CN118471867B - Semiconductor package testing device and testing method thereof - Google Patents
Semiconductor package testing device and testing method thereof Download PDFInfo
- Publication number
- CN118471867B CN118471867B CN202410938330.9A CN202410938330A CN118471867B CN 118471867 B CN118471867 B CN 118471867B CN 202410938330 A CN202410938330 A CN 202410938330A CN 118471867 B CN118471867 B CN 118471867B
- Authority
- CN
- China
- Prior art keywords
- rod
- clamping rod
- lead
- lower clamping
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
本发明涉及半导体封装技术领域，具体为一种半导体封装测试装置及其测试方法，装置包括：托台，其上设置有：用于承托芯片的凹槽；下夹杆，其上设置有与引线端部适配的凹槽；压台，其上设置有：压框；上夹杆，其上设置有用于固定下夹杆的上插杆；引导槽，其用于引导上夹杆于水平方向移动，其中：上插杆插入下夹杆以使上夹杆与下夹杆固定在一起、并夹持引线另一端。该发明提供的半导体封装测试装置，压框与托台顶部配合将引线靠近环氧树脂的一端夹持住，避免引线在延伸的过程中影响与之结合的环氧树脂，上夹杆与下夹杆配合夹住引线的另一端，能够更好地牵引引线，使芯片上的多根引线同步延展，延伸后的引脚的底部处于同一水平面上。
The present invention relates to the field of semiconductor packaging technology, specifically to a semiconductor packaging test device and a test method thereof, the device comprising: a support table, on which is provided: a groove for supporting a chip; a lower clamping rod, on which is provided: a groove adapted to the end of a lead; a press table, on which is provided: a press frame; an upper clamping rod, on which is provided: an upper insertion rod for fixing the lower clamping rod; a guide groove, which is used to guide the upper clamping rod to move in a horizontal direction, wherein: the upper insertion rod is inserted into the lower clamping rod so that the upper clamping rod and the lower clamping rod are fixed together and the other end of the lead is clamped. The semiconductor packaging test device provided by the invention has a press frame and a top of the support table that cooperate to clamp one end of the lead close to the epoxy resin to prevent the lead from affecting the epoxy resin combined with it during the extension process, and the upper clamping rod and the lower clamping rod cooperate to clamp the other end of the lead, which can better pull the lead, so that multiple leads on the chip are extended synchronously, and the bottoms of the extended pins are on the same horizontal plane.
Description
技术领域Technical Field
本发明涉及半导体封装技术领域，具体为一种半导体封装测试装置及其测试方法。The present invention relates to the technical field of semiconductor packaging, and in particular to a semiconductor packaging testing device and a testing method thereof.
背景技术Background Art
半导体是一种常温下介于导体和绝缘体之间的材料，被广泛应用在集成电路、通信通讯、消费电子等领域，常见的计算机、手机的核心部件都和半导体有着密切的联系。Semiconductor is a material that is between conductor and insulator at room temperature. It is widely used in integrated circuits, communications, consumer electronics and other fields. The core components of common computers and mobile phones are closely related to semiconductors.
现有技术中，半导体封装测试需要先将晶圆背面减薄，之后进行清洗切割，然后进行贴片和焊线，将引线固定在晶圆上，再用环氧树脂进行注塑以保护晶圆以及其上的引线，最后进行切筋，将引线多余部分切除，并将伸出来的引线压成芯片的引脚。在将伸出来的引线压成芯片的引脚的过程中，一般是直接利用挤压设备将引线压成预定形状的引脚，但在这一过程中，引线的各部分发生延展，引线与环氧树脂连接的部分也会发生延展，而环氧树脂在固化后基本不具备延展性，这就导致引线与环氧树脂连接部分在延展的过程中会拉动附着在其上的环氧树脂，使连接处的环氧树脂出现微小的裂缝，影响芯片的品质。In the prior art, semiconductor packaging testing requires first thinning the back of the wafer, then cleaning and cutting, then performing chip placement and wire bonding, fixing the leads on the wafer, and then injecting epoxy resin to protect the wafer and the leads thereon, and finally cutting the ribs, cutting off the excess leads, and pressing the extended leads into the pins of the chip. In the process of pressing the extended leads into the pins of the chip, generally, the leads are directly pressed into pins of a predetermined shape using an extrusion device, but in this process, various parts of the leads are extended, and the parts where the leads are connected to the epoxy resin are also extended, and the epoxy resin is basically not ductile after curing, which causes the lead and the epoxy resin to pull the epoxy resin attached to it during the extension process, causing tiny cracks in the epoxy resin at the connection, affecting the quality of the chip.
发明内容Summary of the invention
为解决上述问题，本发明提供一种半导体封装测试装置，包括：In order to solve the above problems, the present invention provides a semiconductor packaging test device, comprising:
托台，其上设置有：A support platform is provided with:
用于承托芯片的凹槽；A groove for holding a chip;
下夹杆，其上设置有与引线端部适配的凹槽；A lower clamping rod, on which a groove adapted to the end of the lead wire is provided;
压台，其上设置有：A press table, on which are arranged:
压框；Press frame;
上夹杆，其上设置有用于固定所述下夹杆的上插杆；An upper clamping rod, on which an upper inserting rod for fixing the lower clamping rod is arranged;
引导槽，其用于引导所述上夹杆于水平方向移动，其中：A guide groove is used to guide the upper clamping rod to move in a horizontal direction, wherein:
所述压台下移以使所述压框配合所述托台夹持芯片外侧引线靠近环氧树脂的一端，所述上插杆插入所述下夹杆以使所述上夹杆与所述下夹杆固定在一起、并夹持引线另一端，且所述下夹杆与所述托台分离。The press platform moves downward so that the press frame cooperates with the support platform to clamp the outer lead of the chip close to one end of the epoxy resin, and the upper insertion rod is inserted into the lower clamp rod to fix the upper clamp rod and the lower clamp rod together and clamp the other end of the lead, and the lower clamp rod is separated from the support platform.
作为优选，所述托台上设置有用于支撑所述下夹杆的支撑杆，所述上插杆插入所述下夹杆以使所述下夹杆与所述支撑杆解耦、所述支撑杆与所述托台解耦。Preferably, a support rod for supporting the lower clamp rod is provided on the support platform, and the upper insertion rod is inserted into the lower clamp rod to decouple the lower clamp rod from the support rod, and the support rod from the support platform.
作为优选，所述支撑杆上设置有用于将其固定于所述托台上的第二锁块以及用于锁止所述下夹杆的第一锁块，所述上插杆上活动设置有用于抵推所述第一锁块的三角块。Preferably, the support rod is provided with a second locking block for fixing it on the support platform and a first locking block for locking the lower clamping rod, and the upper insertion rod is movably provided with a triangular block for pushing the first locking block.
作为优选，所述托台上活动设置有用于给引线塑性的成型框，所述成型框上开设有与多个引线对应的限位槽。Preferably, a forming frame for plasticizing the leads is movably provided on the support platform, and limiting grooves corresponding to the plurality of leads are provided on the forming frame.
作为优选，所述托台上活动设置有第一齿条，所述压台下移以推动所述第一齿条下移并使所述成型框上移。Preferably, a first rack is movably provided on the support platform, and the press platform moves downward to push the first rack downward and move the forming frame upward.
作为优选，所述托台上活动设置有下插杆，所述下插杆插入所述下夹杆以使所述下夹杆与所述上夹杆分离。Preferably, a lower insert rod is movably provided on the support platform, and the lower insert rod is inserted into the lower clamp rod to separate the lower clamp rod from the upper clamp rod.
作为优选，所述成型框上移以使所述下插杆移动至预定位置，所述下插杆插入所述下夹杆时，所述下插杆与所述成型框分离并带动所述下夹杆回到对应支撑杆上。Preferably, the forming frame moves upward to move the lower insertion rod to a predetermined position, and when the lower insertion rod is inserted into the lower clamping rod, the lower insertion rod is separated from the forming frame and drives the lower clamping rod back to the corresponding support rod.
作为优选，所述第一锁块具体为一长方体和三棱柱的结合体，且三棱柱的侧面与长方体连接。Preferably, the first locking block is a combination of a cuboid and a triangular prism, and the side surface of the triangular prism is connected to the cuboid.
作为优选，所述托台上活动设置有用于牵引所述下插杆的牵引块，所述牵引块与所述成型框之间设置有拉绳，所述下插杆上活动设置有用于抵推所述牵引块的活动杆。Preferably, a traction block for pulling the lower insertion rod is movably provided on the support platform, a pull rope is provided between the traction block and the forming frame, and a movable rod for pushing the traction block is movably provided on the lower insertion rod.
一种半导体封装测试方法，其包括上述方案中的半导体封装测试装置，还包括以下步骤：A semiconductor packaging test method, comprising the semiconductor packaging test device in the above scheme, further comprising the following steps:
S1、在挤压工作完成后，压台与托台分离，观察芯片引脚与成型框的契合程度；S1. After the extrusion work is completed, the press table and the support table are separated, and the fit between the chip pins and the molding frame is observed;
S2、将芯片转移到检测台上，检测台检测芯片引脚底面的水平程度以及相邻两引脚间距；S2, transferring the chip to a testing platform, where the testing platform detects the level of the bottom surface of the chip pins and the distance between two adjacent pins;
S3、检测后，根据检测结果对芯片进行分拣。S3. After testing, the chips are sorted according to the test results.
在上述技术方案中，本发明提供的一种半导体封装测试装置，具备以下有益效果：在进行工作时，将芯片放置在托台上，芯片嵌入托台上的凹槽，芯片的引线抵靠在托台的顶部，芯片的引线嵌入下夹杆上的凹槽，压台下移，压台上的压框配合托台将引线靠近环氧树脂的一端夹持住，上夹杆上的上插杆插入下夹杆中，上夹杆与下夹杆配合将引线的另一端夹持住，上插杆将下夹杆与上夹杆固定在一起，同时下夹杆与托台分离，压台继续下移，压框相对压台移动，引线被折弯且拉伸，引线拉动上夹杆带动下夹杆沿着引导槽横向移动，将引线拉伸、折弯成预定状态，变成芯片的引脚，压框与托台顶部配合将引线靠近环氧树脂的一端夹持住，避免引线在延伸的过程中影响与之结合的环氧树脂，上夹杆与下夹杆配合夹住引线的另一端，能够更好地牵引引线，使芯片上的多根引线同步延展，且延伸后的引脚的底部处于同一水平面上。In the above technical scheme, a semiconductor packaging and testing device provided by the present invention has the following beneficial effects: when working, the chip is placed on the support table, the chip is embedded in the groove on the support table, the lead of the chip is against the top of the support table, the lead of the chip is embedded in the groove on the lower clamping rod, the press table moves downward, the pressing frame on the press table cooperates with the support table to clamp one end of the lead close to the epoxy resin, the upper insertion rod on the upper clamping rod is inserted into the lower clamping rod, the upper clamping rod cooperates with the lower clamping rod to clamp the other end of the lead, the upper insertion rod fixes the lower clamping rod and the upper clamping rod together, and the lower clamping rod and The support table is separated, the press table continues to move downward, the press frame moves relative to the press table, the lead is bent and stretched, the lead pulls the upper clamp rod to drive the lower clamp rod to move laterally along the guide groove, stretching and bending the lead into a predetermined state to become the pin of the chip, the press frame cooperates with the top of the support table to clamp the end of the lead close to the epoxy resin to prevent the lead from affecting the epoxy resin combined with it during the extension process, and the upper clamp rod and the lower clamp rod cooperate to clamp the other end of the lead, which can better pull the lead, so that multiple leads on the chip are extended synchronously, and the bottom of the extended pin is on the same horizontal plane.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明中记载的一些实施例，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.
图1为本发明实施例提供的总体结构示意图；FIG1 is a schematic diagram of the overall structure provided by an embodiment of the present invention;
图2为本发明实施例提供的压台的结构示意图；FIG2 is a schematic structural diagram of a press table provided in an embodiment of the present invention;
图3为本发明实施例提供的托台的结构示意图；FIG3 is a schematic diagram of the structure of a support platform provided in an embodiment of the present invention;
图4为本发明实施例提供的爆炸结构示意图；FIG4 is a schematic diagram of an explosion structure provided by an embodiment of the present invention;
图5为图4中A处放大图；FIG5 is an enlarged view of point A in FIG4;
图6为图4中B处放大图；FIG6 is an enlarged view of point B in FIG4;
图7为本发明实施例提供的托台内部的结构示意图；FIG7 is a schematic diagram of the structure inside the support platform provided in an embodiment of the present invention;
图8为图7中C处放大图；FIG8 is an enlarged view of point C in FIG7;
图9为本发明实施例提供的下插杆内部的结构示意图；FIG9 is a schematic diagram of the structure inside the lower insertion rod provided in an embodiment of the present invention;
图10为图9中D处放大图。FIG. 10 is an enlarged view of point D in FIG. 9 .
附图标记说明：Description of reference numerals:
1、托台；11、下夹杆；111、支撑杆；112、第一锁块；113、第二锁块；114、下插杆；115、活动杆；116、牵引块；117、拉绳；12、成型框；121、限位槽；122、第一齿条；123、第二齿条；124、齿轮；2、压台；21、上夹杆；211、三角块；212、榫块；213、上插杆；22、压框；23、引导槽；24、活动筒。1. Support platform; 11. Lower clamping rod; 111. Support rod; 112. First locking block; 113. Second locking block; 114. Lower plug rod; 115. Movable rod; 116. Pulling block; 117. Pull rope; 12. Forming frame; 121. Limiting groove; 122. First rack; 123. Second rack; 124. Gear; 2. Pressing platform; 21. Upper clamping rod; 211. Triangular block; 212. Tenon block; 213. Upper plug rod; 22. Pressing frame; 23. Guide groove; 24. Movable cylinder.
具体实施方式DETAILED DESCRIPTION
为了使本领域的技术人员更好地理解本发明的技术方案，下面将结合附图对本发明作进一步的详细介绍。In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.
实施例一Embodiment 1
如图1-10所示，一种半导体封装测试装置，包括：As shown in FIG. 1-10 , a semiconductor packaging test device includes:
托台1，其上设置有：The support platform 1 is provided with:
用于承托芯片的凹槽；A groove for holding a chip;
下夹杆11，其上设置有与引线端部适配的凹槽；A lower clamping rod 11, on which a groove adapted to the end of the lead wire is provided;
压台2，其上设置有：Pressing platform 2, on which are arranged:
压框22；Press frame 22;
上夹杆21，其上设置有用于固定下夹杆11的上插杆213；An upper clamping rod 21 on which an upper inserting rod 213 for fixing the lower clamping rod 11 is disposed;
引导槽23，其用于引导上夹杆21于水平方向移动，其中：The guide groove 23 is used to guide the upper clamping rod 21 to move in the horizontal direction, wherein:
压台2下移以使压框22配合托台1夹持芯片外侧引线靠近环氧树脂的一端，上插杆213插入下夹杆11以使上夹杆21与下夹杆11固定在一起、并夹持引线另一端，且下夹杆11与托台1分离。The press platform 2 moves downward so that the press frame 22 cooperates with the support platform 1 to clamp the end of the outer lead of the chip close to the epoxy resin, and the upper insertion rod 213 is inserted into the lower clamping rod 11 to fix the upper clamping rod 21 and the lower clamping rod 11 together and clamp the other end of the lead, and the lower clamping rod 11 is separated from the support platform 1.
具体的，上夹杆21上设置有与引导槽23适配的榫块212，引导槽23的内部设置有用于推动榫块212复位的弹簧，压框22滑动安装于压台2上且与压台2之间设置有弹簧，托台1上用于承托芯片的凹槽的深度大于芯片厚度的一半，当芯片放置在托台1上的凹槽中时，芯片外侧的引线靠近环氧树脂的一端会抵靠在托台1的顶部。Specifically, the upper clamping rod 21 is provided with a tenon block 212 adapted to the guide groove 23, and the guide groove 23 is provided inside with a spring for pushing the tenon block 212 to return to its original position. The pressing frame 22 is slidably installed on the pressing platform 2 and a spring is provided between the pressing platform 2. The depth of the groove on the support platform 1 for supporting the chip is greater than half the thickness of the chip. When the chip is placed in the groove on the support platform 1, the end of the lead on the outside of the chip close to the epoxy resin will rest against the top of the support platform 1.
进一步的，在进行工作时，将芯片放置在托台1上，芯片嵌入托台1上的凹槽，芯片的引线抵靠在托台1的顶部，芯片的引线嵌入下夹杆11上的凹槽，压台2下移，压台2上的压框22配合托台1将芯片外侧引线靠近环氧树脂的一端夹持住，上夹杆21上的上插杆213插入下夹杆11中，上夹杆21与下夹杆11配合将引线的另一端夹持住，上插杆213将下夹杆11与上夹杆21固定在一起，同时下夹杆11与托台1分离，压台2继续下移，压框22相对压台2移动，引线被折弯且拉伸，引线拉动上夹杆21带动下夹杆11沿着引导槽23横向移动，引线被拉伸、折弯成预定状态，变成芯片的引脚，压框22与托台1顶部配合将引线靠近环氧树脂的一端夹持住，避免引线在延伸的过程中影响与之结合的环氧树脂，上夹杆21与下夹杆11配合夹住引线的另一端，能够更好地牵引引线，使芯片上的多根引线同步延展，且延伸后的引脚的底部处于同一水平面上。Furthermore, when working, the chip is placed on the pallet 1, the chip is embedded in the groove on the pallet 1, the lead of the chip is against the top of the pallet 1, the lead of the chip is embedded in the groove on the lower clamping rod 11, the press table 2 moves down, the press frame 22 on the press table 2 cooperates with the pallet 1 to clamp the end of the outer lead of the chip close to the epoxy resin, the upper insertion rod 213 on the upper clamping rod 21 is inserted into the lower clamping rod 11, the upper clamping rod 21 cooperates with the lower clamping rod 11 to clamp the other end of the lead, the upper insertion rod 213 fixes the lower clamping rod 11 and the upper clamping rod 21 together, and at the same time the lower clamping rod 11 is separated from the pallet 1, and the press table is pressed. 2 continues to move downward, the pressing frame 22 moves relative to the pressing platform 2, the lead is bent and stretched, the lead pulls the upper clamping rod 21 to drive the lower clamping rod 11 to move horizontally along the guide groove 23, the lead is stretched and bent into a predetermined state, and becomes the pin of the chip, the pressing frame 22 cooperates with the top of the support platform 1 to clamp one end of the lead close to the epoxy resin to prevent the lead from affecting the epoxy resin combined with it during the extension process, the upper clamping rod 21 and the lower clamping rod 11 cooperate to clamp the other end of the lead, which can better pull the lead, so that multiple leads on the chip are extended synchronously, and the bottoms of the extended pins are on the same horizontal plane.
再进一步的，上述实施例中的压台2可以是通过机械臂带着移动，也可以是电动伸缩杆，再可以是本领域技术人员根据公知技术常识能够获取的结构，压台2的移动属于公知技术常识，不赘述。Furthermore, the press table 2 in the above embodiment can be moved by a robotic arm, or an electric telescopic rod, or a structure that can be obtained by technical personnel in this field based on common technical knowledge. The movement of the press table 2 belongs to common technical knowledge and will not be elaborated.
上述技术方案中，压框22与托台1顶部配合将引线靠近环氧树脂的一端夹持住，避免引线在延伸的过程中影响与之结合的环氧树脂，上夹杆21与下夹杆11配合夹住引线的另一端，能够更好地牵引引线，使芯片上的多根引线同步延展，且延伸后的引脚的底部处于同一水平面上。In the above technical solution, the pressing frame 22 cooperates with the top of the support 1 to clamp one end of the lead close to the epoxy resin to prevent the lead from affecting the epoxy resin combined with it during the extension process. The upper clamping rod 21 and the lower clamping rod 11 cooperate to clamp the other end of the lead, which can better pull the lead and make the multiple leads on the chip extend synchronously, and the bottom of the extended pins are on the same horizontal plane.
作为本发明进一步提供的实施例，托台1上设置有用于支撑下夹杆11的支撑杆111，上插杆213插入下夹杆11以使下夹杆11与支撑杆111解耦、支撑杆111与托台1解耦。As a further embodiment of the present invention, a support rod 111 for supporting the lower clamping rod 11 is provided on the support platform 1, and the upper insertion rod 213 is inserted into the lower clamping rod 11 to decouple the lower clamping rod 11 from the support rod 111 and the support rod 111 from the support platform 1.
具体的，支撑杆111滑动安装于托台1上，支撑杆111与托台1之间设置有弹簧。Specifically, the support rod 111 is slidably mounted on the support platform 1 , and a spring is provided between the support rod 111 and the support platform 1 .
进一步的，在压台2下移的过程中，上夹杆21上的上插杆213插入下夹杆11，上夹杆21与下夹杆11配合将芯片外侧引线远离环氧树脂的一端夹持住，上插杆213将下夹杆11与上夹杆21固定在一起，此过程中，支撑杆111固定在托台1上，支撑杆111能够给下夹杆11提供充足的支撑力，使上夹杆21与下夹杆11紧密贴合，将引线的端部夹持住，接着下夹杆11与支撑杆111解耦，下夹杆11可随上夹杆21相对支撑杆111移动，支撑杆111与托台1解耦，支撑杆111可以相对托台1移动，给压台2留出充足的移动空间。Furthermore, during the downward movement of the press platform 2, the upper insertion rod 213 on the upper clamp rod 21 is inserted into the lower clamp rod 11, and the upper clamp rod 21 cooperates with the lower clamp rod 11 to clamp the end of the outer lead of the chip away from the epoxy resin, and the upper insertion rod 213 fixes the lower clamp rod 11 and the upper clamp rod 21 together. During this process, the support rod 111 is fixed on the support platform 1, and the support rod 111 can provide sufficient supporting force to the lower clamp rod 11, so that the upper clamp rod 21 and the lower clamp rod 11 fit tightly and clamp the end of the lead. Then the lower clamp rod 11 is decoupled from the support rod 111, and the lower clamp rod 11 can move relative to the support rod 111 with the upper clamp rod 21. The support rod 111 is decoupled from the support platform 1, and the support rod 111 can move relative to the support platform 1, leaving sufficient moving space for the press platform 2.
作为本发明进一步提供的再一个实施例，支撑杆111上设置有用于将其固定于托台1上的第二锁块113以及用于锁止下夹杆11的第一锁块112，上插杆213上活动设置有用于抵推第一锁块112的三角块211。As another embodiment further provided by the present invention, the support rod 111 is provided with a second locking block 113 for fixing it on the support platform 1 and a first locking block 112 for locking the lower clamping rod 11, and the upper insertion rod 213 is movably provided with a triangular block 211 for pushing the first locking block 112.
具体的，第一锁块112与第二锁块113之间设置有连接杆，连接杆与支撑杆111之间设置有弹簧，三角块211与上插杆213之间设置有弹簧，下夹杆11上开设有与上插杆213适配的竖直通孔，下夹杆11上开设有与竖直通孔相连通且与第一锁块112适配的水平通孔，托台1上开设有与第二锁块113适配的凹槽。Specifically, a connecting rod is arranged between the first locking block 112 and the second locking block 113, a spring is arranged between the connecting rod and the supporting rod 111, a spring is arranged between the triangular block 211 and the upper insertion rod 213, a vertical through hole adapted to the upper insertion rod 213 is provided on the lower clamping rod 11, a horizontal through hole connected with the vertical through hole and adapted to the first locking block 112 is provided on the lower clamping rod 11, and a groove adapted to the second locking block 113 is provided on the support platform 1.
进一步的，在上插杆213插入下夹杆11的过程中，三角块211抵靠在下夹杆11上并被抵推，三角块211缩到上插杆213中，直至三角块211的尖端正对下夹杆11上的水平通孔，三角块211被弹簧抵推逐渐插入水平通孔，推动原本位于水平通孔中的第一锁块112，第一锁块112通过连接杆带动第二锁块113，使第二锁块113缩到支撑杆111内部，支撑杆111解锁，三角块211上方的斜面抵靠在下夹杆11的水平通孔的顶部，三角块211施加给下夹杆11一个向上的力，能够让下夹杆11与上夹杆21之间的连接更加紧密。Furthermore, in the process of inserting the upper insertion rod 213 into the lower clamping rod 11, the triangular block 211 abuts against the lower clamping rod 11 and is pushed, and the triangular block 211 shrinks into the upper insertion rod 213 until the tip of the triangular block 211 is opposite to the horizontal through hole on the lower clamping rod 11. The triangular block 211 is gradually inserted into the horizontal through hole by the spring, pushing the first locking block 112 originally located in the horizontal through hole. The first locking block 112 drives the second locking block 113 through the connecting rod, so that the second locking block 113 shrinks into the support rod 111, and the support rod 111 is unlocked. The inclined surface above the triangular block 211 abuts against the top of the horizontal through hole of the lower clamping rod 11, and the triangular block 21 applies an upward force to the lower clamping rod 11, which can make the connection between the lower clamping rod 11 and the upper clamping rod 21 tighter.
作为本发明进一步提供的又一个实施例，托台1上活动设置有用于给引线塑性的成型框12，成型框12上开设有与多个引线对应的限位槽121。As another embodiment further provided by the present invention, a forming frame 12 for plasticizing the leads is movably disposed on the support platform 1 , and limiting grooves 121 corresponding to the plurality of leads are formed on the forming frame 12 .
具体的，在压台2下移的过程中，上夹杆21与下夹杆11配合牵引引线，使引线弯曲、延展，弯曲的引线逐渐嵌入成型框12上的限位槽121中，限位槽121划定相邻两根引线之间的距离，使多个引线弯成的多个引脚之间的间距大致相同。Specifically, during the downward movement of the pressing platform 2, the upper clamping rod 21 cooperates with the lower clamping rod 11 to pull the lead, so that the lead is bent and extended, and the bent lead is gradually embedded in the limiting groove 121 on the molding frame 12. The limiting groove 121 defines the distance between two adjacent leads, so that the spacing between the multiple pins formed by bending the multiple leads is roughly the same.
作为本发明进一步提供的又一个实施例，托台1上活动设置有第一齿条122，压台2下移以推动第一齿条122下移并使成型框12上移。As another embodiment further provided by the present invention, a first rack 122 is movably provided on the support platform 1, and the press platform 2 moves downward to push the first rack 122 downward and move the forming frame 12 upward.
具体的，成型框12与托台1之间设置有弹簧，成型框12上设置有第二齿条123，托台1的内部转动设置有分别与第一齿条122、第二齿条123啮合的齿轮124。Specifically, a spring is provided between the forming frame 12 and the support platform 1 , a second rack 123 is provided on the forming frame 12 , and a gear 124 meshing with the first rack 122 and the second rack 123 is rotatably provided inside the support platform 1 .
进一步的，在压台2下移的过程中，上夹杆21与下夹杆11配合牵引引线，使引线弯曲较大角度，压台2继续下移并压迫第一齿条122，第一齿条122推动与之相啮合的齿轮124，齿轮124通过与之相啮合的第二齿条123推动成型框12上移，弯曲的引线嵌入成型框12上的限位槽121中，成型框12继续上移，推动引线弯曲角度较大的部分，使引线与成型框12契合；若成型框12是固定的，将引线直接压入成型框12，引线在与成型框12分离后容易回弹，导致引线不能弯曲成预定角度。Furthermore, during the downward movement of the pressing platform 2, the upper clamping rod 21 cooperates with the lower clamping rod 11 to pull the lead, so that the lead is bent at a larger angle. The pressing platform 2 continues to move downward and presses the first rack 122. The first rack 122 pushes the gear 124 meshing with it. The gear 124 pushes the molding frame 12 upward through the second rack 123 meshing with it. The bent lead is embedded in the limiting groove 121 on the molding frame 12. The molding frame 12 continues to move upward, pushing the part of the lead with a larger bending angle to make the lead fit with the molding frame 12; if the molding frame 12 is fixed, the lead is directly pressed into the molding frame 12, and the lead is easy to rebound after being separated from the molding frame 12, resulting in the lead being unable to be bent into a predetermined angle.
作为本发明进一步提供的又一个实施例，托台1上活动设置有下插杆114，下插杆114插入下夹杆11以使下夹杆11与上夹杆21分离。As another embodiment further provided by the present invention, a lower inserting rod 114 is movably provided on the support platform 1 , and the lower inserting rod 114 is inserted into the lower clamping rod 11 to separate the lower clamping rod 11 from the upper clamping rod 21 .
具体的，上插杆213滑动安装于上夹杆21上，上插杆213与上夹杆21之间设置有弹簧。Specifically, the upper insertion rod 213 is slidably mounted on the upper clamping rod 21 , and a spring is provided between the upper insertion rod 213 and the upper clamping rod 21 .
进一步的，在压台2下移、成型框12上移的过程中，成型框12推动下夹杆11，使下夹杆11配合上夹杆21带动引线远离环氧树脂的一端向远离环氧树脂的方向移动，引线被拉伸并嵌入限位槽121，且下夹杆11上的竖直通孔正对下插杆114，压台2继续下移，下插杆114插入下夹杆11并推动上插杆213，使上插杆213回到上夹杆21中并与下插杆114分离，上插杆213与下插杆114分离。Furthermore, in the process of the pressing table 2 moving downward and the forming frame 12 moving upward, the forming frame 12 pushes the lower clamping rod 11, so that the lower clamping rod 11 cooperates with the upper clamping rod 21 to drive the end of the lead away from the epoxy resin to move in the direction away from the epoxy resin, the lead is stretched and embedded in the limiting groove 121, and the vertical through hole on the lower clamping rod 11 is opposite to the lower insertion rod 114, the pressing table 2 continues to move downward, the lower insertion rod 114 is inserted into the lower clamping rod 11 and pushes the upper insertion rod 213, so that the upper insertion rod 213 returns to the upper clamping rod 21 and is separated from the lower insertion rod 114, and the upper insertion rod 213 is separated from the lower insertion rod 114.
作为本发明进一步提供的又一个实施例，成型框12上移以使下插杆114移动至预定位置，下插杆114插入下夹杆11时，下插杆114与成型框12分离并带动下夹杆11回到对应支撑杆111上。As another embodiment further provided by the present invention, the molding frame 12 moves upward to move the lower insertion rod 114 to a predetermined position. When the lower insertion rod 114 is inserted into the lower clamping rod 11, the lower insertion rod 114 separates from the molding frame 12 and drives the lower clamping rod 11 back to the corresponding support rod 111.
具体的，下插杆114与托台1之间设置有弹簧。Specifically, a spring is provided between the lower insertion rod 114 and the support platform 1 .
进一步的，在成型框12移动的过程中，成型框12带动下插杆114移动，并拉伸插杆与托台1之间的弹簧，当下插杆114移动到预定位置时，成型框12推动下夹杆11，下夹杆11上的竖直通孔正对下插杆114，压台2继续下移，下插杆114插入下夹杆11，下夹杆11与上夹杆21分离，下插杆114也与成型框12解耦，弹簧拉动下插杆114移动，下插杆114带动下夹杆11移动，下夹杆11与对应的支撑杆111耦合。Furthermore, during the movement of the forming frame 12, the forming frame 12 drives the lower insertion rod 114 to move and stretches the spring between the insertion rod and the support platform 1. When the lower insertion rod 114 moves to the predetermined position, the forming frame 12 pushes the lower clamping rod 11. The vertical through hole on the lower clamping rod 11 is opposite to the lower insertion rod 114. The pressing table 2 continues to move downward, and the lower insertion rod 114 is inserted into the lower clamping rod 11. The lower clamping rod 11 is separated from the upper clamping rod 21, and the lower insertion rod 114 is also decoupled from the forming frame 12. The spring pulls the lower insertion rod 114 to move, and the lower insertion rod 114 drives the lower clamping rod 11 to move, and the lower clamping rod 11 is coupled with the corresponding support rod 111.
作为本发明进一步提供的又一个实施例，第一锁块112具体为一长方体和三棱柱的结合体，且三棱柱的侧面与长方体连接。As another embodiment further provided by the present invention, the first locking block 112 is specifically a combination of a rectangular parallelepiped and a triangular prism, and the side surface of the triangular prism is connected to the rectangular parallelepiped.
具体的，第一锁块112的顶部为平面（如图6所示）。Specifically, the top of the first locking block 112 is a plane (as shown in FIG. 6 ).
进一步的，在上夹杆21与下夹杆11通过上插杆213连接在一起的过程中，上插杆213上的三角块211推动第一锁块112移动，第一锁块112的长方体部分离开下夹杆11，只有部分三棱柱部位于下夹杆11内部，压台2下移的过程中，引线牵引上夹杆21和下夹杆11向托台1中心处移动，下夹杆11沿着三棱柱部的斜面移动，推动第一锁块112缩到支撑杆111中；在下插杆114带动下夹杆11移动的过程中，支撑杆111上的第二锁块113被托台1抵推，第一锁块112只有部分三棱柱部位置支撑杆111外侧，下夹杆11沿着三棱柱部的斜面移动，推动第一锁块112，使第一锁块112缩到支撑杆111中，当第一锁块112正对下夹杆11上的水平通孔时，第一锁块112插入下夹杆11，下夹杆11与支撑杆111耦合。Furthermore, in the process of connecting the upper clamping rod 21 and the lower clamping rod 11 together through the upper insertion rod 213, the triangular block 211 on the upper insertion rod 213 pushes the first locking block 112 to move, and the rectangular part of the first locking block 112 leaves the lower clamping rod 11, and only part of the triangular prism part is located inside the lower clamping rod 11. In the process of the pressing table 2 moving downward, the lead wire pulls the upper clamping rod 21 and the lower clamping rod 11 to move toward the center of the support platform 1, and the lower clamping rod 11 moves along the inclined surface of the triangular prism part, pushing the first locking block 112 to retract to the support rod 111 In the process of the lower insert rod 114 driving the lower clamp rod 11 to move, the second locking block 113 on the support rod 111 is pushed by the support platform 1, and only part of the triangular prism portion of the first locking block 112 is located outside the support rod 111, and the lower clamp rod 11 moves along the inclined surface of the triangular prism portion, pushing the first locking block 112, so that the first locking block 112 is retracted into the support rod 111, and when the first locking block 112 is facing the horizontal through hole on the lower clamp rod 11, the first locking block 112 is inserted into the lower clamp rod 11, and the lower clamp rod 11 is coupled with the support rod 111.
作为本发明进一步提供的又一个实施例，托台1上活动设置有用于牵引下插杆114的牵引块116，牵引块116与成型框12之间设置有拉绳117，下插杆114上活动设置有用于抵推牵引块116的活动杆115。As another embodiment further provided by the present invention, a traction block 116 for pulling the lower insertion rod 114 is movably provided on the support platform 1, a pull rope 117 is provided between the traction block 116 and the forming frame 12, and a movable rod 115 for pushing the traction block 116 is movably provided on the lower insertion rod 114.
具体的，压台2上滑动设置有活动筒24，活动筒24与压台2之间设置有弹簧，牵引块116与托台1之间设置有弹簧，牵引块116上设置有斜坡（如图10所示），牵引块116具体为伸缩杆，拉绳117具有一定弹性。Specifically, a movable cylinder 24 is slidably provided on the press platform 2, a spring is provided between the movable cylinder 24 and the press platform 2, a spring is provided between the traction block 116 and the support platform 1, a slope is provided on the traction block 116 (as shown in Figure 10), the traction block 116 is specifically a telescopic rod, and the pull rope 117 has a certain elasticity.
进一步的，在进行工作时，将芯片放置在托台1上，芯片嵌入托台1上的凹槽，芯片的引线抵靠在托台1的顶部，芯片的引线嵌入下夹杆11上的凹槽，压台2下移，压台2上的压框22配合托台1将引线靠近环氧树脂的一端夹持住，上夹杆21上的上插杆213插入下夹杆11中，上夹杆21向下夹杆11上的引线靠近，此时第二锁块113将支撑杆111固定在托台1上，支撑杆111能够给下夹杆11提供充足的支撑力，使上夹杆21与下夹杆11紧密贴合，将引线的端部夹持住，在上插杆213下移的过程中，三角块211抵靠在下夹杆11上并被抵推，三角块211缩到上插杆213中，直至三角块211的尖端正对下夹杆11上的水平通孔，三角块211被弹簧抵推逐渐插入水平通孔，推动原本位于水平通孔中的第一锁块112，第一锁块112的长方体部缩到支撑杆111中，只有部分三棱锥部位于水平通孔中，且第一锁块112通过连接杆带动第二锁块113，使第二锁块113缩到支撑杆111内部，支撑杆111解锁，三角块211上方的斜面抵靠在下夹杆11的水平通孔的顶部，三角块211施加给下夹杆11一个向上的力，能够让下夹杆11与上夹杆21之间的连接更加紧密。Furthermore, when working, the chip is placed on the support platform 1, the chip is embedded in the groove on the support platform 1, the lead of the chip is against the top of the support platform 1, the lead of the chip is embedded in the groove on the lower clamping rod 11, the press platform 2 moves down, and the press frame 22 on the press platform 2 cooperates with the support platform 1 to clamp one end of the lead close to the epoxy resin, the upper insertion rod 213 on the upper clamping rod 21 is inserted into the lower clamping rod 11, and the upper clamping rod 21 approaches the lead on the lower clamping rod 11. At this time, the second locking block 113 fixes the support rod 111 on the support platform 1, and the support rod 111 can provide sufficient supporting force for the lower clamping rod 11, so that the upper clamping rod 21 and the lower clamping rod 11 fit tightly to clamp the end of the lead. In the process of the upper insertion rod 213 moving down, the triangular block 211 rests on the lower clamping rod 11 and The triangular block 211 is pushed and retracted into the upper insertion rod 213 until the tip of the triangular block 211 is opposite to the horizontal through hole on the lower clamping rod 11. The triangular block 211 is pushed and gradually inserted into the horizontal through hole by the spring, pushing the first locking block 112 originally located in the horizontal through hole. The rectangular body of the first locking block 112 is retracted into the support rod 111, and only part of the triangular pyramid part is located in the horizontal through hole. The first locking block 112 drives the second locking block 113 through the connecting rod, so that the second locking block 113 is retracted into the support rod 111, and the support rod 111 is unlocked. The inclined surface above the triangular block 211 is against the top of the horizontal through hole of the lower clamping rod 11. The triangular block 211 applies an upward force to the lower clamping rod 11, which can make the connection between the lower clamping rod 11 and the upper clamping rod 21 tighter.
压台2继续下移，带动上夹杆21和下夹杆11移动，引线被弯曲，并施加给上夹杆21和下夹杆11一个朝向托台1中心的力，拉动下夹杆11向托台1中心处移动，上夹杆21上的榫块212沿着引导槽23移动，下夹杆11沿着三棱柱部的斜面移动，推动第一锁块112缩到支撑杆111中。The press table 2 continues to move downward, driving the upper clamping rod 21 and the lower clamping rod 11 to move, the lead wire is bent, and a force toward the center of the support platform 1 is applied to the upper clamping rod 21 and the lower clamping rod 11, pulling the lower clamping rod 11 to move toward the center of the support platform 1, and the tenon block 212 on the upper clamping rod 21 moves along the guide groove 23, and the lower clamping rod 11 moves along the inclined surface of the triangular prism part, pushing the first locking block 112 to retract into the support rod 111.
压台2继续下移，压迫支撑杆111向托台1内部移动，引线牵引上夹杆21和下夹杆11移动，使引线弯曲较大角度，压台2继续下移并压迫第一齿条122，第一齿条122推动与之相啮合的齿轮124，齿轮124通过与之相啮合的第二齿条123推动成型框12上移，弯曲的引线嵌入成型框12上的限位槽121中，成型框12继续上移，推动弯曲角度较大的引线，使引线与成型框12契合；若成型框12是固定的，将引线直接压入成型框12，引线在与成型框12分离后容易回弹，导致引线不能弯曲成预定角度。The pressing platform 2 continues to move downward, pressing the support rod 111 to move toward the inside of the support platform 1, and the lead pulls the upper clamping rod 21 and the lower clamping rod 11 to move, so that the lead is bent at a larger angle, and the pressing platform 2 continues to move downward and presses the first rack 122, and the first rack 122 pushes the gear 124 meshing with it, and the gear 124 pushes the molding frame 12 upward through the second rack 123 meshing with it, and the bent lead is embedded in the limiting groove 121 on the molding frame 12, and the molding frame 12 continues to move upward, pushing the lead with a larger bending angle to make the lead fit with the molding frame 12; if the molding frame 12 is fixed, the lead is directly pressed into the molding frame 12, and the lead is easy to rebound after being separated from the molding frame 12, resulting in the lead cannot be bent to a predetermined angle.
在成型框12上移的过程中，成型框12通过拉绳117拉动牵引块116，牵引块116带动下插块移动，牵引块116与托台1之间的弹簧、下插块与托台1之间的弹簧均拉伸，当下插杆114移动到预定位置时，成型框12推动下夹杆11，下夹杆11上的竖直通孔正对下插杆114，压台2继续下移，下插杆114插入下夹杆11，下插杆114顶部插入下夹杆11并抵推上插杆213，上插杆213压迫活动杆115，活动杆115挤压牵引块116，使牵引块116收缩，牵引块116与下插杆114分离，压台2继续下移，成型框12移动到最高点，引线也嵌入限位槽121，引线被弯成合适形状，同时下插杆114抵推上插杆213，使上插杆213缩到上夹杆21内部，三角块211也缩到上插杆213内部，下夹杆11与上夹杆21分离，弹簧拉动下插杆114移动，此时支撑杆111上的第二锁块113被托台1抵推，第一锁块112只有部分三棱柱部位置支撑杆111外侧，压台2上的活动筒24抵推支撑杆111，使支撑杆111上的第一锁块112与下夹杆11上的水平通孔处于同一水平面上，下夹杆11沿着三棱柱部的斜面移动，推动第一锁块112，使第一锁块112缩到支撑杆111中，当第一锁块112正对下夹杆11上的水平通孔时，第一锁块112插入下夹杆11，下插杆114与支撑杆111耦合。The traction block 116 is pulled by the pull rope 117 to move the lower plug block 116. The springs between the traction block 116 and the support platform 1 and the springs between the lower plug block 116 and the support platform 1 are stretched. When the lower plug rod 114 moves to the predetermined position, the molding frame 12 pushes the lower clamping rod 11. The vertical through hole on the lower clamping rod 11 is directly opposite to the lower plug rod 114. The pressing table 2 continues to move downward, and the lower plug rod 114 is inserted into the lower clamping rod 11. The top of the lower plug rod 114 is inserted into the lower clamping rod 11 and pushes the upper plug rod 213. The upper plug rod 213 presses the movable rod 115. The movable rod 115 squeezes the traction block 116 to shrink the traction block 116. The traction block 116 is separated from the lower plug rod 114, and the pressing table 2 continues to move downward. The molding frame 12 moves to the highest point. The lead wire is also embedded in the limiting groove 121, and the lead wire is bent into a suitable shape. When the first locking block 112 is opposite to the horizontal through hole on the lower clamping rod 11, the first locking block 112 is inserted into the lower clamping rod 11, and the lower insertion rod 114 is coupled with the support rod 111.
接着压台2上移，弹簧推动榫块212移动，使上夹杆21复位，支撑杆111在弹簧的推动下带着下夹杆11上移，成型框12也在弹簧的牵引下下移，拉绳117放松，牵引块116在弹簧的作用下向下插块靠近，在牵引块116靠近下插块时，牵引块116顶部的斜坡抵靠在下插块上，牵引块116收缩，直至牵引块116正对下插块上的通孔，牵引块116伸展并插入下插块，牵引块116与下插块连接。Then the press table 2 moves up, and the spring pushes the tenon block 212 to move, so that the upper clamping rod 21 is reset, and the support rod 111 moves up with the lower clamping rod 11 under the push of the spring, and the forming frame 12 also moves down under the traction of the spring, and the pull rope 117 is relaxed. The traction block 116 approaches the lower plug block under the action of the spring. When the traction block 116 approaches the lower plug block, the slope of the top of the traction block 116 abuts against the lower plug block, and the traction block 116 contracts until the traction block 116 is opposite to the through hole on the lower plug block, and the traction block 116 stretches and inserts into the lower plug block, and the traction block 116 is connected to the lower plug block.
压框22与托台1顶部配合将芯片外侧引线靠近环氧树脂的一端夹持住，避免引线在延伸的过程中影响与之结合的环氧树脂，上夹杆21与下夹杆11配合夹住引线的另一端，能够更好地牵引引线，使芯片上的多根引线同步延展，且延伸后的引脚的底部处于同一水平面上，且上夹杆21与下夹杆11配合，先将引线弯曲较大角度，再由成型框12上移进一步塑性，能够让引线的塑性更稳定。The pressing frame 22 cooperates with the top of the support 1 to clamp the end of the outer lead of the chip close to the epoxy resin to prevent the lead from affecting the epoxy resin combined with it during the extension process. The upper clamping rod 21 cooperates with the lower clamping rod 11 to clamp the other end of the lead, which can better pull the lead and make the multiple leads on the chip extend synchronously. The bottom of the extended pins are on the same horizontal plane. The upper clamping rod 21 cooperates with the lower clamping rod 11 to first bend the lead at a larger angle, and then move up the molding frame 12 for further plasticization, which can make the plasticity of the lead more stable.
实施例二Embodiment 2
一种半导体封装测试方法，其基于实施例一中的半导体封装测试装置，还包括以下步骤：A semiconductor package testing method, based on the semiconductor package testing device in the first embodiment, further comprising the following steps:
S1、在挤压工作完成后，压台2与托台1分离，观察芯片引脚与成型框12的契合程度；S1. After the extrusion work is completed, the pressing table 2 is separated from the supporting table 1, and the fit between the chip pins and the molding frame 12 is observed;
S2、将芯片转移到检测台上，检测台检测芯片引脚底面的水平程度以及相邻两引脚间距；S2, transferring the chip to a testing platform, where the testing platform detects the level of the bottom surface of the chip pins and the distance between two adjacent pins;
S3、检测后，根据检测结果对芯片进行分拣。S3. After testing, the chips are sorted according to the test results.
以上只通过说明的方式描述了本发明的某些示范性实施例，毋庸置疑，对于本领域的普通技术人员，在不偏离本发明的精神和范围的情况下，可以用各种不同的方式对所描述的实施例进行修正。因此，上述附图和描述在本质上是说明性的，不应理解为对本发明权利要求保护范围的限制。The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that, for those skilled in the art, the described embodiments can be modified in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410938330.9A CN118471867B (en) | 2024-07-13 | 2024-07-13 | Semiconductor package testing device and testing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410938330.9A CN118471867B (en) | 2024-07-13 | 2024-07-13 | Semiconductor package testing device and testing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118471867A CN118471867A (en) | 2024-08-09 |
| CN118471867B true CN118471867B (en) | 2024-09-24 |
Family
ID=92150242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410938330.9A Active CN118471867B (en) | 2024-07-13 | 2024-07-13 | Semiconductor package testing device and testing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118471867B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101122613A (en) * | 2006-08-09 | 2008-02-13 | 富士通株式会社 | Carrier Plates for Detectors |
| CN111201597A (en) * | 2017-10-09 | 2020-05-26 | 克利公司 | Rivetless lead fastening for semiconductor packages |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2503652B2 (en) * | 1989-04-28 | 1996-06-05 | 日本電気株式会社 | Semiconductor integrated circuit device and its inspection method |
| JP3281994B2 (en) * | 1993-06-10 | 2002-05-13 | 日本テキサス・インスツルメンツ株式会社 | Resin-sealed semiconductor device |
| JPH0786487A (en) * | 1993-09-20 | 1995-03-31 | Toshiba Corp | Semiconductor device and manufacturing method thereof |
| JPH0936296A (en) * | 1995-07-14 | 1997-02-07 | Texas Instr Japan Ltd | Semiconductor device |
| US5939775A (en) * | 1996-11-05 | 1999-08-17 | Gcb Technologies, Llc | Leadframe structure and process for packaging intergrated circuits |
| JPH10163231A (en) * | 1996-12-04 | 1998-06-19 | Toshiba Corp | Semiconductor package manufacturing method |
| EP0963605A4 (en) * | 1996-12-19 | 2001-02-07 | Gcb Technologies Llc | Improved leadframe structure with locked inner leads and process for manufacturing same |
| KR100254266B1 (en) * | 1997-03-05 | 2000-05-01 | 유무성 | Lead frame and Method for manufactuing the same |
| US6307755B1 (en) * | 1999-05-27 | 2001-10-23 | Richard K. Williams | Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die |
| MY133357A (en) * | 1999-06-30 | 2007-11-30 | Hitachi Ltd | A semiconductor device and a method of manufacturing the same |
| JP2001035984A (en) * | 1999-07-22 | 2001-02-09 | Nec Kansai Ltd | Lead-forming device |
| JP2001156232A (en) * | 1999-11-29 | 2001-06-08 | Hitachi Ltd | Method for manufacturing semiconductor device |
| JP4637380B2 (en) * | 2001-02-08 | 2011-02-23 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
| US8236612B2 (en) * | 2002-04-29 | 2012-08-07 | Unisem (Mauritius) Holdings Limited | Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
| JP4111767B2 (en) * | 2002-07-26 | 2008-07-02 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor device and electrical property inspection method of small element |
| CN1301590C (en) * | 2002-10-23 | 2007-02-21 | 精工爱普生株式会社 | Piezoelectric oscillator and mobile phone and electronic equipment using piezoelectric oscillator |
| JP3740116B2 (en) * | 2002-11-11 | 2006-02-01 | 三菱電機株式会社 | Molded resin encapsulated power semiconductor device and manufacturing method thereof |
| JP2005032876A (en) * | 2003-07-09 | 2005-02-03 | Nichiden Seimitsu Kogyo Kk | Lead frame |
| JP2006108306A (en) * | 2004-10-04 | 2006-04-20 | Yamaha Corp | Lead frame and semiconductor package employing it |
| JP4779614B2 (en) * | 2005-12-08 | 2011-09-28 | ヤマハ株式会社 | Semiconductor device |
| JP6011277B2 (en) * | 2012-06-14 | 2016-10-19 | 株式会社デンソー | Manufacturing method of semiconductor device |
| CN212625539U (en) * | 2020-08-12 | 2021-02-26 | 郑州轻工业大学 | A package structure of an image processing chip |
-
2024
- 2024-07-13 CN CN202410938330.9A patent/CN118471867B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101122613A (en) * | 2006-08-09 | 2008-02-13 | 富士通株式会社 | Carrier Plates for Detectors |
| CN111201597A (en) * | 2017-10-09 | 2020-05-26 | 克利公司 | Rivetless lead fastening for semiconductor packages |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118471867A (en) | 2024-08-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN118471867B (en) | Semiconductor package testing device and testing method thereof | |
| CN107379381A (en) | Resin sealing apparatus and method of resin-sealing | |
| CN110212390B (en) | A kind of cable inserting plastic shell equipment | |
| KR100559797B1 (en) | Wire Bonding Method, Wire Bonding Apparatus and Computer-Readable Medium Recording Wire Bonding Program | |
| CN118738976A (en) | An intelligent wire harness crimping machine device | |
| CN118752219A (en) | A wiring socket assembly machine | |
| CN218866191U (en) | Optical fiber pickup device | |
| CN218180900U (en) | Chip pressing device | |
| CN1169208A (en) | Leadframes for Encapsulated Optics | |
| CN113458745B (en) | Sleeving device | |
| CN215496673U (en) | Chip jointing device with aligning and bonding assembly | |
| CN117283271B (en) | A lead frame precision chamfering equipment | |
| CN212944552U (en) | Clean anchor clamps of optical communication product | |
| CN221687979U (en) | Wiring device for electrical cabinet | |
| CN221226789U (en) | Automatic pressfitting piece of semiconductor connecting wire | |
| KR20080003601U (en) | Insert Insert Jig | |
| KR100940094B1 (en) | Semiconductor Package Molding Device | |
| KR101190483B1 (en) | Apparatus for clamping a wafer ring and apparatus for boding a die including the same | |
| CN119456425B (en) | Separation assembly after chip test | |
| CN221792387U (en) | An adjustable diode processing fixture | |
| CN117711997B (en) | A quartz boat device for solar cell diffusion | |
| CN221892495U (en) | Injection mold and injection equipment | |
| CN218194902U (en) | Splitting device for electrostatic chuck | |
| CN217597729U (en) | Injection molding demoulding device | |
| CN119253380B (en) | Connector assembly equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |