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CN118763061B - IGBT packaging structure and packaging method - Google Patents

IGBT packaging structure and packaging method Download PDF

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Publication number
CN118763061B
CN118763061B CN202411244169.1A CN202411244169A CN118763061B CN 118763061 B CN118763061 B CN 118763061B CN 202411244169 A CN202411244169 A CN 202411244169A CN 118763061 B CN118763061 B CN 118763061B
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China
Prior art keywords
heat
plate
igbt
heat dissipation
igbt module
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CN118763061A (en
Inventor
翟露青
关仕汉
王玉玺
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ZIBO MICRO COMMERCIAL COMPONENTS CORP
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ZIBO MICRO COMMERCIAL COMPONENTS CORP
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
    • F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
    • F16F15/06—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F2238/00—Type of springs or dampers
    • F16F2238/02—Springs
    • F16F2238/022—Springs leaf-like, e.g. of thin, planar-like metal
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F2238/00—Type of springs or dampers
    • F16F2238/02—Springs
    • F16F2238/026—Springs wound- or coil-like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Acoustics & Sound (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to the technical field of packaging structures, in particular to an IGBT packaging structure and a packaging method, wherein the IGBT packaging structure comprises a packaging shell and a vibration reduction assembly, the packaging shell is provided with an upper bottom plate and a lower bottom plate, a plurality of limiting pieces are arranged between the upper bottom plate and the lower bottom plate at equal intervals along the edge direction of the upper bottom plate and each limiting piece is used for limiting the packaging position of an IGBT module, each limiting piece is further provided with the vibration reduction assembly connected with the corresponding IGBT module, and a heat dissipation assembly is further arranged in the packaging shell.

Description

IGBT packaging structure and packaging method
Technical Field
The invention relates to the technical field of packaging structures, in particular to an IGBT packaging structure and an IGBT packaging method.
Background
Most of the existing IGBT module packaging structures are embedded by adopting a shell, glue filling and packaging are directly carried out inside the shell, and in the packaging process, a cover plate is added after glue filling for sealing, so that the heat dissipation efficiency of the IGBT module is reduced by the packaging mode, the weight of the device is improved by the direct glue filling and packaging mode, and the use requirement is difficult to meet under the condition of meeting some high weight requirements.
The currently disclosed Chinese patent CN116884935A discloses an IGBT module heat dissipation device and a packaging structure, wherein the heat dissipation device comprises a packaging shell, connecting terminals and a bottom plate, bolt holes for fixing are symmetrically formed in the packaging shell, side wall grooves for assisting heat dissipation are formed in the side wall of the packaging shell, a plurality of connecting ports for wiring are uniformly formed in the packaging shell, the connecting terminals are arranged on the packaging shell, the bottom of the packaging shell is embedded in the bottom plate, the heat dissipation device further comprises a first limiting component, and the bottom of the packaging shell is provided with the first limiting component; the first limiting component comprises an N-type pushing plate, a first fixed column, a second fixed column, a blocking plate and a stirring plate, the bottom of the packaging shell is connected with the N-type pushing plate in a sliding mode, the bottom plate is symmetrically connected with the first fixed column in a rotating mode, the blocking plate is fixedly connected to the first fixed column, the stirring plate is fixedly connected to the first fixed column in an inclined mode, the second fixed column is symmetrically fixedly connected to the N-type pushing plate, the stirring plate is connected with the second fixed column in a sliding mode, the packaging shell further comprises a clamping component, the bottom of the packaging shell is provided with the clamping component, the clamping component comprises a fixing frame, a hook plate and a spring, the bottom of the packaging shell is fixedly connected with the fixing frame, the hook plate is connected with the N-type pushing plate in a sliding mode, the spring is arranged between the hook plate and the fixing frame, the heat dissipation component is arranged on a side wall groove of the packaging shell, the heat dissipation component comprises a fixing outer frame and a blower, the side wall groove of the packaging shell is fixedly connected with the fixing outer frame, and the blower is arranged on the fixing outer frame.
According to the above patent, the side of the packaging shell is provided with the side wall groove, so that the thickness of the packaging shell is reduced, the heat conduction efficiency of the packaging shell is further improved, the IGBT module is sealed through the bottom plate, the IGBT module can be stably arranged in the packaging shell, glue filling is not required in the process of the IGBT module, the weight of a device can be further lightened, and the heat dissipation efficiency of the packaging shell can be further improved through the heat dissipation assembly arranged on the side wall groove, so that the heat dissipation effect is further improved.
Disclosure of Invention
According to the IGBT packaging structure, the heat radiating component is integrated in the packaging structure and is in close contact with the vibration damping component, so that after heat is generated from the IGBT module, the heat is firstly transferred to the vibration damping component directly connected with the IGBT module, and then the heat continuously flows to the heat radiating component through the heat conduction characteristic of the vibration damping component, so that the heat can be transferred efficiently, and the overall energy conversion efficiency and the service life are improved.
In order to solve the problems in the prior art, the invention provides an IGBT packaging structure, which comprises a packaging shell and a vibration reduction assembly arranged in the packaging shell and used for reducing vibration of an IGBT module, wherein the packaging shell is provided with an upper bottom plate and a lower bottom plate, the vibration reduction assembly is arranged between the upper bottom plate and the lower bottom plate, a plurality of limiting pieces are arranged between the upper bottom plate and the lower bottom plate at equal intervals along the edge direction of the upper bottom plate, each limiting piece is used for limiting the packaging position of one IGBT module, each limiting piece is also provided with a vibration reduction assembly connected with the corresponding IGBT module, a heat dissipation assembly used for dissipating heat of the IGBT module is further arranged in the packaging shell, the heat dissipation assembly is in contact connection with the vibration reduction assembly, and after the packaging of the IGBT module is completed, the IGBT module conducts heat to the vibration reduction assembly, so that heat is indirectly conducted to the heat dissipation assembly, and the IGBT module can effectively dissipate heat when the IGBT module has a vibration reduction effect.
Preferably, the packaging shell is further provided with a sleeve frame surrounding between the upper bottom plate and the lower bottom plate, a plurality of ventilation holes are formed in two sides of the sleeve frame, filter plates for filtering air are arranged on two sides, facing the ventilation holes, of the sleeve frame, clamping grooves for clamping two ends of the filter plates into the sleeve frame are formed in the sleeve frame, and the filter plates are detachably connected into the sleeve frame through the clamping grooves in the sleeve frame.
Preferably, the limiting piece is specifically a guide rod structure with two ends penetrating through the upper bottom plate and the lower bottom plate, the IGBT module is provided with a detachable through hole sleeved on the limiting piece, and the upper surface and the lower surface of the IGBT module are both provided with the vibration reduction assembly.
Preferably, the vibration reduction assembly comprises a heat conduction layer attached to the surface of the IGBT module and a metal pressing plate attached to the surface of the heat conduction layer, wherein the heat conduction layer and the metal pressing plate are respectively provided with a through hole for a limiting piece to pass through, the metal pressing plate is of an elastic structure, and two ends of the metal pressing plate are respectively provided with a connecting piece for providing support for the metal pressing plate.
Preferably, the connecting piece is the axostylus axostyle structure, and fixed being equipped with between upper plate and the lower plate is used for fixing the supporting shoe wherein a pair of connecting piece, the axis direction of connecting piece is perpendicular to the axis direction of locating part, and the tip of metal clamp plate has towards the direction extension of connecting piece and winds the elasticity clamping piece above that, can support the pressure to the heat conduction layer under the cooperation of the elasticity clamping piece at metal clamp plate both ends and corresponding connecting piece, IGBT module is supported between two metal clamp plates.
Preferably, the vibration reduction assembly further comprises a vibration reduction spring sleeved on the limiting piece, two ends of the vibration reduction spring are fixedly connected with the limiting piece and the metal pressing plate respectively, and the vibration reduction spring is combined with the metal pressing plate to achieve vibration reduction effect on the IGBT module.
Preferably, the surface of every metal pressing plate all be equipped with the radiating component, the radiating component is including the heat dissipation layer with metal pressing plate surface laminating to and the heat transfer pipe with heat dissipation layer contact, metal pressing plate is held between heat dissipation layer and heat conduction layer, the heat transfer pipe has the water inlet end and the water outlet end that vertically pass corresponding upper plate or lower plate, all be equipped with elasticity butt casting die between the water inlet end and the water outlet end of heat transfer pipe and corresponding upper plate or lower plate, elasticity butt casting die is used for keeping heat transfer pipe and heat dissipation layer in close contact's state.
Preferably, the surface of the heat dissipation layer is provided with grooves into which the heat exchange tubes are embedded, and the parts of the heat exchange tubes, which are in contact with the heat dissipation layer, are in a meandering form along the edge direction of the heat dissipation layer.
Preferably, the elastic pressing piece is provided with a pressing spring sleeved on the corresponding water inlet end or water outlet end of the heat exchange tube, sealing gaskets sleeved on the upper bottom plate and the lower bottom plate are fixedly arranged at the positions of the water inlet end and the water outlet end of each heat exchange tube, and each water inlet end and the water outlet end of each heat exchange tube are respectively provided with a pipe joint, and the pressing spring is fixedly connected between the corresponding sealing gasket and each pipe joint.
The invention also provides an IGBT packaging method, which comprises the following steps:
S1, placing an IGBT module at a position defined by a limiting piece;
s2, assembling a vibration reduction assembly on the limiting piece;
S3, embedding a heat dissipation assembly between the upper bottom plate and the lower bottom plate, ensuring close contact with the vibration reduction assembly, and establishing a heat conduction path from the vibration reduction assembly to the heat dissipation assembly of the IGBT module;
and S4, installing a filter plate on the side surface of the sleeve frame corresponding to the vent hole, and packaging the sleeve frame between the upper bottom plate and the lower bottom plate.
Compared with the prior art, the application has the beneficial effects that:
1. The invention not only enhances the integrity of the packaging structure by combining the sleeve frame and the filter plate, but also realizes effective protection and management of the internal environment, the ventilation holes and the filter plate are matched for use, the ventilation required by heat dissipation is ensured, meanwhile, pollutants are isolated, a cool and clean running environment is created, the stability and long-term reliability of the IGBT module and the whole packaging structure are improved, the failure rate caused by environmental factors is reduced, the service life of the product is prolonged, and the working performance of the product in severe environments such as dust, humidity and the like is optimized.
2. According to the invention, through the use of the damping spring combined with the metal pressing plate, not only is the protection measure of the IGBT module enhanced, but also the vibration resistance and stability of the IGBT module are improved, the correct position and the functional integrity of the IGBT module can be ensured even under the extreme temperature change or high-intensity vibration environment, the metal pressing plate uniformly presses against the heat conducting layer, and the heat is more effectively transferred from the IGBT module to the metal pressing plate, so that the heat is transferred to the heat radiating component through the metal pressing plate, the heat radiating efficiency is improved, and the service life of the IGBT module is prolonged.
3. According to the heat exchange device, the contact area between the heat exchange tube and the heat dissipation layer is greatly increased through the design of the zigzag heat exchange tube, the contact between the heat exchange tube and the heat dissipation layer is kept tight and zero-clearance through the elastic pressing piece, and the heat exchange efficiency is maximized, so that the heat transfer process is accelerated, the overall heat dissipation performance is improved, and the IGBT module is maintained to operate in a safe temperature range.
Drawings
Fig. 1 is a schematic perspective view of an IGBT package.
Fig. 2 is a schematic exploded perspective view of an IGBT package.
Fig. 3 is a partial plan sectional view of an IGBT package.
Fig. 4 is a partial perspective view of a cross-sectional structure of an IGBT package.
Fig. 5 is a perspective view of the structure at A-A of fig. 3.
Fig. 6 is an enlarged schematic view at B of fig. 3.
Fig. 7 is a schematic perspective view of an upper base plate, a lower base plate, a vibration reduction assembly and a heat dissipation assembly of an IGBT package structure.
Fig. 8 is a left side view of an upper base plate, a lower base plate, a vibration reduction assembly and a heat dissipation assembly of an IGBT package structure.
Fig. 9 is a perspective view of the structure at C-C of fig. 8.
Fig. 10 is an enlarged schematic view at D of fig. 9.
The reference numbers in the drawing are 1-packaging shell, 11-upper bottom plate, 12-lower bottom plate, 13-limiting piece, 14-sleeve frame, 141-vent hole, 142-filter plate, 2-IGBT module, 3-vibration reduction component, 31-heat conduction layer, 32-metal pressing plate, 321-elastic clamping piece, 322-vibration reduction spring, connecting piece, 331-supporting block, 4-heat dissipation component, 41-heat dissipation layer, 42-heat exchange tube, 421-water inlet end, 422-water outlet end, 43-elastic pressing piece, 431-pressing spring, 432-sealing gasket and 433-tube joint.
Detailed Description
The invention will be further described in detail with reference to the drawings and the detailed description below, in order to further understand the features and technical means of the invention and the specific objects and functions achieved.
Referring to fig. 1-5, an IGBT package structure includes a package housing 1 and a vibration damping assembly 3 disposed therein for damping the IGBT module 2, the package housing 1 has an upper base plate 11 and a lower base plate 12, the vibration damping assembly 3 is disposed between the upper base plate 11 and the lower base plate 12, a plurality of limiting members 13 are disposed between the upper base plate 11 and the lower base plate 12 at equal intervals along the edge direction thereof, each limiting member 13 is used for limiting the package position of one IGBT module 2, each limiting member 13 is further provided with a vibration damping assembly 3 connected with the corresponding IGBT module 2, a heat dissipating assembly 4 for dissipating heat from the IGBT module 2 is further disposed in the package housing 1, and the heat dissipating assembly 4 is connected with the vibration damping assembly 3 in a contact manner, when the IGBT module 2 is packaged, the IGBT module 2 conducts heat to the vibration damping assembly 3, thereby indirectly conducting heat to the heat dissipating assembly 4, so that the IGBT module 2 has an effective heat dissipation effect.
The encapsulation shell 1 comprises an upper bottom plate 11 and a lower bottom plate 12, the upper bottom plate 11 and the lower bottom plate 12 are precisely assembled to form a stable shell structure, on the basis, a plurality of limiting pieces 13 which are arranged at equal intervals along the edge not only define the precise encapsulation position of each IGBT module 2, but also are directly connected with the IGBT modules 2 through the damping assemblies 3, so as to absorb external vibration and play a role in protecting against mechanical stress, after the IGBT modules 2 are installed, each IGBT module 2 is connected with the damping assemblies 3 on the corresponding limiting pieces 13, the damping assemblies 3 adopt an elastic structure, vibration energy transferred from the outside can be effectively absorbed and dispersed, the stable operation of the IGBT modules 2 under the high-frequency vibration environment is kept, the service life is prolonged, meanwhile, the heat dissipation assemblies 4 are integrated in the encapsulation shell 1 and are in close contact with the damping assemblies 3, the effect that means that heat is firstly transferred to the damping assemblies 3 which are directly connected after the heat is generated from the IGBT modules 2, then the heat is continuously transferred to the heat dissipation assemblies 4 through the heat conduction characteristics of the damping assemblies 3, the indirect heat transfer mode ensures that the heat can be efficiently transferred, meanwhile, the heat can be effectively and accumulated, the heat between the IGBT modules 2 and a heat dissipation path is kept, the heat dissipation performance of the IGBT module 2 is prevented from being rapidly lowered due to the fact that the heat dissipation performance is influenced by the heat dissipation module is directly, and the heat dissipation performance of the heat dissipation module is fast, and the heat dissipation performance of the heat dissipation module is guaranteed, and the heat dissipation performance of the heat is not can be rapidly and the heat-insulating heat transfer module, and the heat is stable, and the heat dissipation performance is stable.
Referring to fig. 1-5, the packaging shell 1 further has a casing frame 14 surrounding between the upper base plate 11 and the lower base plate 12, a plurality of ventilation holes 141 are formed on both sides of the casing frame 14, filter plates 142 for filtering air are disposed on both sides of the casing frame 14 facing the ventilation holes 141, clamping grooves for clamping both ends of the filter plates 142 are formed on the casing frame 14, and the filter plates 142 are detachably connected in the casing frame 14 through the clamping grooves.
When the cover frame 14 is installed, firstly, the cover frame 14 is fixed between the upper base plate 11 and the lower base plate 12, the ventilation holes 141 uniformly distributed on the two sides of the cover frame 14 are ensured to be sleeved in the upper base plate 11 and the lower base plate 12 so as to enable air to circulate, then, a filter plate 142 which is matched with the ventilation holes 141 is selected, the filter plate 142 is firmly installed and is easy to detach by utilizing the matching of the two ends of the filter plate 142 and the clamping grooves, the filter plate 142 is convenient to clean or replace in the future, so that good filtering performance is maintained, the main function of the filter plate 142 is to purify air flowing through the ventilation holes 141, prevent external dust, moisture or other harmful particles from entering the package shell 1, and protect the IGBT module 2 and an internal circuit from being polluted.
Referring to fig. 3-6, the limiting member 13 is specifically a guide rod structure with two ends penetrating through the upper bottom plate 11 and the lower bottom plate 12, the IGBT module 2 has a detachable through hole sleeved on the limiting member 13, and the upper surface and the lower surface of the IGBT module 2 are both provided with the vibration reduction assembly 3.
The limit piece 13 adopts a guide rod design that two ends penetrate through the upper bottom plate 11 and the lower bottom plate 12, so that precise alignment and stable connection between the upper bottom plate 11 and the lower bottom plate 12 are ensured, the IGBT module 2 is provided with a special through hole, the through hole can be just sleeved on the limit piece 13, precise positioning and rapid installation of the IGBT module 2 are realized, the IGBT module 2 slides onto the limit piece 13 through the through hole and is limited in the vibration reduction assemblies 3 on the upper surface and the lower surface, the vibration reduction assemblies 3 equipped on the upper surface and the lower surface of the IGBT module 2 are directly contacted with the IGBT module 2, external vibration energy is absorbed, the stress concentration of the IGBT module 2 caused by vibration is reduced, the IGBT module 2 is protected from being damaged, the highly stable installation of the IGBT module 2 in a packaging structure is realized, the good electrical connection and the heat management performance of the IGBT module 2 can be maintained even in a high-frequency vibration environment is ensured, and the vibration resistance and the reliability of long-term operation are greatly improved.
Referring to fig. 3-6, the vibration damping assembly 3 includes a heat conducting layer 31 attached to the surface of the IGBT module 2, and a metal pressing plate 32 attached to the surface of the heat conducting layer 31, where the heat conducting layer 31 and the metal pressing plate 32 each have a through hole through which the limiting member 13 passes, the metal pressing plate 32 is of an elastic structure, and two ends of the metal pressing plate 32 are provided with connecting members 33 for supporting the metal pressing plate 32.
In the assembly process, firstly, the heat conducting layer 31 is accurately attached to the upper surface or the lower surface of the IGBT module 2, then, the metal pressing plate 32 with the through holes is covered on the surface of the heat conducting layer 31, the metal pressing plate 32 and the through holes of the heat conducting layer 31 are completely attached, the limiting piece 13 is aligned to the through holes of the heat conducting layer 31, the IGBT module 2, the heat conducting layer 31 and the metal pressing plate 32 are positioned through the limiting piece 13, the two ends of the metal pressing plate 32 provide necessary elastic support through the connecting piece 33, the stability of the whole structure is ensured, the metal pressing plate 32 is used as an elastic structure, the vibration of various frequencies encountered by the IGBT module 2 in the working or transportation process can be effectively absorbed, the impact and the potential damage of the vibration to sensitive components inside the IGBT module 2 can be reduced, even under the condition of continuous vibration, the good positioning and contact pressure of the IGBT module 2 can be kept, the problem of loosening of thermal contact caused by the vibration is avoided, the addition of the heat conducting layer 31 not only provides an extra heat dissipation path for the IGBT module 2, but also through the tight contact with the metal pressing plate 32, a high-efficient heat conduction path is formed, the heat can be transferred from the IGBT module 2 to the heat dissipation assembly 4 more quickly, the heat dissipation efficiency is reduced, and the heat dissipation efficiency is lowered.
Referring to fig. 4-9, the connecting piece 33 is specifically a shaft rod structure, a supporting block 331 for fixing a pair of connecting pieces 33 therein is fixedly arranged between the upper base plate 11 and the lower base plate 12, the axial direction of the connecting piece 33 is perpendicular to the axial direction of the limiting piece 13, the end part of the metal pressing plate 32 is provided with an elastic clamping piece 321 extending towards the direction of the connecting piece 33 and wound on the connecting piece, and the elastic clamping pieces 321 at two ends of the metal pressing plate 32 can have a pressing effect on the heat conducting layer 31 under the cooperation of the corresponding connecting pieces 33, so that the IGBT module 2 is pressed between the two metal pressing plates 32.
A pair of support blocks 331 are pre-installed between the upper base plate 11 and the lower base plate 12, these support blocks 331 are used for fixing the connecting piece 33, ensure that the shaft lever structure of the connecting piece 33 can stand between them firmly, the two ends of the metal pressing plate 32 form elastic clamping pieces 321 which extend towards the direction of the connecting piece 33 and can be wound on the connecting piece, so that the metal pressing plate 32 can be fastened on the connecting piece 33, vibration damping capacity can be provided for the metal pressing plate 32 under the action of the elastic clamping pieces 321, even and proper pressing force is ensured to be applied to the IGBT module 2, when the metal pressing plate 32 is matched with the corresponding connecting piece 33 through the elastic clamping pieces 321 at the two ends of the metal pressing plate 32, the metal pressing plate 32 can apply pressure to the heat conducting layer 31 positioned between the metal pressing plate 32, and then an even pressing effect is indirectly generated on the upper surface and the lower surface of the IGBT module 2, the IGBT module 2 is ensured to be firmly fixed in the whole packaging structure, displacement possibly caused by thermal expansion or mechanical vibration is reduced, good electric connection is maintained, even under the extreme temperature change or high-strength vibration environment, the correct position and functional integrity of the IGBT module 2 can be ensured, even if the metal pressing plate 32 is used for pressing plate 31 is used for evenly pressing the heat conducting layer 31 to the heat conducting heat to the heat conducting module 2, the heat conducting efficiency is improved, and the heat is effectively transferred to the heat conducting efficiency from the heat conducting plate to the heat conducting module 2 to the heat conducting module through the metal pressing plate 2 through the heat conducting plate.
Referring to fig. 3-6, the vibration damping assembly 3 further includes a vibration damping spring 322 sleeved on the limiting member 13, two ends of the vibration damping spring 322 are fixedly connected with the limiting member 13 and the metal pressing plate 32 respectively, and the vibration damping spring 322 is combined with the metal pressing plate 32 to play a vibration damping effect on the IGBT module 2.
Through the cooperation of damping spring 322 and metal clamp plate 32, the mechanical stress that IGBT module 2 bore obtains reducing by a wide margin, has effectively prevented the chip crackle that leads to because of the vibration, solder joint break-off etc. trouble, has prolonged the life and the reliability of IGBT module 2, and damping spring 322 not only slows down the vibration, but also can provide a dynamic regulation's clamp force between IGBT module 2 and metal clamp plate 32 simultaneously, this means, even under different operating modes, still can automatically regulated keep the appropriate pressure to IGBT module 2, ensure that the thermal contact is good and can not harm IGBT module 2 because of the pressure is too big.
Referring to fig. 2, 8, 9 and 10, the surface of each metal pressing plate 32 is provided with the heat dissipation assembly 4, the heat dissipation assembly 4 includes a heat dissipation layer 41 attached to the surface of the metal pressing plate 32, and a heat exchange tube 42 contacting the heat dissipation layer 41, the metal pressing plate 32 is clamped between the heat dissipation layer 41 and the heat conduction layer 31, the heat exchange tube 42 has a water inlet end 421 and a water outlet end 422 vertically penetrating through the corresponding upper bottom plate 11 or the lower bottom plate 12, and elastic pressing members 43 are disposed between the water inlet end 421 and the water outlet end 422 of the heat exchange tube 42 and the corresponding upper bottom plate 11 or the lower bottom plate 12, and the elastic pressing members 43 are used for keeping the heat exchange tube 42 in a state of close contact with the heat dissipation layer 41.
At the interface between the water inlet end 421 and the water outlet end 422 of the heat exchange tube 42 and the upper bottom plate 11 or the lower bottom plate 12, elastic pressing members 43 are provided, and the elastic pressing members 43 have the functions of ensuring that the contact between the heat exchange tube 42 and the heat dissipation layer 41 is kept tight and zero-clearance, maximizing the heat exchange efficiency, avoiding poor contact caused by vibration, when the IGBT module 2 generates heat during operation, the heat is firstly transferred to the metal pressing plate 32 through the heat conduction layer 31 and then rapidly diffused to the heat dissipation layer 41 on the surface of the metal pressing plate 32, the heat dissipation layer 41 then transfers the heat to the heat exchange tube 42 closely attached to the heat conduction layer, the cooling liquid is introduced through the water inlet end 421 of the heat exchange tube 42, the cooling liquid circularly flows in the heat exchange tube 42, takes away the heat and is discharged through the water outlet end 422 of the heat exchange tube 42, and the low-temperature cooling liquid is continuously supplemented by the water inlet end 421, so as to maintain the continuous heat exchange process.
As shown in fig. 2, 8 and 9, the surface of the heat dissipation layer 41 has grooves in which the heat exchange tubes 42 are fitted, and the portions of the heat exchange tubes 42 in contact with the heat dissipation layer 41 are in a meandering form along the edge direction of the heat dissipation layer 41.
The surface of the heat dissipation layer 41 is provided with grooves matched with the shape of the heat exchange tube 42, the heat exchange tube 42 is allowed to be not only attached to the surface of the heat dissipation layer 41, but also embedded in the heat exchange tube, the contact part of the heat exchange tube 42 and the heat dissipation layer 41 is bent along the edge, the layout not only increases the heat exchange surface area, but also ensures a more compact and continuous heat conduction path between the heat exchange surface area and the heat exchange surface area, when the IGBT module 2 operates to generate heat, the heat is transferred to the metal pressing plate 32 through the heat conduction layer 31, and then is rapidly transferred to the heat dissipation layer 41 through the metal pressing plate 32, and when the cooling liquid flows in the heat exchange tube 42, the heat in the heat dissipation layer 41 is taken away, so that the overall heat dissipation performance is improved, and the IGBT module 2 is maintained to operate in a safe temperature range.
Referring to fig. 2, 8, 9 and 10, the elastic pressing member 43 has a pressing spring 431 sleeved on the water inlet end 421 or the water outlet end 422 of the heat exchange tube 42, sealing washers 432 sleeved on the pressing spring 431 are fixedly arranged on the positions of the upper base plate 11 and the lower base plate 12 corresponding to the water inlet end 421 and the water outlet end 422 of each heat exchange tube 42, and a pipe joint 433 is arranged on the water inlet end 421 and the water outlet end 422 of each heat exchange tube 42, and the pressing spring 431 is fixedly connected between the corresponding sealing washer 432 and the pipe joint 433.
The pressing spring 431 is sleeved at the water inlet end 421 or the water outlet end 422 of the heat exchange tube 42, and the elastic characteristic of the pressing spring applies a constant pressing force to the heat exchange tube 42, so that the heat exchange tube 42 is kept in a state of being tightly attached to the heat dissipation layer 41, external dust is prevented from entering the packaging shell 1 through the sealing gasket 432, and when the heat exchange tube 42 is started, the water pump is connected with a pipe joint 433 of the water inlet end 421 and the water outlet end 422 of the heat exchange tube 42, and is not shown in the figure, so that the flow of cooling liquid inside the heat exchange tube 42 is realized, and the continuous heat dissipation effect is ensured.
The IGBT packaging method is applied to an IGBT packaging structure and comprises the following steps:
S1, placing the IGBT module 2 at a position defined by a limiting piece 13;
S2, assembling the vibration reduction assembly 3 on the limiting piece 13;
s3, embedding a heat dissipation assembly 4 between the upper base plate 11 and the lower base plate 12, ensuring close contact with the vibration reduction assembly 3, and establishing a heat conduction path from the vibration reduction assembly 3 to the heat dissipation assembly 4 of the IGBT module 2;
s4, installing a filter plate 142 on the side surface of the sleeve frame 14 corresponding to the ventilation holes 141, and packaging the sleeve frame 14 between the upper base plate 11 and the lower base plate 12.
The heat dissipation assembly 4 is integrated in a packaging structure and is in close contact with the vibration reduction assembly 3, so that after heat is generated from the IGBT module 2, the heat is firstly transferred to the vibration reduction assembly 3 directly connected with the heat dissipation assembly, and then the heat continuously flows to the heat dissipation assembly 4 through the heat conduction characteristic of the vibration reduction assembly 3, so that the heat can be efficiently transferred, meanwhile, the mechanical isolation between the IGBT module 2 and a heat dissipation path is maintained, the heat stress is prevented from directly acting on the IGBT module 2, the external vibration is effectively absorbed, the IGBT module 2 is protected from mechanical damage, the rapid conduction and the dissipation of the heat are ensured, the overheat is prevented, and the integral energy conversion efficiency and the service life are improved.
The foregoing examples merely illustrate one or more embodiments of the invention, which are described in greater detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention.

Claims (10)

1. The utility model provides an IGBT packaging structure, its characterized in that, including encapsulation shell (1) and setting are wherein being used for carrying out vibration damping subassembly (3) to IGBT module (2), encapsulation shell (1) have upper plate (11) and lower plate (12), vibration damping subassembly (3) set up between upper plate (11) and lower plate (12), be equipped with a plurality of locating parts (13) along encapsulation shell (1) edge direction equidistant between upper plate (11) and lower plate (12), every locating part (13) all are used for restricting the encapsulation position of an IGBT module (2), every locating part (13) department still all be equipped with one with vibration damping subassembly (3) that correspond IGBT module (2) and be connected, still be equipped with in encapsulation shell (1) and be used for carrying out radiating subassembly (4) to IGBT module (2), radiating subassembly (4) are connected with vibration damping subassembly (3) contact, after IGBT module (2) encapsulation is accomplished, IGBT module (2) is with heat conduction to subassembly (3) to indirect heat dissipation subassembly (4).
2. The IGBT packaging structure according to claim 1, characterized in that the packaging case (1) further has a cover frame (14) surrounding between the upper base plate (11) and the lower base plate (12), a plurality of ventilation holes (141) are formed on both sides of the cover frame (14), filter plates (142) for filtering air are formed on both sides of the cover frame (14) facing the ventilation holes (141), and clamping grooves into which both ends of the filter plates (142) are clamped are formed in the cover frame (14), and the filter plates (142) are detachably connected in the cover frame (14) through the clamping grooves.
3. The IGBT packaging structure according to claim 1, wherein the limiting piece (13) is specifically a guide rod structure with two ends penetrating through the upper base plate (11) and the lower base plate (12), the IGBT module (2) is provided with a through hole detachably sleeved on the limiting piece (13), and the upper surface and the lower surface of the IGBT module (2) are both provided with the vibration reduction assembly (3).
4. An IGBT package according to claim 3, wherein the vibration reduction assembly (3) comprises a heat conducting layer (31) attached to the surface of the IGBT module (2), and a metal pressing plate (32) attached to the surface of the heat conducting layer (31), the heat conducting layer (31) and the metal pressing plate (32) each have a through hole through which the limiting member (13) passes, the metal pressing plate (32) is of an elastic structure, and both ends of the metal pressing plate (32) are provided with connecting members (33) for supporting the metal pressing plate.
5. The IGBT packaging structure according to claim 4, wherein the connecting member (33) is a shaft structure, a supporting block (331) for fixing a pair of connecting members (33) therein is fixedly provided between the upper base plate (11) and the lower base plate (12), the axial direction of the connecting members (33) is perpendicular to the axial direction of the limiting member (13), the end portion of the metal pressing plate (32) has an elastic clip (321) extending toward the connecting member (33) and wound thereon, the elastic clips (321) at both ends of the metal pressing plate (32) can press the heat conductive layer (31) under the cooperation of the corresponding connecting members (33), and the IGBT module (2) is pressed between the two metal pressing plates (32).
6. The IGBT packaging structure according to claim 5, wherein the vibration reduction assembly (3) further comprises a vibration reduction spring (322) sleeved on the limiting piece (13), and two ends of the vibration reduction spring (322) are fixedly connected with the limiting piece (13) and the metal pressing plate (32) respectively.
7. The IGBT packaging structure according to claim 6, wherein the surface of each metal pressure plate (32) is provided with the heat dissipation component (4), the heat dissipation component (4) includes a heat dissipation layer (41) attached to the surface of the metal pressure plate (32), and a heat exchange tube (42) contacting the heat dissipation layer (41), the metal pressure plate (32) is clamped between the heat dissipation layer (41) and the heat conduction layer (31), the heat exchange tube (42) has a water inlet end (421) and a water outlet end (422) vertically penetrating through the corresponding upper base plate (11) or lower base plate (12), and elastic pressing members (43) are respectively provided between the water inlet end (421) and the water outlet end (422) of the heat exchange tube (42) and the corresponding upper base plate (11) or lower base plate (12), and the elastic pressing members (43) are used for keeping the heat exchange tube (42) in a state of being tightly contacted with the heat dissipation layer (41).
8. The IGBT packaging structure according to claim 7, characterized in that the surface of the heat dissipation layer (41) has grooves in which the heat exchange tubes (42) are embedded, and the portions of the heat exchange tubes (42) in contact with the heat dissipation layer (41) are in a meandering form along the edge direction of the heat dissipation layer (41).
9. The IGBT packaging structure according to claim 7, characterized in that the elastic pressing member (43) has a pressing spring (431) sleeved on the heat exchange tube (42) corresponding to the water inlet end (421) or the water outlet end (422), the upper base plate (11) and the lower base plate (12) are fixedly provided with sealing gaskets (432) sleeved on the positions corresponding to the water inlet end (421) and the water outlet end (422) of each heat exchange tube (42), the water inlet end (421) and the water outlet end (422) of each heat exchange tube (42) are respectively provided with a pipe joint (433), and the pressing spring (431) is fixedly connected between the corresponding sealing gasket (432) and the pipe joint (433).
10. An IGBT packaging method applied to the IGBT packaging structure according to any one of claims 1 to 9, characterized by comprising the steps of:
S1, placing an IGBT module (2) at a position defined by a limiting piece (13);
s2, assembling a vibration reduction assembly (3) on the limiting piece (13);
S3, embedding a heat dissipation assembly (4) between the upper base plate (11) and the lower base plate (12), ensuring close contact with the vibration reduction assembly (3), and establishing a heat conduction path from the vibration reduction assembly (3) to the heat dissipation assembly (4) of the IGBT module (2);
S4, installing a filter plate (142) on the side surface of the sleeve frame (14) corresponding to the vent holes (141), and packaging the sleeve frame (14) between the upper base plate (11) and the lower base plate (12).
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