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CN118438342B - A core-shell abrasive polishing disc capable of changing the motion state of abrasive, preparation method and application thereof - Google Patents

A core-shell abrasive polishing disc capable of changing the motion state of abrasive, preparation method and application thereof Download PDF

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Publication number
CN118438342B
CN118438342B CN202410526205.7A CN202410526205A CN118438342B CN 118438342 B CN118438342 B CN 118438342B CN 202410526205 A CN202410526205 A CN 202410526205A CN 118438342 B CN118438342 B CN 118438342B
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abrasive
core
shell
polishing
polishing disc
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CN118438342A (en
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路家斌
梁文锐
胡达
靳宇航
龙浩天
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Guangdong University of Technology
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Guangdong University of Technology
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention relates to a core-shell abrasive polishing disc capable of changing the motion state of an abrasive, a preparation method and application thereof. In the course of rough machining, core-shell abrasive is uniformly fixed in the grinding and polishing disk, the holding force of matrix on core-shell abrasive is large, the matrix has large material removing capacity on workpiece, and can quickly implement flattening machining of workpiece, according to the machining process, the colloid shell of core-shell abrasive is dissolved by adding organic solvent grinding and polishing liquid on the surface of grinding and polishing disk to form pores, and internal abrasive can be locally moved freely in the pores so as to implement the conceivability of abrasive on workpiece surface machining, obtain high-quality machining surface and at the same time can prevent waste of free abrasive. The coarse and fine machining process circulation of the workpiece is realized through the addition of the organic solvent and the trimming of the polishing disc, so that the polishing machining procedure is shortened, and the machining efficiency and the surface quality are improved.

Description

Core-shell abrasive polishing disc capable of changing abrasive motion state, preparation method and application thereof
Technical Field
The invention relates to the technical field of grinding and polishing. In particular to a core-shell abrasive polishing disc capable of changing abrasive motion state, a preparation method and application thereof.
Background
For processing hard and brittle material workpieces such as semiconductors and glass, the workpiece is generally required to undergo cutting, grinding, polishing and other procedures, and the processing efficiency and the processing surface quality such as surface roughness, surface/subsurface damage, lattice dislocation and the like of the workpiece are often required to adjust the processing procedures according to the processing progress so as to realize the removal of high-efficiency materials to obtain high-quality processing surfaces.
Currently, in the grinding and polishing stages, the abrasive is generally classified into three forms of a fixed abrasive, a semi-fixed abrasive and a free abrasive according to the state of the abrasive in the grinding and polishing. A fixed abrasive disk is a solid body of abrasive material in which the abrasive material is bonded to a base material, and during processing, the workpiece is removed by the abrasive material from the disk surface. The matrix in the fixed abrasive polishing disc has high holding force on the abrasive, can realize the rapid planarization processing of the surface of the workpiece, but is easy to cause the damage of the surface/subsurface of the workpiece, and meanwhile, the fixed abrasive is easy to grind down due to the lack of elasticity in the process of contacting with the workpiece, so that the polishing disc needs to be timely trimmed, and the service life is reduced. The semi-solid abrasive polishing disc generally adopts a special consolidation agent to consolidate the abrasive, so that the abrasive can move in a certain space or a certain range, the processing surface quality can be improved while higher processing efficiency is ensured, but the conversion from efficient planarization processing to high-quality surface processing cannot be realized according to the processing progress. The free abrasive is added into the solution, and the abrasive is removed from the workpiece material by dripping the polishing liquid onto the polishing disc, so that the surface can be processed with high quality, but the processing efficiency is low, the waste of the abrasive material is easily caused, the abrasive is harmful to the environment, the abrasive is agglomerated due to lack of control of the abrasive in the polishing process, and the polishing uniformity of the workpiece is affected to a certain extent.
Currently, in the grinding and polishing stage, it is generally divided into rough and fine machining processes, in which a planarized machined surface is efficiently obtained with a large mechanical removal force, and in which a high quality surface is flexibly obtained with a reduced mechanical removal force. In the course of rough to fine machining, machining parameters such as a machining disc, an abrasive and the like often need to be replaced, and the machining parameters have complex machining procedures and high use cost. Therefore, if the conversion from rough machining to finish machining can be quickly realized on the same polishing disc, the machining efficiency is greatly improved, and the machining cost is reduced.
The present patent (CN 109475995B) discloses a polishing body for CMP, which stores polishing particles through a plurality of air holes communicating in a longitudinal direction, and the polishing particles can be maintained in the air holes during polishing to achieve stable polishing performance. However, the control form of the grinding body on the grinding material is not changeable, the performance cannot be changed according to the processing process, the processing efficiency is low, and the efficient material removal cannot be realized.
The present patent (CN 103897202A) discloses a preparation method and application of a polystyrene/silicon oxide core-shell type nano composite abrasive, wherein polystyrene is used as an inner core, silicon oxide is used as an outer shell, and the polystyrene has higher elasticity and buffering effect on polishing pressure, so that excessive mechanical damage of the silicon oxide abrasive to a workpiece is reduced, and scratches and damage are effectively reduced. However, the core-shell abrasive is used for free abrasive, and is not applied to a polishing disc or a polishing pad, and the particle size of the silica abrasive serving as an outer layer is smaller, so that the material removal rate of composite abrasive processing is lower.
The method has the advantages that the existing workpiece processing has the problems that the surface/subsurface damage of the workpiece is easy to cause in the processing of the fixed abrasive, the processing uniformity of the free abrasive is poor, the utilization rate of the abrasive is low, the process from rough processing to finish processing is complicated, and the like in grinding and polishing.
Disclosure of Invention
Aiming at the problems existing in the prior art, the application discloses a core-shell abrasive polishing disc capable of changing the motion state of an abrasive, a preparation method and application thereof, and solves the problems that the surface/subsurface damage of a workpiece is easily caused by the processing of a fixed abrasive, the processing uniformity of free abrasive is poor, the utilization rate of the abrasive is low, the process from rough processing to finish processing is complicated, and the like in the grinding and polishing by changing the application mode of the abrasive in the polishing process.
The core-shell abrasive polishing disc capable of changing the abrasive motion state, the preparation method and the application thereof have extremely important significance in reducing the cost in polishing and processing and improving the processing efficiency and the surface quality.
Based on the polishing disc, the invention provides a core-shell abrasive polishing disc capable of changing the motion state of an abrasive, which is used for flattening, grinding and polishing of semiconductors and glass workpieces, and the substrate of the polishing disc is selected from one of epoxy resin base, ceramic base and polyurethane base.
Further, the core-shell abrasive consists of an abrasive inner layer and a polymer organic colloid outer layer wrapping the abrasive, wherein the core-shell abrasive and the abrasive inner layer are granular, the grain size of the core-shell abrasive is 0.1-20 mu m, the grain size of the abrasive inner layer of the core-shell abrasive is 0.1-16 mu m, and the thickness of the polymer organic colloid outer layer is 0.05-4 mu m.
Further, the inner layer abrasive is selected from one of diamond, silicon carbide, alumina, cerium oxide and silicon dioxide, and the outer layer of the polymer organic colloid is selected from one of polystyrene, polymethyl methacrylate and benzoguanamine formaldehyde.
Furthermore, uniform air holes are formed in the polishing disc, the diameters of the air holes are 10-100 mu m, abrasive dust generated during processing can be stored, and excessive abrasive dust is prevented from blocking the holes where the abrasive is located, so that the concession of the abrasive in finish processing is prevented from being influenced.
The invention also provides a method for preparing the core-shell abrasive polishing disc capable of changing the motion state of the abrasive, which comprises the following steps:
S1, adding polyvinyl alcohol into a three-neck flask containing deionized water, heating in a water bath to 100 ℃, and continuously stirring for 1-2 hours at 400-600 r/min to obtain a polyvinyl alcohol aqueous solution with a mass fraction of 2-4%, adding sodium oleate particles with a particle size of 1 mu m into the polyvinyl alcohol aqueous solution, controlling the mass fraction of sodium oleate to be 3-6%, and continuously stirring at a speed of 400-600 r/min for 1-2 hours to obtain a substance A;
S2, adding a grinding material and polystyrene with the mass fraction of 5-20% into a dichloromethane solvent with the mass fraction of 20-30%, controlling the mass ratio of the grinding material to the polystyrene to the dichloromethane to be 1:2-4:20-25, and stirring in a water bath at 20-50 ℃ for 1-2 hours until the polystyrene and the grinding material are completely mixed, wherein the obtained substance is denoted as B;
S3, dropwise adding the substance B prepared in the step S2 into the substance A prepared in the step S1 at a speed of 1-1.5 mL/min to form emulsion, placing the emulsion in an environment of 25-30 ℃ and stirring at a speed of 450-600 r/min, preserving heat for 15-20 h, evaporating the organic solvent, keeping the remainder as C after the organic solvent is completely evaporated, centrifuging the substance C at 7000-800 r/min for 10-20 min, washing the precipitate with deionized water for 3-5 times, wherein the mass ratio of the deionized water to the substance B is 1:2-4, and placing the precipitate in a drying oven at 30-50 ℃ for 2h to obtain the abrasive/polystyrene core-shell abrasive;
S4, taking 4.9-9.9% of the core-shell abrasive material prepared in the step S3 according to the mass percentage, taking a polishing disc matrix preparation formula according to the corresponding mass percentage, mixing abrasive particles and the matrix formula, and solidifying and forming;
and S5, demolding the polishing disc blank formed by curing in the step S4, and finishing the polishing disc on a polishing machine by using a 100-1000-mesh grinding wheel for 5-20 min to obtain higher flatness on the surface of the polishing disc, so that the core-shell abrasive polishing disc capable of changing the abrasive motion state for polishing processing can be obtained, and the abrasive is fixedly arranged in the polishing disc.
Further, when the substrate of the polishing disc is selected from epoxy resin, the specific procedure of S4 is as follows:
Taking 4.9-9.9% of the core-shell abrasive material prepared in the step S3 by mass percent, taking 70-74% of liquid epoxy resin by mass percent, taking 0.1% of pore-forming agent by mass percent, wherein the pore-forming agent is one of calcium carbonate, plastic balls and hollow microspheres, mixing the three materials, stirring for 30-1 h at 1000-1200 r/min, adding 20-21% of curing agent by mass percent, mixing at the same speed, stirring for 5-10 min to obtain a mixture, pouring the mixture into a polishing disc die, standing and curing at 23-26 ℃, and keeping for 10-12 h.
Further, the curing agent is one of aniline curing agent, alcohol amine curing agent, polyamide curing agent and the like which are commonly used for curing epoxy resin, and preferably, the curing agent is one of ethylenediamine, cyclohexylamine and polyamide ester.
Further, when the substrate of the polishing disc is selected from polyurethane groups, the specific procedure of S4 is as follows:
taking 4.9-9.9% of core-shell abrasive material prepared in the step S3 by mass percent, taking 65-70% of polyurethane prepolymer by mass percent, taking 20-25% of hydroxypropyl silicone oil by mass percent, taking 0.001% of stannous octoate by mass percent, taking 0.1% of pore-forming agent by mass percent, wherein the pore-forming agent is selected from one of calcium carbonate, plastic balls and hollow microspheres, mixing and performing ultrasonic dispersion at 80 ℃, mechanically stirring at 600r/min for reacting for 12min, adding chain-extending cross-linking agent MOCA at 1-2% by mass percent, stirring at 1300r/min for 30S at 80 ℃ to obtain a mixture, pouring the mixture into a preheated polytetrafluoroethylene mould, applying 2kg pressure to the mould, and curing at 110 ℃ for 16 h.
The invention also provides an application of the core-shell abrasive polishing disc capable of changing the abrasive motion state in workpiece grinding and polishing, comprising the following steps:
The method comprises the following steps of SS1, dropwise adding deionized water polishing liquid to the surface of a core-shell abrasive fixed polishing disc at the speed of 3-4 mL/min in a rough machining stage, enabling a workpiece to be in contact with the core-shell abrasive fixed polishing disc capable of changing the abrasive motion state and realizing relative motion, solidifying the abrasive in the polishing disc at the moment and removing materials on the surface of the workpiece, wherein the rough machining stage is adopted;
SS2, when the surface roughness of a workpiece is reduced to 1-20 nm through rough machining, dropwise adding grinding liquid containing 15-20% of organic solvent to the surface of a core-shell abrasive grinding disc capable of changing the motion state of the abrasive at the speed of 3-4 mL/min, dissolving a colloid shell of the core-shell abrasive on the surface of the grinding disc by the organic solvent, enabling the abrasive inside to freely move in a limited space pore generated by dissolving the shell, further playing roles of avoiding free abrasive loss and waste, improving abrasive yield and reducing damage to the surface of the workpiece, realizing the finish machining of the workpiece, and finishing the finish machining stage when the surface roughness of the workpiece is reduced to 0.1-1 nm;
And SS3, finishing the polished core-shell abrasive polishing disc capable of changing the abrasive motion state by using a 100-1000-mesh finishing grinding wheel, setting the rotation speed of the polishing disc according to the diameter of the polishing disc, determining the finishing time by using a polishing disc matrix material, removing the surface layer of the polishing disc where free abrasive exists, and reserving the plane where the core-shell abrasive which is not dissolved in the shell exists so as to realize disc surface abrasive state conversion.
Further, the organic solvent added to SS2 is selected from one of limonene, methylene chloride, methanol, and the like.
Compared with the prior art, the invention has the beneficial effects that:
1. The invention provides a core-shell abrasive polishing disc capable of changing abrasive motion state, which comprises a core-shell abrasive, wherein the core-shell abrasive consists of an inner abrasive layer and an outer colloid wrapping the abrasive, and the core-shell abrasive is uniformly distributed in the polishing disc.
2. In the rough machining process, the core-shell abrasive is uniformly fixed in the polishing disc, the holding force of the matrix on the core-shell abrasive is large, the abrasive has larger mechanical removing force on the surface of the workpiece, and the planarization machining of the workpiece can be rapidly realized.
3. According to the processing progress, the conversion from rough processing to finish processing is realized by adding an organic solvent polishing liquid into the polishing disc, the organic solvent solution can dissolve the colloid of the organic shell, the colloid shell of the core-shell abrasive is dissolved to form pores, the internal abrasive can do local free movement in the limited space pores generated by the colloid dissolution, the waste of free abrasive is avoided, the concessibility of the abrasive on the surface of a workpiece is improved, and the damage of the abrasive on the surface of the workpiece is reduced or even eliminated, so that the high-quality processing surface is obtained.
4. The pore-forming agent is added in the preparation process to enable the polishing disc to have pores for storing abrasive dust generated in the polishing process, so that excessive abrasive dust is prevented from entering pores where the abrasive is located to prevent local free movement of the abrasive, and the conceivability of the abrasive in finish machining is reduced.
5. The polishing disc can realize the conversion of rough and finish machining procedures of workpieces in one disc, effectively shortens the grinding and polishing machining procedures, greatly improves the machining efficiency, the abrasive utilization rate, the machining uniformity and the surface quality of the workpieces, and reduces the machining cost.
Drawings
FIG. 1 is a schematic illustration of a core-shell abrasive disk application step for changing the abrasive motion;
FIG. 2 is a schematic illustration of rough machining of a workpiece by a core-shell abrasive disk with changeable abrasive motion;
FIG. 3 is a schematic illustration of the finishing of a workpiece by a core-shell abrasive disk with a changeable abrasive motion.
Wherein, the polishing agent comprises a 1-core-shell abrasive, a 2-material removing layer, a 3-workpiece, a 4-abrasive inner layer, a 5-macromolecule organic colloid, a 6-polishing solution, a 7-polishing disc matrix and 8-pores.
Detailed Description
The invention will be further described with reference to the following specific embodiments, but the examples are not intended to limit the invention in any way. Raw materials reagents used in the examples of the present invention are conventionally purchased raw materials reagents unless otherwise specified.
Examples 1-5 are core-shell abrasive polishing discs with epoxy resin based and changeable abrasive motion state, and the types, particle sizes and grinding fluids of the abrasives in examples 1-5 are different, see table 1:
table 1 examples 1-5 partial parameter summary tables
Example 1
This example describes the formulation and preparation of a core-shell abrasive, further describes the method of preparing a polishing disc using the core-shell abrasive, and further describes an application of the polishing disc.
1.1A core-shell abrasive material comprises the following specific steps:
S1, adding polyvinyl alcohol into a three-neck flask containing deionized water, heating in a water bath to 100 ℃, continuously stirring at 600r/min for 2 hours until the polyvinyl alcohol is completely dissolved to obtain a polyvinyl alcohol aqueous solution with the mass fraction of 3 percent, adding sodium oleate particles with the particle size of 1 mu m into the polyvinyl alcohol aqueous solution, controlling the mass fraction of sodium oleate to be 3 percent, and continuously stirring at 600r/min for 2 hours to obtain a substance A;
S2, adding a diamond abrasive with the grain diameter of 5 mu m and 10% of polystyrene into 20% of methylene dichloride solvent, wherein the mass ratio of the diamond abrasive to the polystyrene to the methylene dichloride solvent is 1:2:20, and stirring in a water bath at 40 ℃ for 2 hours until the polystyrene and the diamond are completely mixed and dissolved, wherein the obtained substance is denoted as B;
And S3, dropwise adding the substance B prepared in the step S2 into the substance A prepared in the step S1 at a speed of 1mL/min by using a syringe to form emulsion, placing the emulsion in a water bath kettle at a temperature of 30 ℃ and stirring at a speed of 600r/min, preserving heat for 20h, evaporating an organic solvent, marking the residual substance as C, centrifuging the substance C at 8000r/min for 20min, washing the precipitate with deionized water for 5 times, wherein the mass ratio of the dosage of the deionized water to the substance B is 1-4, and placing the precipitate in a drying oven at a temperature of 50 ℃ for 2h to obtain the diamond/polystyrene core-shell abrasive.
1.2 Method for preparing core-shell abrasive polishing disc with epoxy resin base and changeable abrasive motion state, comprising the following specific steps:
(1) Taking 9.8% of core-shell abrasive material prepared by 1.1% by mass, taking 70% of liquid epoxy resin by mass, taking 0.1% of hollow microspheres by mass, mixing the three, stirring for 30min at 1000r/min, adding 20% by mass of curing agent ethylenediamine, mixing, stirring for 5min at the same speed to obtain a mixture, pouring the mixture into a grinding and polishing disc mold, standing and curing at 25 ℃, and keeping for 2h;
(2) Demolding the polishing disc blank formed by curing in the step (1), and then finishing the polishing disc on a polishing machine by using a 500-mesh grinding wheel for 15min to ensure that the surface of the polishing disc obtains higher flatness, thus obtaining the core-shell abrasive polishing disc which is used for polishing and can change the abrasive motion state, wherein the abrasive is fixedly arranged in the polishing disc.
1.3 A core-shell abrasive polishing disc for processing a workpiece of a hard and brittle material, the abrasive motion state of which can be changed, the application of the polishing disc comprising the following steps:
SS1, dropwise adding deionized water polishing liquid to the surface of a core-shell abrasive fixed polishing disc at the speed of 4mL/min, enabling a workpiece to be in contact with the core-shell abrasive polishing disc capable of changing the abrasive motion state and realizing relative motion, wherein the polishing time is 20min;
And SS2, setting the rotation speed of the polishing disc to be 100r/min, and using a 500-mesh dressing grinding wheel to dress the polished core-shell abrasive polishing disc capable of changing the abrasive motion state for 10min.
Example 2
2.1 Formulation and preparation of core-shell abrasive referring to 1.1 of example 1, the difference is that the diamond abrasive particle size in this example S2 is 1 μm.
2.2 Method for preparing core-shell abrasive polishing disc with epoxy resin based capable of changing abrasive motion state, the specific steps refer to 1.2 of example 1, and the difference is that (1) in this example is 9.8% of the core-shell abrasive prepared by 2.1 by mass percent.
2.3 A core-shell abrasive polishing disc for hard and brittle material workpiece processing with changeable abrasive motion state, the polishing application step of which is referred to 1.3 of example 1.
Example 3
3.1 Method for preparing core-shell abrasive polishing disc with epoxy resin based changeable abrasive motion state, the specific steps refer to 1.2 of example 1, wherein (1) in this example 9.8% of diamond abrasive is taken by mass percent, and the abrasive particle size is 5 μm.
3.2 A core-shell abrasive polishing disc for processing workpieces of brittle and hard material with changeable abrasive motion, the polishing application procedure of which is described in example 1, 1.3.
Example 4
4.1 Method for preparing core-shell abrasive polishing disc with epoxy resin based changeable abrasive motion state, the specific steps refer to 1.2 of example 1, wherein (1) in this example 9.8% of diamond abrasive is taken by mass percent, and the abrasive particle size is 1 μm.
4.2 A core-shell abrasive polishing disc for hard and brittle material workpiece processing with changeable abrasive motion state, the polishing application step of which is referred to 1.3 of example 1.
Example 5
5.1 Formulation and preparation of a core-shell abrasive specific procedures are described in example 1, 1.1.
5.2 Method for preparing core-shell abrasive polishing disc with epoxy resin based capable of changing abrasive motion state, the specific steps refer to 1.2 of example 1, and the difference is that (1) in this example is 9.8% of core-shell abrasive prepared by 5.1 by mass percent.
5.3 A core-shell abrasive polishing disc which is used for processing hard and brittle material workpieces and can change the abrasive motion state, wherein the polishing application steps are as follows:
SS1, dropwise adding deionized water polishing liquid to the surface of a core-shell abrasive fixed polishing disc at the speed of 4mL/min, enabling a workpiece to be in contact with the core-shell abrasive fixed polishing disc capable of changing the motion state of the abrasive and realizing relative motion, wherein the abrasive is fixed in the polishing disc and realizes material removal on the surface of the workpiece, and the polishing time is 10min;
SS2, dripping polishing liquid containing 20% of limonene on the surface of a core-shell abrasive polishing disc capable of changing the abrasive motion state at the speed of 4mL/min, wherein the polishing time is 10min;
And SS3, setting the rotation speed of the polishing disc to be 100r/min, using a 500-mesh finishing grinding wheel to finish the polished core-shell abrasive polishing disc capable of changing the abrasive motion state for 10min, removing the surface layer of the polishing disc where free abrasive exists, and reserving the plane where the core-shell abrasive which is not dissolved in the shell exists.
The mass change of the workpiece before and after grinding was weighed with a precision electronic balance (precision: 0.1 mg) to calculate the material removal rate, and the surface roughness and the morphology change of the workpiece before and after grinding were measured with a white light interferometer (ContourGT-X3). The polishing was performed on a KD15BX single-sided grinder using the polishing pad of this example, and the polished workpiece was a 2-inch 4H-SiC cut piece manufactured by Blu-ray semiconductor Co., ltd. In Beijing, with an initial surface roughness of 80.+ -. 6nm and an initial thickness of 400.+ -.25. Mu.m.
The grinding processing of the 4H-SiC workpiece is realized through relative rotation, the grinding pressure is 200kPa, the rotating speed is 60r/min, the workpiece grinding time is set to be 0-10min and 10-20min, and the workpiece material removal rate and the surface roughness are detected after grinding.
Polishing tests were performed on the polishing plates of the different applications of examples 1-5 using the above polishing conditions, and the test results are shown in Table 2:
Table 2 examples 1-5 polishing test results on polishing discs
As can be seen from comparative examples 3 and 4 in Table 2, the 5 μm large-grain diamond consolidated polishing disc has a high material removal rate in the polishing process, which can reach 55.88nm/min, but has a poor effect of reducing the surface roughness of the wafer, the surface roughness reduction efficiency is obviously deteriorated in the stage of 10-20min, the 1 μm small-grain diamond consolidated polishing disc can effectively reduce the surface roughness in the polishing process, the polishing time can be reduced to Ra 3.2nm for 20min, but the material removal rate is lower, which is only 41.4% of that of the large-grain diamond polishing disc.
As can be seen from comparison of examples 1 and 2, the material removal rate of the large-particle-size core-shell abrasive fixed polishing disc in the polishing process is higher and can reach 54.32nm/min, while the small-particle-size core-shell abrasive fixed polishing disc can obtain better wafer surface quality and can reach Ra 2.2nm.
It can be seen from comparative examples 1 and 3, comparative examples 2 and 4 that the grinding effect of diamond with the same particle size and core-shell diamond consolidated disk is about the same in the case that the core-shell abrasive shell is not dissolved, and the larger particle size core-shell abrasive consolidated disk has higher material removal rate, and the lower particle size core-shell abrasive consolidated disk can obtain better lens surface quality.
As can be seen from a comparison of examples 1 and 5, the polishing disc allows the wafer to achieve a lower surface roughness, reaching Ra 1.2nm, after dissolution of the core shell abrasive colloid shell.
As can be seen from comparison of examples 2 and 5, the large-particle-size core-shell abrasive consolidated polishing disc has higher material removal rate, and the surface roughness of the wafer can be effectively reduced by dissolving the colloid shell of the shell abrasive, so that the large-particle-size abrasive has better surface quality than the small-particle-size abrasive in the polishing process.
Examples 6 to 10
Examples 6 to 10 are core-shell abrasive polishing discs with polyurethane base and changeable abrasive motion state, and the types, particle sizes and grinding fluids of the abrasives in examples 6 to 10 are different, see table 3:
TABLE 3 Induction of parameters for examples 6-10 section
Example 6
This example describes the formulation and preparation of a core-shell abrasive, further describes the method of preparing a polishing disc using the core-shell abrasive, and further describes an application of the polishing disc.
6.1 Formulation and preparation of a core-shell abrasive specific procedures are described in example 1, 1.1.
6.2, The method for preparing the polyurethane-based core-shell abrasive polishing disc capable of changing the motion state of the abrasive comprises the following specific steps:
(1) Taking 8.2% of core-shell abrasive material prepared in the step 6.1 by mass percent, taking 68.4% of polyurethane prepolymer by mass percent, taking 21.6% of hydroxypropyl silicone oil by mass percent, taking 0.001% of stannous octoate by mass percent, taking 0.1% of hollow microspheres by mass percent, mixing and performing ultrasonic dispersion at 80 ℃, mechanically stirring at 600r/min for reacting for 12min, adding 1.7% of chain-extending cross-linking agent MOCA by mass percent, stirring at 1300r/min for 30s at 80 ℃ to obtain a mixture, pouring the mixture into a preheated polytetrafluoroethylene mould, applying 2kg pressure to the mould, and curing at 110 ℃ for 16 h;
(2) Demolding the polishing disc blank solidified and molded in the step S4, and then finishing the polishing disc on a polishing machine by using a 500-mesh grinding wheel for 10min to ensure that the surface of the polishing disc obtains higher flatness, thus obtaining the core-shell abrasive polishing disc which is used for polishing and processing and can change the abrasive motion state, wherein the abrasive is fixedly arranged in the polishing disc.
6.3 A core-shell abrasive polishing disc for processing a workpiece of a hard and brittle material, the polishing application of which comprises the following steps:
SS1, dropwise adding deionized water polishing liquid to the surface of a core-shell abrasive fixed polishing disc at the speed of 4mL/min, enabling a workpiece to be in contact with the core-shell abrasive polishing disc capable of changing the abrasive motion state and realizing relative motion, wherein the polishing time is 60min;
and SS2, setting the rotation speed of the polishing disc to be 100r/min, and finishing the polished core-shell abrasive polishing disc capable of changing the abrasive motion state for 10min by using a 500-mesh finishing grinding wheel.
Example 7
7.1 Formulation and preparation of a core-shell abrasive specific procedures are described in example 2, 2.1.
7.2 Method for preparing polyurethane-based core-shell abrasive polishing disc capable of changing abrasive motion state, the specific procedure is 6.2 of example 6, except that (1) in this example, the core-shell abrasive obtained by 7.1 is used.
7.3 A core-shell abrasive polishing disc for hard and brittle material workpiece processing with changeable abrasive motion state, the polishing application step of which is described in example 6, 6.3.
Example 8
8.1 Method for preparing polyurethane-based core-shell abrasive polishing disc capable of changing abrasive motion state, referring to 6.2 of example 6, in specific steps, 9.8% of diamond abrasive is taken according to mass percentage in the example (1), and the abrasive particle size is 5 μm.
8.2 A core-shell abrasive polishing disc for hard and brittle material workpiece processing with changeable abrasive motion state, the polishing application step of which is described in example 6, 6.3.
Example 9
9.1 Method for preparing polyurethane-based core-shell abrasive polishing disc capable of changing abrasive motion state, referring to 6.2 of example 6, in specific steps, (1) 9.8% diamond abrasive is taken by mass percent in this example, and abrasive particle size is 1 μm.
9.2A core-shell abrasive polishing disc for workpiece processing of hard and brittle materials with changeable abrasive motion state, the polishing application step of which is described in example 6, 6.3.
Example 10
10.1 Formulation and preparation of a core-shell abrasive specific procedures are described in example 1, 1.1.
10.2 Method for preparing polyurethane-based core-shell abrasive polishing disc capable of changing abrasive motion state, the specific procedure is 6.2 of example 6, except that (1) in this example, 10.1 of the core-shell abrasive is taken.
10.3 A core-shell abrasive polishing disc which is used for processing hard and brittle material workpieces and can change the motion state of the abrasive, wherein the polishing application steps are as follows:
SS1, dropwise adding deionized water polishing liquid to the surface of a core-shell abrasive fixed polishing disc at the speed of 4mL/min, enabling a workpiece to be in contact with the core-shell abrasive fixed polishing disc capable of changing the motion state of the abrasive and realizing relative motion, wherein the abrasive is fixed in the polishing disc and realizes material removal on the surface of the workpiece, and the polishing time is 30min;
SS2, dripping polishing liquid containing 20% of limonene on the surface of a core-shell abrasive polishing disc capable of changing the abrasive motion state at the speed of 4mL/min, wherein the polishing time is 30min;
And SS3, setting the rotation speed of the polishing disc to be 100r/min, using a 500-mesh finishing grinding wheel to finish the polished core-shell abrasive polishing disc capable of changing the abrasive motion state for 10min, removing the surface layer of the polishing disc where free abrasive exists, and reserving the plane where the core-shell abrasive which is not dissolved in the shell exists.
The experimental detection method adopted is the same as that of examples 1 to 5, and will not be described here again. The polished workpiece was a 2 inch 4H-SiC cut piece produced by Beijing Tiankogakuda blue semiconductor Co., ltd, with an original surface roughness of 2.+ -. 0.3nm and an initial thickness of 350.+ -. 25. Mu.m.
The 4H-SiC workpiece is polished by relative rotation, the polishing solution is deionized water or limonene solution, the polishing pressure is 40kPa, the workpiece rotating speed is 40r/min, the polishing disk rotating speed is 40r/min, the workpiece polishing time is set to 0-30min and 30-60min, and the workpiece material removal rate and the surface roughness are detected after polishing.
Polishing tests were performed on the polishing plates of the different applications of examples 6-10 using the polishing conditions described above, and the test results are shown in Table 4:
table 4 results of polishing test on polishing discs of examples 6 to 10
As can be seen from the comparison of the examples 8 and 9 in Table 4, the 5 μm large grain diameter diamond consolidated polishing disc has a higher material removal rate in the polishing process, which can reach 43.75nm/min, but the effect of reducing the surface roughness of the wafer is poor, the surface roughness reduction efficiency is obviously deteriorated in the stage of 30-60min, the 1 μm small grain diameter diamond consolidated polishing disc can effectively reduce the surface roughness in the polishing process, the polishing time can be reduced to Ra 0.432nm in 60min, but the material removal rate is lower, which is only 54.8% of that of the large grain diameter diamond polishing disc.
As can be seen from comparison of examples 6 and 7, the material removal rate of the large-particle-size core-shell abrasive fixed polishing disc in the polishing process is higher and can reach 46.11nm/min, while the small-particle-size core-shell abrasive fixed polishing disc can obtain better wafer surface quality and can reach Ra 0.466nm.
As can be seen from comparative examples 6 and 8, and comparative examples 7 and 9, the polishing effect of the diamond and core-shell diamond consolidated disk of the same particle size is about the same in the case where the core-shell abrasive shell is insoluble, and the larger particle size core-shell abrasive consolidated disk has a higher material removal rate, and the lower particle size core-shell abrasive consolidated disk can achieve better lens surface quality.
As can be seen from a comparison of examples 6 and 10, the polishing disc allows the wafer to achieve a lower surface roughness, up to Ra 0.357nm, after dissolution of the core-shell abrasive colloid shell.
As can be seen from comparison of examples 7 and 10, the large-particle-size core-shell abrasive consolidated disk has a higher material removal rate, and the surface roughness of the wafer can be effectively reduced by dissolving the colloidal shell of the shell abrasive, so that the large-particle-size abrasive has better surface quality than the small-particle-size abrasive in the polishing process.
As can be seen from the above examples, core-shell abrasive polishing discs that change the state of abrasive motion can be used for efficient conversion from rough to finish. The workpiece material removal rate is higher before the organic solvent is added dropwise, and the surface roughness is rapidly reduced after the organic solvent is added dropwise.
In the examples, the core-shell abrasive was dissolved in the polystyrene shell by dropping a limonene organic solvent to convert from rough machining to finish machining, and the abrasive inside the particles was converted from a solidified state to a state free from the pores in the limited space.
The core-shell abrasive polishing disc capable of changing the abrasive motion state has the function of controlling the abrasive application mode of the polishing disc in the polishing process, and the advantages that the polishing disc can avoid waste of free abrasive and obtain higher processing efficiency and better polishing effect are shown.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it is possible for a person skilled in the art to make several variants and modifications without departing from the inventive concept, which fall within the scope of protection of the present invention.

Claims (7)

1.一种制备可改变磨料运动状态的核壳磨料研抛盘的方法，其特征在于，具体包括以下步骤：1. A method for preparing a core-shell abrasive polishing disc capable of changing the motion state of an abrasive, characterized in that it specifically comprises the following steps: S1：将聚乙烯醇加入盛有去离子水的三颈烧瓶中，水浴加热至100℃并以400~600r/min速度连续搅拌1~2h，得到质量分数为2~4%的聚乙烯醇水溶液；将粒径为1μm的油酸钠颗粒加入聚乙烯醇水溶液中并控制油酸钠的质量分数为3~6%，继续在400~600r/min的速度下搅拌1~2小时后得到A物质；S1: Add polyvinyl alcohol into a three-necked flask filled with deionized water, heat to 100°C in a water bath and stir continuously at 400-600 r/min for 1-2 hours to obtain a polyvinyl alcohol aqueous solution with a mass fraction of 2-4%; add sodium oleate particles with a particle size of 1 μm into the polyvinyl alcohol aqueous solution and control the mass fraction of sodium oleate to 3-6%, continue stirring at 400-600 r/min for 1-2 hours to obtain substance A; S2：将磨料和质量分数为5~20%的聚苯乙烯加入质量分数为20~30%的二氯甲烷溶剂，控制磨料、聚苯乙烯、二氯甲烷的质量比为1：2~4：20~25，在20~50℃水浴中搅拌1~2h后所得物质记为B；S2: Add abrasive and 5-20% polystyrene to 20-30% dichloromethane solvent, control the mass ratio of abrasive, polystyrene and dichloromethane to be 1:2-4:20-25, stir in a water bath at 20-50℃ for 1-2h, and the resulting substance is recorded as B; S3：将步骤S2所制得B物质以1~1.5mL/min的速度滴加到步骤S1所制得A物质中形成乳状液，并将乳状液置于25~30℃环境中以450~600r/min速度进行搅拌，保温15~20h蒸发有机溶剂；所剩余物质记为C，将C物质在7000~8000r/min下离心10~20min，用去离子水洗涤沉淀物3~5次，去离子水的用量和B物质的质量比为1：2~4；将沉淀物置于30~50℃干燥箱中2h，即得到磨料/聚苯乙烯核壳磨料；S3: adding the substance B obtained in step S2 to the substance A obtained in step S1 at a rate of 1-1.5 mL/min to form an emulsion, and placing the emulsion in an environment of 25-30°C and stirring at a rate of 450-600 r/min, and keeping the temperature for 15-20 hours to evaporate the organic solvent; the remaining substance is recorded as C, and the substance C is centrifuged at 7000-8000 r/min for 10-20 minutes, and the precipitate is washed with deionized water for 3-5 times, and the mass ratio of the amount of deionized water to the substance B is 1:2-4; placing the precipitate in a drying oven at 30-50°C for 2 hours to obtain an abrasive/polystyrene core-shell abrasive; S4：按质量百分比取4.9~9.9%的步骤S3制得的核壳磨料，按对应质量百分比取研抛盘基体制备配方，将磨料颗粒和基体配方混合并固化成型；S4: taking 4.9-9.9% by mass of the core-shell abrasive prepared in step S3, taking a polishing disc matrix preparation formula according to the corresponding mass percentage, mixing the abrasive particles and the matrix formula and curing them into a shape; S5：将步骤S4固化成型的研抛盘胚料脱模，然后在抛光机上用100~1000目砂轮对研抛盘修整5~20min，使研抛盘表面获得较高的平面度，即可获得用于研抛加工的可改变磨料运动状态的核壳磨料研抛盘，此时磨料固结于研抛盘中；S5: demoulding the polishing disc blank solidified in step S4, and then trimming the polishing disc on a polishing machine with a 100-1000 mesh grinding wheel for 5-20 minutes to obtain a high flatness on the surface of the polishing disc, thereby obtaining a core-shell abrasive polishing disc capable of changing the motion state of the abrasive for polishing processing, wherein the abrasive is solidified in the polishing disc; 该可改变磨料运动状态的核壳磨料研抛盘用于半导体、玻璃工件的平坦化研磨、抛光加工，研抛盘的基体选自环氧树脂基、陶瓷基、聚氨酯基中的一种；The core-shell abrasive polishing disc capable of changing the motion state of the abrasive is used for flattening and polishing of semiconductor and glass workpieces, and the base of the polishing disc is selected from one of epoxy resin base, ceramic base and polyurethane base. 核壳磨料由磨料内层以及包裹磨料的高分子有机胶体外层构成，核壳磨料以及磨料内层均呈现颗粒状，所述核壳磨料粒径为0.1~20μm；所述核壳磨料的磨料内层粒径为0.1~16μm，高分子有机物胶体外层的厚度为0.05~4μm；The core-shell abrasive is composed of an inner layer of abrasive and an outer layer of polymer organic colloid wrapping the abrasive. The core-shell abrasive and the inner layer of abrasive are both granular. The particle size of the core-shell abrasive is 0.1-20 μm. The particle size of the inner layer of the core-shell abrasive is 0.1-16 μm, and the thickness of the outer layer of polymer organic colloid is 0.05-4 μm. 所述磨料内层选自金刚石、碳化硅、氧化铝、氧化铈、二氧化硅中的一种；所述高分子有机胶体外层选自聚苯乙烯、聚甲基丙烯酸甲酯、以苯代三聚氰胺甲醛中的一种；The inner abrasive layer is selected from one of diamond, silicon carbide, aluminum oxide, cerium oxide, and silicon dioxide; the outer polymer organic colloid layer is selected from one of polystyrene, polymethyl methacrylate, and benzoguanamine formaldehyde; 研抛盘中存在均匀的气孔，所述气孔的直径为10~100μm。There are uniform pores in the polishing disc, and the diameter of the pores is 10-100 μm. 2.根据权利要求1所述制备可改变磨料运动状态的核壳磨料研抛盘的方法，其特征在于，当研抛盘的基体选自环氧树脂基时，S4的具体步骤如下：2. The method for preparing a core-shell abrasive polishing disc capable of changing the motion state of an abrasive according to claim 1, characterized in that when the base of the polishing disc is selected from an epoxy resin base, the specific steps of S4 are as follows: 按质量百分比取4.9~9.9%的步骤S3制得的核壳磨料，按质量百分比取70~74%的液态环氧树脂，按质量百分比取0.1%的造孔剂，造孔剂选自碳酸钙、塑料球、中空微球中的一种，将三者混合并且以1000~1200r/min搅拌30min~1h，再加入质量百分比为20~21%的固化剂混合以相同速率搅拌5~10min，得到混合料，将混合料浇注于研抛盘模具里在23~26℃下静置固化，保持10~12h。Take 4.9-9.9% of the core-shell abrasive prepared in step S3 by mass percentage, take 70-74% of liquid epoxy resin by mass percentage, take 0.1% of pore-forming agent by mass percentage, the pore-forming agent is selected from one of calcium carbonate, plastic balls, and hollow microspheres, mix the three and stir at 1000-1200 r/min for 30 min-1 h, then add 20-21% of curing agent by mass percentage and stir at the same rate for 5-10 min to obtain a mixture, pour the mixture into a polishing disc mold and stand it at 23-26° C. for curing for 10-12 h. 3.根据权利要求2所述制备可改变磨料运动状态的核壳磨料研抛盘的方法，其特征在于，固化剂选自常用于固化环氧树脂的苯胺类固化剂、醇胺类固化剂、聚酰胺类固化剂中的一种。3. The method for preparing a core-shell abrasive polishing disc capable of changing the motion state of an abrasive according to claim 2, characterized in that the curing agent is selected from one of aniline curing agents, alcoholamine curing agents and polyamide curing agents commonly used for curing epoxy resins. 4.根据权利要求3所述制备可改变磨料运动状态的核壳磨料研抛盘的方法，其特征在于，固化剂选自乙二胺、环己胺、聚酰胺酯中的一种。4. The method for preparing a core-shell abrasive polishing disc capable of changing the motion state of an abrasive according to claim 3, characterized in that the curing agent is selected from one of ethylenediamine, cyclohexylamine and polyamide ester. 5.根据权利要求1所述制备可改变磨料运动状态的核壳磨料研抛盘的方法，其特征在于，当研抛盘的基体选自聚氨酯基时，S4的具体步骤如下：5. The method for preparing a core-shell abrasive polishing disc capable of changing the motion state of an abrasive according to claim 1, characterized in that when the base of the polishing disc is selected from a polyurethane base, the specific steps of S4 are as follows: 按质量百分比取4.9~9.9%的步骤S3制得的核壳磨料，按质量百分比取65~70%的聚氨酯预聚体，按质量百分比取20~25%的羟丙基硅油，按质量百分比取0.001%辛酸亚锡，按质量百分比取0.1%造孔剂，造孔剂选自碳酸钙、塑料球、中空微球中的一种，混合并在80℃下超声分散，以600r/min速度机械搅拌反应12min后加入质量百分比1~2%的扩链交联剂MOCA，将混合料在80℃下以1300r/min的速度搅拌30s，得到混合料，将混合料浇注到预热的聚四氟乙烯模具中，并对模具施加2kg压力，并在110℃下固化16小时。4.9-9.9% of the core-shell abrasive prepared in step S3 is taken by mass percentage, 65-70% of the polyurethane prepolymer is taken by mass percentage, 20-25% of the hydroxypropyl silicone oil is taken by mass percentage, 0.001% of stannous octoate is taken by mass percentage, and 0.1% of a pore-forming agent is taken by mass percentage, wherein the pore-forming agent is selected from one of calcium carbonate, plastic balls, and hollow microspheres. The mixture is ultrasonically dispersed at 80° C., and after mechanically stirring at a speed of 600 r/min for 12 min, 1-2% of a chain extender crosslinking agent MOCA is added. The mixture is stirred at a speed of 1300 r/min for 30 s at 80° C. to obtain a mixture, and the mixture is poured into a preheated polytetrafluoroethylene mold, a pressure of 2 kg is applied to the mold, and the mixture is cured at 110° C. for 16 hours. 6.权利要求1-5任一项所述的可改变磨料运动状态的核壳磨料研抛盘在工件研磨和抛光中的应用，其特征在于，包括如下步骤：6. The use of the core-shell abrasive polishing disc capable of changing the motion state of the abrasive according to any one of claims 1 to 5 in grinding and polishing a workpiece, characterized in that it comprises the following steps: SS1：在粗加工阶段，向核壳磨料固结研抛盘表面以3~4mL/min的速度滴加去离子水研抛液，工件与可改变磨料运动状态的核壳磨料研抛盘接触并实现相对运动；SS1: In the rough machining stage, deionized water polishing liquid is dripped onto the surface of the core-shell abrasive polishing disc at a rate of 3-4 mL/min, and the workpiece contacts the core-shell abrasive polishing disc that can change the motion state of the abrasive and realizes relative motion; SS2：通过粗加工使工件表面粗糙度降至1~20nm时，对可改变磨料运动状态的核壳磨料研抛盘表面以3~4mL/min的速度滴加含有15~20%有机溶剂的研抛液，有机溶剂溶解研抛盘表面的核壳磨料的胶体外壳，当工件表面粗糙度降低至0.1~1nm时，精加工阶段结束；SS2: When the surface roughness of the workpiece is reduced to 1-20 nm through rough machining, a polishing liquid containing 15-20% organic solvent is added to the surface of the core-shell abrasive polishing disc that can change the motion state of the abrasive at a rate of 3-4 mL/min. The organic solvent dissolves the colloidal shell of the core-shell abrasive on the surface of the polishing disc. When the surface roughness of the workpiece is reduced to 0.1-1 nm, the finishing stage ends; SS3：使用100~1000目修整砂轮对研抛后的可改变磨料运动状态的核壳磨料研抛盘进行修整，去除游离磨料所在的研抛盘表面，保留未被溶解外壳的核壳磨料所在平面。SS3: Use a 100~1000 mesh dressing wheel to dress the core-shell abrasive polishing disc that can change the motion state of the abrasive after polishing, remove the surface of the polishing disc where the free abrasive is located, and retain the plane where the core-shell abrasive with the undissolved shell is located. 7.根据权利要求6所述的可改变磨料运动状态的核壳磨料研抛盘在工件研磨和抛光中的应用，其特征在于，SS2中加入的有机溶剂选自柠檬烯、二氯甲烷和甲醇中的一种。7. Use of the core-shell abrasive polishing disc capable of changing the motion state of the abrasive according to claim 6 in workpiece grinding and polishing, characterized in that the organic solvent added to SS2 is selected from one of limonene, dichloromethane and methanol.
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