CN118732777B - A power routing power chip, control system and method - Google Patents
A power routing power chip, control system and method Download PDFInfo
- Publication number
- CN118732777B CN118732777B CN202411212141.XA CN202411212141A CN118732777B CN 118732777 B CN118732777 B CN 118732777B CN 202411212141 A CN202411212141 A CN 202411212141A CN 118732777 B CN118732777 B CN 118732777B
- Authority
- CN
- China
- Prior art keywords
- power
- chip
- resistor
- terminal
- routing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 30
- 239000003990 capacitor Substances 0.000 claims description 15
- 239000000919 ceramic Substances 0.000 claims description 12
- 230000009471 action Effects 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000033228 biological regulation Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 230000001105 regulatory effect Effects 0.000 description 7
- 239000011324 bead Substances 0.000 description 6
- 230000005611 electricity Effects 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003471 anti-radiation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009421 internal insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
- G05F1/00—Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
- G05F1/66—Regulating electric power
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/37—Converter circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Automation & Control Theory (AREA)
- Direct Current Feeding And Distribution (AREA)
Abstract
本申请属于半导体器件技术领域，公开一种电力路由功率芯片、控制系统及方法，使用时，把电力路由功率芯片设置在电器上，并令电力路由功率芯片的电源输入端与全屋低压的供电方案中的AC/DC电源的输出端连接，并通过电力路由功率芯片的电流输出端向电器的功能组件供电，只需要向电力路由功率芯片输入调节指令，即可调节电流输出端输出的电流，从而实现电器的独立功率调节，无需通过AC/DC电源对电器进行功率调节，使电器可以取消电源适配器，降低成本，且该电力路由功率芯片只需要更改MCU芯片中的控制程序，即可适配不同电器的功率调节需求，适用性强。
The present application belongs to the technical field of semiconductor devices, and discloses an electric power routing power chip, a control system and a method. When in use, the electric power routing power chip is set on an electrical appliance, and the power input terminal of the electric power routing power chip is connected to the output terminal of the AC/DC power supply in the whole-house low-voltage power supply scheme, and power is supplied to the functional components of the electrical appliance through the current output terminal of the electric power routing power chip. It is only necessary to input an adjustment instruction to the electric power routing power chip to adjust the current output by the current output terminal, thereby realizing independent power adjustment of the electrical appliance, and there is no need to adjust the power of the electrical appliance through the AC/DC power supply, so that the electrical appliance can cancel the power adapter and reduce the cost. Moreover, the electric power routing power chip only needs to change the control program in the MCU chip to adapt to the power adjustment requirements of different electrical appliances, and has strong applicability.
Description
Technical Field
The application relates to the technical field of semiconductor devices, in particular to an electric power routing power chip, a control system and a method.
Background
With the application of silicon carbide and gallium nitride power devices, the power supply technology is continuously developed towards the directions of small volume, high power and strong stability, and in recent years, a whole-house low-voltage power supply scheme is increasingly sought after. The low-voltage power supply scheme of the whole house refers to that before the commercial power enters the house at high voltage, all electrical interfaces of the whole house are in a direct-current low-voltage state by connecting a high-power AC/DC power supply. Thus, the safety performance of the whole house electricity utilization is greatly improved. At present, many household appliances are driven at low voltage through a power adapter, and under the power supply scheme of low voltage in a whole house, the household appliances do not need to acquire low voltage power through the power adapter, so that the power adapter can be omitted, and the cost is reduced.
In order to adapt to a low-voltage power supply scheme of a whole house, some electric appliances (such as an LED lamp) adopt a low-voltage control technology of driving and separating, a complete switching voltage circuit of the electric appliances comprises an AC/DC module and a DC/DC module, wherein the AC/DC module is an AC/DC power supply shared by the whole house, the DC/DC module is a part of the electric appliances, and after the AC/DC module converts high-voltage commercial power into direct current, the direct current is reduced by the DC/DC module to obtain low-voltage direct current. Since the power regulation and control cannot be realized by the general DC/DC module, if the power regulation and control are required to be performed on the electric appliances, the regulation and control can be performed only at the AC/DC module, but the regulation and control at the AC/DC module can affect the work of all the electric appliances at the same time, and the electric appliances are not practical.
Disclosure of Invention
The application aims to provide an electric power routing power chip, a control system and a method, which can realize independent power regulation and control of electric appliances in a whole-house low-voltage power supply scheme and have strong applicability.
In a first aspect, the application provides an electric power routing power chip, which comprises a substrate, a plastic package body and a chip circuit arranged between the substrate and the plastic package body; the substrate is provided with a power input end, a grounding end, at least one I/O connecting end and a current output end;
The chip circuit comprises a DC/DC chip, an MCU chip and an MOS tube; the voltage input pin of the DC/DC chip is connected with the power input end, the grounding pin of the DC/DC chip is connected with the grounding end, and the voltage output pin of the DC/DC chip is connected with the voltage input end of the MCU chip; the drain electrode of the MOS tube is connected with the power input end, the source electrode of the MOS tube is connected with the current output end, and the grid electrode of the MOS tube is connected with the control signal output end of the MCU chip; at least one I/O interface of the MCU chip is connected with the I/O connection end, and at least one I/O interface is used for inputting an adjusting instruction to activate a control program preset in the MCU chip, so that the MCU chip adjusts the voltage output to the grid electrode of the MOS tube, and further adjusts the current output by the current output end.
When the power supply device is used, the power routing power chip can be arranged on an electric appliance, the power input end of the power routing power chip is connected with the output end of an AC/DC power supply in a whole-house low-voltage power supply scheme, the power is supplied to functional components of the electric appliance through the current output end of the power routing power chip, the current output by the current output end can be regulated only by inputting a regulating instruction into the power routing power chip, thus the independent power regulation of the electric appliance is realized, the power regulation of the electric appliance is not required through the AC/DC power supply, the electric appliance can cancel a power adapter, the cost is reduced, and the power routing power chip can adapt to the power regulation requirements of different electric appliances only by changing a control program in an MCU chip, and the power supply device has strong applicability.
Preferably, the grid electrode of the MOS tube is connected with the control signal output end of the MCU chip through a MOS driving chip, and the voltage input end of the MOS driving chip is connected with the voltage output pin of the DC/DC chip.
Under the condition that an MOS driving chip is not arranged, when the MOS tube is selected, only the MOS tube with smaller driving voltage can be selected, so that the voltage output by the MCU chip can directly drive the MOS tube to be completely opened; the constraint can be eliminated by additionally arranging the MOS driving chip, so that the type selection range of the MOS tube is enlarged, and the applicability is improved.
Preferably, the I/O connection terminals include two, two I/O interfaces of the MCU chip are respectively connected to the two I/O connection terminals, one of the I/O interfaces is used for inputting an adjustment instruction, and the other I/O interface is used for filling the control program into the MCU chip.
Preferably, the chip circuit further comprises an LC filter circuit for filtering the voltage output from the voltage output pin of the DC/DC chip.
Therefore, clutter interference in the circuit can be filtered through the LC filter circuit, so that the voltage output by the DC/DC chip is purer, and the stability and the load capacity of the power routing power chip are improved.
Preferably, the LC filter circuit includes a first resistor and a plurality of capacitors, a first end of the first resistor is connected to a voltage output pin of the DC/DC chip, a second end of the first resistor is connected to first ends of all the capacitors, and second ends of all the capacitors are connected to the ground terminal; and the voltage input end of the MCU chip is connected with the second end of the first resistor.
Preferably, the chip circuit further comprises a second resistor and a third resistor, wherein a first end of the second resistor is connected with a second end of the first resistor, a second end of the second resistor is connected with a first end of the third resistor and a feedback pin of the DC/DC chip, and a second end of the third resistor is connected with the ground terminal.
Optionally, a patterned circuit layer is disposed on the front surface of the substrate, and components of the chip circuit are connected to the patterned circuit layer.
Optionally, a DBC ceramic circuit board is disposed between the substrate and the plastic package body, and the chip circuit is disposed on the front surface of the DBC ceramic circuit board.
Preferably, the package form of the power routing power chip is a QFN package, and the power input terminal, the ground terminal, the I/O connection terminal and the current output terminal are all electrical contacts exposed from the back surface of the substrate.
In a second aspect, the present application provides a control method applied to an electric appliance including the foregoing electric power routing power chip, where the electric appliance further includes a control switch, one end of the control switch is connected to one of the I/O connection terminals of the electric power routing power chip, and is used to generate the adjustment command and input the adjustment command to the MCU chip;
the control method comprises the following steps:
After the starting, the MCU chip controls the current output end to output rated current, so that the electric appliance works at rated power;
And if the control switch executes the opening and closing actions, the MCU chip adjusts the current output by the current output end according to the continuous opening and closing times of the control switch in a preset time period, so that the power of the electric appliance is adjusted.
In a third aspect, the present application provides a control system comprising an AC/DC power supply and a plurality of appliances having power routing power chips as described hereinbefore, the power input of each of the power routing power chips of the appliances being connected to the output of the AC/DC power supply; the AC/DC power supply is configured to convert mains electricity into direct current to power each of the appliances.
Preferably, the control system further comprises a centralized control system, and the centralized control system is used for generating an adjustment instruction of each electric appliance so as to adjust the power of each electric appliance.
The beneficial effects are that: when the power routing power chip, the control system and the method are used, the power routing power chip is arranged on an electric appliance, the power input end of the power routing power chip is connected with the output end of an AC/DC power supply in a full-house low-voltage power supply scheme, the power is supplied to functional components of the electric appliance through the current output end of the power routing power chip, and the current output by the current output end can be regulated only by inputting a regulating command into the power routing power chip, so that independent power regulation of the electric appliance is realized, the power regulation of the electric appliance is not required through the AC/DC power supply, the electric appliance can cancel a power adapter, the cost is reduced, and the power routing power chip can adapt to the power regulation requirements of different electric appliances only by changing the control program in the MCU chip.
Drawings
Fig. 1 is a schematic diagram of a chip circuit of a power routing power chip according to an embodiment of the present application.
Fig. 2 is a schematic diagram of a structure of an electric power routing power chip according to an embodiment of the present application.
Fig. 3 is a connection structure diagram of a chip circuit and a substrate in the power routing chip of fig. 2.
Fig. 4 is a schematic diagram of another structure of an electric power routing power chip according to an embodiment of the present application.
Fig. 5 is a connection structure diagram of a chip circuit and a substrate in the power routing chip of fig. 4.
Fig. 6 is a circuit diagram of an electric appliance according to an embodiment of the present application.
Fig. 7 is a schematic structural diagram of a control system according to an embodiment of the present application.
Description of the reference numerals: 1. a substrate; 101. a power input; 102. a grounding end; 103. a current output terminal; 104. a first I/O connection; 105. a second I/O connection; 106. patterning the circuit layer; 2. a plastic package body; 3. a chip circuit; 301. a DC/DC chip; 302. an MCU chip; 303. a MOS tube; 304. a MOS driving chip; 305. an LC filter circuit; 306. a first resistor; 307. a capacitor; 308. a second resistor; 309. a third resistor; 4. DBC ceramic circuit board; 5. LED lamp beads; 6. a control switch; 100. an AC/DC power supply; 200. and (5) a centralized control system.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only to distinguish the description, and are not to be construed as indicating or implying relative importance.
Referring to fig. 1-5, an electric power routing power chip according to some embodiments of the present application includes a substrate 1, a plastic package 2, and a chip circuit 3 disposed between the substrate 1 and the plastic package 2; the substrate 1 is provided with a power input end 101, a grounding end 102, at least one I/O connection end and a current output end 103;
The chip circuit 3 comprises a DC/DC chip 301, an MCU chip 302 and a MOS tube 303; the voltage input pin of the DC/DC chip 301 is connected with the power input end 101, the grounding pin of the DC/DC chip 301 is connected with the grounding end 102, and the voltage output pin of the DC/DC chip 301 is connected with the voltage input end of the MCU chip 302 (used for providing driving voltage for the MCU chip 302); the drain electrode (i.e., the D electrode) of the MOS tube 303 is connected with the power input end 101, the source electrode (i.e., the S electrode) of the MOS tube 303 is connected with the current output end 103, and the gate electrode (i.e., the G electrode) of the MOS tube 303 is connected with the control signal output end of the MCU chip 302; at least one I/O interface of the MCU chip 302 is connected to the I/O connection terminal, and the at least one I/O interface is used for inputting an adjustment command to activate a control program preset in the MCU chip 302, so that the MCU chip 302 adjusts a voltage output to the gate of the MOS transistor 303, and further adjusts a current output by the current output terminal 103 (by adjusting a current flowing from the D pole to the S pole of the MOS transistor 303, the current output by the current output terminal 103 is adjusted).
When the power supply device is used, the power routing power chip can be arranged on an electric appliance, the power input end 101 of the power routing power chip is connected with the output end of the AC/DC power supply 100 in a whole-house low-voltage power supply scheme, power is supplied to functional components of the electric appliance through the current output end 103 of the power routing power chip, the current output by the current output end 103 can be adjusted only by inputting an adjusting instruction to the power routing power chip (the adjusting instruction is input into the MCU chip 302 through a corresponding I/O connecting end), and therefore independent power adjustment of the electric appliance is achieved, the power adjustment of the electric appliance is not needed through the AC/DC power supply 100 (so that the work of other electric appliances is not influenced), the electric appliance can cancel the power adapter, the cost is reduced, and the power routing power chip can adapt to the power adjustment requirements of different electric appliances only by changing the control program in the MCU chip 302.
In some embodiments, the gate of the MOS transistor 303 is directly connected to the control signal output of the MCU chip 302 (e.g., directly connected to the gate of the MOS transistor 303 and the control signal output of the MCU chip 302 by wire bonding, printed wires, etc.). When the structure is adopted, the voltage output by the MCU chip 302 needs to be ensured to directly drive the MOS tube 303 to be completely opened, and generally, the voltage range output by the MCU chip 302 is 3V-5V, so that the MOS tube 303 is required to be completely opened under the driving voltage of 3V-5V.
In other embodiments, as shown in fig. 1, the gate of the MOS transistor 303 is connected to the control signal output end of the MCU chip 302 through a MOS driving chip 304, and the voltage input end of the MOS driving chip 304 is connected to the voltage output pin of the DC/DC chip 301 (so that the driving voltage is input to the MOS driving chip 304 by the DC/DC chip 301). Specifically, the signal input end of the MOS driving chip 304 is connected to the control signal output end of the MCU chip 302, and the signal output end of the MOS driving chip 304 is connected to the gate of the MOS transistor 303. Under the condition that the MOS driving chip 304 is not arranged, when the MOS transistor 303 is selected, only the MOS transistor 303 with smaller driving voltage can be selected, so that the voltage output by the MCU chip 302 can directly drive the MOS transistor 303 to be completely opened, and the limitation of the type selection range is larger; the constraint can be eliminated by adding the MOS driving chip 304, so that the selection range of the MOS tube 303 is enlarged, the MOS tube 303 with better performance can be adapted, and the applicability is improved.
The number and the functions of the I/O connection terminals on the substrate 1 may be correspondingly set according to the number and the functions of the I/O interfaces of the MCU chip 302.
In some possible embodiments, the MCU chip 302 includes at least two I/O interfaces, wherein one I/O interface is used for inputting an adjustment command, and the other I/O interface is used for injecting a control program into the MCU chip 302, so that at least two I/O connection terminals on the substrate 1 are provided, where the two I/O connection terminals are respectively connected with the I/O interface used for inputting the adjustment command and the I/O interface used for injecting the control program into the MCU chip 302; specifically, the I/O connection terminals on the substrate 1 include a first I/O connection terminal 104 and a second I/O connection terminal 105, the first I/O connection terminal 104 is connected to an I/O interface for injecting a control program into the MCU chip 302, and the second I/O connection terminal 105 is connected to an I/O interface for inputting a regulation command.
By inputting an adjustment command to the second I/O connection terminal 105, a control program in the MCU chip 302 may be activated to implement power adjustment of an electrical appliance, and different control programs may be further poured into the MCU chip 302 through the first I/O connection terminal 104 according to actual needs to adapt to control requirements of different electrical appliances, so as to further improve applicability of the power routing power chip.
For example, in fig. 1, the I/O connection terminals include two (a first I/O connection terminal 104 and a second I/O connection terminal 105), and two I/O interfaces of the MCU chip 302 are respectively connected to the two I/O connection terminals, where one I/O interface is used for inputting an adjustment command, and the other I/O interface is used for filling a control program into the MCU chip 302.
The voltage input terminal of the MCU chip 302 and the voltage input terminal of the MOS drive chip 304 may be directly connected to the voltage output pin of the DC/DC chip 301 (for example, directly connected by a bonding wire, a printed wire, or the like). But more preferably, the chip circuit 3 further comprises an LC filter circuit 305 for filtering the voltage output by the voltage output pin of the DC/DC chip 301, see fig. 1. Therefore, clutter interference in the circuit can be filtered out through the LC filter circuit 305, so that the voltage output by the DC/DC chip 301 is purer, and the stability and the load capacity of the power routing power chip are improved.
Specifically, referring to fig. 1, the lc filter 305 includes a first resistor 306 and a plurality of capacitors 307, wherein a first end of the first resistor 306 is connected to the voltage output pin of the DC/DC chip 301, a second end of the first resistor 306 is connected to first ends of all the capacitors 307, and second ends of all the capacitors 307 are connected to the ground 102 (i.e., if one capacitor 307 is provided, the capacitors 307 and the first resistor 306 are connected in series between the voltage output pin of the DC/DC chip 301 and the ground 102; if a plurality of capacitors 307 are provided, all the capacitors 307 are connected in parallel between the second end of the first resistor 306 and the ground 102); the voltage input end of the MCU chip 302 is connected with the second end of the first resistor 306; if the MOS driver chip 304 is provided, the voltage input terminal of the MOS driver chip 304 is also connected to the second terminal of the first resistor 306.
Further, referring to fig. 1, the chip circuit 3 further includes a second resistor 308 and a third resistor 309, where a first end of the second resistor 308 is connected to a second end of the first resistor 306, a second end of the second resistor 308 is connected to a first end of the third resistor 309 and a feedback pin of the DC/DC chip 301, and a second end of the third resistor 309 is connected to the ground terminal 102. Therefore, the second resistor 308 and the third resistor 309 actually form a feedback circuit, the connection point between the second resistor 308 and the third resistor 309 is a feedback signal sampling point, the feedback signal sampling point is connected with a feedback pin of the DC/DC chip 301, so that the voltage/current information of the output end of the sampled DC/DC chip 301 is fed back to the DC/DC chip 301 to stabilize the output voltage, the sampling precision can be adjusted by adjusting the second resistor 308 and the third resistor 309, so that the output voltage precision of the DC/DC chip 301 is controlled, and the resistance values of the second resistor 308 and the third resistor 309 can be selected according to the required output voltage precision.
The chip circuit 3 may be directly disposed on the front surface of the substrate 1 (as shown in fig. 2), at this time, the front surface of the substrate 1 is provided with the patterned circuit layer 106 (including the printed wires between the bonding pads), and the components of the chip circuit 3 (the DC/DC chip 301, the MCU chip 302, the MOS transistor 303, the MOS driving chip 304, the first resistor 306, the capacitor 307, the second resistor 308, the third resistor 309, etc.) are connected to the patterned circuit layer 106 (as shown in fig. 3, fig. 3 is a top view). The structure is simple, the production process is simple, and the material and process costs are low. In the present application, the front surface means a surface close to the plastic package 2, and the back surface means a surface far from the plastic package 2.
In addition, the power routing power chip can also adopt a DBC internal insulation structure (as shown in fig. 4), specifically, a DBC ceramic circuit board 4 is arranged between the substrate 1 and the plastic package body 2, and the chip circuit 3 is arranged on the front surface of the DBC ceramic circuit board 4. All components of the chip circuit 3 may be disposed on the front surface of the DBC ceramic wiring board 4, or the MOS transistor 303 may be independently disposed outside the DBC ceramic wiring board 4 and directly mounted on the front surface of the substrate 1 (as shown in fig. 5, fig. 5 is a plan view). Adopt DBC ceramic circuit board 4 to keep apart between chip circuit 3 and the base plate 1, its advantage lies in: the ground capacitance is large, the anti-radiation interference capability is strong, and the power routing power chip is mainly used for low-voltage signal control, so that the reduction of interference is helpful for improving the control stability of the chip; in addition, the protection level is high, and the insulating capability is strong. The electric power routing power chip with the structure is particularly suitable for application scenes with high requirements on radiation resistance.
The package form of the power routing power chip may be selected according to actual needs, for example, but not limited to, SOP package, TQFP package, QFN package, etc.
In this embodiment, the package form of the power routing power chip is QFN package, which has advantages of small volume, light weight, good heat dissipation, good electrical performance, etc. Thus, the power input terminal 101, the ground terminal 102, the I/O connection terminal, and the current output terminal 103 are all electrical contacts exposed from the back surface of the substrate 1.
For example, in fig. 3, the front surface of the substrate 1 is provided with a pad a, a pad b, a pad c, a pad d, and a pad e, wherein the power supply input terminal 101 is opposite to the pad a (at a position opposite to the pad a on the back surface of the substrate 1) and electrically connected to the pad a, the first I/O connection terminal 104 is opposite to the pad b and electrically connected to the pad b, the second I/O connection terminal 105 is opposite to the pad c and electrically connected to the pad c, the current output terminal 103 is opposite to the pad d and electrically connected to the pad d, and the ground terminal 102 is opposite to the pad e and electrically connected to the pad e.
For example, in fig. 5, the front surface of the substrate 1 is provided with a pad a, a pad b, a pad c, a pad d, and a pad e, wherein the pad e faces the DBC ceramic wiring board 4 and is covered by the DBC ceramic wiring board 4 (so as not shown in fig. 5), wherein the power input terminal 101 faces the pad a (at a position of the back surface of the substrate 1 facing the pad a) and is electrically connected to the pad a, the first I/O connection terminal 104 faces the pad b and is electrically connected to the pad b, the second I/O connection terminal 105 faces the pad c and is electrically connected to the pad c, the current output terminal 103 faces the pad d and is electrically connected to the pad d, and the ground terminal 102 faces the pad e and is electrically connected to the pad e.
The foregoing power routing chip may be applied to a variety of different appliances including the foregoing power routing chip and a functional component for converting electrical energy into other energy, with a current output 103 of the power routing chip being connected to the functional component and for providing current to the functional component.
The electrical appliance can be, but not limited to, an LED lamp, a fan, an intelligent curtain, an electric heater, etc., and the functional components of different types of electrical appliances are different, for example, the functional components of the LED lamp are LED lamp bead components (for converting electric energy into light energy), the functional components of the fan and the intelligent curtain are direct current motors (for converting electric energy into kinetic energy), and the functional components of the electric heater are heating wires (for converting electric energy into heat energy).
For example, fig. 6 is a circuit diagram of an electrical apparatus, which is an LED lamp, and its functional components include at least one LED lamp bead 5. When a plurality of LED lamp beads 5 are provided, the LED lamp beads 5 can be connected in series and/or in parallel to form an LED lamp bead group.
A control for generating a regulating command may be connected to the second I/O connection 105 of the power routing chip, and a required regulating command may be generated by the control to regulate the power of the electric appliance.
For example, in fig. 6, the control element is a control switch 6, and one end of the control switch 6 is connected to one I/O connection terminal of the power routing power chip, and is used to generate an adjustment command input to the MCU chip 302 (specifically, connected to the second I/O connection terminal 105, and is used to generate an adjustment command input to the MCU chip 302).
In practice, the control element is not limited to the control switch 6, but may also include at least one of a stepless silicon controlled rectifier, a bluetooth module, a WIFI module, and a voice module, but is not limited thereto.
For an electric appliance whose control element is a control switch 6, the present application also provides a control method (i.e. the control method is applied to an electric appliance including the foregoing power routing power chip, the electric appliance further includes a control switch 6, one end of the control switch 6 is connected to an I/O connection end of the power routing power chip, and is used for generating a regulating command to input to the MCU chip 302), including the steps of:
After starting, the MCU chip 302 controls the current output end 103 to output rated current, so that the electric appliance works at rated power; for example, after starting, the MCU chip 302 outputs a default voltage, so that the current flowing from the drain to the source of the MOS transistor 303 is a default current, and the electrical appliance is driven to work at the rated power by the default current;
if the control switch 6 performs the opening and closing action, the MCU chip 302 adjusts the current output by the current output terminal 103 according to the number of times of continuous opening and closing of the control switch 6 in a preset time period, so as to adjust the power of the electrical appliance; for example, if the preset time period is 10s and the switching is continued for 1 time within 10s, the MCU chip 302 is controlled to reduce the output voltage, so that the current flowing from the drain to the source of the MOS transistor 303 is reduced, and the power of the electrical appliance is adjusted to 80% of the rated power; if the switching is continuously performed for 2 times within 10 seconds, the MCU chip 302 is controlled to reduce the output voltage, so that the current flowing from the drain to the source of the MOS tube 303 is reduced, and the power of the electric appliance is adjusted to be 60% of the rated power; if the switching is continuously performed for 3 times within 10 seconds, the MCU chip 302 is controlled to reduce the output voltage, so that the current flowing from the drain to the source of the MOS tube 303 is reduced, and the power of the electric appliance is adjusted to be 30% of the rated power; if the switching is continuously performed for 4 times within 10 seconds, the MCU chip 302 is controlled to reduce the output voltage, so that the current flowing from the drain to the source of the MOS tube 303 is reduced, and the power of the electric appliance is adjusted to be 10% of the rated power; but is not limited thereto.
Referring to fig. 7, the present application also provides a control system comprising an AC/DC power supply 100 and a plurality of electric appliances having power routing power chips as described above, wherein a power input terminal 101 of each electric appliance is connected to an output terminal of the AC/DC power supply 100; the AC/DC power supply 100 is used to convert mains electricity into direct current to power the appliances.
The electrical appliance in the control system may be the electrical appliance in the foregoing, and for example, the electrical appliance includes at least one of an LED lamp, a fan, an intelligent curtain, and an electric heater. For example, f in fig. 7 is an LED lamp, and g is a dc motor in the intelligent curtain.
Wherein, corresponding control members can be arranged on each electric appliance and are respectively used for adjusting the power of the corresponding electric appliance.
Or as shown in fig. 7, the control system further comprises a centralized control system 200, wherein the centralized control system 200 is used for generating an adjustment instruction of each electric appliance so as to adjust the power of each electric appliance. The centralized control system 200 can adjust the power of the whole electric appliance, is more convenient to use, wherein a plurality of and/or various control elements can be integrated in the centralized control system 200, and the control elements can be reused among the electric appliances, so that the cost is reduced.
In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411212141.XA CN118732777B (en) | 2024-08-30 | 2024-08-30 | A power routing power chip, control system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411212141.XA CN118732777B (en) | 2024-08-30 | 2024-08-30 | A power routing power chip, control system and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118732777A CN118732777A (en) | 2024-10-01 |
| CN118732777B true CN118732777B (en) | 2024-11-22 |
Family
ID=92855537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411212141.XA Active CN118732777B (en) | 2024-08-30 | 2024-08-30 | A power routing power chip, control system and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118732777B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113015284A (en) * | 2021-03-22 | 2021-06-22 | 宁波亚茂光电股份有限公司 | LED control circuit and lighting system |
| CN118019175A (en) * | 2024-03-06 | 2024-05-10 | 佛山市国星光电股份有限公司 | Dimming LED driving chip, driving circuit and dimming LED lamp |
| CN118042665A (en) * | 2024-03-06 | 2024-05-14 | 佛山市国星光电股份有限公司 | LED dimming and color adjustment chip, drive circuit and LED lamp |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI365591B (en) * | 2008-12-26 | 2012-06-01 | Richtek Technology Corp | Power transistor chip with built-in junction field effect transistor and application circuit thereof |
| DE102021203742A1 (en) * | 2021-04-15 | 2022-10-20 | Osram Gmbh | CURRENT MEASUREMENT DEVICE FOR SWITCHED POWER CONVERTERS AND CONTROL CIRCUIT FOR APPLICATION OF THE CURRENT MEASUREMENT DEVICE |
| CN215642445U (en) * | 2021-09-23 | 2022-01-25 | 成都英思嘉半导体技术有限公司 | Device for dynamically adjusting output voltage of linear power supply through DAC (digital-to-analog converter) |
| CN220527904U (en) * | 2023-07-05 | 2024-02-23 | 广州昂宝电子有限公司 | Intelligent control circuit for direct common ground connection of alternating current and direct current workplaces |
-
2024
- 2024-08-30 CN CN202411212141.XA patent/CN118732777B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113015284A (en) * | 2021-03-22 | 2021-06-22 | 宁波亚茂光电股份有限公司 | LED control circuit and lighting system |
| CN118019175A (en) * | 2024-03-06 | 2024-05-10 | 佛山市国星光电股份有限公司 | Dimming LED driving chip, driving circuit and dimming LED lamp |
| CN118042665A (en) * | 2024-03-06 | 2024-05-14 | 佛山市国星光电股份有限公司 | LED dimming and color adjustment chip, drive circuit and LED lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118732777A (en) | 2024-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110945736B (en) | Control method and device of solar power supply system | |
| TWI327806B (en) | Two-wire switching device | |
| CN1035593A (en) | Power control circuit with phase controlled signal input | |
| TW201236502A (en) | Dimmable timer-based LED power supply | |
| TW200524259A (en) | DC-DC converter | |
| JPH0828464B2 (en) | Power module | |
| CN1409474A (en) | Switch power source device | |
| CN103199712A (en) | Ultrasonic cleaning power system | |
| TW201123702A (en) | Multi-output DC-to-DC conversion apparatus with voltage-stabilizing function | |
| CN118732777B (en) | A power routing power chip, control system and method | |
| CN207603472U (en) | A kind of electric welding power circuit and the Electricity generating welder containing the power circuit | |
| CN205324946U (en) | Single chip microcomputer control's electric welding | |
| CN110224620A (en) | A kind of elevator power supply system and elevator | |
| CN100367646C (en) | Single/Three-phase Impedance Source Up/Down Voltage AC/AC Converter | |
| CN206099804U (en) | A Switching Voltage Regulator System Based on UC3843 | |
| CN209120068U (en) | A kind of power circuit package and electronic device | |
| CN209593269U (en) | A kind of dual chip power circuit | |
| CN206480618U (en) | Integrated circuit applied to power device | |
| CN223347027U (en) | Multi-loop power supply debugging auxiliary switch | |
| CN222509114U (en) | New type of resistance-capacitance step-down power supply circuit | |
| CN220492871U (en) | AC load driving circuit and electronic equipment | |
| CN222721367U (en) | Power supply circuit and electrical equipment | |
| CN219499254U (en) | Fan lamp | |
| CN223218158U (en) | Stepless speed-regulating temperature-regulating electric hair drier | |
| CN222951338U (en) | A frequency conversion refrigerator control system and a frequency conversion refrigerator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |