the end heads at two sides are respectively bent outwards at the edge of the inner wall of the first cavity, extend towards the bottom along the outer wall surface of the first cavity and are buckled at the bottom of the first cavity, and the electrode support is injection-molded at the joint of the first cavity and the second cavity;
The electrode supports comprise a first electrode support, a second electrode support, a third electrode support, a fourth electrode support and a fifth electrode support;
The end heads at two sides of the first electrode bracket respectively extend along the inner wall of the first cavity to the outer wall and are abutted to the outer wall of the shell structure corresponding to the first cavity;
The end heads of one side of the second electrode support, the third electrode support and the fourth electrode support extend from the inner wall of the first cavity to the outer wall, and are abutted to the outer wall of the shell structure corresponding to the first cavity;
The end heads at two sides of the fifth electrode bracket respectively extend towards the outer wall along the inner wall of the first cavity and are abutted against the outer wall of the shell structure corresponding to the first cavity;
The anode and the cathode of the red LED flip chip are respectively fixedly connected with the first electrode bracket and the second electrode bracket;
The anode and the cathode of the green LED flip chip are respectively fixedly connected with a third electrode bracket and a first electrode bracket;
the anode and the cathode of the blue LED flip chip are respectively and fixedly connected with the fifth electrode bracket and the fourth electrode bracket.
2. The high weatherability SMD LED light emitting tube of claim 1, wherein the cross section of said first and second cavities are trapezoidal and the cross section area of said second cavity is greater than the cross section area of said first cavity.
3. The SMD LED light emitting tube of claim 1, wherein said housing structure has a sidewall extension corresponding to a sidewall of the first cavity for extending a path length of the gas into the first cavity, and the electrode mount has the same shape at the sidewall extension as the sidewall extension.
4. The strong weather-proof SMD LED light-emitting tube according to claim 2, wherein said first cavity is filled with a first encapsulation glue, said electrode holder is located at a junction between the inner wall and the outer wall, at a transition between the first cavity and the second cavity, and a surface formed by curing said first encapsulation glue covers the junction between the inner wall and the outer wall of the electrode holder;
And second packaging glue is filled in the second cavity.
5. A packaging process of a strong weather-resistant SMD LED light-emitting tube, for preparing the strong weather-resistant SMD LED light-emitting tube according to any one of claims 1 to 4, comprising:
S10, setting a support die for stamping the electrode support, wherein the shape of a cavity of the support die is the same as that of the electrode support to be formed;
Setting a plastic mould for injection molding of the shell structure, wherein the shape of a cavity of the plastic mould is the same as that of the shell structure to be molded;
S20, a punching machine is matched with a bracket die, a copper sheet or an iron sheet is punched into an electrode bracket, and silver plating is carried out on the surface of the electrode bracket;
S30, placing the electrode bracket in a plastic mold, and adopting an injection molding machine to perform injection molding on a shell structure with the electrode bracket;
s40, fixing the red LED flip chip, the green LED flip chip and the blue LED flip chip on the corresponding electrode brackets by using a die bonder;
S50, dripping first packaging glue into the first cavity by using a glue dispenser, dripping second packaging glue into the second cavity after the first packaging glue is primarily solidified, and solidifying the second packaging glue.
6. The process for packaging the high-weather-resistance SMD LED luminous tube according to claim 5, wherein the surface of the electrode bracket is coated with conductive solder, and the red LED flip chip, the green LED flip chip and the blue LED flip chip are fixedly connected with the electrode bracket through the conductive solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410443331.6A CN118315511B (en) | 2024-04-12 | 2024-04-12 | A highly weather-resistant SMD LED light-emitting tube and its packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410443331.6A CN118315511B (en) | 2024-04-12 | 2024-04-12 | A highly weather-resistant SMD LED light-emitting tube and its packaging process |
Publications (2)
| Publication Number | Publication Date |
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| CN118315511A CN118315511A (en) | 2024-07-09 |
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| CN218896635U (en) * | 2022-12-19 | 2023-04-21 | 深圳市和胜欣晶膜数字文化光电有限公司 | Lens packaging type full-color LED lamp bead with built-in vertical structure RGB chip and drive IC chip |
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| KR101055081B1 (en) * | 2010-01-15 | 2011-08-08 | 엘지이노텍 주식회사 | Light emitting device, light emitting device manufacturing method and backlight unit |
| JP2013026451A (en) * | 2011-07-21 | 2013-02-04 | Stanley Electric Co Ltd | Semiconductor light-emitting device |
| CN204289531U (en) * | 2014-12-25 | 2015-04-22 | 深圳市安普光光电科技有限公司 | Full-color LED encapsulation structure and LED show module |
| CN206098444U (en) * | 2016-07-22 | 2017-04-12 | 厦门市信达光电科技有限公司 | Polycrystal LED packaging support and polycrystal LED packaging body |
| KR102769519B1 (en) * | 2018-02-14 | 2025-02-17 | 에피스타 코포레이션 | Light-emitting device, manufacturing method thereof and display module using the same |
| KR102515603B1 (en) * | 2018-04-11 | 2023-03-29 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | Light emitting device package and light module |
| TWI819073B (en) * | 2019-08-22 | 2023-10-21 | 晶元光電股份有限公司 | Light-emitting device, manufacturing method thereof and display module using the same |
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| CN114171509A (en) * | 2021-12-29 | 2022-03-11 | 深圳市迈龙迪科技有限公司 | A multi-light chamber LED pixel light-emitting tube and its manufacturing process |
| CN220672586U (en) * | 2023-08-11 | 2024-03-26 | 深圳市迈龙迪科技有限公司 | Outdoor small-space display LED mounting type luminous tube structure |
| CN117393550B (en) * | 2023-11-15 | 2024-05-28 | 深圳市富斯迈电子有限公司 | LED luminous tube chip jump layer type packaging structure and preparation process thereof |
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| CN101350321A (en) * | 2007-07-18 | 2009-01-21 | 晶科电子（广州）有限公司 | Method for manufacturing LED directly mounted on a support upside-down |
| CN218896635U (en) * | 2022-12-19 | 2023-04-21 | 深圳市和胜欣晶膜数字文化光电有限公司 | Lens packaging type full-color LED lamp bead with built-in vertical structure RGB chip and drive IC chip |
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